TWI367944B - Liquid supplying method and apparatus - Google Patents

Liquid supplying method and apparatus

Info

Publication number
TWI367944B
TWI367944B TW093131616A TW93131616A TWI367944B TW I367944 B TWI367944 B TW I367944B TW 093131616 A TW093131616 A TW 093131616A TW 93131616 A TW93131616 A TW 93131616A TW I367944 B TWI367944 B TW I367944B
Authority
TW
Taiwan
Prior art keywords
liquid supplying
supplying method
liquid
supplying
Prior art date
Application number
TW093131616A
Other languages
English (en)
Other versions
TW200517486A (en
Inventor
Toshikazu Suganuma
Yasushi Tomita
Kazunari Sakai
Naoki Hada
Katsuhiko Kazama
Original Assignee
Dainippon Ink & Chemicals
Kitz Sct Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink & Chemicals, Kitz Sct Corp filed Critical Dainippon Ink & Chemicals
Publication of TW200517486A publication Critical patent/TW200517486A/zh
Application granted granted Critical
Publication of TWI367944B publication Critical patent/TWI367944B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J4/00—Feed or outlet devices; Feed or outlet control devices
    • B01J4/02—Feed or outlet devices; Feed or outlet control devices for feeding measured, i.e. prescribed quantities of reagents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/30—Injector mixers
    • B01F25/31—Injector mixers in conduits or tubes through which the main component flows
    • B01F25/315—Injector mixers in conduits or tubes through which the main component flows wherein a difference of pressure at different points of the conduit causes introduction of the additional component into the main component
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/02—Burettes; Pipettes
    • B01L3/0289—Apparatus for withdrawing or distributing predetermined quantities of fluid
    • B01L3/0293—Apparatus for withdrawing or distributing predetermined quantities of fluid for liquids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0324—With control of flow by a condition or characteristic of a fluid
    • Y10T137/0329—Mixing of plural fluids of diverse characteristics or conditions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/206—Flow affected by fluid contact, energy field or coanda effect [e.g., pure fluid device or system]
    • Y10T137/2076—Utilizing diverse fluids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87571—Multiple inlet with single outlet
    • Y10T137/87676—With flow control

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW093131616A 2003-10-21 2004-10-19 Liquid supplying method and apparatus TWI367944B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003361174 2003-10-21

Publications (2)

Publication Number Publication Date
TW200517486A TW200517486A (en) 2005-06-01
TWI367944B true TWI367944B (en) 2012-07-11

Family

ID=34463432

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093131616A TWI367944B (en) 2003-10-21 2004-10-19 Liquid supplying method and apparatus

Country Status (6)

Country Link
US (1) US8171956B2 (zh)
JP (1) JP3866274B2 (zh)
KR (1) KR101061142B1 (zh)
CN (1) CN100477102C (zh)
TW (1) TWI367944B (zh)
WO (1) WO2005038895A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030229393A1 (en) * 2001-03-15 2003-12-11 Kutryk Michael J. B. Medical device with coating that promotes cell adherence and differentiation
CN103357610B (zh) * 2013-07-18 2015-05-06 宜昌南玻硅材料有限公司 一种集中补液系统及补液方法
CN107427786B (zh) * 2015-04-13 2021-10-12 Dic株式会社 电阻率值调整装置及电阻率值调整方法
JP2017154298A (ja) * 2016-02-29 2017-09-07 東芝テック株式会社 液体循環装置、及び液体吐出装置
CN112842771B (zh) * 2021-02-03 2023-03-24 潍坊医学院附属医院 一种内分泌科糖尿病足用清创装置
TW202302215A (zh) * 2021-07-01 2023-01-16 日商Ｄｉｃ股份有限公司 比電阻值調整裝置以及比電阻值調整方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3410531A (en) * 1967-05-19 1968-11-12 United Shoe Machinery Corp Mixing apparatus
NL160373C (nl) * 1968-11-08 1979-10-15 Wavin Bv Pijpverbindingsstuk voor pijpen met uitwendige schroeflijn- vormige ruggen.
JPS6048160A (ja) * 1983-08-25 1985-03-15 Asahi Okuma Ind Co Ltd 二液混合吐出方法及び装置
US5016817A (en) * 1989-11-08 1991-05-21 University Of Georgia Research Foundation, Inc. Pesticide spraying device and method
JPH0760082A (ja) * 1993-08-31 1995-03-07 Mitsubishi Rayon Co Ltd 超純水の比抵抗調整方法及び装置
JPH10324502A (ja) * 1997-05-21 1998-12-08 Dainippon Ink & Chem Inc 超純水の炭酸ガス付加装置及び付加方法
JP4135780B2 (ja) 1997-08-29 2008-08-20 ユーシーティー株式会社 薬液定量注入装置および方法
JPH11139804A (ja) 1997-11-11 1999-05-25 Dainippon Ink & Chem Inc 超純水の比抵抗調整装置及び調整方法
JP2000208471A (ja) 1999-01-11 2000-07-28 Kurita Water Ind Ltd 電子材料用洗浄水の調製装置
JP2001271868A (ja) * 2000-03-24 2001-10-05 Canon Inc 除振装置
TWI275436B (en) * 2002-01-31 2007-03-11 Ebara Corp Electrochemical machining device, and substrate processing apparatus and method
JP4332329B2 (ja) 2002-02-26 2009-09-16 三菱レイヨン株式会社 中空糸膜モジュールの製造装置並びに製造方法
AU2003268000A1 (en) * 2002-07-19 2004-02-09 Mykrolis Corporation Liquid flow controller and precision dispense apparatus and system
EP1598105B8 (en) * 2003-02-03 2010-05-19 Toyo Boseki Kabushiki Kaisha Hollow fiber membrane module and module arrangement group thereof

Also Published As

Publication number Publication date
KR101061142B1 (ko) 2011-08-31
TW200517486A (en) 2005-06-01
CN100477102C (zh) 2009-04-08
KR20060115378A (ko) 2006-11-08
US20070125423A1 (en) 2007-06-07
CN1871693A (zh) 2006-11-29
US8171956B2 (en) 2012-05-08
JP3866274B2 (ja) 2007-01-10
WO2005038895A1 (ja) 2005-04-28
JPWO2005038895A1 (ja) 2007-02-01

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