WO2004064460A1 - 高周波電力供給装置およびプラズマ発生装置 - Google Patents
高周波電力供給装置およびプラズマ発生装置 Download PDFInfo
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- WO2004064460A1 WO2004064460A1 PCT/JP2004/000258 JP2004000258W WO2004064460A1 WO 2004064460 A1 WO2004064460 A1 WO 2004064460A1 JP 2004000258 W JP2004000258 W JP 2004000258W WO 2004064460 A1 WO2004064460 A1 WO 2004064460A1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/3299—Feedback systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
Definitions
- the present invention relates to a high-frequency power supply device and a plasma generation device which are particularly suitable for a thin film forming process for a large-area substrate and an ion implantation process for a long member in a plasma ion implantation method.
- Inductively coupled plasma generators that use high-frequency power can generate high-density plasma and thus achieve high throughput, and have been used for thin film formation of substrates and plasma ion injection.
- the antenna 54 is supplied as a plurality of loads.
- the high-frequency signal from the oscillator 55 is amplified by a plurality of amplifiers 56 to obtain high-frequency power, and the high-frequency power is output by the phase matching device 57 together. It has become.
- the high-frequency power generated between the terminals of each antenna 54 is compared with the case where high-frequency power is supplied in series to each of two or more antennas 54 having a finite inductance and the case where they are supplied in parallel.
- the voltage is the same in both cases in that the voltage is proportional to the product of the inductance of each antenna 54 and the high-frequency current, but the combined inductance supplies high-frequency power in parallel compared to supplying high-frequency power in series. This is because it is possible to reduce.
- each antenna 54 in order to increase the diameter or volume of the plasma generator, each antenna 54 must be connected to a plasma to generate uniform plasma over a large area or large volume. It is arranged so as not to be localized in the generation room 59, and as a result, the distance between the impedance matching device 53 and one antenna 54 via the wiring portion 58, and the other antenna 54 The difference from the distance increases.
- the inductance in the wiring portion 58 required to supply the high-frequency power to each antenna 54 in parallel is reduced by plasma. It increases with an increase in the diameter or volume of the generating section. For this reason, there is a problem that a high-frequency voltage larger than a high-frequency voltage generated between the terminals of the single antenna 54 is generated in the antenna 54 connected to the end.
- the high-frequency current flowing through each antenna 54 is an impedance.
- a high-frequency current is distributed by a passive circuit between the matching device 53 and the antenna 54 serving as a load. For this reason, not only the current distribution becomes non-uniform due to the non-uniformity of the impedance parasitic on the shunt circuit, but also the current distribution cannot be actively controlled.
- the high-frequency current flowing between the antennas 54 becomes uneven due to the non-uniformity of the loading resistance of the plasma, the parasitic impedance of the shunt circuit, and the temporal change due to the generated heat. Even in such a case, there is a problem that the high-frequency current cannot be controlled, the plasma generation becomes uneven and unstable, and the thin film formation using the plasma becomes unstable.
- a high-frequency power supply device includes a high-frequency power supply device provided with two or more capacitive or inductive loads. This is a configuration provided near each corresponding load.
- the above configuration eliminates the necessity of supplying a high-frequency current to each load in parallel or in series, and can reduce variations in high-frequency voltage generated in each load.
- a plasma generator of the present invention includes: a high-frequency power supply device according to the above; and a vacuum mounted so that a load of the high-frequency power supply device generates plasma by applying high-frequency power. And a container.
- the above configuration eliminates the need to supply a high-frequency current to each load in parallel or in series, so that the dispersion of the high-frequency voltage generated in each load can be reduced, and the diameter of the plasma generation unit can be increased or increased. Even if the volume is increased, more uniform plasma can be generated, and the formation of a thin film by the plasma and the plasma ion injection can be stabilized.
- FIG. 1 is a circuit block diagram of the high-frequency power supply device of the present invention.
- FIG. 2 is a configuration diagram of the plasma generator of the present invention, and shows a cross-sectional structure of the plasma generator in which a plurality of inductively coupled antennas are connected to the high-frequency power supply of the present invention.
- FIG. 3 is a circuit block diagram of a high-frequency oscillation controller of the high-frequency power supply device.
- FIG. 4 is a circuit block diagram of an amplifier (integrated high-frequency amplifier unit) showing a main part of the plasma generator.
- FIGS. 5 (a) and 5 (b) are schematic diagrams when the phase of the high-frequency current supplied to a plurality of antenna conductors in the above-described plasma generator is changed, and FIG. 5 (a) shows the phase in one direction.
- Figure 5 (b) shows the case where the phase is changed in the opposite direction.
- FIG. 6 is a schematic perspective view of an inductively-coupled embodiment in which four antenna conductors are arranged on each side surface of a rectangular vacuum vessel in the above-described plasma generator.
- FIGS. 7 (a) to 7 (c) show the plasma uniformity in the vacuum vessel when the high-frequency power supplied to the antenna conductor is changed in the plasma generator of the present invention shown in FIG.
- FIG. 7 is a graph showing the change.
- (a) shows the case where the same power is supplied to all four wires on each surface
- Fig. 7 (b) shows that the high-frequency power supplied to the antenna conductors at both ends of each surface is 20% higher than the remaining two wires.
- Fig. 7 (c) shows a case where the high-frequency power supplied to the antenna conductors at both ends of each surface is reduced by 40% from the remaining two.
- Figures 8 (a) and (b) are graphs showing the ground amplitude when a high-frequency current is supplied to the antenna conductor, which is an inductive load.
- Figure 8 (a) shows the case where one of the antenna conductors is grounded.
- Figure 8 (b) shows the case where the floating potential is caused by the blocking capacitor and the like.
- FIG. 9 is a block diagram showing the voltage at each part in the conventional plasma generator.
- FIG. 10 is a block diagram showing a voltage at each part in the plasma generator according to the second embodiment of the present invention.
- FIG. 11 is a block diagram showing a voltage at each part in the plasma generator according to the third embodiment of the present invention.
- FIG. 12 is a cross-sectional view of the antenna peripheral structure in the plasma generator of the second and third embodiments of the above embodiment.
- FIG. 13 is a cross-sectional view of a modification of the antenna peripheral structure in the plasma generator of the second and third embodiments of the above embodiment.
- FIG. 14 is a cross-sectional view of a structure around an antenna in a plasma generator according to a fourth embodiment of the present invention.
- FIG. 15 is a cross-sectional view of a modified example of the antenna peripheral structure in the plasma generator according to the fourth embodiment.
