WO2005091689A1 - Leiterplatte mit wenigstens einer anschlussbohrung für einen anschlussdraht bzw. -pin eines bedrahteten elektronischen bauteils - Google Patents
Leiterplatte mit wenigstens einer anschlussbohrung für einen anschlussdraht bzw. -pin eines bedrahteten elektronischen bauteils Download PDFInfo
- Publication number
- WO2005091689A1 WO2005091689A1 PCT/EP2005/051235 EP2005051235W WO2005091689A1 WO 2005091689 A1 WO2005091689 A1 WO 2005091689A1 EP 2005051235 W EP2005051235 W EP 2005051235W WO 2005091689 A1 WO2005091689 A1 WO 2005091689A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- printed circuit
- connection
- pin
- bores
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Definitions
- the invention relates to a printed circuit board with a holding device for holding wired electronic components.
- wired electronic components can be fixed on circuit boards so that they do not slip or otherwise change their position when assembling or when transporting the circuit boards with the components mounted on them to a soldering system. Similar devices are also used in order to be able to hold wired components with an unfavorable mass distribution on the printed circuit board during selective soldering.
- Wired components are to be understood here to mean all electronic components which have at least one connecting wire or a connecting pin which is inserted through or into a corresponding customary connection hole in the printed circuit board and soldered to or with a desired contact point and thus the electrical contact of the component.
- wired components can also be connector strips, connecting wires or strands, but also transformers and other active or passive electronic components.
- the simple insertion or insertion of the connecting wires or connecting pins is not sufficient to ensure secure mechanical fastening for the components during selective soldering or transport to or by an automatic soldering system ,
- wired components of the type described are previously shaken out on the bumpy or jerky conveyor belts on the way to an automatic soldering system or on the way through the automatic soldering system from the circuit board. Cases have also become known in which the said wired components in a wave soldering system were pressed out of the printed circuit board by the solder wave. Even if the components do not completely fall out of the circuit board under the specified unfavorable conditions, it can happen that they assume an undesired position on the circuit board, which can be problematic or even harmful for the soldering. If the shape of the connection bore is not matched to the cross-sectional shape of the connection pin or wire of the component under consideration, the problems described above will still arise more clear.
- the invention is therefore based on the object to provide a circuit board which has a holding device for holding the connecting wire or pins of components and thus avoids the disadvantages described above, without the components under consideration by gluing or additionally attached to the circuit board Holding elements must be attached.
- a circuit board with at least one connection hole for receiving a connecting wire or pins of an electronic component with a predetermined pin or wire cross-section, the connection hole being formed from at least two adjacent and partially overlapping holes, and wherein the two bores are placed in such a way that a constriction is formed in the interior of the connection bore, which clamps the connection wire or pin in the connection bore in a controllable manner.
- the clamping effect of the narrowing of the connection bore can be adjusted by a suitable choice of the distance between the bores and taking into account the pin or wire cross section.
- the bores have different diameters.
- the actual number of holes which form the connection hole is selected depending on the cross-sectional shape of the connection pin or wire to be received.
- the connecting bore formed from the bores is drilled through by a central, non-continuous blind hole.
- connection hole is metallized.
- the great advantage of the invention is that it can be implemented in a simple manner and does not require any unusual process steps in the production of the printed circuit board according to the invention.
- the necessary for the invention neighboring and partially penetrating holes can be drilled independently of the same side of the circuit board.
- the circuit boards can thus be drilled in a stack using a known method. It has also been shown that the desired positioning of the adjacent bores can be maintained in a reproducible manner, as can their dimensional accuracy.
- connection hole provided in a special embodiment of the invention is a further possibility of controlling the clamping effect on the connection wire or pin under consideration in the desired manner.
- Fig. 1 is a schematic plan view of a first embodiment of a circuit board according to the invention
- Fig. 2 is a schematic plan view of a second embodiment of a circuit board according to the invention.
- FIG. 3 shows a schematic top view of a third embodiment of a printed circuit board according to the invention.
- Fig. 4 is a schematic plan view of a fourth embodiment of a circuit board according to the invention.
