WO2004084604A1 - 表面実装機 - Google Patents
表面実装機 Download PDFInfo
- Publication number
- WO2004084604A1 WO2004084604A1 PCT/JP2004/003657 JP2004003657W WO2004084604A1 WO 2004084604 A1 WO2004084604 A1 WO 2004084604A1 JP 2004003657 W JP2004003657 W JP 2004003657W WO 2004084604 A1 WO2004084604 A1 WO 2004084604A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- axis direction
- mounting work
- head unit
- mounting
- work area
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
Definitions
- the present invention relates to a surface mounter configured to pick up an electronic component by a component mounting head unit and mount the electronic component at a predetermined position on a printed circuit board.
- a chip unit such as an IC
- a head unit equipped with a nozzle member for picking up the component and is then moved to a predetermined position on the printed board.
- a surface mounter hereinafter, abbreviated as a mounter
- a driving mechanism is configured so that the head unit moves in the X and Y directions on a plane, and is driven by a motor.
- This mounting machine consists of a component supply unit arranged on both sides in the Y-axis direction with respect to a mounting work area for mounting components on a printed circuit board, and a head unit that can move along a guide member extending in the Y-axis direction.
- a support member two head units mounted on both sides of the support member in the Y-axis direction and movable in the X-axis direction, a drive mechanism for driving the support member and the head units, respectively, It has a board holding member arranged in the mounting work area and movable in the Y-axis direction, and a moving mechanism for moving the board holding member.
- the mounting mechanism is efficiently controlled by controlling the moving mechanism for moving the substrate holding member by the control means.
- the component mounting is performed by the other head unit while the component is sucked by the one head unit.
- the head unit supporting member stopped at a position where the components can be sucked by the unit, the movement of the other head unit in the X-axis direction and the movement of the substrate holding member in the Y-axis direction.
- the component can be mounted at a desired position on the printed board by the movement in the direction.
- the other head unit can mount components on a printed circuit board.
- the mounting efficiency is greatly improved compared to the case.
- the number of mounted components on one printed circuit board is significantly increased, etc.
- multiple mounting machines are arranged along the production line, a part of the required number of components to be mounted on one printed circuit board is mounted on the upstream mounting machine, and then sent to the downstream mounting machine. It is also conceivable that the mounting of the components on the printed circuit board is shared by each mounting device, such as mounting the remaining components.
- the present invention has been made to solve the above-mentioned problems, and it is possible to further increase the efficiency of mounting components on a printed circuit board even in comparison with a mounting machine as disclosed in the above publication. It is intended to provide a surface mounter that can be configured to be compact in size. Disclosure of the invention
- the present invention relates to a head unit for component mounting and a substrate on which the component is mounted.
- a surface mounting machine that is movable in the X-axis direction and the Y-axis direction orthogonal to the X-axis direction, and that mounts components picked up from the component supply unit by the head unit on the substrate, the X-axis direction.
- a plurality of mounting work areas provided side by side; component supply units provided on both sides in the Y-axis direction of the mounting work areas;
- a predetermined number of guide frames extending in the Y-axis direction and arranged at predetermined intervals in the X-axis direction so as to be located between the areas and on both sides in the X-axis direction of the mounting work area arrangement portion, and each of the mounting operations described above.
- a head unit supported by the head unit a driving mechanism for individually driving each of the head unit support members and each of the head units, and a drive unit disposed in each of the mounting work areas so that the board can be moved in the Y-axis direction. It comprises a plurality of substrate holding means for holding, and a substrate moving drive mechanism for individually moving the substrates held by the respective substrate holding means.
- the component is sucked from the component supply unit to the board in one mounting work area by one of the two head units supported by the head unit support member in the mounting work area.
- the other head unit is positioned with respect to the board by the movement of the other head unit in the X-axis direction and the movement of the board held by the board holding means in the Y-axis direction, the other head unit is In this way, component mounting and suction by two head units are performed in parallel, such that the component mounting is performed by the two head units.
