WO2004059710A1 - 収差計測方法、露光方法及び露光装置 - Google Patents
収差計測方法、露光方法及び露光装置 Download PDFInfo
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- WO2004059710A1 WO2004059710A1 PCT/JP2003/016259 JP0316259W WO2004059710A1 WO 2004059710 A1 WO2004059710 A1 WO 2004059710A1 JP 0316259 W JP0316259 W JP 0316259W WO 2004059710 A1 WO2004059710 A1 WO 2004059710A1
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- aberration
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- optical system
- projection optical
- pattern
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
- G01M11/0257—Testing optical properties by measuring geometrical properties or aberrations by analyzing the image formed by the object to be tested
- G01M11/0264—Testing optical properties by measuring geometrical properties or aberrations by analyzing the image formed by the object to be tested by using targets or reference patterns
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0207—Details of measuring devices
- G01M11/0214—Details of devices holding the object to be tested
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
- G03F7/706—Aberration measurement
Definitions
- the present invention relates to an aberration measurement method, an exposure method, and an exposure apparatus, and more particularly, to an aberration measurement method for measuring aberration of a projection optical system, an exposure method including the aberration measurement method, and measuring an aberration of the projection optical system.
- the present invention relates to a suitable exposure apparatus. Background art
- a pattern of a photomask or a reticle (hereinafter, collectively referred to as an “r reticle”) is formed on a surface through a projection optical system.
- a projection exposure apparatus that transfers onto a substrate such as a wafer or a glass plate coated with a photosensitive agent such as a photoresist, for example, a step-and-repeat reduction projection exposure apparatus (so-called stepper), 'A scanning type projection exposure apparatus (a so-called scanning stepper) or the like is used.
- a reticle on which the circuit patterns are drawn is used in a projection exposure apparatus for transferring the above-described patterns.
- the pattern can be transferred while being accurately superimposed on the pattern already formed in each shot area on the substrate.
- the imaging characteristics of a projection optical system it is first necessary to accurately measure the imaging characteristics.
- a method of measuring the imaging characteristics exposure is performed using a measurement mask on which a predetermined pattern is formed, and a projected image of the pattern is transferred and formed.
- the method of calculating the imaging characteristics based on the measurement result of the resist image obtained by developing the obtained substrate (hereinafter, referred to as “printing method”) is mainly used.
- the measurement mark of the measurement mask is illuminated with the illumination light, and the aerial image (projection image) of the measurement pattern formed by projection by the projection optical system is measured.
- a method of calculating the imaging characteristics of the projection optical system based on the measurement results (hereinafter referred to as “aerial image measurement method”) has also been performed.
- the measurement of such an aerial image and the calculation of the imaging characteristics of the projection optical system based on the aerial image are disclosed in, for example, Japanese Patent Application Laid-Open No. H10-170399.
- the image intensity of each diffraction grating obtained through the projection optical system is measured at a plurality of focus positions of the projection optical system, and based on the result, the wavefront of the projection optical system is measured.
- a method for obtaining aberration is disclosed (see, for example, Japanese Patent Application Laid-Open No. 2000-57373 and US Patent Nos. 6,360,012 corresponding thereto).
- the present invention has been made under such circumstances, and a first object of the present invention is to provide an aberration measurement method that can accurately measure aberration of a projection optical system in a short time.
- a second object of the present invention is to provide an exposure method that can transfer a pattern of a mask onto a substrate with high accuracy.
- a third object of the present invention is to provide an exposure apparatus capable of transferring a mask pattern onto a substrate with high accuracy. Disclosure of the invention
- an aberration measuring method for measuring aberration of a projection optical system, wherein at least one measurement mark including a periodic pattern is located within an effective field of view of the projection optical system. Illuminating the measurement mark with illumination light, forming a spatial image of the measurement mark with the projection optical system, and forming the spatial image at a position near an image plane in the optical axis direction of the projection optical system.
- a radial polynomial obtained by expanding an aberration function indicating a wavefront aberration on an exit pupil of the projection optical system based on a magnitude of a spatial frequency component of a predetermined order included in the light intensity signal. Movement of each term Calculating the amount of aberration of the even-function aberration whose radial function is represented by an even function.
- an aberration function (Wp, ⁇ ) representing the wavefront aberration on the exit pupil of the projection optical system is used.
- W is expressed in a polar coordinate format
- p is a normalized pupil position in the radial direction of the exit pupil of the projection optical system
- 0 is an angle.
- W can be expanded into a series using a complete orthogonal system radial polynomial in which the radius and the variable of angle 0 are separated, for example, the Fringe Zernike polynomial shown in the following equation (1). It is possible.
- W (p, 0) ⁇ Zi-fi (p, 0) (1)
- Zi is a coefficient representing the magnitude of various aberrations of the projection optical system.
- Table 1 below is an example of fi in items 1 to 37. (table 1 ) ⁇ 4 -42 ⁇ 2 +1
- fi ( ⁇ , ⁇ ) of each term of the radial polynomial is expressed in a form where the variables of the radial ( ⁇ ) and the angle (S) are separated. You. Of these, the part represented by the radial (yo) is called the radial function.
- each term of the radial polynomial can be classified into an odd function and an even function.
- f 7 and f 8 information about shown in Table 1 the radial function both 3 p 3 - in 2 p, is an odd function, f 5 and f 6, the radial function is both , Which is an even function.
- m of the angular component m0 (where m is 0 or a natural number) is odd
- the radial function becomes an odd function
- if m is 0 or even the dynamic function becomes The radial function becomes an even function.
- the aberration whose radial function is represented by an odd function is called an odd function aberration
- the aberration represented by an even function is called an even function aberration.
