Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B3/00—Ohmic-resistance heating
  • H05B3/02—Details
  • H05B3/03—Electrodes
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B3/00—Ohmic-resistance heating
  • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
  • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
  • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
  • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
  • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/12—All metal or with adjacent metals
  • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
  • Y10T428/12771—Transition metal-base component
  • Y10T428/12861—Group VIII or IB metal-base component
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
  • Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
  • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
  • Y10T428/264—Up to 3 mils
  • Y10T428/265—1 mil or less

Definitions

• the present invention relates to a ceramic block having a built-in sheet electrode used for a ceramic electrostatic chuck or a ceramic heater.
• the ceramic block with built-in electrodes has a flat mounting surface on which semiconductor wafers and glass substrates for LCD (liquid crystal display) are mounted.
• the ceramic block is formed by using a length ⁇
• a sheet electrode extending parallel to the mounting surface is sandwiched between the stacked ceramic sheets.
• the sheet electrode may be in the form of a film, mesh, or metallized layer baked on a ceramic sheet. Usually, it is provided in a 0 ceramic block extending from the side of the mounting surface toward the sheet electrode. Into the hole, a drawer for supplying power to the sheet electrode is provided. Through the hole, it is connected to the external terminal of the ceramic block.
• Japanese Patent Publication 62-2646438 discloses an electrostatic chuck base as a ceramic block with a built-in electrode. An insertion hole is formed in the electrostatic chuck base on the opposite side of the mounting surface, and external terminals are fixed to the insertion hole. A via hole of ⁇ : to make the sheet electrode and the insertion hole »is formed, and the paste is poured into the via hole. Is the outside sound! And ⁇ this paste 3 ⁇ 4 ⁇ is supplied.
• the ceramic heater has a resistance heating element pattern as a sheet electrode and a plurality of ceramic insulating layers. Several suseo 1 / ⁇ holes with a metal film baked on the inner surface are formed in the ceramic heater. Some are exposed on the outer surface of the ceramic yarn leak, and The A plate-shaped wire (lead S) is exposed by the ring bracket.
• Japanese Patent Publication No. 2000-0-106991 discloses an insulating ceramic substrate for a susceptor supporting a semiconductor as a ceramic block with built-in electrodes.
• a receiving hole is formed in the ceramic base on the opposite side of the mounting surface. Part of the mesh electrode in the ceramic substrate is exposed at the bottom of the receiving hole.
• a terminal for supplying a voltage to the mesh electrode is housed in the housing hole.
• an intermediate material Prior to heat treatment of the ceramic substrate, an intermediate material is provided between the bottom of the receiving hole and the terminal.
• the intermediate material is made of a conductive metal matrix-ceramic composite, and is melted by heat treatment of the ceramic substrate. As a result, the terminals are electrically connected to the mesh electrode and bond to the ceramic substrate.
• JP * ⁇ 1 ⁇ 2 ⁇ g2 0 0 3-1 1 5 5 29 discloses an electrostatic chuck device as a ceramic block with built-in electrodes.
• the electrostatic chuck device includes an insulating layer on which a mounting surface is formed, and a conductive layer that extends in the insulating layer, that is, an electrode.
• the insulating layer is laminated on the metal base on which the through hole is formed.
• An insulating member is provided in the through hole, and a guide hole is formed in the insulating member.
• a conductor extends through the guide hole, one end of the conductor is fixed to the conductive layer with solder, and the other end is fixed to the power supply terminal with solder.
• the ceramic sheet on which the mounting surface is formed has a thickness of about 50 to 500 m in consideration of dielectric strength and mechanical strength. Ceramic sheets and sheet electrodes differ in coefficient of thermal expansion and thermal contraction. As a result, a high residual stress is generated at the connection between the sheet electrode and the lead conductor, and cracks are easily generated in the thin ceramic sheet electrode.
• An object of the present invention is to cover a thin ceramic sheet-sheet electrode having a mounting surface formed thereon.
• An object of the present invention is to provide a ceramic block with a built-in electrode in which a rack is hardly generated and a method for manufacturing the same.
• a ceramic block with a built-in electrode of the present invention comprises: a first insulating ceramic sheet having a mounting surface; a sheet electrode having an inner edge and extending substantially parallel to the mounting surface; Second insulating ceramic sheet sandwiching the sheet electrode together with the insulating ceramic sheet, and a drawer extending through the second insulating ceramic sheet to supply voltage to the sheet electrode and connecting to the inner edge of the sheet electrode Including conductors.
• the lead conductor is in the form of a cylindrical thin film and is connected to the sheet electrode so as to form a vertical corner.
• the method includes a step of forming a laminate of the first and second insulating ceramic sheets, and a step of firing the laminate of the first and second insulating ceramic sheets.
• FIG. 1 is a sectional view of a ceramic block with built-in electrodes according to the present invention.
• FIG. 2 is a plan view of the ceramic block with built-in electrodes of FIG. 1 as viewed from below.
• FIG. 3 is a perspective view illustrating a method for manufacturing the ceramic block with built-in electrodes in FIG.
• FIG. 4 is a pattern diagram of a printed sheet electrode.