- each of the plurality of mounting work areas mounting and suction of components are performed in parallel by two head units as described above. Furthermore, in each mounting work area, a part of all components to be mounted on the board is shared and mounted, and the mounting work in each mounting work area is also performed in parallel. This greatly improves mounting efficiency.
- the guide frames arranged between the mounting work areas and on both sides in the X-axis direction of the mounting work area arrangement portion support both ends of the plurality of head unit support members.
- the support structure can be made simple and compact while supporting the support member stably.
- first and second mounting work areas are provided as the plurality of mounting work areas.
- first and second guide frames are arranged outside the first and second mounting work areas in the X-axis direction.
- a third guide frame is disposed between the first mounting work area and the second mounting work area, and both ends of the first head unit supporting member located on the first mounting work area are connected to the first guide frame and the first guide frame. Both ends of the second head unit support member located on the second mounting work area are movable by the third guide frame in the Y-axis direction while being supported by the third guide frame in the Y-axis direction. What is necessary is just to be supported.
- the drive mechanism for moving the headunit support member in the Y-axis direction includes a servomotor and a ball screw connected to the servomotor, and the servomotor and the ball screw are guided on both sides in the X-axis direction. It is preferable to be arranged along the guide frame inside the frame.
- the head unit support member is moved in the Y-axis direction by the above-mentioned servo motor and pole screw. Since the servo motor and the pole screw do not exist between the mounting work areas, the mounting work areas can be made as close as possible, which is advantageous for improving the mounting efficiency.
- a camera that captures an image of the sucked component for recognition of the component sucked by the head unit is disposed outside each component supply unit in the X-axis direction.
- the head unit moves onto the camera after the component is sucked, and the component recognition is performed based on the captured image. Since the camera does not exist between the mounting work areas, the mounting work areas can be made as close as possible, which is advantageous for improving mounting efficiency.
- FIG. 1 is a plan view schematically showing an embodiment of the surface mounter of the present invention.
- FIG. 2 shows a specific structure of the mounting machine, and is a plan view in a state where a head unit and a head unit support member are removed.
- FIG. 3 is a front view in a state where the head unit and the head unit supporting member are assembled.
- FIG. 4 is a side view schematically showing a substrate holding unit and a driving mechanism for the substrate holding unit.
- Fig. 5 shows the guide frame and the head for supporting the head unit supporting member.
- FIG. 6 is a plan view showing a mechanism for driving a unit support member.
- FIG. 6 is a front view showing the guide frame and the like.
- FIG. 7 is a side view showing the guide frame and the like.
- FIG. 8 is a side view of the guide frame at the center. BEST MODE FOR CARRYING OUT THE INVENTION
- a conveyor 2 for transporting a printed circuit board is arranged, and the printed circuit board 3 is moved along the conveyor 2. It is designed to be transported.
- the direction in which the substrate is conveyed by the conveyor 2 (the horizontal direction in FIG. 1) is the X-axis direction
- the direction orthogonal to the X axis on the seven planes (the vertical direction in FIG. 1) is the Y-axis direction. That.
- the substrate 3 is loaded into the mounting machine from the right side by the conveyor 2 on the loading side.
- a mounting work area for performing component mounting work on the printed circuit board is provided between the conveyor 2 on the loading side and the conveyor 2 on the unloading side.
- the first and second mounting work areas are provided. 4 and 5 are provided side by side in the X-axis direction.
- the conveyor 2 is composed of a pair of belt conveyors 2a and 2b parallel to each other, and the size of the printed circuit board can be changed by configuring the space between the belt conveyors 2a and 2b to be scalable. It is possible to correspond to.
- Component supply units are provided on both sides in the Y-axis direction of the mounting machine.
- component supply units 6A and 6B for the first mounting work area are provided on both sides in the Y-axis direction of the first mounting work area 4.
- component supply units 7A and 7B for the second mounting work area are provided on both sides of the second mounting work area 5 in the Y-axis direction.
