WO2005090070A1 - Procédé de fabrication de substrat pour carte à circuit imprimé souple - Google Patents

Procédé de fabrication de substrat pour carte à circuit imprimé souple Download PDF

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Publication number
WO2005090070A1
WO2005090070A1 PCT/JP2005/005234 JP2005005234W WO2005090070A1 WO 2005090070 A1 WO2005090070 A1 WO 2005090070A1 JP 2005005234 W JP2005005234 W JP 2005005234W WO 2005090070 A1 WO2005090070 A1 WO 2005090070A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
conductor
wiring board
flexible printed
printed wiring
Prior art date
Application number
PCT/JP2005/005234
Other languages
English (en)
Japanese (ja)
Inventor
Shuji Ogami
Masahiro Kanno
Ichiro Higasayama
Original Assignee
Nippon Steel Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co., Ltd. filed Critical Nippon Steel Chemical Co., Ltd.
Publication of WO2005090070A1 publication Critical patent/WO2005090070A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Definitions

  • the present invention relates to a method for manufacturing a substrate for a flexible printed wiring board suitable for a flexible printed board or the like as a wiring material in response to a demand for miniaturization and light weight of electronic devices, and particularly to a conductive layer and an insulating layer.
  • the present invention relates to a method for manufacturing a flexible printed wiring board substrate which has excellent adhesion to a flexible printed wiring board and has excellent reliability without warpage or dimensional change.
  • Patent Document 1 JP-A-62-212140
  • Patent Document 2 JP-A-63-84188
  • Patent Document 3 JP-A-63-245988
  • Patent Document 4 Japanese Patent Publication No. 6-49185
  • a high adhesive force is obtained between the conductor layer and the polyimide resin layer as an insulating layer, and advanced electronic components that require high functionality are required. Widely used in the field.
  • the polyimide precursor resin is imidized by heating.However, if the adhesive force between the conductor layer and the insulating layer is insufficient after the heat treatment, or if the long substrate is heat-treated, It is not possible to provide a product that satisfies the market where it is difficult to obtain flexible printed wiring board substrates of uniform quality as a product due to variations in adhesive strength.
  • An object of the present invention is to provide a flexible printed wiring board having improved adhesive strength between a conductor layer and an insulating layer after heat treatment of a polyimide precursor resin and variation in adhesive strength when a long substrate is heat-treated.
  • An object of the present invention is to provide a method for manufacturing a substrate.
  • the inventors of the present invention have conducted intensive studies on the above problems, and as a result, have heated the polyimide precursor resin.
  • the present inventors have found that a phenomenon in which the adhesive strength between the conductor layer and the insulating layer is improved by maintaining the film at a specific maximum temperature range for a certain period of time during imidation, thereby completing the present invention.
  • the present invention relates to a method for producing a substrate for a flexible printed wiring board having a single-sided insulating layer that is directly applied with a polyimide precursor resin solution on one surface of a conductor, dried, and then heat-cured.
  • the maximum temperature of the substrate is in the range of 300-400 ° C, and this temperature is maintained for 20-60 minutes.
  • the air-permeable sheet material is brought into contact with at least the resin layer side of the dried sheet-like substrate, and is wound into a cylindrical body with a companion winding to form a gas-permeable multi-layer cylinder. It is preferable that the transfer is performed in a heat-hardening furnace in a state where the body is in a state of being kept still. Curing in a heat-curing furnace is performed under reduced pressure or in an inert gas atmosphere. Curing in a heat-curing furnace is performed by radiating heating means and conducting current through the conductor of the multilayer cylinder to induce induction by the resistance of the conductor. A combination of a heating means and the like is a preferred embodiment.
  • examples of the conductor used in the present invention include metal foils having a thickness of 5 to 150 ⁇ m, such as copper, aluminum, iron, silver, palladium, nickel, chromium, molybdenum, tungsten, zinc, and alloys thereof. And is preferably copper foil.
  • copper foil there are rolled copper foil and electrolytic copper foil, but both can be used.
  • the surface may be subjected to a chemical or mechanical surface treatment such as a plating, nickel plating, copper-zinc alloy plating, or an aluminum alcoholate, an aluminum chelate, or a silane coupling agent.
