WO2005027145A1 - 感放射線性樹脂組成物 - Google Patents
感放射線性樹脂組成物 Download PDFInfo
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- WO2005027145A1 WO2005027145A1 PCT/JP2004/012338 JP2004012338W WO2005027145A1 WO 2005027145 A1 WO2005027145 A1 WO 2005027145A1 JP 2004012338 W JP2004012338 W JP 2004012338W WO 2005027145 A1 WO2005027145 A1 WO 2005027145A1
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- radiation
- resin
- sensitive resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/124—Intrinsically conductive polymers
- H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Definitions
- the present invention relates to a negative radiation-sensitive resin composition
- a negative radiation-sensitive resin composition comprising a composite composed of poly (3,4-disubstituted thiophene) and a polyanion, and a radiation-sensitive resin, and a conductive thin film using the same. And a substrate having the pattern.
- Transparent conductive films are used to coat transparent electrodes such as liquid crystal displays, electronic luminescence displays, plasma displays, electronic chromic displays, solar cells, touch panels, and substrates such as electromagnetic wave shielding materials. .
- the most widely applied transparent conductive film is a vapor-deposited film of indium tin oxide (ITO).
- ITO film having a predetermined pattern is formed on a substrate as follows, for example. First, an ITO film is formed on a substrate by sputtering, and a radiation-sensitive resin coating film is formed on this surface. Next, radiation such as light is irradiated through a photomask to cure the resin, then development is performed, and then the exposed portion of the ITO film is dissolved and removed by etching.
- Japanese Patent Application Laid-Open No. 2000-2008-254 discloses a method of patterning polythiophene by an ink jet printing apparatus. However, it is necessary to form a partition wall in advance to prevent the polythiophene solution from dripping. And its viscosity and surface tension are also limited. Disclosure of the invention
- An object of the present invention is to solve the above-mentioned conventional problems.
- An object of the present invention is to provide a negative-type image forming apparatus capable of forming a conductive thin film pattern having excellent resolution by a simple method.
- An object of the present invention is to provide a radiation resin composition, a method for forming a pattern of a conductive thin film using the composition, and a substrate having a pattern of a conductive thin film obtained by the method.
- the present inventors have conducted intensive studies to solve the above problems, and as a result, have found that the above problems can be solved by combining an aqueous dispersion of a specific polythiophene complex and a specific radiation-sensitive resin.
- the present invention has been completed.
- the negative-type radiation-sensitive resin composition of the present invention comprises: (a) a compound represented by the following general formula (1):
- R 1 and R 2 are each independently hydrogen or an alkyl having 1 to 4 carbons.
- the first resin of the radiation-sensitive resin is a curable epoxy (meth) acrylate
- the curable epoxy (meth) acrylate is a polyhydroxy compound and an epichlorohydrin.
- the second resin among the radiation-sensitive resins has the following general formula (2)
- R 3 represents a hydrogen atom or a methyl group
- R 4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms
- a compound having a hydroxyl group in the molecule In the presence of a strong acid catalyst.
- the 'third resin of the radiation-sensitive resin is a unit represented by the following formula (3-1); a unit represented by (3-1-1); and
- R 5 is hydrogen or a methyl group, and a plurality of R 5 in the molecule may be the same or different, and P is an integer of 110),
- R 6 is hydrogen or a methyl group
- X is a group selected from the group consisting of hydrogen, an alkali metal, and ammoniums, and a plurality of R 6 or X in the molecule is each May be the same or different
- R 7 and R 8 are each independently a hydrogen or a methyl group, and a plurality of R 7 or R 8 of the molecule may be the same or different.
- the unit of (3-III) is 15 mol 0 /. It is contained in a proportion of 1-8 0 mol 0/0.
- the fourth resin among the radiation-sensitive resins is represented by the following formula (4):
- the resin composition further contains at least one of a photopolymerization initiator and a photosensitizer.
- the method for forming a pattern of a conductive thin film according to the present invention comprises: a step of applying a coating liquid comprising the above resin composition onto a substrate to form a coating film; and irradiating the coating film surface with radiation through a photomask. And developing the irradiated coating film with a developer containing water.
- the present invention includes a substrate having a pattern of a conductive thin film formed by the above method.
- the substrate having the conductive thin film pattern is a transparent electrode of a display, an electrode of a transistor, an electrode of a solar cell, a wiring material, an organic EL device, an organic semiconductor, or an electromagnetic wave shielding material.
- FIG. 1 is a schematic view showing a step of forming a pattern of a thin film having conductivity on a substrate using the resin composition of the present invention.
- Negative radiation-sensitive resin composition of the present invention the following c containing (a) Porichiofu Kon aqueous dispersion of the complex, and (b) water-soluble or water-dispersible radiation-sensitive resin, for these The description will be made sequentially.
