WO2004105105A1 - Appareil de support, appareil d'exposition, et procede de production de dispositif - Google Patents

Appareil de support, appareil d'exposition, et procede de production de dispositif Download PDF

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Publication number
WO2004105105A1
WO2004105105A1 PCT/JP2004/006823 JP2004006823W WO2004105105A1 WO 2004105105 A1 WO2004105105 A1 WO 2004105105A1 JP 2004006823 W JP2004006823 W JP 2004006823W WO 2004105105 A1 WO2004105105 A1 WO 2004105105A1
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WO
WIPO (PCT)
Prior art keywords
stage
axis
stator
axis direction
unit
Prior art date
Application number
PCT/JP2004/006823
Other languages
English (en)
Japanese (ja)
Inventor
Makoto Kondo
Hideaki Hara
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2005506345A priority Critical patent/JPWO2004105105A1/ja
Publication of WO2004105105A1 publication Critical patent/WO2004105105A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation

Definitions

  • the present invention relates to a stage apparatus, an exposure apparatus, and a device manufacturing method, and more particularly, to a stage apparatus having a stage on which an object is mounted and movable in a two-dimensional plane, and including the stage apparatus.
  • the present invention relates to an exposure apparatus that performs, and a device manufacturing method using the exposure apparatus.
  • a resist or the like is applied to a pattern formed on a mask or a reticle (hereinafter, collectively referred to as a "reticle”) via a projection optical system.
  • stepper a repeat type reduction projection exposure apparatus
  • An AND'scan type scanning projection exposure apparatus (retro scanning 'stepper) or the like is mainly used.
  • a stage apparatus including a stage that holds a wafer as an object to be exposed and moves two-dimensionally and a drive mechanism that drives the stage is used.
  • a linear motor type stage device having a linear motor as a driving source has become mainstream.
  • This linear motor type stage device includes a first axis linear motor that drives the stage in a first axis direction, and a second axis direction that is orthogonal to the first axis and is integrated with the first axis linear motor and the stage.
  • a two-axis drive linear motor type stage device having a pair of second-axis drive motors that are driven in parallel is relatively frequently used. In this case, the positional relationship between the stator of the first axis linear motor and the stage in the second axis direction is maintained substantially constant by the gas static pressure bearing or the magnetic bearing provided therebetween.
  • each of the second-axis linear motors is, for example, a fixed member whose both ends are supported by a support member or a vibration isolator installed on the floor. Due to electromagnetic interaction between the linear guide as a child and the linear guide. And a slider as a mover that moves in the longitudinal direction of the linear guide due to the electromagnetic force generated by the slider.
  • each slider is provided at one end and the other end in the longitudinal direction of the linear guide constituting the stator of the first-axis linear motor, and has a fixed surface formed with a guide surface for guiding the stage. It moves along the board.
  • the stage can be minutely rotated integrally with the first axis linear motor.
  • the stage has often adopted a configuration in which it is levitated and supported by a non-contact bearing, for example, an air bearing, on a guide surface on the surface of the surface plate (for example, see Patent Documents 1 and 2).
  • Patent Document 1 JP-A-11-352266
  • Patent Document 2 JP-A-8-233964
  • the present invention has been made under vigorous circumstances, and a first object of the present invention is to provide a stage device capable of improving the position controllability of a stage on which an object is placed. It is in that.
  • a second object of the present invention is to provide an exposure apparatus capable of improving the transfer accuracy of a pattern onto a photosensitive object.
  • a third object of the present invention is to provide a device manufacturing method capable of improving the productivity of a highly integrated device.
  • the present invention provides a stage on which an object is placed; a mover unit provided on the stage; and an electromagnetic interaction between the mover unit and the stage. Is driven in the first axis direction at a predetermined stroke, and in a second axis direction orthogonal to the first axis and orthogonal to the first axis and the second axis in a plane parallel to the moving surface of the stage.
  • a first drive mechanism having a stator unit extending in the first axis direction and minutely driven around a third axis; and one end and the other end of the stator unit in the first axis direction.
  • the stator unit is integrated with the corresponding first mover by the electromagnetic interaction between the pair of first movers respectively provided and the respective first movers in the second axial direction.
  • a second driving mechanism having a pair of first stators for generating a driving force;
  • a first plate guide surface for guiding the over-di are formed; and the first plate are vibrationally separated, supporting surface for supporting the stator unit with respect to said third axis direction are formed, the A pair of
  • At least one second platen for supporting each of the stators.
  • the stage is guided by the guide surface formed on the first platen, and is integrated with the mover unit constituting the first drive mechanism, and is connected to the mover unit and the stator unit. Electricity between Due to the driving force generated by the magnetic interaction, it is driven in the first axis direction and minutely driven in the rotation directions around the second and third axes.
  • the stage is guided by a guide surface formed on the first platen, and an electromagnetic interaction between a pair of first stators constituting the second drive mechanism and a pair of first movers corresponding thereto.
  • the pair of first movers is driven in the second axial direction integrally with the stator units provided respectively at one end and the other end in the longitudinal direction by the driving force generated by the above.
  • the stator unit that constitutes the first drive mechanism is supported in the third axial direction by a support surface formed on the second platen that is vibrationally separated from the first platen.
  • the stage can be finely driven in the second axis direction by a driving force generated by an electromagnetic interaction between the mover unit and the stator unit. It is necessary to provide an air bearing or the like in order to maintain the positional relationship in the two axial directions, and the stage can be accurately moved to a desired position in the second axial direction. In this case, the movement of the stator unit in the second axis direction does not directly affect the stage. This makes it possible to maintain high stage position control accuracy when driving the stage in the second axis direction without driving the stage in the second axis direction as a vibration factor of the stage.
  • the stage is driven in the first axial direction along the stator unit while being guided on the guide surface by a driving force generated by electromagnetic interaction between the mover unit and the stator unit. Therefore, the stage does not vibrate during this drive.
  • the reaction force generated by this drive is transmitted to the second surface plate supporting each first stator via the stator unit. This vibration is not transmitted to the first platen.
  • stator unit and the mover unit allow a change in the relative position of the first platen and the second platen in the third axial direction during the stage running.
  • the interval in the third axis direction may be set.
  • the stator unit includes a second stator extending in the first axial direction, and one side of the second axial centered on the second stator.
  • a pair of third stators respectively arranged on the other side and extending in the first axial direction, wherein the mover unit is configured to move the stage by the electromagnetic interaction between the movable unit and the second stator. Electromagnetic interaction is individually performed between the second mover that generates a driving force for minutely driving in the axial direction and the pair of third stators, and the drive that drives the stage in the first axial direction. It may include a pair of third movers each generating a force.
  • the stage includes a stage main body provided with the mover unit, and a minute drive that holds the object on the stage main body and at least moves in the third axis direction. And a possible table.
  • the second drive mechanism may include a pair of moving coils, wherein each of the first movers comprises an armature unit and each of the first stators comprises a magnetic pole unit. And a linear motor of the same type.
  • a first bearing mechanism is provided on the stage so as to face the guide surface, and supports the stage in non-contact with the guide surface;
  • a second bearing mechanism provided on the stator unit so as to face the support surface of the second platen, and supporting the stator unit in a non-contact manner with respect to the support surface.
  • Power S can.
  • each of the first stators has at least a relative movement in the second axial direction in a state where the frictional force between the first stator and the second platen is substantially zero. It can be accepted.
  • two position adjusting mechanisms for adjusting the position of each of the first stators in the second axial direction may be further provided.
  • each of the second driving mechanisms has a magnetic pole unit as a stator.
  • Each of the position adjusting mechanisms may include a part of the magnetic pole unit as a mover.
  • the stator unit may allow at least relative movement in the first axial direction in a state where the frictional force between the stage and the guide surface is substantially zero. It can be done.
  • a pair of the second bases is provided corresponding to the pair of the first stators, and at least one specific base of the pair of the second bases is provided with respect to a floor surface.
  • the apparatus may further include a transmission mechanism that is movable and transmits a reaction force generated when the mover unit is driven in the first axis direction to the specific surface plate via the stator unit.
  • the canceling mechanism includes an electromagnetic interaction between the stator fixed on the specific surface plate and the stator. And a movable element that generates a reaction force in a direction that cancels the rotation of the specific surface plate due to the rotational moment.
  • the canceling mechanism may move the movable element by a predetermined amount according to a position of the first movable element in the second axial direction and a driving amount of the stage in the first axial direction. Can be driven in a predetermined direction.
  • a stage on which an object is placed a mover unit provided on the stage; and an electromagnetic interaction between the mover unit and the stage. Is driven in the first axis direction at a predetermined stroke, and in a second axis direction orthogonal to the first axis and orthogonal to the first axis and the second axis in a plane parallel to the moving surface of the stage.
  • a first drive mechanism having a stator unit extending in the first axis direction and minutely driven around a third axis; and one end and the other end of the stator unit in the first axis direction.
  • the stator unit is integrated with the corresponding first mover by the electromagnetic interaction between the pair of first movers respectively provided and the respective first movers in the second axial direction.
  • Drive to A second drive mechanism having a pair of first stators that generate a driving force; and each of the first stators is supported in a state in which movement in at least the second axial direction is allowed.
  • a second stage device having a pair of first stators that generate a driving force; and each of the first stators is supported in a state in which movement in at least the second axial direction is allowed.
  • the first drive mechanism moves the stage in the first axial direction by electromagnetic interaction between the mover unit provided on the stage and the stator unit extending in the first axial direction.
  • Driving at a constant stroke minute driving in the second axis direction perpendicular to the first axis and around the third axis perpendicular to the first and second axes in a plane parallel to the moving surface of the stage, and the second driving
  • the mechanism is constituted by a pair of first movers provided at one end and the other end of the stator unit in the first axial direction, respectively, and a corresponding one of the first movers by an electromagnetic interaction between the pair of first stators.
  • the stator unit is driven in the second axis direction integrally with the mover.