  • the polyimide precursor resin is one that forms an insulating layer of a polyimide resin layer having an imide ring structure by being cured by heating to form an imide bond, and is typically a polyamic acid.
  • the polyimide resin used as the insulating layer is, for example, polyimide, polyamide imide, or polyester. Terimide and the like.
  • a low-thermal-expansion layer described in Patent Document 14 or a thermoplastic polyimide-based resin that melts or softens when heated can be used, and is not particularly limited.
  • Particularly preferred insulating layer placed the two layers of thermal expansion coefficient is made of Netsuka plastic polyimide ⁇ and below the 30 X 10- 6 (1ZK) below consisting of a low thermal expansion ⁇ layer main ⁇ layer It is desirable to use at least three polyimide resin layers.
  • the coefficient of linear expansion is determined by using a sample that has completed the imidization reaction, using a thermomechanical analyzer ( ⁇ ), raising the temperature to 250 ° C, cooling at a rate of 10 ° CZ, The average linear expansion coefficient in the range of ° C was determined.
  • a polyimide resin having a unit structure represented by the following general formula (I) is desirable.
  • thermoplastic polyimide resin used above and below the main resin layer may have any unit structure as long as its glass transition point temperature is 350 ° C or less. It is preferable that the adhesive strength at the interface of the press bonding under heat and pressure is sufficient.
  • the thermoplastic polyimide resin as used herein includes those which can be adhered by pressure so that they do not necessarily show sufficient fluidity in a normal state above the glass transition point. Specific examples of the thermoplastic polyimide resin having such properties include those having a unit structure represented by the following general formula (II) or ( ⁇ ). [0015] [Formula 2]. . ( ⁇ )
  • Ar is a divalent aromatic group having 12 or more carbon atoms.
  • divalent aromatic group Ar or Ar include, for example,
  • the polyimide precursor solution applied on the conductor used in the present invention is basically one that can be converted to the above-mentioned polyimide resin, and is a known acid anhydride-based amine-based curing agent.
  • Various additives and catalysts such as a curing agent such as a silane coupling agent, a titanate coupling agent, an adhesion imparting agent such as an epoxy conjugate, and a flexibility imparting agent such as rubber, may be added.
  • a thermoplastic polyimide resin layer is placed on the conductor, a low thermal expansion polyimide resin layer is placed on the center main layer, and a thermoplastic polyimide resin layer is placed on the outermost layer in this order. Is preferred.
  • the central main layer must be a polyimide resin layer having a lower thermal expansion than the upper and lower thermoplastic polyimide resin layers.
  • the main layer has the function of suppressing the occurrence of curl and warpage of the substrate for the flexible printed wiring board to be manufactured, and the thermoplastic polyimide layer in contact with the conductor has the function of ensuring adhesiveness to the conductor, and has the function of securing the outermost layer.
  • the thermoplastic polyimide layer is expected to have the effect of suppressing the curl of the film alone.
  • the ratio (t / t) of the total thickness t of the upper and lower thermoplastic polyimide resin layers to the thickness t of the low thermal expansion polyimide resin layer as the main layer is in the range of 2-100, Preferably
  • thermoplastic polyimide resin layer has a coefficient of thermal expansion that is too high compared to that of the conductor, and the resulting flexible printed wiring board substrate has a large amount of warpage and curl, which significantly reduces workability in circuit processing.
  • the thickness t of the thermoplastic polyimide resin layer is too small, and the thickness ratio (t Zt) exceeds 100.
  • Coating of the plurality of polyimide-based resins on the conductor is carried out in the form of a precursor solution as described in Patent Document 4 described above V, such as batch or sequential application of the plurality of precursor solutions. After coating or desolvation at the imide ring-closing temperature or lower, it is preferable to carry out the heat conversion of the precursor to polyimide as a whole. If another polyimide-based precursor solution is applied on the layer completely converted to polyimide and heat-treated to close the imide ring, the adhesion between the polyimide-based resin layers may not be sufficiently exhibited. It causes the quality of the product to deteriorate.
  • the polyimide precursor solution (polyamic acid solution) on the conductor
  • a known method using a knife coater, a die coater, a roll coater, a curtain coater, or the like can be used.
  • Die coaters and knife coaters are particularly suitable for thick coating.
