WO2005106912A1 - プラズマディスプレイパネルの蛍光体層の形成方法およびプラズマディスプレイパネルの製造方法 - Google Patents
プラズマディスプレイパネルの蛍光体層の形成方法およびプラズマディスプレイパネルの製造方法 Download PDFInfo
- Publication number
- WO2005106912A1 WO2005106912A1 PCT/JP2005/007474 JP2005007474W WO2005106912A1 WO 2005106912 A1 WO2005106912 A1 WO 2005106912A1 JP 2005007474 W JP2005007474 W JP 2005007474W WO 2005106912 A1 WO2005106912 A1 WO 2005106912A1
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- WO
- WIPO (PCT)
- Prior art keywords
- mask
- phosphor
- phosphor material
- plasma display
- display panel
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
- H01J11/42—Fluorescent layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
- H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
- H01J9/22—Applying luminescent coatings
- H01J9/227—Applying luminescent coatings with luminescent material discontinuously arranged, e.g. in dots or lines
Definitions
- the present application relates to a method for forming a phosphor layer of a plasma display panel used for a display device such as a display, and a method for manufacturing a plasma display panel.
- a plasma display panel As a panel used for a display device such as a display, a plasma display panel has been developed.
- This plasma display panel usually has a front plate in which a transparent electrode, a bus electrode, a black stripe, a transparent dielectric layer and a protective film are formed at predetermined positions on a front substrate, and an address electrode, A dielectric layer, partition walls (generally also called ribs), and a back plate on which a phosphor layer is formed at a predetermined position are bonded together so that each substrate is on the outside, and gas is sealed.
- a front plate in which a transparent electrode, a bus electrode, a black stripe, a transparent dielectric layer and a protective film are formed at predetermined positions on a front substrate, and an address electrode, A dielectric layer, partition walls (generally also called ribs), and a back plate on which a phosphor layer is formed at a predetermined position are bonded together so that each substrate is on the outside, and gas is sealed.
- the rear substrate of the plasma display panel has a configuration in which partitions are arranged in parallel on the rear substrate, and pixels formed of phosphor layers of three colors of RGB (red, green, blue) are provided between the partitions.
- the phosphor layer serving as a pixel is formed by applying a phosphor paste, which is also a mixed liquid force of a phosphor, a binder, and a solvent, between screens by screen printing. It is. Normally, a screen printing step and a drying step of the solvent of the phosphor paste are performed for one color in order to separately apply three colors of RGB of pixels, and this is repeated three times.
- Patent Document 1 JP-A-5-299019
- the squeegee is moved to insert the phosphor paste from the opening corresponding to the phosphor layer of the screen mask. And unnecessary phosphor paste is removed. At this time, the movement of the squeegee exerts pressure on the screen mask, and withstands this pressure.
- the opening of the screen mask has a structure having a mesh. Depending on the position and roughness of the mesh with respect to the pixels of the plasma display panel, the amount of the phosphor paste to be inserted, that is, the amount of the phosphor, varies, so that the image quality of the image displayed by the manufactured plasma display panel is high. Is disadvantageously reduced.
- An object of the present invention is to provide a method for forming a phosphor layer and a method for manufacturing a plasma display panel.
- the invention according to claim 1 is directed to a configuration in which two substrates are arranged to face each other with a plurality of partitions interposed therebetween, and are divided by each partition provided on one substrate.
- the invention according to claim 13 is directed to an invention in which two substrates are arranged to face each other via a plurality of partition walls, and are partitioned by respective partition walls provided on one of the substrates.
- FIGS. 1 (a) to 1 (g) are process diagrams showing a process of forming a phosphor layer of the plasma display panel of the present embodiment.
- FIGS. 2 (a) to 2 (d) are cross-sectional views showing respective shapes of a mask used in a process of forming a phosphor layer of the plasma display panel of the present embodiment.
- FIGS. 3 (a) and 3 (b) are diagrams showing examples of a powdery phosphor material used for manufacturing the plasma display panel of the present embodiment.
- FIG. 4 (a) and FIG. 4 (b) are diagrams showing a phosphor material filling step of another embodiment.