  • the stage is driven by the first drive mechanism and the second drive mechanism at a predetermined stroke in the first and second axis directions, and is minutely driven around the second axis direction and the third axis.
  • the pair of first stators since the pair of first stators is supported in a state where movement in at least the second axial direction is permitted, the pair of first stators receive a reaction force generated when the first movable element is driven in the second axial direction. Then, the first stator moves in the direction of the second axis by a predetermined distance in accordance with the law of conservation of momentum, whereby the reaction force is absorbed (canceled). Therefore, since the driving of the stator unit (the pair of first movers) in the second axis direction does not cause the stage to vibrate, the position control accuracy of the stage can be maintained at a high level.
  • stator unit may be allowed to move relative to the stage at least in the first axial direction while the frictional force between the stages is substantially zero.
  • the second stage device of the present invention may further include a first position adjusting mechanism for adjusting a position of at least one of the first stators in the first axial direction.
  • the second stage device of the present invention may further include a second position adjusting mechanism for adjusting the position of each of the first stators in the second axial direction.
  • At least one of the first stators is movable in the first axial direction by a reaction force generated when the stator unit is driven in the first axial direction.
  • a transmission mechanism for transmitting a reaction force generated at the time of driving in the first axial direction to the at least one second base plate via the stator unit may be further provided.
  • the canceling mechanism is driven by electromagnetic interaction between the stator fixed on the at least one second platen and the stator; And a mover that generates a reaction force in a direction that cancels the rotation of one second base plate.
  • an exposure apparatus for transferring a pattern formed on a mask onto a photosensitive object, wherein the photosensitive object is placed on the stage as the object.
  • An exposure apparatus comprising one of the first and second stage devices of the invention.
  • a projection optical system for projecting the pattern onto the photosensitive object; a mask stage on which the mask is mounted; and the second axis in synchronization with the mask stage and the stage.
  • a synchronous movement device that moves relative to the projection optical system with respect to the direction.
  • the productivity of highly integrated microdevices can be improved by transferring a device pattern onto a substrate using the exposure apparatus of the present invention. Therefore, from another viewpoint, the present invention can be said to be a device manufacturing method using the exposure apparatus of the present invention.
  • FIG. 1 is a view schematically showing an exposure apparatus according to one embodiment.
  • FIG. 2 is a perspective view showing the wafer stage device of FIG. 1.
  • FIG. 3 (A) is a view of the wafer stage as viewed from the + X side.
  • FIG. 3 (B) is a plan view showing a wafer stage and a stator unit.
  • FIG. 4 is a view for explaining a configuration of an air bearing 51B provided on a mounting member 65B.
  • FIG. 5 (A) is a diagram (part 1) for describing a drive control method of a pair of X-axis linear motors
  • FIG. 5 (B) is a diagram (part 2) for explaining a drive control method of a pair of X-axis linear motors
  • FIG. 6 is a diagram for explaining a relationship between a position adjustment mechanism and a Y-axis stator.
  • FIG. 7 (A) is a diagram (No. 1) for describing the configuration of the canceling mechanism.
  • FIG. 7 (B) is a diagram (part 2) for describing the configuration of the canceling mechanism.
  • FIG. 8 is a view for explaining a driving method and an operation of the canceling mechanism.
  • FIG. 9 is a perspective view showing a configuration of a stage device according to a first modification.
  • FIG. 10 (A) is a view (No. 1) for describing a method of controlling a canceling mechanism in the stage device of the first modification.
  • FIG. 10 (B) is a diagram (part 2) for describing a method of controlling the canceling mechanism in the stage device of the first modification.
  • FIG. 11 is a perspective view showing a configuration of a stage device according to a second modification.
  • FIG. 12 is a perspective view showing a configuration of a stage device according to a third modification.
  • FIG. 13 is a flowchart for explaining a device manufacturing method according to the present invention.
  • FIG. 14 is a flowchart showing a specific example of step 204 in FIG. 13.
  • FIG. 1 schematically shows an exposure apparatus 10 according to one embodiment in a cross-sectional view.
  • the exposure apparatus 10 includes a reticle R as a mask and a reticle R as a photosensitive object (and an object).
  • This is a step-and-scan type scanning exposure apparatus that transfers data to a plurality of shot areas on the W, that is, a so-called scanning stepper.
  • Exposure apparatus 10 includes an illumination system 12 for illuminating reticle R with illumination light IL, a reticle stage RST on which reticle R is mounted, and a projection for projecting illumination light IL emitted from reticle R onto wafer W.
  • An optical system PL and a stage device 20 on which the wafer W is placed are provided.
  • the illumination system 12 includes a light source, an optical integrator (a fly-eye lens, and an internal reflection) as disclosed in, for example, JP-A-6-349701 and US Pat. No. 5,534,970 corresponding thereto.
  • Illumination uniformizing optical system including a mold integrator or a diffractive optical element, etc., a relay lens, a variable ND filter, a reticle blind, and an illumination optical system consisting of a dike opening mirror and the like. It is composed of To the extent permitted by the national laws of the designated States (or selected elected States) specified in this International Application, the disclosures in the above publications and corresponding US Patents are hereby incorporated by reference.
  • a slit-shaped (or rectangular) illumination area extending in the X-axis direction on the reticle R on which a circuit pattern or the like is formed is provided by the illumination light IL. Illuminate with almost uniform illuminance.
  • far ultraviolet light such as KrF excimer laser light (wavelength 248 nm)
  • vacuum ultraviolet light such as ArF excimer laser light (wavelength 193 nm) or F laser light (wavelength 157 nm) is used.
  • an ultraviolet bright line (g-line, i-line, etc.) from an ultra-high pressure mercury lamp as the illumination light IL.
  • each driving unit in the illumination system 12 for example, a variable ND filter, a reticle blind, and the like are controlled by an illumination control device (exposure controller) (not shown) according to an instruction from the main control device 50.
  • reticle R force S for example, is fixed by vacuum suction.
  • the reticle stage RST is driven by a reticle stage drive unit 22 in an X-axis direction, a Y-axis direction, and a ⁇ z direction in an XY plane perpendicular to an optical axis of the illumination system 12 (coincident with an optical axis AX of a projection optical system PL described later). (Rotational direction around the Z-axis) It can be driven at a designated scanning speed in a predetermined scanning direction (Y-axis direction) along the upper surface of the no-stage base 30.
  • the reticle stage drive section 22 is a single block that is a mechanism that uses a linear motor, a voice coil motor, or the like as a drive source.
  • the reticle stage RST includes a coarse movement stage driven one-dimensionally in the Y-axis direction, and a reticle R with at least three degrees of freedom relative to the coarse movement stage (X-axis direction, Y-axis direction, and ⁇ z direction). It is a matter of course that a stage having a coarse / fine movement structure having a fine movement stage capable of fine driving can be adopted.
  • the position of the reticle stage RST in the XY plane (including the ⁇ ⁇ ⁇ z rotation) is adjusted, for example, by a reticle laser interferometer (hereinafter, referred to as a "reticle interferometer") 16 via a movable mirror 15 through a movable mirror 15. It is always detected with a resolution of about 1 nm.
  • the position information of the reticle stage RST from the reticle interferometer 16 (including rotation information such as the ⁇ z rotation amount (jowing amount)) is supplied to the main controller 50.
  • Main controller 50 drives and controls reticle stage RST via reticle stage drive unit 22 based on the position information of reticle stage RST.
  • an end surface of the reticle stage RST may be mirror-finished to form a reflecting surface (corresponding to the reflecting surface of the moving mirror 15).
  • the projection optical system PL a reduction system whose telescopic magnification is Sl / 4 (or 1/5) on both the object plane side (reticle side) and the image plane side (wafer side) is used. ing. Therefore, when the reticle R is irradiated with the illumination light (ultraviolet pulse light) IL from the illumination system 12, the connection from the portion illuminated by the ultraviolet pulse light in the circuit pattern area formed on the reticle R is formed.
  • the illumination light ultraviolet pulse light
  • the image light beam enters the projection optical system PL, and the image (partial inverted image) of the circuit pattern in the irradiation area of the illumination light IL (the above-mentioned illumination area) is projected at each pulse irradiation of the ultraviolet laser light.
  • an image is formed with a slit (or rectangular (polygonal)) elongated in the X-axis direction.
  • a refraction system including only a refraction optical element is mainly used.
  • F laser light for example, A so-called catadioptric combining a refractive optical element and a reflective optical element (such as a concave mirror or a beam splitter) as disclosed in Japanese Patent No. 3-282527 and the corresponding US Pat. No. 5,220,454.
  • a system (a catadioptric system) or a reflection system consisting of only a reflection optical element is mainly used.
  • a refractive system can be used.
  • the stage device 20 is disposed below the projection optical system PL in FIG. 1, and is a wafer stage WST as a stage for holding the wafer W, and moves the wafer stage WST by a predetermined stroke in the X-axis (first axis) direction. And a first drive mechanism that minutely drives in the rotation direction ( ⁇ z direction) around the Y-axis (second axis) and the Z-axis (third axis), and integrally with the first drive mechanism A second drive mechanism for driving the wafer stage WST in the Y-axis direction is provided.
  • the wafer stage WST is a first platen 4 having a rectangular shape in plan view (as viewed from above) supported substantially horizontally on a floor F of a clean room via a plurality (for example, three) of vibration isolation units 92. 4 is located above.
  • the upper surface 44a of the first platen 44 has a very high degree of flatness and serves as a guide surface for guiding the wafer stage WST.
  • the upper surface 44a of the first platen 44 is also referred to as a “guide surface 44a”.
  • the plurality of vibration isolation units 92 insulate micro vibration ( ⁇ vibration) transmitted from the floor F to the first base 44 at the micro G level.
  • ⁇ vibration micro vibration
  • the first base plate 44 is actively damped based on the output of a vibration sensor such as a semiconductor accelerometer fixed to a predetermined portion of the first base plate 44, respectively. It is of course possible to use an active vibration isolator.
