JP6240775B2 - 外部接続部を有する多層デバイス、および外部接続部を有する多層デバイスを製造するための方法 - Google Patents
外部接続部を有する多層デバイス、および外部接続部を有する多層デバイスを製造するための方法 Download PDFInfo
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- JP6240775B2 JP6240775B2 JP2016533865A JP2016533865A JP6240775B2 JP 6240775 B2 JP6240775 B2 JP 6240775B2 JP 2016533865 A JP2016533865 A JP 2016533865A JP 2016533865 A JP2016533865 A JP 2016533865A JP 6240775 B2 JP6240775 B2 JP 6240775B2
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- 238000000034 method Methods 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 39
- 239000002184 metal Substances 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 26
- 238000005245 sintering Methods 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 239000002923 metal particle Substances 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 claims description 4
- ZXSQEZNORDWBGZ-UHFFFAOYSA-N 1,3-dihydropyrrolo[2,3-b]pyridin-2-one Chemical compound C1=CN=C2NC(=O)CC2=C1 ZXSQEZNORDWBGZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 229910001958 silver carbonate Inorganic materials 0.000 claims description 3
- LKZMBDSASOBTPN-UHFFFAOYSA-L silver carbonate Substances [Ag].[O-]C([O-])=O LKZMBDSASOBTPN-UHFFFAOYSA-L 0.000 claims description 3
- 230000001413 cellular effect Effects 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 210000003739 neck Anatomy 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Ceramic Capacitors (AREA)
- Micromachines (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Contacts (AREA)
Description
2 : 基体
3 : コンタクト層
4 : 接続部材
5a: 内部電極層
5b: 内部電極層
6 : 圧電層
7 : 絶縁ゾーン
8 : ベースメタライジング部
9 : 外部接続部
Claims (15)
- 基体(2)と外部接続部(9)とを備えた多層デバイス(1)であって、
前記外部接続部は、接続部材(4)とコンタクト層(3)とを備え、
前記コンタクト層(3)は、前記基体(2)を前記接続部材(4)と電気的に導通して結合しており、
前記基体(2)と前記接続部材(4)との間の結合は、前記コンタクト層(3)の焼結によって生成されており、
前記コンタクト層(3)は、金属粒子および炭酸銀を含む金属ペーストから、固い多孔性の純粋金属として形成されている、
ことを特徴とする多層デバイス。 - 前記焼結の温度は、400℃より低いことを特徴とする、請求項1に記載の多層デバイス。
- コンタクト層(3)は、多孔質であることを特徴とする、請求項1または2に記載の多層デバイス。
- 前記コンタクト層(3)の多孔率は1容量%〜50容量%であることを特徴とする、請求項3に記載の多層デバイス。
- 前記コンタクト層(3)は、金属を含むことを特徴とする、請求項1乃至4のいずれか1項に記載の多層デバイス。
- 前記コンタクト層(3)は銀または銅を含むことを特徴とする、請求項1乃至5のいずれか1項に記載の多層デバイス。
- 前記コンタクト層(3)は、少なくとも95%の純度の材料から成っていることを特徴とする、請求項1乃至6のいずれか1項に記載の多層デバイス。
- 前記コンタクト層(3)の厚さは、2μm〜200μmであることを特徴とする、請求項1乃至7のいずれか1項に記載の多層デバイス。
- 前記コンタクト層(3)は、400℃を越える融点を備えることを特徴とする、請求項1乃至8のいずれか1項に記載の多層デバイス。
- 前記基体(2)と前記コンタクト層(3)との間に1つのベースメタライジング部(8)が取り付けられていることを特徴とする、請求項1乃至9のいずれか1項に記載の多層デバイス。
- 前記接続部材(4)は、蛇行,櫛状,金属板,ワイヤメッシュ,ワイヤ編み,導電体,または波状金属板の形態を有することを特徴とする、請求項1乃至10のいずれか1項に記載の多層デバイス。
- 前記多層デバイス(1)は、圧電アクチュエータまたは多層コンデンサとして形成されていることを特徴とする、請求項1乃至11のいずれか1項に記載の多層デバイス。
- 多層デバイス(1)を製造するための方法であって、
A)基体(2)および接続部材(4)を準備するステップと、
B)前記基体(2)の少なくとも1つの外面上に、金属粒子および炭酸銀を含む金属ペーストを用いてコンタクト層(3)を塗布するステップと、
C)前記接続部材(4)を前記金属ペースト上に設置するステップと、
