WO2005038895A1 - 液供給方法および装置 - Google Patents
液供給方法および装置 Download PDFInfo
- Publication number
- WO2005038895A1 WO2005038895A1 PCT/JP2004/015644 JP2004015644W WO2005038895A1 WO 2005038895 A1 WO2005038895 A1 WO 2005038895A1 JP 2004015644 W JP2004015644 W JP 2004015644W WO 2005038895 A1 WO2005038895 A1 WO 2005038895A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- liquid
- supply
- supplied
- main fluid
- flow pipe
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 161
- 238000000034 method Methods 0.000 title claims abstract description 35
- 229910021642 ultra pure water Inorganic materials 0.000 claims abstract description 61
- 239000012498 ultrapure water Substances 0.000 claims abstract description 61
- 239000012530 fluid Substances 0.000 claims abstract description 57
- 239000000243 solution Substances 0.000 claims description 25
- 239000012510 hollow fiber Substances 0.000 claims description 16
- 239000008151 electrolyte solution Substances 0.000 claims description 8
- 239000003792 electrolyte Substances 0.000 claims description 5
- 239000012527 feed solution Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 18
- 238000004140 cleaning Methods 0.000 abstract description 15
- 238000002360 preparation method Methods 0.000 abstract description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 31
- 235000011114 ammonium hydroxide Nutrition 0.000 description 28
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 26
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 11
- 229910021529 ammonia Inorganic materials 0.000 description 8
- 239000012776 electronic material Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000012982 microporous membrane Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
- B01F25/30—Injector mixers
- B01F25/31—Injector mixers in conduits or tubes through which the main component flows
- B01F25/315—Injector mixers in conduits or tubes through which the main component flows wherein a difference of pressure at different points of the conduit causes introduction of the additional component into the main component
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J4/00—Feed or outlet devices; Feed or outlet control devices
- B01J4/02—Feed or outlet devices; Feed or outlet control devices for feeding measured, i.e. prescribed quantities of reagents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/02—Burettes; Pipettes
- B01L3/0289—Apparatus for withdrawing or distributing predetermined quantities of fluid
- B01L3/0293—Apparatus for withdrawing or distributing predetermined quantities of fluid for liquids
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
- Y10T137/0329—Mixing of plural fluids of diverse characteristics or conditions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/206—Flow affected by fluid contact, energy field or coanda effect [e.g., pure fluid device or system]
- Y10T137/2076—Utilizing diverse fluids
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/87571—Multiple inlet with single outlet
- Y10T137/87676—With flow control
Definitions
- the present invention relates to a method and an apparatus for supplying a liquid used for preparing a solution.
- a liquid to be supplied such as an aqueous electrolyte solution is supplied to a main fluid such as ultrapure water, and can be used as washing water for electronic materials.
- the present invention relates to a liquid supply method and an apparatus used for preparing a novel solution.
- this cleaning method has the disadvantages of requiring enormous costs for treating chemicals, ultrapure water, waste liquids, etc., and also having a large burden on the environment.
- a chemical solution containing an acid or an alkaline solution is added to ultrapure water, and based on the electric conductivity of the ultrapure water containing the chemical solution.
- a device for preparing electronic material cleaning water having a chemical solution supply device for controlling the supply amount of a chemical solution (see Japanese Patent Application Laid-Open No. 2000-2008847).
- the above-mentioned conventional method is excellent in precise concentration control, but may cause concentration hunting when a flow rate fluctuation occurs in ultrapure water in actual use. Also, the equipment becomes complicated and the cost increases.
- the aim is to provide a supply method and a device that can be defined. Disclosure of the invention
- the inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, the use of a small-diameter liquid supply pipe such as a hollow-fiber tubular body has made it possible to easily supply a small amount of liquid to be supplied.
- the present inventors have found that they can be determined accurately and accurately, and have completed the present invention based on this finding.
- the present invention relates to a liquid supply method for supplying a liquid to be supplied to a main fluid flowing through a main fluid flow pipe to prepare a solution, comprising: a supply section for sending a liquid to be supplied; and a supply section from the supply section.
- a liquid supply apparatus for supplying a liquid to be supplied to a main fluid flowing through a main fluid flow pipe to prepare a solution, comprising: a supply section for sending the liquid to be supplied; A supply liquid flow pipe for flowing the supply liquid toward the main fluid flow pipe; an inner diameter of the supply liquid flow pipe is set to 0.01 to 1 mm; When supplying from the supply section to the main fluid flow pipe through the supplied liquid flow pipe, the pressure P 1 of the liquid to be supplied in the supply section is compared with the pressure P 2 of the main fluid in the main fluid flow pipe.
- a liquid supply device that can be set to satisfy the following equation.
