WO2005081601A1 - マウンタ装置及びその部品カートリッジ、並びに基板の保持搬送方法 - Google Patents
マウンタ装置及びその部品カートリッジ、並びに基板の保持搬送方法 Download PDFInfo
- Publication number
- WO2005081601A1 WO2005081601A1 PCT/JP2004/010148 JP2004010148W WO2005081601A1 WO 2005081601 A1 WO2005081601 A1 WO 2005081601A1 JP 2004010148 W JP2004010148 W JP 2004010148W WO 2005081601 A1 WO2005081601 A1 WO 2005081601A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- holding
- carrier
- component
- mounter device
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Definitions
- the present invention relates to a mounter device that is particularly suitable for use in manufacturing an electronic circuit board using a thin printed wiring board, a component force thereof, and a substrate holding and conveying method.
- a resin material having weak adhesiveness is coated on the base material of the transport carrier, and the resin material
- a method of holding the substrate by adhesive force, or a method of fixing the peripheral portion of the substrate to the transport carrier using a tape or a way rod is employed.
- the above methods have the following problems.
- the force generated by the heat stress generated when the substrate is reflowed may exceed the adhesive force of the carrier, which may prevent the substrate from being warped.
- the method of fixing the board using tape or weight may increase costs due to an increase in man-hours.
- the temperature of the substrate surface is uneven because the way ⁇ ⁇ force ⁇ heat is absorbed during reflow. In some cases, solder melting may be uneven.
- the present invention has been made in view of the above circumstances, and it is an object of the present invention to reliably prevent warpage during reflow of a substrate while effectively utilizing existing mounting lines and devices to reduce cost. Disclosure of the invention
- the present invention provides a method in which an electronic component is mounted on a substrate mounted on a carrier by a mounter device, and then the substrate is heated to a predetermined temperature to thereby transfer the electronic component to the substrate.
- a component cartridge for a mounter device used in a mounting process for mounting comprising: a holding component that holds the substrate in close contact with the carrier carrier; and a guide tape that holds the holding component;
- the holding component is held by the mounter device to the transport carrier. It becomes possible to adopt a transport method.
- the holding component is inserted while being elastically slidably contacted with the transport carrier, thereby generating a predetermined locking force between the holding component and the transport carrier. Therefore, if the locking force is set so that the substrate can be held with a holding force that exceeds the force generated by the thermal stress of the substrate during heating, the warpage of the substrate can be prevented. It is also possible to easily attach and detach the holding parts to and from the carrier carrier.
- the edge portion of the substrate is a concept that includes, in addition to the peripheral edge portion, an inner edge portion such as a hole slit provided in the substrate (including the state of the base material before being formed as a substrate). is there.
- FIG. 1 is a perspective view of a mounting line in an embodiment of the present invention.
- FIG. 2 is a perspective view of a parts feeder of the mounting apparatus.
- FIG. 3 is a perspective view of the substrate placed on the transport carrier.
- FIG. 4 is a cross-sectional view taken along line AA in FIG.
- FIG. 5 is a front view of the holding pin.
- FIG. 6 is a perspective view of the component cartridge.
- FIG. 7 is a perspective view corresponding to FIG. 2 in the case of using a tray-type component force trough.
- FIG. 1 shows a thin printed wiring board (hereinafter simply referred to as a thin printed wiring board) having a thickness of 0.001 to 1.Omm such as a thin printed wiring board (FWB) or a flexible printed circuit (FPC) board.
- a thin printed wiring board (hereinafter simply referred to as a thin printed wiring board) having a thickness of 0.001 to 1.Omm
- a thin printed wiring board (FWB) or a flexible printed circuit (FPC) board.
- mounting line 1 for surface mounting hereinafter simply referred to as mounting
- various electronic components such as transistors and capacitors and IC chips (integrated circuits) (see Fig. 2) 1 1 It shows the main part.
- a plurality of substrates 10 trimmed to a desired shape are placed on one transport carrier 12 and in this state, each substrate 10 is transported carrier 1 2.
- a series of processing in the mounting process is sequentially performed on each substrate 10 while being conveyed.
- an arrow F indicates the transport direction of the substrate 10 and the transport carrier 12.