- FIGS. 16 (a) to (c) show the shape of the ground electrode according to the fourth embodiment of the present invention.
- FIG. 16 (a) is a plan view
- FIG. 16 (b) is a front view
- FIG. c) shows a perspective view.
- FIG. 17 is a rough graph showing the difference in the floating potential of the plasma depending on the presence or absence of the ground electrode in the fourth embodiment.
- FIGS. 18 (a) and 18 (b) show a sensor of a plasma generator according to a sixth embodiment of the present invention.
- FIG. 18 (a) is a cross-sectional view
- FIG. 18 (b) is a perspective view.
- FIG. 18 (a) is a cross-sectional view
- FIG. 18 (b) is a perspective view.
- FIG. 19 is a schematic configuration diagram showing the sensor and the detection unit.
- FIG. 20 is a graph showing attenuation characteristics of a high-frequency induction magnetic field from an antenna conductor.
- FIGS. 21 (a) to (c) are graphs showing the time change of the plasma state during the pulse operation of the conventional inductively coupled load.
- FIG. 21 (a) shows the plasma density
- FIG. (b) shows the electron temperature
- FIG. 21 (c) shows the plasma potential as the above-mentioned plasma state.
- FIG. 22 is a graph showing the plasma density dependence of the increase rate of the electron temperature at the time of the pulse ⁇ N with respect to the electron temperature value in the steady state under the inductive coupling load immediately before the pulse is turned on.
- FIG. 23 is a graph showing the dependence of the increase rate of the plasma potential during the pulse ON on the plasma density immediately before the pulse ⁇ N with respect to the plasma potential value in the steady state under the inductive coupling load.
- FIGS. 24 (a) to (c) are graphs showing the time change of the plasma state associated with the pulse operation of the inductively coupled load according to the sixth embodiment of the present invention. Indicates the plasma density, FIG. 24 (b) indicates the electron temperature, and FIG. 24 (c) indicates the plasma potential as the above-mentioned plasma state.
- FIG. 25 is a circuit block diagram of a conventional high-frequency power supply device.
- FIG. 26 is a configuration diagram of a conventional plasma generator, and shows a cross-sectional structure of a plasma generator in which a plurality of inductively coupled antenna conductors are connected in parallel to a conventional high-frequency power supply.
- the high-frequency power supply device includes a plurality of antennas 1 as loads, and a high-frequency oscillation controller for supplying high-frequency power to each of the antennas 1 (Power control unit, plasma control unit) 2, and a distributed constant line 3 for transmitting a high-frequency signal for supplying a high-frequency signal for the high-frequency power to each antenna 1.
- a high-frequency oscillation controller for supplying high-frequency power to each of the antennas 1 (Power control unit, plasma control unit) 2
- a distributed constant line 3 for transmitting a high-frequency signal for supplying a high-frequency signal for the high-frequency power to each antenna 1.
- Distributed constant The characteristic impedance of line 3 is set to 50 ⁇ .
- amplifiers 4 for amplifying the high-frequency signal and supplying the high-frequency power to the antennas 1 are individually provided close to the respective antennas 1. As a result, even if two or more antennas 1 are provided, the voltage generated by the high-frequency power supplied to these antennas 1 can be made uniform, and the generation of plasma due to the inductive coupling of each antenna 1 can be stabilized. it can.
- the antenna 1 is set to be an inductive load, but may be set to be a capacitive load.
- Antenna 1 The shape may be any shape that can generate plasma as an inductive load or a capacitive load. In the case of an inductive load, one turn (turns) or less is used to reduce inductance. More preferably, the length is less than one turn, and is a semicircular shape or a substantially U-shape.
- the plasma generating apparatus of the present invention has the above-described high-frequency power supply apparatus, and includes a substrate stage 5 on a bottom inner surface thereof and a vacuum vessel 6 for generating plasma. Are provided adjacent to each other so as to surround the substrate stage 5 and protrude inward from the inner wall surface of the vacuum vessel 6.
- the shape of the vacuum container 6 is not particularly limited as long as it is a shape corresponding to a substrate to be processed such as a thin film formation, but is set to a rectangular parallelepiped shape or a cylindrical shape.
- the vacuum vessel 6 is provided with a gas inlet for generating plasma, an exhaust port for controlling the pressure in the vacuum vessel 6, and a gas supply unit and a vacuum pump. ing.
- a target mounting portion for sputtering or the like may be provided in the vacuum vessel 6.
- the high-frequency oscillation controller 2 includes an integrated control system 21, a high-frequency circuit system 22, and a DC power supply system 23.
- the high-frequency circuit system 2 2 includes: 1) a phase modulator (phase control unit) 22 b connected to one main oscillator (oscillation frequency: f 0) 22 a; a frequency modulator (frequency control unit) 22 c, a plurality of signal amplifiers 22 d. 2)
- the output high-frequency signal is output from the high-frequency output terminal connected to each high-frequency circuit system 22 and is input to the amplifier 4 directly connected via the high-frequency line 3a of the distribution constant line 3. 3)
- the high-frequency signal output from the high-frequency circuit 22 is converted by the phase modulator 22b, frequency modulator 22c, and signal amplifier 22d that constitute the high-frequency circuit 22. Power, frequency and phase can be controlled independently.
- the DC power supply system 23 includes 1) a plurality of DC power supplies 23a, and 2) each DC power output from the DC power supply system 23 is supplied from a DC output terminal connected to each DC power supply 23a. It is output and input to the amplifier 4 directly connected via the DC line 3 b of the distributed constant line 3. 3) The DC power output from each DC power supply 23a can be controlled independently.
- the integrated control system 21 includes the measurement signals of the high-frequency voltage, current, and power supplied to the antenna 1 as a load in each unit, and the plasma generation state (plasma density) near the load provided in each unit. Measurement signals (Prf_l to Prf-n, Vrf-l to Vrf-n, Irf-l to Irf-n PL-l to PL-n) Input Input as a signal.
- the integrated control system 21 uses the signals indicating the high-frequency voltage, current, power, and plasma state input from each amplifier 4 to the integrated control system 21 as control signals, and outputs a signal for X and a high-frequency circuit 2 Phase modulation control signal generator 21a, frequency modulation control signal generator 21b, signal amplification factor for performing feedback control of the output of DC power supply 2 and DC power supply system 23 so as to satisfy the desired process conditions It has a control signal generator 21c and a DC output control signal generator 21d.
- the phase modulation control signal generator 21a can control each phase modulator 22b.