- the pressure P of the supply liquid in the supply section is used. 1 and the pressure P 2 of the main fluid in the main fluid flow pipe should satisfy P 1 ⁇ P 2> 0.
- the supply amount of the liquid to be supplied can be set using the pressure difference between the upstream side and the downstream side of the liquid supply pipe.
- FIG. 1 is an explanatory diagram of the Hagen-Poiseuille (Hagen-Poise11e) rule used in the liquid supply method of the present invention.
- FIG. 2 is a schematic configuration diagram illustrating an example of the liquid supply device of the present invention.
- the liquid supply method of the present invention is a method for supplying a main fluid flowing through a main fluid flow pipe, and supplying a liquid to be supplied, wherein a liquid is supplied between a supply section for delivering the liquid to be supplied and the main fluid flow pipe.
- the supply amount of the liquid to be supplied is set using a liquid supply device provided with the liquid supply pipe and the differential pressure between the upstream side and the downstream side of the liquid supply pipe.
- the supply liquid flow pipe is formed in a hollow fiber shape.
- Hollow fiber refers to a fibrous tubular structure with a hollow interior.
- the use of the hollow fiber flow pipe facilitates the installation of the liquid supply device. That is, by selecting the inner diameter, length, and number of the hollow fiber flow pipes, it becomes easy to set the supply amount of the liquid to be supplied to an appropriate value.
- the inner diameter of the flow pipe for the liquid to be supplied is 0.01 to: L mm (10 to: 10 ⁇ 0 ⁇ ), preferably 0.05 to 0.5 mm (50 to 50 mm). 0 / im).
- the inside diameter is less than the above range, the flow resistance increases and the flow rate setting of the supply liquid becomes difficult. If the inner diameter exceeds the above range, the accuracy of setting the flow rate of the liquid to be supplied decreases.
- a separation membrane for example, a microporous membrane, a homogeneous membrane, a heterogeneous membrane, a composite membrane, a sandwich membrane, or the like can be used as the hollow fiber-shaped flow pipe for the liquid to be supplied.
- the sandwich film include a sandwich film having a structure in which an intermediate film made of a polyurethane resin or the like is sandwiched between two microporous film layers made of a polypropylene resin or the like.
- hollow fiber fibers used for clothing and industrial purposes can be used.
- the material of the supply pipe for liquid to be supplied is preferably other than metal when used for the preparation of washing water for electronic materials.
- a material having excellent durability against an aqueous electrolyte solution is preferable.
- polytetrafluoroethylene, perfluoroalkoxyfluorine Various fluororesins such as resin and polyhexafluoropropylene; various polyolefin resins such as polyptene resin, silicone resin, polyethylene resin, polypropylene resin and poly (4-methylpentene1-1) resin Materials are preferably used. Among them, poly (4-methylpentene-11) -based resin is particularly preferred.
- the main fluid flow pipe through which the main fluid such as ultrapure water flows usually has an inner diameter of 1 inch (about 25.4 mm) or less.
- the liquid supply method of the present invention is a method utilizing Hagen-Poisele's law regarding the pressure loss of a laminar flow in a pipeline.
- the loss head H (pressure loss) of a fluid flowing through a circular pipe can be expressed by equation (1) in the case of laminar flow, and the length of the circular pipe is expressed by equation (1) ) Is transformed into Eq. (4).
- Table 1 shows the meanings and units of the symbols in the formula.
- the length L of the circular pipe can be calculated by the above equation (5).
- the length, inner diameter, and number of circular pipes (supply liquid circulation pipes) necessary to obtain the desired flow rate of the liquid (supply liquid) can be obtained based on Equation (5).
- the actual hollow fiber conduit may not have a strictly circular cross section, or the conduit cross-sectional area may not be constant. Therefore, it is preferable to create a hollow fiber tubular body with the length calculated from equation (4) force, determine the flow coefficient by testing, and accurately calculate and adjust the required length.
- the length of the pipeline is proportional to the fourth power of the diameter of the pipeline, so if the diameter of the pipeline differs by 10%, the length of the pipeline will differ by 46.4%.
- the liquid to be supplied can be supplied to the main fluid in the main fluid flow pipe ⁇ ⁇ ⁇ by a differential pressure.
- the pressure P1 is preferably set such that P1ZP2 is 1.01 to: L0, preferably 1.05 to: 10, and more preferably 1.1 to 5.
- ammonia water supplied liquid
- ultrapure water main fluid
- ammonia solution ammonia-containing ultrapure water
- the pressure P1 of the liquid to be supplied in the supply section is set appropriately, the supply amount of the liquid to be supplied can be accurately determined without performing feed knock control, and the amount of liquid that can provide a sufficient cleaning effect The liquid to be supplied can be supplied.
