WO2006022026A1 - 半導体のテストシステム - Google Patents
半導体のテストシステム Download PDFInfo
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- WO2006022026A1 WO2006022026A1 PCT/JP2004/012693 JP2004012693W WO2006022026A1 WO 2006022026 A1 WO2006022026 A1 WO 2006022026A1 JP 2004012693 W JP2004012693 W JP 2004012693W WO 2006022026 A1 WO2006022026 A1 WO 2006022026A1
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- WIPO (PCT)
- Prior art keywords
- processing unit
- output
- digital data
- digital
- pass
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
Definitions
- the present invention relates to a semiconductor test system, and more particularly, to a super multi-pin output L
- image data is processed by an electronic circuit such as a drive circuit, and is output from a plurality of output terminals provided in the drive circuit. Output to the display element.
- an inspection device test system
- Fig. 1 is a schematic diagram schematically showing a conventional test system for inspecting the L S I configured on the UA-8W.
- the conventional test system consists of a workstation 100, a tester body 1001, a test head 1020, a node board 1030, and a probe.
- Card 1
- the probe card 10 4 is provided with a plurality of probe needles 10 4 a.
- a wafer W to be inspected is placed on a chuck (not shown) formed on the connector 1 0 5, and the LSI configured on this wafer W
- Each Probe needle 1 0 4 a with probe force 1 0 4 is applied to the I / O terminal
- Probe card 1 0 4 is connected to the test head 1 0 3 via the performance board 1 0 3
- the test head 1 0 2 is connected to the tester body 1 0 1 via the cable 1 0 6.
- the test head 10 0 2 amplifies the signal output from each output terminal of the SI and input via the probe force 1 10 4 and the noise performance board '1 0 3, or digital ⁇ -Pre-processing such as conversion to evening is performed by a funnel card that is detachable from test head 10 2.
- the tester body 101 is connected to the 18 W based on the characteristic measurement data sent via the test head 1 0 2 according to the inspection program stored in the white. Been formed
- the performance sport 10 3 is detachably electrically connected to the test head 10 2 and the probe force 10 4.
- a multi-pin test system is provided in which the number of probe needles 10 4 a according to the number is arranged in the probe force 10 4.
- Patent Literature 1 Japanese Patent No. 3 1 9 9 8 2 7
- a switch is provided between one inspection terminal and a predetermined number of output terminals, and image signals appearing at the output terminal are sequentially selected by the switch. Output to the inspection terminal.
- the semiconductor test system multiplexes a plurality of analog signals output from a plurality of output terminals provided in a semiconductor to be inspected at an early stage.
- the number of signals is reduced, the results are AZD converted, averaged and calibrated, and the calibrated characteristic measurement data is supplied to the half pass / fail judgment unit.
- a plurality of analog signals output from a plurality of output terminals are multiplexed at an early stage to reduce the number of signals, and after A / D conversion. Since the data is averaged at an early stage and the amount of data is reduced, a processing circuit for a large number of parallel transmission lines is not necessary, and the apparatus can be miniaturized. In addition, the number of signals and the amount of data are small, so the throughput is improved, the processing time can be greatly reduced, and the inspection time can be greatly shortened. The data of multiple samples can be averaged and calibrated. Thus, the pass / fail judgment is performed, so that the effects of random noise and system noise that are on each display are reduced, and high-precision inspection can be performed. By using a multiplexer and A / D converter that can operate at high speed, the number of samplings that can be performed within a short period of time can be increased and averaged. Can be used.
- 1 is based on digital characteristic measurement data obtained by A / D conversion of a plurality of analog signals output from a plurality of analog output terminals included in a semiconductor. Next pass / fail judgment is performed. A secondary pass / fail decision is then made based on the digital data that passed the primary pass / fail decision.
- the characteristic measurement data calibrated by T / D conversion averaging and calibrating the digital signal output from the plurality of output elements of the semiconductor to be tested is calibrated.
- tenor signals output from a plurality of output terminals are TD-converted and averaged at an early stage after TD conversion to reduce the amount of data.