- Each of the component supply units 6A, 6B, 7A, and 7B includes, for example, a large number of rows of tape feeders 8, and is capable of sequentially supplying a large number of components contained in a tape.
- first and second guide frames 11 and 12 located outside the first and second mounting work areas 4 and 5 in the X-axis direction, and both mounting work areas 4 and 5.
- the third row of guide frames consisting of the third guide frame 13 located between In addition, first and second head unit support members 14, 15 supported by these guide frames 11, 12, 13 are provided.
- the three rows of guide frames are arranged at predetermined intervals in the X-axis direction, and each extend in the Y-axis direction.
- the first head unit support member 14 is located on the first mounting work area 4, extends in the X-axis direction so as to cross this area 4, and both ends thereof are located outside the first mounting work area 4.
- the first guide frame 11 is supported by the third guide frame 13 located between the mounting work areas 4 and 5 and is movable in the Y-axis direction.
- the second head unit support member 15 is located on the second mounting work area 5, extends in the X-axis direction so as to cross this area 5, and has both ends outside the second mounting work area 5. Is supported by a second guide frame 12 located at a position 3 and a third guide frame 13 located between both mounting work areas 4 and 5, and is movable in the Y-axis direction.
- the head unit supporting members 14 and 15 are independently driven by first and second Y-axis support motors 16 and 17 via poll screws 18 and 19, respectively. I have.
- the Y-axis support members 16 and 17 and the pole screws 18 and 19 are disposed on the inner sides of the guide frames on both sides, and are provided at one end of the headunit support members 14 and 15. (Not shown) are screwed into the above-mentioned pole screws 18 and 19.
- the first head unit support member 14 has two head units 21A and 2 IB for the first mounting work area
- the second head unit support member 15 has two head units 22A for the second mount work area. , 22 B equipped. These two head units 21 A, 21 B, 22 A, and 22 B are supported on both sides of the head unit supporting members 14 and 15 in the Y-axis direction so as to be movable in the X-axis direction.
- the X axis servo motors are driven by pole screws 25 A, 25 B, 26 A, 26 B by 23 A, 23 B, 24 A, 24 B.
- X-axis direction guides 27 are provided on both sides of the head unit support members 14, 15 in the Y-axis direction, respectively, and the X-axis servo motors 23A, 23B, 24A, 24B are connected thereto. Ball screws 25A, 25B, 26A, 26B are installed. And each head unit 21A, 21B, 22A, 22B The guide unit 27 is supported so as to be movable in the X-axis direction, and nuts (not shown) provided on each of the head units 21 A, 21 B, 22 A, and 22 B are connected to the above-mentioned pole screws 25 A, 25 B, and 26. A, 26 B is screwed.
- a drive mechanism for individually driving each of the head units 14 and 15 and each of the head units 21A, 21B, 22A and 22B is configured.
- Each of the head units 21A, 21B, 22A, and 22B has one or more heads 28 having a nozzle for picking up a component, a Z-axis drive mechanism for moving the head 28 up and down, and rotating the head. Equipped with an R-axis drive mechanism (not shown).
- first board holding means 31 is provided in the first mounting work area 4, and a second board holding means 32 is provided in the second mounting work area 5.
- these substrate holding means 31, 32 include a pair of guide rails 33 in the Y-axis direction, and a movable frame 34 movably supported on the guide rails 33.
- the movable frame 34 holds the printed circuit board 3.
- the movable frames 34 can be moved by the substrate moving servo motors 35 and 36 via poll screws 37 and 38.
- a drive mechanism for moving the substrate is constituted by the above-mentioned supporters 35 and 36 and the pole screws 37 and 38.
- the drive mechanism for moving the substrate is provided for each of the substrate holding means 31 and 32, respectively.
- Each printed circuit board 3 can be moved individually.
- reference numeral 39 denotes a component recognition camera, which is arranged outside the component supply units 6A, 6B, 7A, and 7B in the X-axis direction.