- the frequency modulation control signal generator 2 1 b This is for individually controlling the wave number modulators 22c.
- Signal amplification rate control The signal generator 21c controls each signal amplifier 22d separately.
- the DC output control signal generator 21d can control each DC power supply 23a.
- the integrated control system 21 can maintain the state in the process device in a stable and highly reproducible state by the feedback control described above.
- the antenna conductor of antenna 1 Furthermore, by comparing the high-frequency power, voltage, and current flowing through the antenna conductor of antenna 1 with the plasma state (intensity ratio, phase difference), the antenna
- the ratio of the high frequency magnetic field strength to Irf decreases as the ratio of absorption and shielding of the high frequency magnetic field by the deposit increases. Therefore, by monitoring the plasma state with respect to this Irf, it is possible to predict the degree of deposits on the periphery of the antenna 1 and to clean the area around the antenna 1 with an appropriate etching gas or use a new one. 'Replacement for antenna 1'-you will be able to know exactly when.
- the monitor provides feedback input signals to the integrated control system 21 (high-frequency voltage, high-frequency current, phase, high-frequency magnetic field strength signals supplied to the antenna, and each signal from each of the measurement units).
- the state of the plasma and the state of the shield around the antenna are output to the outside and monitored.
- the amplifier 4 includes a high-frequency power amplifier 41 in which a high-frequency power amplifying element (MOS FET) is mounted on a water-cooled Cu base.
- the high-frequency power amplifier 41 is connected to the low-impedance antenna 1 via a vacuum flange and a high-frequency feedthrough (insulator) 6a, so that the amplifier 4 is a unit integrated with a high-frequency amplifier.
- the antenna 1 has an inductively coupled antenna conductor la and an antenna sheath 1b made of an electrical insulator such as ceramic and a low dielectric material and covering the antenna conductor 1a.
- the amplifier 4 includes various measurement circuits (measurement units) 4 2, 4 3 for measuring the high-frequency power (Prf-n), voltage (Vrf-n), and current (Irf-n) supplied to the antenna conductor 1a, respectively. , 44 and a measurement probe (measurement unit) 45 and a measurement circuit (measurement unit) 46 for measuring the plasma state (PL-n) near the antenna conductor 1a.
- the measurement probe 45 has a rod shape, and its tip end projects into the vacuum vessel 6.
- a high-frequency magnetic field probe for measuring the high-frequency magnetic field intensity around the antenna, a Langmuir probe, an ion collector, a plasma absorption probe, and an emission spectroscopic probe can be used.
- a high-frequency signal having a maximum power of 10 W input from the high-frequency oscillation controller 2 is input to a class C amplifier circuit in the amplifier 4 and is power-amplified by supplying drive power from the DC power supply 23 a to the M ⁇ SFET. It becomes high frequency power.
- the output of high-frequency power is directly connected to the low impedance inductively coupled antenna conductor 1a, and impedance matching between the antenna conductor 1a and the amplifier 4 is received.
- the high-frequency power supplied to the antenna conductor 1 a is given by the product of the high-frequency signal supplied from the high-frequency oscillation controller 2 and the amplification factor of the amplifier 4.
- the amplification factor depends on the input high-frequency signal, its frequency, and the DC power supplied to the amplifier 4.
- the high-frequency power supplied to the antenna conductor 1a is controlled by the high-frequency signal supplied from the high-frequency oscillation controller 2 to the amplifier 4, the frequency thereof, and the DC power.
- the specifications of the amplifier 4 are as follows.
- Amplification circuit Push-pull high-frequency power amplification circuit
- Amplification frequency band 2 to 50 MHz
- Impedance matching box and antenna load
- a shunt circuit for shunting a high-frequency current between the shunt circuit and the passive circuit becomes unnecessary, and it is possible to avoid a non-uniform current distribution due to the non-uniformity of the parasitic impedance of the shunt circuit. Become.
- the output section of the high-frequency power amplifier 41 can be directly connected to the antenna 1 through a lumped constant circuit with low impedance (a matching circuit with the conventional 50 ⁇ transmission line is not required).
- High output can be easily achieved with low cost and multiple implementations (less than 1/3 of conventional products).
- the dissociation process, ionization process, and excitation process of the process gas used in plasma CVD and plasma etching are governed by the collision of the process gas with the electrons in the plasma, and by controlling the electron energy distribution in the plasma.
- the ratio of neutral radicals and ionic species and the excited state are controlled.
- the ratio of these neutral radicals and ionic species and the excited state Surface reactions and gas phase reactions are dominant, and processing processes such as plasma CVD and plasma etching can be controlled to desired states.
- a first embodiment of the present invention using a plasma generator having a vacuum vessel 6 whose inner wall surface has a substantially rectangular parallelepiped shape shown in FIG. 6 will be described below.
- Antenna 1 is placed inside each inner wall of vacuum vessel 6.
- 'Four antennas 1 from two short sides: (Bl, B2, B3, B4) and (D1, D2, D3, D4)
- the origin of the z axis is the center position in the height direction.
- the origin of the XY plane is the center of the plane.
- the substantially U-shaped antenna conductor la in each antenna 1 has a closed curve formed by an imaginary line connecting their tips (portions substantially parallel to the inner wall surface of the vacuum vessel 6).
- the tips are set to be larger than the surface shape (for example, rectangle) of the target substrate and similar to the above surface shape, and substantially parallel to each other, and the distances between the adjacent antenna conductors 1a on the imaginary line are set at substantially equal intervals. Is set.
- the distribution of plasma generated in the vacuum vessel 6 is arbitrarily controlled by independently controlling the high-frequency power supplied to each antenna conductor 1a. It is possible.
- the antenna 1 is arranged on the side wall of the vacuum vessel, even when a plurality of antennas 1 are arranged on the top plate, the high-frequency waves supplied to the antenna conductors adjacent to each other are also provided. By controlling the power independently, it is possible to easily control the distribution of plasma generated in the vacuum vessel.
- the power feeding side Oscillates at a ground amplitude determined by the product of the angular frequency ( ⁇ ) of the high-frequency power supply, the inductance (L) of the antenna 1 and the amplitude of the high-frequency current (I rf). 8 As shown in (b)
- one of the ends of the antenna conductor 1a shows a high ground amplitude.
- this high-frequency voltage is applied to the sheath portion of the plasma, not only does the capacitive coupling with the plasma cause abnormal oscillation of the plasma potential, but also the high-frequency voltage at which ions in the plasma are applied to the sheath portion. Then, it is accelerated and incident on the side of the antenna conductor 1a, causing a phenomenon such as sputtering, thereby causing problems such as generation of impurities.