  • the wafer stage WST includes, as shown in FIG. 2, a wafer table WTB for holding a wafer W, and a stage body 100 for supporting the wafer table WTB via a tilt drive mechanism 96a 96c. It has.
  • the stage body 100 is formed by a frame having a rectangular YZ section. It is configured.
  • the stage body 100 is provided with a top plate 99a and a bottom plate 99b arranged at a predetermined interval in the Z-axis direction, and a predetermined interval in the Y-axis direction between the top plate 99a and the bottom plate 99b. It has two side plates 99c and 99d connecting the both.
  • a polygonal plate member in plan view (as viewed from above) is used as the top plate 99a, and rectangular plate members are used as the remaining plates 99b, 99c, and 99d.
  • a plurality of gas static pressure bearings (eg, air bearings) 94 as a first bearing mechanism are provided on the bottom surface of the bottom plate 99b.
  • a pressurized gas for example, helium or nitrogen gas (or clean air)
  • the wafer stage WST is levitated above the guide surface 44a via a clearance of about several ⁇ m by balancing the pressure and the weight of the wafer stage WST (whole).
  • a magnetic pole unit 76A as a second movable element is fixed to the center of the lower surface of the top plate 99a. Further, a pair of magnetic pole units 76B and 76C as a third movable element is provided on one side and the other side of the magnetic pole unit 76A on the lower surface of the top plate 99a in the Y-axis direction.
  • the magnetic pole unit 76A is provided on a frame member 31 made of a magnetic material having a rectangular YZ section and a pair of opposing surfaces (upper surface and lower surface) inside the frame member 31.
  • a pair of permanent magnets 33A and 33B elongated in the X-axis direction.
  • the permanent magnet 33A and the permanent magnet 33B have opposite polarities. Therefore, between the permanent magnet 33A and the permanent magnet 33B, a magnetic field having a magnetic flux direction of + Z direction (or -Z direction) is generated.
  • one magnetic pole unit 76B of the remaining magnetic pole units 76B and 76C includes a frame-shaped member 35 made of a magnetic material having a rectangular YZ section and a frame-shaped member 35B. It has a plurality of field magnets 37 arranged at predetermined intervals along the X-axis direction on a pair of opposing surfaces (upper surface and lower surface) inside. In this case, the field magnets 37 adjacent in the X-axis direction and the field magnets 37 facing in the Z-axis direction have opposite polarities. Therefore, an alternating magnetic field is formed in the internal space of the frame member 35 in the X-axis direction.
  • the other magnetic pole unit 76C has the same configuration as the magnetic pole unit 76B.
  • the stator unit 60 has an X-axis direction, as can be seen from a combination of Figs. 3 (A) and 3 (B).
  • An armature unit 61A as a second stator having an H-shaped cross section extending in the YZ direction, and a pair of H-shaped cross sections extending in parallel at predetermined intervals on the soil Y side of the armature unit 61A.
  • the armature unit 61A is inserted into a space formed by the permanent magnets 33A and 33B and the frame member 31 that constitute the magnetic pole unit 76A. Further, the armature unit 61B is inserted into the internal space of the magnetic pole unit 76B described above.
  • the electronic unit 61C is inserted into the internal space of the magnetic pole unit 76C described above.
  • the armature units 61A to 61C are connected at one end in the longitudinal direction by, for example, a mounting member 65A. Insert the other longitudinal end of 61C into the interior space of the corresponding magnetic pole unit 76A-76C, and connect the longitudinal end of armature unit 61A-61C with mounting member 65B after the insertion. It is good.
  • armature unit 61A Inside the armature unit 61A, for example, an arrangement is made such that current can flow only in the + X direction or only in the 1X direction in a magnetic field in the Z-axis direction formed in the magnetic pole unit 76A.
  • One or more armature coils are provided.
  • the armature coil for example, a pair of coils that are elongated in the X-axis direction and are arranged at predetermined intervals in the Y-axis direction can be used.
  • the magnitude and direction of the current supplied to the armature coil constituting armature unit 61A are controlled by main controller 50.
  • the magnitude and direction of the driving force (Lorentz force) for driving the magnetic pole unit 76A in the Y-axis direction with respect to the armature unit 61A are arbitrarily controlled. That is, the armature unit 61A and the magnetic pole unit 76A constitute a Y-axis fine movement motor 75A that minutely drives the wafer stage WST in the Y-axis direction.
  • armature unit 61A is also referred to as Y-axis fine movement stator 61A
  • magnetic pole unit 76A is also referred to as Y-axis fine movement movable element 76A.
  • a predetermined interval (place) is provided along the X-axis direction.
  • a plurality of armature coils are arranged at a constant pitch.
  • the magnitude and direction of the current supplied to at least one armature coil located in the alternating magnetic field in the X-axis direction formed in the internal space of the magnetic pole units 76B and 76C are mainly determined.
  • the control unit 50 controls the magnetic pole units 76B and 76C mounted on the stage body 100 with respect to the armature units 61B and 61C in the X-axis direction.
  • the magnitude and direction of the driving force (Lorentz force) are controlled arbitrarily.
  • the wafer stage WST is rotated around the center of gravity Gs by generating driving forces f and 1f of the same size and opposite directions at positions symmetric with respect to the center of gravity Gs of the wafer stage WST.
  • armature units 61B and 61C and magnetic pole units 76B and 76C respectively engaged with them drive wafer stage WST at a predetermined stroke in the X-axis direction, and move wafer stage WST around Z-axis.
  • the moving magnet type X-axis linear motors 75B and 75C are minutely driven in the rotation direction.
  • the armature units 6 IB and 61C are also referred to as X-axis stators 61B and 61C
  • the magnetic pole units 76B and 76C are referred to as X-axis movers 76B and 76C.
  • a mover unit is constituted by the Y-axis fine mover 76A and the X-axis movers 76B and 76C provided on the stage main body 100.
  • the above-described stator unit 60 constitute a first drive mechanism that drives the wafer stage WST by a predetermined stroke in the X-axis direction by electromagnetic interaction and minutely drives the wafer stage WST in the Y-axis direction and around the Z-axis. Have been.
  • one side (one X side) and the other side (+ X side) of the first surface plate 44 in the X-axis direction have an L-shape in an XZ section and a Y-axis direction.
  • the pair of second stools 46A and 46B having the longitudinal direction as the longitudinal direction are arranged in a symmetrical manner.
  • the second platen 46A which is located on one X side of the first platen 44, is fixed on the floor F of the clean room, and the end on the + X side (inside) is a convex portion. Have been.
  • the upper surface of the convex portion (hereinafter also referred to as “first surface” for convenience) 146a ( 2) is a support surface for supporting the stator unit 60 in the Z-axis direction as described later.
  • first surface for convenience
  • second surface for convenience
  • the other second surface plate 46B which is located on the + X side of the first surface plate 44, is levitated and supported via a static gas pressure bearing (for example, an air bearing) 42 on the floor surface F of the clean norem. I have.
  • the second surface plate 46B is symmetrical to the second surface plate 46A, but has the same shape.
  • the second surface plate 46B is formed to be somewhat longer in the Y-axis direction than the second surface plate 46A described above (see FIG. 2).
  • the second platen 46B has a convex portion on the X side (inside) end, and the upper surface of the convex portion (hereinafter also referred to as "first surface” for convenience).
  • the side surfaces 146c and ⁇ X sides (146e, 146f (see FIG. 4)) are support surfaces for supporting the stator unit 60 in the Z-axis direction and the X-axis direction, respectively, as described later.
  • a guide member 48B having the same shape as the above-described guide member 48A is fixed to a one-step lower surface 146d outside the convex portion (hereinafter, also referred to as a “second surface” for convenience).
  • a pair of armatures as first movers are provided at one end and the other end in the longitudinal direction of the stator unit 60 via mounting members 65A and 65B, respectively.
  • Units 64A and 64B are provided.
  • gas static pressure bearings for example, air bearings
  • 51A and 51B (however, in FIG. 2, one second bearing mechanism is provided) as a second bearing mechanism. 51B is not shown, see FIG. 4).
  • the gas static pressure bearing 51A provided on one mounting member 65A is disposed so as to face the upper surface (first surface) 146a of the convex portion of the second surface plate 46A described above. Have been. Pressurized gas (for example, helium or nitrogen gas (or clean air)) is ejected from the static gas pressure bearing 51A toward the first surface 146a, and the static pressure of the pressurized gas causes the static gas pressure bearing 51A. A clearance of about several / zm is formed between the bearing surface of the first surface 146a and the first surface 146a.
  • Pressurized gas for example, helium or nitrogen gas (or clean air)
  • the gas static pressure bearing 51B provided on the other mounting member 65B is as shown in FIG.
  • the second platen 46B is disposed so as to face the first surface 146c of the second platen 46B.
  • the pressurized gas is ejected toward the first surface 146c, and the static pressure of the pressurized gas causes a static pressure between the bearing surface of the gas static pressure bearing 51B and the first surface 146c.
  • a clearance of about several ⁇ is formed.
  • the total force of the stator unit 60 and the pair of armature units 64 ⁇ and 64 ⁇ is in non-contact with the first surfaces 146a and 146c of the second platens 46 ⁇ and 46 ⁇ by the gas static pressure vehicle supports 51A and 51B. In the Z-axis direction.
  • a pair of hydrostatic gas bearings 151a and 151b are fixed to one side and the other side of the air bearing 51B in the X-axis direction.
  • one gas static pressure bearing 151a is arranged to face the side surface 146e of the convex portion of the second platen 46B, and blows out a pressurized gas toward the side surface 146e.
  • the other gas static pressure bearing 151b is arranged to face the side surface 146f of the convex portion of the second platen 46B, and blows out a pressurized gas toward the side surface 146f.
  • the distance between the convex portion and each static gas pressure bearing is approximately several m / m. Clearance is formed and maintained.
  • the convex portion of the second platen 46B also serves as a yaw guide for the stator unit 60.
  • a transmission mechanism that transmits a reaction force generated when the wafer stage WST (movable unit) is driven in the X-axis direction by the static gas pressure bearings 151a and 151b to the second platen 46B via the stator unit 60 is configured. Have been.
  • the vibration isolation unit 92 that supports the first base 44 has a function of insulating vibration transmitted from the floor F.
  • a configuration may be adopted in which the first platen 44 can be minutely driven in the Z-axis direction by the vibration isolation unit 92.
  • the vibration isolating unit 92 is an active vibration isolating device having, for example, an actuator and an air mount, the first platen 44 is actively moved in the Z-axis direction by the actuator to prevent the vibration.
  • the vibration function can also be activated.
  • the first surface plate 44 may be moved in six directions of freedom ( ⁇ , ⁇ , ⁇ , ⁇ ⁇ , ⁇ ⁇ , ⁇ ⁇ , ⁇ ⁇ directions) by the active vibration isolating device so that the vibration is damped. Good les ,. Furthermore, in order to maintain a predetermined positional relationship in the ⁇ -axis direction between the wafer holding surface of the wafer stage WST and the focal position of the projection optical system ⁇ L, It is also conceivable to move the first platen 44 in the Z-axis direction using data or the like. When the first surface plate 44 is moved in this manner, the wafer stage WST on the guide surface 44a of the first surface plate 44 also functions in substantially the same manner as the first surface plate 44.
  • the first surface plate 44 when the first surface plate 44 is configured to be movable in the Z-axis direction, a change in the relative position in the Z-axis direction between the first surface plate 44 and the second surface plates 46A and 46B. Occurs. Further, even when the first platen 44 is configured to be able to move (rotate) in the ⁇ X and ⁇ y directions, the Z-axis direction is provided between the first platen 44 and the second platens 46A and 46B. A change in relative position with respect to In the configuration of the present embodiment, the Y-axis fine movement motor 75A and the X-axis linear motors 75B and 75C have their respective movers (magnetic pole units 76A, 76B and 76C) fixed to the wafer stage WST.
  • the respective stators (armature units 61A, 61B, 61C) are supported on second platens 46A, 46B via a pair of mounting members 65A, 65B.
  • the Y-axis fine movement motor 75A and the X-axis linear motors 75B and 75C The relative position in the Z-axis direction between the stator and the stator will also change.
  • the gap (gap) in the Z-axis direction between the mover and the stator of each of these motors 75A, 75B, and 75C can be maintained even if the first platen 44 moves in the Z-axis direction. It is necessary to predetermine a value that does not cause contact between the stator and the stator. For example, during scanning exposure, if the range in which the first platen 44 can be moved in the Z-axis direction by the vibration isolation unit 92 is set to ⁇ 0.3-3.0 mm from the reference position, the motors 75A, 75B, and 75C will The distance between the mover and the stator in the Z-axis direction is preferably set to about 0.4-4. Omm.
  • each of the motors 75A, 75B, and 75C be configured so that the output in the driving direction does not change due to the gap distance between the mover and the stator.
  • the Z position of the first platen 44 changes during maintenance of the stage device 20 (for example, when the vibration isolating unit 92 has an air mount and the air is released). It is necessary to make sure that the mover of each of the motors 75A, 75B, and 75C does not come into contact with the stator. At this time, if contact cannot be prevented only by the distance between the mover and the stator, a stopper or the like is provided in advance, and after the stopper is used to prevent contact, the first platen 44 May be changed in the Z-axis direction.
  • the parallelism of the guide surface between the first platen 44 and the second platen 46A, 46B changes.
  • the clearance in the static gas pressure bearings 51A, 51B, 151a, 151b decreases, and for example, the bearing may come into contact with the guide surface of the surface plate. Therefore, for example, a hinge mechanism (not shown) having a plate panel, a flexure, and the like is provided between the mounting member 65B and the stator unit 60 and between the mounting member 65A and the hydrostatic gas bearing 51A.
  • the configuration may be such that a change in parallelism can be tolerated.
  • the hinge mechanism provided between the mounting member 65B and the stator unit 60 has a degree of freedom in the y-direction
  • the hinge mechanism provided between the mounting member 65A and the hydrostatic gas bearing 51A. May be configured to have degrees of freedom in the ⁇ X direction and the ⁇ y direction. Due to these hinge mechanisms, even if the parallelism between the first platen 44 and the second platens 46A, 46B changes, the rotation of the gas static pressure bearings 51A, 51B, 151a, 151b is caused by the deformation of the hinge mechanism. Therefore, it is possible to maintain a predetermined clearance in each of the gas static pressure bearings without applying the stress.
  • a pair of magnetic pole units 62A and 62B as a first stator are provided above the second platens 46A and 46B so as to face the pair of armature units 64A and 64B, respectively. It extends along the axial direction.
  • one of the magnetic pole units 62A and 62B has an upper plate member 54A having a rectangular plate shape in plan view (as viewed from above), and A yoke 60A includes a lower plate member 54B having the same shape, and an intermediate member 56 having a U-shaped cross section provided in a state where the upper plate member 54A and the lower plate member 54B are connected to each other.
  • the yoke 60A has a plurality of field magnets 108 disposed on the pair of opposing surfaces (upper and lower surfaces) at predetermined intervals along the Y-axis direction. In this case, the field magnets 108 adjacent in the Y-axis direction and the field magnets 108 facing in the Z-axis direction have opposite polarities. For this reason, an alternating magnetic field is formed in the interior space of the yoke 60A in the Y-axis direction.
  • the other magnetic pole unit 62B is configured similarly to the magnetic pole unit 64A. That is, an upper plate member 54A having a rectangular plate shape in plan view (as viewed from above), a lower plate member 54B having the same shape as the upper plate member 54A, and connecting the upper plate member 54A and the lower plate member 54B.
  • a yoke 60B composed of an intermediate member 56 having a U-shaped cross section provided in a state, and a pair of opposing surfaces (upper and lower surfaces) of the yoke 60B are provided at predetermined intervals along the Y-axis direction. And a plurality of field magnets 108 disposed therein. Y-axis direction Thus, an alternating magnetic field is formed.
  • the armature units 64A and 64B are each composed of a housing having a hollow interior, and armature coils (not shown) arranged at predetermined intervals in the housing along the Y-axis direction. ing.
  • the generated Lorentz force drives the armature units 64A, 64B (that is, the stator unit 60) in the Y-axis direction along the magnetic pole units 62A, 62B. That is, in the present embodiment, the armature units 64A and 64B and the magnetic pole units 62A and 62B also provide a moving coil type linear motor force. It is configured.
  • the magnetic pole units 62A and 62B are also referred to as Y-axis stators 62A and 62B, and the armature units 64A and 64B are also referred to as Y-axis movers 64A and 64B.
  • a prismatic slide member 68A having the Y-axis direction as a longitudinal direction is fixed to the lower surface of one magnetic pole unit (Y-axis stator) 62A, and the other magnetic pole unit (Y-axis stator).
  • a prismatic slide member 68B whose longitudinal direction is in the Y-axis direction is fixed to the lower surface of 62B.
  • one slide member 68A is arranged such that the side surfaces and the lower surface on both sides in the X-axis direction respectively face the three inner surfaces of the aforementioned U-shaped guide member 48A.
  • the slide member 68A is supported from three directions (+ X, X and Z directions) by a guide member 48A in a non-contact manner through static gas bearings (for example, air bearings) (not shown). .
  • static gas bearings for example, air bearings
  • the other slide member 68B is disposed so as to face the inner three surfaces of the above-described U-shaped guide member 48B, respectively, on the side surfaces on both sides in the X-axis direction and the lower surface force.
  • the slide member 68B is not contacted by the guide member 48B from three directions (+ X direction, 1X direction and 1Z direction) via static gas bearings (for example, air bearings) (not shown). Supported by. In this case, a predetermined clearance is formed between the lower surface of the Y-axis stator 62B and the guide member 48B.
  • the ⁇ -tilt drive mechanisms 96a-96c are substantially equilateral triangles on the upper surface of the stage body 100. It is arranged at each of the vertices.
  • ⁇ ⁇ Tilt drive mechanisms 96a-96c each include a voice coil motor that supports the wafer table WTB and independently drives minutely in the Z-axis direction. Accordingly, the wafer table WTB can be moved in three directions of freedom in the Z-axis direction, the ⁇ -X direction (rotation direction around the X-axis), and the ⁇ y direction (rotation direction around the Y-axis) by the ⁇ -tilt drive mechanisms 96a-96c. Is slightly driven.
  • the tilt drive mechanisms 96a and 96c are controlled by the main controller 50 in FIG.
  • wafer interferometer wafer laser interferometer
  • a Y movable mirror 102a extending in the X-axis direction is provided at one end (+ Y side) in the Y-axis direction.
  • An X movable mirror 102b that is fixed and extends in the Y-axis direction is fixed to one end ( ⁇ X side) in the X-axis direction.
  • the outer surfaces of these moving mirrors 102a and 102b are mirror-finished reflecting surfaces.
  • the wafer interferometer also has a Y interferometer that irradiates a laser beam (length measuring beam) on the reflecting surface of the Y moving mirror 102a and a wafer interferometer that reflects the reflecting surface of the X moving mirror 102b.
  • An X interferometer that irradiates a laser beam (length measuring beam) is provided.
  • a plurality of moving mirrors and a plurality of wafer interferometers are provided, respectively.
  • these are representatively shown as a moving mirror 102 and a wafer interferometer 104.
  • a multi-axis interferometer having a plurality of measurement axes is used, and the X and Y positions of the wafer table WTB and the jowing (rotation around the Z axis) are used.
  • pitching ⁇ X rotation, rotation around the X axis
  • rolling ⁇ y rotation, rotation around the axis
  • a reflective surface corresponding to the reflective surfaces of the movable mirrors 102a and 102b described above
  • the above-described multi-axis interferometer injects a laser beam through a reflecting surface installed on the wafer table WTB at an angle of 45 ° to a reflecting surface installed on a mount (not shown) on which the projection optical system PL is mounted.
  • Irradiation and projection optical system PL optical axis direction (Z axis direction) It is good to detect relative position information.
  • Position information (or speed information) of wafer table WTB (wafer stage WST) measured by wafer interferometer 104 is sent to main controller 50, and main controller 50 transmits position information (wafer stage WST) of wafer stage WST.
  • position information wafer stage WST
  • the position in the XY plane of the wafer stage WST is controlled via the Y-axis linear motors 66A and 66B, the X-axis linear motors 75B and 75C, and the Y-axis fine movement motor 75A based on the speed information).
  • the stage device 20 further includes two position adjusting mechanisms 52 ⁇ , 52 ⁇ for adjusting the positions of the above-mentioned ⁇ -axis stators 62 ⁇ , 62 ⁇ in the ⁇ -axis direction.
  • one of the position adjustment mechanisms 52 ⁇ has, as a stator, an armature unit 74 supported at a predetermined height position on a floor F via a support member 72, as described above.
  • the magnetic pole unit 62 ⁇ that is, a moving magnet type linear motor having a part of the ⁇ -axis stator 62 ⁇ as a mover.
  • the armature unit 74 is configured such that the inner space of the yoke 60 ⁇ is formed through a rectangular opening ⁇ formed in the intermediate member 56 of the yoke 60 ⁇ constituting the shaft stator 62 ⁇ . (A space in which an alternating magnetic field is formed by the field magnet). Inside the armature unit 74, at least one armature coil is provided, and an electromagnetic interaction between the X-axis direction current flowing through the armature coil and the alternating magnetic field described above is provided. The generated Lorentz force drives the ⁇ -axis stator 62 ⁇ relative to the armature unit 74 in the ⁇ -axis direction. In this case, the magnitude and direction of the current supplied to the armature coil inside the armature unit 74 are controlled by the main controller 50 in FIG.
  • the other position adjustment mechanism 52 # is configured by a moving magnet type linear motor having the same configuration as the above-described position adjustment mechanism 52 #, and drives the # axis stator 62 # in the # axis direction.
  • Stage device 20 further includes an offset mechanism that offsets a rotational moment generated on second platen 46 ° due to the effect of a reaction force generated when wafer stage WST is driven in the X-axis direction.
  • the canceling mechanism 78 is provided on the second surface 146d of the second platen 46 ⁇ .
  • -It is provided at the end on the Y side.
  • the canceling mechanism 78 includes a fixed portion 78 ⁇ fixed on the second platen 46 ⁇ ⁇ and a movable portion 78 ⁇ moving along the longitudinal direction of the fixed portion 78 ⁇ .
  • the fixing portion 78 # includes a guide 179 having a substantially U-shaped cross section and a stator RMa fixed to the upper surface of the guide 179.
  • the guide 179 is directly fixed on the second platen 46B.
  • the stator RMa has an I-shaped cross section, and has a plurality of armature coils disposed therein.
  • the movable portion 78B includes a mover RMb and a pair of heavy objects (mass) 178A, 178B fixed to both sides of the mover RMb in the Y-axis direction.
  • the mover RMb includes a tubular member having a rectangular cross section, and a plurality of field magnets fixed to a pair of opposing surfaces (both side surfaces in the Y-axis direction) inside the tubular member.
  • a part of the portion of the masses 178A, 178B fixed to both sides in the Y-axis direction of the mover RMb facing the guide 179 is provided with a gas static pressure bearing (not shown). Masses 178A and 178B are supported by guides 179 in a floating manner via clearances of several ⁇ via pressure bearings. These masses 178A and 178B are provided to generate a large reaction force (force) with a small stroke. It is desirable that the masses 178A and 178B be made as large as possible by being made of a member having a relatively high density.
  • the cancellation mechanism 78 (that is, the linear motor RM) thus configured is controlled by the main control device 50 shown in FIG. 1 as described later.
  • the stage device 20 further includes a voice coil motor 80 that can drive the second platen 46B in the X-axis direction.
  • the voice coil motor 80 includes a flat movable member 81 protruding from the + X side surface of the second base plate 46B, and a support member 83 so as to engage with the movable member 81 in a non-contact manner.
  • U-shaped stator placed above floor F via And
  • the mover 81 is an armature unit having an armature coil therein, and the stator 82 has a pair of opposing surfaces (upper surface and lower surface) having field magnets having opposite polarities.
  • the magnetic pole unit may be provided.
  • the mover 81 is provided at a position in the Y-axis direction corresponding to the center of gravity of the second platen 46B.
  • the voice coil motor 80 when the voice coil motor 80 is driven by the main controller 50, it can be driven in the X-axis direction without rotating the second platen 46B by ⁇ z.
  • exposure apparatus 10 of the present embodiment has a light source whose on / off is controlled by main controller 50, and has a large number of pinholes or slits facing the image forming plane of projection optical system PL.
  • An irradiation system AFa that irradiates an image forming light beam for forming an image from an oblique direction with respect to the optical axis AX, and a light receiving system AFb that receives the light beam reflected by the surface of the wafer W of the image forming light beam.
  • the apparatus further includes a focal position detection system comprising an input type multi-point focal position detection system.
  • a defocus signal from the light receiving system AFb is output during scanning exposure, which will be described later.
  • Defocus signal for example, the movement of the wafer table WTB in the Z-axis direction via the tilt drive mechanism 96a-96c based on the S-curve signal, and the inclination with respect to the two-dimensional surface (ie, ⁇ X, ⁇
  • the illumination area of the illumination light IL is controlled.
  • the image plane of the projection optical system PL substantially coincides with the surface of the wafer W (shot area) within the exposure area to be related (in other words, the surface of the shot area is projected onto the projection optical system PL within the exposure area).
  • Auto focus set within the depth of focus
  • auto leveling for example, the movement of the wafer table WTB in the Z-axis direction via the tilt drive mechanism 96a-96c based on the S-curve signal, and the inclination with respect to the two-dimensional surface (ie, ⁇ X, ⁇
  • the exposure operation of the step-and-scan method is performed as follows.
  • main controller 50 starts the acceleration start position for the exposure of the first shot area (first shot area) on wafer W held on wafer table WTB based on the result of the wafer alignment. Move wafer stage WST to. This movement is performed by the main controller 50 controlling the Y-axis linear motors 66A and 66B and the X-axis linear motors 75B and 75C based on the measurement values of the wafer interferometer 104.
  • main controller 50 starts relative scanning in the Y-axis direction between reticle stage RST and wafer stage WST, performs scanning exposure on the first shot area on wafer W,
  • the circuit pattern of the reticle R is reduced and transferred via the projection optical system PL.
  • main controller 50 monitors reticle interferometer 22 and wafer interferometer 104 while monitoring reticle stage drive unit 22 and Y-axis linear motors 66A and 66B.
  • main controller 50 uses Y-axis fine movement motor 75A to adjust the position of wafer stage WST in the Y-axis direction so that the tracking error of reticle stage RST with respect to wafer stage WST is minimized. Fine adjustments have been made.
  • the reaction force due to the driving causes the Y-axis linear motors 66A and 66B to move. Acts on the constituent Y-axis stators 62A, 62B. By the action of this reaction force, the Y-axis stators 62A and 62B are driven in the Y-axis direction along the guides 48A and 48B. In this case, since the guides 48A and 48B and the sliders 68A and 68B fixed to the Y-wheel stators 62A and 62B are not in contact with each other by the static gas pressure bearing, the law of conservation of momentum is substantially satisfied. Then, the Y-axis stators 62A and 62B move, and the aforementioned reaction force is almost completely canceled.
  • the main controller 50 sets the above-described position adjustment mechanisms 52A and 52B at a timing that does not affect the exposure accuracy, that is, for example, at a time when the exposure operation alignment operation is not performed.
  • the Y-axis is fixed at a position where the reaction force generated when driving wafer stage WST to the target position is canceled by the law of conservation of momentum.
  • the position adjusting mechanisms 52A and 52B may be constantly controlled so that the slaves 62A and 62B move. Also in this case, it is preferable to control the position adjustment mechanisms 52A and 52B to be driven at a timing when the exposure operation alignment operation is not performed.
  • the reaction force generated by driving the wafer stage WST in the X-axis direction is composed of members supported by the second platen 46B such as the second platen 46B, the guide member 48B, and the Y-axis stator 62B.
  • the wafer stage WST is located at a distance L1 from the center of gravity Gp of the system, and a reaction force acts on that position.
  • a rotating moment (torque) M is generated on the second platen 46B.
  • the main control device 50 drives the movable portion 78B constituting the above-described canceling mechanism 78 in the X-axis direction according to the magnitude of the reaction force and the position of the action point.
  • the rotational moment M is canceled in the closed system including the second platen 46B.
  • main controller 50 controls the reaction force (F) due to the movement of wafer stage WST in the X-axis direction and the point from the center of gravity Gp of the system to the point where reaction force (F) acts. Departure according to the distance (L1)
  • reaction force (F) due to the movement and the distance (L2) from the center of gravity Gp of the system to the point where the reaction force (F) acts
  • the drive of the movable portion 78B of the canceling mechanism 78 is controlled so that the rotational moment around the center of gravity generated in the opposite direction has the same magnitude in the opposite direction.
  • the moment (M) acting around the center of gravity Gp of the system including the second base plate 46B is offset in the system including the second base plate 46B.
  • main controller 50 controls the driving of voice coil motor 80 while the exposure operation and the alignment operation are not performed, and causes second base plate 46B Then, the stator unit 60 is appropriately moved to a predetermined reference position or its vicinity.
  • the voice coil motor 80 may be constantly controlled so that the second base plate 46B and the stator unit 60 move. Also in this case, it is preferable to control the voice coil motor 80 to be driven at a timing when the exposure operation alignment operation is not performed.
  • the wafer stage WST is guided by the guide surface 44a formed on the first platen 44, and the first drive mechanism described above is operated.
  • the X-axis linear motors 75B and 75C are driven at a predetermined stroke in the X-axis direction and minutely driven in the rotation direction around the Z-axis. Further, wafer stage WST is minutely driven in the Y-axis direction by Y-axis fine movement motor 75A constituting the first drive mechanism.
  • the wafer stage WST is guided by a guide surface 44a formed on the first platen 44, and a pair of Y-axis movers 65 corresponding to a pair of Y-axis stators 64A and 64B constituting a second drive mechanism.
  • the pair of Y-axis movers 65A and 65B are connected to one end in the longitudinal direction by the driving force generated by the electromagnetic interaction between A and 65B (ie, the driving force of the pair of Y-axis linear motors 66A and 66B). It is driven in the Y-axis direction integrally with the stator unit 60 provided at each of the other ends.
  • the stator unit 60 (including the X-axis stators 61B and 61C and the Y-axis fine movement stator 61A) constituting the first drive mechanism (the Y-axis fine movement motor 75A, the X-axis linear motors 75B and 75C) is included. ) Is supported in the Z-axis direction by the first surfaces 146a and 146c of the second surface plates 46A and 46B which are vibrationally separated from the first surface plate 44.
  • the stator unit 60 having the Y-axis movers 65A, 65B provided at both ends thereof, Since the support surfaces 146a and 146B of the pair of second base plates 46A and 46B are supported in a non-contact manner in the Z-axis direction via static gas bearings, vibration is transmitted to the second base plates 46A and 46B. Nevertheless, it is not transmitted to the first platen 44, which is vibrationally separated from these second platens 46A and 46B. Also, the vibration of the Y-axis movers 65A and 65B hardly affects the stator unit 60.
  • the vibration isolating unit 92 is not necessarily provided if there is no influence of the vibration transmitted to the first base plate 44.
  • the first surface plate 44 and the second surface plates 46A and 46B may be integrally configured.
  • the magnetic force is generated by electromagnetic interaction between the mover unit (specifically, the Y-axis fine-movement mover 76A) and the stator unit 60 (specifically, the Y-axis fine-movement stator 61A). Since the wafer stage WST can be finely driven in the Y-axis direction (running direction) by the driving force, it is necessary to maintain the positional relationship between the wafer stage WST (movable unit) and the stator unit 60 in the Y-axis direction. It is not necessary to provide an air bearing or the like, and the wafer stage WST can be accurately moved to a desired position in the Y-axis direction.
  • the movement of stator unit 60 in the Y-axis direction is directly performed on wafer stage WST. Does not affect Thus, the position control accuracy of the wafer stage WST can be maintained at a high level when the wafer stage WST is driven in the Y-axis direction without being driven by the wafer stage WST in the Y-axis direction as a vibration factor of the wafer stage WST.
  • the wafer stage WST moves along the stator unit 60 along the stator unit 60 while being guided by the guide surface 44a by the driving force generated by electromagnetic interaction between the mover unit and the stator unit 60. Since it is driven in the axial direction, the wafer stage WST does not vibrate during this drive. Even if the reaction force due to this drive is transmitted to the second bases 46A and 46B that support the Y-axis stators 64A and 64B via the stator unit 60, this vibration is transmitted to the first base 44. It is not transmitted.
  • stage device 20 the height of wafer stage WST that hardly causes the vibration of each part caused by the reaction force generated by driving wafer stage WST to deteriorate the position controllability of wafer stage WST. Accurate position control can be realized.
  • the stator unit 60 includes a Y-axis fine movement stator 61A extending in the X-axis direction, and one side in the Y-axis direction with the Y-axis fine movement stator 61A as a center. And a pair of X-axis stators 61B and 61C extending in the X-axis direction, respectively, and the mover unit is provided with a wafer stage by electromagnetic interaction with the Y-axis fine movement stator 61A.
  • Electromagnetic interaction is performed individually between the Y-axis fine mover 76A, which generates a driving force to slightly drive the WST in the Y-axis direction, and the pair of X-axis stators 61B, 61C. It includes a pair of X-axis movers 76B and 76C that respectively generate a driving force for driving in the axial direction. That is, a Y-axis fine movement motor 75A for finely driving the wafer stage WST in the Y-axis direction, and X-axis linear motors 75B and 75C respectively arranged on one side and the other side of the Y-axis direction centering on the Y-axis fine movement motor 75A.
  • the driving force of the X-axis linear motors 75B and 75C is the same, the driving force can be applied to the vicinity of the center of gravity of the stage. Are made to have the same magnitude and force in opposite directions, so that rotational driving around the center of gravity can be performed.
  • the Y-axis linear motors 66A and 66B are configured such that the movers 64A and 64B are composed of armature units, and the stators 64A and 64B are composed of magnetic pole units. Since it is composed of a moving coil type linear motor, The side can be made lighter, and the stator side can be made heavier. In this case, the stroke when the stator functions as the counter mass can be reduced, and the size of the device can be reduced.
  • the moving coil type Y-axis linear motors 66A and 66B are used.Therefore, two wafer stages are provided, and the Y-axis linear motor of the two wafer stages has a common stator. Thus, a twin wafer stage type wafer stage device having two wafer stages can be realized relatively easily.
  • the second bases 46A and 46B also serve as the bases of the Y-axis stators 62A and 62B, and each of the Y-axis stators 62A and 62B is provided between the second bases 46A and 46B.
  • the frictional force is almost zero, relative movement at least in the Y-axis direction is allowed.
  • the Y-axis movers 64A and 64B are integrated with the stator unit 60, and are driven by the reaction force generated in the Y-axis stators 62A and 62B when driven in the axial direction.
  • the Y-axis stators 62A and 62B move in the Y-axis direction according to the law of conservation of momentum. As a result, the reaction force is almost completely canceled, and the occurrence of vibration is prevented. In this case, since the center of gravity does not move, there is no occurrence of an eccentric load.
  • stator unit 60 moves relative to the X-axis direction in a state where the frictional force between wafer stage WST and guide surface 44a is substantially zero.
  • the stator unit 60 moves in the X-axis direction in accordance with the law of conservation of momentum due to the reaction force of the driving force, and the reaction force is canceled.
  • the second platen 46B is movable with respect to the floor surface F, and generates a reaction force generated in the stator unit 60 when the wafer stage WST (X-axis movers 76B, 76C) is driven in the X-axis direction.
  • the stator unit 60 has static gas bearings 151a and 151b for transmitting to the second base plate 46B. Therefore, the reaction force of wafer stage WST (X-axis mover 76B, 76C) is canceled by the movement of stator unit 60 and second platen 46B. In this case, the mass of the second platen 46B and the like is large, so that the moving distance can be reduced as much as possible.
  • the two position adjusting mechanisms 52 described above are used.
  • a and 52B make it possible to return the Y-axis stators 62A and 62B in the Y-axis direction to a predetermined reference position, so it is necessary to increase the travel stroke of the ⁇ axis stators 62 ⁇ and 62 ⁇ . In other words, it is possible to reduce the size.
  • the position adjusting devices 52 ⁇ and 52 ⁇ use a part of the ⁇ -axis stators 62 ⁇ and 62 ⁇ as movers, there is no need to provide a magnetic pole unit (or armature unit) separately from the ⁇ -axis linear motor.
  • stage device 20 it is possible to prevent the rotation of second platen 46 ° due to the reaction force when wafer stage WST is driven, by canceling mechanism 78 described above.
  • stage control device 20 can improve the position controllability of wafer stage WST, wafer W held on wafer stage WST can be placed with high accuracy. It becomes possible to transfer the pattern of the reticle R.
  • the stage apparatus 20 employs a coarse / fine movement type configuration in the running direction, so that the synchronization accuracy between the reticle stage RST and the wafer stage WS during scanning exposure is improved. Exposure accuracy (such as overlay accuracy of a reticle pattern and a wafer) can also be improved in this regard.
  • two second bases are provided corresponding to the ⁇ -axis stator.
  • the present invention is not limited to this.
  • One second base may be used.
  • a frame-shaped surface plate surrounding the first surface plate 44 can be adopted as the second surface plate.
  • one of the two second platens 46 ⁇ , 46 ⁇ is supported by floating above the floor surface, and the other second platen 46 ⁇ is moved in the X-axis direction.
  • the present invention is not limited to the case where the present invention is used as a countermass of any of the two second base plates 46 ⁇ and 46 ⁇ . Good les ,.
  • a configuration may be adopted in which the two second base plates 46 #, 46 # are connected by a predetermined connecting member, and the respective base plates move by the same amount.
  • two second surface plates 46 ⁇ and 46 ⁇ are connected by a predetermined connecting member or integrated into a frame-shaped surface plate surrounding the first surface plate 44, and this surface plate is placed on the floor F.
  • the robot can be supported by levitation so that it can move in the X-axis direction and the ⁇ -axis direction and rotate ⁇ ⁇ .
  • This allows the second platen to function as a counter mass for the X-axis direction and the ⁇ direction.
  • the X-axis direction of this 2nd surface plate A drive device may be provided for adjusting the position of the lens and the position in the Y-axis direction and removing the ⁇ rotation.
  • the same configuration as the above-described position adjusting mechanisms 52 #, 52 #, the voice control motor 80, the canceling mechanism 78, and the like can be used.
  • the first base 44 and the second bases 46 ⁇ and 46 ⁇ can be integrated to function as a counter mass for the X-axis direction, the ⁇ -axis direction, and the ⁇ rotation.
  • the second surface plates 46 ⁇ and 46 ⁇ are connected or integrated with a predetermined connecting member to form a frame member surrounding the first surface plate 44.
  • the frame member has a ⁇ -axis linear motor 66 ⁇ ⁇ ⁇ shaft stator (magnetic pole unit) of 66 mm.
  • the frame-shaped member is configured to float on the floor surface F so as to be movable in the X-axis direction and the ⁇ -axis direction and to be able to rotate ⁇ X, and for the X-axis direction, the ⁇ -axis direction, and the ⁇ rotation. It may be made to function as the counter mass of the above.
  • a driving device for adjusting the position of the frame-shaped member in the X-axis direction and the ⁇ -axis direction and removing the ⁇ ⁇ rotation may be provided.
  • the frame member and the first platen 44 are integrated so that the reaction force is transmitted to the first platen 44, and the first platen 44 is rotated in the X-axis direction, the ⁇ -axis direction, and ⁇ It is also possible to make it function as a countermass for this.
  • the offset mechanism 78 described in the above embodiment is an example, and in the stage apparatus of the present invention, the offset mechanism 78 is provided on a specific surface plate (the second surface plate 46B in the above embodiment).
  • a specific surface plate the second surface plate 46B in the above embodiment.
  • Various configurations can be adopted as the configuration of the canceling mechanism for canceling the rotational moment generated on the specific surface plate due to the action of the reaction force generated when the moving unit (unit) is driven in the X-axis direction.
  • the stage device 20 ' according to the first modified example shown in FIG. 9 has substantially the same configuration as the stage device 20 described above, but is provided with a canceling mechanism BM instead of the canceling mechanism 78. There is a characteristic in the point.
  • the offset mechanism BM includes a guide 181 provided on the + X side end of the second platen 46B and extending in the Y-axis direction, and a balance mass 182 engaged with the guide 181.
  • the balance mass 182 can be driven in the Y-axis direction along a guide 181 by a drive mechanism (not shown).
  • the balance mass 182 is driven by the main controller 50 via the drive mechanism according to the position of the wafer stage WST in the Y-axis direction, and is generated when the wafer stage WST is driven in the axial direction.
  • the control is performed so that the center of gravity of the system including the second base plate 46B and the canceling mechanism BM is located near the portion where the force is transmitted to the second base plate 46B.
  • the balance mass 182 when the wafer stage is located near one side (+ Y side end) in the axial direction of the WST force, the balance mass 182 is also positioned at the + Y side end. As shown in FIG. 10 (B), when the wafer stage WST force is located near the other side (one Y side end) in the SY axis direction, the balance mass 182 is also located at the one Y side end. Is controlled.
  • stage device 20 regardless of the position (Y-axis direction position) of wafer stage WST, the reaction force caused by driving wafer stage WST in the X-axis direction is: Since the light is always transmitted to the vicinity of the center of gravity of the second base plate 46B, the second base plate 46B does not generate a tonole component, or can suppress the tongue component to a small amount.
  • the mass of the balance mass 182 constituting the canceling mechanism BM is determined by estimating the torque component generated in the second platen 46B and setting it to a value that can cancel the torque component.
  • the drive amount is adjusted according to the mass of the balance mass 182.
  • the stage device 20 "according to the second modified example may be employed instead of the stage device 20.
  • the torque component of the second platen 46B due to the reaction force generated by driving the wafer stage WST is used.
  • Canceling mechanism force to cancel This is composed of two actuators (reaction motors) 80A and 80B arranged on the + X side of the second platen 46B at predetermined intervals in the Y-axis direction.
  • the one actuator (reaction motor) 80A includes, for example, a mover 81A protruding in the vicinity of one Y-side end of the + X side of the second platen 46B, A voice coil motor including a stator 82A that generates a driving force in the X-axis direction by an electromagnetic interaction between the two can be used.
  • the stator 82A is supported at a predetermined height from the floor F by the support member 83A.
  • the other actuator (reaction motor) 80B includes the above actuator (reactor). As in the case of 80A, the stator 82B supported by the support member 83B, the movable coil 81B protruding near the + Y side end of the + X side surface of the second platen 46B, and the voice coil motor formed by force. Can be used.
  • the stage device 20 "according to the second modification the balance between the forces in the X-axis direction applied from the two actuators 80A, 80B to the second platens 46A, 46B is adjusted. As a result, it is possible to almost completely cancel the tonolech component generated on the second platen 46B due to the movement of the wafer stage WST.
  • the reaction force acting on the support members 83A and 83B by driving these two actuators 80A and 80B may be canceled, if necessary, using a counter mass having three degrees of freedom (not shown). Also good ,. It is also possible to use the functions of the voice coil motor 80 in combination with the two actuators 80A and 80B. That is, the two actuators 80A and 80B are not only used for canceling the torque component generated in the second base plate 46B, but as described above, the second base plate 46B and the stator unit 60 are located at or near the predetermined reference position. Good to use to move.
  • stage device 120 of a third modified example as shown in FIG. 12 may be employed instead of the above-described stage device 20.
  • the stage device 120 of the third modified example is characterized in that the two reaction motors 115A and 115B arranged on the second base plate 46B constitute a canceling mechanism.
  • one reaction motor 115A has a guide 114 fixed in the vicinity of the ⁇ Y end of the second platen 46B, with the X-axis direction as the longitudinal direction, and the guide 114
  • the stator unit 112 includes a movable part 113 provided inside the stator part 112 that can slide along the stator part 112.
  • the stator portion 112 includes a pair of masses 111A and 111B provided at predetermined intervals in the Z-axis direction, and a plurality of permanent magnets provided on a surface where the masses 111A and 111B face each other. And a stator unit (not shown). In this case, the mass 111B located below is brought into non-contact with the guide 114 and the second platen 46B via an air bearing or the like (not shown).
  • the mover 113 is composed of an armature unit including a plurality of armature coils inside. Inserted between the 111A and 11 IB. That is, the mover 113 is moved in the X-axis direction inside the stator portion 112 by an electromagnetic interaction between a current supplied to the armature coil of the mover 113 and a magnetic field formed by the stator unit. It is now driven.
  • reaction motor 115A configured as described above, when the mover 113 is driven in, for example, the + X direction, a reaction force generated by the drive acts on the stator portion 112, and the stator portion 112 is driven.
  • the mover 112 moves in the direction opposite to the driving direction of the mover 113 (one X direction). Further, a reaction force in the + X direction due to the movement of the stator portion 112 acts on the second platen 46B. Therefore, a force in the + X direction acts on the second platen 46B.
  • a force in the same direction as the driving direction of the mover 113 can be applied to the second base plate 46B.
  • the other reaction motor 115B is configured similarly to the above-described reaction motor 115A.
  • the stage device 120 of the third modification the balance of the reaction force transmitted from the two reaction motors 115A and 115B disposed on the second base plate 46B to the second base plate 46B, respectively.
  • the positions By adjusting the position, it is possible to cancel the torque component caused by the position and movement of wafer stage WST acting on second platen 46B.
  • the masses and generated thrusts of the masses 111A and 111B of the stator portion 112 constituting the reaction motors 115A and 115B are determined based on the Y-axis position of the wafer stage WST and the torque component generated on the second platen 46B. By estimating the torque component, the torque component can be almost completely canceled.
  • the two reaction motors (115A, 115B) are provided on the second platen 46B.
  • the present invention is not limited to this, and the reaction motors (115A, 115B) are not limited to this. It is good also as providing only one data.
  • a part of the Y-axis linear motor is also used as the mover of the position adjusting mechanism.
  • the present invention is not limited to this, and a separate mover may be attached to the Y-axis stator. The good thing is, of course.
  • the voice coil motor is used as the position adjusting mechanism for returning the second platen to the predetermined position.
  • another driving mechanism such as a linear motor may be used. Les ,.
  • a moving magnet type linear motor is used for the X-axis linear motor
  • a moving coil type linear motor is used for the Y-axis linear motor.
  • the present invention is not limited to this.
  • Moving linear motors may be used for both linear motors, and moving magnet linear motors may be used for both.
  • the X-axis linear motor can be a moving coil type linear motor
  • the Y-axis linear motor can be a moving magnet type linear motor.
  • the first drive mechanism is constituted by two X-axis linear motors and one Y-axis fine movement motor.
  • the force W stage is moved in the first axis direction (for example, in the X axis direction).
  • the second axis direction for example, the Y axis direction
  • the configuration is not limited to the configuration of the above-described embodiment as long as it is a driving mechanism that minutely drives around a third axis (for example, the Z axis) orthogonal to the above.
  • the force S described in the case where the Y-axis stator, and the X-axis stator and the second surface plate have a function as a counter mass is not limited thereto. It is not necessary to have the function as.
  • the wafer stage WST is supported by the hydrostatic gas bearing against the guide surface 44a of the first platen 44, and the stator unit 60 is mounted on the second platen 46A, 46B.
  • the present invention is not limited to this, and magnetic levitation or a mechanical guide may be adopted.
  • the present invention is not limited to this, and a static exposure type exposure apparatus such as a step-and-repeat type stepper is used. Also applicable to
  • stage device of the present invention is applied to the stage device for holding a wafer of the exposure device.
  • present invention is not limited to this.
  • the stage device of the present invention can be suitably applied to precision machines other than the above.
  • An illumination optical system and a projection optical system composed of a plurality of lenses are assembled in an exposure apparatus main body.
  • the exposure apparatus of the above embodiment can be manufactured. It is desirable that the manufacture of the exposure apparatus be performed using a clean frame whose temperature, cleanliness, etc. are controlled.
  • the present invention is not limited to an exposure apparatus for manufacturing a semiconductor, but also includes an exposure apparatus for transferring a device pattern onto a glass plate and a method for manufacturing a thin film magnetic head, which are used for manufacturing a display including a liquid crystal display element and the like. It can also be applied to an exposure apparatus used for manufacturing an exposure device that transfers a device pattern used for a semiconductor wafer onto a ceramic wafer, an imaging device (such as a CCD), a micromachine, an organic EL, a DNA chip, and the like.
  • glass substrates or silicon wafers are used to manufacture reticles or masks used in optical exposure equipment, EUV exposure equipment, X-ray exposure equipment, electron beam exposure equipment, etc. that can only be used with micro devices such as semiconductor devices.
  • the present invention can also be applied to an exposure apparatus that transfers a circuit pattern to a substrate.
  • a transmissive reticle is generally used in an exposure apparatus using DUV (far ultraviolet) light or VUV (vacuum ultraviolet) light, and the reticle substrate is quartz glass, fluorine-doped quartz glass, or fluorescent glass. Stone, magnesium fluoride, quartz, or the like is used.
  • a transmission mask stencil mask, membrane mask
  • a silicon substrate is used as a mask substrate.
  • FIG. 13 shows a flowchart of an example of manufacturing devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, and the like).
  • a device function 'performance design eg, a semiconductor device circuit design, etc.
  • a pattern design for realizing the function is performed.
  • step 202 mask manufacturing step
  • step 203 wafer manufacturing step
  • a wafer is manufactured using a material such as silicon.
  • step 204 wafer processing step
  • step 201-step 203 wafer processing step
  • step 205 device assembly step
  • step 205 includes steps such as a dicing step, a bonding step, and a packaging step (chip sealing) as necessary.
  • step 206 the device created in step 205 is subjected to inspection such as an operation confirmation test and an endurance test. After these steps, the device is completed and shipped.
  • FIG. 14 shows a detailed flow example of step 204 in the semiconductor device.
  • step 211 oxidation step
  • step 212 CVD step
  • step 213 electrode forming step
  • step 214 ion implantation step
  • ions are implanted into the wafer.
  • a post-processing step is executed as follows.
  • step 215 resist forming step
  • step 216 exposure step
  • step 217 development step
  • step 218 etching step
  • step 219 resist removing step
  • the exposure apparatus of the above embodiment is used in the exposure step (step 216), so that the reticle pattern can be accurately transferred onto the wafer. it can. As a result, the yield of highly integrated microdevices can be improved, and the productivity can be improved.
  • the stage device of the present invention is suitable for moving a stage on which an object is placed in a two-dimensional plane.
  • the exposure apparatus of the present invention is suitable for transferring a pattern formed on a mask onto a photosensitive object.
  • the device manufacturing method of the present invention is suitable for producing a highly integrated microdevice.

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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

L'invention concerne un support (porte-plaquette, WST) guidé par une surface guide (44a) d'une première plaque de surface (44) et entraînée minutieusement avec une unité d'élément mobile dans la direction de l'axe X, la direction de l'axe Y et la direction de rotation de l'axe Z. En outre, le support est solidairement entraîné avec une unité d'élément fixe dans la direction de l'axe Y. En l'occurrence, l'unité d'élément fixe est supportée, par rapport à la direction de l'axe Z, au niveau de la surface d'appui sur des secondes plaques de surface (46A, 46B) séparées par vibrations de la première plaque de surface où la surface guide du support est formée. Ainsi, même lorsque des vibrations sont produites dans l'élément fixe de l'axe Y par l'entraînement du support dans la direction de l'axe Y, ces vibrations ne sont communiquées qu'aux secondes plaques de surfaces supportant l'élément fixe de l'axe Y et non à la première plaque de surface. En conséquence, on peu éviter que les vibrations soient transmises au support par le biais de la première plaque de surface, ce qui permet de maintenir à un niveau élevé la précision de la commande de position du support.
PCT/JP2004/006823 2003-05-21 2004-05-20 Appareil de support, appareil d'exposition, et procede de production de dispositif WO2004105105A1 (fr)

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008016840A (ja) * 2006-06-30 2008-01-24 Asml Netherlands Bv 角度分解スペクトロスコピリソグラフィを特徴付けるための装置およびデバイス製造方法
JP2008021972A (ja) * 2006-05-31 2008-01-31 Asml Netherlands Bv メトロロジーツール、リソグラフィ装置およびメトロロジーツールを備えるシステム、および、基板のパラメータを決定する方法
US7817251B2 (en) 2006-09-22 2010-10-19 Canon Kabushiki Kaisha Supporting apparatus, exposure apparatus, and device manufacturing method
JP2011501396A (ja) * 2007-04-19 2011-01-06 株式会社ニコン 三次元動作移動体とその制御方法
US7999943B2 (en) 2006-06-30 2011-08-16 Asml Netherlands B.V. Device manufacturing method with angular-resolved spectroscopic lithography characterization
WO2011108170A1 (fr) * 2010-03-04 2011-09-09 株式会社安川電機 Dispositif à plateau
JP2012514336A (ja) * 2008-12-31 2012-06-21 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 一体式ステージ位置決めシステム及び方法
CN112355990A (zh) * 2021-01-13 2021-02-12 上海隐冠半导体技术有限公司 一种xy运动台及运动装置
TWI721475B (zh) * 2018-06-29 2021-03-11 大陸商上海微電子裝備（集團）股份有限公司 一種工件台系統及光刻設備
CN114488699A (zh) * 2020-11-12 2022-05-13 上海微电子装备（集团）股份有限公司 带质量平衡补偿的可变光阑及光刻机
EP4336260A3 (fr) * 2022-09-12 2024-03-20 Canon Kabushiki Kaisha Appareil de support, appareil de formation de motif et procédé de fabrication d'article

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310686A (ja) * 2005-05-02 2006-11-09 Nsk Ltd 位置決めテーブル装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120105A (ja) * 1992-09-30 1994-04-28 Canon Inc 位置決め装置及びこれに用いられるピエゾアクチュエータ駆動装置
JPH07226354A (ja) * 1993-06-23 1995-08-22 Canon Inc 位置決め装置及びそれを用いた半導体素子の製造方法
JPH09219353A (ja) * 1996-02-13 1997-08-19 Canon Inc ステージ装置、及びこれを用いた露光装置やデバイス生産方法
JP2002008971A (ja) * 2000-06-23 2002-01-11 Canon Inc 移動装置、ステージ及び露光装置
JP2002093686A (ja) * 2000-09-19 2002-03-29 Nikon Corp ステージ装置及び露光装置
JP2003059797A (ja) * 2001-08-09 2003-02-28 Canon Inc 移動装置、ステージ装置及び露光装置
JP2003133204A (ja) * 2001-10-23 2003-05-09 Nikon Corp ステージ装置および露光装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120105A (ja) * 1992-09-30 1994-04-28 Canon Inc 位置決め装置及びこれに用いられるピエゾアクチュエータ駆動装置
JPH07226354A (ja) * 1993-06-23 1995-08-22 Canon Inc 位置決め装置及びそれを用いた半導体素子の製造方法
JPH09219353A (ja) * 1996-02-13 1997-08-19 Canon Inc ステージ装置、及びこれを用いた露光装置やデバイス生産方法
JP2002008971A (ja) * 2000-06-23 2002-01-11 Canon Inc 移動装置、ステージ及び露光装置
JP2002093686A (ja) * 2000-09-19 2002-03-29 Nikon Corp ステージ装置及び露光装置
JP2003059797A (ja) * 2001-08-09 2003-02-28 Canon Inc 移動装置、ステージ装置及び露光装置
JP2003133204A (ja) * 2001-10-23 2003-05-09 Nikon Corp ステージ装置および露光装置

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008021972A (ja) * 2006-05-31 2008-01-31 Asml Netherlands Bv メトロロジーツール、リソグラフィ装置およびメトロロジーツールを備えるシステム、および、基板のパラメータを決定する方法
JP4639214B2 (ja) * 2006-05-31 2011-02-23 エーエスエムエル ネザーランズ ビー．ブイ． メトロロジーツール、リソグラフィ装置およびメトロロジーツールを備えるシステム、および、基板のパラメータを決定する方法
US7961309B2 (en) 2006-05-31 2011-06-14 Asml Netherlands B.V. Metrology tool, system comprising a lithographic apparatus and a metrology tool, and a method for determining a parameter of a substrate
US7999943B2 (en) 2006-06-30 2011-08-16 Asml Netherlands B.V. Device manufacturing method with angular-resolved spectroscopic lithography characterization
US7999940B2 (en) 2006-06-30 2011-08-16 Asml Netherlands B.V. Apparatus for angular-resolved spectroscopic lithography characterization
JP2008016840A (ja) * 2006-06-30 2008-01-24 Asml Netherlands Bv 角度分解スペクトロスコピリソグラフィを特徴付けるための装置およびデバイス製造方法
US7817251B2 (en) 2006-09-22 2010-10-19 Canon Kabushiki Kaisha Supporting apparatus, exposure apparatus, and device manufacturing method
JP2011501396A (ja) * 2007-04-19 2011-01-06 株式会社ニコン 三次元動作移動体とその制御方法
JP2012514336A (ja) * 2008-12-31 2012-06-21 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 一体式ステージ位置決めシステム及び方法
WO2011108170A1 (fr) * 2010-03-04 2011-09-09 株式会社安川電機 Dispositif à plateau
JP5370580B2 (ja) * 2010-03-04 2013-12-18 株式会社安川電機 ステージ装置
US8624445B2 (en) 2010-03-04 2014-01-07 Kabushiki Kaisha Yaskawa Denki Stage apparatus
TWI721475B (zh) * 2018-06-29 2021-03-11 大陸商上海微電子裝備（集團）股份有限公司 一種工件台系統及光刻設備
CN114488699A (zh) * 2020-11-12 2022-05-13 上海微电子装备（集团）股份有限公司 带质量平衡补偿的可变光阑及光刻机
CN114488699B (zh) * 2020-11-12 2023-12-08 上海微电子装备（集团）股份有限公司 带质量平衡补偿的可变光阑及光刻机
CN112355990A (zh) * 2021-01-13 2021-02-12 上海隐冠半导体技术有限公司 一种xy运动台及运动装置
EP4336260A3 (fr) * 2022-09-12 2024-03-20 Canon Kabushiki Kaisha Appareil de support, appareil de formation de motif et procédé de fabrication d'article

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