- FIG. 5 shows a further schematic plan view of the embodiment of the printed circuit board according to FIG. 1; 6 shows a schematic sectional illustration of the printed circuit board according to FIG. 1 along a section line illustrated by VI-VI in FIG. 1; and
- FIG. 7 shows a schematic sectional illustration of a special embodiment of the printed circuit board according to FIG. 6 with an overbore of the connection bore.
- a circuit board 10 is shown, with a connection hole 12 for receiving a connecting wire or pin 14 of an electronic component, not shown here for simplification.
- the connecting wire or pin 14 has a rectangular cross section in the embodiment shown here.
- the connection hole 12 is formed from two adjacent and partially overlapping holes 16 and 18, the first hole 16 for the second hole 18 being placed in such a way that 1 inside the connection hole 12 due to the overlapping of the holes 16 , 18 webs 20 are formed, which form a constriction 22 of the clear passage through the connection bore 12.
- the connecting wire or pin 14 is clamped in a controllable manner by the webs 20 in the connecting bore 12.
- 1 illustrates the particular suitability of this embodiment of the Printed circuit board 10 with a connecting bore 12 formed from two bores 16, 18 for connecting pins or wires 14 with a rectangular cross section.
- 2 shows a second exemplary embodiment of the printed circuit board 10 according to the invention. 1, where the first and second bores 16, 18 have essentially the same diameter, in the embodiment of the printed circuit board 10 shown in FIG. 2, the connection bore 12 is formed from two bores 16, 18 which have different diameters.
- This embodiment of the printed circuit board 10 is also particularly suitable with the connection bore 12 formed from two bores 16, 18 for connection pins or wires 14 with a rectangular cross section.
- connection bore 12 is formed from three overlapping bores 16, 18, 20.
- connection bore 12 leads to three webs 20 which are particularly suitable for securely clamping a connection pin or wire 14 with a circular cross section.
- connection bore 12 is formed from four overlapping bores 16, 18, 20, 22, so that here four webs 20 form with which the connection pin or wire 14 can be securely held.
- FIG. 5 illustrates, using the example of the printed circuit board 10 according to FIG. 1, how, by changing a distance 28 between the axes of the bores 16, 18, the size of the webs 20 projecting into the connecting bore is set, which is responsible for the actual clamping effect the connecting pin or wire 14 are responsible.
- the required press-in force is also determined, which must be exerted on a component in order to press its connecting pin or wire 14 into the connecting bore 12, against the resistance of the webs 20.
- FIG. 6 For further clarification of the webs 20, a section through the printed circuit board according to FIG. 1 is shown schematically in FIG. 6, specifically along a section line designated by VI-VI in FIG. 1. You can clearly see that from the overlapping ones Boreholes 16, 18 formed connection bore 12 and the web 20 in its central region. In the lower part of FIG. 1, the representation of the two bores 16, 18 with their axes was taken up again in order to illustrate the possibilities for varying the spacing of the axes based on FIG. 5 to show.
- the connecting bore 12 formed from the two overlapping bores 16, 18 is drilled with an additional blind bore 30.
- the connection bore 12 obtained in this way is illustrated in FIG. 6 in a sectional illustration based on FIG. 6.
- the diameter of the drilled blind hole boring i30 is smaller than the diameter of the bores 16, 18 and slightly larger than the shortest distance between the tips of the webs 20 projecting into the connecting bore 12.
- a suitable choice of a depth 32 of the blind hole bored hole 30 can be one in the connection bore 12 remaining web height 34 are set so that the clamping effect exerted by the webs 20 on the connection pin or wire 14 under consideration (see FIGS. 1-4) is optimized.
- FIG. 7 a connecting bore 12 formed from two bores 16, 18 with an over-drilled blind hole bore 30 is shown, it is clear to the person skilled in the art that the over-drilled blind hole bore 30 also applies to the exemplary embodiments of printed circuit boards 10 according to FIGS. 2-4 can be used.
- the bores 16 " 18, 24, 26 or the over-drilled blind hole bore 30 are drilled from. If appropriate, these holes can also be drilled from different sides of the circuit board. If the bores 16, 18, 24, 26 forming the connection bore 12 are to be drilled from a single side of the printed circuit board 10, several printed circuit boards can be drilled together in a stack. For an over-drilled blind hole drilling, however, each of the printed circuit boards must then be machined individually.