  • the polymer concentration of the polyimide precursor solution used for coating is usually 5 to 30% by weight, preferably 10 to 20% by weight, depending on the degree of polymerization of the polymer. If the polymer concentration is lower than 5% by weight, a single coating will not provide a sufficient film thickness, and if it is higher than 30% by weight, the solution viscosity will be too high, resulting in poor coating.
  • any device can be used for the drying.
  • the coated conductor as described in Patent Document 4 does not come into contact with the device. It is preferable to use the one of the tag type.
  • the coated conductor is dried while running continuously in a hot air stream. Drying is usually performed at 150 ° C or less, preferably at 90-130 ° C, to remove volatiles such as solvents by drying.
  • the solvent in the polyimide precursor solution was used for the resin during application. It is desirable to remove the solvent by drying to at least 50% by weight or less, preferably 30% by weight or less, more preferably 10% by weight or less.
  • a polyimide precursor resin solution is continuously applied to the conductor on the roll, and the conductor is continuously floated in a hot air stream in the above-mentioned floating manner.
  • a roll-to-roll which winds up in a roll shape after drying while running.
  • a sheet material having air permeability such as a nonwoven fabric or a stainless steel wire mesh is brought into contact. It is wound into a cylindrical body by winding to form an air-permeable multilayered cylindrical body.
  • the multi-layered cylindrical body is appropriately moved into a heat-curing furnace, where it is allowed to stand, and the polyimide-based precursor resin layer is heat-cured.
  • the conductor is wound so that the conductor portion faces inside and the resin surface faces outside in order to alleviate the residual stress of the polyimide resin layer when the temperature is raised.
  • the reaction in an inert gas atmosphere or under a reduced pressure of 100 Torr or less in order to avoid the conductive metal foil / polyimide resin being deteriorated by oxygen. It is more preferable to carry out under the following reduced pressure. This is for the purpose of smoothly and completely removing the residual organic solvent generated from the applied resin, moisture generated during the imidization ring closure reaction, unreacted monomers, and the like. In particular, when moisture remains in the atmosphere, the resin is hydrolyzed and the polymerization degree of the resin is reduced, and as a result, the physical properties of the polyimide layer may be reduced.
  • the conductor will be oxidized, which will cause deterioration in quality.
  • a step of sufficiently performing degassing and a solvent removal it is preferable to roughly perform two steps: a step of sufficiently performing degassing and a solvent removal, and a step of completing the curing reaction. That is, first, the temperature is gradually or stepwise raised to around 150 ° C, preferably to around the boiling point of the organic solvent, and the residual solvent in the resin is sufficiently volatilized, and then gradually or stepwise to 300 or more. It is preferable to raise the temperature. More preferably, the heating rate is in the range of 0.75 to 12 ° CZmin.
  • the temperature rise rate exceeds 12 ° CZmin, the solvent is rapidly removed, and foaming may occur in the resin, which is not preferable.
  • the temperature is less than 0.75 ° CZmin, the time required to reach the maximum temperature is prolonged, and the resin is exposed to high temperatures for a long period of time, which causes deterioration of the resin.
  • the conductor of the multilayer cylinder which is left standing in the heat-hardening furnace is connected to the power supply wiring at the same time as the radiant heating means, and is energized. It is desirable to supplementally and uniformly heat the entire body. Further, when cooling to room temperature after heat curing, it is preferable to perform the cooling in an inert gas atmosphere or in a vacuum of 100 Torr or less, more preferably in a vacuum of 100 Torr or less.
  • the cooling means may be left alone, but it is preferable to use forced cooling means such as flowing cooling water in consideration of production efficiency.
  • the solvent is completely removed by the heat curing treatment, and the imide is closed with a ring.
  • the final heat treatment temperature is preferably 300-400 ° C. Above 400 ° C, thermal decomposition of polyimide begins to occur gradually, and below 300 ° C, the polyimide film becomes conductive metal foil. A single-sided conductor laminate having good planarity and excellent adhesion cannot be obtained because of insufficient orientation.
  • the time for maintaining the final heat treatment temperature is preferably 20 to 60 minutes.