- the polythiophene complex contained in the composition of the present invention comprises a poly (3,4-disubstituted thiophene) having a repeating unit represented by the following general formula (1) and a polyanion. Is a complex:
- R 1 and R 2 each independently represent hydrogen or an alkyl group having 1 to 4 carbon atoms, or 1 to 4 carbon atoms which may be optionally substituted together.
- Examples thereof include a 1,2-alkylene group and a 1,3-alkylene group.
- Examples include a len group, a 1,2-ethylene group, and a 1,3-propylene group. Of these, the 1,2-ethylene group is particularly preferred.
- the alkyl group having 1 to 4 carbon atoms may be substituted, and examples of the substituent include an alkyl group having 1 to 12 carbon atoms and a phenyl group.
- Specific examples of the substituted alkylene group having 1 to 4 carbon atoms include a 1,2-cyclohexylene group and a 2,3-butylene group.
- Representative examples of such alkylene groups include a 1,2 alkylene group formed by R 1 and R 2 taken together and substituted with an alkyl group having 1 to 12 carbon atoms.
- Such groups are derived from 1,2-dibumoalkanes obtained by brominating ⁇ -olefins such as ethen, propene, hexene, otaten, decene, dodecene, and styrene.
- Examples of the compound capable of constituting the polyanion include polymeric carboxylic acids (for example, polyatalylic acid, polymethacrylic acid, and polymaleic acid), and polymeric sulfonic acids (for example, polystyrene sulfonic acid and polyvinyl sulfonic acid). No. These carboxylic acids and sulfonic acids may also be copolymers of vinyl carboxylic acids or vinyl sulfonic acids with other polymerizable monomers (eg, acrylates and styrene). Polystyrene sulfonic acid is particularly preferred as a compound capable of constituting a polyanion.
- polymeric carboxylic acids for example, polyatalylic acid, polymethacrylic acid, and polymaleic acid
- polymeric sulfonic acids for example, polystyrene sulfonic acid and polyvinyl sulfonic acid. No. These carboxylic acids and sulfonic acids may also be copoly
- the number average molecular weight of the compound capable of constituting the above-mentioned polyanion is preferably in the range of 1,000 to 2,000,000, more preferably, 2,0000 to 500,000. It is in the range of 0000, most preferably in the range of 100,000 to 200,000.
- the aqueous dispersion of the polythiophene composite can be produced, for example, by the method described in Japanese Patent No. 2636969. 'More preferably, the aqueous dispersion of the polyolefin complex can be produced by the following method.
- the method for producing the aqueous dispersion of the polythiophene composite includes a 3,4-disubstituted thiophene represented by the following formula (1 ′). Hi ')
- R 1 and R 2 are the same as defined in the above formula (1)
- an acid selected from the group consisting of a water-soluble inorganic acid and an organic acid is added to the 3,4-disubstituted thiophene using an oxidizing agent in the presence of a polyanion to form a reaction solution. It involves a step of lowering the pH and polymerizing in an aqueous solvent.
- the charge amount of the polyanion in the polymerization step is preferably in the range of 50 to 3,000 parts by mass, more preferably 100 to 1,000 parts by mass, based on 100 parts by mass of the thiophene. It is in the range of 500 parts by weight, most preferably in the range of 150 to 500 parts by weight.
- the solvent used in the above method is an aqueous solvent, particularly preferably water.
- Alcohols such as methanol, ethanol, 2-propanol and 1-prononol; water-soluble solvents such as acetone and acetonitrile may be added to water before use.
- the oxidizing agent for performing the polymerization reaction of the 3,4-disubstituted thiophene includes, but is not limited to, the following compounds: peroxodisulfuric acid, sodium peroxodisulfate, potassium peroxodisulfate , Ammonium sulfate, inorganic ferric oxide, organic ferric oxide, hydrogen peroxide, potassium permanganate, potassium dichromate, alkali perborate, copper salt and the like. Of these, peroxodisulfate, sodium peroxodisulfate, potassium ⁇ ⁇ / reoxodisulfate, and ammonium peroxodisulfate are most preferred.
- the amount of oxidizing agent used is per equivalent of 3,4-disubstituted thiophene The range is preferably from 1 to 5 equivalents, more preferably from 2 to 4 equivalents.
- the pH of the polymerization reaction system during polymerization is low (preferably 1.5 or less). Therefore, when peroxodisulfuric acid is selected from the above oxidizing agents, it can be suitably used without pH adjustment only by adding it to the reaction system. If another oxidizing agent is selected, it is necessary to adjust the pH by adding an acid.
- the pH of the reaction solution is preferably 1.5 or less, more preferably 1.0 or less.
- an acid selected from the group consisting of water-soluble inorganic acids and organic acids is used.
- the inorganic acid include hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid and the like.
- the organic acid include p-toluenesulfonic acid, benzenesulfonic acid, methanesulfonic acid, and trifluoromethanesulfonic acid.
