WO2005085492A1

WO2005085492A1 - Film forming equipment and film forming method

Info

Publication number: WO2005085492A1
Application number: PCT/JP2005/003171
Authority: WO
Inventors: Hisato Tanaka
Original assignee: Ulvac, Inc.
Priority date: 2004-03-04
Filing date: 2005-02-25
Publication date: 2005-09-15
Also published as: JP4549697B2; JP2005248249A

Abstract

Film forming equipment and a film forming method, by which a film forming process can be performed immediately after aligning a substrate with a mask, a substrate transfer system between different types of chambers is eliminated and a film can be continuously formed. In a same vacuum chamber (2), an alignment unit (3) for aligning the substrate (5) with the mask (6), a transfer tray (4) for receiving the substrate (5) and the mask (6) from the alignment unit (3), and a plurality of film forming sources (81A)-(81F) which are arranged along a transfer path of the transfer tray (4) are provided. To transfer the substrate (5) and the mask (6) between the alignment unit (3) and the transfer tray (4), a magnet holder (61) is separated from a magnet lifting mechanism (12) through a locking part (67).

Description

Film forming apparatus and film forming method

Technical field

The present invention relates to a film forming apparatus and a film forming method for forming a film after aligning a substrate and a mask in the same vacuum chamber.

Background art

[0002] In a film forming apparatus that forms a film by overlapping a mask on a substrate, an alignment technique for aligning the substrate and the mask with high precision is important. For example, in the manufacture of an organic EL (Electro Luminescence) display device using an organic thin film, when forming three types of organic thin films that generate light of the three primary colors on the same substrate, a predetermined mask pattern (opening) is required. The mask on which is formed) is positioned with high precision on the film forming surface of the substrate, and a predetermined film forming process such as vapor deposition or sputtering is performed.

[0003] By the way, conventionally, in a film forming apparatus used for manufacturing an organic EL display device, a metal mask made of a magnetic material is used as a mask, and after a substrate is positioned on the mask, By placing a magnet on the substrate and sandwiching the substrate between the magnet and the mask, the aligned state of the substrate and the mask aligned with each other is maintained (see Patent Documents 1 and 2 below).

In a conventional film forming apparatus, an alignment chamber for aligning a substrate and a mask and a film forming chamber are formed in separate chambers. For example, when transferring a (mask) or forming a multilayer film, the substrate was unloaded Z from one deposition chamber to the other deposition chamber (see Patent Document 2 below).

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2001-358202

Patent Document 2: JP 2002-367781 A

Disclosure of the invention

Problems to be solved by the invention

[0006] In a conventional film forming apparatus, since the alignment chamber and the film forming chamber are composed of different chambers as described above, the transfer system for the substrate between these chambers may be used. Since a stem is required, a rapid film formation process after the alignment cannot be performed, and there is a problem that productivity is poor.

[0007] Further, in the conventional film forming apparatus, when a multilayer film is formed, it is necessary to transfer the substrate over a plurality of film forming chambers. In this case, a substrate transfer system between different types of chambers is indispensable. As a result, there is a problem that the device configuration becomes complicated and productivity is reduced.

[0008] The present invention has been made in view of the above-described problems, and enables a film forming process to be performed quickly after alignment of a substrate and a mask, and eliminates the need for a substrate transfer system between different types of chambers, and is also applicable to continuous film forming. It is an object to provide a film forming apparatus and a film forming method that can be used.

Means for solving the problem

[0009] The above-mentioned problems are caused by an alignment unit for aligning a substrate and a mask in the same vacuum chamber, a transfer tray for receiving the substrate and the mask from the alignment unit, and a transfer tray for the transfer unit. And a film forming means arranged along the transfer path.

[0010] Further, the above problem is caused by an alignment step of aligning a substrate and a mask by an alignment unit in the same vacuum chamber, and transferring the substrate and the mask from the alignment unit to a transfer tray. The problem is solved by a film forming method comprising a transfer step and a film forming step of forming a film on a film forming surface of the substrate while transferring the transfer tray along a transfer path.