- the voltage (V s) applied to the plasma sheath region 14 as shown in the equivalent circuit of Fig. 9 Can be expressed by the following equation (1) using the voltage (V a) generated in the antenna conductor la and the potential drop (V i) in the insulator 12.
- Z i and Z s represent the impedances in the region of the insulator 12 and the sheath portion 14, respectively.
- a second embodiment of the present invention is aimed at further reducing the voltage applied to the region of the sheath portion 14.
- a vacuum region (space region) 1 is formed around a portion (more preferably all portions) of the antenna conductor 1 a inside the vacuum vessel 6.
- Insulators 12 are arranged at intervals of 8.
- the degree of vacuum in the vacuum region 18 may be a degree set in the vacuum vessel 6 for generating plasma.
- the relative permittivity of the vacuum region 18 is almost 1, which is lower than any dielectric material, so that a high impedance can be secured. Therefore, the voltage (V s) applied to the region of the plasma sheath portion 14 is the voltage (V a) generated in the antenna conductor 1 a, the potential drop (V v) in the vacuum region 18 and the insulator 1
- the following equation (2) can be expressed by using the potential drop (V i) at 2.
- ZV indicates the impedance of the vacuum region 18.
- the antenna conductor 1 a is located inside the vacuum vessel 6.
- the first insulator 12a (the above-mentioned portion) is disposed around the portion (more preferably all the portions) through a first vacuum region 18a (corresponding to the above-mentioned vacuum region 18).
- the second insulator 12b is disposed so as to cover the first insulator 12a with a second vacuum region 18b therebetween. .
- the high-frequency voltage applied to the region of the sheath portion 14 near the end of the antenna conductor 1a, which causes abnormal vibration of the sputtering of the second insulator 12b and the plasma potential, is reduced. It will be possible to reduce it more effectively and more than before.
- Desirable shapes of the second insulator 12b include a protective tube or a protective plate.
- FIG. 11 shows an equivalent circuit in the case where the second insulator 12 b is arranged around the first insulator 12 a with a second vacuum region 18 b therebetween.
- the voltage (V s) applied to the region of the plasma sheath portion 14 is the voltage (V a) generated in the antenna conductor 1 a , the potential drop (V vl) in the first vacuum region 18 a And the potential drop (V i 1) in the first insulator 12 a, the potential drop (VV 2) in the second vacuum region 18 b, and the potential drop (V V 2) in the second insulator 12 b Using Vi 2), it can be expressed as the following equation (3).
- the high-frequency voltage applied to the region of the sheath portion 14 at the end of the antenna conductor 1a can be effectively and further reduced.
- ZV1 and Zi1 are the first vacuum regions 18a and 18a, respectively.
- ZThe impedance of the first insulator 12a is shown, and
- Zv2 and Zi2 are the impedances of the second vacuum region 18b and the second insulator 12b, respectively.
- a cylindrical shape is formed at a portion close to the wall of the vacuum vessel 6 which is the end of the antenna conductor la.
- the ground electrode 15 having a zigzag cross section is provided so as to surround the first insulator 12a with a coaxial structure.
- the zigzag structure of the cross section means that the antenna conductor 1a is bent in a zigzag manner so that it projects perpendicularly to the direction of conduction (long axis direction) of the antenna conductor 1a and alternately protrudes in the direction opposite to each other along the direction of conduction. Structure.
- ground electrode 15 By installing the ground electrode 15, it is possible to block a high-frequency voltage generated at the end of the antenna conductor 1 a from being applied to the region of the sheath portion 14 of the plasma.
- the above-described antenna conductor is formed by the ground electrode 15 and the second insulator 12 b. It is possible to completely block the application of the high-frequency voltage generated at the end of 1a to the region of the sheath portion 14 of the plasma.
- the ground electrode 15 in a zigzag structure, it is possible to effectively cut off the electrostatic coupling due to the high-frequency voltage generated in the antenna introduction portion, and to extend the current path for the induced electric field in the ground electrode 15. To suppress heat generation induced by the ground electrode 15 and reduce power loss. It is possible to reduce.
- the antenna 1 has an antenna conductor 1 a that generates an induced electric field by the applied high-frequency power, and a high-frequency feedthrough 6 a, which is a vacuum flange in a vacuum vessel 6, or a wall of a champer. is installed is attached to, is constituted Katsua antenna conductor 1 a is a metal pipe or a metal plate, in addition ⁇ antenna conductor 1 a, present in the vacuum chamber 6, preferably to around all parts, cylinder Insulator 12 is arranged with vacuum region 18 interposed therebetween, and has a structure that completely blocks the contact between plasma and antenna conductor 1a.
- the insulator 12 includes a cylindrical main body 12 c and a holding insulator 12 d. Since the main body 1 2c is arranged with the vacuum area 18 separated from the antenna conductor 1a, the holding insulator 12 d moves inward from the inner wall of the main body 1 2c. An extended rib shape is inserted into the main body 12c to hold the antenna conductor 1a. As a result, the insulator 12 is stably arranged around the antenna conductor 1a across the vacuum region 18.
- the area of the loop surrounded by the portion of the antenna conductor 1a inside the vacuum vessel 6 and the wall of the vacuum vessel 6 is such that the antenna conductor 1a is present in order to reduce the inductance of the antenna conductor 1a. It is preferable that the cross-sectional area (projection area) of the vacuum container 6 in a plane is 1/2 or less.
- the inductance of the antenna conductor 1a which is the antenna system, is low, the high-frequency voltage generated in the antenna conductor 1a can be suppressed. Furthermore, the insulator 12 arranged around all the parts of the antenna conductor 1a inside the vacuum vessel 6 has a seamless structure, and completely cuts off the contact between the plasma and the antenna conductor 1a. To have a structure.
- a second insulator 12b may be arranged around the insulator 12 with a vacuum region 18b therebetween.
- Examples of the shape of the second insulator 12b include a protection tube or a protection plate.
- the insulator 12 becomes the first insulator 12a. This suppresses the coupling of the high-frequency voltage generated at the end of the antenna conductor 1a into the plasma, thereby reducing the generation of impurities due to the sputtering of the insulator 12 and suppressing the fluctuation of the plasma potential.
- FIG. 13 is another embodiment of the second and third embodiments of the present invention.
- a connecting portion 12 e that forms a curved portion of the insulator 12 disposed around the antenna conductor 1 a by connection may be provided.