- a catalytic amount of a metal ion such as iron, cobalt, nickel, molybdenum, or vanadium ion may be added as necessary.
- Poly (3,4-disubstituted thiophene) is produced by the polymerization reaction. This poly (3,4-disubstituted thiophene) is in the form of a cation, and is considered to form a complex with the polyanion present in the reaction system.
- the above complex may be described as “complex of poly (3,4-disubstituted thiophene) and polyanion”, “polythiophene complex”, or simply “complex”.
- polystyrenesulfonic acid a composite of poly (3,4-ethylenedioxythiophene) and polystyrenesulfonic acid is preferred.
- Radiation-sensitive resin The water-soluble or water-dispersible radiation-sensitive resin (b) contained in the composition of the present invention is not particularly limited, but the following four resins (b.1) to (b.4) are shown. Eve's resin is preferred.
- This resin is a curable epoxy (meth) acrylate, and is obtained by reacting (meth) acrylic acid with a polyglycidyl ether compound obtained by reacting a polyhydroxy compound with epichlorohydrin.
- the above-mentioned polyhydroxy compound is not particularly limited, but examples thereof include ethylene glycol, 1,2-propylene glycol, 1,3-propylene glycol, 1,4-butanediol, glycerin, and trimethylolone. Examples thereof include ethane, trimethylolpropane, sorbitol, sorbitan, pentaerythritol, ethylene glycolone, triethylene glycolone, tetraethyleneglycol dipropylene glycol, tripropylene glycol and mixtures thereof.
- a polyglycidyl ether compound is obtained from these polyhydroxy compounds and epichlorohydrin, and is reacted with (meth) acrylic acid to have an unsaturated bond derived from (meth) acrylic acid at the molecular terminal.
- a polymer (curable epoxy (meth) acrylate) is obtained. The details of the method for producing the curable epoxy (meth) acrylate are described in JP-A-2002-194502.
- This resin has the following general formula (2)
- R 3 represents a hydrogen atom or a methyl group
- R 4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms
- Examples of the compound having a hydroxyl group in the molecule include pentaerythritol and tris (2-hydroxyethyl) isocyanurate.
- Examples of the strong acid catalyst include sulfuric acid, hydrochloric acid, nitric acid, and p-toluenesulfonic acid.
- a resin obtained from a (meth) acrylamide derivative and a compound having a hydroxyl group in the molecule is described in JP-A-2002-341529.
- This resin has a unit represented by the following formula (3-1), a unit represented by (3-II), and a unit represented by (3-III):
- R 6 is hydrogen or methyl tomb
- X is a group selected from the group consisting of hydrogen, alkali metals, and ammoniums
- R 6 or X may each be the same or different
- R 7 and R 8 are each independently a hydrogen or a methyl group, and a plurality of R 7 or R 8 in the molecule may be the same or different.
- the unit of the above (3-I) is in a ratio of 2 mol% to 73 mol%
- a rate unit of 8 mol% to 8 3 mol 0/0 (3- 1 I), and is contained in a proportion unit is 1 to 5 mol% to 8 0 mole 0/0 (3- III) .
- This resin may be, for example, glycidyl (meta) ) It is obtained by adding atelylate at a predetermined ratio.
- this C such resins being Ki ⁇ in JP 2001- 270919 as
- This resin has a unit represented by the following formula (4) (
- Y- represents an anion.
- suitable Y— include chloride ion, bromide ion, iodide ion, lower alkoxysulfate ion, p-toluenesulfonic acid ion and the like.
- Such a resin is described, for example, in JP-A-8-320553.
- the radiation-sensitive resin composition of the present invention comprises the aqueous dispersion of the polythiophene complex of (a) and the water-soluble or water-dispersible radiation-sensitive resin of (b). ) At least one of a photopolymerization initiator and a photosensitizer, (d) a polymerizable monomer, (e) a solvent, (f) a water-soluble polymer other than the above (b), (g) a water-soluble compound, (h ) A neutralizing agent, and (i) an additive.
- a photopolymerization initiator and a photosensitizer At least one of a photopolymerization initiator and a photosensitizer, (d) a polymerizable monomer, (e) a solvent, (f) a water-soluble polymer other than the above (b), (g) a water-soluble compound, (h ) A neutralizing agent, and (i) an additive.
- the content ratio of the polythiophene complex ( a ) and the radiation-sensitive composition (b) in the resin composition of the present invention is not particularly limited, but is preferably 5: 95-95: 5 by mass ratio of solid content. It is preferably in the range of 25:75 to 75:25. If the content of the composite is too small, sufficient conductivity cannot be provided, Conversely, if the amount of the radiation-sensitive resin is too small, the conductivity increases, but the resolution of the finally formed pattern decreases.
- the composition of the present invention contains water as an essential component. Although the water dispersion of the polythiophene composite contains water, water can be further contained in the composition as necessary.