According to the present invention, an alignment unit for aligning a substrate and a mask in the same vacuum chamber, a transfer tray for receiving the substrate and the mask from the alignment unit, The substrate transported into the vacuum chamber is transferred to a transport tray after alignment with a mask because the film transport means is provided along the transport path of the tray. In the transfer process by the tray, it becomes possible to form a film on the substrate film formation surface via a mask. As a result, a rapid film forming process can be performed after the alignment of the substrate, so that the productivity can be improved while eliminating the need for a complicated substrate transfer system between different types of chambers.

[0012] Further, a plurality of evaporation sources / sputtering targets or other film forming means may be arranged in the film forming chamber. Thereby, continuous film formation of the substrate becomes possible, and it is possible to cope with formation of a multilayer film.

The invention's effect

[0013] As described above, according to the present invention, after the alignment between the substrate and the mask, the process can be continuously shifted to the film formation process, so that the productivity can be improved and the single vacuum chamber can be used. In addition, an alignment process and a film forming process of the substrate can be realized, and it is possible to sufficiently cope with multilayer film formation.

Brief Description of Drawings

FIG. 1 is a schematic configuration diagram of a film forming apparatus 1 according to an embodiment of the present invention.

FIG. 2 is a front sectional view showing a main part of the alignment unit 3.

FIG. 3 is a side view showing a main part of the alignment unit 3.

FIG. 4 is a plan view showing a main part of the alignment unit 3.

FIG. 5 is a cross-sectional view when the transport tray 4 is viewed from the transport direction.

FIG. 6 is a plan view of a transport tray 4.

FIG. 7 is a front sectional view for explaining one operation of the alignment unit 3.

FIG. 8 is a side sectional view for explaining one operation of the transport tray 4.

Explanation of symbols

1 Film forming equipment

2 Vacuum Channo

3 Alignment unit

4 Transport tray

5 substrate

6 Mask

7 Magnet

8 Deposition unit

10 Board support unit

11 Mask Honoreda

12 Magnet lifting mechanism

13 Support plate 21 hooks

21A lifting shaft

31 Substrate lifting mechanism

33 Guide rod

34 spindle

41 1st drive part

42 2nd drive part

43 3rd drive

51 Supporting claws

54 hollow shaft

56 motor

58 X—Y direction moving part

59 CCD camera

60 Suspension plate

61 Magnet holder

62 Magnet lifting shaft

64 PCB holder

67 Lock

70 Tray body

71 Opening

73A, 73B wheels

74A, 74B Transfer rail

81A-81F Sputter target unit

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a side sectional view showing a schematic configuration of a film forming apparatus 1 according to an embodiment of the present invention. The film forming apparatus 1 transports the substrate 5 and the mask 6 into one vacuum chamber 2 by aligning the substrate 5 and the mask 6 with each other and maintaining the alignment state. A transport tray 4 and a film forming unit 8 for forming a film on a substrate 5 on the transport tray 4 via a mask 6 are provided.

FIG. 2 to FIG. 4 show a schematic configuration of the alignment unit 3, FIG. 2 is a front sectional view of the main part, FIG. 3 is a side view of the main part, and FIG. 4 is a plan view of the main part. is there. The alignment unit 3 includes a substrate support unit 10 that supports the substrate 5, a mask holder 11 that supports the mask 6, and a magnet elevating mechanism 12 that elevates and lowers a magnet 7 (see FIG. 5) that tightly contacts the substrate 5 and the mask 6. And

The substrate supporting units 10 are respectively disposed at two locations (a total of four locations) on a pair of opposing side edges of the substrate 5, and each have a hook 21 that supports the lower surface of the peripheral edge of the substrate 5. ing. Each of these hooks 21 is vertically movable by a vertically extending shaft 21A extending in the vertical direction.

[0020] Each of these substrate support units 10 is provided with a substrate lifting / lowering mechanism unit 31 that simultaneously raises and lowers each hook 21.

The substrate elevating mechanism 31 includes a guide plate 23 fixed integrally to the outer periphery of the elevating shaft 21 A, and a guide erecting on a support plate 13 mounted on the top plate 2 a of the vacuum chamber 2. It has a rail 24 and a linear bearing 25 for moving the guide plate 23 along the guide rail 24!