- FIG. 5 is a schematic view showing a general structure of a plasma display panel. Explanation of symbols
- FIGS. 1 (a) to 1 (g) are process diagrams showing a process of forming a phosphor layer of the plasma display panel according to the present embodiment
- FIG. 4D is a cross-sectional view illustrating each shape of the mask used in the step of forming the phosphor layer of the plasma display panel of the present embodiment
- FIGS. 3 (a) and 3 (b) are diagrams showing examples of the phosphor material used in the production of the plasma display panel of the present embodiment.
- (b) is a diagram showing a filling step of a phosphor material of another embodiment
- FIG. 5 is a schematic diagram showing a general structure of a plasma display panel.
- the top and bottom when the back substrate 11 is on the lower side and the partition wall 12 is on the upper side are simply referred to as "up / down" as shown in each drawing of the plasma display and a part thereof.
- the method of forming the phosphor layer 151 of the plasma display panel 40 employs a back substrate 11 provided with a plurality of partition walls 12.
- a mask setting step of setting a mask 21 having an opening 221 corresponding to a position between the partition walls 12 on the upper side through the partition wall 12 (FIG. 1A).
- a phosphor material filling step in which a phosphor material 131 composed of a powder is filled in between (FIGS. 1 (b) and 1 (c))
- a mask separating step in which the mask 21 is separated from the partition walls 12
- a melting step of melting the phosphor material 131 (FIGS.
- FIG. 1 is a view showing a state where a partition wall 12 is provided.
- a mask 21 having an opening 221 corresponding to a position between the partition walls 12 is formed on the rear substrate 11 provided with the plurality of partition walls 12 through the partition wall 12. Install. At this time, the mask 21 is brought into close contact with the partition wall 12.
- the portion between the partition walls 12 is a portion corresponding to a pixel of a plasma display panel, and this portion is hereinafter also referred to as a cell.
- Each partition 12 is usually provided in parallel on the back substrate 11 at a distance corresponding to a pixel, and is also provided in a direction perpendicular to the provided partition 12. .
- a material used for a conventionally known plasma display panel is used, and the formation method of the partition wall 12 can be formed by a conventionally known method of forming the partition wall 12.
- the mask 21 has an opening 221 corresponding to a position between the partitions 12 when installed on the partitions 12.
- a metal mask is used, and as described later, a certain amount of pressure that can withstand squeegee pressure is applied so that a phosphor material that also has powder power can be filled from the opening 221 to the space between the partition walls 12. It is preferable to use a mask that can keep the shape of the.
- the opening 221 of the mask 21 does not have a mesh structure unlike a mask for screen printing, so that the filling amount of a phosphor material described later is prevented from being varied depending on pixels, and the mask 21 itself is not required.
- the mask 21 can be easily manufactured, and the life of the mask 21 itself is prolonged.
- the shape of the opening 221 of the mask 21 is such that the side in contact with the partition wall 12 is widened, and the shape of the force opening is not limited to this configuration.
- the shape of the opening 222 of the mask 21 may be perpendicular to the surface of the mask 21 that is in contact with the partition 12.
- the shape of the opening 223 of the mask 21 is expanded from the position between the thicknesses of the mask 21 toward the side in contact with the partition wall 12 and toward the side not in contact with the partition wall 12.
- the shape of the opening 224 of the mask 21 may be changed from the position between the thickness of the mask 21 and the side in contact with the partition 12 and the partition 12 as shown in FIG.
- the shape may be widened toward the side not in contact with.
- the position where the shape of the opening changes is, for example, the center of the mask 21 in the thickness direction. can do.
- the width W1 at the lower end of the opening of the mask 21 is smaller than the width W2 at the upper end of the cell (see FIG. 2 (d)).
- the mask 21 preferably has a smooth side wall of the opening 221. Further, it is preferable that the mask 21 be subjected to a surface treatment for preventing the adhesion of the phosphor material, for example, a coating with polytetrafluoroethylene. With the mask 21 and the opening 221 having such a configuration, the phosphor material filled in the cell is prevented from adhering to the mask 21, and in the mask separation step (d) described later, When the mask 21 is separated from the partition 12, no phosphor material remains on the mask 21 side, so that the amount of the phosphor material filled is prevented from varying from pixel to pixel.