- photopolymerization initiator and photosensitizer of the above (c) that can be contained in the composition of the present invention are not particularly limited.
- photopolymerization initiators or photosensitizers include the following compounds: benzophenone, 4-hydroxybenzophenone, bis-N, N-dimethinoleaminobenzophenone, bis-N, N-jeti / a Benzophenones such as minobenzophenone and 4-methoxy-4-dimethylaminobenzozophenone; thioxanthones such as thioxanthone, 2,4-getylthioxanthone, isopropinolethioxanthone, black thioxanthone, and isopropoxy black thioxanthone; Anthraquinones such as ethylanthraquinone, benzoanthraquinone, aminoanthraquinone, black anthraquinone, black anthraquinon
- the polymerizable monomer (d) is used for the purpose of improving the sensitivity of the resin composition and the heat resistance, water resistance, solvent resistance, and scratch resistance of the thin film finally formed on the substrate. Included in the composition.
- Such polymerizable monomers are not particularly limited.
- the following monomers can be used: polyethylene glycol (meth) acrylate (a compound having 2 to 14 ethylene groups), and trimethylol.
- Examples of the solvent (e) include solvents other than water that are miscible with water. Such a solvent is not particularly limited. Examples of the solvent include the following compounds: methanol, ethanol, 2-propanol, alcohols such as 1-propanol, etc .; ethylene glycol, diethylene glycol, triethylene glycol, and ethylene glycol.
- Ethylene glycol such as tetraethylene glycolone
- Glycols such as ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, ethylene glycol getyl ether, and diethylene glycol monoresin methine oleate; ethylene glycol oleno olein oleate / reacetate; Glycol enoate acetates, such as mono-tera acetate, diethylene glycolone monoptinooleate enorea acetate; propylene glycol monoleates, such as propylene dalicol, dipropylene darycol, and tripropylene darycore; propylene glycole Monomethinole ether, Propylene glycolone monoether / reaterate, Dipropylene daricone / Lemonomethine / Reatete / re, Dipropylene dariconere Propylene glycol / reterones such as monoethylenolate, propy
- Propylene glycols such as propylene daricol monomethyl ether acetate, propylene glycol monoethyl enoate enoate acetate, dipropylene daricone monomethino enoate enoate acetate, and dipropylene glycol monoethyl enoate enoate acetate / diacetate N-methylformamide; N-methylpyrrolidone; dimethylacetamide; dimethylsulfoxide; acetone; and acetonitrile. These compounds can be used alone or in combination of two or more.
- the water-soluble polymer (f) other than (b) is contained in the composition for the purpose of improving the film-forming property.
- Such water-soluble polymers are not particularly limited, and include, for example, the following compounds: polybutyl alcohol, modified polyvinyl alcohol (polyvinyl alcohol 'polyacrylate block copolymer, graphitized polyvinyl alcohol, etc.) , Hydroxymethylcellulose, hydroxyxetinoresenorelose, hydroxypropinorese 7 rerose, polybutanolpyrrolidone, vinylpyrrolidone-bierimidazole copolymer, water-soluble alkyd tree Fats, salts of copolymers containing (meth) atalilic acid (such as sodium salts and rymine salts), and water-soluble polymers having an ethylenic double bond in the side chain.
- the water-soluble compound (g) is contained in the composition for the purpose of improving the conductivity of the finally obtained thin film.
- Such water-soluble compounds are not particularly limited and include the following compounds: pyrrolidone-based compounds such as N-methylpyrrolidone, 2-pyrrolidone and N-vinylpyrrolidone; N-methylformamide; Amide group-containing compounds such as N, N-dimethylformamide and dimethylacetamide; polyhydric alcohols such as glycerol, 1,3-butanediol, ethylene glycol and diethylene glycol monoethyl ether; dimethyl sulfoxide Such.
- the neutralizing agent (h) is a basic compound contained for the purpose of improving the compatibility between the polythiophene complex and the radiation-sensitive resin.
- neutralizing agents include the following compounds: ammonia, triethylamine, N, N-dimethylaminoethanol, 2-amino-2-methylpropanol, diethanolamine, triethanolamine, sodium hydroxide , Such as potassium hydroxide.
- additive (i) examples include a polymerization inhibitor, a plasticizer, an antifoaming agent, a surfactant, and a coupling agent, and any of them can be a compound or a material commonly used in the art.
- FIG. 1 In order to form a conductive thin film pattern on a substrate according to the present invention, for example, FIG.
- a coating solution that is the negative-type radiation-sensitive resin composition of the present invention is applied on a substrate 1 to form a coating film (radiation-sensitive resin composition layer 2).
- a substrate any of a substrate made of an inorganic material and a substrate made of an organic material can be used.