The guide plate 23 supports lifting shafts 21 A, 21 A of a pair of substrate support units 10, 10 adjacent to each other, and the guide plate 23 is provided with the rotational movement of the ball screw 14. A block member 15 that converts the movement into vertical movement is attached (Fig. 3). The ball screw 14 is supported by a base plate 16 attached to the upper end of the guide rail 24 and the support plate 13 and extends in the vertical direction.

The base plate 16 is further provided with a first drive unit 41 for driving the ball screw 14 to rotate (FIG. 3). A pulley 41b is fixed to the drive shaft 41a of the first drive unit 41, and a belt 26A is stretched between the pulley 41b and the pulley 14a fixed to the upper end of the ball screw 14. A pair of pulleys 41b on the first drive unit 41 side are provided, and the other pulley 41b is provided with a guide plate 23 that supports the lifting shaft 21A of the remaining substrate support unit 10 located on the opposite side to the direction shown in FIG. Belt 26B that rotates the ball screw 14 for lifting and lowering Is stretched out. Thus, each substrate support unit 10 can be moved up and down at the same time by driving the first drive unit 41.

Further, the substrate support unit 10 is provided with a second drive unit 42 such as a rotary actuator for rotating the hook 21 around the elevating shaft 21A (FIG. 3). The second drive unit 42 is connected to the upper end of the elevating shaft 21A via a magnetic fluid seal 27, and

[0025] The substrate supporting unit 10 is configured as described above, and these constitute the "substrate supporting mechanism" according to the present invention. The substrate 5 is placed inside the vacuum chamber 2 by this substrate support mechanism! In addition, it is vertically movable relative to the mask 6 supported by the mask holder 11 at a position directly below.

Next, the configuration of the mask holder 11 will be described.

[0027] The mask holder 11 includes a plurality of support claws 51 for supporting, for example, four corner lower surfaces of the periphery of the mask 6 made of magnetic metal, a plurality of support rods 52 for supporting the support claws 51 at lower ends thereof, An attachment plate 53 to which the support rods 52 are attached, and a hollow shaft 54 that supports the attachment plate 53 are provided.

[0028] The hollow shaft 54 is inserted into a hollow support shaft 34 that supports a guide rod 33 that guides the elevation of the mounting plate 53, and is movable up and down relatively to the support shaft 34. I have. The guide rod 33 is held at a fixed position inside the vacuum chamber 2, and is connected to the mounting plate 53 via a guide bush 35.

The mask holder 11 including the hollow shaft 54 is supported on the upper surface of a suspension plate 60 of a magnet lifting mechanism 12 described later, and rises with the lifting movement of the suspension plate 60. The plate 60 is lowered by its own weight as the plate 60 moves downward. The lowermost position of the mask holder 11 is regulated by a stopper 36 provided at the lower end of the guide rod 33.

Incidentally, the support shaft 34 is rotatable by a motor 56 on the support plate 13, and is connected to an XY direction moving unit 58 via a magnetic fluid seal 57. By driving the motor 56 and the XY direction moving unit 58, the mask holder 11 and the mask 6 supported by the mask rod 11 together with the guide rod 33 are relatively movable in the X, Y and Θ directions. Yes. This allows the mask 6 to be highly accurate with respect to the substrate 5 supported by the substrate support unit 10 based on the alignment image between the substrate 5 and the mask 6 by a CCD (Charge Coupled Device) camera 59 (FIG. 1). Is aligned with

[0031] The motor 56, the XY direction moving section 58, the CCD camera 59, and the like constitute an "alignment mechanism" of the present invention.

On the other hand, the magnet elevating mechanism 12 includes a magnet 7 (see FIG. 5) for closely adhering the substrate 5 and the mask 6 precisely aligned with each other, a magnet holder 61 for holding the magnet 7 on the lower surface, and a magnet holder 61. The system includes a hanging plate 60 to be hung, a magnet elevating shaft 62 for elevating and lowering the hanging plate 60, and a third drive unit 43 connected to the magnet elevating shaft 62 to elevate the magnet holder 61.

[0033] The magnet elevating shaft 62 is inserted so as to be relatively movable with respect to the axis of the hollow shaft 54 of the mask holder 11, and has a third driving unit such as a hydraulic or pneumatic reciprocating cylinder at the upper end thereof. 43 are linked. A suspension plate 60 is fixed to the lower end of the magnet elevating shaft 62.