- each of the guide frames 11 to 13 includes a frame body 11 a, 12 a, 13 a having a generally horizontally long rectangular shape in a side view. It has rails to support the ends of 14 and 15 movably in the Y-axis direction.
- the first and second guide frames 12, 13 located on both sides are formed to be relatively narrow, and only one rail 41 is provided on the upper surface thereof.
- Compare the third guide frame 13 located between The first and second head unit supporting members 14 and 15 are simultaneously supported by the provision of two rails 42 on the upper surface thereof.
- the frame main bodies 11 a, 12 a, and 13 a are formed in a frame shape having a space 43 inside so that the printed circuit board 3 can pass therethrough.
- Y-axis Supomo overnight 16 and 17 X-axis Supamo overnight 23 A, 23 B, 24 A, 24 B, Head unit 21 A, 21 B, 22 A, 2 2
- the Z-axis and R-axis drive mechanisms provided on 2B and the servomotors 35, 36 for moving the substrate are electrically connected to a control unit (not shown).
- Reference numeral 4 denotes a frame disposed over the side portion and the upper portion of the base.
- Reference numeral 46 denotes a flexible duct having electric wiring for supplying power to each head unit and piping for supplying a negative pressure therein, and one end of the duct 46 is provided on a bracket provided on the frame 44. The other end is connected to each head unit 21A, 21B, 22A, 22B.
- the printed circuit board 3 carried in by the conveyor 2 on the loading side is transferred to the first board holding means 31 in the first mounting work area 4, and the board holding means 31 is moved. Held in frames 34.
- the first head unit support member 14 and the two head units 21 A and 21 B supported by the first head unit support member 14 are actuated by controlling the thermomotor and the like by the control unit.
- the movable frame 34 of the board holding means 31 is actuated, and the components are mounted on the printed board 3.
- the head unit support member 14 first moves to the component supply unit 6 A side, and the components 28 are sucked by the respective heads 28 of the one head unit 21 A. After the suction, the head unit 21A is moved onto the component recognition camera 39 to perform component recognition based on the image taken by the camera 39, and then the other head unit 21B is used to pick up the component.
- the head unit support member 14, which performs component recognition, moves to the other component supply unit 6B side. At this time, the movable frame 34 holding the printed circuit board 3 is positioned closer to the component supply section 6B in the first mounting work area 4. (The two-dot chain line in Fig. 4).
- the head unit support member 14 stops at a predetermined position near the component supply unit 6B, and in this state, the head unit 21B moves in the X-axis direction and the head unit 28 of the head unit 21B moves up and down.
- the head unit 21B absorbs the component from the component supply unit 6B by the head 28 of the head unit 21B while the head unit 21B is placed on the force mirror 39 on the side of the component supply unit 6B. The part moves and recognition of the part is performed.
- the head unit 21A moves in the X-axis direction while holding and recognizing components by such a head unit 21B, and holds the print board 3 in place.
- the head unit supporting member 14 moves to the component supply unit 6 A side, and the movable frame 34 holding the printed circuit board 3 also becomes the first mounting work area. Move to a position (solid line in Fig. 4) close to the parts supply section 6A in (4). Then, while the head unit support member 14 is stopped at a predetermined position in the vicinity of the component supply unit 6A, the head unit 21 A performs the component suction operation and the component recognition, while the head unit 21 B is The component positioning operation in which the movable frame 34 holding the printed circuit board 3 moves in the Y-axis direction in the X-axis direction, and the rotation and lifting and lowering of each head 28 of the head unit 21B are repeated. While this is being done, mounting of the components sucked on each head 28 of the head unit 21B is sequentially performed.
- the component suction operation by the unit and the component mounting operation by the other head unit are performed in parallel.
- the remaining components are mounted on the printed circuit board 3 on which some components are mounted in the first mounting work area 4 in the second mounting work area 5.
- the subsequent printed board 3 is carried into the first mounting work area, and components are mounted on the printed board 3.
- the component picking operation and the component mounting operation are performed in parallel by two head units, and the first mounting work area 4 And the mounting work in the second mounting work area 5 are also performed in parallel, and the mounting work by the four head units 21A, 21B, 22A, and 22B is performed in parallel as a whole. Therefore, mounting can be performed extremely efficiently even on a printed circuit board on which a large number of components need to be mounted, and the mounting processing time can be significantly reduced.
- both head unit support members 14, 15 are supported by three rows of guide frames 11, 12, 13 in common with the support, both head unit support members 14, 15 are held in a state of being held by both ends.
- the support structure can be made simple and compact while enabling stable support.
- the third guide frame 11 is commonly used to support both the head unit support members 14 and 15, and the Y-axis support member for moving the head unit support members 14 and 15 in the Y-axis direction.
- , 17 and the pole screws 18, 19 are arranged on the inner sides of the first and second guide frames 12, 13 on both sides, and are not arranged between the two mounting work areas 4, 5.
- Work areas 4 and 5 can be brought close to each other to minimize the distance between them. As a result, the time required for transferring the printed circuit board from the first mounting work area 4 to the second mounting work area 5 can be reduced, and the working efficiency can be further improved.
- the camera 39 for component recognition is also the X axis of the component supply units 6A, 6B, 6C, and 6D. It is not located between the mounting work areas 4 and 5 in the outer side of the direction, so it is one layer to reduce the time required to transfer electronic components between the mounting work areas 4 and 5. This is advantageous.
- the specific configuration of the surface mounter according to the present invention is not limited to the above embodiment, and can be appropriately changed without departing from the gist of the present invention.
- the first and second mounting work areas 4 and 5 are provided, but three or more mounting work areas may be provided side by side in the X-axis direction.
- component supply units are provided on both sides of each mounting work area in the Y-axis direction
- guide frames are arranged between the mounting work areas and on both sides in the X-axis direction of the mounting work area arrangement part. Both ends of a plurality of headunit support members arranged on the work area are supported on the guide frame so as to be movable in the Y-axis direction, and two headunits are respectively movable on each of the headunit support members in the X-axis direction. It is sufficient to make them support.
- the tape feeders are provided in the respective component supply units 6A, 6B, 7A, and 7B, but the component supply units 7A, 7B on both sides of the second mounting work area 5 are provided.
- another feeder for example, a tray feeder
- a feeder other than a tape feeder may be provided in some parts supply units.
- a force camera 39 is arranged outside each of the component supply units 6A, 6B, 7A, and 7B, and component recognition is performed based on the image captured by the camera 39.
- the head units 21 A, 21 B, 22 A, and 22 B may be provided with a device for performing component recognition by projecting the components using laser light or the like. In this way, the suction parts 21A, 21B, 22A, and 22B are moved from the component supply sections 6A, 6B, 7A, and 7B to the component mounting positions. Can be recognized, so that the mounting efficiency can be further improved.
- the mounting machine of the present invention includes a plurality of mounting work areas provided side by side in the X-axis direction, and a component supply unit is provided on each side of the mounting work area in the Y-axis direction. It is placed on each mounting work area and can be moved in the Y axis direction A plurality of head unit support members, two head units supported by each head unit support member so that they can move in the X-axis direction, and a board placed in each mounting work area and moving the board in the Y-axis direction Since a plurality of substrate holding means are provided so as to be able to hold the components, a component suction operation by one head unit and a component mounting operation by the other head unit are performed in parallel in each mounting work area. Mounting work is performed in parallel in the work area. Therefore, even when the number of components mounted on the printed circuit board is very large, the mounting efficiency can be greatly increased.
- guide frames are provided at predetermined intervals in the X-axis direction so as to be located between the respective work areas and on both sides in the X-axis direction, and are provided with guide frames extending in the Y-axis direction. Since both ends of the dudunit support member are supported, the support structure can be made simple and compact while stably supporting a plurality of the dudunit support members.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003076431A JP4213494B2 (ja) | 2003-03-19 | 2003-03-19 | 表面実装機 |
JP2003-076431 | 2003-03-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004084604A1 true WO2004084604A1 (ja) | 2004-09-30 |
Family
ID=33027888
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/003657 WO2004084604A1 (ja) | 2003-03-19 | 2004-03-18 | 表面実装機 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4213494B2 (ja) |
CN (1) | CN100584182C (ja) |
WO (1) | WO2004084604A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007214429A (ja) * | 2006-02-10 | 2007-08-23 | Yamaha Motor Co Ltd | 表面実装機 |
JP5606136B2 (ja) * | 2010-04-26 | 2014-10-15 | 富士機械製造株式会社 | 部品実装機 |
JP5358529B2 (ja) | 2010-07-23 | 2013-12-04 | ヤマハ発動機株式会社 | 実装機 |
CN103596376B (zh) * | 2013-11-01 | 2015-06-10 | 深圳市森阳流体自动化有限公司 | 高速贴片机 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09102696A (ja) * | 1995-10-04 | 1997-04-15 | Yamaha Motor Co Ltd | 表面実装機 |
JPH11289194A (ja) * | 1998-04-06 | 1999-10-19 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000068691A (ja) * | 1998-08-20 | 2000-03-03 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
JP3720213B2 (ja) * | 1999-05-31 | 2005-11-24 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP4338848B2 (ja) * | 1999-11-01 | 2009-10-07 | Juki株式会社 | 電子部品装着方法及び装置 |
JP4550269B2 (ja) * | 2000-12-21 | 2010-09-22 | ヤマハ発動機株式会社 | 表面実装機 |
-
2003
- 2003-03-19 JP JP2003076431A patent/JP4213494B2/ja not_active Expired - Lifetime
-
2004
- 2004-03-18 WO PCT/JP2004/003657 patent/WO2004084604A1/ja active Application Filing
- 2004-03-18 CN CN200480007438A patent/CN100584182C/zh not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09102696A (ja) * | 1995-10-04 | 1997-04-15 | Yamaha Motor Co Ltd | 表面実装機 |
JPH11289194A (ja) * | 1998-04-06 | 1999-10-19 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1762189A (zh) | 2006-04-19 |
CN100584182C (zh) | 2010-01-20 |
JP2004288745A (ja) | 2004-10-14 |
JP4213494B2 (ja) | 2009-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3402876B2 (ja) | 表面実装機 | |
JP2008251771A (ja) | 部品実装装置 | |
JP4354845B2 (ja) | 電子部品搭載装置 | |
WO2004084604A1 (ja) | 表面実装機 | |
JP4527131B2 (ja) | 実装機 | |
JP4494910B2 (ja) | 表面実装装置 | |
JP2001320195A (ja) | 複合実装機 | |
WO2013099105A1 (ja) | 部品実装装置 | |
JP3165289B2 (ja) | 表面実装機 | |
JPH0761556A (ja) | コンベア | |
JP2006310647A (ja) | 表面実装機および部品実装方法 | |
JP2001313492A (ja) | 部品実装システム | |
JP4342652B2 (ja) | 表面実装機におけるハーネス類の配索構造 | |
KR100585599B1 (ko) | 전자부품 실장장치 | |
JP4969977B2 (ja) | 部品実装装置 | |
JP4467710B2 (ja) | モジュール型部品実装装置 | |
JP4047608B2 (ja) | 実装機 | |
WO2003081975A1 (fr) | Appareil et procede de montage | |
JP3720212B2 (ja) | 基板支持装置 | |
JP3957157B2 (ja) | 実装機 | |
JP2012248657A (ja) | ダイボンダ及びボンディング方法 | |
JP2001313497A (ja) | 表面実装機 | |
JP4814262B2 (ja) | 表面実装機 | |
JP4383633B2 (ja) | 部品実装方法 | |
JP3914080B2 (ja) | 実装機 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 20048074387 Country of ref document: CN |
|
122 | Ep: pct application non-entry in european phase |