WO2004077156A1 - フォトマスク及びその作製方法並びにパターン形成方法 - Google Patents
フォトマスク及びその作製方法並びにパターン形成方法 Download PDFInfo
- Publication number
- WO2004077156A1 WO2004077156A1 PCT/JP2003/002286 JP0302286W WO2004077156A1 WO 2004077156 A1 WO2004077156 A1 WO 2004077156A1 JP 0302286 W JP0302286 W JP 0302286W WO 2004077156 A1 WO2004077156 A1 WO 2004077156A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pattern
- mask
- photomask
- mask pattern
- actual
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/76—Patterning of masks by imaging
- G03F1/78—Patterning of masks by imaging by charged particle beam [CPB], e.g. electron beam patterning of masks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
Definitions
- the present invention relates to a photomask used for manufacturing a semiconductor device or a liquid crystal, a manufacturing method thereof, and a pattern forming method.
- the present invention forms a resist pattern so as not to cause a defect in device manufacturing such as disconnection between actual patterns such as contact holes even if the pitch is small even if the pitch is small, and a mask from proximity effect correction.
- a method for manufacturing a photomask according to the present invention is a method for manufacturing a photomask provided with a mask pattern, wherein the mask pattern is used to form an actual pattern having at least a part of an outer shape curved. And forming the mask pattern by curve approximation of the external portion using a polygonal line segment capable of approximating the external portion of the mask pattern corresponding to the curved line of the real pattern.
- a photomask according to the present invention is a photomask provided with a mask pattern, wherein the mask pattern is for forming an actual pattern having at least a part of an outer shape curved. The outer portion corresponding to the curve of the actual pattern is a curve approximation.
- the pattern forming method according to the present invention is a method for forming an actual pattern having at least a part of an outer shape having a curved shape, wherein an outer part corresponding to the curve of the actual pattern is approximated by a curve.
- a photomask having a mask pattern the mask pattern is exposed and transferred to form the actual pattern.
- the mask pattern is correspondingly circular or elliptical. If the actual pattern has an outer shape in which the corners are curved, the mask pattern is correspondingly approximated to the corners.
- FIG. 1A is a schematic plan view showing a conventional mask image for forming a contact hole.
- FIG. 1B is a contour diagram of the light intensity derived from the simulation of the mask image of FIG. 1A.
- FIG. 2A is a schematic plan view showing a mask image when the mask pattern is further made polygonal according to the present invention.
- FIG. 2B is a light intensity contour plot derived from the simulation of the mask image of FIG. 1A.
- FIG. 3 is a characteristic diagram showing the relationship between the contrast of light intensity and the hole diameter when a mask pattern for forming a contact hole is approximated by a square and an octagon.
- FIG. 4A is a schematic plan view showing a data image when a photomask is manufactured using a mask drawing apparatus using an electron beam.
- FIG. 4B is a schematic plan view showing a mask image produced using the mask data of FIG. 4A.
- FIG. 5A is a schematic plan view showing a data image when a photomask is manufactured using a laser type mask drawing apparatus using i-line or the like.
- FIG. 5B is a schematic plan view showing a mask image produced using the mask data of FIG. 5A.
- FIG. 6A is a schematic plan view showing an image of a photomask.
- FIG. 6B is a schematic plan view showing an image of a resist pattern on the wafer when formed using the photomask of FIG. 6A.
- FIG. 7 is a characteristic diagram showing the relationship between the Horne diameter of the mask pattern on the photomask and the diameter of the contact hole on the wafer.
- FIG. 8 is a schematic plan view showing an example in which a mask pattern is changed according to a portion on the photomask.
- FIG. 9 is a schematic plan view showing another example in which the mask pattern is changed according to the portion on the photomask.
- FIG. 10 is a schematic plan view showing a photomask when an actual pattern corresponding to, for example, a capacitor of a memory element is formed.
- FIG. 11A is a schematic plan view showing a data image when producing a photomask.
- FIG. 11B is a schematic plan view showing a mask image produced using the mask data of FIG. 11A.
- FIG. 12A is a schematic plan view showing an image of a photomask having a square mask pattern by an electron beam type mask drawing apparatus.
- FIG. 12B is a schematic plan view showing an image of a photomask having a mask pattern of a circular approximation by an electron beam type mask drawing apparatus.
- FIG. 13A is a schematic plan view showing an image of a photomask having a square mask pattern by a laser type mask drawing apparatus.
- FIG. 13B is a schematic plan view showing an image of a photomask having a mask pattern of a circular approximation by a laser type mask drawing apparatus.
- the approximation by the polygon line segment is performed, and the portion corresponding to the relevant portion of the mask pattern is approximated by a curve (case).
- a curve case
- the actual pattern to be formed is a circular one, it is assumed to be hexagonal, octagonal, or more. That is, a mask pattern that has a curve approximation corresponding to the actual pattern having a curved shape is used. I thought that the above problem could be solved by using a photomask.