- a projection optical system that projects an aerial image of a pattern on an object plane onto an image plane condenses a plurality of diffracted lights emitted from the pattern on the object plane onto the image plane, and An image of the pattern is formed on the image plane.
- the positions of the diffracted light passing through the projection pupil of the projection optical system are different from each other.
- the imaging state of each diffracted light is affected by the aberration.
- the imaging positions of the respective diffracted lights are shifted in the optical axis direction of the projection optical system.
- any position in the optical axis direction is a position deviated from the optimum imaging position for any of the following diffracted lights.
- the magnitude of the spatial frequency component included in the light intensity distribution due to the diffracted light is larger than the magnitude of the spatial frequency component at the optimal imaging position. Become smaller.
- the inventor has determined that the amount of aberration of even function aberration, which is one of the imaging characteristics of the projection optical system, and the magnitude of the spatial frequency component of a predetermined order included in the light intensity distribution corresponding to the spatial image of the pattern have a predetermined value. I found that they were in a relationship. In the present invention, using this relationship, a light intensity signal corresponding to the measurement mark including the periodic pattern is obtained, and the magnitude of the spatial frequency component of a predetermined order included in the light intensity signal is measured. The amount of even function aberration of the projection optical system is calculated based on the magnitude. In this way, the light intensity signal (light intensity distribution) corresponding to the aerial image of one periodic pattern can be measured only once to measure the amount of even-function aberration. The functional aberration can be determined.
- the relationship between the amount of aberration of the even function aberration and the magnitude of the spatial frequency component of a predetermined order included in the light intensity distribution corresponding to the spatial image of the pattern is determined on the assumption that the partial coherent illumination system is used. Therefore, according to the present invention, even function aberrations can be accurately measured even if the coherence factor of the illumination system is large.
- the aerial image measurement and the calculation of the aberration amount of the even function aberration are performed.
- the method further includes the step of executing again, and determining the polarity of the even function aberration based on a comparison result between the currently calculated even function aberration amount and the previously calculated even function aberration amount.
- the magnitude of the spatial frequency component of the predetermined order included in the light intensity signal measured by the aerial image measurement changes substantially in a cosine function with respect to the aberration amount of the even function aberration.
- the magnitude of the aberration amount of the even function aberration can be obtained by executing the aerial image measurement and the even function aberration calculation only once, but up to the polarity of the amount of the aberration. I can't ask. Therefore, in the present invention, the polarities of the aberration amounts are temporarily determined, the imaging characteristics of the projection optical system are adjusted, and after the adjustment, the aerial image measurement and the even-function aberration calculation are performed again to execute the even-function aberration. The amount of aberration is obtained, and the amount of aberration is compared with the amount of aberration of the previous time to determine the polarity of the amount of aberration of the even function aberration.
- the polarity J of the aberration amount of the even function aberration refers to the direction of the aberration with respect to the optical axis direction of the projection optical system.
- the first aberration measurement method of the present invention in the position having a predetermined offset from a position in the optical axis direction of the projection optical system where the magnitude of the spatial frequency component of the predetermined order is maximum, Image measurement is performed, and a characteristic of a change in the magnitude of the spatial frequency component of the predetermined order with respect to a change in the aberration amount of the even function aberration at the position having the predetermined offset is obtained.
- the polarity of the aberration amount of the aberration can be determined.
- the spatial frequency component of a predetermined order included in the light intensity signal is focused on, and the position in the optical axis direction of the projection optical system where the magnitude of the spatial frequency component is maximum is obtained by, for example, simulation. .
- the position in the optical axis direction for scanning the predetermined measurement pattern is set to a position having a predetermined offset from the position where the magnitude of the spatial frequency component is maximum, and then the aerial image measurement is performed.
- aerial image measurement is performed while adjusting the imaging characteristics of the projection optical system to change the amount of aberration of the even function aberration, and the spatial circumference is changed with respect to the change of the amount of aberration of the even function aberration.
- the characteristic of the change in the magnitude of the wave number component is obtained. From this characteristic, the polarity of the aberration amount of the even function aberration can be easily obtained.
- the predetermined offset an offset determined based on characteristics of the projection optical system calculated by a simulation using a mathematical model of the projection optical system can be used.
- the predetermined offset can be determined such that the magnitude of the spatial frequency component of the predetermined order is substantially zero.
- an aberration measuring method for measuring aberration of a projection optical system, wherein at least one measurement mark including a periodic pattern is located within an effective field of view of the projection optical system. Illuminating the measurement mark with illumination light, forming a spatial image of the measurement mark by the projection optical system, and positioning the spatial image at a position near an image plane in the optical axis direction of the projection optical system.
- the present inventor has calculated the aberration amount of the even function aberration included in the imaging characteristics of the projection optical system and It has been determined that the positional deviation is in a predetermined relationship.
- light intensity signals corresponding to the measurement mark including the periodic pattern are obtained at a plurality of positions in the optical axis direction of the projection optical system, and the basic frequency included in the light intensity signal is obtained.
- the displacement of the position where the magnitude of the wave number component is the maximum and the position where the magnitude of the spatial frequency component of the predetermined order is the maximum in the direction of the optical axis are measured, and the projection optical system is determined based on the measured displacement.
- the aberration amount of the even-function aberration is calculated.
- even function error can be measured only by measuring the light intensity signal corresponding to the aerial image of one periodic pattern, so that it can be accurately performed in a short time regardless of the manufacturing error of the periodic pattern.
- Even function aberrations can be determined.
- not only pattern manufacturing errors, but also errors due to the fluctuation of the focus sensor that detects the focus position, which is one of the even-function aberrations, are canceled out because multiple frequency components are measured at the same time. The even function aberration can be obtained well.