- the throughput is improved, and the inspection time is greatly shortened by processing in the high speed direction. be able to. / This averages the data of multiple samples, and calibrates to determine pass / fail, so the effects of random noise and system noise on each data are reduced. It is possible to perform a proper inspection.
- Fig. 1 is a diagram showing a simplified configuration of a conventional test L system for inspecting the L S I configured on the top
- FIG. 2 is a diagram showing a schematic configuration example of the entire test ⁇ system according to the first and fifth embodiments.
- FIG. 3 is a block diagram showing an example of the internal configuration of the mother pod and daughter port according to the first embodiment.
- Figure 4 shows an overview of the multiplexers according to the first, second and fifth embodiments. It is a block diagram showing a schematic configuration example
- FIG. 5 is a block diagram showing an example of the internal configuration of the one-card and daughter board according to the second embodiment.
- FIG. 6 is a block diagram showing an example of the internal configuration of the motherboard and daughter board according to the third embodiment.
- FIG. 7 is a block diagram showing an example of the internal configuration of the board and the door board according to the fourth embodiment.
- FIG. 8 is a block diagram showing an example of the internal configuration of the one-port and do-yu-ichi port according to the fifth embodiment.
- FIG. 2 is a diagram showing an example of a schematic configuration of the entire test ⁇ system according to the first embodiment.
- the test system of the first embodiment is a personal computer 10 10 the one F 1 1 H one night 1 12, a probe card 1 3, and a chuck 14. It is configured with a single-hole connector.
- the probe card 1 3 is provided with a number of probe needles 1 3 a.
- Each IC input / output terminal configured on the wafer W where the wafer W to be inspected is placed on the chuck 14 formed on the flow 15 is connected to the pro One probe needle 1 3 a is applied. Pubeka
- Node 1 3 is connected to Mother Port 1 through F
- the mother port 11 is connected to the personal combination 10 via the I / cable 16.
- Mother-board 1 1 is connected directly to personal computer 10 via I / O cable 16 However, it may be connected via a network such as the Internet or a LAN (Local Area Network).
- the daughter card 1 2 is detachably electrically connected to the mother board 1 1 and the probe card 1 3.
- FIG. 3 is a block diagram showing an example of the internal configuration of the mother board 1 1 and the daughter board 1 2.
- the motherboard 1 1 includes a multiplexer 2 1 and a determination processing unit 2 2.
- the board 1 2 has an analog interface section 31, an A / D (Analog / Digital) conversion section 3 2, an averaging processing section 3 3, and a calibration.
- a processing unit 3 4 and a digital interface unit 3 5 are provided.
- the analog port section 3 1 of the daughter port 1 2 is connected to the probe cable from the multiple analog output terminals of the L S I formed on the W-8W.
- Multiplexer 2 1 multiplexes multiple analog signals input from analog port 3 1, reduces the number of signals, and outputs the result to ANO D of DO Supply to converter 3 2.
- the A / D converter 3 2 converts the analog signal returned from the multiplexer 2 1 of the motherboard 1 1 into a digital signal 5.
- the averaging processor 3 3 averages the digital samples (digitalized voltage values) for multiple samples obtained by the A / D converter 3 2. This averaging process makes it possible to reduce the random error of the voltage value caused by the noise generated in the LSI under test, and at an early stage after AZD conversion. Averaging ⁇ This will reduce the amount of data and the subsequent processing will be easier.
- the calibration processing unit 34 performs processing to reduce the LSI systematic error (noise due to a certain tendency, not due to chance). For example, it is output from the averaging processing unit 33 Subtract the specified gift set value from the digital evening price.
- the offset value is ⁇ or h, which is an appropriate value for the deviation from the expected value of the voltage output from the output terminal when the test is input to the LSI. Keep it.
- the adapter section 3 5 was calibrated by the calibration processing section 3 4.
- the decision processing unit 2 2 of the one-point 11 1 performs SI pass / fail judgment of the subject to be inspected based on the digital data input from the cash train interface unit 35.
