WO2005026015A1 - スペーサーシート及びそれを用いる板状物の輸送方法 - Google Patents
スペーサーシート及びそれを用いる板状物の輸送方法 Download PDFInfo
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- WO2005026015A1 WO2005026015A1 PCT/JP2004/013278 JP2004013278W WO2005026015A1 WO 2005026015 A1 WO2005026015 A1 WO 2005026015A1 JP 2004013278 W JP2004013278 W JP 2004013278W WO 2005026015 A1 WO2005026015 A1 WO 2005026015A1
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- Prior art keywords
- spacer sheet
- plate
- spacer
- sheet
- sheet according
- Prior art date
Links
- 125000006850 spacer group Chemical group 0.000 title claims abstract description 179
- 238000000034 method Methods 0.000 title claims description 31
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 239000011521 glass Substances 0.000 claims abstract description 44
- 239000000126 substance Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims description 39
- 239000004065 semiconductor Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 10
- 230000000737 periodic effect Effects 0.000 claims description 7
- 239000000470 constituent Substances 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 abstract description 21
- 230000003068 static effect Effects 0.000 abstract description 21
- 230000001788 irregular Effects 0.000 abstract description 2
- 238000012546 transfer Methods 0.000 description 17
- 238000011109 contamination Methods 0.000 description 16
- 239000000428 dust Substances 0.000 description 15
- 239000005416 organic matter Substances 0.000 description 14
- -1 plates Substances 0.000 description 11
- 229920003050 poly-cycloolefin Polymers 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 10
- 239000004973 liquid crystal related substance Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000003860 storage Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 235000019832 sodium triphosphate Nutrition 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 241000256011 Sphingidae Species 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical group [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000003911 water pollution Methods 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D57/00—Internal frames or supports for flexible articles, e.g. stiffeners; Separators for articles packaged in stacks or groups, e.g. for preventing adhesion of sticky articles
- B65D57/002—Separators for articles packaged in stacks or groups, e.g. stacked or nested
- B65D57/003—Separators for articles packaged in stacks or groups, e.g. stacked or nested for horizontally placed articles, i.e. for stacked or nested articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
Definitions
- the present invention relates to a spacer used for the purpose of protecting the surface of a plate-shaped object such as a substrate for a precision device or a member for a precision device from being scratched, adhering to dust or contaminating organic matter when the plate-shaped object is transported and stored.
- the present invention relates to a sheet and a method for transporting a plate-like object using the spacer sheet.
- semiconductors and liquid crystal displays, etc. have higher performance, they are used to manufacture substrates such as silicon, glass, and plastic used for their manufacture, and plate-like materials such as ceramics and metal materials used for equipment components. Problems that occur during transportation and storage have become problems.
- the defects that occur on the slabs during transportation and storage include physical damage, dust adhesion, organic contamination, static electricity, etc., which greatly increases the yield when manufacturing products using the slabs. It is known to affect.
- silicon wafers used for semiconductor devices and glass substrates used for liquid crystal substrates are subject to contamination during transportation and storage, which may cause problems such as MO SF ⁇ and TF ⁇ ⁇ produced on those substrates.
- the chairs are thoroughly cleaned and used after they are received to greatly reduce the performance of the chairs.
- the transfer container is sealed so that contamination during transfer and storage does not occur.
- contamination during transfer and storage does not occur.
- non-contact transfer using a cassette etc. Since the container is transported and stored by transport, there are many voids in the container and the volume of the container increases, which causes an increase in transport and storage costs.
- Literature 1 discloses a spacer sheet having unevenness with a height of 0.5 to 2.5 mm on one surface in order to ensure good air permeability between plate-like objects, and has a large projection density. There is disclosed a spacer sheet characterized by a mixture of an area and a small area.
- Document 2 discloses a glass insert containing 0.1% by weight or more of sodium tripolyphosphate.
- metal components such as sodium tripolyphosphate are included in the slip paper. Therefore, it cannot be used for applications in which the performance is significantly deteriorated due to the alkali metal component, such as non-alkali glass and semiconductor substrates, in which the alkali metal component adsorbed on the surface becomes a problem. Occurs.
- the problem of static electricity is particularly remarkable for objects that must be handled in a dry atmosphere to maintain device performance, such as semiconductor substrates, glass substrates, and products using these substrates.