- the aerial image is executed for a plurality of measurement marks having different periods of a periodic pattern, and in calculating the aberration amount, a fundamental frequency component included in the light intensity signal obtained for each measurement mark is calculated. Based on the positional deviation between the position where the magnitude is maximum and the position where the magnitude of the harmonic component is maximum, and the sensitivity of a plurality of even function aberrations corresponding to the change in the positional deviation in each of the measurement marks.
- the aberration amount of each of the plurality of even-function aberrations may be calculated.
- even-function aberrations include low-order and high-order spherical aberrations, and it may be necessary to separate low-order and high-order spherical aberrations.
- each even function aberration For example, it is possible to extract a low-order spherical aberration component and a high-order spherical aberration component.
- a difference amount of each of the plurality of even-function aberrations is calculated using a least squares method. be able to.
- the predetermined order may be an odd number.
- the position of the position where the magnitude of the fundamental frequency component is maximum and the position where the magnitude of the even-order harmonic component, for example, the second-order harmonic component is maximum are determined based on the displacement. It is also possible to obtain the amount of aberration of even function aberration by using, but especially when the periodic pattern of the measurement mark is a pattern whose duty is 50% and its image intensity changes to a rectangular shape. The intensity of the even-order diffracted light is almost zero. Therefore, using odd-order harmonic components is less susceptible to manufacturing errors in periodic patterns and input / output characteristics of measuring instruments that measure aerial images. In such a case, the even-order harmonic components included in the aerial image are beat components of the multiple-order spatial frequency components. For example, the fifth-order harmonic component and the seventh-order harmonic component are included. Its size changes depending on the presence or absence, and becomes unstable. Therefore, the use of odd-order harmonic components can often calculate the amount of aberration of even-function aberration with higher accuracy.
- the even function aberration can be a spherical aberration.
- the measurement pattern may be a pinhole pattern.
- an aberration measuring method for measuring aberration of a projection optical system.
- a measurement mark in which a plurality of periodic patterns having different periods are arranged in parallel in a direction perpendicular to the periodic direction, in a state where the measurement mark is positioned in the effective visual field of the projection optical system, and A measurement having a length in the vertical direction that is equal to or longer than the length of the aerial image in the vertical direction with respect to the aerial image of the measurement mark formed through the projection optical system by illuminating the measurement mark.
- Aerial image measurement that obtains a light intensity signal corresponding to the aerial image by photoelectrically detecting the illumination light obtained through the measurement pattern while relatively scanning the measurement pattern. Performing at least one position in the direction of the optical axis; based on at least one of the phase and magnitude of the spatial frequency component corresponding to each of the periodic patterns included in the light intensity signal. Calculating the amount of aberration of the projection optical system.
- the length of the measurement pattern to be scanned with respect to the aerial image of the measurement mark including a plurality of periodic patterns arranged in parallel and having different periods is measured in a direction perpendicular to the periodic direction of the periodic pattern. It is longer than the length of the aerial image of the mark. Therefore, if this measurement pattern is used, it is possible to obtain the light intensity signal of the illumination light through all the periodic patterns in one scan. Therefore, the time required for measuring the aberration of the projection optical system can be reduced.
- the ratio of the maximum period to the minimum period may be three times or less. In such a case, the third harmonic component corresponding to the maximum periodic pattern and the fundamental frequency component corresponding to the minimum periodic pattern coexist, and the accuracy of the aberration measurement of the projection optical system decreases. Can be prevented.
- the projection optical system in calculating the aberration amount, may be configured based on a phase difference between spatial frequency components corresponding to the periodic patterns included in the light intensity signal.
- An odd function aberration in which the radial function of each term of the radial polynomial obtained by expanding the aberration function indicating the wavefront aberration on the exit pupil is represented by an odd function Can be calculated.
- the diffraction angles of the diffracted light generated by the pattern are different from each other, and the passing positions of the diffracted light on the exit pupil are different for each periodic pattern. Therefore, the phase of the spatial frequency component corresponding to each periodic pattern is shifted (lateral shift). Therefore, by measuring the phase difference between the spatial frequency components respectively corresponding to the respective periodic patterns included in the measured light intensity signal, the aberration amount of the odd function aberration of the projection optical system can be obtained.
- the amount of each of the plurality of odd function aberrations can be calculated. In such a case, it is possible to separate the odd function aberrations based on the sensitivity of the plurality of odd function aberrations to the changes in the plurality of phase differences.
- the aberration amounts of the plurality of odd function aberrations can be obtained using a least squares method.
- the plurality of periodic patterns include a first periodic pattern having a basic period and at least a pair of second periods having a predetermined period different from the basic period. And a pair of the second periodic patterns are disposed so that the phase difference in the periodic direction between them is substantially zero with the first periodic pattern interposed therebetween. Can be.
- a pair of second periodic patterns having the same period are arranged so as to sandwich the first periodic pattern having the basic period so that the phase difference between them in the periodic direction is substantially zero.
- the rotation error which is the error between the periodic direction of the periodic pattern and the scanning direction of the measurement pattern. Cancel, Odd function aberrations can be accurately measured.
- the aerial image measurement is performed for each of a plurality of positions in an optical axis direction of the projection optical system, and among the plurality of periodic patterns included in the light intensity signal,
- the radial radius of each term of the radial polynomial obtained by developing an aberration function indicating the wavefront aberration on the exit pupil of the projection optical system based on the displacement of the projection optical system in the optical axis direction with respect to It is possible to calculate the aberration amount of the even function aberration whose function is represented by an even function.