- the result is a personal computer via I / O cable 1 6 1
- the above-mentioned multiplexer 21 has a plurality of transistor switches 41 connected in the form of “ ⁇ ” --a plurality of analog outputs of the LSI. Multiple analog signals output from the terminal through probe force 1 3 are multiplexed by sequentially passing through these multiple transistor switches 4 1 to reduce the number of signals. Has become
- L S I to be inspected is a 1 0 0 0 pin output (for example,
- a relay switch is provided at various locations on the ⁇ transistor switch, and the relay switch is turned on and off, and the switch is turned off to connect to the previous stage.
- the operation of 1 can be speeded up.
- the multiplex operation of the 1 00 0 pin output can be completed in a short time of 1 m s power.
- An A / D converter 3 2 that AD-converts the analog signal multiplexed at high speed is one that can operate at high speed in about 100 ns, which is equivalent to the operation speed of the multiplexer 21. For example, use a conversion accuracy of 12-bit accuracy. ⁇ ⁇ LS to be inspected
- the same test data is input to the LSI, the analog signal output from each output terminal is sampled, for example, 10 times by the AD conversion unit 32, and the result is averaged by the averaging processing unit 33. Turn into.
- This averaging process reduces the effect of noise on each analog signal, and provides a high degree of characteristic measurement.
- the time required to sample the analog signal for 100 0 pins once is very small. It is about 1 0 0 S. Since the characteristic measurement data is obtained by averaging 10 samples of this digital data, the total measurement time is about 1 ms. This is a very short time compared to the conventional case where one inspection takes about 1 s, and the inspection time can be significantly reduced compared to the conventional case.
- a dedicated cable 10 6 connects the test body 100 1 and the test pad 1 0 2, and this dedicated cable 1 0
- a Z D converter 3 2 is used. This allows multiplex operation and A
- the Z D conversion operation can be performed in a short time of about 10 Ons, and the processing frequency can be increased to about 10 MHz.
- sampling is performed 10 times and averaged, and the overall processing time is as short as 1 ms. Furthermore, overnight
- the number of signals output from the 1 2 to the decision processing unit 2 2 of the motherboard 1 1 is very small in the early multiplet operation and is averaged at a relatively early stage after A / D conversion. Since the amount of data is reduced by the averaging process by the processing unit 33, throughput is also improved.
- the electrical characteristics of a multi-pin output LSI are measured.
- a multi-pin output LSI such as driver voltage measurement and source drain test
- FIG. 5 is a block diagram showing an example of an internal configuration of the mother board 1 according to the second embodiment: [and the board 11 2. Note that in FIG. 5, the same reference numerals as those shown in FIG. 3 have the same functions, and therefore, redundant description is omitted here.
- the motherboard '1 1 according to the second embodiment includes a secondary determination processing unit 2 3 instead of the determination processing unit 2 2 shown in FIG.
- the daughter port '1 2 according to the second embodiment further includes a primary determination processing unit 3 6 between the calibration processing unit 3 4 and the T interferometer face unit 3 5. It is configured.
- the primary judgment processing unit 3 6 performs a primary pass / fail judgment for the Densier data that has been calibrated by the calibration processing unit 3 4, and performs processing to reduce unnecessary data.
- the content of the processing performed here is, for example, that even if a predetermined offset value is subtracted from the final value of the final value in the calibration processing unit .34, the calculated result is the expected value. If the difference between the data value output from the calibration processing unit 34 and the expected value is greater than or equal to a predetermined value, it is determined that there is a defect in the LSI to be inspected. When the data is destroyed
- the digital interface 35 is a primary determination process. Only the digital data that is judged to be acceptable by the primary pass / fail judgment by the logic part 3 6 is output to the motherboard 1 1.
- the secondary decision processing unit 2 3 of the mother board 1 1 performs secondary pass / fail judgment of the LSI to be inspected based on the digital data input from the digital input face unit 35.