The suspending plate 60 supports the mask holder 11 on its upper surface, and moves the mask holder 11 up and down in conjunction with the up and down movement of the magnet elevating shaft 62. On the lower surface of the suspension plate 60, a plurality of suspension hooks 66 having a substantially L-shaped cross section for suspending the magnet holder 61 are attached at predetermined positions. This hanging hook 66 is bent in the standby position force transfer direction of the transfer tray 4 as described later.

A plate-shaped magnet 7 is attached to the lower surface of the magnet holder 61, and a locking portion 67 that detachably locks to the hanging hook 66 of the hanging plate 60 is provided on the upper surface thereof. A plurality are attached corresponding to the formation positions of the bosses 66. The locking portion 67 is formed in a substantially annular shape, and the direction of detachment from the hanging hook 66 is a direction in which the transport tray 4 moves toward the film forming portion 8 as described later.

[0036] The magnet holder 61 is provided with a substrate holder 64 for restricting the displacement of the substrate 5 when the magnet 7 is attached to or detached from the substrate 5. The board holder 64 is a thin plate made of a non-magnetic metal material such as aluminum, and is suspended via a plurality of stepped pins 63 so as to be vertically movable by a predetermined distance relative to the magnet holder 61. Yes.

[0037] The alignment unit 3 is configured as described above. Next, the transport tray 4 will be described. 5 and 6 are views showing the configuration of the transport tray 4, FIG. 5 is a cross-sectional view as viewed from the transport direction, and FIG. 6 is a plan view thereof.

[0038] The transport tray 4 is provided on both sides of the rectangular tray main body 70 having an opening 71 for exposing the film-forming surface of the substrate 5 to the outside of the tray downward at the center, and on both sides of the tray main body. Wheel brackets 72A and 72B, and wheels 73A and 73B respectively attached to the wheel brackets 72A and 72B.

The opening 71 of the transfer tray 4 has a substantially rectangular shape, and is tapered in an inverted mortar shape from the upper surface side to the lower surface side of the tray main body 70. The upper surface of the periphery of the opening 71 serves as a mounting surface for the mask 6 and the substrate 5 and the magnet 7 to be superimposed thereon. In addition, a deposition prevention plate 78 is attached to the lower surface of the peripheral edge of the opening 71.

Escape grooves 75, 75 for avoiding interference with the support claws 51 of the mask holder 11 supporting the mask 6 are provided on both sides of the opening 71 in the tray conveyance direction, respectively, at the rear end of the tray body 70. It is formed. Thus, after the mask 6 and the substrate 5 and the magnet 7 laid thereon are mounted on the mounting surface of the tray main body 70, as the tray main body 70 moves in the transport direction of the transport tray 4, these The support claw 51 also comes out of the rear end force of the tray body 4 via the escape groove 75.

The hook 21 of the substrate support unit 10 that supports the substrate 5 is provided with a support claw of the mask holder 11 via a predetermined clearance formed on a side edge of the mask 6 that is superimposed on the substrate 5. Along with 51, the rear end force of the tray body 70 is also released with the transport of the transport tray 4.

[0042] The wheels 73A and 73B are supported by a pair of transport rails 74A and 74B constituting a transport path of the transport tray 4. On one wheel 73A, a substantially V-shaped groove is formed on the rolling contact surface of the transfer rail 74A, and the transfer rail 74A that supports the groove is also formed with a corresponding protrusion having a substantially triangular cross section. The other wheel 73B has a flat rolling contact surface with the transfer rail 74B, and the transfer rail 74B supporting the transfer rail 74B also has a corresponding flat shape. This allows the transport tray 4 to be positioned with reference to one wheel 73A. It has become.

As for the positioning of the transport tray 4, as shown in FIG. 2, guide rollers 76A and 76B that are in rolling contact with the respective wheel brackets 72A and 72B of the transport tray 4 are provided. The guide rollers 76A, 76B can be advanced and retracted to a retreat position shown by a solid line in FIG. 2 and a guide position shown by a dashed line in FIG. 2 by drive units 77A, 77B attached to both side walls of the vacuum chamber 2.