  • the polyimide resin that is in contact with the conductor is appropriately melted and adheres well to the conductor surface, and the oxygen that is slightly present in the atmosphere due to heating or the oxygen atom contained in the polyimide resin is heated. And the conductor reacts with the polyimide resin and the conductor surface. It is presumed that a chemical bond is formed to increase the adhesive strength. If the holding time is less than 20 minutes, the polyimide resin will not flow due to sufficient melting at the contact surface with the conductive metal foil, and the chemical reaction of imidization will not proceed sufficiently to obtain the desired adhesive strength. This may not be possible, which is not desirable.
  • the heat-cured roll formed in this way is cooled and then rewound by a roll wrapping machine similar to that before the heat-curing, whereby the sheet material is rolled into a separated roll.
  • the overall thickness of the formed polyimide resin layer as an insulating layer is usually 10 to 150 ⁇ m.
  • the dimensional change, the curl and adhesive force of a single-sided copper-clad product, and the curl of a film were measured by the following methods.
  • the dimensional change rate is 4 points of intersection of a 25mm line from each side of a 250mm square sample, and the center force of each side is also 1 point at each 25mm position with respect to the opposite side. Then, the dimensional change before and after removing the copper foil was calculated by actual measurement.
  • the adhesive strength of a single-sided copper-clad product is as follows in accordance with JIS C5016: 7.1, using a pattern with a conductor width of 3mm and peeling the copper foil in the direction of 180 ° at a speed of 50mmZ. It was obtained as a value.
  • the curl of a single-sided copper-clad product is as follows: after placing a 50 mm square sample in an environment of 23 ° C and 50% humidity for 24 hours, place the copper foil on the horizontal surface with The swelling was measured with a caliper.
  • the film curl is obtained by removing copper foil from a 50 mm square single-sided copper-clad product with an aqueous ferric chloride solution, washing and drying the film, and leaving the film at 23 ° C and a humidity of 50% for 24 hours.
  • the copper foil was placed on the horizontal surface with the side facing down, the peripheral warpage or the central bulge was measured with a caliper.
  • a polyimide precursor solution was prepared in the same manner as in Synthesis Example 1, except that 1 mol of DDE was used as the diamine component and 1 mol of BTDA was used as the acid anhydride component.
  • the obtained polyimide precursor solution had a polymer concentration of 15% by weight and an apparent viscosity of 300 mPa ⁇ s at 25 ° C. by a B-type viscometer.
  • the polyimide precursor solution of Synthesis Example 2 was coated on a roughened surface of a 35 ⁇ m thick conductor (electrolytic copper foil) having a roughened surface and a glossy surface so that the thickness became 15 m, and 130 ° C. For 12 minutes, further apply the polyimide precursor solution of Synthesis Example 1 to 200 m, dry at 130 ° C, and further reduce the polyimide precursor solution of Synthesis Example 2 to 20 ⁇ m And dried at 130 ° C. to obtain a radial sheet-shaped substrate which is a rolled copper-clad product comprising a polyimide resin in which the solvent has volatilized and a copper foil. At this time, the residual amount of the solvent in the resin was 0.78% by weight, and the resin was dried to a degree and tackiness was not recognized.
  • the substrate for a flexible printed wiring board thus obtained had excellent appearance without any curl or scratches such as rubbing or unevenness on the conductor surface. Its adhesive force is 2. OkgZcm, heat shrinkage is 0.05%, the coefficient of linear expansion is 11 X 10- 6 (1ZK), any of the abnormalities, such observed ChikaraTsuta the soldering heat resistance test. Further, there was no oxidization on the glossy surface of the copper foil, and a desired circuit pattern could be easily formed.
  • Example 2 A test was conducted in exactly the same manner as in Example 1 except that the final holding temperature was changed to 260 ° C.
  • the adhesive strength of the obtained flexible printed wiring board was 0.5 kgZcm, the rate is 0.3% 0.1, and the coefficient of linear thermal expansion is 45 X 10- 6 (1ZK), location was peeled at the interface between the copper foil and ⁇ in solder heat resistance test occurred many.
  • Example 2 A test was performed in exactly the same manner as in Example 1 except that the final holding temperature was changed to 450 ° C.
  • the adhesive strength of the obtained flexible printed wiring board was 0.5 kgZcm, the rate is 0.3% 0.1, and the coefficient of linear thermal expansion is 45 X 10- 6 (1ZK), location was peeled at the interface between the copper foil and ⁇ in solder heat resistance test occurred many.