• the electrode built-in ceramic block 1 includes laminated rectangular ceramic sheets 12 and 14.
• a mounting surface 12 a for holding a wafer or a substrate is formed on the upper surface of the first ceramic sheet 12.
• An enlarged hole 14 b for inserting an external terminal (not shown) is formed on the bottom surface of the second ceramic sheet 14.
• a through hole 14c extending from the upper surface of the second ceramic sheet 14 to the enlarged hole 14b is formed. 2, the through hole 14c has a concentric circular cross section smaller than the enlarged hole 14b.
• the ceramic block 1 has a thin-film sheet electrode 2 having a thickness of 2 to 150 m between the ceramic sheets 12 and 14. As is well shown in FIG. 1, the sheet electrode 2 extends substantially parallel to the mounting surface 12a. As shown in FIG.
• a circular hole corresponding to the opening of the through hole 14 c is formed in the sheet electrode 2.
• the sheet electrode 2 has a rectangular outer edge and a circular inner edge 2e along the opening of the through hole 14c.
• the ceramic block 1 further includes a tubular lead conductor 3 for supplying a voltage to the sheet electrode 2.
• the thin-film lead conductor 3 has a thickness of 2 to 150 m.
• the lead conductor 3 is attached to the inner wall of the through hole 14 and has a cylindrical shape. The lower end 3d of the cylindrical lead conductor 3 is exposed in the enlarged hole 14b.
• the upper end 3 e of the lead conductor 3 is connected to the inner edge 2 e of the sheet electrode 2, and the lead conductor 3 and the sheet electrode 2 form a vertical corner along the opening of the through hole 14 c.
• a cylindrical ceramic shaft 16 is packed in the through hole 14c.
• the ceramic shaft 16 and the ceramic sheets 12, 14 are made of the same material. Have been made.
• the ceramic sheets 12 and 14 are made by compression-molding a ceramic powder to which a sintering aid has been added by a mold.
• the ceramic shaft 16 is made by compression molding.
• the dimensions of the through-holes 14 c of the second ceramic sheet 14 are designed in consideration of the supply electric capacity of the lead conductor 3.
• a conductive paste is applied to the inner peripheral surface of the through hole 14c.
• a conductive paste is applied to at least one of the bottom surface of the first ceramic sheet 12 and the top surface 14 d of the second ceramic sheet 14.
• an application surface having a predetermined size and pattern is formed. When the application surface has dried, the ceramic shaft 16 is fitted into the through hole 14 c of the second ceramic sheet 14.
• the ceramic sheets 12, 14 are laminated, and the laminate is placed in an elastic bag. If necessary, ceramic powder is filled around the laminate.
• the laminate is compression molded by CIP (cold isostatic pressing) at a pressure equal to or greater than the initial compression molding.
• CIP cold isostatic pressing
• the joined ceramic sheets 12, 14 are fired under conditions according to the material. By firing, the applied conductive paste becomes the lead conductor 3 and the sheet electrode 2.
• the lead conductor 3 and the sheet electrode 2 preferably have a thickness of 2 to 150 m.
• the fired body is processed to a desired size by grinding or cutting. Thus, the ceramic block 1 with a built-in electrode is manufactured.
• a ceramic material containing alumina as a main component, a sintering aid such as silica, magnesia, and lucifer, and a binder such as PVA (polyvinyl alcohol), glycerin, and acrylic acid are mixed.
• a sintering aid such as silica, magnesia, and lucifer
• a binder such as PVA (polyvinyl alcohol), glycerin, and acrylic acid
• a ceramic shaft 16 having a diameter of about 5 mm and a length of 1 Omm was produced by CIP with a surface pressure of 100 OKgZcm 2 and machining.
• two sheet electrodes 2a and 2b were screen-printed on the upper surface 14d of one of the ceramic sheets 14 using the parametic paste.
• Palladium paste was applied to the inner peripheral surfaces of the two through holes 14c using a paintbrush. The coated surface was air-dried at room temperature for about one day.
• the other ceramic sheet 12 was superimposed on the upper surface 14d of one ceramic sheet 14, and two ceramic shafts 16 were inserted into the through holes 14c.
• the two ceramic sheets were packed in a rubber bag and joined by CIP with a surface pressure of 100 OKgZcm 2 .
• the assembly was fired at 145 O: in a firing furnace using LPG as fuel.
• a cylindrical lead conductor 3 having a diameter of about 4.5 mm and a thickness of about 5 was formed in the peripheral wall device of the through-hole 14c.
• the lead conductor 3 was in close contact with the ceramic sheet 14 without any gap, and no crack was observed.
• the fired body was processed with a diamond grindstone so that the thickness of the ceramic sheet 12 was 0.4 mm and the thickness of the ceramic sheet 14 was 6 mm.
• An electroless nickel plating with a thickness of 5 to 10 xm was applied to the bottom surface of the enlarged hole 14b in a range of about 1 Omm in diameter, and a metal terminal connected to an external terminal was attached to the enlarged hole 14b.
• an electrostatic chuck base was manufactured.
• the electrostatic chuck substrate was able to strongly attract the glass substrate with the ITO film while maintaining sufficient mechanical strength.

Landscapes

• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Ceramic Engineering (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
• Resistance Heating (AREA)
• Production Of Multi-Layered Print Wiring Board (AREA)
• Coils Or Transformers For Communication (AREA)

Priority Applications (1)

Applications Claiming Priority (2)

Publications (2)

Family

ID=35510188

Family Applications (1)

Country Status (3)

Families Citing this family (4)

Family Cites Families (9)

• 2004
  • 2004-06-21 JP JP2004182505A patent/JP4266886B2/ja not_active Expired - Fee Related
• 2005
  • 2005-06-21 WO PCT/JP2005/012255 patent/WO2005122701A2/ja not_active Ceased
  • 2005-06-21 US US10/590,360 patent/US7825355B2/en active Active

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