- Each main body 1 2 c They are connected to each other via a connection 12 e.
- the connecting portion 12 e may be made of any material having heat resistance, such as ceramic, glass, metal, etc., which can be processed into a curved shape.
- Each main body portion is a pipe-shaped linear insulator. The combination with 12 c makes it possible to easily realize the first insulator 12 a.
- a high voltage generated in a high-frequency introducing portion of the antenna conductor la is effectively shielded, It has an effect of suppressing capacitive coupling, the ground electrode 1-5 of the tubular, so as to cover the antenna conductor 1 a from the outside, and is provided so as to be coaxially with the antenna conductor 1 a.
- the ground electrode 15 is provided between the antenna conductor 1a and the first insulator 12a.
- the ground electrode 15 is provided between the first insulator 12a and the second insulator 12b.
- the metal ground electrode 15 used at that time has a zigzag structure in cross section, as shown in FIG. 16, as shown in FIG.
- the electrostatic coupling due to the high-frequency voltage generated at the introduction portion of the antenna conductor 1a can be effectively cut off, and the current path for the induced electric field of the ground electrode 15 can be made longer by the zigzag structure. It is possible to suppress heat generation induced by the electrode 15 and reduce power loss.
- FIG. 17 shows a hydrogen plasma (discharge pressure of 2 Pa) generated by using each of the antennas 1 of the embodiments of FIGS. 12 (without ground electrode) and FIG. 15 (with ground electrode).
- the results obtained by measuring the floating potential in () with a Langmuir probe are shown below.
- Fig. 1 shows that the plasma potential was effectively reduced with the ground electrode compared to the case without the ground electrode.
- the results of 7 are shown.
- a sensor for measuring the high-frequency induced magnetic field intensity radiated from the antenna conductor 1a be provided in the vacuum vessel 6.
- a sensor 30 described in a sixth embodiment described later can be used.
- Examples of the physical quantity measured by the sensor include the strength of a high-frequency magnetic field emitted from the antenna conductor la, and preferably the azimuthal direction with respect to the antenna current.
- a high-frequency current measuring element pickup coil, loop coil, etc. installed in an insulating protection tube is used.
- the sensor should be installed at a location close to the antenna 1 installation potential, preferably within a distance of 50 mm or less from the dielectric (insulator) shield of the antenna 1 ′. Up to the position where it attenuates to 0).
- the physical interpretation and effect of the measured quantity is that the high-frequency magnetic field radiated from the antenna 1 is induced by the high-frequency current flowing through the antenna 1 and mainly has an azimuthal component with respect to the antenna current. Therefore, the following information can be obtained by measuring the high-frequency magnetic field strength and comparing it with the high-frequency current flowing through the antenna 1 (intensity ratio, phase difference). 4 000258
- a) a high-frequency magnetic field B proportional to the current I rf is generated in the azimuthal direction of the current by flowing a high-frequency current I rf through the antenna, and b) the Faraday's induction law.
- the high-frequency magnetic field B which fluctuates at the high-frequency power supply frequency, generates an induction electric field E having a strength proportional to the high-frequency current I rf and the frequency.
- [Faraday's induction law: rot E — ⁇ B / ⁇ t ]: E oc B (e I rf) X frequency, c) It is driven by the acceleration of electrons in the plasma by the induced electric field E.
- the present invention by providing a sensor for directly measuring the high-frequency induction magnetic field intensity radiated from the antenna conductor 1a in the vacuum vessel 6, it is possible to directly measure the high-frequency magnetic field driving the inductive coupling plasma, It is possible to measure the plasma generation state (drive source) itself, not the plasma density or electron temperature that is the result of plasma generation.
- a sensor (magnetic field intensity detector) 30 for measuring a high-frequency magnetic field intensity is provided in a vacuum vessel 6 at a distance from the antenna 1. Is installed at each of two or more different locations (not shown), and measures the antenna current along with the high-frequency magnetic field strength at each location.
- Examples of the sensor 30 include a sensor provided with an insulating protection tube 32 and a loop coil 34 installed in the insulating protection tube 32.
- the above-described sensor 30 may be used for the measurement probe 45 in the plasma state shown in FIG. 4 described above.
- the insulating protective tube 32 includes a dielectric shield (first shield) 32a that covers the loop coil 34 with a gap therebetween, and an adhering material shield (second shield) that covers the outside of the dielectric shield 32a with a gap therebetween.
- the dielectric shield 32a is made of an insulator such as quartz or alumina.
- the sensor 30 is arranged around a portion existing inside the vacuum vessel 6 so as to block direct contact between the plasma and the sensor 30.
- the dielectric shield 32a functions also as an electrostatic shield described later.
- the adhering material shield 32b is designed to prevent the entire surface of the dielectric shield 32a from being covered with the adhering material from the plasma around the dielectric shield 32a, and to form a loop coil. It is arranged to have a structure to avoid shielding of the high-frequency induction magnetic field from 34.
- the loop coil 34 includes a coil conductor 34a and an electrostatic shield 34b covering the coil conductor 34a.
- the influence of electrostatic potential fluctuation of plasma is suppressed by the electrostatic shield 34b. Further details of the sensor 130 will be described later.
- the detecting section 38 can measure the high-frequency magnetic field strength (B) in the loop section 34c by detecting a high-frequency voltage generated in the loop section 34c of the loop coil 34.
- the detection unit 38 may be the measurement circuit 46 described above.
- the electromagnetic wave (frequency f 0 ) radiated from the high-frequency antenna or the like into the plasma is f, with respect to the cutoff frequency f pe determined by the electron density (ne) of the plasma.
- the intensity of the electromagnetic wave attenuates exponentially with the distance r from the boundary surface in contact with the plasma where high-frequency power is supplied to the plasma due to the skin effect, and the skin depth Only about ⁇ ⁇ (the length at which the intensity decays to 1 Z e in the plasma: e is the base of the natural logarithm) can penetrate into the plasma.
- B p is the amplitude of the high-frequency magnetic field strength of the component of the high-frequency magnetic field perpendicular to the antenna 1 on the surface on the razor side at the boundary where the insulator and the plasma come into contact.
- the skin depth ⁇ ⁇ is determined by the type of discharge gas, pressure, frequency of high frequency, electron energy distribution of plasma, and plasma density.
- the type of discharge gas, pressure and high frequency The frequency is known and ultimately depends only on the state of plasma production (electron temperature and plasma density).
