WO2005010056A1 - 嫌気硬化性組成物 - Google Patents
嫌気硬化性組成物 Download PDFInfo
- Publication number
- WO2005010056A1 WO2005010056A1 PCT/JP2004/010770 JP2004010770W WO2005010056A1 WO 2005010056 A1 WO2005010056 A1 WO 2005010056A1 JP 2004010770 W JP2004010770 W JP 2004010770W WO 2005010056 A1 WO2005010056 A1 WO 2005010056A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal
- curable composition
- weight
- composition
- component
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
Definitions
- the present invention relates to an anaerobic curable composition which can maintain the same preservability as a conventional anaerobic curable composition and can significantly improve the curing time when an inert metal is used as an adherend.
- An anaerobic curable composition is a curable composition containing a (meth) acrylate ester monomer as a main component, and does not gel for a long time while in contact with air or oxygen, and is kept in a liquid state without being gelled for a long time.
- the composition has the ability to cure rapidly when air or oxygen is cut off or eliminated.
- the composition can be used for bonding and fixing screws, ports, etc., fixing of fitting parts, fixing of flanges, and flanges. It is used for bonding between surfaces, for sealing, and for filling burrows generated in structural parts.
- the anaerobic curable composition is cured by blocking and eliminating air or oxygen.
- the curing time (set time) at this time differs depending on the material of the adherend, even if the composition is the anaerobic curable composition having the same composition. This is because the anaerobic curable composition oxidizes the metal that is the adherend, which itself is reduced and is cured by this chemical reaction, so the curing time (set time) differs depending on the material of the adherend. That is.
- adherends that have been treated with antioxidants such as gloss chromate and green chromate have a low ability to react anaerobic curable compositions due to the low amount of active metal ions on the adherend surface, and are cured.
- antioxidants such as gloss chromate and green chromate
- adherends it is considered important to oxidize the adherend surface as quickly as possible.
- An anaerobic curable composition with an improvement in the composition is generally used.
- Patent Document 1 Japanese Patent Publication No. 2-4 4 3 4 5
- Patent Document 2 Japanese Patent Publication No. 48-9404
- the anaerobic curing mechanism is basically a radical polymerization using an organic peroxide as an initiator, the organic peroxide is decomposed by metal ions to start a reaction. Therefore, the presence of metal ions in the anaerobic curable composition causes gelation. Therefore, copper ions and vanadium ions cannot be present in the composition, and it has not been possible to add them to the composition.
- an anaerobic curable composition capable of rapidly curing an inert metal without sacrificing storage stability has been desired, but a satisfactory composition has not been obtained.
- the present invention overcomes the above-mentioned conventional problems, and provides an anaerobic curable composition having improved fast-curing properties with respect to an inert metal while maintaining the same preservability as a conventional anaerobic curable composition.
- the purpose is to do. That is, the present invention provides (a) a compound having at least one or more radically polymerizable functional groups in a molecule, (b) an organic peroxide, (c) o-benzoixulfimide, (d) An anaerobic curable composition comprising a complex of a metal other than an alkali metal and ethylenediaminetetraacetic acid, or a complex of a metal other than an alkali metal and diethylenetriaminepentaacetic acid.
- radical polymerizability examples of the functional group include an atalyloyl group, a (meth) atalyloyl group, a butyl group, and a propyl group.
- Compounds having one such functional group are generally referred to as radically polymerizable monomers, such as methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, and 2-ethyl.
- (meth) acryl is a generic term for acryl and methacryl.
- Radical polymerizable polyfunctional monomers include ethylene glycol diacrylate, polyethylene glycol resin (meth) atalylate, neopentyl glycol di (meth) atalylate, trimethylolpropane tri (meth) atalylate, and pentaerythritol tetraatali. And dipentaerythritol poly (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, and the like.
- Radical polymerizable oligomers include epoxy-modified (meth) acrylates, hydroxyl-containing (meth) acrylates, and terminal isocyanates obtained by reacting acrylic acid, methacrylic acid, or a polymer thereof with an epoxy group of glycidyl ether such as bisphenol.