- the present inventor has found that the technology disclosed in Reference 2 has such a problem.
- the present invention has been made in view of the above-described problems.
- the spacer sheet and the plate-like material are not provided.
- An object of the present invention is to provide a spacer sheet capable of suppressing contamination by focusing on a contact area and devising a shape thereof, and a method of transporting a plate-like object using the spacer sheet.
- Another object of the present invention is to provide a single plate or a plurality of plates in close contact with each other by using a very small amount of organic matter transfer that causes contamination.
- An object of the present invention is to provide a method for transporting or storing a single or a plurality of plate-like objects, which can greatly reduce a space for transportation and storage by storing.
- the spacer sheet refers to a sheet-like material that is disposed on one or both sides of the plate-like material and has a function of protecting the plate-like material.
- the spacer sheet is disposed on one side or both sides of a single plate-like object, or one side or both sides of a plurality of plate-like objects, and Z or between them.
- the spacer sheet is obtained by giving the sheet a shape suitable for protecting a plate-like object.
- a spacer sheet according to the present invention is a spacer sheet disposed on the surface of a single plate-shaped object or between a plurality of plate-shaped objects, wherein the plate-shaped object and the space sheet are separated from each other.
- S 1 the contact area of the spacer sheet
- S 2 the area of the contact surface side of the spacer sheet
- the organic substance adhesion preventing structure refers to any structure that causes a non-contact portion between the surface of the spacer sheet and the board.
- a pattern shape is formed on the surface of the spacer sheet.
- the pattern shape formed on the surface of the spacer sheet can be reduced if the structure that can reduce the contact area with the substrate is maintained while maintaining the strength of the spacer sheet.
- the pattern is preferably a periodic pattern, and the pattern viewed from a direction perpendicular to the surface of the spacer sheet is more preferably a periodic pattern having a parallelogram as a basic pattern, and the parallelogram is a rhombus. Is especially preferred.
- the spacer sheet of the present invention has ⁇ ⁇ 0 ° when the angle between the projection component of the spacer sheet in the peeling direction on the surface of the spacer sheet and the side of the diamond is ⁇ . It is preferable that
- the parallelogram or rhombus-shaped ft diagonal line forming the basic pattern is substantially parallel to the long side of the circuit board.
- the long diagonal line of the parallelogram or the rhombus shape forming the basic pattern is substantially parallel to the projection component on the spacer sheet in the spacer sheet peeling direction.
- the projected component of the peeling direction onto the spacer sheet is in the long side direction of the spacer sheet.
- the angle between the peeling direction of the spacer sheet and the spacer sheet surface is smaller than 90 °.
- the side of the basic pattern forms a convex portion
- the surface surrounded by the side of the basic pattern forms a concave portion
- the convex portion contacts the plate-like object. Is preferred.
- the spacer sheet of the present invention may be in the form of a net.
- the structural part constituting the net can be defined as a convex part, and the opening of the net can be defined as a concave part.
- a constituent material of the spacer sheet has little organic substance attached to the plate-like material.
- the spacer sheet of the present invention is preferably a spacer sheet arranged between a plurality of plate-like objects.
- the constituent material of the spacer sheet preferably contains at least an organic substance, and is particularly preferably a resin.
- the amount of the organic substance transferred to the plate-like material is preferably 100 ng / cm 2 or less. No. Further, it is preferable that the molecular weight of the organic substance transferred to the plate-like material is 1000 or less.
- the plate-like material is one that is conveyed using the spacer sheet of the present invention, and a glass substrate (for manufacturing a flat panel such as a liquid crystal display, an organic EL display, and a plasma display).
- a glass substrate for manufacturing a flat panel such as a liquid crystal display, an organic EL display, and a plasma display.