- the mounting process includes a printing process for performing cream solder printing of a desired pattern on the substrate 10 placed on the carrier carrier 12 using the printing apparatus 2, and a mounter apparatus that is an electronic component automatic mounting machine. 3 is used to automatically mount various electronic components 1 1 on the substrate 10, and each electronic component 1 1 is mounted on the substrate 1 0 in the reflow furnace 4. This is divided into a reflow process in which each electronic component 11 is electrically connected and fixed to the substrate 10 through a cream solder heated to a temperature (220 to 28 ° C.). The reflow process is performed at a high temperature, whereas the printing process and the mounting process are performed at a room temperature of about room temperature.
- the mounter device 3 includes a plurality of parts feeders 6 that can be replaced with respect to the mounter body 5.
- Each of these parts feeders 6 is provided corresponding to each of various electronic parts 1 1, and a part cartridge 8 containing a plurality of electronic parts 11 of the same type is attached to the feeder body 7 in a replaceable manner. It is done.
- This part strength ridge 8 is configured such that a corresponding electronic component 11 is held on a guide tape 9 and is wound around a reel, and these are accommodated in a case.
- the guide tape 9 includes an embossed carrier tape 2 1 in which a plurality of embossed (concave-shaped portions) 2 2 are arranged at equal intervals in the longitudinal direction, and each embossed 2
- the top cover tape 2 3 is attached to the embossed rear tape 2 1 so as to close the 2 2.
- electronic components 1 1 are set in a posture (state) that can be mounted on the substrate 10, and the electronic components 1 1 are arranged on the guide tape 9 at equal intervals. It is in a retained state.
- the guide tape 9 is provided with a plurality of feed holes 24 that can convey the guide tape 9 side by side.
- the guide tape 9 is pulled out intermittently, and the top force bar tape 23 is scraped off by the take-up reel 25.
- the electronic components 11 arranged on the tape 9 are arranged one by one at the component supply position in the feeder body 7.
- the electronic component 11 placed at the component supply position is sucked and held by the mount arm 5 a of the mounter body 5, and the mount arm 5 a operates to place the electronic component 11 on the transport carrier 1 2. It moves to a predetermined position of the placed substrate 10 and is mounted on the substrate 10.
- the operation control of the mounter device 3 including the mount arm 5a is performed by a control device (not shown), and can be appropriately handled according to the substrate 10 and the electronic component 1 1.
- the electronic component 11 when the electronic component 11 is replenished or switched, it can be handled by replacing the component cartridge 8.
- at least one of the parts feeders 6 is a holding pin that holds the substrate 10 in close contact with the substrate mounting surface of the carrier carrier 12 (holding component: see FIGS. 3 to 5).
- the feeder main body 7 and the pin component cartridge 8A mounter device component cartridge
- the feeder main body 7 and the pin component cartridge 8A are configured as a pin parts feeder 6A.
- the component cartridge 8 A for the pin replaces the electronic component 1 1, and the holding pin 15 is held in the guide tape 9 and accommodated in the case in a reel-wound state.
- each holding pin 15 is housed in the emboss 22 of the guide tape 9 in a posture (state) that can be attached to the transport carrier in the same manner as each electronic component 1 1. They are arranged at equal intervals and held in this position.
- the guide tape 9 is intermittently pulled out along with the operation of the mounter body 5, and the top cover tape 23 is taken up by the take-up reel 25, and in this state the guide tape 9 is taken up.
- the holding pins 15 arranged on the tape 9 are arranged one by one at the parts supply position in the feeder body 7.
- the holding pins 15 are attracted and held by the mount arms 5 a and moved to a predetermined position of the transport carrier 12 and attached to the transport carrier 12.
- the substrate 10 in this embodiment has a substantially square outer shape, and is a peripheral portion (outer edge portion) of the substrate 10 in the transport carrier 12 and a portion near each corner.
- Each of the holding pins 15 is attached to each other. Then, the holding pins 15 attached to the transport carrier 12 hold the peripheral edge portion of the substrate 10 so as to prevent the transport carrier 12 from floating from the substrate placement surface 13.
- each holding carrier 15 can be attached to a portion of the transport carrier 12 near the corner of the substrate 10 and outside the periphery of the substrate 10.
- Each hole 14 is provided.
- each holding pin 15 includes a leg portion 16 inserted into the through hole 14 of the carrier carrier 12 and an umbrella-shaped head provided on the substrate 10 side (base end side) of the leg portion 16. Part 1 And 7.
- Each insertion hole 14 of the transport carrier 1 2 is formed so as to be substantially orthogonal to the substrate mounting surface 13, and the leg portion 16 of the holding pin 15 is inserted into each of the through holes 14.
- the peripheral portion of the substrate 10 is pressed by the head 17, and the separation of the peripheral portion from the substrate placement surface 13 of the transport carrier 12, that is, the floating is restricted.