- a urethane bond-containing (meth) acrylate obtained by reacting with a group-containing compound, a compound in which a (meth) atalyloyl group is reacted at the end of a polyether resin, and a (meth) atalyloyl group is reacted at the end of a polyester. And the like.
- Radical polymerizable monomer and radical It is preferable to use a mixture of polymerizable oligomers.
- the organic peroxide (component (b)) used in the present invention has been conventionally used in an anaerobic curable composition and is not particularly limited.
- cumenehydride peroxide t-butyl Hydroperoxides such as norehydroperoxide, ⁇ -menthanide peroxide, etc.
- dicumyl peroxide t-butyl methyl peroxide, di-t-butyl peroxide, etc.
- Diaryl peroxides methyl ethyl ketone peroxide, ketone peroxides such as cyclohexaneperoxide, methylcyclohexaneperoxide, etc., benzoyl peroxide, lauroyl peroxide, acetyl baxide, etc.
- di-cinoleperoxide t-p-inoleoxy benzoate
- t-p-inolereoxy Cetearyl Ichito organic peroxides such as par O alkoxy esters such as t- Petit helper O screeching oleate and the like.
- the amount of the component (b) is usually 0.1 to 5 parts by weight based on 100 parts by weight of the total weight of the component (a). When the amount is less than 0.1 part by weight, it may be insufficient to cause a polymerization reaction, and when the amount is more than 5 parts by weight, the stability of the anaerobic curable composition may decrease.
- the component (c) used in the present invention is o-benzoitutasulfimide and is a component usually used in an anaerobic composition.
- o-Benzoxulfimide is a so-called saccharin, and the component (c) is usually added in an amount of 0.1 to 5 parts by weight based on 100 parts by weight of the component (a).
- the component (d) used in the present invention is a complex of a metal other than an alkali metal and ethylenediaminetetraacetic acid (EDTA) or diethylenetriaminepentaacetic acid (DTPA).
- EDTA ethylenediaminetetraacetic acid
- DTPA diethylenetriaminepentaacetic acid
- the metal forming the complex is an alkali metal, the effects of the present invention cannot be obtained.
- Suitable metals for the present invention include Mg, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Al, and Ag.
- Ethylenediaminetetraacetic acid and diethylenetriaminepentaacetic acid are known as metal chelators. If metal ions are present in the anaerobic curable composition, the storage stability is impaired for the reasons described above. Metal ions are mixed in during the manufacturing process or are present in the raw material itself.Addition of a metal chelating agent captures metal ions, keeps them inactive, and improves storage stability. There is. As this chelating agent, ethylenediaminetetraacetic acid or triethylenetetraminehexaacetic acid was used, but it was used as a simple substance instead of a metal complex or as a sodium salt. However, even if only ethylenediaminetetraacetic acid, diethylenetriaminepentaacetic acid or a sodium salt thereof which is not a complex is added, the effect of the present invention is not exerted at all.
- Metal ions such as Cu and Fe are considered to be excluded from the anaerobic curable composition, and no studies have been made to actively add them. However, when organic peroxide and metal ions are stored in separate containers, such as a two-component curable SGA adhesive, the storage stability is not affected, so metal ions should be used positively. it can. However, when these metal ions are used in a one-part anaerobic curable composition, they immediately gel, and a practical curable composition cannot be obtained.
- the metal complex of ethylenediaminetetraacetic acid and the metal complex of diethylenetriaminepentaacetic acid of the present invention may not be a complex with a single metal ion.
- the ethylenediaminetetraacetic acid / diethylenetriaminepentaacetic acid used in the metal complex of the present invention may be a salt with sodium hydroxide or the like. That is, the metal complex of the present invention may be a complex of such a salt and a metal ion (for example, a complex of ethylenediaminetetraacetic acid 2-sodium salt and Fe). Rather, from the viewpoint of availability, it is preferable that ethylenediaminetetraacetic acid / diethylenetriaminepentaacetic acid be a salt with sodium hydroxide or the like.