- the diffraction angles of the diffracted light are different from each other, and therefore, the passing positions of the diffracted light on the exit pupil are different for each periodic pattern. Therefore, the image formation position of each order diffracted light is shifted in the optical axis direction of the projection optical system depending on each periodic pattern. That is, the position of the projection optical system in the optical axis direction where the magnitude of the spatial frequency component becomes maximum is shifted depending on the periodic pattern. Therefore, by measuring the magnitude of the positional deviation between the periodic patterns, the amount of aberration of the even function aberration can be obtained.
- the displacement between the position where the magnitude of the fundamental frequency component included in the light intensity signal obtained for each of the periodic patterns is maximum and the position where the magnitude of the odd-order harmonic component is maximum is The amount of aberration of each of the plurality of even function aberrations can be calculated based on the sensitivity of the plurality of even function aberrations corresponding to the change in the position shift in each of the periodic patterns.
- a system of linear equations is created based on the sensitivity of the periodic pattern to a change in the period with respect to the change in the period, for example, based on the sensitivity. Can be separated into a plurality of even-function aberration components.
- the position shift in each of the periodic patterns and the plurality of Based on the sensitivity of the even function aberration it is possible to calculate the aberration amount of each of the plurality of even function aberrations by using the least square method.
- the radial polynomial may be a fringe I-runike polynomial, and the measurement pattern may be a slit pattern. it can.
- an aberration measuring method for measuring an aberration of a projection optical system, wherein a plurality of periodic patterns having different line widths are arranged in an effective field of view of the projection optical system. Illuminating the measurement mark with illumination light and forming a spatial image of the measurement mark by the projection optical system while at least one measurement mark arranged to be mixed in the direction is positioned; A predetermined measurement pattern is relatively scanned with respect to the aerial image at a position near an image plane in the optical axis direction of the projection optical system, and the scanning is performed via the measurement pattern during the scanning.
- the measurement mark since the measurement mark includes a plurality of periodic patterns having different line widths, a large spatial frequency component corresponding to each periodic pattern is included in the aerial image. As a result, the magnitude of those components, which are indicators of the amount of aberration of the projection optical system, becomes large, so that the SZN ratio of the measured value of the amount of aberration to be obtained can be improved, and the amount of aberration can be accurately determined. You will be able to measure. In addition, since it becomes possible to equalize the magnitudes of a plurality of spatial frequency components to be measured, it is possible to reduce the influence of nonlinearity of a detection device for measuring a light intensity signal. In addition, it becomes possible to measure the amount of aberration with high accuracy.
- each of the periodic patterns has the same
- the patterns may have different ratios.
- the line width of each of the periodic patterns may be a natural number of the period.
- the harmonic component corresponding to the first periodic pattern and the fundamental frequency component corresponding to the second periodic pattern almost completely coincide with each other in the periodic direction.
- Higher harmonic components corresponding to the periodic pattern are emphasized. Therefore, the SZN ratio of the harmonic component can be improved, and as a result, the aberration of the projection optical system can be detected with high accuracy.
- Simultaneous measurement of the fundamental wave and the harmonic wave is advantageous because the fluctuation of the interferometer for measuring the position of the measurement pattern can be offset. It is particularly useful when a plurality of patterns cannot be juxtaposed, such as a pinhole pattern for a measurement pattern.
- the portion corresponding to the portion where the polarity of the (m + 1) / 2-order spatial frequency component included in the light intensity signal obtained when the aerial image measurement is performed using the measurement mark is the second The light shielding part of the periodic pattern is formed Can be done.
- the measurement pattern may include a plurality of slit patterns whose longitudinal directions cross each other.
- a pinhole pattern may be further included as the measurement pattern.
- a slit pattern may be selected as a measurement pattern to reduce the measurement time, and a pinhole pattern may be used to improve the measurement accuracy of the aberration of the projection optical system. It is only necessary to select a measurement pattern and use a plurality of measurement marks whose periodic directions intersect each other to measure the difference of the projection optical system for each measurement mark. That is, in the present invention, it is possible to execute appropriate measurement according to the required measurement time and measurement accuracy.
- the slit pattern and the pinhole pattern when scanning the slit pattern relative to the aerial image, the pinhole pattern does not interfere with the aerial image, Further, when the pinhole pattern is relatively scanned with respect to the aerial image, the slit pattern may be arranged so as to have a positional relationship that does not interfere with the aerial image. it can.
- an aberration measuring method for measuring an aberration of a projection optical system, wherein at least one of the aberration measurement methods includes a periodic pattern in an effective visual field of the projection optical system. Illuminating the measurement mark with illumination light in a state where the two measurement marks are located, forming a spatial image of the measurement mark by the projection optical system, A predetermined measurement pattern is relatively scanned with respect to the aerial image at a position, and the illumination light obtained through the measurement pattern is photoelectrically detected during the scanning, and a light intensity signal corresponding to the aerial image is obtained.
- the measurement pattern since it is not necessary to position the measurement pattern at a plurality of positions in the optical axis direction of the projection optical system, for example, fluctuation or non-linearity of a detector (for example, a focus sensor) for performing the positioning is required.
- the aberration measurement can be performed with high accuracy and in a short time without being affected by the measurement accuracy.
- the aerial image measurement is performed on a plurality of the measurement marks having different periods of the periodic pattern, and when the aberration amount is calculated, the measurement is performed for each of the measurement marks.
- the amount of change in the position where the magnitude of the predetermined frequency component included in the light intensity signal is maximized when the first aberration is changed by a predetermined amount, and a plurality of second aberrations in each of the measurement marks The amount of aberration of each of the plurality of second aberrations may be calculated based on the rate of change of the position where the magnitude of the predetermined frequency component in the first aberration conversion with respect to each change is maximized.
- the aerial image measurement is performed under a plurality of optical conditions, and the second aberration is obtained for each of the optical conditions when calculating the aberration amount.