- Substrates made of inorganic materials include silicon wafers and glass plates; substrates made of organic materials include polyester, polyimide, polyamide, polysulfone, polycarbonate, polyvinyl chloride, and polyester.
- a resin such as propylene, a copolymer containing a monomer constituting these polymers as a polymerized unit, a phenol resin, an epoxy resin, an ABS resin, or a blend of these resins. Film, sheet, etc.).
- the thickness of the radiation-sensitive resin composition layer 2 thus formed is not particularly limited, but is preferably 0.01 to 1.0 O / xm, more preferably 0.05 to 0.6 m. Range. If the film thickness is too small, sufficient conductivity cannot be imparted. Conversely, if the film thickness is too large, the conductivity increases, but the transparency decreases and the resolution of the pattern decreases.
- a photomask 3 having a light-shielding layer having a pattern opposite to the pattern of the intended conductive thin film is placed, and radiation is irradiated through this (FIG. 1 (B)).
- radiation is a general term for visible light, ultraviolet light, far ultraviolet ray, X-ray, electron beam, molecular beam, ⁇ -ray, synchrotron radiation, proton beam, etc.
- the radiation-sensitive resin composition before irradiation is soluble or dispersible in an aqueous solvent, but the irradiated part (exposed part) 21 is cured and becomes insoluble in the solvent (see FIG. 1 (C )). Therefore, by developing with a developing solution comprising an aqueous solvent, the light-shielding portion (unexposed portion) 22 is dissolved and removed, and a desired conductive thin film pattern 20 can be formed (FIG. 1 (D )).
- the developer contains water as an essential component, and may contain other components as necessary.
- organic solvents, organic amines, inorganic alkalis, surfactants, defoamers, etc. are contained for the purpose of improving developability, or organic acids, inorganic acids, etc. are contained for the purpose of improving conductivity. You can also.
- the developing method can be performed by a spray method, a paddle method, an immersion method, or the like. Super if necessary Irradiation of sound waves can be used in combination.
- a conductive thin film having a desired pattern can be easily formed on a substrate with high accuracy by a wet process.
- a screen printing method, an ink jet printing, and the like are known as a method of forming a conductive thin film pattern by a wet process.
- the former requires adjustment of the viscosity of a coating solution and a resolution of the obtained pattern.
- the latter has the problems that the viscosity and surface tension of the coating solution are limited, and that it is necessary to form a partition in advance to prevent the coating solution from dripping. According to the present invention, such a problem is solved, and as described above, a pattern of a conductive thin film with good resolution can be formed by a simple method.
- the substrate having the pattern includes a display transparent electrode, a transistor electrode, a solar cell electrode, a wiring material, an organic EL device (the pattern functions as a hole injection layer), an organic semiconductor, and an electromagnetic wave shielding material. It can be widely used as such.
- a PET film (total light transmittance: 87.8%) was used.
- Aqueous dispersion of complex of poly (3,4-ethylenedioxythiophene) and polystyrenesulfonate In a 1,887 parts aqueous solution containing 20.8 parts of polystyrene sulfonic acid having a weight average molecular weight of 7500, 49 parts of a 1 mass% iron (III) sulfate 7 solution 49 parts, 3,4 monoethylene di O carboxymethyl Chio Fen 8.8 parts, and 1 0. 9 mass 0/0 Peruoki 'Sony sulfate aqueous 1 1 7 parts was added.
- This reaction mixture was stirred at 18 ° C for 23 hours to obtain an aqueous dispersion of a complex of poly (3,4-ethylenedioxythiophene) and polystyrenesulfonic acid. .
- 154 parts of a cation exchange resin and 232 parts of an anion exchange resin were added, and after stirring for 2 hours, the ion exchange resin was filtered off.
- a desalted aqueous dispersion containing a complex of poly (3,4-ethylenedioxythiophene) and polystyrenesulfonic acid at a ratio of 1.4% by mass was obtained.
- TOPPAN-TEST-CHART-N01-P / NL7401 manufactured by Toppan Printing Co., Ltd. was used as a photomask. Based on 36 levels of 0.87 7 to 50.0 ⁇ m in 36 lines and spaces, it is evaluated by optical microscope observation to determine the resolution of the obtained pattern up to the line width. did.
- polyglycidyl ether a polyglycidyl ether (epoxy equivalent: 149 WPE, total chlorine content: 0.7% by mass) obtained by reacting epichlorohydrin with a 3-mol ethylene oxide adduct of glycerin was prepared.
- 250.0 g of this polyglycidyl ether, 120.8 g of acrylic acid, 0.6 g of tetramethylammonium chloride as a catalyst, and hydroquinone monomethyl as a polymerization inhibitor 0.6 g of ether was charged and stirred at 70 to 80 ° C. for 20 hours to obtain a viscous solution of a radiation-sensitive resin.