D)前記金属ペーストを焼結するステップであって、これによって前記接続部材(4)を前記基体(2)と結合する焼結ステップと、
を備え、
前記コンタクト層(3)は、前記焼結ステップによって固い多孔性の純粋金属となる、
ことを特徴とする方法。 - 前記焼結は400℃より下側の温度で行われることを特徴とする請求項13に記載の方法。
- 前記焼結ステップの際に、前記金属ペーストは多孔質のコンタクト層(3)となることを特徴とする、請求項13または14に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013108753.1 | 2013-08-13 | ||
DE102013108753.1A DE102013108753A1 (de) | 2013-08-13 | 2013-08-13 | Vielschichtbauelement mit einer Außenkontaktierung und Verfahren zur Herstellung eines Vielschichtbauelements mit einer Außenkontaktierung |
PCT/EP2014/065746 WO2015022154A1 (de) | 2013-08-13 | 2014-07-22 | VIELSCHICHTBAUELEMENT MIT EINER AUßENKONTAKTIERUNG UND VERFAHREN ZUR HERSTELLUNG EINES VIELSCHICHTBAUELEMENTS MIT EINER AUßENKONTAKTIERUNG |
Publications (2)
Publication Number | Publication Date |
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JP2016529721A JP2016529721A (ja) | 2016-09-23 |
JP6240775B2 true JP6240775B2 (ja) | 2017-11-29 |
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JP2016533865A Active JP6240775B2 (ja) | 2013-08-13 | 2014-07-22 | 外部接続部を有する多層デバイス、および外部接続部を有する多層デバイスを製造するための方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10074794B2 (ja) |
EP (1) | EP3033756B1 (ja) |
JP (1) | JP6240775B2 (ja) |
CN (1) | CN105431917B (ja) |
DE (1) | DE102013108753A1 (ja) |
WO (1) | WO2015022154A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102015102866B4 (de) | 2015-02-27 | 2023-02-02 | Tdk Electronics Ag | Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements |
DE102020118857B4 (de) | 2020-07-16 | 2023-10-26 | Tdk Electronics Ag | Vielschichtkondensator |
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US4559279A (en) * | 1983-06-30 | 1985-12-17 | Matsushita Electric Industrial Co., Ltd. | Electrode on heat-resisting and isolating substrate |
DE19928189A1 (de) * | 1999-06-19 | 2001-04-19 | Bosch Gmbh Robert | Piezoaktor |
JP3964184B2 (ja) * | 2000-12-28 | 2007-08-22 | 株式会社デンソー | 積層型圧電アクチュエータ |
EP2012374B1 (en) | 2003-09-24 | 2012-04-25 | Kyocera Corporation | Multi-layer piezoelectric element |
JP4808915B2 (ja) | 2003-09-24 | 2011-11-02 | 京セラ株式会社 | 積層型圧電素子及び噴射装置 |
DE102004002484A1 (de) * | 2004-01-17 | 2005-08-11 | Robert Bosch Gmbh | Piezoaktor mit einer elektrisch leitfähigen Kontaktfahne |
WO2005086247A1 (ja) | 2004-03-09 | 2005-09-15 | Kyocera Corporation | 積層型圧電素子とその製造方法 |
JP2006013437A (ja) | 2004-05-27 | 2006-01-12 | Kyocera Corp | 積層型圧電素子およびその製造方法ならびにこれを用いた噴射装置 |
US7385337B2 (en) * | 2004-06-18 | 2008-06-10 | Tdk Corporation | Multilayer piezoelectric element |
CN100587989C (zh) * | 2004-06-24 | 2010-02-03 | 京瓷株式会社 | 叠层型电子部件及使用其的喷射装置 |
WO2006001334A1 (ja) * | 2004-06-24 | 2006-01-05 | Kyocera Corporation | 積層型電子部品及びこれを用いた噴射装置 |
JP4693397B2 (ja) | 2004-11-26 | 2011-06-01 | 京セラ株式会社 | 薄膜バルク音響波共振子およびフィルタならびに通信装置 |