- the component (d) can be added in an amount of 0.01 to 2 parts by weight per 100 parts by weight of the component (a). If the compounding ratio of (d) is less than 0.01 part by weight, the effect as a polymerization accelerator may be insufficient, and if it exceeds 2 parts by weight, the storage stability of the anaerobic composition may deteriorate. is there.
- the composition may contain a small amount of a component that promotes polymerization in addition to the above components.
- the polymerization accelerator include an amine compound, a mercaptan compound, and a hydrazine derivative.
- Amine compounds are heterocycles such as 1,2,3,4-tetrahydroquinoline and 1,2,3,4-tetrahydroquinaldine.Secondary amines, heterocycles such as quinoline, methylquinoline, quinaldine, quinoxaline phenazine and the like.
- Aromatic tertiary amines such as tertiary amines, N, N-dimethyl-1-anisidine, N, N-dimethyla-line, 1,2,4-triazole, oxazole, oxaziazole, thiadiazo monole, benzotriazonole And azole compounds such as hydroxybenzotriazonole, benzothiazonole, benzoxazonole, 1,2,3-benzothiazoiazole / re, 3-menolecaptobenzozotrizole and the like.
- Examples of the mercaptan compound include linear mercaptans such as n-dodecyl mercaptan, ethyl mercaptan, and butyl mercaptan.
- Examples of the hydrazine derivative include, but are not limited to, ethylcarbazate, N-aminonorehodanine, acetinolefedinorehydrazine, and p-ditrophenylhydrazine and p-trisulfonylhydrazide.
- the present invention can further use various additives.
- a radical absorbent such as benzoquinone, hydroquinone, or hydroquinone monomethinoleate can be added.
- metal chelating agents such as ethylenediaminetetraacetic acid or its 2-sodium salt, oxalic acid, acetylaceton, o-aminophenol and the like may be added.
- a thickener, a filler, a plasticizer, a colorant, and the like can be used as needed to adjust the properties of the anaerobic curable resin and the properties of the cured product.
- the composition of the present invention has a high curing rate and improved adhesive strength even when an inert metal is used as an adherend.
- the storage stability is the same as that of the conventional anaerobic curable composition, even though the curing speed has been increased, and the composition can be stored at room temperature for a long time.
- HEMA 2-hydroxylethylmetharylate
- a base resin was prepared by mixing 50 parts by weight, 1 part by weight of cumenehydride peroxide as the component (b), and 1 part by weight of o-benzoic acid sulfide as the component (c).
- the anaerobic curable composition was prepared by adding 100 parts by weight of the base resin to the copper complex of sodium diethylenediaminetetraacetic acid (EDTA2NaNaCu) in an amount shown in Table 1 as a component (d). Prepared. The following evaluation tests were performed on the obtained compositions.
- Adhesion strength Apply one drop of each composition to the thread of JISB 3L 180 glossy chromate hexagon bolt (M10, P I. 5x2 Omm).
- the hexagonal nut of the mouth mat was tightened to the middle of the bolt with ON ⁇ m and left at 25 ° C and 40% environment for 24 hours. Then, using a torque measuring device, the nut was continuously rotated in the loosening direction, and the torque at the point where the nut began to move for the first time (during adhesive rupture) was measured.
- Examples 15 to 19 and Comparative Example 5 were performed by changing the type of metal ion of the EDTA metal complex.
- 0.02 parts by weight of the EDTA metal complex was dissolved in 0.2 parts by weight of purified water to add a constant solubility, and then added.
- the EDTA metal complex those whose metals were Mg, Mn, Fe, Ni, and Ca, or purified water alone, omitting the EDTA metal complex, were used.
- Example 3 The same evaluation test as in Example 1 was performed on each of the obtained compositions. However, regarding the evaluation of the set time, one drop of each composition was applied to Ml 0 volt, the nut was set at ON ⁇ m, and the measurement was performed every 10 minutes. Table 3 shows the evaluation results. As can be seen from Table 3, when the metal complex of EDTA was added, the set time was clearly improved as compared with the case where no metal complex was added. Table 3
- compositions were prepared by adding a metal complex of a compound referred to as another chelating agent instead of the component (d) of the present invention, based on the formulation of Example 1.
- a metal complex of a chelating agent based on the formulation of Example 1.
- the metal complexes of the chelating agents used were -copper triacetate (NTA), vanadium hydroethyliminodiacetic acid (HI DA), and triethylenetetramine hexaamine.
- NTA -copper triacetate
- HI DA vanadium hydroethyliminodiacetic acid
- PDTA triethylenetetramine hexaamine.
- a copper complex of acetic acid (TTHA) and an iron complex of propanediaminetetraacetic acid (PDTA) were used.
- Comparative Examples 10 to 13 are based on the formulation of Example 1, and instead of the complex of the present invention, EDTA simple substance, sodium salt of EDTA, DTPA simple substance, sodium salt of DTPA are added to the base resin in an amount of 0.02 parts by weight.
- a composition was prepared by adding 0.01 parts by weight of copper oxide.
- Example 4 The same evaluation test as in Example 1 was performed on each of the compositions obtained above. On the other hand, the set time was measured in the same manner as in Example 15. The evaluation results are shown in Table 4. As can be seen from Table 4, it was confirmed that the chelating agent which is not the component (d) of the present invention had no effect and had poor storage stability.
- the anaerobic curable composition of the present invention can be rapidly cured even when the adherend is made of an inactive metal, and can be used for bonding screws and ports, fixing, fixing fitting parts, bonding between flange surfaces, sealing, etc. Suitable for.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Polymerisation Methods In General (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/565,553 US20060189724A1 (en) | 2003-07-25 | 2004-07-22 | Anaerobically curable composition |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003279578 | 2003-07-25 | ||
JP2003-279578 | 2003-07-25 | ||
JP2003366853A JP2005060650A (ja) | 2003-07-25 | 2003-10-28 | 嫌気硬化性組成物 |
JP2003-366853 | 2003-10-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005010056A1 true WO2005010056A1 (ja) | 2005-02-03 |
Family
ID=34106898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/010770 WO2005010056A1 (ja) | 2003-07-25 | 2004-07-22 | 嫌気硬化性組成物 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060189724A1 (ja) |
JP (1) | JP2005060650A (ja) |
KR (1) | KR20060058691A (ja) |
MY (1) | MY136324A (ja) |
WO (1) | WO2005010056A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103160211A (zh) * | 2011-12-19 | 2013-06-19 | 烟台德邦科技有限公司 | 一种太阳能晶硅棒拼接胶及其制备方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5201312B2 (ja) * | 2007-03-30 | 2013-06-05 | 株式会社スリーボンド | 嫌気硬化性組成物 |
US20090278084A1 (en) * | 2008-05-07 | 2009-11-12 | Henkel Corporation | Cure accelerators for anaerobic curable compositions |
JP2011083698A (ja) * | 2009-10-15 | 2011-04-28 | Tdk Corp | ノズル、塗布装置および部品の接着方法 |
CN103237821B (zh) * | 2010-12-03 | 2016-04-27 | 三键精密化学有限公司 | 固化性组合物 |
JP6447868B2 (ja) * | 2014-12-22 | 2019-01-09 | 株式会社スリーボンド | 嫌気硬化性接着剤 |
GB2548918B (en) | 2016-04-01 | 2020-07-15 | Henkel IP & Holding GmbH | Anaerobically curable (meth)acrylate compositions |
CN110643317B (zh) * | 2019-09-25 | 2023-03-24 | 玉环鑫淼建材有限公司 | 一种厌氧胶组合物及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02160881A (ja) * | 1987-12-25 | 1990-06-20 | Toagosei Chem Ind Co Ltd | 接着剤組成物 |
JPH04339812A (ja) * | 1990-09-25 | 1992-11-26 | Loctite Corp | 硬化性組成物と配合物、ならびに支持体の接着又は密着法 |
JP2003519713A (ja) * | 2000-01-13 | 2003-06-24 | ヘンケル ロックタイト コーポレイション | 最適化嫌気性接着剤組成物及びその製法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH068407B2 (ja) * | 1986-02-08 | 1994-02-02 | 大倉工業株式会社 | 接着性に優れた嫌気性接着剤 |
JP2674233B2 (ja) * | 1989-09-08 | 1997-11-12 | 東亞合成株式会社 | 接着剤組成物 |
US5256450A (en) * | 1990-08-29 | 1993-10-26 | National Starch And Chemical Investment Holding Corporation | Process for impregnating porous metal articles using water miscible anaerobic sealants |
US5350783A (en) * | 1991-11-21 | 1994-09-27 | Biolan Corporation | Compostable thermoplastic products |
JP4418992B2 (ja) * | 1997-07-30 | 2010-02-24 | 株式会社スリーボンド | 暗反応硬化組成物の硬化方法 |
-
2003
- 2003-10-28 JP JP2003366853A patent/JP2005060650A/ja active Pending
-
2004
- 2004-07-22 WO PCT/JP2004/010770 patent/WO2005010056A1/ja active Application Filing
- 2004-07-22 US US10/565,553 patent/US20060189724A1/en not_active Abandoned
- 2004-07-22 KR KR1020067001712A patent/KR20060058691A/ko not_active Application Discontinuation
- 2004-07-23 MY MYPI20042971A patent/MY136324A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02160881A (ja) * | 1987-12-25 | 1990-06-20 | Toagosei Chem Ind Co Ltd | 接着剤組成物 |
JPH04339812A (ja) * | 1990-09-25 | 1992-11-26 | Loctite Corp | 硬化性組成物と配合物、ならびに支持体の接着又は密着法 |
JP2003519713A (ja) * | 2000-01-13 | 2003-06-24 | ヘンケル ロックタイト コーポレイション | 最適化嫌気性接着剤組成物及びその製法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103160211A (zh) * | 2011-12-19 | 2013-06-19 | 烟台德邦科技有限公司 | 一种太阳能晶硅棒拼接胶及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
US20060189724A1 (en) | 2006-08-24 |
KR20060058691A (ko) | 2006-05-30 |
JP2005060650A (ja) | 2005-03-10 |
MY136324A (en) | 2008-09-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2343339B1 (en) | Adhesive composition and adhesion method | |
US8323448B2 (en) | Adhesive composition and bonding method | |
EP2978777B1 (en) | Ultraviolet curable pressure sensitive adhesives | |
WO2010092995A1 (ja) | 光学部材用放射線硬化型粘着剤組成物および粘着型光学部材 | |
WO2005010056A1 (ja) | 嫌気硬化性組成物 | |
JPH01168777A (ja) | 接着剤組成物 | |
CN1181152C (zh) | 厌氧可固化的组合物 | |
WO2014091830A1 (ja) | 二液型硬化性樹脂組成物 | |
JPH01168776A (ja) | 二液主剤型アクリル系接着剤組成物 | |
EP0802249B1 (en) | Curable resin composition | |
JP6739519B2 (ja) | 組成物 | |
JPS6176578A (ja) | 二液タイプのラジカル重合硬化性組成物 | |
JPS638152B2 (ja) | ||
JPH0232304B2 (ja) | Akurireetonokokaseisoseibutsu | |
CN100398568C (zh) | 厌氧固化性组合物 | |
WO2007097373A1 (ja) | 嫌気硬化性組成物 | |
KR20230150341A (ko) | 접착제 조성물, 접합체 및 접착제 조성물의 제조 방법 | |
JPH09125011A (ja) | 耐熱性アクリル系接着剤組成物 | |
JP3661626B2 (ja) | 嫌気硬化性組成物 | |
JPS59223771A (ja) | 接着性組成物 | |
JP5517459B2 (ja) | 粘着剤組成物の製造方法 | |
CN117999299A (zh) | 组合物、接着剂及接合体 | |
JP2008156514A (ja) | 混合物の保存方法および粘着剤組成物の保存方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200480027166.7 Country of ref document: CN |
|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2006189724 Country of ref document: US Ref document number: 10565553 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020067001712 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 1020067001712 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 10565553 Country of ref document: US |
|
122 | Ep: pct application non-entry in european phase |