JP2006005295A5 - - Google Patents
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- Publication number
- JP2006005295A5 JP2006005295A5 JP2004182505A JP2004182505A JP2006005295A5 JP 2006005295 A5 JP2006005295 A5 JP 2006005295A5 JP 2004182505 A JP2004182505 A JP 2004182505A JP 2004182505 A JP2004182505 A JP 2004182505A JP 2006005295 A5 JP2006005295 A5 JP 2006005295A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- ceramic
- internal electrode
- hole
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 106
- 239000000843 powder Substances 0.000 claims description 68
- 238000000605 extraction Methods 0.000 claims description 43
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 239000010409 thin film Substances 0.000 claims description 16
- 238000010304 firing Methods 0.000 claims description 14
- 238000000748 compression moulding Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 3
- 238000009694 cold isostatic pressing Methods 0.000 claims description 2
- 238000004070 electrodeposition Methods 0.000 claims description 2
- 238000011049 filling Methods 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 14
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 235000012255 calcium oxide Nutrition 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004482 other powder Substances 0.000 description 1
- 125000000914 phenoxymethylpenicillanyl group Chemical group CC1(S[C@H]2N([C@H]1C(=O)*)C([C@H]2NC(COC2=CC=CC=C2)=O)=O)C 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004182505A JP4266886B2 (ja) | 2004-06-21 | 2004-06-21 | セラミック素子とその製造方法 |
| US10/590,360 US7825355B2 (en) | 2004-06-21 | 2005-06-21 | Ceramic block with built in electrode and method of manufacture thereof |
| PCT/JP2005/012255 WO2005122701A2 (ja) | 2004-06-21 | 2005-06-21 | 電極内蔵セラミックブロック及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004182505A JP4266886B2 (ja) | 2004-06-21 | 2004-06-21 | セラミック素子とその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006005295A JP2006005295A (ja) | 2006-01-05 |
| JP2006005295A5 true JP2006005295A5 (enExample) | 2008-10-16 |
| JP4266886B2 JP4266886B2 (ja) | 2009-05-20 |
Family
ID=35510188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004182505A Expired - Fee Related JP4266886B2 (ja) | 2004-06-21 | 2004-06-21 | セラミック素子とその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7825355B2 (enExample) |
| JP (1) | JP4266886B2 (enExample) |
| WO (1) | WO2005122701A2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9281226B2 (en) * | 2012-04-26 | 2016-03-08 | Applied Materials, Inc. | Electrostatic chuck having reduced power loss |
| JP6194526B2 (ja) * | 2013-06-05 | 2017-09-13 | 高周波熱錬株式会社 | 板状ワークの加熱方法及び加熱装置並びにホットプレス成形方法 |
| US20240225108A1 (en) * | 2022-05-30 | 2024-07-11 | Shenzhen Huachengda Precision Industry Co. Ltd. | Atomizer and atomizing assembly |
| KR20250044914A (ko) * | 2022-09-14 | 2025-04-01 | 교세라 가부시키가이샤 | 흡착 기판 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0697677B2 (ja) | 1987-04-21 | 1994-11-30 | 東陶機器株式会社 | 静電チャック基盤の製造方法 |
| JP3771686B2 (ja) | 1997-08-29 | 2006-04-26 | 京セラ株式会社 | ウエハ支持部材 |
| JP2000106391A (ja) | 1998-07-28 | 2000-04-11 | Ngk Insulators Ltd | 半導体支持装置、その製造方法、接合体の製造方法および接合体 |
| WO2001062686A1 (en) | 2000-02-24 | 2001-08-30 | Ibiden Co., Ltd. | Aluminum nitride sintered compact, ceramic substrate, ceramic heater and electrostatic chuck |
| JP2004168658A (ja) * | 2000-02-24 | 2004-06-17 | Ibiden Co Ltd | 半導体製造・検査装置用セラミック基板 |
| JP4485010B2 (ja) | 2000-04-17 | 2010-06-16 | 日本特殊陶業株式会社 | セラミック素子と電極の組立体 |
| JP4502462B2 (ja) | 2000-05-31 | 2010-07-14 | 京セラ株式会社 | ウエハ支持部材及びその製造方法 |
| JP4439108B2 (ja) * | 2000-10-31 | 2010-03-24 | 京セラ株式会社 | ウエハ支持部材 |
| JP3993408B2 (ja) | 2001-10-05 | 2007-10-17 | 株式会社巴川製紙所 | 静電チャック装置、その組立方法および静電チャック装置用部材 |
-
2004
- 2004-06-21 JP JP2004182505A patent/JP4266886B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-21 WO PCT/JP2005/012255 patent/WO2005122701A2/ja not_active Ceased
- 2005-06-21 US US10/590,360 patent/US7825355B2/en active Active
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