The transport system of the transport tray 4 employs a rack “and” pinion mechanism. That is, a rack 79 attached to the lower end of one wheel bracket 72A is configured to engage with a pinion gear (not shown) arranged in parallel with the transport rail 74A. The precise feed operation of Tray 4 becomes possible.

As described above, the wheels 73A and 73B, the transport rails 74A and 74B, the guide rollers 76A and 76B, and the like constitute the “guide mechanism” of the present invention.

[0046] Each of the wheels 73A, 73B is attached inwardly to the outer wall of the substantially U-shaped wheel bracket 72A, 72B. Then, in order to prevent the film-forming material from adhering to the wheels 73A, 73B and the transport rails 74A, 74B, the transport path of the transport tray 4 is so covered as to cover the wheels 73A, 73B and the transport rails 74A, 74B from the inside. The shield plates 75A and 75B are respectively provided along.

Next, the film forming unit 8 will be described with reference to FIG.

The film forming section 8 is configured in a linear tubular tube 80 of the vacuum chamber 2, and a plurality of film forming means are arranged adjacent to each other along the transport path of the transport tray 4. In this embodiment mode, an example is shown in which six sputtering target units 81A to 81F are provided to deposit a film-forming material on a substrate by a sputtering method. For example, an evaporation source is provided instead of a unit, and a film formation source corresponding to the film formation method will be installed.

[0049] The sputter target units 81A-81F are provided on a film forming source mounting base 82 disposed below the transfer renoles 74A and 74B, and the film forming source can be easily changed according to the application. It is like that. Each sputter target unit 81A-81F is composed of targets of the same material, and may be composed of targets of different materials. May be.

[0050] At the rear end of the cylindrical tube 80, a maintenance outlet 83 for removing the transport tray 4 out of the system is provided.

[0051] The film forming apparatus 1 of the present embodiment is configured as described above. The alignment unit 3 of the film forming apparatus 1 is formed on a support plate 13 placed on a top plate 2a of the vacuum chamber 2 as a whole. The alignment operation is not affected by the deformation of the top plate 2a due to the pressure difference or the like.

Then, the film forming apparatus 1 performs an alignment step in which the substrate 5 and the mask 6 are aligned by the alignment unit 3 inside the vacuum chamber 2, and transports the substrate 5 and the mask 6 from the alignment unit 3. And a film forming step of forming a film on the film forming surface of the substrate 5 by the film forming unit 8 while transferring the transfer tray 4 along the transfer path. Hereinafter, the operation of the film forming apparatus 1 will be described.

First, referring to FIG. 2, the substrate 5 carried into the vacuum chamber 2 with the film-forming surface facing downward by a robot (not shown) has its peripheral lower surface fixed by the hooks 21 of each substrate support unit 10. Supported. The deposition surface (lower surface) of the substrate 5 supported by the substrate support unit 10 faces the mask 6 supported by the mask holder 11, and the opposite non-deposition surface (upper surface) is suspended from the magnet holder 61. It faces the lowered substrate holder 64.

Next, in the state shown in FIG. 2, the alignment of the substrate 5 and the mask 6 is performed by the alignment unit 3. The alignment between the substrate 5 and the mask 6 is performed by using the mask holder 11 supporting the mask 6 with respect to the substrate 5 stationary by the substrate support unit 10 by using the motor 56 and the X-Y direction moving unit 58 for Θ, X, and Y. The substrate 5 and the mask 6 are aligned by relative movement in the directions.

Specifically, each image of the alignment mark of the substrate 5 and the alignment mark of the mask 6 is acquired by the CCD camera 59, and based on these alignment marks, the motor 56 and the XY direction moving unit 58 are operated. Drive and move the mask holder 11 in each of the Θ, X and Y directions.

After the alignment of the substrate 5 and the mask 6 is performed as described above, each of the substrate support units 10 is simultaneously lowered by driving the substrate lifting / lowering mechanism unit 31, and suspended by driving the third driving unit 43. Lower the mask holder 11 supported by the lowering plate 60, and Then, the mask 6 and the substrate 5 are transferred onto the mounting surface of the transfer tray 4 in this order. At this time, the mask holder 11 descends with the guide action of the guide rod 33, and a predetermined alignment accuracy is secured.