- silicon substrates for semiconductor manufacturing semiconductor substrates, resin substrates, circuit boards such as printed boards, printed wiring boards, ceramic substrates such as plates, metal substrates such as plates, plastic substrates, circuit boards, magnetic recording boards, Substrates such as optical recording substrates and magneto-optical recording substrates; optical materials such as lens sheets, prism sheets, retardation films, brightness enhancement sheets, field-of-view expansion sheets, electromagnetic wave shielding sheets, diffusion sheets, lenticular lens sheets, and reflection sheets Sheets; liquid crystal display, organic EL display, and plasma address display Display devices such as devices; optical molded parts such as light guide plate, reflector plate, polarizing plate, retardation plate, diffuser plate, lens,
- the contact surface between the spacer sheet and the plate-like object in the present invention differs depending on the configuration of the spacer sheet. There are two types, a simple sheet shape without an opening penetrating the front and back surfaces, and a mesh sheet shape. Can be roughly divided into
- the contact surface is defined by:
- the length of the spacer sheet in the short side direction is W
- the reference length of the measurement curve is W
- the amplitude distribution curve defined by JIS B0601-1994 on one surface of the spacer sheet is taken.
- n D / Ra.
- Ra is the arithmetic average roughness defined in JIS B0601-1994.
- the contact surface is defined as follows.
- the reference plate surface when the spacer sheet 15 is placed on the reference plate 16 is set to 0, and the height from the surface of the spacer sheet to the inside by Ra, that is, the position of T-Ra Is the measurement line, and the area formed by the intersection of the measurement line and the spacer sheet structure is the contact surface.
- the spacer sheet area is the area of the entire sheet including the recesses or openings.
- the pattern may be irregular or regular, but is preferably a regular periodic pattern from the viewpoint of manufacturing cost, and the shape viewed from a direction perpendicular to the spacer sheet surface is a parallelogram. More preferably, the pattern is a periodic pattern having a basic pattern, and the parallelogram is particularly preferably a diamond.
- thermosetting whether thermoplastic 'raw, preferably has a small transfer amount of organic substances, particularly preferred are those organic transfer amount is less than l OO ng Z cm 2 . Further, the molecular weight of the transferred organic substance is preferably 100,000 or less, more preferably 100,000 or less, and particularly preferably 100,000 or less.
- thermoplastics are preferred in view of cost / productivity.
- thermoplastic resin examples include polyolefins such as polyethylene and polypropylene; polystyrene, polyvinyl chloride, polyurethane, polyester, polypropylene, polyamide, and polycycloolefin.
- thermoplastic resins polyolefins, polyurethanes, polyesters, polycarbonates and polycycloolefins are preferred because they have a particularly small transfer amount of organic substances and are excellent in performance as a phenolic. Cycloolefins are more preferred, and olefins and polycycloolefins are particularly preferred.
- polyester polyethylene terephthalate is preferred.
- polyethylene is preferable.
- the plate-like material is a plate-like material.
- the term “plate-like” refers to a shape that is thin and thin, and the length of the object in the longitudinal direction and the length in the direction perpendicular thereto are sufficiently longer than the length (thickness) in the transverse direction.
- the surface including the longitudinal direction and the direction perpendicular thereto may be a flat surface, may be a curved surface, or may have a step.
- the plate-like object may have a structure to have a surface to be protected requiring the spacer sheet of the present invention as a part thereof, and have a part which is not plate-like as a whole.
- the plate-like material (the average of the length of the plate-like material in the longitudinal direction and the length in the direction perpendicular thereto) Value) / (thickness at the place where the thickness of the plate-like object is the largest) is preferably 3 or more, more preferably 10 or more, further preferably 100 or more, and particularly preferably 100 or more. Is preferably used. .
- peeling An operation of removing the spacer sheet is performed when the spacer sheet of the present invention is sandwiched and wrapped in a plate-like material such as a substrate, and the package is opened after transporting and transporting the package. .
- This is referred to as peeling in the present application.
- the direction of peeling it is not practical to peel the sheet completely perpendicular to the surface of the sheeter, that is, to peel off the sheet so that it lifts the entire sheet. It is efficient to peel off by pulling in the direction. In this month, this direction is called the peeling direction.
- the angle between the peeling direction and the spacer sheet surface is
- the projection component of the peeling direction to the spacer sheet be the long side direction of the spacer sheet.
- the bow I is perpendicular to the peeling direction and if there is a contact surface, the line is drawn. Since a large amount of static electricity is instantaneously generated at the moment of peeling, it is preferable that the peeling direction and the line direction are not parallel.
- the projection component on the spacer sheet in the peeling direction and the long diagonal of the parallelogram are as follows: Substantially parallel is preferable from the viewpoint of preventing static electricity.