- connection bore 12 is preferably metallized.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
- Structure Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/593,344 US20070212934A1 (en) | 2004-03-19 | 2005-03-17 | Circuit Board With At Least One Connection Bore For A Connection Wire Or Pin Of A Wired Electronic Component |
EP05733581A EP1726192A1 (de) | 2004-03-19 | 2005-03-17 | Leiterplatte mit wenigstens einer anschlussbohrung für einen anschlussdraht bzw. -pin eines bedrahteten elektronischen bauteils |
EA200601731A EA200601731A1 (ru) | 2004-03-19 | 2005-03-17 | Печатная плата по меньшей мере с одним соединительным отверстием для проволочного вывода или штырька, присоединяемого электронного элемента |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004014034A DE102004014034A1 (de) | 2004-03-19 | 2004-03-19 | Leiterplatte mit wenigstens einer Anschlußbohrung für einen Anschlußdraht bzw. -Pin eines bedrahteten elektronischen Bauteils |
DE102004014034.0 | 2004-03-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005091689A1 true WO2005091689A1 (de) | 2005-09-29 |
Family
ID=34964426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2005/051235 WO2005091689A1 (de) | 2004-03-19 | 2005-03-17 | Leiterplatte mit wenigstens einer anschlussbohrung für einen anschlussdraht bzw. -pin eines bedrahteten elektronischen bauteils |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070212934A1 (de) |
EP (1) | EP1726192A1 (de) |
CN (1) | CN1934915A (de) |
DE (1) | DE102004014034A1 (de) |
EA (1) | EA200601731A1 (de) |
WO (1) | WO2005091689A1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006013145A1 (de) * | 2004-08-03 | 2006-02-09 | Endress+Hauser Gmbh+Co. Kg | Leiterplatte mit smd-bauteilen und mindestens einem bedrahteten bauteil sowie ein verfahren zum bestücken, befestigen und elektrischen kontaktieren der bauteile |
DE102006042806A1 (de) * | 2006-09-08 | 2008-03-27 | Endress + Hauser Flowtec Ag | Opto-elektronische Vorrichtung |
EP2207244B1 (de) * | 2009-01-12 | 2014-01-15 | ERNI Electronics GmbH & Co. KG | Anordnung aus Steckverbinder und Multilayerplatine |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005058089A1 (de) * | 2005-12-05 | 2007-06-14 | Endress + Hauser Gmbh + Co. Kg | Verfahren zum Einsetzen eines Steckteils in eine durchgängige Anschlußbohrung und Herstellen einer hochfesten elektrisch leitenden Verbindung |
DE102009028349A1 (de) * | 2009-08-07 | 2011-02-24 | Endress + Hauser Gmbh + Co. Kg | Verfahren zur Herstellung von Anschlussbohrungen mit optimierten Klemmkragen |
CN102646086A (zh) * | 2011-02-18 | 2012-08-22 | 鸿富锦精密工业(深圳)有限公司 | Usb接口组件及其线路板 |
JP6680928B1 (ja) | 2019-05-10 | 2020-04-15 | 株式会社フジクラ | モード変換器及びモード変換器の製造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3049647A (en) * | 1958-09-02 | 1962-08-14 | Sylvania Electric Prod | Electrical chassis |
US5414222A (en) * | 1992-05-12 | 1995-05-09 | Lsi Logic Corporation | Multilayer IC semiconductor package |
DE19706281A1 (de) * | 1997-02-18 | 1998-08-20 | Siemens Ag | Verfahren zur Herstellung einer Ausnehmung in einer Leiterplatte eines Kommunikationsendgerätes |
US6133805A (en) * | 1996-10-31 | 2000-10-17 | The Whitaker Corporation | Isolation in multi-layer structures |
US6380491B1 (en) * | 1999-08-26 | 2002-04-30 | Lucent Technologies Inc. | Method for producing snap fit apertures for RF shield fences |