The operation is not limited to the above-described operation example in which the substrate 5 is moved down toward the transport tray 4 together with the mask 6, but the substrate 5 is once superimposed on the mask 6, and the substrate supporting unit 10 releases the substrate 5 supporting action. After that, the mask 6 and the substrate 5 supported by the mask holder 6 may be integrally transferred to the transport tray 4. In this case, if each substrate support unit 10 superimposes the substrate 5 on the mask 6 and turns each hook 21 to the outside of the substrate 5 by driving the second driving unit 42, the substrate The transfer operation of 5 to the transfer tray 4 is not obstructed.

Next, the third drive section 43 is further driven to move the suspension plate 60 downward relative to the mask holder 11 as shown in FIG. The magnet holder 61 is placed on the non-deposition surface (upper surface) of the substrate 5.

At this time, the substrate holder 64 suspended by the magnet holder 61 reaches the upper surface of the substrate 5 before the magnet 7 attached to the lower surface of the magnet holder 61, and the weight of the substrate holder 64 The action of pressing the substrate 5 toward the mask 6 is performed. Then, the magnet 7 is overlapped on the substrate holder 64 in contact with the substrate 5 while suppressing the deformation of the mask 6 toward the magnet 7 due to the magnetic force of the magnet 7. Thus, precise alignment and close contact between the substrate 5 and the mask 6 can be achieved (FIG. 5).

As described above, the step of transferring the substrate 5 and the mask 6 to the transport tray 4 is completed. Subsequently, a step of forming a film on the film formation surface of the substrate 5 while transferring the transfer tray 4 along the transfer path is performed.

The transport tray 4 is waiting at a transfer position immediately below the alignment unit 3, as shown in FIGS. After the substrate 5 and the mask 6 integrated by the magnet 7 are mounted on the mounting surface of the transfer tray 4, the transfer direction is performed by the guide rollers 76A and 76B extended by the driving units 77A and 77B. The wafer is transported to the film forming unit 8 along the transport rails 74A and 74B while being properly guided to the film forming unit 8.

At this time, the transfer tray 4 moves in the direction indicated by the arrow A in the locking portion 67 of the magnet holder 61 locked by the hanging hook 66 of the hanging plate 60 as shown in FIG. Occasionally The locking action with the suspension hook 66 is released. Thus, the suspension plate 60 and the magnet holder 61 are separated from each other, and the magnet holder 61 is supported on the transport tray 4 together with the magnet 7.

The film is formed on the substrate 5 through the opening 71 of the carrying tray 4 at a position directly above the sputter target units 81A-81F, and a film pattern having a shape corresponding to the opening pattern of the mask 6 is formed. It is formed on the deposition surface of the substrate 5. In the film forming process in the film forming section 8, the transport tray 4 may be intermittently sent to a position immediately above each of the sputter target units 81A-81F, or the position directly above each of the sputter target units 81A-81F may be fixed. It may be sent continuously at a speed.

When a sputter target of the same material is applied to each of the sputter target units 81A-81F, a thick film deposition pattern can be obtained. When a sputter target of a different material is applied, a multilayer film structure can be obtained. Can be obtained.

As described above, according to the present embodiment, alignment unit 3 for positioning substrate 5 and mask 6 with high precision, and film formation for forming a film formation pattern of a predetermined material on substrate 5 Since the unit 8 and the unit 8 are provided in the same vacuum chamber 2, it is possible to promptly shift to the film formation step after the alignment step, thereby improving productivity.

Further, since the transfer of the substrate 5 from the alignment unit 3 to the film forming unit 8 is performed by the transfer tray 4, the transfer system is different from the conventional substrate transfer system between different vacuum chambers. Can be simplified, thereby reducing the device manufacturing cost and improving the maintainability.

Subsequently, after the film formation of the substrate 5 in the film forming unit 8 is performed, the transfer tray 4 is moved to the transfer rail.

The process returns to the original transfer position along 74A and 74B, and the process of transferring the film-formed substrate 5 together with the mask 6 and the magnet 7 to the transport tray 4 force alignment unit 3 is performed.