- the result is output to the personal computer 10 via the I / O cable 16 and the secondary pass / fail judgment process performed by the judgment processor 2 2 shown in FIG. This is the same as the pass / fail judgment process to be performed, and it is a more advanced judgment than the primary pass / fail judgment performed by the primary judgment processing unit 36.
- the pass / fail judgment by the secondary judgment processing unit 2 3 takes longer to process.
- a simple pass / fail determination is performed before advanced pass / fail determination, and the LSI to be inspected is considered to be clearly defective.
- the above inspection is not performed. That is, only the digital data that passed the primary pass / fail judgment in the primary judgment processing section 36 is sent to the secondary judgment processing section 2 3. Since it is subject to secondary pass / fail judgment, it is possible to reduce m. Of digital data sent to the secondary judgment processing unit 23, which takes a long time for inspection. As a result, the throughput is further improved as compared with the first embodiment described above, and the inspection time can be greatly shortened by processing at higher speed.
- a digital pulse is input when a pulsed digital signal is input to the LSI.
- LSI inspection is performed based on the time lag (response time, etc.) of the digital data output from the output terminal.
- FIG. 6 is a block diagram showing an internal configuration example of the mother board 1 1 and the daughter board 1 2 according to the third embodiment.
- the mother pole '1 1 includes a timing generator 41, a switch array 42, and a determination processor 43.
- the Do Yui Port 1 2 according to the third embodiment is
- the wing generation unit 4 1 of the motherboard 11 is supplied to the LSI to be inspected.
- An evening input signal (for example, a pulse signal with rising and falling edges at a predetermined timing) is generated, and output to the ⁇ interface unit 5 1 of the overnight board 12 To do.
- the delay line section 51 outputs the digital input signal supplied from the timing generation section 41 to the digital input terminal of the LSI, and as a result, outputs each digital signal of the LSI. Input the decibel output signal (SI characteristic measurement data) returned from the output terminal. Then, the digital signal ⁇ Ichibat input from S I is output to the switch 4 2 of Mother Pod 1 1 ⁇
- the switch array 4 2 switches a plurality of digital data input from the digital interface unit 51 and supplies the digital data to the TZD conversion unit 52 of the turbocharger 12.
- switch array 4 2 is used instead of a multiplexer, but this is not so large in the number of digital output terminals, and switch array 4 2 in which the release switches are arranged in an array is also used. This is because the number of digital output terminals is extremely large because it is possible, and the number of digital signals input to the DIGIN LIN FACE part 5 1 is huge.
- the switch array 4 2 field ⁇ multiplexer does not connect the range switch, it does not take a large load force and realizes high-speed operation. can do
- the ZD converter 5 2 inputs the digital data input to the SI digital input terminal from the digital data input interface 51, and then outputs it from the SI ⁇ digital output terminal. Time from when digital data is output until it is input to the TZD converter 52 via the switch array 42 (F alignment time from when a pulse is input to the LSI until the measurement data is obtained) ) Is converted into a digital evening.
- the averaging processing unit 53 performs a process of averaging the number of digital events (digitalized response time) obtained by the ⁇ / D conversion unit 52. For example, when the same pulse data is input to the LSI, the digital signal output from the output terminal is used to input the response time for 10 times, for example, in the ⁇ / D converter 52.
- the averaged processing unit 53 performs the ⁇ leveling process. This averaging process makes it possible to reduce the random error in the response time caused by the noise that occurs in the test target S I /
- the calibration processing unit 54 performs processing for reducing the LSI system ⁇ to be tested.
- the averaging processing unit 53 performs a process of subtracting a predetermined offset value from the digital value of the output response time. This place The value of ⁇ is set to an appropriate value as the amount of deviation from the expected response time until the measurement data is obtained when the digital data is input to the LSI.
- the data is supplied to the decision processing unit 4 3 of the turbocharger 1 2 through the digital interface 5 1.
- the decision processing unit 4 3 makes a pass / fail decision on the LSI to be inspected based on the ⁇ parameter value input from the digital interface X 1 unit 51, and the result is I / O. ⁇ Output to personal view 10 through cable 1 6.