US20030136656A1 (en) * | 2002-01-23 | 2003-07-24 | Dunne John Edmund | Switch assembly employing an external customizing printed circuit board |
US20030213767A1 (en) * | 2000-09-06 | 2003-11-20 | Belke Robert Edward | Electrical circuit board and a method for making the same |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5884492A (ja) * | 1981-11-13 | 1983-05-20 | 松下電器産業株式会社 | 両面プリント基板 |
JP2737204B2 (ja) * | 1989-02-08 | 1998-04-08 | ソニー株式会社 | プリント基板 |
JPH06326462A (ja) * | 1993-03-17 | 1994-11-25 | Ibiden Co Ltd | スルーホールを有するプリント配線板の製造方法 |
JPH0969676A (ja) * | 1995-08-31 | 1997-03-11 | Matsushita Electric Ind Co Ltd | プリント基板ダルマ穴 |
JPH1041601A (ja) * | 1996-07-24 | 1998-02-13 | Fuji Facom Corp | プリント配線板とその製造方法 |
JPH1051137A (ja) * | 1996-07-30 | 1998-02-20 | Nec Toyama Ltd | プリント配線板の製造方法 |
JPH1075022A (ja) * | 1996-08-31 | 1998-03-17 | Taiyo Yuden Co Ltd | 回路基板 |
JPH11177235A (ja) * | 1997-12-08 | 1999-07-02 | Cmk Corp | プリント配線板の製造方法 |
AU2001273596A1 (en) * | 2000-06-19 | 2002-01-02 | Robinson Nugent, Inc. | Printed circuit board having inductive vias |
-
2004
- 2004-03-19 DE DE102004014034A patent/DE102004014034A1/de not_active Withdrawn
-
2005
- 2005-03-17 EP EP05733581A patent/EP1726192A1/de not_active Withdrawn
- 2005-03-17 WO PCT/EP2005/051235 patent/WO2005091689A1/de not_active Application Discontinuation
- 2005-03-17 CN CNA2005800085263A patent/CN1934915A/zh active Pending
- 2005-03-17 EA EA200601731A patent/EA200601731A1/ru unknown
- 2005-03-17 US US10/593,344 patent/US20070212934A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3049647A (en) * | 1958-09-02 | 1962-08-14 | Sylvania Electric Prod | Electrical chassis |
US5414222A (en) * | 1992-05-12 | 1995-05-09 | Lsi Logic Corporation | Multilayer IC semiconductor package |
US6133805A (en) * | 1996-10-31 | 2000-10-17 | The Whitaker Corporation | Isolation in multi-layer structures |
DE19706281A1 (de) * | 1997-02-18 | 1998-08-20 | Siemens Ag | Verfahren zur Herstellung einer Ausnehmung in einer Leiterplatte eines Kommunikationsendgerätes |
US6380491B1 (en) * | 1999-08-26 | 2002-04-30 | Lucent Technologies Inc. | Method for producing snap fit apertures for RF shield fences |
US20030213767A1 (en) * | 2000-09-06 | 2003-11-20 | Belke Robert Edward | Electrical circuit board and a method for making the same |
US20030136656A1 (en) * | 2002-01-23 | 2003-07-24 | Dunne John Edmund | Switch assembly employing an external customizing printed circuit board |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006013145A1 (de) * | 2004-08-03 | 2006-02-09 | Endress+Hauser Gmbh+Co. Kg | Leiterplatte mit smd-bauteilen und mindestens einem bedrahteten bauteil sowie ein verfahren zum bestücken, befestigen und elektrischen kontaktieren der bauteile |
DE102006042806A1 (de) * | 2006-09-08 | 2008-03-27 | Endress + Hauser Flowtec Ag | Opto-elektronische Vorrichtung |
US7956338B2 (en) | 2006-09-08 | 2011-06-07 | Endress + Hauser Flowtec Ag | Optoelectronic apparatus for transmitting digital and/or analog signals between galvanically separated circuits |
EP2207244B1 (de) * | 2009-01-12 | 2014-01-15 | ERNI Electronics GmbH & Co. KG | Anordnung aus Steckverbinder und Multilayerplatine |
Also Published As
Publication number | Publication date |
---|---|
CN1934915A (zh) | 2007-03-21 |
EP1726192A1 (de) | 2006-11-29 |
DE102004014034A1 (de) | 2005-10-06 |
EA200601731A1 (ru) | 2007-02-27 |
US20070212934A1 (en) | 2007-09-13 |
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