- a surface treatment for preventing the adhesion of the phosphor material for example, a coating with polytetrafluoroethylene.
- the phosphor material 131 made of powder is filled between the opening 221 of the mask 21 and the partition 12.
- the phosphor material 131 made of a powder is, for example, as shown in FIG. 3A, a phosphor 135 shown by a black circle is a powder 131 coated with a resin 136 shown by a white layer.
- phosphor 135 a conventionally known material used for a pixel of a plasma display panel is used.
- a conventionally known material used for a pixel of a plasma display panel is used.
- manganese zinc orthosilicate (Zn SiO: Mn) or the like is used.
- the resins 136 and 137 those having a property of melting by heat are used, for example, acrylic resins, paraffin and the like are used. It should be noted that this resin component is finally burned off in the firing step (g) described later.
- phosphor particles 135 are covered with individual resin 136.
- the particle size of the phosphor particles 135 is not particularly limited, for example, Inn! About 10 / zm, preferably about 1/5 / ⁇ .
- a plurality of phosphor particles 135 may be coated with resin 136.
- the phosphor material 131 shown in FIG. 3 (b) is a mixture of the phosphor particles 135 and the hot-melt resin 137 at a constant ratio.
- the particle size of the phosphor particles 135 is not particularly limited, but is, for example, about lnm to 10 ⁇ m, and preferably about 1 to 5 ⁇ m.
- the particle size of the hot-melt resin 137 is not particularly limited, either. 1010 / zm, preferably about 1-5 ⁇ m.
- the particle diameters of the particles constituting the phosphor material 131 are set such that the phosphor material 141 after melting becomes equal in each cell in the melting step (e, f) described later. In addition, it is preferable to set it within a certain range.
- the phosphor material 131 has a phosphor: resin weight ratio of 3: 7 to 7: 3.
- the weight ratio between the phosphor and the resin is such that the phosphor particles 135 can move freely in the melted resins 136 and 137 in the melting step (e, f) described later.
- the weight of the phosphor 135 is smaller than the resin 136, 137! / In such a case, the phosphor layer 151 to be formed has a required thickness.
- the phosphor material 131 includes, in addition to the phosphor 135 and the resin 136 or 137, an additive for improving the fluidity of the powder and a coagulation of the powder, similarly to the toner used in electrophotography. Additives for prevention can also be added.
- the phosphor material 131 made of a powder between the opening 221 of the mask 21 and the partition 12 (in the cell), as shown in FIG.
- the material 131 is supplied, and a moving device such as the squeegee 31 is reciprocated, so that the fluorescent material enters the cell from the opening 221 of the mask 21. After dropping the phosphor material 131, the phosphor material 131 is pressed to fill the cell.
- the phosphor material 131 is forcibly filled in the cell, the filled powder is solidified (lumped), and the filling amount of the phosphor material 131 in each cell is made constant.
- the filling amount of the phosphor material 131 in each cell it is possible to make the amount of the phosphor material 141 after melting constant in the melting step (e, f) described later.
- the firing step (g) the amount of the phosphor 135 contained in the phosphor layer 151 between the cells becomes uniform, and the image quality when displaying an image using the manufactured plasma display panel is good. It becomes.
- the process is not limited to the step shown in FIG. 4
- the phosphor material 131 is supplied onto the mask 21 and the phosphor material 131 is filled with a rotating and moving device such as the rotating and moving body 32 that can rotate and move.
- the phosphor material 131 is rotated by a powder supply rotating / moving device such as a rotating body 33 having a function of supplying the phosphor material 131 (powder) filled therein. May be filled.
- an extra phosphor material 131 remaining on the mask 21 is removed using a squeegee.
- a mask separation step (d) the mask 21 is separated from the partition walls 12.