At the transfer position, the support claws 51 of the mask holder 11 and the hooks 21 of the substrate support unit 10 are on standby, and when the transport tray 4 returns to the transfer position, the transfer tray 4 returns to the lower surface of the periphery of the substrate 5 and the mask 6. The support claw 51 and the hook 21 face each other. Further, the locking portion 67 of the magnet holder 61 and the hanging hook 66 of the hanging plate 60 are locked. Then, the magnet elevating shaft 62 is raised to lift the magnet holder 61 via the suspension plate 60 (FIG. 7). At this time, since the upper surface of the substrate 5 is pressed by the substrate presser 64, radial deformation of the mask 6 due to the magnetic force of the magnet 7 is suppressed, and positional displacement between the substrate 5 and the mask 6 is prevented. Is done. Thus, it is possible to avoid the damage of the pattern formed on the film-forming surface of the substrate 5 due to the misalignment between the substrate 5 and the mask 6, and to protect the film-forming surface of the substrate 5.

Next, the substrate 5 is lifted by raising the substrate support unit 10, and the mask holder 11 is lifted integrally with the suspension plate 60, so that the transport tray 4 also moves the substrate 5 and the mask 6 to the alignment unit 3. Is completed. Thereafter, a robot (not shown) enters below the substrate 5 and is carried out of the vacuum chamber 2, and a new substrate 5 to be processed next is placed on the hook 21 of the substrate support unit 10.

[0071] As described above, the present invention is not limited to the power described in the embodiment of the present invention, and various modifications are possible based on the technical idea of the present invention.

For example, in the above-described embodiment, after the substrate 5 and the mask 6 are placed on the transport tray 4, the force for bringing the substrate 5 and the mask 6 into close contact by the magnet 7 is used instead. After the alignment of the mask 5 and the mask 6 is completed, the configuration of the magnet lifting mechanism 12 is changed so that the substrate 5 is superimposed on the mask 6 and adhered by the magnet 7 before transfer to the transport tray 4. It may be. In this case, the substrate 5 and the mask 6 are transferred to the transport tray 4 in a state where they are integrated by the magnet 7.

Claims

The scope of the claims

[1] An alignment unit for aligning a substrate and a mask in the same vacuum chamber, a transport tray for receiving the substrate and the mask from the alignment unit, and a transport path for the transport tray. A film forming apparatus comprising:

[2] The alignment unit includes a substrate support mechanism that supports the substrate so as to be able to move up and down with respect to the mask made of a magnetic material supported by a mask holder, and an alignment that aligns the mask with the substrate. A mechanism for raising and lowering a magnet for bringing the mask and the substrate into close contact with each other with respect to the substrate, wherein the magnet has a locking portion detachable from the magnet lifting mechanism. The film forming apparatus according to claim 1, wherein the film forming apparatus is provided.

[3] The magnet lifting mechanism includes a magnet holder fixed to a lower end of a lifting shaft and holding the magnet, and a substrate suspended so as to be relatively movable with respect to the magnet holder and arranged to face the upper surface of the substrate. 3. The film forming apparatus according to claim 2, comprising a presser.

[4] The transfer tray includes a tray main body having an opening for exposing the film-forming surface of the substrate to the outside of the tray, and a guide mechanism for guiding the tray main body to the transfer path. 2. The film forming apparatus according to item 1, wherein

5. The film forming apparatus according to claim 1, wherein the film forming means is a plurality of evaporation sources or a sputter target arranged along the transport path.

6. The film forming apparatus according to claim 1, wherein the alignment unit is supported on a support plate arranged on a top plate of the vacuum chamber.

[7] In the same vacuum chamber, an alignment step of aligning the substrate and the mask by an alignment unit, a transfer step of transferring the substrate and the mask from the alignment unit to a transport tray, A film forming step of forming a film on a film forming surface of the substrate while transferring the transfer tray along a transfer path.

8. The film forming method according to claim 7, further comprising a step of transferring the substrate and the mask from the transfer tray to the alignment unit after forming the film on the substrate.

[9] In the alignment step, by attaching a magnet to the mask made of a magnetic material via the substrate, the substrate and the mask are brought into close contact with each other, and in the transfer step, the magnet is held and held. The film forming method according to claim 7, further comprising a step of separating the magnet from an alignment unit for aligning a substrate and the mask.

10. The film forming method according to claim 7, wherein in the film forming step, the substrate is transferred on a plurality of evaporation sources or sputter targets arranged along the transfer path.