  • Example 2 A test was performed in exactly the same manner as in Example 1 except that the final holding time was set to 10 minutes and the final holding temperature was set to 260 ° C.
  • the adhesive strength of the obtained flexible printed wiring board was 0.4 kgZcm.
  • the heat shrinkage rate was 0.05% 0.
  • linear expansion coefficient of 36 X 10 - is a 6 (1 zk)
  • interface peeled portion are numerous onset raw copper foil and ⁇ in soldering heat resistance test did.
  • the method for manufacturing a substrate for a flexible printed wiring board according to the present invention is characterized in that the adhesive strength between the conductor layer and the insulating layer after the heat treatment of the polyimide precursor resin and the adhesive strength when the long substrate is heat-treated are reduced. An improved substrate with high industrial applicability is obtained.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

La présente invention entend améliorer l’adhérence entre une couche conductrice et une couche isolante après traitement thermique d’une résine précurseur polyimide, et améliorer les variations d’adhérence lorsque l’on soumet un long substrat à un traitement thermique. Il est prévu spécifiquement un procédé de fabrication de substrat pour cartes à circuit imprimé souples ayant une couche isolante d’un côté, dans lequel on applique directement une résine précurseur polyimide sur une surface de conducteur, avant de passer à la vulcanisation par cuisson, après un cycle de séchage. Ce procédé est caractérisé en ce que la température la plus élevée pendant la polymérisation thermique est dans la fourchette allant de 300°C à 400°C, et la température de chauffage est maintenue dans cette fourchette 20 à 60 minutes.
PCT/JP2005/005234 2004-03-24 2005-03-23 Procédé de fabrication de substrat pour carte à circuit imprimé souple WO2005090070A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-087162 2004-03-24
JP2004087162A JP4360956B2 (ja) 2004-03-24 2004-03-24 フレキシブルプリント配線板用基板の製造方法

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Publication Number Publication Date
WO2005090070A1 true WO2005090070A1 (fr) 2005-09-29

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JP (1) JP4360956B2 (fr)
TW (1) TW200537996A (fr)
WO (1) WO2005090070A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101965228A (zh) * 2008-02-29 2011-02-02 株式会社康井精机 复合材料板的制造装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4684601B2 (ja) * 2004-08-26 2011-05-18 新日鐵化学株式会社 フレキシブル積層基板の製造法
JP4790582B2 (ja) * 2006-12-12 2011-10-12 新日鐵化学株式会社 高屈曲性フレキシブル銅張積層板の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60157286A (ja) * 1984-01-27 1985-08-17 株式会社日立製作所 フレキシブルプリント基板の製造方法
JPS63161023A (ja) * 1986-12-25 1988-07-04 Sumitomo Bakelite Co Ltd フレキシブルプリント回路用基板の製造方法
JPH05175634A (ja) * 1991-12-11 1993-07-13 Nippon Steel Chem Co Ltd フレキシブルプリント配線用基板の製造方法
JPH10138318A (ja) * 1996-09-13 1998-05-26 Ube Ind Ltd 多層押出しポリイミドフィルムの製法
JP2002240195A (ja) * 2001-02-19 2002-08-28 Ube Ind Ltd ポリイミド銅張板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60157286A (ja) * 1984-01-27 1985-08-17 株式会社日立製作所 フレキシブルプリント基板の製造方法
JPS63161023A (ja) * 1986-12-25 1988-07-04 Sumitomo Bakelite Co Ltd フレキシブルプリント回路用基板の製造方法
JPH05175634A (ja) * 1991-12-11 1993-07-13 Nippon Steel Chem Co Ltd フレキシブルプリント配線用基板の製造方法
JPH10138318A (ja) * 1996-09-13 1998-05-26 Ube Ind Ltd 多層押出しポリイミドフィルムの製法
JP2002240195A (ja) * 2001-02-19 2002-08-28 Ube Ind Ltd ポリイミド銅張板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101965228A (zh) * 2008-02-29 2011-02-02 株式会社康井精机 复合材料板的制造装置
CN101965228B (zh) * 2008-02-29 2013-10-16 株式会社康井精机 复合材料板的制造装置

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TW200537996A (en) 2005-11-16
TWI360373B (fr) 2012-03-11
JP4360956B2 (ja) 2009-11-11
JP2005271374A (ja) 2005-10-06

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