- the mask 21 is raised perpendicularly to the rear substrate 11 so that the mask 21 is separated from each partition 1 2 Separate from As described above, the phosphor material 131 is forcibly filled and solidified, and when the mask 21 is separated from the partition walls 12 and the phosphor material 131, the opening of the mask 21 is formed.
- the frictional force between the phosphor material 131 and the side surface of the opening 22 of the mask 21 causes the friction force between the phosphor material 131 and the side surface of the partition wall 12 Since the phosphor material 131 is smaller than the frictional force, the phosphor material 131 remains in a solid state between the partition walls 12 (in the cell) of the back substrate 11.
- the phosphor material 131 is melted.
- the liquid level of the melted phosphor material 141 is set to be approximately the same as the upper end of the partition 12 or slightly lower than the upper end of the partition 12. If the liquid surface of the phosphor material 141 is too low, the phosphor layer 151 cannot be formed well between the partition walls 12 (in the cell). On the other hand, if the liquid level of the phosphor material 141 is too high, the color may be mixed with the phosphor 135 of an adjacent cell, or a mask for the phosphor material 141 or 151 of another color described later may be stuck to the partition wall 12. It causes.
- the phosphor material 131 after the mask 21 is separated is raised above the respective partition walls 12 by the thickness of the mask 21, and the phosphor material 131 is heated to form a powder.
- the phosphor material 131 is changed from the phosphor material 131 to the liquid phosphor material 141, the gap force between the particles of the phosphor material 131 is increased, and the volume of the phosphor material is reduced accordingly.
- the particles of the phosphor material 131 are optimized and the filling amount of the phosphor material 131 in the cell is kept constant. Also, by controlling the thickness of the mask 21 used, the filling amount of the phosphor material 131 can be controlled.
- the heating is stopped, the phosphor material 141 is cooled to a temperature lower than the melting point of the resin 136 or 137, and the phosphor material 141 is cured.
- the molten phosphor material 141 is fired to form the phosphor layer 151.
- the resin 136 or 137 in the phosphor material 141 is burned off, and only the phosphor 135 remains in the cell. .
- a mask setting step (a) for setting the mask 21 for the phosphor material of the first color, a phosphor material filling step (b, c), a mask separating step (d) and The melting step (e) is performed, and the mask setting step (a) in which the mask 21 is set at a different position with respect to the phosphor material of each other color (a), the phosphor material filling step (b, c), the mask separating step ( d) and the melting step (e) are performed, and as shown in FIG. 1 (f), the red phosphor material 141, the green phosphor material 142, and the blue phosphor After melting the material 143, a firing step (g) is performed.
- the plasma display panel 40 has a transparent electrode 52, a bus electrode 53, a black stripe 54, a transparent dielectric layer 55, and a protective film (MgO) 56 on a front substrate 51 from above.
- Address electrodes 17, dielectric layers 18, partition walls 12, and phosphor layers 151, 152, and 153 are formed at predetermined positions on a front plate 50 formed at predetermined positions and a rear substrate 11 from below.
- the back plate 10 is manufactured by hermetically sealing and bonding the substrates 51 and 11 so that the respective substrates 51 and 11 are on the outside, and performing gas sealing and the like.
- the plasma display panel 40 excites the phosphors in the phosphor layers 151, 152, 153 by applying a current to predetermined electrodes to discharge the gas sealed in the panel, thereby emitting light. To display an image or the like.
- the above-described method of forming the phosphor layers 151, 152, and 153 is used when manufacturing the back plate 10. It should be noted that conventionally known materials and forming methods may be used for the materials and forming methods of the layers and electrodes except for the phosphor layers 151, 152, and 153.
- the configuration of the plasma display panel 40 is not limited to that shown in Fig. 5, and the arrangement of the electrodes and the partition walls is appropriately selected as needed.
- the partition walls 12 of the plasma display panel 40 of FIG. It may have a configuration like a rib.
- the method for forming the phosphor layers 151, 152, and 153 described above is used when manufacturing the back plate 10, other manufacturing methods may be used. Each step is not particularly limited.