- N-methylforma Negative radiation sensitivity was obtained by mixing 3.6 g of the amide, 2.7 g of the viscous solution of the radiation-sensitive resin obtained in Synthesis Example 1, 0.2 g of thioxanthone, and 4.0 g of demineralized water. A coating solution of the resin composition was obtained.
- the polymer solution was cooled again to 80 ° C., and 13.0 g of pyridine and 0.6 g of N--torosophenylhydroxylamine / ammonium salt dissolved in 32.0 g of propylene glycol were added thereto. After each addition, glycidyl methacrylate (1 16. Og) was added dropwise over 30 minutes and kept at 80 ° C for 6 hours to obtain a pale red viscous polymer solution.
- Example 3 1000 ml of ethyl acetate was put into a reaction vessel equipped with a stirrer, and 100 g of the above viscous polymer solution was added dropwise thereto. After dispersion for 1 hour, the mixture was filtered and dried to obtain a white powder. 10.74 g of this white powder, 0.83 g of a 10% aqueous NaOH solution, 17.94 g of propylene glycol, and 30.00 g of demineralized water were mixed to obtain a transparent and viscous polymer solution. (Example 3)
- Example 2 The coating solution obtained in Example 1 was applied on a PET film (substrate) using No. 8 wire par, and dried at 100 ° C. for 2 minutes. A photomask is placed on the formed coating film, and a metal halide lamp is mounted on the photomask using a nail polish system (TYPE: UVX-01212 S1CS01: manufactured by ⁇ Shio Electric Co., Ltd.). It was performed co Ntakuto exposure with an exposure amount of 50 Om J / cm 2. Next, the substrate having this coating film is immersed in water at 23 ° C for 1 minute to dissolve and remove the unexposed portion (light-shielded portion), and then washed with water. Thus, a conductive thin film pattern was formed.
- a nail polish system TYPE: UVX-01212 S1CS01: manufactured by ⁇ Shio Electric Co., Ltd.
- the resolution of the pattern of the obtained conductive thin film was 50 ⁇ , the surface resistivity was 1,100 ⁇ / mouth, and the total light transmittance was 81.0%. (Example 6)
- the coating solution obtained in Example 2 was applied on a PET film (substrate) using a No. 12 wire bar, and dried at 60 ° C. for 5 minutes.
- a photomask is placed on the formed coating film, and a metal halide lamp is mounted on the photomask, using a nail polish system (TYPE: UVX-01212 S1CS01: manufactured by Dashio Electric Co., Ltd.) through the photomask.
- TYPE UVX-01212 S1CS01: manufactured by Dashio Electric Co., Ltd.
- Contact exposure was performed with an exposure of cm 2 .
- the substrate having this coating film was washed with an aqueous developer at 23 ° C (a mixed solution of 86.7 parts by mass of demineralized water, 3.3 parts by mass of monoethanolamine, and 10.0 parts by mass of ethylene glycol monobutyl ether). After immersion for 1 minute, the unexposed portion was dissolved and removed by a water shower and washed with water to form a conductive thin film pattern.
- the pattern resolution of the obtained conductive thin film was 15 ⁇ , the surface resistivity was 580 ⁇ / mouth, and the total light transmittance was 75.0%.
- Example 3 The coating solution obtained in Example 3 was applied on a PET film (substrate) using a No. 12 wire bar, and dried at 60 ° C. for 3 minutes. A photomask is placed on the formed coating film, and a metal halide lamp is mounted, and a nail polish system (TYPE: UVX-01212 S1CS01: manufactured by Dashio Electric Co., Ltd.) is used to pass through the photomask to 45 mJ. Contact exposure was performed at an exposure amount of / cm 2 .
- TYPE UVX-01212 S1CS01: manufactured by Dashio Electric Co., Ltd.
- the substrate having this coating film was washed with an aqueous developer at 23 ° C (86.7 parts by mass of demineralized water, 3.3 parts by mass of monoethanolamine, After 1 minute the glycol monobutyl ether 10.0 parts by mass, and 60 mass 0/0 aqueous nitric acid 5. mixture of 0 parts by weight), with water showers, the unexposed portions dissolve 'removed, washed with water Thus, a pattern of the conductive thin film was formed.
- the pattern resolution of the obtained conductive thin film was ⁇ ⁇ , the surface resistivity was 580 ⁇ , and the total light transmittance was 75.1%.
- Example 4 The coating solution obtained in Example 4 was applied on a PET film (substrate) using a No. 8 wire bar, and dried at 100 ° C. for 2 minutes. A photomask is mounted on the formed coating film, and a metal halide lamp is mounted on the photomask, using a cure system (TYPE: UVX-01212 S1CS01: manufactured by Dashio Electric Co., Ltd.). Contact exposure was performed with an exposure amount of 50 Om jZcni 2 . Next, the substrate having the coating film was immersed in water at 23 ° C. for 1 minute to dissolve and remove unexposed portions, and washed with water to form a conductive thin film pattern.