- the wiring is kept only on the boards of the mother board 11 and the door board 12. Also T /
- the throughput is also improved.
- test system configuration can be significantly reduced compared to conventional systems
- FIG. 7 is a block diagram showing an example of the internal configuration of the mother board 1: L and the turbo turbo board 12 according to the fourth embodiment.
- the motherboard 11 according to the fourth embodiment includes a secondary determination processing unit 4 4 instead of the determination processing unit 4 3 shown in FIG.
- the Dopod port 12 according to the second embodiment is configured to further include a primary determination processing unit 55 between the calibration processing unit 54 and the digital interface unit 51. .
- the primary determination processing unit 5 5 performs a primary pass / fail determination for the digital signal ⁇ evening calibrated by the calibration processing unit 54, and performs processing to reduce excess data. Do. For example, even if the calibration processing unit 54 subtracts a predetermined offset value from the tale data value in the calibration processing unit 54, the calculated value of the calculated value deviates significantly from the expected value. (For example, if the difference between the data value output from the calibration processing unit 54 and the expected value is greater than or equal to the predetermined value, the LSI to be inspected is defective and the data is discarded. When is there.
- the digital evening interface 5 1 is the only message that is determined to have passed the primary pass / fail judgment by the primary judgment processing unit 5 5. 1 output to 1.
- the board 1 1 secondary decision processing unit 4 4 determines the secondary pass / fail decision of the LSI to be inspected based on the digital data input from the digital interface X 1
- the secondary pass / fail judgment process performed by outputting the result to the personal computer 10 via the I / O cable 16 is performed by the judgment processing unit 4 3 shown in FIG. processes similar to also Nodea is, the primary processing device 5 5 Te ratio base to primarily pass-fail decision made Te Niyotsu, but 0 was performs a sophisticated determination Ri good connexion, primary determining Processing part
- advanced pass / fail judgment is performed.
- a simple pass / fail decision is made before the test, and no further inspection is performed on the LSI that is clearly inspected.
- only digital data that has passed the primary pass / fail judgment in the primary judgment processing section 55 is sent to the secondary judgment processing section 44 to be subjected to secondary pass / fail judgment. Therefore, it is possible to reduce the amount of digital data sent to the secondary judgment processing unit 44, which takes more time for inspection. As a result, the throughput is further improved compared to the third embodiment described above, and the inspection time can be greatly shortened by processing at higher speed.
- the fifth embodiment is a combination of the second embodiment and the fourth embodiment described above.
- the overall configuration of the test system according to the fifth embodiment is the same as that shown in FIG.
- FIG. 8 is a block diagram showing an example of the internal configuration of the mother board 11 and the door board 1 2 according to the fifth embodiment.
- Fig. 8 is a block diagram showing an example of the internal configuration of the mother board 11 and the door board 1 2 according to the fifth embodiment.
- the mother port 11 is composed of a multiplexer 2 1, a sunset generation unit 4 1, a switch array 4 2,
- the daughter turbo 1 2 according to the fifth embodiment is provided with an analog ⁇ interface section 3 1 and K /
- the averaging processor 7 1 of the overnight board 1 2 has the functions of both the averaging processor 3 3 shown in Fig. 5 and the averaging processor 5 3 shown in Fig. 7. It is.
- the averaging processing unit 7 1 is the result of inputting digital signals for a plurality of samples obtained by the A / D conversion unit 3 2 (test 5 ⁇ even into the LSI). The obtained voltage value is digitized, and
- the calibration processing unit 7 2 has both functions of the calibration processing unit 3 4 shown in FIG. 5 and the calibration processing unit 5 4 shown in FIG. 7.
- Averaging output from the averaging processing unit 7 1 Performs processing to subtract a predetermined offset value from the 7 evening value.
- the offset value is measured according to the amount of deviation from the expected value of the voltage output from the output terminal when test data is input to the LSI, and when a pulse is input to the LSI.
- an appropriate M value is ⁇ or C and ⁇ respectively.