- a method for forming the phosphor layers 151, 152, 153 of the plasma display panel 40 in which the phosphor layers 151, 152, 153 are formed while being partitioned by the respective partition walls 12 provided above comprising: A mask setting step of setting a mask 21 having an opening 221 corresponding to a position between the partition walls 12 on the substrate 11 provided with 12 through the partition wall 12 (FIG. 1A).
- the pressure applied to the mask 21 when filling the phosphor material 131 between the partition walls 12 is smaller than that in the related art, the life of the mask 21 can be extended.
- heating may be performed to the extent that the resin 136 or 137 is melted, so that the resin 136 or 137 is melted in the melting step (e, f) compared to the conventional drying step. Since the heating time is short, the entire time required for forming the phosphor layer 151, that is, the entire time required for manufacturing the plasma display panel 40 is reduced, and the manufacturing efficiency of the plasma display panel 40 is improved. I do.
- red, green, and blue phosphor materials 131 are used as the phosphor material 131, and the mask setting step (a) Sets the mask 21 at a different position for the phosphor material 131 of each color, and for the phosphor material 131 of each color, After performing the steps (b, c), the mask separating step (d), and the melting step (e, f), a firing step (g) is performed.
- a full-color plasma display panel 40 including RGB pixels can be provided.
- a printing process and a solvent drying process are repeated for each color in order to apply three colors of RGB separately.
- the phosphor layers 151, 152 153 that is, the entire time required to manufacture the plasma display panel 40 is reduced, and the manufacturing efficiency of the plasma display panel 40 is improved.
- the phosphor material 131 is a powder in which the phosphor 135 is coated with the resin 136, or It is a mixed powder comprising powder 135 and resin powder 136.
- the phosphor material 131 since the phosphor material 131 has such a specific structure, the phosphor material 131 can be filled between the partition walls 12 in the phosphor material filling step (b). is there.
- the phosphor material 131 has a phosphor 135: resin 136 or 137 weight ratio of 3: 7 to 7: 3. It is characterized by being.
- the liquid level of the phosphor material 141 after melting can be controlled to be lower than the height of the upper end of the partition 12, and in the firing step (g), the phosphor material 141 After baking 131, phosphor layers 151, 152, 153 having a required thickness can be formed between partition walls 12.
- the opening of the mask 21 has a shape 221 in which the side in contact with the partition wall 12 is widened, and is parallel to the thickness direction of the mask 21. From a position between a certain shape 222 and the thickness of the mask 21, it spreads toward the side in contact with the partition wall 12 and spreads out toward the side in contact with the partition wall 12, but is directed toward the side and parallel to the thickness direction of the mask 21. 223, or a shape 224 that is spread toward the side contacting the partition wall 12 and the side not contacting the partition wall 12 from the middle of the thickness.
- the mask 21 is easily separated from the phosphor material 131, and can be left on the rear substrate 11 and the partition wall 12 without losing the shape of the phosphor material 131. . Therefore, in the melting step (e, f), the phosphor material 131 can be satisfactorily melted, and color mixing between pixels due to the phosphor material 131 falling between the other partition walls 12 is prevented.
- the mask 21 is characterized in that the openings 211, 222, 223, and 224 have a smooth wall thickness.
- the mask 21 is characterized in that a surface treatment for preventing adhesion of the phosphor material 131 is performed.
- the mask 21 is easily separated from the phosphor material 131, and can be left on the rear substrate 11 and the partition wall 12 without losing the shape of the phosphor material 131. . Therefore, in the melting step (e, f), the phosphor material 131 can be satisfactorily melted, and color mixing between pixels due to the phosphor material 131 falling between the other partition walls 12 is prevented.
- the phosphor material filling step (b, c) is performed by using the movable bodies 31, 32, 33 to form the openings 221 and the like.
- the phosphor material 131 is pressed.
- the filled phosphor material 131 becomes a lump, the mask 21 is easily separated from the phosphor material 131 in the mask separation step (d), and the shape of the phosphor material 131 is broken. And can be left on the rear substrate 11 and the partition 12 side. Therefore, in the melting step (e, f), the phosphor material 131 can be favorably melted, and color mixing between pixels due to the phosphor material 131 falling between the other partition walls 12 is prevented.