DE102005017108A1 (de) * | 2005-01-26 | 2006-07-27 | Epcos Ag | Piezoelektrisches Bauelement |
JP2006303044A (ja) * | 2005-04-18 | 2006-11-02 | Denso Corp | 積層型圧電体素子 |
DE102005027364A1 (de) * | 2005-06-14 | 2006-12-21 | Robert Bosch Gmbh | Piezoaktor |
DE102006018034A1 (de) * | 2006-04-19 | 2007-10-31 | Robert Bosch Gmbh | Piezoaktor und Verfahren zu dessen Herstellung |
DE102007046901A1 (de) * | 2007-09-28 | 2009-04-09 | W.C. Heraeus Gmbh | Verfahren und Paste zur Kontaktierung von Metallflächen |
DE102007049145A1 (de) * | 2007-10-12 | 2009-04-16 | Robert Bosch Gmbh | Piezoaktor und Verfahren zu dessen Herstellung |
JP4685145B2 (ja) | 2008-09-10 | 2011-05-18 | ニホンハンダ株式会社 | 金属製部材接合体の製造方法および金属製部材接合体 |
DE102008056746A1 (de) | 2008-11-11 | 2010-05-12 | Epcos Ag | Piezoaktor in Vielschichtbauweise und Verfahren zur Befestigung einer Außenelektrode bei einem Piezoaktor |
JP2010123647A (ja) * | 2008-11-18 | 2010-06-03 | Panasonic Corp | セラミックス電子部品、及びこれを用いた電子機器 |
DE102008055144A1 (de) * | 2008-12-23 | 2010-07-01 | Robert Bosch Gmbh | Piezoaktor, Kraftstoff-Injetor mit Piezoaktor sowie Verfahren zum Herstellen eines Piezoaktors |
WO2010137618A1 (ja) * | 2009-05-26 | 2010-12-02 | 京セラ株式会社 | 積層型圧電素子およびこれを用いた噴射装置ならびに燃料噴射システム |
DE102010022925B4 (de) * | 2010-06-07 | 2019-03-07 | Tdk Electronics Ag | Piezoelektrisches Vielschichtbauelement und Verfahren zur Ausbildung einer Außenelektrode bei einem piezoelektrischen Vielschichtbauelement |
DE102010044326A1 (de) * | 2010-09-03 | 2012-03-08 | Heraeus Materials Technology Gmbh & Co. Kg | Verwendung von aliphatischen Kohlenwasserstoffen und Paraffinen als Lösemittel in Silbersinterpasten |
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DE102015120640A1 (de) * | 2015-11-27 | 2017-06-01 | Epcos Ag | Vielschichtbauelement und Verfahren zur Herstellung eines Vielschichtbauelements |
-
2013
- 2013-08-13 DE DE102013108753.1A patent/DE102013108753A1/de not_active Ceased
-
2014
- 2014-07-22 WO PCT/EP2014/065746 patent/WO2015022154A1/de active Application Filing
- 2014-07-22 EP EP14741642.4A patent/EP3033756B1/de active Active
- 2014-07-22 CN CN201480045341.9A patent/CN105431917B/zh active Active
- 2014-07-22 US US14/907,800 patent/US10074794B2/en not_active Expired - Fee Related
- 2014-07-22 JP JP2016533865A patent/JP6240775B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2016529721A (ja) | 2016-09-23 |
US20160190424A1 (en) | 2016-06-30 |
CN105431917A (zh) | 2016-03-23 |
US10074794B2 (en) | 2018-09-11 |
EP3033756B1 (de) | 2018-08-29 |
CN105431917B (zh) | 2019-01-01 |
DE102013108753A1 (de) | 2015-02-19 |
WO2015022154A1 (de) | 2015-02-19 |
EP3033756A1 (de) | 2016-06-22 |
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