- the primary judgment processing unit 7 3 has the functions of both the primary judgment processing unit 36 shown in FIG. 5 and the primary judgment processing unit 55 shown in FIG. 7
- the processing for reducing the excess data is performed on the digital data calibrated in accordance with 2 2.
- the primary determination processing unit 7 3 is connected to the calibration processing unit 36.
- the digital interface unit 7 4 outputs, to the motherboard 11, only the digital interface that is determined to be acceptable by the primary pass / fail determination by the primary determination processing unit 7 3.
- the secondary decision processing unit 6 1 of the mother board 1 1 uses the digital data input from the digital evening interface unit 74 as the secondary pass / fail of the LSI under test. Judgment is made, and the result is output to one Sonar computer 10 via I / O cable 16. In this secondary determination processing unit 6 1,
- the first digital data output from the analog output terminal of the LSI and supplied from the primary judgment processing unit 73 after undergoing D conversion (the digitized voltage value) and the digital output terminal of the LSI Comprehensive judgment is performed including both of the second digital data that is output and supplied via the primary judgment processing section 7 3 (the response time is converted into a dental value).
- the averaging processing unit 71, calibration processing unit 72, and primary determination processing unit 73 shown above are configured by, for example, one DSP (Digital Signal 1 Processor). Is possible
- the test system capable of performing both the driver test for measuring the driver voltage and the timing test ⁇ for checking the response time, etc. It is possible to inspect the thermal characteristics of pin output LSIs quickly and with high accuracy. Fallen
- test system configuration can be significantly smaller than before. Also, based on the analog signal output from the LSI analog output terminal ⁇ Pass / Fail and LSI digital output Since comprehensive judgment including both pass / fail judgment based on the digital signal output from the terminal is performed.
- the mother board 1 1 and the door Although an example has been described in which the boards 1 and 2 are provided separately and each function block is arranged in each board, this is merely an example of the arrangement. Whether board 1 1 or board 1 or turbo 1 or 2 is installed is completely arbitrary.
- the mother board 1 1 may be configured as a single board without distinguishing between the “even night port” 1 2 and the upper PL 1 to the fifth.
- the example of performing the driving test and the evening test as the test seed fe has been described.
- the present invention can be used for other test tests as well.
- LSIs with super-multi-pin outputs used in display devices such as liquid crystal display devices, organic EL devices, plasma display devices, and surface electric field displays are to be inspected.
- display devices such as liquid crystal display devices, organic EL devices, plasma display devices, and surface electric field displays.
- the semiconductor to be inspected is not limited to this.
- the present invention is useful for a test system for inspecting electrical characteristics related to L S I having an ultra-high pin output.
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- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
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Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2004800442482A CN101069101A (zh) | 2004-08-26 | 2004-08-26 | 半导体的测试系统 |
EP04772649A EP1783504A1 (en) | 2004-08-26 | 2004-08-26 | Semiconductor test system |
CA002578060A CA2578060A1 (en) | 2004-08-26 | 2004-08-26 | Semiconductor test system |
JP2006531218A JPWO2006022026A1 (ja) | 2004-08-26 | 2004-08-26 | 半導体のテストシステム |