- the plasma density There is shown a 1 0 1 1 cm- 3, the calculation results relating to the attenuation characteristics of the high-frequency magnetic field at the electron temperature in an argon plasma 3 electron volts.
- the high-frequency magnetic field strength on the plasma-side surface of the insulator 12 B p is generally reduced by the absorption and shielding of the high-frequency power to the deposit 40, and the high-frequency magnetic field strength of the insulator 12 on the inner surface of the deposit 40.
- I rf the high-frequency magnetic field strength B e (r, t) at the above-mentioned distance r is
- the state of the plasma in the vacuum vessel 6 and the degree of the deposit 40 on the insulator 12 covering the antenna 1 can be detected. Based on the detection results, the above-described high-frequency
- the state of the plasma in the vacuum vessel 6 can be controlled by controlling the driving of each antenna 1 by the oscillation controller 2 using at least one of the electric energy, the frequency, and the phase.
- the high-frequency magnetic field strengths are measured as Be (rl, t) and Be (r2, respectively.
- the shielding ratio 77 d can be obtained as follows by simultaneously measuring the antenna current I rf.
- the position where the high frequency magnetic field sensor 30 is installed is preferably at a distance of 10 mm from the surface of the insulator 12 and at a distance of 70 mm, at two different points, The greater the distance between each other, the higher the accuracy of the above measurements.
- the direction of the loop portion 34c of the sensor 30 may be set so that the high-frequency magnetic field detected by the knock portion 34c is maximized.
- the virtual plane including 4c is set so as to include the minute section of the antenna conductor 1a closest to the loop section 34c.
- the senor 30 is installed at two points in the plasma at different distances from the surface of the insulator 12, but the installation place is not limited to only two points. It is clear that the measurement accuracy is improved by installing the sensors in the above different places.
- the sensor 30 is equipped with an electrostatic shield 34b and a dielectric shield 32a for electrostatic potential fluctuations of the plasma so that the area in contact with the plasma is not completely covered with the deposit 40 from the plasma. Is characterized in that it has a structure in which an attached matter shield 32b is provided outside the dielectric shield 32a.
- the high-frequency magnetic field strength is measured as a voltage Vb generated at both ends of the coil by electromagnetic induction of a time change dB B Z dt of a magnetic flux passing through a coil in which the coil conductor 34 a is connected in a loop.
- the loop coil 34 is used in a process of forming an adhering substance 40 on a surface exposed to plasma by a process such as film formation or etching, and the above-described plasma generation state and the insulator 12 are used.
- the deposit 40 formed on the surface where the loop coil 34 is exposed to the plasma is also used as the measuring point.
- the high-frequency magnetic field strength at the same time is similarly absorbed and shielded, and the measurement accuracy is degraded.
- the above-mentioned disadvantage is solved by adopting at least one of the following components [1] or [3].
- a dielectric shield 32 a made of an insulator is placed around the portion of the coil conductor 34 a for detecting the high-frequency magnetic field strength existing inside the vacuum vessel 6 between the plasma and the coil conductor 34 a. Arrange so as to block contact.
- FIG. 18 (a) shows a cross-sectional structure of the sensor 30, and FIG. 18 (b) shows a perspective view of the sensor 30.
- a semi-rigid cable (coaxial cable) 36 with a characteristic impedance of 50 ⁇ is used.
- the semi-rigid cable 36 uses a copper pipe without coating as the outer conductor, and incorporates a copper wire as the center conductor in the copper pipe via an electrical insulator made of fluororesin or the like. Things.
- one end of a semi-rigid cable 36 is formed into a single loop of 10 mm in diameter (round, square, or triangular) to form the loop coil 34 of the sensor 30.
- the coil conductor 34a which is the center conductor at the tip of the loop, is electrically connected to the outer conductor at the base of the loop.
- the coil conductor 34 a at the loop-shaped distal end is connected to the loop-shaped external conductor at the proximal end, the external conductor at the proximal end and the external conductor at the distal end are electrically connected to each other at the connection.
- a gap of about 1 mm, for example, is provided between the two to prevent contact.
- the loop coil 34 is formed by such a manufacturing method.
- the outer conductor is electrostatically shielded. Effectively acts as 34b, shields against electrostatic potential fluctuations, and makes it possible to measure the strength of the high-frequency magnetic field that penetrates the internal space surrounded by the loop-shaped coil conductor 34a .
- the above-described loop core which is a high-frequency magnetic field strength detector is used.
- a dielectric shield 32 a made of an insulator around a portion of the coil 34 located inside the vacuum vessel 6, it is possible to completely shut off the contact between the plasma and the loop coil 34. It becomes possible. This prevents the internal conductor exposed in the gap provided at the connection portion of the above-mentioned loop coil 34 from coming into contact with the plasma and preventing a signal due to the potential fluctuation of the plasma from being mixed.
- the dielectric shield 32a made of the insulator is used for the dielectric shield 32a made of the insulator, but the insulator material that can be used is a low dielectric material such as alumina or aluminum nitride. It is possible to use a ceramic dielectric material having a high resistivity and a high heat resistance. The thickness is not problematic as long as it can completely shield the plasma, and preferably has a thickness of about 1 mm.
- a structure is provided around the dielectric shield 32a so that the entire surface of the dielectric shield 32a is not covered with the deposits from the plasma and the high-frequency induction magnetic field is not shielded.
- Kimono shield 32b is arranged.
- the reason that the dielectric shield 32a is not completely covered with the adhering substance is that the adhering substance (conductor) on the dielectric shield 32a is generated by an eddy current generated by a high-frequency magnetic field and has a high frequency. This is to prevent the magnetic field from being shielded.
- the attached material shield 32b prevents the dielectric shield 32a from being completely covered by the attached material and prevents the high frequency induction magnetic field from being shielded by the attached material shield 32b.
- the dielectric shield 32a is not completely covered, but is provided with a slit-like gap 32c.
- the gap 32c may be formed so that the high-frequency induction magnetic field reaches the loop coil 34, but a part of the gap 32c in the longitudinal direction is formed by the loop 34c of the loop coil 34. It is preferable to set in parallel to the plane direction formed by being surrounded by.
- the longitudinal direction of the gap 32c is perpendicular to the surface of the inner wall attached to the vacuum vessel 6. It may be formed in the direction crossing the dielectric shield 32a parallel to the inner wall surface.
- the adhered material shield 32b is formed of two members made of aluminum having a thickness of 0.5 mm to form a gap 32c having a width of 1 mm and a dielectric shield. It is formed so as to cover 32a.