- Ultrapure water can be exemplified as the main fluid, and an aqueous electrolyte solution can be exemplified as the liquid to be supplied.
- Acid or acid can be used as the electrolyte.
- Acids include hydrochloric acid, sulfuric acid, hydrogen fluoride, nitric acid, and carbonic acid (carbon dioxide).
- Examples of the alkali include ammonia, potassium hydroxide, and sodium hydroxide.
- the electrolyte concentration of the main fluid (ultra pure water) supplied with the liquid to be supplied (aqueous electrolyte solution) is too low, the cleaning effect is reduced, and if it is too high, the electronic material may be deteriorated. . 1% by weight, preferably 0.0001 to 0.01 mass 0/0 good suitable.
- the ratio ⁇ // ⁇ between the flow rate X of the liquid to be supplied and the flow rate ⁇ of the main fluid ⁇ // ⁇ is too low, the cleaning effect is reduced, and if it is too high, the electronic material may be deteriorated. 1000, preferably f / 100,000 to 1/1000, and more preferably lZ500,000 to l / 2500.
- the liquid supply method of the present invention is particularly effective when the supply amount of the liquid to be supplied is 0.0 O 1 to 10 cm 3 / min. This is because it is difficult to manufacture a flow control valve capable of stably setting the flow rate of the liquid to be supplied to this range.
- Example 1 Example 1
- Ultrapure water having a specific resistance at 18.degree. The flow rate was varied stepwise every minute. Supply water pressure is 0. 20MP a 'G ( 2 kgf / cm 2 - G) was.
- aqueous electrolyte solution a 29% aqueous ammonia solution was used.
- a 29 wt% aqueous ammonia solution is added to ultrapure water to design a flow pipe (circular pipe) for the liquid to be supplied to prepare a 6 mg / liter aqueous ammonia solution.
- equation (7) is derived.
- Table 2 shows the symbols and units in equations (6) and (7).
- the test was performed by changing the differential pressure ( ⁇ ) in the range of 0.05 to 0.1 MPa.
- the flow rate error between the calculated and measured values was 17-27%. From this result, it can be seen that even if it is assumed that all errors are caused by the diameter error of the hollow fiber tubular body, the diameter error is only 6%.
- the hollow fiber tubular body can be sufficiently used for the liquid supply device.
- a liquid supply device using two hollow fiber-like tubular members made of poly 4-methylpentene 1 having an inner diameter of 0.1 mm and a length of 30 Omm was prepared.
- the ultrapure water flow rate was increased and decreased in steps of 0.5 to 9 liters / minute in 0.5 liter / minute steps at a water pressure of 0.2 MPa ⁇ G.
- the flow rate was varied stepwise every minute.
- the ammonia water was pressurized at 0.25 MPa a 'G in the supply section, the ammonia water was added to the ultrapure water due to the pressure difference between the pressure of the ammonia water and the pressure of the ultrapure water.
- a liquid supply device using a general-purpose tube in place of the supply liquid flow tube formed of a hollow fiber tubular body was manufactured.
- a liquid supply device for preparing an aqueous ammonia solution of 600 mg / liter corresponding to 100 times the aqueous ammonia solution of 6 mg / liter prepared in the example was prepared.
- the physical properties of the 29 wt% ammonia aqueous solution are as follows.
- the tube length may be 4 Om, but with such a small pressure difference, a sufficient amount of water supply can be obtained. I can't get it. Further, when the pressure fluctuation of the ultrapure water occurs, the ultrapure water may flow back into the aqueous ammonia solution.
- Ultrapure water having a specific resistance of 18.2 ⁇ ⁇ cm at 25 ° C was used as the main fluid.
- a liquid supply apparatus using a supply liquid flow pipe composed of a hollow fiber tubular body was manufactured.
- the liquid supply device 1 shown here includes a supply section 3 for sending a liquid to be supplied, and a supply section 3 A supply liquid flow pipe 4 for flowing the supply liquid toward the main fluid flow pipe 2 is provided.
- the supply liquid flow pipe 4 is a hollow fiber tubular body made of poly 4-methylpentene 1 having an inner diameter of 0.1 mm and a length of 300 mm. In the liquid supply apparatus 1, two flow pipes 4 for the liquid to be supplied were used.
- the ultrapure water flow rate was varied within a range of 12 to 24 liters (12, 18, and 24 liters Z) at a water pressure of 0.2 to 0.3 MPa.G.
- the ammonia water was pressurized in the supply section 3 at a pressure 0.1 MPa higher than the water pressure of the ultrapure water (0.27 MPa).
- the pressure difference was not adjusted, but ammonia was added by the pressure difference between the ammonia water pressure and the ultrapure water pressure.