- the peripheral edge portion of the substrate 10 is sandwiched between the lower surface of the head portion 17 of each holding pin 15 and the substrate placement surface 13 of the transport carrier 12.
- the carrier 12 is made of a relatively hard base material 1 2 a such as glass cloth epoxy resin laminated material, aluminum, stainless steel, and magnesium alloy, and is relatively soft and 10 to 1 OOO g Z cm 2 For example, it is formed by coating a fluorine-based or silicon-based resin material 1 2 b having weak adhesiveness that satisfies the following conditions.
- the substrate mounting surface 1 3 is formed by the resin material 1 2 b, and the substrate 10 placed on the substrate mounting surface 1 3 is bonded to the substrate by the adhesive force of the resin material 1 2 b. A holding force that suppresses lifting from the mounting surface 13 is applied, and positioning in the direction along the substrate mounting surface 13 is performed.
- the substrate 10 can be easily peeled off from the carrier carrier 12 after finishing the processing in each process.
- the transport carrier 1 2 is used by using a mounting jig (not shown) and a reference hole of the substrate 10 corresponding thereto.
- the substrate 10 may be placed at a predetermined position.
- the leg portion 16 of the holding pin 15 has, for example, a plurality of locking claws 16 6 a force ⁇ , which are curved so as to bulge the substantially central portion in the longitudinal direction toward the radially outer side. It is provided at a predetermined interval S in the circumferential direction.
- Each of the locking claws 16 a has a panel property, and the leg portions 16 can be reduced in diameter by being displaced so as to be elastically deformed and to narrow the interval S. Yes.
- the maximum outer diameter of the leg 16 before the diameter reduction is set to be larger than the inner diameter of the through hole 14 of the transport carrier 1 2.
- the claw 16 a is inserted into the through hole 14 while being elastically slidably contacted with the inner surface of the through hole 14. This A predetermined locking force is generated between the holding pin 15 and the transport carrier 12, and as a result, at the peripheral portion of the substrate 10, the locking force and the adhesive force of the transport carrier 12 are The substrate 10 is held by the resultant force.
- the length and maximum outer diameter of the legs 16 of the holding pin 15 are set corresponding to the insertion hole 14 of the transport carrier 1 2, but as an example, a thread with an inner diameter of approximately 1 mm is used.
- the length L 1 of the leg 16 is about 1.25 mm and the maximum outer diameter D 1 is about 1.2 mm.
- the outer diameter D 2 of the head 17 of the holding pin 15 is about 1.5 mm, and the strength is such that the substrate 10 can be held while being attached to the transport carrier 12.
- the thickness T 2 of the head 17 is about 1 mm.
- a disc-shaped base portion 18 having a thickness (for example, 0.45 mm) T 3 corresponding to the substrate 10 is provided on the lower surface side (the leg portion 16 side) of the head 17.
- the leg portion 16 extends from the lower surface thereof.
- the outer diameter D 3 of the pedestal portion 18 is about 0.9 mm.
- Such holding pins 15 are made of, for example, a thermoplastic resin such as polystyrene or acrylic resin, a thermosetting resin such as polyacetal or epoxy resin, or a metal material such as stainless steel or aluminum, and has heat resistance and good resistance. It shall have flexibility. In addition to the above characteristics, the holding pin 15 is preferably conductive so as to prevent electrostatic charge.
- each holding pin 15 is attached to the transport carrier 12 automatically and at high speed using the existing mounter device 3 in the mounting process, which is a pre-process of the reflow process.
- the existing mounter device 3 in the mounting process which is a pre-process of the reflow process.
- each locking claw 16 Remove each holding pin 15 smoothly without crushing a. You can.
- the pin component cartridge 8 A in the above embodiment is mounted on the substrate 10 placed on the carrier carrier 12 after the electronic component 11 is mounted on the substrate 10 by the mounter device 3.
- 1 0 is used in the mounting process in which electronic components 1 1 are mounted on the substrate 10 by being heated to a predetermined temperature, and the substrate 10 is held in close contact with the carrier carrier 1 2.
- the holding pin 15 is held in a reel-wound state together with the guide tape 9 so that the holding pin 15 can be attached to the carrier 12 by the mounter 3. is there.
- the holding pin 15 is automatically and rapidly transferred to the carrier carrier 12 by the mounter device 3 in the mounting process. It is possible to adopt a method for holding and conveying the substrate to be mounted.