- a cure system TYPE: UVX-01212 S1CS01: manufactured by Dashio Electric Co., Ltd.
- the pattern resolution of the obtained conductive thin film was 30 ⁇ m, the surface resistivity was 1,200 ⁇ / port, and the total light transmittance was 84.3%.
- Pentaerythritol triatalylate 1.0 g, 1- [4- (2-hydroxyethoxy) 1-phenyl-2-]-2-hydroxy-2-methyl-1 1-propane 1-one 0.03 g, plus 0.5 g of Coat RY-2 (surfactant manufactured by Ryogo Chemical Industry Co., Ltd.) was vigorously stirred and mixed. While stirring this mixture, a desalted water dispersion containing a complex of poly (3,4-ethylenedioxythiophene) and polystyrenesulfonic acid prepared in section 1.2 above was used. Add 0 g and N_methylformamide 3.Og and mix. A coating liquid of a molybdenum radiation-sensitive resin composition was obtained. (Comparative Example 2)
- the coating solution obtained in Comparative Example 1 was applied on a PET film (substrate) using No. 8 wire par, and dried at 100 ° C. for 2 minutes.
- a photomask was placed on the formed coating film, and a metal halide lamp was mounted on the coating film using a nail polish system (TYPE: UVX-01212 S1CS01: manufactured by Dashio Electric Co., Ltd.).
- TYPE UVX-01212 S1CS01: manufactured by Dashio Electric Co., Ltd.
- Contact exposure was performed at an exposure amount of Om j / cm 2 .
- the substrate having the coating film was immersed in water at 23 ° C. for 1 minute to dissolve and remove unexposed portions, and washed with water to form a conductive thin film pattern.
- the pattern of the obtained conductive thin film could not be resolved even at the maximum photomask pattern of 50 ⁇ used.
- the surface resistivity was 1,800 ⁇ / port, and the total light transmittance was 80.0%. Possibility for industrial use
- the negative radiation-sensitive resin composition which can form the electroconductive thin film which has a desired pattern easily and with high precision on a board
- the pattern of the conductive thin film obtained by this composition has sufficient resolution, conductivity, and transparency. Therefore, the substrate having the pattern can be widely used as a transparent electrode of a display, an electrode of a transistor, an electrode of a solar cell, a wiring material, an organic EL device, an organic semiconductor, an electromagnetic wave shielding material, and the like.
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- Spectroscopy & Molecular Physics (AREA)
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- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials For Photolithography (AREA)
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- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
Description
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JP2005513829A JP4621870B2 (ja) | 2003-09-11 | 2004-08-20 | 感放射線性樹脂組成物 |
KR1020067004859A KR101103241B1 (ko) | 2003-09-11 | 2004-08-20 | 감방사선성 수지 조성물 |
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JP (1) | JP4621870B2 (ja) |
KR (1) | KR101103241B1 (ja) |
TW (1) | TWI350427B (ja) |
WO (1) | WO2005027145A1 (ja) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006185674A (ja) * | 2004-12-27 | 2006-07-13 | Fujikura Ltd | 電子デバイスおよびその製造方法 |
WO2008022908A1 (en) * | 2006-08-21 | 2008-02-28 | Agfa-Gevaert | Uv-photopolymerizable composition for producing organic conductive layers, patterns or prints |
JP2008133322A (ja) * | 2006-11-27 | 2008-06-12 | Shin Etsu Polymer Co Ltd | 導電性高分子塗料及び導電性塗膜 |
JP2010161013A (ja) * | 2009-01-09 | 2010-07-22 | Toagosei Co Ltd | 導電性樹脂パターンを有する積層体の製造方法、および、積層体 |
US8007335B2 (en) | 2004-12-27 | 2011-08-30 | Fujikura Ltd. | Manufacturing method for electronic device |
JP2011198736A (ja) * | 2010-02-24 | 2011-10-06 | Hitachi Chem Co Ltd | 感光性導電フィルム、導電膜の形成方法及び導電パターンの形成方法 |
