JP4266886B2 - セラミック素子とその製造方法 - Google Patents
セラミック素子とその製造方法 Download PDFInfo
- Publication number
- JP4266886B2 JP4266886B2 JP2004182505A JP2004182505A JP4266886B2 JP 4266886 B2 JP4266886 B2 JP 4266886B2 JP 2004182505 A JP2004182505 A JP 2004182505A JP 2004182505 A JP2004182505 A JP 2004182505A JP 4266886 B2 JP4266886 B2 JP 4266886B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- hole
- powder
- electrode
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/03—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Resistance Heating (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Coils Or Transformers For Communication (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004182505A JP4266886B2 (ja) | 2004-06-21 | 2004-06-21 | セラミック素子とその製造方法 |
| PCT/JP2005/012255 WO2005122701A2 (ja) | 2004-06-21 | 2005-06-21 | 電極内蔵セラミックブロック及びその製造方法 |
| US10/590,360 US7825355B2 (en) | 2004-06-21 | 2005-06-21 | Ceramic block with built in electrode and method of manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004182505A JP4266886B2 (ja) | 2004-06-21 | 2004-06-21 | セラミック素子とその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006005295A JP2006005295A (ja) | 2006-01-05 |
| JP2006005295A5 JP2006005295A5 (enExample) | 2008-10-16 |
| JP4266886B2 true JP4266886B2 (ja) | 2009-05-20 |
Family
ID=35510188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004182505A Expired - Fee Related JP4266886B2 (ja) | 2004-06-21 | 2004-06-21 | セラミック素子とその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7825355B2 (enExample) |
| JP (1) | JP4266886B2 (enExample) |
| WO (1) | WO2005122701A2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9281226B2 (en) * | 2012-04-26 | 2016-03-08 | Applied Materials, Inc. | Electrostatic chuck having reduced power loss |
| JP6194526B2 (ja) * | 2013-06-05 | 2017-09-13 | 高周波熱錬株式会社 | 板状ワークの加熱方法及び加熱装置並びにホットプレス成形方法 |
| US20240225108A1 (en) * | 2022-05-30 | 2024-07-11 | Shenzhen Huachengda Precision Industry Co. Ltd. | Atomizer and atomizing assembly |
| JPWO2024058183A1 (enExample) * | 2022-09-14 | 2024-03-21 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0697677B2 (ja) | 1987-04-21 | 1994-11-30 | 東陶機器株式会社 | 静電チャック基盤の製造方法 |
| JP3771686B2 (ja) | 1997-08-29 | 2006-04-26 | 京セラ株式会社 | ウエハ支持部材 |
| JP2000106391A (ja) * | 1998-07-28 | 2000-04-11 | Ngk Insulators Ltd | 半導体支持装置、その製造方法、接合体の製造方法および接合体 |
| WO2001062686A1 (en) * | 2000-02-24 | 2001-08-30 | Ibiden Co., Ltd. | Aluminum nitride sintered compact, ceramic substrate, ceramic heater and electrostatic chuck |
| JP2004168658A (ja) | 2000-02-24 | 2004-06-17 | Ibiden Co Ltd | 半導体製造・検査装置用セラミック基板 |
| JP4485010B2 (ja) | 2000-04-17 | 2010-06-16 | 日本特殊陶業株式会社 | セラミック素子と電極の組立体 |
| JP4502462B2 (ja) | 2000-05-31 | 2010-07-14 | 京セラ株式会社 | ウエハ支持部材及びその製造方法 |
| JP4439108B2 (ja) * | 2000-10-31 | 2010-03-24 | 京セラ株式会社 | ウエハ支持部材 |
| JP3993408B2 (ja) | 2001-10-05 | 2007-10-17 | 株式会社巴川製紙所 | 静電チャック装置、その組立方法および静電チャック装置用部材 |
-
2004
- 2004-06-21 JP JP2004182505A patent/JP4266886B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-21 WO PCT/JP2005/012255 patent/WO2005122701A2/ja not_active Ceased
- 2005-06-21 US US10/590,360 patent/US7825355B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006005295A (ja) | 2006-01-05 |
| WO2005122701A3 (ja) | 2006-02-16 |
| US7825355B2 (en) | 2010-11-02 |
| US20070286985A1 (en) | 2007-12-13 |
| WO2005122701A2 (ja) | 2005-12-29 |
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