- Predetermined amount of aberration of 1 The amount of change in the position where the magnitude of the predetermined frequency component included in the light intensity signal is maximum when the light intensity signal is changed, and the first amount with respect to the change of each of the plurality of second aberrations under each of the optical conditions.
- the predetermined frequency component of aberration conversion The amount of aberration of each of the plurality of second aberrations may be calculated based on the rate of change of the position where the size of the minute is maximum.
- the first aberration and the second aberration are both obtained by developing an aberration function indicating a wavefront aberration on an exit pupil of the projection optical system.
- the radial function of each term of the radial polynomial may be an even function aberration represented by an even function, and the first aberration may be a lower order term than the second aberration. it can. In such a case, higher-order even-function aberrations can be measured with high accuracy and in a short time.
- the amplitude of a spatial frequency component included in the light intensity signal may be used as an evaluation amount of the magnitude, or the light intensity signal may be The contrast of the included spatial frequency component may be used as the evaluation amount of the magnitude.
- the contrast is obtained by dividing the amplitude of the spatial frequency component by the DC component included in the light intensity signal.
- the width of the measurement pattern in the relative scanning direction may be equal to or smaller than the width of the aerial image.
- an exposure method for transferring a pattern of a mask onto a photosensitive object via a projection optical system comprising any one of the first to fifth aberration measuring methods of the present invention. Measuring the aberration of the projection optical system; adjusting the imaging characteristics of the projection optical system based on the measured aberration; and adjusting the projection optical system via the adjusted projection optical system. Transferring the pattern onto the photosensitive object.
- the aberration of the projection optical system can be accurately corrected by the aberration measurement method of the present invention.
- the imaging properties of the projection optical system can be adjusted based on the measured aberrations. Therefore, the mask can be adjusted via the projection optical system whose imaging properties have been adjusted to an appropriate state. Can be accurately transferred to a photosensitive object.
- an exposure apparatus for transferring a mask pattern onto a photosensitive object via a projection optical system wherein the mark forming member has at least one measurement mark including a periodic pattern formed thereon.
- An illumination unit for illuminating the mark forming member with illumination light; and an optical axis direction of the projection optical system with respect to a spatial image of the measurement mark formed via the projection optical system by illumination by the illumination unit.
- a predetermined measurement pattern is relatively scanned at a position near the image plane with respect to the illumination light obtained through the predetermined measurement pattern during the scanning, and light corresponding to the aerial image is detected.
- An aerial image measurement device for obtaining an intensity signal; and a wavefront aberration on an exit pupil of the projection optical system based on a magnitude of a spatial frequency component of a predetermined order included in the light intensity signal.
- the even function aberration of the projection optical system is accurately calculated by the processing device based on the magnitude of the predetermined order and the fundamental frequency component included in the light intensity signal measured by the aerial image measurement device.
- the adjusting device adjusts the imaging characteristic of the projection optical system, and adjusts the imaging characteristic to an appropriate state. Therefore, the mask pattern can be accurately transferred onto the photosensitive object via the projection optical system whose imaging characteristics have been adjusted.
- an exposure apparatus for transferring a mask pattern onto a photosensitive object via a projection optical system, wherein the mark forming member has at least one measurement mark including a periodic pattern formed thereon.
- An illumination unit for illuminating the mark forming member with illumination light; and projecting the illumination by the illumination unit.
- a predetermined measurement pattern is relatively scanned at a position near the image plane in the optical axis direction of the projection optical system with respect to the aerial image of the measurement mark formed via an optical system.
- the projection optics of the position where the magnitude of the fundamental frequency component is the largest and the position where the magnitude of the spatial frequency component of the predetermined order is the largest are obtained.
- the even function aberration of the projection optical system is accurately calculated by the processing device based on the displacement of the system in the optical axis direction.
- the adjusting device adjusts the imaging characteristic of the projection optical system, and adjusts the imaging characteristic to an appropriate state. Therefore, it is possible to transfer the pattern of the mask onto the photosensitive object with high precision via the projection optical system in which the imaging characteristics are adjusted.
- an exposure apparatus for transferring a mask pattern onto a photosensitive object via a projection optical system, wherein a plurality of periodic patterns having different periods are arranged in a direction perpendicular to the period direction.
- the optical axis direction of the projection optical system with respect to the formed spatial image of the measurement mark At a position near the image plane with respect to the direction, the measurement pattern having a length in the vertical direction that is equal to or longer than the length of the aerial image in the vertical direction is relatively scanned, and during the scanning, the measurement pattern is scanned.
- An aerial image measurement device that photoelectrically detects the illumination light obtained through the light source and obtains a light intensity signal corresponding to the aerial image; and an odd-order space corresponding to the period of each of the periodic patterns included in the light intensity signal.
- a processing device that calculates an aberration amount of the projection optical system based on at least one of a phase difference and a magnitude of a frequency component; and adjusts an imaging characteristic of the projection optical system based on the measured aberration amount.
- a third exposure device comprising: an adjusting device.
- the length of the measurement pattern is equal to or more than the length in the vertical direction of the aerial image of the measurement mark in which a plurality of periodic patterns having different periods are arranged in parallel in the direction perpendicular to the periodic direction. Therefore, if this measurement pattern is used, the light intensity signal of the illumination light through all the periodic patterns can be obtained by one scan.
- the processing device can measure the aberration of the projection optical system by a single aerial image measurement by the aerial image measurement device, thereby reducing the time required for measuring the aberration of the projection optical system.
- the present invention is an exposure apparatus for transferring a mask pattern onto a photosensitive object via a projection optical system, wherein a plurality of periodic patterns having different line widths are arranged in the periodic direction.
- a predetermined measurement pattern is relatively scanned at a position near an image plane in the optical axis direction of the projection optical system with respect to the aerial image of the measurement mark formed through the scanning optical system.