PCT/JP2004/012693 WO2006022026A1 (ja) | 2004-08-26 | 2004-08-26 | 半導体のテストシステム |
TW094128240A TW200612509A (en) | 2004-08-26 | 2005-08-18 | Semiconductor test system |
US11/677,155 US20070162800A1 (en) | 2004-08-26 | 2007-02-21 | Semiconductor test system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2004/012693 WO2006022026A1 (ja) | 2004-08-26 | 2004-08-26 | 半導体のテストシステム |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/677,155 Continuation US20070162800A1 (en) | 2004-08-26 | 2007-02-21 | Semiconductor test system |
Publications (1)
Publication Number | Publication Date |
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WO2006022026A1 true WO2006022026A1 (ja) | 2006-03-02 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2004/012693 WO2006022026A1 (ja) | 2004-08-26 | 2004-08-26 | 半導体のテストシステム |
Country Status (7)
Country | Link |
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US (1) | US20070162800A1 (ja) |
EP (1) | EP1783504A1 (ja) |
JP (1) | JPWO2006022026A1 (ja) |
CN (1) | CN101069101A (ja) |
CA (1) | CA2578060A1 (ja) |
TW (1) | TW200612509A (ja) |
WO (1) | WO2006022026A1 (ja) |
Cited By (2)
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JP2014071089A (ja) * | 2012-10-02 | 2014-04-21 | Hioki Ee Corp | 基板検査装置 |
US10392351B2 (en) | 2014-01-07 | 2019-08-27 | Suzhou Lixin Pharmaceutical Co., Ltd. | Method for preparing nilotinib intermediate |
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TWI416117B (zh) * | 2009-10-28 | 2013-11-21 | Mpi Corp | 探針卡 |
JP5817236B2 (ja) * | 2011-06-17 | 2015-11-18 | 株式会社Sumco | 半導体試料中の金属汚染評価方法および半導体基板の製造方法 |
US8860448B2 (en) * | 2011-07-15 | 2014-10-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Test schemes and apparatus for passive interposers |
TWI451108B (zh) * | 2013-01-17 | 2014-09-01 | Test Research Inc | 時序分析裝置及時序分析方法 |
TWM488641U (zh) * | 2014-01-24 | 2014-10-21 | Sitronix Technology Corp | 自動測試設備的積體電路測試介面 |
CN204044309U (zh) * | 2014-01-24 | 2014-12-24 | 矽创电子股份有限公司 | 自动测试设备和升级自动测试设备的集成电路测试界面 |
US11221365B2 (en) * | 2020-03-11 | 2022-01-11 | Teradyne, Inc. | Calibrating an interface board |
CN113078962B (zh) * | 2021-03-19 | 2022-12-09 | Oppo广东移动通信有限公司 | 射频校准方法、射频校准装置、测试设备及存储介质 |
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2004
- 2004-08-26 JP JP2006531218A patent/JPWO2006022026A1/ja not_active Withdrawn
- 2004-08-26 EP EP04772649A patent/EP1783504A1/en not_active Withdrawn
- 2004-08-26 CN CNA2004800442482A patent/CN101069101A/zh active Pending
- 2004-08-26 WO PCT/JP2004/012693 patent/WO2006022026A1/ja not_active Application Discontinuation
- 2004-08-26 CA CA002578060A patent/CA2578060A1/en not_active Abandoned
-
2005
- 2005-08-18 TW TW094128240A patent/TW200612509A/zh unknown
-
2007
- 2007-02-21 US US11/677,155 patent/US20070162800A1/en not_active Abandoned
Patent Citations (5)
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JPS58174864A (ja) * | 1982-04-08 | 1983-10-13 | Toshiba Corp | 回路診断装置 |
JPH08307268A (ja) * | 1995-05-11 | 1996-11-22 | Meidensha Corp | ディジタル保護継電器 |
JP2000040571A (ja) * | 1998-07-23 | 2000-02-08 | Nec Ibaraki Ltd | Icソケット |
JP2001337133A (ja) * | 2000-05-26 | 2001-12-07 | Yokogawa Electric Corp | Icテスタ |
JP2004048383A (ja) * | 2002-07-11 | 2004-02-12 | Renesas Technology Corp | 送受信システムおよび通信用半導体集積回路並びにテスト方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014071089A (ja) * | 2012-10-02 | 2014-04-21 | Hioki Ee Corp | 基板検査装置 |
US10392351B2 (en) | 2014-01-07 | 2019-08-27 | Suzhou Lixin Pharmaceutical Co., Ltd. | Method for preparing nilotinib intermediate |
Also Published As
Publication number | Publication date |
---|---|
EP1783504A1 (en) | 2007-05-09 |
TW200612509A (en) | 2006-04-16 |
US20070162800A1 (en) | 2007-07-12 |
JPWO2006022026A1 (ja) | 2008-05-08 |
CA2578060A1 (en) | 2006-03-02 |
CN101069101A (zh) | 2007-11-07 |
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