- the term “substantially parallel” means that the angle formed by the projected component and the long diagonal is 30 ° or less, preferably 10 ° or less, and particularly preferably 3 ° or less.
- the contact area S 1 with the plate is the contact surface side of the spacer sheet. Area smaller than S2. Therefore, it is possible to protect the surface while stacking or packing the plate-like objects at a high density, and to reduce the amount of static electricity generated at the time of peeling. In other words, since the amount of dust and the like can be reduced while reducing the packaging volume, transportation costs can be reduced without reducing reliability. Can be reduced.
- the contact area with the plate-like object can be reduced while maintaining mechanical strength.
- the constituent material of the spacer sheet has a small amount of organic substances attached to the plate-like objects, contamination of the plate-like objects by organic substances is caused. This can contribute to the improvement of the reliability of the plate-like material and the reduction of the cleaning cost in the post-process.
- the spacer sheet of the present invention is composed of an organic substance such as a resin as a preferred embodiment, the surface pattern can be formed at low cost.
- Optical sheets such as electromagnetic wave shielding sheets, diffusion plates, diffusion sheets, lenticular lens sheets, and reflection sheets, optical molded parts such as lenses and prisms can be highly integrated at low cost, and organic substances and debris can adhere. Since contamination does not easily occur, it is necessary to improve reliability and reduce post-process washing. Can.
- Products manufactured using various substrates transported using the spacer sheet of the present invention such as semiconductor devices, circuit boards, magnetic recording devices, optical recording devices, magneto-optical recording devices, light guide plates, and lenses
- Products such as sheets, prism sheets, reflectors, polarizers, and molded ceramic plates can be provided.
- FIG. 1 is a diagram illustrating the definition of a contact surface in a simple sheet-shaped spacer sheet according to the present invention using an amplitude distribution curve
- FIG. 2 is a diagram illustrating the definition of a contact surface in a mesh sheet-shaped spacer sheet according to the present invention using an amplitude distribution curve
- FIG. 3 is a schematic diagram illustrating a surface of a spacer sheet according to the first embodiment of the present invention.
- FIG. 4 is a schematic diagram illustrating a surface of the spacer sheet according to the second embodiment of the present invention.
- FIG. 5 is a schematic view showing a surface of a spacer sheet according to Embodiment 3 of the present invention.
- 3 to 5 are partial schematic sectional views showing the shapes of spacer sheets according to Examples 1 to 3 of the present invention.
- the surface of the spacer sheet of the present invention has minute projections.
- the height of the convexity is usually 1 mm or less, preferably 0.5 mm or less, and more preferably 0.1 mm or less.
- the heights of the convex portions and the concave portions need not be particularly uniform, but are preferably as uniform as possible.
- the contact area S 1 and the area S 2 on the contact surface side of the spacer sheet only have to satisfy S 1 and S 2, but S 2 is preferably at least twice as large as S 1. It is more preferably at least 10 times, more preferably at least 10 times.
- the arrangement (pattern) of the contact surfaces is preferably at least partially periodic However, it does not matter whether it is continuous or discontinuous.
- the contact surfaces are distributed uniformly over the entire spacer sheet as much as possible, and it is preferable that the periphery of the spacer sheet has a convex shape.
- the method for imparting the shape of the spacer sheet is not particularly limited, but usually, a transfer method using a transfer roll, a press method using a mold, a pressurized air or vacuum press method, or the like is used. Further, an etching method using a solvent, photolysis, or the like, or a bank forming method for forming a convex portion can be used. Further, the puncture of the convex portion may be formed by a printing method using a printing technique such as an ink jet.
- the method of using the spacer sheet of the present invention is such that when used on a single plate-like material such as a glass substrate or a silicon substrate, the spacer sheet may be sandwiched between a packing container or a packing bag and the plate-like material. preferable.
- Packaging containers and bags are not specified, but metal, ceramic, or plastic containers or bags with good airtightness and no contamination from the containers or bags themselves are preferred. It is further preferable that these containers or bags are made of polycycloolefin or a purified resin.
- FIG. 3 is a schematic diagram showing the structure of the spacer sheet of the first embodiment.
- trapezoidal projections 21 and 22 are formed on both surfaces thereof by an embossing method.