- the specific resistance value and pH of the obtained ultrapure water to which ammonia water was added were measured using a specific resistance meter and pH meter, respectively.
- ultrapure water containing ammonia water obtained under the same conditions was sampled three times, one liter at a time, and this was used as the measurement target.
- Table 4 shows the results. From this table, an aqueous ammonia solution with stable specific resistance and pH was obtained with good reproducibility regardless of the ultrapure water flow rate.
- a liquid supply device was manufactured using the supply liquid distribution pipe 4 formed of a hollow fiber-shaped tubular body made of poly 4-methylpentene 1 having a diameter of 0.1 mm and a length of 300 mm.
- the liquid supply device 1 four supply pipes 4 for the liquid to be supplied were used.
- the ultrapure water flow rate was varied in the range of 12 to 24 liters / minute (12, 18, and 24 liters / minute) at a water pressure of 0.2 to 0.3 MPa.G.
- the flow rate of the ultrapure water was 12 liters Z
- the ammonia water was pressurized at the supply unit 3 at a pressure approximately 0.1 MPa higher than the water pressure of the ultrapure water (0.27 MPa).
- the pressure difference was not adjusted, but ammonia was added due to the pressure difference between the ammonia water pressure and the ultrapure water pressure.
- the specific resistance value and the ammonia concentration of the obtained ultrapure water added with aqueous ammonia were measured with a specific resistance meter and a pH meter, respectively.
- ultrapure water containing ammonia water obtained under the same conditions was rubbed three times, one liter at a time, and this was used as the measurement target.
- Table 5 shows the results. From this table, an aqueous ammonia solution with stable specific resistance and pH was obtained with good reproducibility regardless of the ultrapure water flow rate.
- the supply liquid when the supply liquid is supplied from the supply section to the main fluid flow pipe through the supply liquid flow pipe by using the small-diameter supply liquid flow pipe, the supply liquid is supplied to the supply section.
- the pressure P 1 of the supply liquid and the pressure P 2 of the main fluid in the main-fluid flow pipe are set so as to satisfy P 1 ⁇ P 2> 0.
- the supply amount of the liquid to be supplied can be set using the pressure difference between the upstream side and the downstream side of the liquid supply pipe.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020067008305A KR101061142B1 (ko) | 2003-10-21 | 2004-10-15 | 액체 공급 방법 및 장치 |
US10/574,954 US8171956B2 (en) | 2003-10-21 | 2004-10-15 | Liquid supply method and apparatus |
JP2005514871A JP3866274B2 (ja) | 2003-10-21 | 2004-10-15 | 液供給方法および装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003361174 | 2003-10-21 | ||
JP2003-361174 | 2003-10-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005038895A1 true WO2005038895A1 (ja) | 2005-04-28 |
Family
ID=34463432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/015644 WO2005038895A1 (ja) | 2003-10-21 | 2004-10-15 | 液供給方法および装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8171956B2 (ja) |
JP (1) | JP3866274B2 (ja) |
KR (1) | KR101061142B1 (ja) |
CN (1) | CN100477102C (ja) |
TW (1) | TWI367944B (ja) |
WO (1) | WO2005038895A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103357610A (zh) * | 2013-07-18 | 2013-10-23 | 宜昌南玻硅材料有限公司 | 一种集中补液系统及补液方法 |
WO2023276837A1 (ja) * | 2021-07-01 | 2023-01-05 | Dic株式会社 | 比抵抗値調整装置及び比抵抗値調整方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030229393A1 (en) * | 2001-03-15 | 2003-12-11 | Kutryk Michael J. B. | Medical device with coating that promotes cell adherence and differentiation |
JP6569731B2 (ja) * | 2015-04-13 | 2019-09-04 | Dic株式会社 | 比抵抗値調整装置及び比抵抗値調整方法 |
JP2017154298A (ja) * | 2016-02-29 | 2017-09-07 | 東芝テック株式会社 | 液体循環装置、及び液体吐出装置 |
CN112842771B (zh) * | 2021-02-03 | 2023-03-24 | 潍坊医学院附属医院 | 一种内分泌科糖尿病足用清创装置 |
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TWI367944B (en) | 2012-07-11 |
US20070125423A1 (en) | 2007-06-07 |
CN100477102C (zh) | 2009-04-08 |
KR20060115378A (ko) | 2006-11-08 |
CN1871693A (zh) | 2006-11-29 |
JP3866274B2 (ja) | 2007-01-10 |
TW200517486A (en) | 2005-06-01 |
US8171956B2 (en) | 2012-05-08 |
JPWO2005038895A1 (ja) | 2007-02-01 |
KR101061142B1 (ko) | 2011-08-31 |
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