- the substrate transport method described above even when a thermal stress occurs on the substrate 10 during heating, the substrate 10 is held in close contact with the transport carrier 12 by the holding pins 15. It is possible to reliably prevent the substrate 10 from floating from the transport carrier 12, that is, the substrate 10 from warping.
- halogen-free boards that do not contain halogen-based flame retardants such as bromine and chlorine, and so-called lead-free solders that do not contain lead (PB) have been adopted in consideration of environmental friendliness.
- PB lead-free solders that do not contain lead
- the halogen-free board tends to warp at once in the riff opening, and the lead-free solder has a high melting temperature (2500 to 2800 ° C), which prevents the board from warping. It is disadvantageous in terms.
- the holding pins 15 are transported. Since it is configured to generate a predetermined locking force between the holding pin 15 and the transport carrier 12 by inserting the rear 12 while being elastically slidably contacted, the substrate during heating If the locking force is set so that the substrate 10 can be held with a holding force that exceeds the force generated by the 10 thermal stress, the substrate 10 can be prevented from warping, and the holding pin 1 5 It is also possible to easily attach and detach the transport carrier 12.
- the holding pins 15 are arranged so as to hold the peripheral edge of the substrate 10, the peripheral edge of the substrate 10 is likely to float from the transfer carrier 12. Can be securely held in close contact with the carrier carrier 12, and the warpage of the substrate 10 can be effectively prevented. Then, it is possible to manufacture an electronic circuit board in which the electronic component 11 is mounted on the substrate 10 by using the existing mounting line and device, and the holding pin using the existing mounter device 3. 1 5 can be installed automatically and at high speed.
- the printing process, mounting process, and reflow process are performed as a series of processes. Therefore, interposing the process of attaching the holding pin 15 between each process requires the existing mounting line 1 This is not desirable because it involves major changes. It is also possible to attach the holding pins 15 before the printing process, as in the conventional method of fixing the substrate 10 using tape, but the thickness of the head 1 of the holding pins 15 This is significantly thicker than the thickness of the tape (approximately 80 m), which hinders cream solder printing and increases the number of man-hours in the same way as conventional tape methods.
- the above-described substrate holding and transporting method of attaching the holding pin 15 for holding the substrate 10 using the existing mounter device 3 can improve the production efficiency while suppressing the equipment cost. Very effective
- a tray-type component force cartridge 1 0 8 may be attached by housing a plurality of electronic components 1 1 in one main body 1 0 7.
- a plurality of recesses 10 9 are arranged in parallel on the component mounting surface of the tray body 10 7, and the same kind or various electronic components 11 are set in the recesses 10 9 respectively.
- Each electronic component 11 in this state is directly sucked and held by the mount arm 10 05 a of the mounter body 105, moves to a predetermined position of the substrate 10, and is mounted on the substrate 10.
- One of the component cartridges 10 8 and 8 is a pin component cartridge (mounter device component cartridge) 10 8 A that contains the holding pin 15 instead of the electronic component 11.
- each holding pin 15 is configured not to be inserted into a part of the transport carrier 12 outside the periphery of the substrate 10 but to be inserted into the transport carrier 12 through the periphery of the substrate 10. It may be.
- a positioning reference hole for example, a diameter of 3.2 mm or 4 mm used when placing the substrate 10 on the carrier carrier 12 is used. It is possible to use.
- an arm-like shape extending from the base end portion of the leg portion 16 for example, instead of one umbrella-shaped head portion. You may set things.
- the holding pin 15 may be configured to hold an inner edge portion such as a slit provided in the base material 10.
- the number of substrates is not limited to a single substrate, for example, when the substrate is held in the state of the base material before it is formed as the substrate 10 by the transport carrier 12 and provided at the peripheral portion of the base material and this.
- the holding pins 15 may be arranged so as to hold the base material using the inner edge portion of the formed hole or the like.
- the transport carrier 12 may not be configured to adhere and hold the substrate 10 ⁇
- the holding pins 15 may be positioned in the direction along the substrate mounting surface 13 of the substrate 10. May be. In this case, attach the holding pin 15 to the carrier 1 2 before mounting the electronic component 1 1, It is desirable that the substrate 10 be fixed to the transport carrier 12 in advance in combination.
- the electronic component or the holding pin is not held in the guide tape by being housed in the emboss 22, but is held in the guide tape by being inserted, for example, through an adhesive layer. May be.
- the holding component for holding the substrate 10 is not limited to the holding pin 15 and may be, for example, a snap button or a thumbtack.
- the substrate is reliably prevented from warping. Therefore, it is possible to improve the yield and reduce the manufacturing cost.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006510147A JP4319220B2 (ja) | 2004-02-24 | 2004-07-09 | マウンタ装置及びその部品カートリッジ、並びに基板の保持搬送方法 |
US10/598,251 US7600313B2 (en) | 2004-02-24 | 2004-07-09 | Part cartridge for mounter device |
EP04747614A EP1720388B1 (en) | 2004-02-24 | 2004-07-09 | Mounter device, part cartridge for the device, and method of holding and carrying substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-47568 | 2004-02-24 | ||
JP2004047568 | 2004-02-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005081601A1 true WO2005081601A1 (ja) | 2005-09-01 |
Family
ID=34879479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/010148 WO2005081601A1 (ja) | 2004-02-24 | 2004-07-09 | マウンタ装置及びその部品カートリッジ、並びに基板の保持搬送方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7600313B2 (ja) |
EP (1) | EP1720388B1 (ja) |
JP (1) | JP4319220B2 (ja) |
CN (1) | CN100559917C (ja) |
WO (1) | WO2005081601A1 (ja) |
Cited By (1)
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JP2014051035A (ja) * | 2012-09-07 | 2014-03-20 | Teijin Ltd | 繊維強化熱可塑性樹脂成形体の製造方法 |
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US9226407B2 (en) * | 2002-07-01 | 2015-12-29 | Semigear Inc | Reflow treating unit and substrate treating apparatus |
TW201214609A (en) * | 2010-09-27 | 2012-04-01 | Toray Eng Co Ltd | Substrate conveying apparatus |
RU2472252C1 (ru) * | 2011-06-22 | 2013-01-10 | Государственное образовательное учреждение высшего профессионального образования Томский государственный университет систем управления и радиоэлектроники (ГОУ ВПО ТУСУР) | Способ изготовления полупроводникового источника света |
US9814406B2 (en) | 2013-11-19 | 2017-11-14 | Pacesetter, Inc. | Method and system to identify motion data associated with consistent electrical and mechanical behavior for a region of interest |
CN104822229A (zh) * | 2015-04-22 | 2015-08-05 | 上海凯思尔电子有限公司 | 一种使用图钉固定pcb板的作业流程 |
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-
2004
- 2004-07-09 JP JP2006510147A patent/JP4319220B2/ja not_active Expired - Fee Related
- 2004-07-09 US US10/598,251 patent/US7600313B2/en not_active Expired - Fee Related
- 2004-07-09 CN CNB2004800419823A patent/CN100559917C/zh not_active Expired - Fee Related
- 2004-07-09 EP EP04747614A patent/EP1720388B1/en not_active Expired - Fee Related
- 2004-07-09 WO PCT/JP2004/010148 patent/WO2005081601A1/ja active Application Filing
-
2009
- 2009-08-27 US US12/548,863 patent/US8196292B2/en not_active Expired - Fee Related
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JPS5973243A (ja) * | 1982-10-20 | 1984-04-25 | Sanyo Electric Co Ltd | ピンカシメ装置 |
JPH02137297A (ja) * | 1988-11-17 | 1990-05-25 | Matsushita Electric Ind Co Ltd | 電子部品装着装置 |
JPH03190200A (ja) * | 1989-12-19 | 1991-08-20 | Sanyo Electric Co Ltd | 基板支持装置 |
JPH08279699A (ja) * | 1995-04-10 | 1996-10-22 | Matsushita Electric Ind Co Ltd | 電子部品実装装置 |
JPH09321491A (ja) * | 1996-05-27 | 1997-12-12 | Sony Corp | 部品マウント装置 |
Non-Patent Citations (1)
Title |
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See also references of EP1720388A4 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014051035A (ja) * | 2012-09-07 | 2014-03-20 | Teijin Ltd | 繊維強化熱可塑性樹脂成形体の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1720388A1 (en) | 2006-11-08 |
JPWO2005081601A1 (ja) | 2007-08-02 |
US7600313B2 (en) | 2009-10-13 |
JP4319220B2 (ja) | 2009-08-26 |
EP1720388A4 (en) | 2010-08-18 |
US20100050430A1 (en) | 2010-03-04 |
EP1720388B1 (en) | 2012-05-02 |
US20070266556A1 (en) | 2007-11-22 |
CN100559917C (zh) | 2009-11-11 |
US8196292B2 (en) | 2012-06-12 |
CN1954650A (zh) | 2007-04-25 |
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