- the moving body is a squeegee 31 or a phosphor material 131 is contained therein, and the moving body is rotated.
- the moving body 33 supplies the phosphor material 131 to the outside while also providing the phosphor material 131 to the outside. [0070] Therefore, as described above, the opening 221 and the like can be filled with the phosphor material 131 and pressed, and the filled phosphor material 131 becomes a lump.
- the mask 21 is easily separated from the light-emitting material 131, and can be left on the rear substrate 11 and the partition 12 without losing the shape of the phosphor material 131. Therefore, in the melting step (e, f), the phosphor material 131 can be satisfactorily melted, and color mixing between pixels due to the phosphor material 131 falling between the other partition walls 12 is prevented.
- the phosphor material filling step (b, c) is such that the phosphor material 131 which also has a powder force is filled between the partition walls 12. After that (FIG. 1 (b)), there is a powder removing step (FIG. 1 (c)) for removing the phosphor material 131 remaining on the mask 21.
- the two substrates 11 and 51 are arranged to face each other with the plurality of partition walls 12 therebetween.
- a mask setting step of setting a mask 21 having an opening 221 corresponding to a position between the partition walls 12 through the partition wall 12 (FIG. 1A), and a powder force between the opening 221 of the mask 21 and the partition wall 12
- a phosphor material filling step for filling the phosphor material 131 (FIGS.
- heating may be performed to the extent that the resin 136 or 137 is melted, so that the resin 136 or 137 is melted in the melting step (e, f) compared to the conventional drying step. Since the heating time is short, the entire time required for forming the phosphor layer 151, that is, the entire time required for manufacturing the plasma display panel 40 is reduced, and the manufacturing efficiency of the plasma display panel 40 is improved. I do.
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- Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
Description
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Priority Applications (1)
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JP2006512747A JP4286286B2 (ja) | 2004-04-30 | 2005-04-19 | プラズマディスプレイパネルの蛍光体層の形成方法およびプラズマディスプレイパネルの製造方法 |
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JP2004136066 | 2004-04-30 | ||
JP2004-136066 | 2004-04-30 |
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WO2005106912A1 true WO2005106912A1 (ja) | 2005-11-10 |
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PCT/JP2005/007474 WO2005106912A1 (ja) | 2004-04-30 | 2005-04-19 | プラズマディスプレイパネルの蛍光体層の形成方法およびプラズマディスプレイパネルの製造方法 |
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JP (1) | JP4286286B2 (ja) |
TW (1) | TW200601387A (ja) |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9460589B2 (en) | 2012-03-23 | 2016-10-04 | Smart Drawer Ltd. | Cash register drawer systems and methods for determining changes in the content of cash trays |
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JP2004130254A (ja) * | 2002-10-11 | 2004-04-30 | Tdk Corp | マスキング冶具および粉体塗装方法ならびにカード型電子機器 |
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2005
- 2005-04-19 WO PCT/JP2005/007474 patent/WO2005106912A1/ja active Application Filing
- 2005-04-19 JP JP2006512747A patent/JP4286286B2/ja not_active Expired - Fee Related
- 2005-04-29 TW TW094113848A patent/TW200601387A/zh unknown
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JPH03240540A (ja) * | 1990-02-20 | 1991-10-25 | Matsushita Electric Ind Co Ltd | スクリーン印刷機 |
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JPH06262106A (ja) * | 1993-03-12 | 1994-09-20 | Atsushi Kobayashi | コーティング処理を施した塗装マスク治具及びその製造方法 |
JPH10134717A (ja) * | 1996-10-29 | 1998-05-22 | Matsushita Electric Ind Co Ltd | プラズマディスプレイパネルの製造方法 |
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US9460589B2 (en) | 2012-03-23 | 2016-10-04 | Smart Drawer Ltd. | Cash register drawer systems and methods for determining changes in the content of cash trays |
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Publication number | Publication date |
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JP4286286B2 (ja) | 2009-06-24 |
JPWO2005106912A1 (ja) | 2008-07-31 |
TW200601387A (en) | 2006-01-01 |
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