- polycycloolefin was used as the sheet material.
- the thickness of the spacer sheet is a force that can be selected as appropriate according to the shape and size of the target plate-like object.
- the height of the part 21 was 5 0 111.
- the upper surfaces of the convex portions 21 and 22 were formed in a square shape with a side of 10 m. At this time, the contact area where one of the protrusions 21 and 22 was in contact with the plate-like object was measured by the above-mentioned method, and it was 100 ⁇ m 2 .
- the contact area was 794 cm 2 .
- the sheet area was 144 000 cm 2
- the area ratio of the hornworm was 5.6%
- the amount of generated static electricity due to peeling was about 1 to 20 as compared with the case of full contact.
- a glass substrate contacted with a paper spacer sheet and a glass contacted with the spacer sheet of this embodiment were used.
- the characteristics of the electric elements formed on the substrate were compared.
- a glass substrate was prepared for each of the paper spacer sheet and the spacer sheet of the present embodiment, and A was put on it by a hard mask method.
- an Si 3 N 4 film was formed as an insulating film at a temperature of 400 ° C. by a plasma CVD method.
- A1 was formed on the surface of the formed Si 3 N 4 film by spazota and patterned to form an upper electrode.
- a voltage was applied between the lower electrode and the upper electrode, and the electric field at the time of dielectric breakdown of the insulating film was measured.
- the dielectric strength of the Si 3 N 4 film on the glass substrate in contact with the paper spacer sheet was 1 MV / cm, and the S 3 N 4 film on the glass substrate in contact with the spacer sheet of this example was The withstand voltage of the i 3 N 4 film was 8.2 MV / cm.
- each of the S i 3 N 4 section results of EDX analysis of the film, S i 3 N 4 film on the glass substrate in contact with the paper of the scan Bae Sashito
- the spacer sheet of the present invention did not cause transfer contamination of organic substances on the glass substrate which was a plate-like material, the insulating film on the glass substrate had poor dielectric strength. I could't see it.
- FIG. 3 illustrates the case where the protrusions 21 and 22 are provided on both sides of the sheet, the protrusions may be provided only on one side of the sheet.
- the tip of the projection instead of making the upper surface of the projection a flat surface, the tip of the projection may be cut so that the projection surrounds the recess (opening). That is, a configuration in which a closed curve (or a polygon) is formed by the convex portions surrounding the concave portions may be employed. This configuration has the effect that the contact area can be reduced and the mechanical strength can be maintained.
- FIG. 4 is a schematic diagram showing the structure of the spacer sheet according to the second embodiment.
- a diamond-shaped pattern is formed on the surface thereof by a roll transfer method.
- the sides of the rhombus form the protrusions 31, and the surfaces surrounded by the sides form the recesses 32.
- the height of the projections was 50 / zm, and the thickness of the sheet portion as the base material was 1 ⁇ 0 ⁇ .
- the longer long diagonal line was 8 mm long and the shorter short diagonal line was 4.6 mm long.
- the projection component on the surface of the spacer sheet in the peeling direction of the sheet is in the direction of the white arrow D in the figure (to the right in the figure), and is set in the long side direction of the spacer sheet.
- the spacer sheet of the present embodiment has a rhombic shape on the surface, and since the direction of the projected component on the spacer sheet in the peeling direction is parallel to the long diagonal line of the rhombus, the mechanical strength is increased. It is possible to suppress the occurrence of static electricity due to the large area being peeled off locally while maintaining the same.
- FIG. 5 is a schematic diagram showing the structure of the spacer sheet in the third embodiment.
- the spacer sheet shown in the figure was constructed by combining ribbon-shaped resins 41 and 42 having a fixed width in a net shape and fusing the intersections. In this case, the ribbon width was 5 mm and the ribbon pitch was f 20 mm.
- a contact surface with the plate-like structure is formed at the intersection of the intersecting ribbon-shaped resins 41 and 42.
- the contact area was 89.4 cm 2 .
- a polycycloolefin resin sheet and a polyethylene terephthalate sheet circuit having the same structure as in Examples 1 to 3 and a plurality of non-alcoholic glass substrates were prepared.
- Al-free glass substrate is 2-3 pp ozone in ultrapure water m added, C 0 2 and 0 2 added ozone water
- Flip adjusting the p H of about 5 by, adding 2 to 3 ppm of hydrogen ultra ⁇ , NH 3 was adjusted p H of about 9 by NH 3 Washing was performed with added hydrogen water.
- Each spacer sheet was sandwiched between two non-alert glass substrates, superimposed, placed on the floor, and left for one week. After that, the amount of dust, the amount of organic matter adsorbed, and the molecular weight of the attached organic matter on the contact surface of each alkali-free glass substrate with the spacer sheet were examined. '
- the alkali-free glass substrate a rectangular substrate having a length of 10 cm and a length of 20 cm was used, although the thickness was different.
- the determination of the amount of adsorbed dust was determined by irradiating light from the side to the surface of the glass substrate without contact with the spacer sheet and visually observing the number of foreign substances on the surface.
- the amount of organic matter adsorbed f The glass substrate without heat was heated to 500 ° C in high-purity nitrogen, the volatile components were collected by a collection tube, and the collected organic matter was collected by a gas chromatography mass spectrometer (GC- MS).
- GC- MS gas chromatography mass spectrometer
- the collected organic substance is concentrated by bubbling into a chromate form solution instead of the collection tube used for the organic substance adsorption measurement. Measured using gel permeation chromatography (GPC).
- Table 1 shows the results.
- the amount of attached dust and the amount of organic matter adsorbed were smaller than those of paper, but were observed more.
- One sheet of polycycloolefin spacer having the shape according to the present invention and one sheet of flat polycycloolefin spacer not having the shape according to the present invention are formed on a glass substrate.
- the charge potential on the gates substrate at the time of sticking and vigorous peeling is 500 V or less for the former and 100 V or more for the latter.
- the contact area ratio between the plate-like structure and the spacer sheet is 5.0% to 6.3% has been described. For example, 50% or less may be sufficient, 20% or less is more preferable, and 10% or less is more preferable.
- the contact area with the surface of the plate-like structure is determined by using a force for forming a protrusion by embossing the surface or using a spacer sheet formed in a net shape.
- a flat spacer sheet made of a polycycloolefin resin is used.
- the charge may be removed when the spacer sheet is peeled off while being transported in a state of being in close contact with the plate-like structure.
- a 0.7 mm thick glass substrate is packaged for transportation and storage using a spacer film made of a 0.5 mm thick polycycloolefin resin, the total thickness is 1 It can be done with 2 cm, but this is about 20 times less than the total thickness of 210 cm when avoiding contact between glass substrates and keeping a space of about 2 cm.
- Garbage can be transported and stored in a space-saving environment without garbage and water pollution.
- the present invention is applied to an organic EL display panel, a plasma display panel, a semiconductor substrate, a ceramic substrate, a metal substrate, a circuit substrate, a CD, a DVD, a MO, a hard disk substrate, a prism sheet, a lens sheet, a phase difference film, and a brightness enhancement.
- Sheet, field-of-view sheet, electromagnetic wave shielding sheet, light guide plate, diffusion plate, diffusion sheet, lenticular lens sheet, reflection sheet, lens, prism Adhesion of organic contaminants was extremely low, indicating that product reliability was improved.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Elimination Of Static Electricity (AREA)
- Buffer Packaging (AREA)
Abstract
Description
Claims
Priority Applications (1)
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JP2005513933A JPWO2005026015A1 (ja) | 2003-09-11 | 2004-09-07 | スペーサーシート及びそれを用いる板状物の輸送方法 |
Applications Claiming Priority (2)
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JP2003320034 | 2003-09-11 | ||
JP2003-320034 | 2003-09-11 |
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WO2005026015A1 true WO2005026015A1 (ja) | 2005-03-24 |
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ID=34308592
Family Applications (1)
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PCT/JP2004/013278 WO2005026015A1 (ja) | 2003-09-11 | 2004-09-07 | スペーサーシート及びそれを用いる板状物の輸送方法 |
Country Status (5)
Country | Link |
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JP (1) | JPWO2005026015A1 (ja) |
KR (1) | KR20070024453A (ja) |
CN (1) | CN1845857A (ja) |
TW (1) | TW200519059A (ja) |
WO (1) | WO2005026015A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006273371A (ja) * | 2005-03-29 | 2006-10-12 | Toray Ind Inc | プラスマディスプレイパネル用ガラス基板の輸送方法および該ガラス基板を用いたプラズマディスプレイパネル用部材の製造方法 |
JP2014136754A (ja) * | 2013-01-17 | 2014-07-28 | Sekisui Plastics Co Ltd | 合紙用ポリエチレン系樹脂発泡シート |
JP2016074449A (ja) * | 2014-10-03 | 2016-05-12 | 日本パレットレンタル株式会社 | 樹脂成型材 |
CN108974627A (zh) * | 2017-05-24 | 2018-12-11 | Agc株式会社 | 玻璃夹纸、玻璃板包装体、玻璃夹纸层叠方法及玻璃夹纸层叠装置 |
WO2019136050A1 (en) * | 2018-01-04 | 2019-07-11 | Corning Incorporated | Stacks including a plurality of sheets and an interleaf layer and method of forming said stacks |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4807789B2 (ja) * | 2006-10-19 | 2011-11-02 | 信越化学工業株式会社 | ペリクル梱包用緩衝体および梱包方法 |
US11192338B2 (en) * | 2017-10-12 | 2021-12-07 | Tredegar Surface Protection, Llc | Films for use as interleaves between substrates |
CN114249019A (zh) * | 2020-09-19 | 2022-03-29 | 东莞市创群精密机械有限公司 | 隔离片和叠片式玻璃料框 |
Citations (3)
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JPH0858829A (ja) * | 1994-08-18 | 1996-03-05 | Chisso Corp | 耐受傷性に優れるセパレートシート |
JPH09129719A (ja) * | 1995-08-30 | 1997-05-16 | Achilles Corp | 半導体ウエハの収納構造および半導体ウエハの収納・取出し方法 |
JP2003505875A (ja) * | 1999-07-23 | 2003-02-12 | ブルックス、レイ ジー. | 保存および出荷用に設計された容器内に保持された集積回路(ic)ウェーハの保護システム |
-
2004
- 2004-09-07 CN CNA2004800256421A patent/CN1845857A/zh active Pending
- 2004-09-07 KR KR1020067005051A patent/KR20070024453A/ko not_active Application Discontinuation
- 2004-09-07 WO PCT/JP2004/013278 patent/WO2005026015A1/ja active Application Filing
- 2004-09-07 JP JP2005513933A patent/JPWO2005026015A1/ja active Pending
- 2004-09-09 TW TW093127262A patent/TW200519059A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0858829A (ja) * | 1994-08-18 | 1996-03-05 | Chisso Corp | 耐受傷性に優れるセパレートシート |
JPH09129719A (ja) * | 1995-08-30 | 1997-05-16 | Achilles Corp | 半導体ウエハの収納構造および半導体ウエハの収納・取出し方法 |
JP2003505875A (ja) * | 1999-07-23 | 2003-02-12 | ブルックス、レイ ジー. | 保存および出荷用に設計された容器内に保持された集積回路(ic)ウェーハの保護システム |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006273371A (ja) * | 2005-03-29 | 2006-10-12 | Toray Ind Inc | プラスマディスプレイパネル用ガラス基板の輸送方法および該ガラス基板を用いたプラズマディスプレイパネル用部材の製造方法 |
JP2014136754A (ja) * | 2013-01-17 | 2014-07-28 | Sekisui Plastics Co Ltd | 合紙用ポリエチレン系樹脂発泡シート |
JP2016074449A (ja) * | 2014-10-03 | 2016-05-12 | 日本パレットレンタル株式会社 | 樹脂成型材 |
CN108974627A (zh) * | 2017-05-24 | 2018-12-11 | Agc株式会社 | 玻璃夹纸、玻璃板包装体、玻璃夹纸层叠方法及玻璃夹纸层叠装置 |
WO2019136050A1 (en) * | 2018-01-04 | 2019-07-11 | Corning Incorporated | Stacks including a plurality of sheets and an interleaf layer and method of forming said stacks |
Also Published As
Publication number | Publication date |
---|---|
JPWO2005026015A1 (ja) | 2006-11-16 |
TW200519059A (en) | 2005-06-16 |
KR20070024453A (ko) | 2007-03-02 |
CN1845857A (zh) | 2006-10-11 |
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