WO2011136022A1 (ja) * | 2010-04-26 | 2011-11-03 | コニカミノルタホールディングス株式会社 | 透明電極の製造方法、透明電極および有機電子素子 |
WO2012014621A1 (ja) * | 2010-07-29 | 2012-02-02 | コニカミノルタホールディングス株式会社 | 透明導電膜、および有機エレクトロルミネッセンス素子 |
JP2017105982A (ja) * | 2015-12-04 | 2017-06-15 | 東ソー株式会社 | 帯電防止薄膜、及び帯電防止用水溶液 |
JP2017126385A (ja) * | 2017-04-26 | 2017-07-20 | 株式会社ジャパンディスプレイ | 静電容量方式タッチパネルの製造方法 |
JP2019003685A (ja) * | 2018-09-11 | 2019-01-10 | 株式会社ジャパンディスプレイ | 静電容量方式タッチパネルの製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US11971659B2 (en) | 2018-10-08 | 2024-04-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Photoresist composition and method of forming photoresist pattern |
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JPS62123444A (ja) * | 1985-08-07 | 1987-06-04 | Japan Synthetic Rubber Co Ltd | ポジ型感放射線性樹脂組成物 |
JPH0848858A (ja) * | 1994-05-06 | 1996-02-20 | Bayer Ag | 伝導性被覆 |
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JPS6226268A (ja) * | 1985-07-26 | 1987-02-04 | Mitsubishi Chem Ind Ltd | 有機半導体 |
WO2003067333A1 (en) * | 2002-02-05 | 2003-08-14 | Koninklijke Philips Electronics N.V. | Photo-sensitive composition |
JP2003241370A (ja) * | 2002-02-15 | 2003-08-27 | Nippon Telegr & Teleph Corp <Ntt> | 感光性組成物及びそれを用いた導電性組成物の製造方法 |
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2004
- 2004-08-20 JP JP2005513829A patent/JP4621870B2/ja not_active Expired - Fee Related
- 2004-08-20 KR KR1020067004859A patent/KR101103241B1/ko active IP Right Grant
- 2004-08-20 WO PCT/JP2004/012338 patent/WO2005027145A1/ja active Application Filing
- 2004-09-07 TW TW093126944A patent/TWI350427B/zh not_active IP Right Cessation
Patent Citations (2)
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JPS62123444A (ja) * | 1985-08-07 | 1987-06-04 | Japan Synthetic Rubber Co Ltd | ポジ型感放射線性樹脂組成物 |
JPH0848858A (ja) * | 1994-05-06 | 1996-02-20 | Bayer Ag | 伝導性被覆 |
Cited By (15)
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US8018146B2 (en) | 2004-12-27 | 2011-09-13 | Fujikura Ltd. | Electronic device and manufacturing method therefor |
JP2006185674A (ja) * | 2004-12-27 | 2006-07-13 | Fujikura Ltd | 電子デバイスおよびその製造方法 |
JP4583917B2 (ja) * | 2004-12-27 | 2010-11-17 | 株式会社フジクラ | 電子デバイスの製造方法および透明導電回路基板の製造方法 |
US8007335B2 (en) | 2004-12-27 | 2011-08-30 | Fujikura Ltd. | Manufacturing method for electronic device |
WO2008022908A1 (en) * | 2006-08-21 | 2008-02-28 | Agfa-Gevaert | Uv-photopolymerizable composition for producing organic conductive layers, patterns or prints |
US7989032B2 (en) | 2006-08-21 | 2011-08-02 | Agfa Gevaert | UV-photopolymerizable composition for producing organic conductive layers, patterns or prints |
JP2008133322A (ja) * | 2006-11-27 | 2008-06-12 | Shin Etsu Polymer Co Ltd | 導電性高分子塗料及び導電性塗膜 |
JP2010161013A (ja) * | 2009-01-09 | 2010-07-22 | Toagosei Co Ltd | 導電性樹脂パターンを有する積層体の製造方法、および、積層体 |
JP2011198736A (ja) * | 2010-02-24 | 2011-10-06 | Hitachi Chem Co Ltd | 感光性導電フィルム、導電膜の形成方法及び導電パターンの形成方法 |
WO2011136022A1 (ja) * | 2010-04-26 | 2011-11-03 | コニカミノルタホールディングス株式会社 | 透明電極の製造方法、透明電極および有機電子素子 |
JP5673675B2 (ja) * | 2010-04-26 | 2015-02-18 | コニカミノルタ株式会社 | 透明電極の製造方法、透明電極および有機電子素子 |
WO2012014621A1 (ja) * | 2010-07-29 | 2012-02-02 | コニカミノルタホールディングス株式会社 | 透明導電膜、および有機エレクトロルミネッセンス素子 |
JP2017105982A (ja) * | 2015-12-04 | 2017-06-15 | 東ソー株式会社 | 帯電防止薄膜、及び帯電防止用水溶液 |
JP2017126385A (ja) * | 2017-04-26 | 2017-07-20 | 株式会社ジャパンディスプレイ | 静電容量方式タッチパネルの製造方法 |
JP2019003685A (ja) * | 2018-09-11 | 2019-01-10 | 株式会社ジャパンディスプレイ | 静電容量方式タッチパネルの製造方法 |
Also Published As
Publication number | Publication date |
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JPWO2005027145A1 (ja) | 2006-11-24 |
KR101103241B1 (ko) | 2012-01-12 |
TW200510929A (en) | 2005-03-16 |
JP4621870B2 (ja) | 2011-01-26 |
TWI350427B (en) | 2011-10-11 |
KR20060133959A (ko) | 2006-12-27 |
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