- the polygonal approximation for approximating the contour of the mask pattern with a curve is, in other words, a method of approximating the contour of the mask pattern corresponding to the curve of the actual pattern with a curve.
- an intended mask pattern can be formed by individual and specific polygonal approximations corresponding to these shapes and various conditions.
- an exposure apparatus for drawing a circular pattern using an electron beam a technique of drawing a circular pattern from information on a center position and a radius is disclosed in Japanese Patent Application Laid-Open No. 60-136225.
- FIG. 1A, 1B, 2A, 2B, and 3 are diagrams for explaining the principle of the present invention.
- FIG. 1A is a schematic plan view showing a mask image when a conventional contact hole is formed
- FIG. 1B is a contour diagram of light intensity derived from the simulation.
- Each mask pattern 111 of the photomask 101 is an opening for forming a contact hole, and has a square shape with a pitch of 18 O nm and a side of 13 O nm. I have.
- the light-shielding portion is indicated by 112 and corresponds to the portion where the resist remains on the wafer. In Fig.
- FIG. 2A is a schematic plan view showing a mask image when the mask pattern is further made into a polygonal shape according to the present invention
- FIG. 2B is a contour diagram of light intensity guided from the simulation.
- the mask pattern 11 of the photomask 1 is an opening for forming a contact hole, and has an octagon shape with a pitch of 180 nm and a diameter of 140 nm.
- the light-shielding portion is indicated by 12 and corresponds to a portion where the resist remains on the top of the screen.
- 13 is the location of the highest intensity of the light intensity obtained from the simulation, and 14 is the location of the lowest intensity. Comparing this result with the result in Fig. 1 (a), the light intensity of the part (13) is slightly lower, but the light intensity of the part (14) is also lower. It can be seen that ⁇ is larger.
- ' Figure 3 is a characteristic diagram showing the relationship between the contrast of light intensity and the hole diameter when the mask pattern for forming the contact hole is approximated by a square and an octagon.
- the results show that the contrast becomes larger when the mask pattern is approximated by a circle with an octagon rather than a quadrangle. In other words, it is possible to open contact holes with a narrow pitch, which could not be opened conventionally.
- the simulation results are approximated by an octagon, but have more vertices It is preferable to approximate with a polygon and make it as close as possible to a circle (curve outline).
- the mask pattern is made substantially circular, differences in pattern rounding caused by the mask drawing apparatus and manufacturing process become invisible, and it becomes possible to remove parameters caused by the mask from the proximity effect correction. Therefore, even if the mask manufacturing process is changed, it is not necessary to change the proximity effect correction value, and the number of steps can be reduced.
- Embodiment 1 of the present invention is shown in FIGS. 4A and 4B.
- a photomask is manufactured by forming a mask pattern using an electron beam mask drawing apparatus.
- FIG. 4A is a schematic plan view showing a data image when a photomask is produced by using a mask drawing apparatus using an electron beam
- FIG. 4B is a mask image produced using the mask data. It is a schematic plan view shown.
- the data (pattern data) 21 for forming the mask pattern in the mask data 2 is an octagon.
- an electron beam type mask drawing apparatus since the resolution is high, polygonal pattern data having more vertices such as an octagon is required.
- a photomask 3 having a mask pattern 22 which is an opening close to a circle (approximately a circle) can be obtained.
- Embodiment 2 of the present invention is shown in FIGS. 5A and 5B.
- a mask pattern is formed using a laser-type mask drawing apparatus, and a photomask is manufactured.
- FIG. 5A is a schematic plan view showing a data image when a photomask is manufactured using a laser type mask drawing apparatus using i-line and the like, and FIG. 5B is manufactured using the mask data.
- FIG. 3 is a schematic plan view showing a mask image.
- the data (pattern data) 23 for forming the mask pattern in the mask data 4 was octagonal.
- the resolution is not so high. Therefore, even when using polygonal pattern data having relatively few vertices such as a hexagon, for example, a mask that is an opening close to a circle (close to a circle) is used.
- a photomask 5 having a pattern 24 is obtained.
- Embodiment 3 of the present invention is shown in FIGS. 6A and 6B.
- an actual contact hole pattern is formed by a photomask having a mask pattern that is approximately circular.
- FIG. 6A is a schematic plan view showing an image of a photomask
- FIG. 6B is a schematic plan view showing an image of a resist pattern on a wafer when formed using this photomask.
- NA 0.7
- ⁇ 2 / '.
- the resist that does not open with the normal square mask pattern can be changed to the desired circular shape by using the photomask 6 that has the mask pattern 25 that is an opening of a circular shape.
- the registry pattern 2 6 is formed
- FIG. 7 is a characteristic diagram showing the relationship between the hole diameter of the mask pattern on the photomask and the hole diameter of the contact hole on the wafer.
