Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
  • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
  • B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
  • H01J9/02—Manufacture of electrodes or electrode systems
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J2217/00—Gas-filled discharge tubes
  • H01J2217/38—Cold-cathode tubes
  • H01J2217/49—Display panels, e.g. not making use of alternating current
  • H01J2217/492—Details
  • H01J2217/49207—Electrodes
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/01—Tools for processing; Objects used during processing
  • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
  • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/05—Patterning and lithography; Masks; Details of resist
  • H05K2203/0502—Patterning and lithography
  • H05K2203/0522—Using an adhesive pattern
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/14—Related to the order of processing steps
  • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors

Definitions

• the present invention relates to a method for forming a relay image on a substrate, and particularly to a method for forming a conductor pattern in a plasma display panel (hereinafter, referred to as a PDP), a fluorescent display tube, an electronic component, or the like.
• the present invention relates to a technology for forming a relay image without using a photosensitive conductive paste.
• a method using a photosensitive conductive paste is used as a typical method for forming a relay image of a high-definition conductive pattern on a glass substrate or a ceramic substrate of a PDP.
• a photolithographic method This uses a photosensitive paste as a conductor paste for thick film printing, and forms a high-resolution thick film conductor pattern through mask exposure and development after printing. It is possible.
• the photosensitive conductive paste a mixture of a conductive metal powder, glass frit, a photocurable resin, a photopolymerization initiator, a solvent, and other additives is often used (for example, See Japanese Patent Application Laid-Open Nos. Hei 11-246636, Japanese Patent Laid-Open No. 5-271756, Japanese Patent Laid-Open No. 2-268870, etc.).
• the photolithography method using the photosensitive conductive paste most of the conductive paste is removed by development, and metal powder such as gold, silver, and platinum is used. Even if the conductive paste containing the body is reused, the recovered developer contains metal powder, organic resin, solvent, water, and alkalis in the developer. Therefore, it cannot be easily reused, and as a result, there is a problem that valuable resources are wasted.
• a method of forming a relay image using the ink jet method has been proposed for a long time.
• a method of dissolving a polymer film by ink droplets of the ink jet has been proposed.
• a technique for forming a relief image having a thickness that allows ink droplets to penetrate by changing the property for example, see British Patent No. 14431462.
• the technique involves spraying an appropriate liquid onto the polymer film by using an ink jet method, and changing the solubility of the polymer film in the developing solution by a chemical change.
• the solubility of the polymer film is reduced, and the portion where the solubility is reduced is developed with a developing solution to form a relief image.
• the polymer film disintegrates to increase the solubility, and the portion is dissolved in a developer to form a relay image.
• the present invention has been completed in view of the problems of the prior art, and a main object of the present invention is to provide a method of forming a relay image on a substrate, the method comprising: Another object of the present invention is to provide a method for forming a relay image that facilitates reuse of metal oxide powder and can achieve low cost and is excellent in productivity.
• a binder was pattern-printed on a powder layer containing a metal powder or an oxide powder thereof by an ink jet method, and the substrate was printed. It has been found that the above object can be achieved by forming a non-removable portion and a removable portion with respect to a predetermined means for partially removing the powder layer from above. . That is, for example, with respect to the means for partially removing the powder layer using a predetermined solvent, the portion where the binder is printed by the ink jet method is regarded as a non-removable portion using the solvent, and Only the portion where the toner is not printed is removed by using this method.
• the recovered liquid containing the metal powder or its oxide powder removed from the substrate can be reused for forming a relay image by adjusting the solid content almost completely.
• the metal powder or its oxide powder contained in the recovered liquid can be easily and efficiently reused, and the cost required for forming a relay image is greatly reduced. Get.
• a method for forming a relief image characterized by using a slurry obtained by adjusting the solid content of a recovered material with a solvent, is provided.
• At least a step of preparing a slurry by adjusting a solid content of a metal powder or an oxide powder thereof and a solvent, and the slurry preparing step are provided.
• a pattern is formed by removing from the substrate only a portion where the pattern is not printed by the binder in the pattern printing step, and the pattern is not formed.
• Recovering the metal powder or the oxide powder thereof contained in the portion which is included in the metal powder or the oxide powder used in the slurry preparation step. Includes metal powder or its oxide powder Wherein, the method of forming the Le Li Fui image is provided.
• no pattern was printed on the binder.
• the means for removing the portion there is a means for removing the portion on which the pattern is not printed by using a predetermined solvent.
• the metal powder or the oxide powder recovered using the removing means with the solvent can be reused in the preparation of the slurry by adjusting the solid content of the recovered liquid.
• the same solvent as the solvent contained in the slurry used to form the powder layer is used as a solvent that can be used to remove portions where the binder has not been subjected to pattern printing. Is preferred.
• a pattern formed product obtained by the method for forming a relay image.
• Examples of the metal powder or its oxide powder that can be used in the slurry of the present invention include powders of silver, palladium, gold, platinum, copper, nickel, ruthenium oxide, and the like. As a result, these precious resources can be easily and efficiently reused, and the cost can be significantly reduced.
• FIG. 1 is an explanatory view schematically showing one embodiment of a relay image forming method according to the present invention.
• the substrate that can be used in forming the relay image according to the present invention is not particularly limited, and the present invention provides a glass substrate, a ceramic substrate, and a ceramic substrate. Can be put on green sheets and metal substrates.
• the slurry used to form the powder layer is a mixture of the powder and a solvent such as water or a solvent, and if necessary, a mixture of a small amount of resin such as polyvinyl alcohol or polyvinyl butyral. Can be obtained by dispersing and slurrying.
• the powder is not particularly limited, but, for example, silver, silver-palladium alloy, silver alloy, palladium, gold, platinum, copper or nickel, or gold containing glass frit as necessary for forming a conductive pattern. Dielectric powder can be used for forming a capacitor pattern, and ruthenium oxide containing glass frit can be used for forming a resistive pattern.
• the slurry can be applied onto the substrate by a known method such as a doctor blade method or a screen printing method, and by drying the formed uniform coating film. Obtain a powder layer.
• the slurry used for the powder layer formed on the substrate may be a metal powder removed from the substrate in pattern formation or a slurry thereof.
• the metal powder or its oxide powder is reused. It is characterized in that
• Such reuse is achieved by printing a pattern of a binder on the powder layer using an ink jet method and removing the powder layer from the substrate by a predetermined means for partially removing the powder layer from the substrate. This is made possible by forming a and a removable portion.
• the predetermined removing means the part printed by the binder by the ink jet method is regarded as an unremovable part, and only the part where the binder is not printed is used by using the means. Remove. Then, The recovered material containing the metal powder and Z or its oxide powder removed from the plate is used as slurry for forming a powder layer by adjusting the solid content with a solvent. And can be easily reused.
• FIG. 1 is a cross-sectional view schematically showing one embodiment of a step of forming a relay image according to the present invention.
• the binder is jet-printed on the powder layer 1 as an ink droplet 3 by an ink jet (see Fig. 1 (a)).
• the portion 4 on which the binder has been jet-printed cannot be removed by the predetermined removing means. That is, a non-removable portion 4 and a removable portion 5 are formed in the powder layer for a predetermined removing means (see FIG. 1 (b)).
• the binder is not particularly limited.
• a hot wax is jetted at a temperature equal to or higher than the melting point of the wax using an ink jet. It is also possible to use a method that renders it impossible to remove the specified removal means, or use a thermosetting, UV-curing, or drying-curing ink.
• the means for removing the portion where the jetter is not jet-printed includes a means for applying pressure using a medium, Means using a sound wave, means for removing using a solvent, and the like can be given.
• the medium that can be used in the means for removing by applying pressure may be a gas or a liquid, and examples thereof include means for removing by wind pressure, means for removing by liquid spray, and the like.
• the present invention from the viewpoint of reusing the collected material, it is preferable to employ a means for removing the portion where the binder is not subjected to the jet printing using a solvent as a removing means. . More preferably, the same solvent as that used in forming the slurry is used as the solvent.
• the recovered liquid containing the metal powder or its oxide powder may be removed, for example, by removing the solvent by a method of adjusting the solid content by removing the supernatant or by removing the solvent by filtration
• a slurry that can be reused as a slurry used for forming a powder layer can be obtained by an extremely simple method.
• the solvent used for removing the powder layer in a portion that is not jet-printed and cannot be removed is the same as the solvent used for forming the slurry.
• other solvents can be used as long as slurry is not hindered.
• it is preferable as a solvent for removing the powder layer Specifically, alcohols, ketones, and glycols having a boiling point of 100 ° C. or less are suitably used, and a mixture of two or more solvents may be used.
• the solid content of the slurry is adjusted by removing the solvent by heating before separating the metal powder or its oxide powder from the recovered liquid by filtration. It is easy to keep them apart.
• Silver powder and glass powder are mixed in a mixed solution of polyvinyl alcohol and distilled water at the following composition ratio, stirred with a stirrer, and then slurried with a three-roll mill to make a slurry. Was done.
• the slurry obtained in the above (1) by screen printing is subjected to screen printing using a 250 mesh mesh poly stealth screen. Then, it was applied to the entire surface of the substrate and dried at 80 ° C. for 20 minutes to form a coating film (powder layer) having a thickness of 5 m.
• the wax having a melting point of 40 ° C is jet-printed on the powder layer obtained in the step (2). Then, the dropped portion of the wax is used for the slurry.
• the solvent (distilled water) used in the preparation was not removed.
• the pattern that could not be removed was a parallel line with a space of 200 ⁇ m and a line width of 80 im.
• Distilled water was sprayed on the powder layer obtained in the above step (3), and portions which were not made unremovable by the wax dripped by the ink jet method were removed. At this time, the water temperature was 30 ° C.
• the substrate obtained in the step (4) was fired at 550 ° C. to form a conductive pattern relief image.
• Silver powder and glass powder are mixed in a mixed solution of polyvinyl butyral and a solvent at the following composition ratio, stirred with a stirrer, and then ground with a three-roll mill to make a slurry. Was performed.
• the slurry obtained in the above (1) by screen printing is subjected to screen printing using a 250 mesh polystyrene screen. Then, it was applied to the entire surface of the substrate and dried at 80 ° C. for 20 minutes to form a coating film (powder layer) having a thickness of 5 ⁇ m.
• thermosetting binder is jet-printed on the powder layer obtained in the above step (2) by an ink jet method, and the portion where the thermosetting binder is dropped is heated. After curing, the solvent (ethyl carbitol acetate) used in the preparation of the slurry was not removed.
• the pattern that could not be removed had the shape of a parallel line with a space of 200 ⁇ m s and a line width of 80 Atm.
• Ethyl carbitol acetate was sprayed on the powder layer obtained in the above step (3), and the powder layer was made unremovable by a thermosetting binder dripped by an ink jet method. The missing part was removed.
• the substrate obtained in the step (4) was fired at 550 ° C. to form a relief image of a conductive pattern.
• Silver powder and glass powder are mixed in a mixed solution of cellulose ether and distilled water at the following composition ratio, stirred with a stirrer, and ground with a three-roll mill. Slurry was implemented.
• the slurry obtained in the above (1) by screen printing is subjected to screen printing using a 250-mesh polysteel screen. Then, it was applied to the entire surface of the substrate and dried at 80 ° C. for 20 minutes to form a coating film (powder layer) having a thickness of 5 ⁇ m.
• a solution consisting of 5% of acrylic polymer and 95% of carbitol acetate was added to the powder layer obtained in the above step (2) by jetting. After printing and drying at 80 ° C. for 20 minutes, the dropped portion of the solution was made unremovable with respect to the solvent (distilled water) used in the preparation of the slurry.
• the pattern that could not be removed was shaped like a parallel line with a space of 200 ⁇ m and a line width of 80 m.
• Distilled water is sprayed on the powder layer obtained in the above step (3), and the portion which is not made unremovable by the acrylic polymer-containing solution dropped by the ink jet method is removed. Removed. At this time, the water temperature was 30 ° C.
• the substrate obtained in the above step (4) was fired at 550 ° C. to form a conductive pattern relief image.
• the conductive pattern can be formed without using the photolithography method. As a result, it is possible to easily reuse metal powder or its oxide powder that was discarded in the photolithographic method. Therefore, a conductive pattern relief image can be formed at a low price.

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• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Ink Jet Recording Methods And Recording Media Thereof (AREA)
• Manufacturing Of Printed Wiring (AREA)
• Ink Jet (AREA)
• Application Of Or Painting With Fluid Materials (AREA)

Priority Applications (1)

Applications Claiming Priority (2)

Publications (1)

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Citations (3)

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• 2004
  • 2004-05-14 KR KR1020057021924A patent/KR100708790B1/ko active IP Right Grant
  • 2004-05-14 WO PCT/JP2004/006888 patent/WO2004101174A1/ja active Application Filing
  • 2004-05-14 CN CNB2004800135677A patent/CN100418643C/zh not_active Expired - Fee Related
  • 2004-05-14 JP JP2005506264A patent/JPWO2004101174A1/ja not_active Withdrawn

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