- a material used for the deposit shield 32b a material of a ceramic dielectric group can be used in addition to metal.
- a material of the ceramic dielectric group having excellent heat resistance is preferably used.
- the slit width in the gap 32c for preventing the shielding of the high-frequency magnetic field may be about 1 mm.
- the dielectric shield 32 a and the attached matter shield 32 b were arranged, and signals due to a high-frequency magnetic field were measured.
- a radio frequency power of 13.56 MHz is applied to antenna 1 Plasma was generated, and the RF signal strength was measured with a 50 ⁇ oscilloscope connected to the loop coil 34 at a RF power of 506 W, and a sine wave with an amplitude of 23 mV was observed. This indicates that the loop coil 34 can measure a high-frequency induction magnetic field.
- the discharge is pulsed (time for supplying high frequency power). And the time for stopping the supply are provided periodically and exclusively).
- the spatial pattern to which the high-frequency power was supplied could not be freely changed, and the entire plasma source flickered.
- the plasma generated while the high-frequency power is supplied (pulse ON time) is generated while the high-frequency power supply is stopped (pulse OFF time).
- the electron temperature (Fig. 21 (b)) and the plasma potential (Fig. 21 (c)) are accompanied by a sharp decrease in plasma density (Fig. 21 (a)) due to diffusion and recombination to the wall. Decrease.
- the decrease in electron temperature during the pulse OFF time has been used for negative ion generation and the like.
- the decrease in plasma potential has been used as a means of suppressing plasma damage by reducing the time-average plasma potential.
- the plasma potential becomes abnormally higher than the plasma potential in the steady state during the initial time when the pulse ⁇ FF changes to the pulse ON, and the plasma damage occurs.
- the cause of this problem was assumed to be as follows. Because the plasma density decreases during the pulse OFF time, the same high-frequency power as in the steady state is supplied when the pulse changes to ⁇ N, despite the fact that the electron density is lower than in the steady state. The high-frequency power density per electron is higher than in the steady state. As a result, the electrons are heated more than in the steady state, causing an increase in the electron temperature, resulting in an abnormal increase in the plasma potential via the sheath at the wall.
- the above problem is caused by the fact that the ON-OFF operation of the high-frequency power supplied to the plasma source is performed simultaneously over the entire plasma source. This was an inevitable problem with the conventional high frequency power supply type plasma generator.
- a seventh embodiment of the present invention in order to solve the above-mentioned problems, high-frequency power supplied to each load for pulse discharge (plasma damage suppression) in which an abnormal rise in plasma potential is suppressed
- plasma damage suppression in which an abnormal rise in plasma potential is suppressed
- each group is individually pulsed at separate and independent timings, and even when the load of one group is in a panoramic FF state, the load of another group adjacent to it is The timing of the pulse operation is shifted exclusively from each other so that the antenna 1 is in the pulse-on state, so that the electron density near the antenna 1 belonging to the group that turns into the pulse-on state is controlled, and the electron temperature and plasma potential Abnormal rise can be suppressed.
- each of the groups adjacent to each other is prevented from being in the ON state.
- the above-mentioned exclusion may be such that both groups adjacent to each other are in the OFF state.
- the peak values of the electron temperature and the plasma potential immediately after the pulse ON were about 4 eV and 30 V, respectively. This is because, when the plasma density control near the load was not performed by the adjacent load (Figs. 21 (a) to (c)), the plasma potential increased to about 50 V in this embodiment. It can be seen that the example shows a remarkable suppression effect.
- each of the embodiments is described independently. However, any of these embodiments may be combined in any way, and the effects are obtained in each combination. It is clear that this will be done. Further, in the first to seventh embodiments of the above embodiments, members having the same functions as those described in any one of the embodiments are assigned the same member numbers in other embodiments, and Description omitted.
- the conventional plasma process technology includes (1) a cleaning step for removing impurities from a processing substrate, (2) an assing step for removing a resist, (3) a thin film forming step that requires nanostructure control, and ( 4) Used in various processes such as an etching process for applying microfabrication to the surface.
- the plasma generator and the plasma process of the present invention are provided with a plurality of low-inductance antennas 1 and actively drive and control them independently of each other, as shown in FIG.
- the plasma source By controlling the plasma source, the area of the plasma source is increased, the density of the plasma source is increased, and the potential is reduced, while the problems of low plasma damage and standing waves can be avoided.
- a high-frequency power supply for supplying power to the load corresponds. It is characterized by being installed near each load.
- each high-frequency power supply includes a high-frequency power amplifier close to a corresponding load.
- the frequency modulation control section for controlling the frequency of the high-frequency current supplied to each load is independent of each high-frequency power supply attached to each load, and one type.
- the high-frequency currents of the above frequencies are supplied to two or more loads simultaneously, and the impedance of each load is adjusted by frequency modulation of the high-frequency current supplied to each load. You may.
- a phase modulation control unit for controlling the phase of each current is independently supplied by each high-frequency power supply attached to each load, and high-frequency currents of the same phase or different phases are simultaneously supplied to two or more loads. It may be provided as follows.
- the power control unit for controlling the high-frequency power supplied to each load is independently controlled by each power supply corresponding to each load, and one or more types of high-frequency power are supplied to each load. It may be provided so that it is supplied to one or more loads at the same time.
- a plasma generator includes: a high-frequency power supply device according to any one of the above; and a vacuum vessel in which a load of the high-frequency power supply device is attached so as to generate plasma by applying high-frequency power. It is characterized by having.
- the above-described plasma generator may include a measuring unit for measuring a high-frequency current, a high-frequency voltage, a phase supplied to each load, and a plasma generation state near the load.
- the plasma generator includes a negative feedback circuit that generates a control signal from a signal of high-frequency power flowing through each load, and a control system that supplies high-frequency power by self-oscillation based on the control signal. Is also good.
- a negative feedback circuit that generates a control signal from a signal of high-frequency power flowing through each load, and a control system that supplies high-frequency power by self-oscillation based on the control signal. Is also good.
- two or more loads are mounted adjacent to each other, and the phases and frequencies of the high-frequency current supplied to the adjacent loads are set independently, and the loads are generated at the adjacent loads. It is preferable to provide a plasma controller for controlling the effective acceleration potential of electrons in the plasma by the high-frequency electric field generated.
- high frequency current of high frequency power feeds successive measurements of the state of the plasma (eg, plasma density) near the phase and load, and independently and actively supplies high-frequency power to two or more loads by either phase modulation, frequency modulation, or amplitude modulation.