- a spatial image measurement device that photoelectrically detects the illumination light obtained through a predetermined measurement pattern and obtains a light intensity signal corresponding to the aerial image; and the periodic patterns included in the light intensity signal.
- a processing unit for calculating the aberration amount of the projection optical system To Based on least one also the phase and magnitude of the spatial frequency component, a processing unit for calculating the aberration amount of the projection optical system; the calculation A fourth exposure device comprising: an adjustment device that adjusts an imaging characteristic of the projection optical system based on the output aberration amount.
- the measurement mark since the measurement mark includes a plurality of periodic patterns having different line widths, a large spatial frequency component corresponding to each periodic pattern is included in the aerial image. As a result, the magnitude of those components, which are indicators of the amount of aberration of the projection optical system, becomes large, so that the SZN ratio of the measured value of the amount of aberration to be obtained can be improved, and the amount of aberration can be accurately determined. You will be able to measure.
- the magnitudes of a plurality of spatial frequency components to be measured can be made uniform, it is possible to reduce the influence of non-linearity of a detection device for measuring a light intensity signal. This makes it possible to measure the aberration of the projection optical system with high accuracy.
- the image forming characteristic of the projection optical system is adjusted by the adjusting device, so that the image forming characteristic is adjusted to an appropriate state. Therefore, the mask pattern can be accurately transferred to the photosensitive object via the projection optical system in which the imaging characteristics are adjusted.
- an exposure apparatus that transfers a pattern of a mask onto a photosensitive object via a projection optical system, wherein the mark includes at least one measurement mark including a periodic pattern.
- An illumination unit for illuminating the mark formation member with illumination light; and a projection optical system for a spatial image of the measurement mark formed via the projection optical system by illumination by the illumination unit.
- An aerial image measurement device that executes aerial image measurement for obtaining a light intensity signal corresponding to the first aberration for each of a case where the first aberration of the projection optical system is set to a plurality of aberration amounts;
- a processing device that calculates at least one second aberration amount using the amount of change in the position where the magnitude of the predetermined frequency component included in the light intensity signal is the maximum when the amount is changed by a fixed amount as an evaluation amount; The calculated And an adjusting device that adjusts the imaging characteristics of the projection optical system based on the aberration amount.
- the exposure apparatus further includes a mask stage for holding a mask on which the pattern is formed, wherein the mark forming member is a reference mark plate disposed on the mask stage. It can be.
- FIG. 1 is a diagram showing a schematic configuration of an exposure apparatus according to a first embodiment of the present invention.
- FIG. 2 is an enlarged view of the vicinity of the wafer stage in FIG. 1 and shows the drive device for the Z tilt stage.
- FIG. 3 is a diagram showing the internal configuration of the aerial image measurement device of FIG.
- FIG. 4A is a diagram showing a slit on a slit plate
- FIG. 4B is a diagram showing an example of a photoelectric conversion signal obtained at the time of aerial image measurement.
- FIG. 5 is a diagram showing the actual arrangement of the slits on the slit plate.
- FIG. 6 is a diagram showing an example of the measured light intensity distribution.
- FIG. 7 is a diagram illustrating an example of a contrast curve of a spatial frequency component of a predetermined order with respect to a focus position of the projection optical system.
- Fig. 8A shows an example of the relationship between the change in the amount of low-order spherical aberration and the change in the contrast of the first-order fundamental frequency component.
- Fig. 8B shows the amount of aberration in high-order spherical aberration.
- FIG. 6 is a diagram showing a relationship between the change of the contrast of the primary fundamental frequency component and the change of the contrast.
- FIG. 9A is a diagram illustrating an example of a contrast curve of a spatial frequency component of each order
- FIG. 9B is a diagram illustrating an example of a relationship between a focus difference and an aberration amount of an even function aberration.
- FIG. 10 is a diagram showing a change in the phase delay level due to each aberration of the even function component with respect to the normalized pupil position.
- Figure 1 1 is a diagram for explaining amplitude adjustment for by Z 9.
- Figure 1 2 is a graph showing the calculation results when calculating the time of changing the Z 9, the amplitude of the fundamental frequency component of the aerial image intensity in the simulation.
- Figure 1 3 is Mel a diagram showing the correlation between the peak position of the aberration amount and Z 9 Conversion ⁇ 6.
- FIG. 14A is a diagram showing an example of a group of measurement marks on a reticle mark plate RFM ′ according to the third embodiment of the present invention
- FIG. 14B is a slit plate for performing aerial image measurement. It is a figure showing an example of.
- FIG. 15A is a diagram illustrating an example of a contrast curve in two LZS patterns having different periods
- FIG. 15B is a diagram illustrating an example of a relationship between a focus difference and an aberration amount of an even function aberration. .
- FIG. 16A is a diagram showing an example of a reticle mark plate R FM "
- FIG. 16B is a diagram showing another example of a reticle mark plate R FM”
- FIG. 21 is a diagram showing another example of a plate RFM ".
- FIG. 17A is a diagram showing another example of the reticle mark plate RFM "
- FIG. 17B is a diagram showing another example of the reticle mark plate RFM".
- FIG. 18 is a graph showing an analysis result of a simulation of an aerial image according to the fourth embodiment of the present invention.
- FIG. 19 is a graph showing a method of designing a second harmonic emphasis mark.
- FIG. 20 is a graph showing a method of designing a third harmonic emphasis mark.
- FIG. 21 is a graph showing a design method of the fourth harmonic emphasis mark.
- FIG. 22 is a graph showing a method of designing a fifth harmonic emphasis mark.
- FIG. 23 is a graph showing a method for designing a sixth harmonic emphasis mark.
