TWI360379B - - Google Patents

Download PDF

Info

Publication number
TWI360379B
TWI360379B TW094139662A TW94139662A TWI360379B TW I360379 B TWI360379 B TW I360379B TW 094139662 A TW094139662 A TW 094139662A TW 94139662 A TW94139662 A TW 94139662A TW I360379 B TWI360379 B TW I360379B
Authority
TW
Taiwan
Prior art keywords
interconnect
base
side terminal
adhesive
terminal
Prior art date
Application number
TW094139662A
Other languages
English (en)
Chinese (zh)
Other versions
TW200628035A (en
Inventor
Ryoichi Nishigawa
Hiroshi Aoyama
Original Assignee
Hallys Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hallys Corp filed Critical Hallys Corp
Publication of TW200628035A publication Critical patent/TW200628035A/zh
Application granted granted Critical
Publication of TWI360379B publication Critical patent/TWI360379B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
TW094139662A 2004-11-12 2005-11-11 Interposer bonding method and electronic component manufactured using the same TW200628035A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004329658A JP4628067B2 (ja) 2004-11-12 2004-11-12 インターポーザの接合方法、及び電子部品。

Publications (2)

Publication Number Publication Date
TW200628035A TW200628035A (en) 2006-08-01
TWI360379B true TWI360379B (https=) 2012-03-11

Family

ID=36336560

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094139662A TW200628035A (en) 2004-11-12 2005-11-11 Interposer bonding method and electronic component manufactured using the same

Country Status (3)

Country Link
JP (1) JP4628067B2 (https=)
TW (1) TW200628035A (https=)
WO (1) WO2006051885A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4855849B2 (ja) * 2006-06-30 2012-01-18 富士通株式会社 Ｒｆｉｄタグの製造方法、およびｒｆｉｄタグ
JP5171405B2 (ja) * 2008-06-05 2013-03-27 株式会社 ハリーズ インターポーザ接合方法
JP5437623B2 (ja) * 2008-11-27 2014-03-12 株式会社 ハリーズ Ｉｃタグ
US8584331B2 (en) * 2011-09-14 2013-11-19 Xerox Corporation In situ flexible circuit embossing to form an electrical interconnect
JP5889718B2 (ja) * 2012-05-30 2016-03-22 アルプス電気株式会社 電子部品の実装構造体及び入力装置、ならびに、前記実装構造体の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04186697A (ja) * 1990-11-19 1992-07-03 Alps Electric Co Ltd フレキシブルプリント基板の接続方法
JP3763607B2 (ja) * 1996-04-10 2006-04-05 セイコーエプソン株式会社 液晶表示装置の製造方法及び液晶表示装置
JP2003069216A (ja) * 2001-08-29 2003-03-07 Toppan Forms Co Ltd 導電接続部同士の接続方法
JP2004111993A (ja) * 2003-12-02 2004-04-08 Hitachi Chem Co Ltd 電極の接続方法およびこれに用いる接続部材

Also Published As

Publication number Publication date
TW200628035A (en) 2006-08-01
WO2006051885A1 (ja) 2006-05-18
JP4628067B2 (ja) 2011-02-09
JP2006140359A (ja) 2006-06-01

Similar Documents

Publication Publication Date Title
CN101097607B (zh) Rfid标签的制造方法和rfid标签
US7960752B2 (en) RFID tag
JP5029597B2 (ja) カード型記録媒体およびカード型記録媒体の製造方法
US20120018084A1 (en) Printed Circuit Board Assembly Manufacturing Device And Method
WO2006112447A1 (ja) 電子部品及び、この電子部品の製造方法
CN103458625A (zh) 电子部件的安装结构体及其制造方法、以及输入装置
CN101441727B (zh) 电子装置及其制造方法
TWI360379B (https=)
EP2053647A2 (en) Semiconductor chip mounting method, semiconductor mounting wiring board producing method and semiconductor mounting wiring board
EP1148540A2 (en) Method and device for attaching a semiconductor chip to a chip carrier
JP2000331138A (ja) 非接触型ｉｃカード
JP4091096B2 (ja) インターポーザ接合装置
JPH11103158A (ja) プリント配線板へのフリップチップ実装方法および実装構造
US20070159341A1 (en) Packaging structure for radio frequency identification devices
CN101383022B (zh) 电子部件
JP4209574B2 (ja) 半導体部品実装済部品の製造方法
CN100524352C (zh) Rfid标签
JP2004038573A (ja) 非接触ｉｄカード類及びその製造方法
JP5171405B2 (ja) インターポーザ接合方法
JP2008521105A (ja) ブリッジモジュールを基板および多層トランスポンダへ接続する方法
JP7790205B2 (ja) 非接触型データ受送信体および非接触型データ受送信体の製造方法
JP7790204B2 (ja) Ｒｆｉｄラベルおよびｒｆｉｄラベルの製造方法
WO2007088631A1 (ja) 回路基板の接続部および回路基板の接続構造
JP2004086852A (ja) 非接触ｉｄカード類及びその製造方法
HK1220074B (zh) 电子部件及其连接方法、连接体及其制造方法、缓冲材料

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees