WO2004098887A1 - Procede de montage a superposition de masque de dispositif de serigraphie, et dispositif de serigraphie - Google Patents

Procede de montage a superposition de masque de dispositif de serigraphie, et dispositif de serigraphie Download PDF

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Publication number
WO2004098887A1
WO2004098887A1 PCT/JP2004/005852 JP2004005852W WO2004098887A1 WO 2004098887 A1 WO2004098887 A1 WO 2004098887A1 JP 2004005852 W JP2004005852 W JP 2004005852W WO 2004098887 A1 WO2004098887 A1 WO 2004098887A1
Authority
WO
WIPO (PCT)
Prior art keywords
mask
substrate
image
printing
circuit pattern
Prior art date
Application number
PCT/JP2004/005852
Other languages
English (en)
Japanese (ja)
Inventor
Yasushi Miyake
Original Assignee
Yamaha Motor Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co., Ltd. filed Critical Yamaha Motor Co., Ltd.
Publication of WO2004098887A1 publication Critical patent/WO2004098887A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B41F15/26—Supports for workpieces for articles with flat surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/10—Screen printing machines characterised by their constructional features
    • B41P2215/11—Registering devices
    • B41P2215/114—Registering devices with means for displacing the article
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board

Definitions

  • the present invention relates to a mask mounting method and a screen printing apparatus for a screen printing apparatus for dispensing paste such as cream solder on a substrate using a screen mask.
  • a screen mask (hereinafter, referred to as a mask) is mounted on the substrate set on the stage, and the paste supplied on the mask, such as cream solder, conductive paste, or resistive paste, is expanded with a squeegee to form the mask.
  • the paste supplied on the mask such as cream solder, conductive paste, or resistive paste
  • a screen printing apparatus in which a paste is applied (printed) to a predetermined position on a substrate via an opening is generally known (for example, Japanese Patent Application Laid-Open No. 2001-38875).
  • the fiducial marks (simply referred to as marks) respectively marked on the mask and the substrate are image-recognized, and based on the recognition result, the mask and the substrate are overlapped while being positioned with respect to each other. ing.
  • both the mask and the substrate are positioned based on the image recognition of the mark with reference to the mark respectively marked on the mask and the substrate. This is performed when the mark is correctly marked on the mask and the substrate. Is assumed. In other words, when there is a displacement (position error) in the positional relationship between the mark and the circuit pattern, or when there is a displacement (position error) in the positional relationship between the mark and the printing opening due to deformation such as extension of the mask.
  • position error position error
  • the mask and the substrate are positioned relative to each other on the basis of the mark, and both are mounted, it is difficult to accurately associate the corresponding circuit pattern with the printing opening.
  • the mask and the substrate be overlaid in a state where the circuit pattern and the printing opening are accurately associated even when the mark itself on the substrate has a printing deviation or the like. Disclosure of the invention
  • the present invention has been made in view of the above problems, and has as its object to surely prevent printing misalignment by overlapping a mask and a substrate while positioning them more accurately.
  • a mask overlaying method for a screen printing apparatus includes: a mask having a printing opening; holding means for holding a substrate which is a printing object; A driving means for relatively moving the means, and the mask and the substrate of a screen printing apparatus for printing by overlapping the substrate held by the holding means and the mask by the operation of the driving means.
  • the circuit pattern of the substrate and the printing opening of the mask corresponding to the circuit pattern Prior to the mounting of the mask and the substrate, the circuit pattern of the substrate and the printing opening of the mask corresponding to the circuit pattern are imaged, and these image data are used. A position error of an image between the circuit pattern and the printing opening is obtained based on the error, and the mask and the substrate are overlapped by controlling the driving means based on the error.
  • a screen printing apparatus includes: a mask having a printing opening; holding means for holding a substrate as a printing medium; and driving means for relatively moving the mask and the holding means.
  • a first imaging unit capable of imaging a circuit pattern of a substrate held by the holding unit, and an image of a printing opening of the mask corresponding to the circuit pattern imaged by the first imaging unit.
  • a second imaging unit capable of combining the image data of the circuit pattern imaged by the first imaging unit with the image data of the printing opening imaged by the second imaging unit;
  • a composite image generating means for generating image data in a state where parts are superimposed, and a table for displaying an image based on the image data generated by the composite image generating means.
  • image position changing means for changing and displaying a circuit pattern or an image position of a printing opening on a screen in accordance with input information by the input means, and a circuit based on the image data generated by the composite image generating means.
  • a substrate based on a difference between an image position of a pattern or a printing opening and the image position after being changed by the image position changing means; Error calculating means for calculating a position error of the mask; and control means for controlling the driving means based on the error calculated by the error calculating means to overlap the mask and the substrate.
  • FIG. 1 is an overall configuration diagram showing a screen printing apparatus according to the present invention.
  • FIG. 2 is a block diagram showing a control system of the screen printing apparatus.
  • FIG. 3 is a flowchart showing an example of a printing operation based on control by the control system of FIG.
  • FIG. 4 is a schematic diagram for explaining a display state of a composite image and a method of calculating a correction value.
  • FIG. 1 shows an embodiment of a screen printing machine according to the present invention.
  • the screen printing press includes a printing press main body 2 having a base 1, a substrate support unit 3 for supporting the substrate W in a clamped state, and a conveyor (not shown) for transporting the substrate W to the substrate support unit 3. ).
  • the substrate support unit 3 includes an R-Z stage 3A that supports the substrate W so as to be able to move up and down (movement in the Z-axis direction) and rotate (rotate around the Z-axis).
  • the X-Y stage 3B supports the Z stage 3A movably in the board transfer direction (X-axis direction; the direction perpendicular to the paper in FIG. 1) and the direction perpendicular to the direction (Y-axis direction).
  • the stage W is configured to move the substrate W by the mutual operation of the stages 3A and 3B. That is, in this embodiment, the holding means and the driving means of the present invention are constituted by the substrate supporting unit 3.
  • the R-Z stage 3A is equipped with a mask recognition camera 24 (second imaging means) for recognizing a metal mask 7 described below from below, and a lighting device (not shown).
  • the mask recognition camera 24 is provided with an image sensor such as a CCD area sensor, and has a fiducial mark (hereinafter simply referred to as a mark) printed on the lower surface of the metal mask 7. And the printing opening formed in the metal mask 7 can be imaged.
  • the printing press main body 2 is provided with a U-shaped frame 2b in a plan view having an open front side (the left side in FIG. 1). Supported by a.
  • a metal mask 7 (mask sheet; hereinafter, abbreviated as mask 7) having a printing opening is fixed to the frame 2b, and a squeegee unit 5 is disposed above the mask 7.
  • the mask 7 has its entire periphery held by a frame member 8, and is fixed to the frame 2 b via the frame member 8.
  • the squeegee unit 5 includes a pair of rail members 5a in the Y-axis direction, which are fixed on the left and right frames 2b on both sides (in FIG. 1, both sides in a direction perpendicular to the paper), and a rail member 5a.
  • a spar member 5b which is mounted in a straddling state and moves along the rail member 5a by the operation of a driving means (not shown), and a solder supply device (not shown) for supplying cream solder on the mask 7
  • a pair of squeegees 22, 22 for expanding the cream solder on the mask 7, and lifting means 10 for respectively raising and lowering the squeegees 22, 22, as will be described later.
  • the squeegees 22 and 22 are reciprocated in the Y-axis direction while the squeegees 22 and 22 are alternately slid along the surface of the mask 7 to expand the solder cream on the mask 7. It is configured to have
  • a board recognition camera 2 5 for recognizing a board W supported on the board support unit 3 from above the board unit 5.
  • a first imaging unit and its lighting device (not shown) are provided.
  • This substrate recognition device 25 has an image sensor such as a CCD area sensor, and has a fiducial mark (hereinafter simply referred to as a mark) printed on the upper surface of the substrate W, and the substrate W It is configured so that a circuit pattern to be formed can be imaged.
  • the R-Z stage 3A of the substrate support unit 3 has a position corresponding to the operation of the XY stage 3B (ie, a position corresponding to the ski unit 5 (solid line position in FIG. 1; work position)). And a position retracted in the X-axis direction from the position (a dashed line position in FIG. 1; an imaging position).
  • the R-Z stage 3A is disposed at the image position so that the substrate W supported by the stage 3A can be recognized.
  • FIG. 2 is a block diagram illustrating a control system of the screen printing apparatus.
  • the screen printing apparatus has a well-known CPU that executes a logical operation, an R ⁇ M that previously stores various programs for controlling the CPU, and temporarily stores various data during operation of the apparatus. It has a controller 30 composed of a RAM or the like, and each controller 26 to 27 of the squeegee unit 5 and the substrate support unit 3 (R-Z stage 3A, XY stage 3B).
  • the mask recognition camera 24 and the board recognition camera 25 are all connected to the controller 30.
  • the control device 30 includes a main control unit 31, an image processing unit 32, an error calculation unit 33, an error storage unit 34, and the like as its functional configuration.
  • the main control means 31 controls the overall operation of the screen printing apparatus.
  • the main control means 31 performs a predetermined printing operation in accordance with a program stored in advance and scans through the controllers 26 to 28.
  • Drive control of one unit 5 and the like In particular, before the printing process is performed on the first substrate W of the production lot, the substrate supporting unit 3 or the like for executing a preparation process for acquiring data for positioning the substrate W and the mask 7 is required. Drive control.
  • the image processing means 32 performs a predetermined process on an image taken by the mask recognizing camera 24 and the board recognizing camera 25. During the preparation process, the mask recognizing camera 24 and the board recognizing camera 25 are used. A composite image of the mask 7 (printing opening) and the substrate W (circuit pattern) based on the image data captured by the camera, that is, a virtual image (initial image) in which the mask 7 and the substrate W are superimposed on the mark And an image (updated image data) in which the composite image is changed according to the vector information input by the operation of the input means 36 described later.
  • a virtual image in which the mask 7 and the substrate W are superimposed on the mark
  • image updated image data
  • Changing (switching) the image display position in accordance with external input information can be performed based on a conventionally known image processing technique.
  • the image processing device 32 is operated according to a program stored in advance. By controlling the main control means 31 Is performed. That is, in this embodiment, the main control means 31 and the image processing device 32 constitute a combined image generating means and an image position changing means of the present invention.
  • the error calculating means 33 generates an image of the substrate W based on the initial image data generated by the image processing means 32 and the final updated image data obtained by moving the image of the substrate W with respect to the image of the mask 7. Is calculated. '
  • the error storage means 34 stores the displacement calculated by the error calculation means 33 as a deviation (position error) between the mask 7 and the substrate W, and is calculated by the error calculation means 33 The error is updated and stored.
  • the control device 30 is further connected to a display means 35 such as a CRT and an input means 36 such as a keypad.
  • the display means 35 displays information relating to various operating conditions during the printing operation to the operator, etc. During the preparation process, the mask 7 and the substrate W are combined based on the image data generated by the image processing means 32. Display an image.
  • the input means 36 inputs various information to the control device 30. During the preparation process, the input of vector information for moving the image of the substrate W displayed on the display means 35 is performed by this input. This is done via means 36.
  • the substrate support unit 3 is set at the initial position where the substrate W can be received, the initial value ⁇ 1 '' is set to the count value, and then the substrate W is transferred from the conveyor. It is carried onto the substrate support unit 3 and clamped (steps S1, S2).
  • the substrate W is placed at the imaging position by the substrate recognition camera 25 by the operation of the substrate support unit 3 (R-Z stage 3A, XY stage 3B), and the substrate recognition camera 25 places the substrate W on the substrate W.
  • recognition position recognition of the substrate W is performed based on the mark (step S3).
  • step S4 it is determined whether or not the counter value is "1", that is, whether or not the substrate W is the first substrate W of the production lot (step S4).
  • the process proceeds to step S5, and thereafter, in steps S5 to S12, a preparation process for acquiring positioning data is executed.
  • Step S5 the circuit board of a plurality of regions on the substrate W predetermined based on the mark is imaged by the substrate recognition camera 25 by moving the substrate support unit 3.
  • the circuit patterns at two places on the substrate W, which are separated in the diagonal direction, are sequentially imaged by the substrate recognition camera 25.
  • step S6 recognition of the mask 7 (position recognition) is performed.
  • step S7 As the substrate support unit 3 moves, two areas including the printing opening corresponding to the circuit pattern imaged in step S5 are sequentially imaged by the mask recognition force camera 24 (step S7). ). At this time, the drive of the substrate support unit 3 (XY stage 3B) is controlled based on the position of the mask 7 recognized in step S6.
  • a virtual image superimposed on each mark of the mask 7 and the substrate W is formed by the image processing means 3. 2
  • the virtual image is displayed by the display means 35, and a display requesting the "correction processing" is also performed.
  • FIG. 4 upper diagram
  • the composite images of the above two places images 4OA and 40B
  • Steps S8, S9 the display to the effect that "correction processing" is requested is omitted.
  • the “correction process” refers to a process of correcting a shift between the mask 7 and the substrate W on a screen by an operation of an operator. That is, since the composite image displayed on the screen is an image in which the printing opening and the circuit pattern are overlapped with each other on the mask 7 and the mark on the substrate W as described above, the mark on the substrate W and the circuit Both the positional relationship with the pattern and the positional relationship between the mark of the mask 7 and the printing opening are within the appropriate ranges. Then, an image in which the printing opening and the circuit pattern completely correspond (overlap) is displayed as a composite image.
  • the image 7a of the printing opening is displayed on the composite image as shown in FIG.
  • the circuit pattern image W a is displayed in a state where it is shifted.
  • such a shift is a process of virtually correcting the shift by operating the input means 36 to move the image of the substrate W.
  • the operator inputs vector information, that is, the direction and amount (size) of moving the substrate W, for each of the images 4OA and 40B, and updates the image (the updated image data) according to the input.
  • step S10 it is determined whether or not the correction processing has been completed. If it is determined that the correction processing has been completed, the error calculating means 33 calculates the error between the substrate W and the mask 7 (step S10). S 11), the calculation result is updated and stored in the error storage means 34 (step S 12). For example, after the correction processing, when the operator operates the input means 36 to input that the correction processing work has been completed, “YES” is determined in the step S10.
  • step S 1 as shown in FIG. 4 (lower side in FIG.), X- Y-direction variation in the image center in our Keru substrate W to the image 4 0 a ( ⁇ ⁇ 0 1 ') and an image 4
  • the average value of the change in the X and Y directions at the center of the image of the substrate W in O b (0 2 ⁇ 0 2 ′) is obtained as the error between the substrate W and the mask 7 in the X and Y directions.
  • the angle 0 with 2 ′) is obtained as an error between the substrate W and the mask 7 in the R-axis direction.
  • the substrate support unit 3 is moved to the work position, and the substrate W is positioned with respect to the mask 7 in the X, Y, and R axis directions.
  • the substrate W is lifted by the operation of the stage 3 ⁇ , whereby the substrate W is loaded on the mask 7 from below (step S 13).
  • the positioning of W is performed based on the mark images acquired in steps S3 and S6.
  • the position of the substrate W is corrected based on the error data stored in the error storage means 34. Note that the basic positioning operation and the position correction may be performed simultaneously.
  • the squeegee unit 5 is operated, whereby the printing process is started (step S14). Specifically, after the squeegees 22 and 22 are arranged at a predetermined work start position, the squeegees 22 and 22 (one side squeegee 22) are moved to a predetermined height by the operation of the lifting / lowering means 10.
  • the position that is, the tip (lower end) is set at the height position where it contacts the mask 7. Then, after the cream solder is supplied onto the mask 7 by the solder supply device, the squeegees 22 and 22 alternately slide along the surface of the mask 7 while reciprocating in the Y-axis direction. The cream solder is applied to the substrate W through the printing opening of the mask 7.
  • step S15 it is determined in step S15 whether or not the printing process has been completed. If it is determined that the printing process has been completed, the squeegees 22 and 22 are reset to the rising end position, and the substrate support is performed. The unit 3 is reset to the initial position, and thereafter, the substrate W is unloaded (step S16).
  • step S17 it is determined whether or not the processing of the predetermined number N of the substrates W has been completed (step S17), and if it is determined that the processing has not been completed, the count value is determined. Is incremented (step S18), the process proceeds to step S2, and the next substrate W is carried into the substrate support unit 3.
  • step S4 If it is determined in step S4 that the counter value is not "1", that is, if the board W is not the first board W in the production lot, the processing in steps S5 to S12 is skipped, and the processing in step S5 is skipped. After the mark recognition processing of 19, the process proceeds to step S13. That is, if NO is determined in step S4, the substrate W is reset to the working position by the operation of the substrate support unit 3, and is marked on the mask 7 by the mask recognition camera 24 mounted on the substrate support unit 3. Mark is imaged
  • Step S 19 After the basic positioning of the substrate W with respect to the mask 7 is performed based on the mark images acquired in steps S 3 and S 19, the error data stored in the error storage means 34 is temporarily reduced. Based on this, the position of the substrate W is corrected, and the substrate W is mounted on the mask 7 in this state. In this way, when it is finally determined in step S17 that the processing of the predetermined number N of substrates W has been completed, this flowchart ends.
  • a specific shift (position error) between the circuit pattern and the printing opening when the substrate W and the mask 7 are positioned relative to each other with reference to the mark is determined in advance (preparation).
  • the substrate W and the mask 7 are positioned based on the fiducial mark, and the substrate W is determined based on the error obtained in the above-described preparation processing.
  • the position of the mask 7 are corrected. For example, when there is an error in the positional relationship between the mark and the circuit pattern due to a printing error of the mark, or when the mask itself is deformed by elongation or the like, the mask is deformed.
  • the substrate W and the mask 7 are overlaid with the corresponding circuit pattern and the printing opening securely matched. be able to . Therefore, compared with the conventional screen printing apparatus that positions the substrate and the mask mutually based only on the image recognition of the mark, the substrate W and the mask 7 can be more accurately overlapped, and as a result, the printing misalignment can be caused. This has the effect of more reliably preventing the occurrence of phenomena.
  • error data is stored by executing a preparation process prior to the first printing process of a production lot, and for a substrate W belonging to a common production lot, the error data is stored based on the stored error data. Since the position correction between the mask 7 and the substrate W is performed, the printing process can proceed rationally. There is also an effect. In other words, it is conceivable to perform the preparation process for each substrate of a production lot, but in this case, it takes time to perform the printing process per substrate. On the other hand, when an error occurs in the positional relationship between the mark and the printing opening due to the deformation of the mask 7, the above-described error becomes a value common to each substrate W. In general, mark printing errors on the substrate W often occur in units of production lots.
  • the screen printing apparatus described above is an embodiment of the screen printing apparatus according to the present invention, and its specific configuration can be appropriately changed without departing from the gist of the present invention.
  • the following embodiments can be adopted.
  • the circuit pattern of a plurality of regions on the substrate W is imaged by the substrate recognition camera 25, and the plurality of regions of the mask 7 corresponding to the region are imaged by the mask recognition camera 24.
  • the process (error calculation process) of step S11 in FIG. 3 an error between the substrate W and the mask 7 is calculated based on the change amounts of a plurality of coordinate positions in the image of the substrate W. What should I do?
  • the operator is configured to operate the input means 36 to move the displayed image of the substrate W on the display screen, thereby causing the error calculating means 33 to calculate the position error.
  • the error may be calculated directly from the synthesized image data without performing such an operation by the operator.
  • the above-described error data is obtained only once in the production lot by executing the preparation processing (the processing of steps S5 to S12 in FIG. 3) before the printing processing of the first substrate W of the production lot.
  • the preparation process is executed multiple times during the production lot, and the error data is updated one or more times during the production lot. Is also good.
  • the present invention relatively moves a mask having an opening for printing and a holding means holding a substrate as a printing substrate, so that the substrate held by the holding means and the mask can be moved.
  • the present invention relates to a screen printing apparatus to be overlaid, and is particularly useful for accurately overlaying a substrate, which is a printing substrate, and a mask.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention a trait à un dispositif de sérigraphie comportant un masque (7) présentant une ouverture d'impression, et une unité de support de substrat (3) portant un substrat (W) qui constitue un objet d'impression mobile par rapport au masque (7). L'impression est réalisée au moyen de la superposition du substrat (W) et du masque (7) effectuée par le fonctionnement de l'unité de support de substrat (3). Préalablement à la superposition du masque (7) et du substrat (W), on effectue des prises de vue d'un tracé de circuit sur le substrat (W) et de l'ouverture d'impression dans le masque (7) correspondant à ce tracé, et une déviation (erreur de position) entre le tracé de circuit et l'ouverture d'impression est recherchée en fonction de ces données d'image. En fonction de cette déviation la superposition du masque (7) et du substrat (W) est effectuée par un entraînement contrôlé de l'unité de support de substrat (3).
PCT/JP2004/005852 2003-05-09 2004-04-23 Procede de montage a superposition de masque de dispositif de serigraphie, et dispositif de serigraphie WO2004098887A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003-131678 2003-05-09
JP2003131678A JP4515042B2 (ja) 2003-05-09 2003-05-09 スクリーン印刷装置のマスク重装方法およびスクリーン印刷装置

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WO2004098887A1 true WO2004098887A1 (fr) 2004-11-18

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JP (1) JP4515042B2 (fr)
CN (1) CN100522611C (fr)
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EP3566872A4 (fr) * 2017-01-06 2020-01-08 Fuji Corporation Imprimeur sérigraphe
EP3845385A4 (fr) * 2018-08-27 2021-07-07 FUJI Corporation Machine d'impression de soudure

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KR101491037B1 (ko) 2012-04-27 2015-02-23 주식회사 고영테크놀러지 스크린 프린터 장비의 보정방법 및 이를 이용한 기판 검사시스템
JP5877327B2 (ja) * 2012-10-15 2016-03-08 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置およびスクリーン印刷における不良原因の解析装置ならびに不良原因の解析方法
JP6558794B2 (ja) * 2015-03-30 2019-08-14 倉敷紡績株式会社 印刷用アライメント装置、この印刷用アライメント装置を備えた印刷装置、及び印刷用アライメント方法

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JPH0781034A (ja) * 1993-06-23 1995-03-28 Alps Electric Co Ltd ワークの位置合わせ方法
JP2001232757A (ja) * 2000-02-25 2001-08-28 Matsushita Electric Ind Co Ltd クリーム半田印刷装置の教示方法及びクリーム半田印刷装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102126630A (zh) * 2010-12-29 2011-07-20 常州亿晶光电科技有限公司 全自动印刷机的硅片影像定位校正装置
CN102126630B (zh) * 2010-12-29 2015-02-04 常州亿晶光电科技有限公司 全自动印刷机的硅片影像定位校正装置
EP3566872A4 (fr) * 2017-01-06 2020-01-08 Fuji Corporation Imprimeur sérigraphe
EP3845385A4 (fr) * 2018-08-27 2021-07-07 FUJI Corporation Machine d'impression de soudure

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CN100522611C (zh) 2009-08-05

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