- the horizontal axis shows the hole diameter of the mask pattern
- the vertical axis shows the hole diameter of the contact hole.
- a clear difference can be seen in the slope of the straight line that indicates the relationship between the turn Honoré diameter of the turn and the contact Honoré diameter. This means that the mask pattern with a circular approximation has a larger process margin.
- FIG. 8 shows a fifth embodiment of the present invention.
- Embodiment 5 shows an example in which the mask pattern is changed according to the portion on the photomask.
- a mask pattern 27 of only a narrow pitch portion on the photomask 8 is formed by circular approximation, and a rectangular mask pattern 28 is formed at a relatively sparse portion. That is, it is appropriate to apply such a circularly-shaped mask pattern 27 only to a portion where it is particularly difficult to form a mask pattern. By using such a method, it is possible to prevent the mask data from being unnecessarily increased.
- FIG. 9 shows Embodiment 6 of the present invention.
- Embodiment 6 shows another example in which the mask pattern is changed according to the portion on the photomask.
- a mask pattern 29 only at relatively sparse portions on the photomask 9 is formed by circular approximation, and a square mask pattern 30 is formed at narrow pitch portions. This is an effective example especially when it is used when dimensional stability of a sparse mask pattern is required. Since the circular approximation is applied only to the sparse mask pattern, the data amount does not greatly differ from the normal data amount.
- Embodiment 10 of the present invention is shown in FIG. In the seventh embodiment, for example, a photomask for forming an actual pattern corresponding to a capacitor of a memory element will be described.
- Embodiment 8 of the present invention is shown in FIGS. 11A and 11B.
- a photomask for forming an actual pattern such as bulk wiring of a logic device is manufactured.
- FIG. 11A is a schematic plan view showing a data image when producing a photomask
- FIG. 11B is a schematic plan view showing a mask image produced using this mask data.
- a mask pattern 33 having a nearly circular end on the photomask 42.
- Use of such a mask pattern makes it possible to obtain a stable resist pattern having a wide process margin.
- FIGS. 12A, 12B, 13A, and 13B A ninth embodiment of the present invention is shown in FIGS. 12A, 12B, 13A, and 13B.
- the mask pattern shapes formed by the electron beam type mask writing apparatus and the laser type mask writing apparatus were compared.
- Fig. 12A is a photomask having a square mask pattern by an electron beam type mask drawing apparatus
- Fig. 12B is a photomask having a circular approximation mask pattern by an electron beam type mask drawing apparatus
- Fig. 13A is FIG. 13B is a schematic plan view showing an image of a photomask having a square mask pattern by a laser type mask drawing apparatus
- FIG. 13B is an image of a photomask having a circular approximation mask pattern by a laser type mask drawing apparatus.
- the resist pattern is formed so as not to cause a problem in device manufacturing such as disconnection between actual patterns such as contact holes due to a reduction in the film thickness of the resist, and from the proximity effect correction.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN03823713A CN100590523C (zh) | 2003-02-28 | 2003-02-28 | 光掩模和其制造方法及图形形成方法 |
PCT/JP2003/002286 WO2004077156A1 (ja) | 2003-02-28 | 2003-02-28 | フォトマスク及びその作製方法並びにパターン形成方法 |
JP2004568760A JP4494221B2 (ja) | 2003-02-28 | 2003-02-28 | フォトマスク及びその作製方法並びにパターン形成方法 |
US11/128,183 US7598005B2 (en) | 2003-02-28 | 2005-05-13 | Photomask and manufacturing method of the same, and pattern forming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2003/002286 WO2004077156A1 (ja) | 2003-02-28 | 2003-02-28 | フォトマスク及びその作製方法並びにパターン形成方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/128,183 Continuation US7598005B2 (en) | 2003-02-28 | 2005-05-13 | Photomask and manufacturing method of the same, and pattern forming method |
Publications (1)
Publication Number | Publication Date |
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WO2004077156A1 true WO2004077156A1 (ja) | 2004-09-10 |
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ID=32923114
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PCT/JP2003/002286 WO2004077156A1 (ja) | 2003-02-28 | 2003-02-28 | フォトマスク及びその作製方法並びにパターン形成方法 |
Country Status (4)
Country | Link |
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US (1) | US7598005B2 (ja) |
JP (1) | JP4494221B2 (ja) |
CN (1) | CN100590523C (ja) |
WO (1) | WO2004077156A1 (ja) |
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JP2007199434A (ja) * | 2006-01-27 | 2007-08-09 | Dainippon Printing Co Ltd | プロキシミティ方式の露光方法とそれに用いられるマスク基板、および該マスク基板の作製方法 |
JP2010062562A (ja) * | 2008-09-01 | 2010-03-18 | D2S Inc | 半導体装置を基板上に製造するための方法、荷電粒子ビームリソグラフィのための断片化またはマスクデータ準備のための方法、複数の円形パターンを表面上に形成するための方法およびシステム、ならびに荷電粒子ビームリソグラフィで用いるための断片化またはマスクデータ準備のためのシステム |
US8609306B2 (en) | 2008-09-01 | 2013-12-17 | D2S, Inc. | Method for forming circular patterns on a surface |
US8669023B2 (en) | 2008-09-01 | 2014-03-11 | D2S, Inc. | Method for optical proximity correction of a reticle to be manufactured using shaped beam lithography |
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- 2003-02-28 JP JP2004568760A patent/JP4494221B2/ja not_active Expired - Lifetime
- 2003-02-28 CN CN03823713A patent/CN100590523C/zh not_active Expired - Fee Related
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Cited By (20)
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---|---|---|---|---|
JP2007199434A (ja) * | 2006-01-27 | 2007-08-09 | Dainippon Printing Co Ltd | プロキシミティ方式の露光方法とそれに用いられるマスク基板、および該マスク基板の作製方法 |
US9323140B2 (en) | 2008-09-01 | 2016-04-26 | D2S, Inc. | Method and system for forming a pattern on a reticle using charged particle beam lithography |
US9268214B2 (en) | 2008-09-01 | 2016-02-23 | D2S, Inc. | Method for forming circular patterns on a surface |
US9274412B2 (en) | 2008-09-01 | 2016-03-01 | D2S, Inc. | Method and system for design of a reticle to be manufactured using variable shaped beam lithography |
US8828628B2 (en) | 2008-09-01 | 2014-09-09 | D2S, Inc. | Method and system for design of a reticle to be manufactured using variable shaped beam lithography |
US8900778B2 (en) | 2008-09-01 | 2014-12-02 | D2S, Inc. | Method for forming circular patterns on a surface |
US8609306B2 (en) | 2008-09-01 | 2013-12-17 | D2S, Inc. | Method for forming circular patterns on a surface |
US9625809B2 (en) | 2008-09-01 | 2017-04-18 | D2S, Inc. | Method and system for forming patterns using charged particle beam lithography with variable pattern dosage |
US9715169B2 (en) | 2008-09-01 | 2017-07-25 | D2S, Inc. | Method and system for forming a pattern on a reticle using charged particle beam lithography |
US8669023B2 (en) | 2008-09-01 | 2014-03-11 | D2S, Inc. | Method for optical proximity correction of a reticle to be manufactured using shaped beam lithography |
JP2010062562A (ja) * | 2008-09-01 | 2010-03-18 | D2S Inc | 半導体装置を基板上に製造するための方法、荷電粒子ビームリソグラフィのための断片化またはマスクデータ準備のための方法、複数の円形パターンを表面上に形成するための方法およびシステム、ならびに荷電粒子ビームリソグラフィで用いるための断片化またはマスクデータ準備のためのシステム |
US9372391B2 (en) | 2008-09-01 | 2016-06-21 | D2S, Inc. | Method and system for forming patterns using charged particle beam lithography with variable pattern dosage |
US9341936B2 (en) | 2008-09-01 | 2016-05-17 | D2S, Inc. | Method and system for forming a pattern on a reticle using charged particle beam lithography |
US10101648B2 (en) | 2008-09-01 | 2018-10-16 | D2S, Inc. | Method and system for forming a pattern on a reticle using charged particle beam lithography |
US9164372B2 (en) | 2009-08-26 | 2015-10-20 | D2S, Inc. | Method and system for forming non-manhattan patterns using variable shaped beam lithography |
US9057956B2 (en) | 2011-02-28 | 2015-06-16 | D2S, Inc. | Method and system for design of enhanced edge slope patterns for charged particle beam lithography |
US9612530B2 (en) | 2011-02-28 | 2017-04-04 | D2S, Inc. | Method and system for design of enhanced edge slope patterns for charged particle beam lithography |
JP2020512583A (ja) * | 2017-03-13 | 2020-04-23 | 武漢華星光電技術有限公司Wuhan China Star Optoelectronics Technology Co.,Ltd | フォトマスク構造及びcoa型アレイ基板 |
CN111324002A (zh) * | 2018-12-13 | 2020-06-23 | 三星电子株式会社 | 制造半导体器件的方法 |
CN111324002B (zh) * | 2018-12-13 | 2024-06-07 | 三星电子株式会社 | 制造半导体器件的方法 |
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JP4494221B2 (ja) | 2010-06-30 |
JPWO2004077156A1 (ja) | 2006-06-08 |
CN1688933A (zh) | 2005-10-26 |
US7598005B2 (en) | 2009-10-06 |
US20050208392A1 (en) | 2005-09-22 |
CN100590523C (zh) | 2010-02-17 |
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