- FIG. 24 is a graph showing the result of the aerial image simulation of the second harmonic emphasis mark.
- Fig. 25 is a graph showing the results of the aerial image simulation of the 3rd harmonic emphasis mark.
- FIG. 26A is a diagram showing a measurement pattern used in the fourth embodiment of the present invention
- FIG. 26B is a diagram showing a state when performing aerial image measurement using a slit pattern. .
- FIG. 27 is a diagram showing a state when performing aerial image measurement using a pinhole pattern.
- FIG. 28 is a graph showing the input / output characteristics of the photomultiplier tube. BEST MODE FOR CARRYING OUT THE INVENTION
- FIGS. 1 to 8B a first embodiment of the present invention will be described with reference to FIGS. 1 to 8B.
- FIG. 1 shows a schematic configuration of an exposure apparatus 10 according to the first embodiment of the present invention.
- the exposure apparatus 10 is a step-and-scan scanning projection exposure apparatus, that is, a so-called scanning stepper.
- the exposure apparatus 10 includes an illumination system (illumination unit) including a light source 14 and an illumination optical system 12, a reticle stage RST as a mask stage for holding a reticle R as a mask, a projection optical system PL, Hold the wafer W as an object and see Fig. 1. It is provided with a wafer stage WST that can freely move in an XY plane including the X axis and the Y axis shown, and a control system for controlling these.
- the portions other than the light source 14 and the control system are not shown in an actual environment (not shown) in which the environmental conditions such as the internal temperature and pressure are controlled with high precision and are kept constant. It is housed in the control chamber (Environmental Chamber).
- the light source 14 an excimer laser light source that outputs ArF excimer laser light (wavelength: 193 ⁇ m) is used.
- This light source 14 is actually installed in a low-clean service room or the like, which is separate from the clean room in which the above-mentioned environmental control chamber is installed, and is provided through an optical control optical system (not shown). It is connected to the internal illumination optical system 12.
- the light source 14 is controlled by a main controller 50 to turn on / off the laser light emission, the center wavelength, the spectrum half width, the repetition frequency, and the like.
- a KrF excimer laser (oscillation wavelength: 248 nm) can be used as a light source.
- the illumination optical system 12 includes a beam shaping optical system 18, a fly-eye lens 22 as an optical integrator (homogenizer), an illumination system aperture stop plate 24, a first relay lens 28 A, and a second relay lens. It has a relay optical system consisting of 28 B, fixed reticle blind 30 A, movable reticle blind 30 B, mirror M, condenser lens 32 and the like. Note that a rod-type (internal reflection type) integrator, a diffractive optical element, or the like may be used as the optical integrator.
- a rod-type (internal reflection type) integrator, a diffractive optical element, or the like may be used as the optical integrator.
- the cross-sectional shape of the laser beam LB pulsed by the light source 14 is adjusted so as to efficiently enter the fly-eye lens 22 provided behind the optical path of the laser beam LB.
- a cylinder lens and a beam expander are included.
- the fly's eye lens 22 is arranged on the optical path of the laser beam LB emitted from the beam shaping optical system 18 and a large number to illuminate the reticle R with a uniform illuminance distribution.
- a point light source (light source image) forms a surface light source, that is, a secondary light source.
- the laser beam emitted from this secondary light source is hereinafter referred to as “illumination light IL”.
- an illumination system aperture stop plate 24 made of a disc-shaped member is arranged.
- the illumination system aperture stop plate 24 is provided at substantially equal angular intervals, for example, an aperture stop (normal stop) composed of an ordinary circular aperture, an aperture for reducing the ⁇ value, which is a smaller recoherence factor than a small circular aperture.
- the illumination system aperture stop plate 24 is rotated by a drive device 40 such as a motor controlled by a main controller 50. By this rotation operation, one of the aperture stops is illuminated by the illumination light. Selectively set on the optical path of IL.
- an optical unit disposed between the light source 14 and the optical integrator 22 in the illumination optical system 12 is used.
- This shaping optical system is, for example, exchangeably arranged in the illumination optical system 12 and diffracts the diffracted light into regions having at least one different shape, size and position on the pupil plane of the illumination optical system 12.
- a plurality of diffractive optical elements to be distributed and a plurality of prisms whose intervals in the direction parallel to the optical axis AX of the illumination optical system 12 are variable
- a fly-eye lens is used as the optical integrator 22. Therefore, a lens system (not shown) allows a substantially parallel light beam to enter the fly-eye lens.
- illumination light IL diffiffraction light
- lens system not shown
- the focal point of the illumination light I by the lens system (not shown) should be shifted from the incident surface of the internal reflection type integrator.
- a beam splitter 26 having a small reflectance and a large transmittance is arranged on the optical path of the illumination light IL emitted from the illumination system aperture stop plate 24, and further on the optical path behind the reticle blind 30A, 3
- the relay optical system (28 A, 28 B) is arranged with 0 B interposed.
- the fixed reticle blind 3 OA is located on a surface slightly defocused from a conjugate plane with respect to the pattern surface of the reticle R, and the fixed reticle blind 3 OA has a rectangular shape defining an illumination area IAR on the reticle R. An opening is formed.
- positions optically corresponding to the scanning direction during scanning exposure here, the Y-axis direction
- the non-scanning direction the X-axis direction
- a movable reticle blind 30B having an opening having a variable width.
- the illumination area IAR defined by the fixed reticle blind 3OA is further limited by the movable reticle blind 30B according to an instruction from the main controller 50. This prevents exposure of unnecessary portions (portions other than portions to be transferred, such as circuit patterns on reticle R described later).
- the movable reticle blind 30B is also used for setting an illumination area at the time of aerial image measurement described later.