- a control system is provided to control the impedance matching for each load by controlling the load, and to control the uniformity and reproducibility of the plasma in the vacuum vessel, and a monitor to show the plasma state is provided. It is desirable that
- a single high-frequency power supply is independently provided near each corresponding load for each antenna and the like, and each load is provided with:
- the high-frequency power supply device and the plasma generation device provide a high-frequency power supply to each load.
- measurement and monitoring of the high-frequency current, high-frequency voltage, phase applied to each load and the plasma state near the antenna conductor enable feedback control of the measurement signal.
- a control system for controlling the uniformity and reproducibility of the plasma can be provided, so that the thin film formation by the plasma and the plasma ion implantation can be further stabilized.
- another plasma generator according to the present invention is provided with a vacuum vessel for generating plasma, and has at least an antenna conductor for generating an induced electric field when high-frequency power is applied in the vacuum vessel.
- One is installed around the portion of the antenna conductor present inside the vacuum vessel, with the first insulator s, separated by the first spatial region so as to cut off the contact between the plasma and the antenna conductor. It is characterized by
- a second insulator is disposed around the first insulator with a second space region therebetween.
- the arrangement of the second insulator further increases the area of the sheath portion.
- the high frequency voltage applied to the region can be effectively reduced.
- a ground electrode surrounding the periphery of the first insulator is provided at an antenna introduction portion of the antenna conductor close to an inner wall of the vacuum vessel, and the ground electrode is provided around the ground electrode. It is desirable that the two insulators are arranged so as to suppress the contact between the plasma and the ground electrode. In the above configuration, by providing the ground electrode, it is possible to block a high frequency voltage generated at the end of the antenna conductor from being applied to the region of the plasma sheath.
- the ground electrode preferably has a zigzag structure that alternately protrudes in a direction orthogonal to the direction of conduction of the antenna conductor along the direction of conduction.
- the ground electrode in a zigzag structure, it is possible to effectively cut off the electrostatic coupling due to the high-frequency voltage generated in the antenna introduction portion, and to extend the current path for the induced electric field in the ground electrode. In addition, it is possible to suppress heat generation induced by the ground electrode and reduce power loss.
- a sensor for measuring the intensity of a high-frequency induction magnetic field radiated from an antenna conductor as a load may be provided in the vacuum vessel.
- a plurality of sensors may be provided at positions different in distance from the antenna conductor.
- the plasma generator has a plasma control unit that calculates a plasma state in the vacuum vessel from each measurement result from each sensor and a high-frequency current value flowing through the antenna conductor, and controls driving of the antenna conductor. May be I
- the senor may include a magnetic field strength detection unit and a first shield that covers the magnetic field strength detection unit.
- the senor may further include a second shield that suppresses the formation of deposits on the first shield and that prevents a high-frequency induction magnetic field from being interrupted to the magnetic field strength detection unit.
- the second shield preferably has a slit part in order to avoid interruption of the high-frequency induction magnetic field to the magnetic field strength detection part.
- the high-frequency magnetic field radiated from the antenna conductor is induced by the high-frequency current flowing through the antenna conductor, and mainly has an azimuthal component with respect to the antenna current. Therefore, by measuring this high-frequency magnetic field strength and comparing it with the high-frequency current flowing through the antenna conductor (intensity ratio, phase difference), the high-frequency magnetic field strength driving the inductively coupled discharge in the plasma can be calculated. Can be measured directly.
- the above measurement corresponds to directly monitoring the driving source in the plasma generation, and if the feedback control is performed so that the measured amount is constant when generating the plasma, the plasma generation state It is possible to keep the state more constant.
- a power supply control unit for controlling each high-frequency power supply so as to change the spatial distribution pattern of each plasma generated based on the pulse-like high-frequency power supplied to each load is provided. You may be angry.
- the above-mentioned power supply control part is a space component of each plasma.
- the cloth pattern may be changed periodically.
- the power control unit may change a spatial distribution pattern of each plasma independently of each other.
- a sensor for measuring the intensity of a high-frequency induced magnetic field radiated from a load may be provided in the vacuum vessel.
- the high-frequency power supply device and the plasma generator according to the present invention eliminate the need to supply a high-frequency current to each load in parallel or in series, so that the variation of the high-frequency voltage generated in each load can be reduced.
- the above configuration can generate a more uniform plasma even if the diameter or volume of the plasma generation section is increased, stabilize the thin film formation by the above plasma, and stabilize the plasma ion implantation. It can be suitably used for forming thin films for semiconductors such as silicon.
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- Drying Of Semiconductors (AREA)
Abstract
Description
Claims
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EP04702413.8A EP1589793B1 (en) | 2003-01-16 | 2004-01-15 | Plasma generation device |
US10/542,289 US7567037B2 (en) | 2003-01-16 | 2004-01-15 | High frequency power supply device and plasma generator |
JP2005508013A JP4451392B2 (ja) | 2003-01-16 | 2004-01-15 | プラズマ発生装置 |
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JP2003008648 | 2003-01-16 | ||
JP2003-008648 | 2003-01-16 |
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WO2004064460A1 true WO2004064460A1 (ja) | 2004-07-29 |
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PCT/JP2004/000258 WO2004064460A1 (ja) | 2003-01-16 | 2004-01-15 | 高周波電力供給装置およびプラズマ発生装置 |
Country Status (6)
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US (1) | US7567037B2 (ja) |
EP (2) | EP2565903B1 (ja) |
JP (2) | JP4451392B2 (ja) |
KR (1) | KR100783983B1 (ja) |
TW (1) | TWI266361B (ja) |
WO (1) | WO2004064460A1 (ja) |
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TW200425285A (en) | 2004-11-16 |
EP2565903A3 (en) | 2013-07-10 |
EP1589793B1 (en) | 2014-06-04 |
US7567037B2 (en) | 2009-07-28 |
JP2010157511A (ja) | 2010-07-15 |
EP2565903A2 (en) | 2013-03-06 |
JPWO2004064460A1 (ja) | 2006-05-18 |
JP4451392B2 (ja) | 2010-04-14 |
EP1589793A1 (en) | 2005-10-26 |
KR100783983B1 (ko) | 2007-12-11 |
EP1589793A4 (en) | 2009-12-02 |
US20060057854A1 (en) | 2006-03-16 |
KR20060008280A (ko) | 2006-01-26 |
EP2565903B1 (en) | 2014-09-10 |
TWI266361B (en) | 2006-11-11 |
JP4852140B2 (ja) | 2012-01-11 |
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