JP4266886B2 - セラミック素子とその製造方法 - Google Patents
セラミック素子とその製造方法 Download PDFInfo
- Publication number
- JP4266886B2 JP4266886B2 JP2004182505A JP2004182505A JP4266886B2 JP 4266886 B2 JP4266886 B2 JP 4266886B2 JP 2004182505 A JP2004182505 A JP 2004182505A JP 2004182505 A JP2004182505 A JP 2004182505A JP 4266886 B2 JP4266886 B2 JP 4266886B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- hole
- powder
- electrode
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 title claims description 98
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000000843 powder Substances 0.000 claims description 54
- 238000000605 extraction Methods 0.000 claims description 34
- 238000000748 compression moulding Methods 0.000 claims description 13
- 238000010304 firing Methods 0.000 claims description 13
- 239000010409 thin film Substances 0.000 claims description 13
- 238000000465 moulding Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 14
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 235000012255 calcium oxide Nutrition 0.000 description 1
- 238000009694 cold isostatic pressing Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004482 other powder Substances 0.000 description 1
- 125000000914 phenoxymethylpenicillanyl group Chemical group CC1(S[C@H]2N([C@H]1C(=O)*)C([C@H]2NC(COC2=CC=CC=C2)=O)=O)C 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/03—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Resistance Heating (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Coils Or Transformers For Communication (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004182505A JP4266886B2 (ja) | 2004-06-21 | 2004-06-21 | セラミック素子とその製造方法 |
| US10/590,360 US7825355B2 (en) | 2004-06-21 | 2005-06-21 | Ceramic block with built in electrode and method of manufacture thereof |
| PCT/JP2005/012255 WO2005122701A2 (ja) | 2004-06-21 | 2005-06-21 | 電極内蔵セラミックブロック及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004182505A JP4266886B2 (ja) | 2004-06-21 | 2004-06-21 | セラミック素子とその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006005295A JP2006005295A (ja) | 2006-01-05 |
| JP2006005295A5 JP2006005295A5 (enExample) | 2008-10-16 |
| JP4266886B2 true JP4266886B2 (ja) | 2009-05-20 |
Family
ID=35510188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004182505A Expired - Fee Related JP4266886B2 (ja) | 2004-06-21 | 2004-06-21 | セラミック素子とその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7825355B2 (enExample) |
| JP (1) | JP4266886B2 (enExample) |
| WO (1) | WO2005122701A2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9281226B2 (en) * | 2012-04-26 | 2016-03-08 | Applied Materials, Inc. | Electrostatic chuck having reduced power loss |
| JP6194526B2 (ja) * | 2013-06-05 | 2017-09-13 | 高周波熱錬株式会社 | 板状ワークの加熱方法及び加熱装置並びにホットプレス成形方法 |
| US20240225108A1 (en) * | 2022-05-30 | 2024-07-11 | Shenzhen Huachengda Precision Industry Co. Ltd. | Atomizer and atomizing assembly |
| KR20250044914A (ko) * | 2022-09-14 | 2025-04-01 | 교세라 가부시키가이샤 | 흡착 기판 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0697677B2 (ja) | 1987-04-21 | 1994-11-30 | 東陶機器株式会社 | 静電チャック基盤の製造方法 |
| JP3771686B2 (ja) | 1997-08-29 | 2006-04-26 | 京セラ株式会社 | ウエハ支持部材 |
| JP2000106391A (ja) | 1998-07-28 | 2000-04-11 | Ngk Insulators Ltd | 半導体支持装置、その製造方法、接合体の製造方法および接合体 |
| WO2001062686A1 (en) | 2000-02-24 | 2001-08-30 | Ibiden Co., Ltd. | Aluminum nitride sintered compact, ceramic substrate, ceramic heater and electrostatic chuck |
| JP2004168658A (ja) * | 2000-02-24 | 2004-06-17 | Ibiden Co Ltd | 半導体製造・検査装置用セラミック基板 |
| JP4485010B2 (ja) | 2000-04-17 | 2010-06-16 | 日本特殊陶業株式会社 | セラミック素子と電極の組立体 |
| JP4502462B2 (ja) | 2000-05-31 | 2010-07-14 | 京セラ株式会社 | ウエハ支持部材及びその製造方法 |
| JP4439108B2 (ja) * | 2000-10-31 | 2010-03-24 | 京セラ株式会社 | ウエハ支持部材 |
| JP3993408B2 (ja) | 2001-10-05 | 2007-10-17 | 株式会社巴川製紙所 | 静電チャック装置、その組立方法および静電チャック装置用部材 |
-
2004
- 2004-06-21 JP JP2004182505A patent/JP4266886B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-21 WO PCT/JP2005/012255 patent/WO2005122701A2/ja not_active Ceased
- 2005-06-21 US US10/590,360 patent/US7825355B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006005295A (ja) | 2006-01-05 |
| US20070286985A1 (en) | 2007-12-13 |
| WO2005122701A2 (ja) | 2005-12-29 |
| WO2005122701A3 (ja) | 2006-02-16 |
| US7825355B2 (en) | 2010-11-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0596711B1 (en) | Method of fabricating a capacitive pressure transducer | |
| CN101405882B (zh) | 压电致动器 | |
| US20080238264A1 (en) | Multi-Layer Piezoelectric Element and Method for Manufacturing the Same | |
| US20100156251A1 (en) | Piezoelectric actuator and method for producing it | |
| WO2015016173A1 (ja) | 配線基板、リード付き配線基板および電子装置 | |
| JP2000517105A (ja) | 電気セラミックスデバイス及びその製造方法 | |
| JP4266886B2 (ja) | セラミック素子とその製造方法 | |
| US5120377A (en) | Method of manufacturing laminated ceramic material | |
| JPH11340106A (ja) | 積層セラミック電子部品とその選別方法 | |
| CN107195769A (zh) | 多层压电陶瓷堆叠结构、传感器及其制备方法 | |
| JP7745718B2 (ja) | セラミックス焼結体の製造方法、電極埋設部材の製造方法、および電極埋設部材 | |
| JP2006005295A5 (enExample) | ||
| JP2007173456A (ja) | 積層型圧電バイモルフ素子およびその製造方法 | |
| JPS63153870A (ja) | 電歪効果素子 | |
| JP6240775B2 (ja) | 外部接続部を有する多層デバイス、および外部接続部を有する多層デバイスを製造するための方法 | |
| JP2019523545A (ja) | 多層素子及び多層素子を製造するための方法 | |
| JP7602637B2 (ja) | 積層セラミック電子部品およびその製造方法 | |
| JP2010199271A (ja) | 積層型圧電素子およびその製法ならびに振動体 | |
| US7233099B2 (en) | Multilayer piezoelectric element | |
| JP4349820B2 (ja) | 積層型電子部品の製法 | |
| JP4659368B2 (ja) | 積層型電子部品の製法 | |
| JPH06164143A (ja) | 多層ハイブリッド回路の製造方法 | |
| JPH03129786A (ja) | 積層型電歪体 | |
| JP2007019420A (ja) | 積層型圧電素子 | |
| JP2010199272A (ja) | 積層型圧電素子およびその製法ならびに振動体 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060921 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060921 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080829 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20080829 |
|
| A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20080917 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081111 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090113 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090210 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090217 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4266886 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120227 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130227 Year of fee payment: 4 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130227 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140227 Year of fee payment: 5 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |