WO2005046986A1 - セラミックグリーンシート成形用離型フィルム - Google Patents
セラミックグリーンシート成形用離型フィルム Download PDFInfo
- Publication number
- WO2005046986A1 WO2005046986A1 PCT/JP2004/009420 JP2004009420W WO2005046986A1 WO 2005046986 A1 WO2005046986 A1 WO 2005046986A1 JP 2004009420 W JP2004009420 W JP 2004009420W WO 2005046986 A1 WO2005046986 A1 WO 2005046986A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- release
- film
- layer
- release film
- ceramic
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 60
- 239000010410 layer Substances 0.000 claims abstract description 96
- 229920006267 polyester film Polymers 0.000 claims abstract description 35
- 239000002356 single layer Substances 0.000 claims abstract description 7
- 239000003522 acrylic cement Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 51
- 238000004519 manufacturing process Methods 0.000 abstract description 18
- 239000003990 capacitor Substances 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 99
- 239000002245 particle Substances 0.000 description 44
- 238000000576 coating method Methods 0.000 description 32
- 239000011248 coating agent Substances 0.000 description 29
- -1 aromatic dicarboxylic acids Chemical class 0.000 description 27
- 239000000203 mixture Substances 0.000 description 25
- 229920000728 polyester Polymers 0.000 description 25
- 229920000139 polyethylene terephthalate Polymers 0.000 description 24
- 239000005020 polyethylene terephthalate Substances 0.000 description 24
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 19
- 229920002799 BoPET Polymers 0.000 description 18
- 239000003795 chemical substances by application Substances 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 15
- 239000002994 raw material Substances 0.000 description 15
- 238000005259 measurement Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 239000002390 adhesive tape Substances 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 6
- 238000005809 transesterification reaction Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 229920002050 silicone resin Polymers 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 230000010485 coping Effects 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- 229920001634 Copolyester Polymers 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000001227 electron beam curing Methods 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000005305 interferometry Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 2
- 239000011146 organic particle Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- FYELSNVLZVIGTI-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-5-ethylpyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C=1C=NN(C=1CC)CC(=O)N1CC2=C(CC1)NN=N2 FYELSNVLZVIGTI-UHFFFAOYSA-N 0.000 description 1
- UOBYKYZJUGYBDK-UHFFFAOYSA-N 2-naphthoic acid Chemical group C1=CC=CC2=CC(C(=O)O)=CC=C21 UOBYKYZJUGYBDK-UHFFFAOYSA-N 0.000 description 1
- MMINFSMURORWKH-UHFFFAOYSA-N 3,6-dioxabicyclo[6.2.2]dodeca-1(10),8,11-triene-2,7-dione Chemical group O=C1OCCOC(=O)C2=CC=C1C=C2 MMINFSMURORWKH-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- DAMJCWMGELCIMI-UHFFFAOYSA-N benzyl n-(2-oxopyrrolidin-3-yl)carbamate Chemical compound C=1C=CC=CC=1COC(=O)NC1CCNC1=O DAMJCWMGELCIMI-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- XQKKWWCELHKGKB-UHFFFAOYSA-L calcium acetate monohydrate Chemical compound O.[Ca+2].CC([O-])=O.CC([O-])=O XQKKWWCELHKGKB-UHFFFAOYSA-L 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 235000011132 calcium sulphate Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- LXVAEMFXVFEJNV-UHFFFAOYSA-N decanedioic acid;hexanedioic acid Chemical compound OC(=O)CCCCC(O)=O.OC(=O)CCCCCCCCC(O)=O LXVAEMFXVFEJNV-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 description 1
- 239000004137 magnesium phosphate Substances 0.000 description 1
- 229910000157 magnesium phosphate Inorganic materials 0.000 description 1
- 229960002261 magnesium phosphate Drugs 0.000 description 1
- 235000010994 magnesium phosphates Nutrition 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 125000005487 naphthalate group Chemical group 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- MRFDIIXYTDNCAZ-UHFFFAOYSA-N phthalic acid;terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1.OC(=O)C1=CC=CC=C1C(O)=O MRFDIIXYTDNCAZ-UHFFFAOYSA-N 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000007581 slurry coating method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004441 surface measurement Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004876 x-ray fluorescence Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/481—Insulating layers on insulating parts, with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
Definitions
- the present invention relates to a release film for forming a ceramic green sheet, and more particularly, to releasing a release film by vacuum suction or the like when manufacturing various ceramic electronic components such as a ceramic multilayer capacitor and a ceramic substrate.
- the present invention also relates to a release film for forming a ceramic green sheet, which is capable of coping with a peeling step employing a so-called surface peeling method, in which a ceramic layer formed on the surface of the mold layer is vertically peeled off as a sheet.
- a ceramic green sheet is abbreviated as a green sheet.
- a release film using a polyester film as a base material has been used for forming a green sheet necessary for manufacturing various ceramic electronic components such as ceramic laminated capacitors and ceramic substrates. . That is, a ceramic layer is formed on the release layer surface of the release film to form a green sheet, and after a predetermined process, the ceramic layer is peeled from the release film as a sheet.
- the thickness of ceramic sheets has also tended to decrease.
- the ceramic slurry coating may be performed. Repelling of the slurry and pinholes may occur during construction, and problems such as breakage of the ceramic sheet may occur when the ceramic sheet is peeled off.
- Patent Document 1 JP-A-2000-49060
- Patent Document 2 JP-A-2002-254421
- the present invention has been made in view of the above circumstances, and has as its object to form a green sheet used for manufacturing various ceramic electronic components such as ceramic multilayer capacitors and ceramic substrates.
- An object of the present invention is to provide a release film having a flat surface and capable of coping with a peeling step employing a so-called surface peeling method, in which a ceramic sheet is peeled in a direction perpendicular to a release layer surface.
- the present inventors have conducted intensive studies and have obtained the following findings.
- the surface peeling method can be considered as a peeling method in a high-speed peeling region where the peeling propagation speed is higher.
- the present invention has been completed based on the above findings, and the gist of the present invention is that a release layer is provided on at least one surface of a single-layer polyester film or a co-extruded laminated polyester film, and the following formula (1) ) And (2) are simultaneously satisfied.
- Rm r represents the maximum roughness (nm) of the release layer surface in the release film
- F 300 and F 30 represent the peeling rates of 300 (m / min) and 3 respectively.
- the peel force (mNZ cm) between the release layer surface and the acrylic adhesive tape at 0 (m / min) is shown.
- a green sheet that has a release layer surface that is flat and that can cope with a peeling step that employs a so-called surface peeling method that peels a ceramic sheet in a vertical direction by vacuum suction or the like is used.
- a mold release film is provided.
- the polyester film constituting the release film of the present invention is a single-layer polyester film or a co-extruded laminated polyester film.
- the coextruded laminated polyester film has two layers that make up the two exposed surfaces, which are called the outermost layers. In the case of three or more layers, the inner layer exists, and in the case of four or more layers, the inner layer itself has a multilayer structure.
- the polyester used for the polyester film may be a homopolyester or a copolyester.
- a homopolyester those obtained by polycondensing an aromatic dicarboxylic acid and an aliphatic glycol are preferred.
- aromatic dicarboxylic acids include terephthalic acid and 2,6-naphthalenedicarboxylic acid
- aliphatic glycols include ethylene glycol, diethylene glycol, and 1,4-cyclohexanedimethanol.
- Typical polyesters include polyethylene terephthalate (PET) and polyethylene 2,6-naphthalenedicarboxylate (PEN).
- a copolyester it is preferably a copolymer containing 30 mol% or less of a third component.
- the dicarboxylic acid component of the copolymerized polyester may be one or more of isophthalic acid, terephthalic acid phthalate, 2,6-naphthalenedicarboxylic acid, adipic acid sebacic acid, oxycarboxylic acid (for example, P-oxybenzoic acid, etc.) and the like.
- glycol components include one or more of ethylene glycol, diethylene glycol, propylene glycol, butanediol, 1,4-cyclohexanedimethanol, neopentyl glycol and the like.
- the polyester in the present invention is usually 80 mol% or more, preferably 90 molar 0/0 or polyethylene terephthalate is ethylene terephthalate unit, ethylene -2, 6-naphthalate unit Polyethylene 2, 6 Polyester such as naphthalate Refers to
- Particles are preferably incorporated into the polyester of the present invention mainly for imparting lubricity.
- the type of particles to be blended is not particularly limited as long as the particles can impart lubricity, and specific examples thereof include silica, calcium carbonate, magnesium carbonate, barium carbonate, calcium sulfate, calcium phosphate, magnesium phosphate, and the like. Examples include particles of kaolin, aluminum oxide, titanium oxide, and the like. Further, heat-resistant organic particles described in JP-B-59-5216 and JP-B-59-217755 may be used. Examples of other heat-resistant organic particles include thermosetting urea resin, thermosetting phenol resin, thermosetting epoxy resin, benzoguanamine resin, and the like. Further, during the polyester production process, precipitated particles in which a part of a metal compound such as a catalyst is precipitated and finely dispersed can be used.
- the shape of the above-mentioned particles is not particularly limited, and may be any of a sphere, a lump, a rod, a flat shape, and the like. There is no particular limitation on the hardness, specific gravity, color and the like. These particles may be used in combination of two or more as necessary.
- the average particle size of the above-mentioned particles is usually 0.1 to 5 ⁇ m, preferably 0.5 to 3 ⁇ m, and more preferably 0.5 to 2 m. If the average particle size is less than 0.1 m, the particles tend to agglomerate and the dispersibility may be insufficient. If the average particle size is more than 5 m, the surface roughness of the film becomes too coarse. Problems may occur when a release layer is provided.
- the particle content in the polyester is usually in the range of 0.01 to 5% by weight, preferably 0.01 to 3% by weight. If the particle content is less than 0.01% by weight, the lubricity of the film may be insufficient, and if it exceeds 5% by weight, the smoothness of the film surface may be insufficient.
- the method for adding the particles to the polyester is not particularly limited, and a conventionally known method can be employed.
- it can be added at any stage of producing the polyester.
- it is a stage of transesterification or a stage of proceeding the polycondensation reaction after the end of the transesterification reaction.
- a method of blending a polyester slurry with particles of particles dispersed in an appropriate medium such as ethylene glycol or water is used.
- a method of blending dried particles with a polyester raw material using a kneading extruder is used.
- the thickness of the polyester film is preferably thinner, particularly in consideration of light release of the releasability from the ceramic sheet, in order to reduce the influence of the film stiffness.
- the thickness of the polyester film is usually in the range of 9.1 to 50 ⁇ m, preferably in the range of 9.1 to 38 ⁇ m.
- the film thickness unevenness in the longitudinal direction and the width direction of the polyester film is usually 5% or less, preferably 3% or less. Specific methods to reduce the film thickness unevenness to 5% or less include:
- a method employing a simultaneous biaxial stretching method may be used.
- the obtained ceramic sheet is Large thickness unevenness
- a method of using a polyester raw material described above and cooling and solidifying a molten sheet extruded with a die roll with a cooling roll to obtain an unstretched sheet is preferable.
- an electrostatic application adhesion method and a Z or liquid application adhesion method which preferably increase the adhesion between the sheet and the rotary cooling drum, are preferably employed.
- the obtained unstretched sheet is stretched biaxially as follows.
- the unstretched sheet is stretched in one direction by a roll or tenter type stretching machine.
- the stretching temperature is usually 70-120 ° C, preferably 80-110 ° C, and the stretching ratio is It is usually 2.5-7 times, preferably 3.0-6 times.
- the film is stretched in a direction orthogonal to the stretching direction of the first step.
- the stretching temperature is usually 130 to 170 ° C., and the stretching ratio is usually 3.0 to 7 times, preferably 3.5 to 6 times.
- heat treatment is performed at a temperature of 180 to 270 ° C. under tension or relaxation within 30% to obtain a biaxially oriented film.
- the simultaneous biaxial stretching method is a method in which the unstretched sheet is stretched at 70 to 120 ° C, preferably 80 to 110 ° C, and simultaneously stretched in the machine direction and the width direction.
- the stretching magnification is usually 4 to 50 times, preferably 7 to 35 times, and more preferably 10 to 25 times as an area magnification.
- a heat treatment is performed at a temperature of 170 to 250 ° C under tension or relaxation within 30% to obtain a stretched oriented film.
- a simultaneous biaxial stretching apparatus using the above stretching method a conventionally known stretching method such as a screw method, a pantograph method, or a linear motor method can be employed.
- the “screw method” is a method in which a clip is placed in the groove of a screw to increase the clip interval.
- the “pantograph method” is a method in which a clip interval is widened using a pantograph.
- the “linear motor system” is a system that can individually control clips by applying the principle of a linear motor, and has the advantage that the clip interval can be adjusted arbitrarily.
- Simultaneous biaxial stretching may be performed in two or more stages. In such a case, the stretching may be performed in one tenter, or a plurality of tenters may be used together! .
- simultaneous biaxial stretching has a good stretch following property, so that it is possible to further increase the stretching ratio in the longitudinal direction and width direction of the film as compared with sequential biaxial stretching, and furthermore, it is possible to further increase the film thickness. It is possible to produce a polyester film with small unevenness.
- a so-called coating and stretching method in which the surface of the film is treated during the above-described stretching step of the polyester film can be employed.
- the first-stage stretching is completed, and the coating is performed before the second-stage stretching.
- polyester films can also be used as the base film of the release film.
- examples of such commercially available products include “T300” (a laminated product having a thickness of 30 ⁇ m and a flat grade having a PV value of 400 nm or less) and “T100” (a thickness of 38 mm) manufactured by Mitsubishi Iridaku Polyester Film Co., Ltd.
- the type of the constituent material (release agent) of the release layer in the present invention is not particularly limited, but from the viewpoint of good release properties, the release agent containing the curable silicone resin is preferably a release agent. The properties are good.
- any of a curing reaction type such as an addition type, a condensation type, an ultraviolet curing type, an electron beam curing type, and a solventless type can be used.
- the addition type is preferable because the curing reaction is quick.
- the type composed of an ultraviolet curing type, an electron beam curing type, and a solventless type is preferable because it can be cured at a lower temperature.
- a release control agent or the like may be used in combination within a range that does not impair the gist of the present invention!
- the coating amount (after drying) of the release layer is usually 0.005 to lgZm 2 , preferably 0.005 to 0.5 g, more preferably 0.005 to 0.5 lg / m 2 , and most preferably. ⁇ or 0. 005- is in the range of 0. 08g / m 2. If the coating amount (after drying) of the release layer is less than 0.005 gZm 2 , stability may be lacking in terms of coating properties, and it may be difficult to obtain a uniform coating film. On the other hand, when the coating amount exceeds lg Zm 2 , the coating film adhesion, curability, and the like of the release layer itself may be reduced.
- a conventionally known coating method such as reverse gravure coating, direct gravure coating, bar coating, and die coating can be employed.
- An example of the coating method is described in "Coating Method” (published by Yuji Harazaki, Bookstore, 1979).
- the polyester film of the present invention may be subjected to a surface treatment such as a corona treatment and a plasma treatment in advance. Further, a coating layer such as an adhesive layer and an antistatic layer may be provided in advance on the polyester film in the present invention.
- the release layer in the present invention may be provided on a polyester film by the above-mentioned coating and stretching method (in-line coating).
- the maximum roughness (Rmr) of the release layer surface is 700 or less, preferably 500 nm or less, and more preferably 300 nm or less.
- the lower limit of the maximum roughness of the release layer surface is usually 50 nm in consideration of the winding property and transportability of the release film.
- the maximum roughness (R) of the surface (rear surface) on which the release layer is not provided is not provided.
- mb is preferably at least 300 nm in order to improve the film winding property and transportability. If the maximum roughness of the back surface is less than 300 nm, the back surface may be too flat, causing problems such as reduced slipperiness.
- the upper limit of the maximum roughness of the rear surface is usually 700 nm, taking into account the transfer of the roughness of the release film to the ceramic layer surface after winding the green sheet.
- the ratio of the peeling force at different peeling speeds that is, the peeling speeds of 300 (mZmin) and 30 (mZmin) under the high-speed peeling region where the peeling speed is 30 (mZmin) or more )
- the ratio of the peeling force (m NZcm) between the release layer surface and the acrylic pressure-sensitive adhesive tape: F300ZF30 is 2.0 or less, preferably 1.5 or less.
- the release film of the present invention As a specific method for the release film of the present invention to satisfy the above conditions, for example, when the release layer contains a curable silicone resin, a so-called T unit (one unit) is used as a repeating unit. (SiO 2) method using a silicone compound having a structure. It is. Note that the above chemical formula shows that three oxygen atoms (O) directly connected to Si
- silicone compound having a T unit structure examples include a non-solvent type silicone resin having a branched structure and a solvent type silicone resin having a branched structure.
- the ratio of the silicone compound having a T unit in the release layer is usually 30% by weight or more, preferably 50% by weight or more.
- the proportion of the silicone compound having a T unit is less than 30% by weight, light release is insufficient in a high-speed release region, and it may be difficult to obtain a desired release force.
- the peeling force F300 is usually 200 (mNZcm), preferably 150 (mNZcm) or less. If the F300 force exceeds 200 (mNZcm), peeling may be difficult when peeling the ceramic sheet.
- the release film of the present invention enables further light peeling in the peeling step employing the surface peeling method.
- the residual adhesion rate of the release layer is usually 90% or more, preferably 95% or more, in order to suppress the transfer or transfer of the release component to the ceramic sheet surface. is there. If the residual adhesion rate is less than 90%, the migration of the release component to the surface of the ceramic sheet in contact with the release layer surface of the release film will increase, causing problems such as a decrease in the adhesive strength between the sheets when laminating the ceramic sheets. May occur.
- the measuring method used in the present invention is as follows.
- the resin sheet was fixed to the “Intesco Model 2001” manufactured by Intesco Co., Ltd. so that the resin sheet side was the top side, and At a peeling speed of 400 mmZmin in the vertical direction, the release layer surface force also peeled the resin sheet. Peeling after repeating the same operation 10 times Using the success rate (%), judgment was made according to the judgment criteria shown in Table 2. Only when the resin sheet was completely peeled off from the surface of the release layer of the release film, it was determined that “peeling was successful”. When peeling partially or when peeling was difficult, it was judged as "peeling failed"
- the non-contact surface measurement system ⁇ Micromap512 made by Micromap '' using direct phase detection interferometry (so-called two-beam interferometry utilizing Michelson interference) provides the maximum roughness of the release layer surface of the release film. (Rmr) and the maximum roughness of the back surface (Rmb) were measured.
- the measurement wavelength was 554 nm, an objective lens with a magnification of 20 was used, and 20 visual fields were measured. The average value was used.
- the release layer of the release film was measured under the measurement conditions shown in Table 3 by the FP (Fundamental Parameter Method) method. Measure the amount of silicon element on the surface and back surface provided, and release the mold based on the difference. The coating amount (Si) (gZm 2 ) as a unit was calculated.
- Nitto Denko (manufacturer) No. 3 IB adhesive tape is pressed back and forth with a 2kg rubber roller once on the release layer surface of the sample film, and heat treated at 100 ° C for 1 hour.
- the No. 31B adhesive tape is peeled off from the crimped sample, and the adhesive strength is measured according to the method of JIS-C-2107 (adhesive strength to stainless steel plate, 180 ° peeling method). This is defined as the residual adhesive strength. The measurement was 20 ⁇ 2. C, 65 ⁇ 5% RH.
- Residual adhesion ratio The residual adhesion ratio is determined by using the above measured values and based on the following equation.
- a release film cut into a length of 30 mm and a length of 3 m was used as a sample, and measured with a continuous film thickness measuring device (using an electronic micrometer) manufactured by Anritsu Electric Co., and the film thickness unevenness was calculated by the following formula. For example, if the release film is A4 size, The cut samples can be joined together to secure a measurement length of 3m (excluding the joint).
- Thickness unevenness (%) [(maximum thickness-minimum thickness) / average thickness] X 100
- a ceramic slurry having the composition shown in Table 4 is applied to the release layer surface of the release film so as to be 5 m in a wet state, and a green sheet is formed.
- the thickness of the ceramic layer in the vertical and horizontal directions on the release film was measured using a non-contact) 8-wire thickness gauge, and the results were used to make a judgment based on the criteria shown in Table 5. went.
- the surface (measurement area lm 2 ) of the ceramic layer obtained by the above-described method was observed by a scanning laser microscope (manufactured by Lasertec), and judged according to the criteria shown in Table 6.
- Production Example 1 was repeated, except that 20000 ppm of calcium carbonate particles having an average particle size of 0 was used instead of 20000 ppm of aluminum oxide particles having an average particle size of 0.2 m. 65 dlZg of polyethylene terephthalate A3 was obtained.
- Production Example 1 was repeated except that aluminum oxide particles having an average particle diameter of 0.2 m were replaced by 20000 ppm of aluminum oxide particles having an average particle diameter of 0.2 m, and 80000 ppm of silicon dioxide particles having an average particle diameter of 1 were used. Polyethylene terephthalate A4 having a viscosity of 0.65 dlZg was obtained.
- the limiting viscosity was set to 0 in the same manner as in Preparation Example 5, except that 20000 ppm of amorphous silica particles having an average particle size of 2.4 ⁇ m were added after the transesterification reaction and before the polymerization reaction. 65 dlZg of polyester B3 was obtained.
- polyethylene terephthalate A1 was dried in an inert gas atmosphere at 180 ° C for 4 hours, melted at 290 ° C with a melt extruder, and extruded with a die cap. It was cooled and solidified on a cooling roll set at C to obtain an unstretched sheet. Next, the unstretched sheet is guided to a tenter, and simultaneously biaxially stretched at 90 ° C by 4.5 times in the machine direction and 4.8 times in the transverse direction. A 38 ⁇ m PET film F1 was obtained.
- a release agent having the composition shown in Table 7 was applied to the PET film F1 so that the applied amount (after drying) was 0.1 lgZm 2, and heat-treated at 120 ° C. for 30 seconds. Thereafter, a release film was obtained.
- Example 1 except that polyethylene terephthalate A2 was used in place of polyethylene terephthalate A1 to obtain a PET film F2 having a thickness of 38 m, coating and heat treatment were performed in the same manner as in Example 1. A release film was obtained.
- Example 1 except that polyethylene terephthalate A3 was used instead of polyethylene terephthalate A1 to obtain a PET film F3 having a thickness of 38 m, a coating and heat treatment was performed in the same manner as in Example 1. A release film was obtained.
- polyethylene terephthalate A2 was dried at 180 ° C for 4 hours in an inert gas atmosphere, melted at 290 ° C by a melt extruder, and the die force was also extruded. It was cooled and solidified on a cooling roll set at 40 ° C to obtain an unstretched sheet. Next, the unstretched sheet was stretched 3.5 times in the machine direction at 85 ° C. Then, the obtained film was guided to a tenter, stretched 3.8 times in the transverse direction at 85 ° C, and heat-set at 230 ° C to obtain a PET film F4 having a thickness of 38 m.
- a release agent having the same composition as that used in Example 1 was applied to the PET film F4 so that the coating amount (after drying) was 0.1 lgZm 2 , After heat treatment for a second, a release finolem was obtained.
- Example 1 was the same as Example 1 except that the composition of the release agent was changed to the composition shown in Table 8. Thus, a release film was obtained.
- polyethylene terephthalate A1 was dried in an inert gas atmosphere at 180 ° C for 4 hours, melted at 290 ° C with a melt extruder, and extruded with a die cap. It was cooled and solidified on a cooling roll set at C to obtain an unstretched sheet.
- the release agent (solvent-free type) having the composition shown in Table 9 was applied to the unstretched sheet so that the coating amount (after drying) was 0.1 (g / m 2 ). Led to. Then, it was simultaneously biaxially stretched at 90 ° C by 4.5 times in the machine direction and 4.8 times in the transverse direction, and then heat-set at 230 ° C to obtain a release film.
- the thickness of the PET film was 38 ⁇ m.
- Example 4 a release film was obtained in the same manner as in Example 4, except that polyethylene terephthalate A4 was used instead of polyethylene terephthalate A2. The obtained release film was not suitable for forming a ceramic sheet of a thin film having a large surface roughness.
- Comparative Example 2 Comparative Example 2:
- a release film was obtained in the same manner as in Example 1 except that the composition of the release agent was changed to the composition shown in Table 10.
- Example 1 60 2.4 2.3 98 Example 2 62 2.5 2.4 98 Example 3 62 2.4 2.3 98 Example 4 62 3.2 3.1 98 Example 5 52 2.4 2.3 96 Example 6 76 2.4 2.3 102 Comparative Example 1 65 3.2 3.1 98 Comparative Example 2 36 2.4 2.3 96
- the film is stretched at 100 ° C through a preheating step in a tenter at a transverse stretching ratio of 4.8 times at 210 ° C. Heat treatment was performed for 10 seconds to obtain a 38 m PET film F1. Table 14 shows the thickness of each layer of the polyester film.
- a release agent having the composition shown in Table 7 above was applied to the flat surface side (C layer) of the PET film F1 so that the coating amount (after drying) was 0.1 lgZm 2 , C, After heat treatment for 30 seconds, a release film was obtained.
- Example 7 the raw materials were changed to the raw materials shown in Table 14, and the raw materials were supplied to each of three vented twin-screw extruders so as to obtain the respective raw materials.
- Layers C and C as outermost layers (surface layer) and Layer B as an intermediate layer, on a casting drum cooled to 20 ° C, co-extruded in a three-layer structure and cooled and solidified to obtain a non-oriented sheet.
- a PET film F2 of 38 / zm was obtained in the same manner as in Example 7, except that the stretching ratio was changed to 2.8.
- Table 14 below shows the thickness of each layer of the polyester film.
- coating and heat treatment were performed in the same manner as in Example 7, to obtain a release film.
- Example 7 a 38 m laminated PET film F3 was obtained in the same manner as in Example 7, except that the raw material composition shown in Table 14 was changed and the heat treatment temperature after stretching was set to 200 ° C. Table 14 shows the thickness of each layer of the polyester film. Next, coating and heat treatment were performed in the same manner as in Example 7, to obtain a release film.
- Example 7 a 38 m laminated PET film F4 was obtained in the same manner as in Example 7, except that the raw material composition shown in Table 14 was changed and the heat treatment temperature after stretching was set to 200 ° C. Table 14 shows the thickness of each layer of the polyester film. Then, as in Example 7 And heat-treated to obtain a release film.
- Example 7 a release film was obtained in the same manner as in Example 7, except that the composition of the release agent shown in Table 5 was changed.
- Example 7 the raw material composition of the A layer, the B layer, and the C layer was as shown in Table 14, and the longitudinal stretching ratio and the transverse stretching ratio were both 4.0 times. To obtain a PET film F5. Table 14 below shows the thickness of each layer of the polyester film. Next, coating and heat treatment were performed in the same manner as in Example 7 to obtain a release film.
- a PET film F6 was obtained in the same manner as in Example 7, except that the transverse stretching ratio was changed to 3.0 times.
- Table 14 below shows the thickness of each layer of the polyester film.
- coating and heat treatment were performed in the same manner as in Example 7 to obtain a release film.
- Example 7 the raw material composition of the A layer, the B layer, and the C layer was as shown in Table 14, and the longitudinal stretching ratio and the transverse stretching ratio were both 4.0 times. Thus, a PET film F6 was obtained. Table 14 below shows the thickness of each layer of the polyester film. Next, a coating and heat treatment was performed in the same manner as in Example 7 to obtain a release film. The resulting release film was unsuitable for forming a thin ceramic sheet having a large surface roughness.
- Example 7 Thickness unevenness Surface flatness
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Producing Shaped Articles From Materials (AREA)
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005515392A JPWO2005046986A1 (ja) | 2003-11-14 | 2004-07-02 | セラミックグリーンシート成形用離型フィルム |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003385021 | 2003-11-14 | ||
JP2003-385021 | 2003-11-14 | ||
JP2003421894 | 2003-12-19 | ||
JP2003-421894 | 2003-12-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005046986A1 true WO2005046986A1 (ja) | 2005-05-26 |
Family
ID=34593958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/009420 WO2005046986A1 (ja) | 2003-11-14 | 2004-07-02 | セラミックグリーンシート成形用離型フィルム |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2005046986A1 (ja) |
WO (1) | WO2005046986A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010234644A (ja) * | 2009-03-31 | 2010-10-21 | Mitsubishi Plastics Inc | 両面離型フィルム |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000025163A (ja) * | 1998-07-09 | 2000-01-25 | Toyobo Co Ltd | 離型フィルム |
JP2002160208A (ja) * | 2000-11-27 | 2002-06-04 | Mitsubishi Polyester Film Copp | 離型フィルム用ポリエステルフィルム |
JP2003191384A (ja) * | 2001-12-26 | 2003-07-08 | Mitsubishi Polyester Film Copp | 離型フィルム用ポリエステルフィルム |
JP2004188814A (ja) * | 2002-12-12 | 2004-07-08 | Mitsubishi Polyester Film Copp | 離型フィルム |
JP2004196856A (ja) * | 2002-12-16 | 2004-07-15 | Mitsubishi Polyester Film Copp | 離型フィルム用ポリエステルフィルム |
JP2004195750A (ja) * | 2002-12-17 | 2004-07-15 | Mitsubishi Polyester Film Copp | 薄膜グリーンシート成形用離型フィルム |
JP2004202703A (ja) * | 2002-12-24 | 2004-07-22 | Mitsubishi Polyester Film Copp | 薄膜グリーンシート成形用離型フィルム |
-
2004
- 2004-07-02 JP JP2005515392A patent/JPWO2005046986A1/ja not_active Withdrawn
- 2004-07-02 WO PCT/JP2004/009420 patent/WO2005046986A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000025163A (ja) * | 1998-07-09 | 2000-01-25 | Toyobo Co Ltd | 離型フィルム |
JP2002160208A (ja) * | 2000-11-27 | 2002-06-04 | Mitsubishi Polyester Film Copp | 離型フィルム用ポリエステルフィルム |
JP2003191384A (ja) * | 2001-12-26 | 2003-07-08 | Mitsubishi Polyester Film Copp | 離型フィルム用ポリエステルフィルム |
JP2004188814A (ja) * | 2002-12-12 | 2004-07-08 | Mitsubishi Polyester Film Copp | 離型フィルム |
JP2004196856A (ja) * | 2002-12-16 | 2004-07-15 | Mitsubishi Polyester Film Copp | 離型フィルム用ポリエステルフィルム |
JP2004195750A (ja) * | 2002-12-17 | 2004-07-15 | Mitsubishi Polyester Film Copp | 薄膜グリーンシート成形用離型フィルム |
JP2004202703A (ja) * | 2002-12-24 | 2004-07-22 | Mitsubishi Polyester Film Copp | 薄膜グリーンシート成形用離型フィルム |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010234644A (ja) * | 2009-03-31 | 2010-10-21 | Mitsubishi Plastics Inc | 両面離型フィルム |
Also Published As
Publication number | Publication date |
---|---|
JPWO2005046986A1 (ja) | 2007-05-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR20160021754A (ko) | 이형용 이축 배향 적층 폴리에스테르 필름 | |
JP2001246698A (ja) | 離型フィルム | |
WO2000021752A1 (fr) | Film a couche detachable | |
JP2006051661A (ja) | 離型フィルム | |
KR101600104B1 (ko) | 이형 필름 | |
JP5420454B2 (ja) | 偏光板用離型フィルム | |
JP3948333B2 (ja) | セラミック離型用ポリエステルフィルム | |
WO2009088094A1 (ja) | 離型フィルム | |
JP2006051681A (ja) | 離型フィルム | |
JP4216962B2 (ja) | 離型フィルム | |
JP2004188814A (ja) | 離型フィルム | |
JP4311008B2 (ja) | セラミックシート製造用離型フィルムロール、セラミックシート製造用離型フィルム積層体ロール、及びセラミックシートの製造方法 | |
JP2004311200A (ja) | 両面離型フィルム | |
JP3962161B2 (ja) | セラミックコンデンサー製造用キャリヤーシート | |
JP2004306344A (ja) | 離型フィルム | |
JP6481725B2 (ja) | グリーンシート成形用離型フィルム | |
JP6206165B2 (ja) | 転写箔用フィルム | |
WO2005046986A1 (ja) | セラミックグリーンシート成形用離型フィルム | |
JP4391858B2 (ja) | グリーンシート成形用離型フィルム | |
JP2004291240A (ja) | 離型フィルム | |
JP2009184339A (ja) | 離型フィルム | |
WO2005087493A1 (ja) | グリーンシート成形用離型フィルム | |
JP3918547B2 (ja) | セラミックシート製造用離型フィルムの製造方法及びフィルム積層体の製造方法 | |
JP3797185B2 (ja) | 剥離性積層フィルムおよびそれを用いたセラミックグリーンシート用工程フィルム | |
JP4391859B2 (ja) | 薄膜グリーンシート成形用離型フィルム |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 2005515392 Country of ref document: JP |
|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
122 | Ep: pct application non-entry in european phase |