- a condenser lens 44 and an integrator sensor 46 including a light receiving element are arranged on the optical path of the illumination light I reflected by the beam splitter 26 in the illumination optical system 12.
- the light receiving element of the integrator sensor 46 for example, a PIN photodiode having good sensitivity in the deep ultraviolet region and having a high response frequency for detecting the pulse light emission of the light source 14 is used.
- the laser beam LB pulsed from the light source 14 enters the beam shaping optical system 18, and then enters the rear fly-eye lens 22. After its cross-sectional shape is shaped so as to be incident efficiently, it is incident on the fly-eye lens 22.
- a secondary light source is formed on the exit-side focal plane of the fly-eye lens 22 (the pupil plane of the illumination optical system 12).
- the illumination light IL emitted from the secondary light source passes through one of the aperture stops on the illumination system aperture stop plate 24 and then reaches a beam splitter 26 having a large transmittance and a small reflectance.
- the illumination light IL transmitted through the beam splitter 26 passes through the first relay lens 28 A, passes through the rectangular opening of the fixed reticle blind 3 OA and the opening of the movable reticle blind 30 B, and After passing through the second relay lens 28B and the optical path is bent vertically downward by the mirror M, the slit-like illumination area IAR extending in the X-axis direction on the reticle R through the condenser lens 32 is made uniform. Illuminate with illuminance distribution.
- the integrator sensor 46 receives a part of the illumination light IL reflected by the beam splitter 26 from the integrator sensor 46 via the condenser lens 44, and the photoelectric conversion signal of the integrator sensor 46 is converted into a peak hold circuit (not shown). And is supplied to the main controller 50 via a signal processor 80 having an AZD converter.
- the measured value of the integrator sensor 46 is used not only for controlling the exposure amount, but also for calculating the irradiation amount for the projection optical system PL. Can also be obtained based on the output of the integrator sensor and the output of a reflectance monitor (not shown)), and is also used to calculate the amount of change in the imaging characteristic due to absorption of illumination light by the projection optical system PL.
- the main controller 50 calculates the irradiation amount at predetermined time intervals based on the output of the integrator sensor 46, and the calculation result is stored in a memory 51 described later as an irradiation history. Is stored.
- a reticle R is provided, for example, by vacuum suction (or (Electrostatic attraction).
- the reticle stage RST is two-dimensionally moved (in the X-axis direction and in the Micro drive is possible in the orthogonal Y axis direction and the rotation direction (0 Z direction) around the Z axis orthogonal to the XY plane. Can be moved at the scanning speed specified in.
- moving mirror 52R that reflects the laser beam from reticle laser interferometer (hereinafter referred to as “reticle interferometer”) 54R is fixed.
- the position in the XY plane is always detected by the reticle interferometer 54R with a resolution of, for example, about 0.5 to 1 nm.
- the movable mirror (or retro-reflector) having a reflecting surface orthogonal to the scanning direction (Y-axis direction) at the time of scanning exposure on the reticle stage RST is orthogonal to the non-scanning direction (X-axis direction).
- a movable mirror having a reflective surface is provided, and the reticle interferometer 54R is provided with at least two axes in the Y-axis direction and at least one axis in the X-axis direction. , A reticle interferometer 54R.
- Position information of reticle stage RST from reticle interferometer 54R is sent to stage control device 70, and to main control device 50 via this.
- the stage control device 70 controls the movement of the reticle stage RST via the reticle stage drive system 56R in accordance with an instruction from the main control device 50.
- the end surface of reticle stage RST may be mirror-finished to form the above-described reflecting surface.
- a reticle fiducial mark plate (hereinafter abbreviated as “reticle mark plate”) as a mark forming member having a reference mark for aerial image measurement formed near one Y-side end of reticle stage RST. )
- RFM is arranged in line with reticle R.
- This reticle mark plate RFM is made of the same material as reticle R.
- the reticle stage is made of synthetic quartz, fluorite, lithium fluoride, and other fluoride crystals. The specific configuration of this reticle mark plate RFM will be described later.
- the reticle stage RST has a movement stroke in the Y-axis direction such that at least the entire surface of the reticle R and the entire surface of the reticle mark plate RFM can cross the optical axis AX of the projection optical system PL.
- the reticle stage RST has openings formed below the reticle R and the reticle mark plate RFM. As will be described later, these openings serve as passages for the illumination light I.
- a rectangular opening that is at least directly above the projection optical system P of the reticle-based RBS (portion centered on the optical axis AX) and is at least larger than the illumination area IAR is formed as a path for the illumination light IL. Have been.
- a mark on the reticle R or a mark on the reticle mark plate RFM via the projection optical system PL and a reference mark plate (not shown) on the wafer stage WST are formed above the reticle R.
- a pair of reticle alignment detection systems consisting of a Through The Reticle (TTR) alignment system that uses light at the exposure wavelength to observe the reference mark at the same time (hereinafter referred to as “RA detection system” for convenience) It may be.
- TTR Through The Reticle
- the detection signals of these RA detection systems are supplied to the main controller 50 via an alignment controller (not shown).
- a deflecting mirror (not shown) for guiding the detection light from the reticle R to each RA detection system is movably arranged, and when the exposure process is started, a command from the main controller 50 is also received. Then, the deflecting mirror is retracted by the mirror driving device (not shown).
- a configuration equivalent to that of the RA detection system is disclosed in, for example, Japanese Patent Application Laid-Open No. 7-176468 and corresponding US Patent Nos. 5,646,413 and the like. Since it is known, detailed description is omitted here.
- the projection optical system PL is arranged below the reticle base RBS in FIG.
- the direction of the optical axis AX is defined as the Z-axis direction.
- the projection optical system PL here is a reduction system that is telecentric on both sides, and includes a plurality of, for example, eight lens elements 13 ⁇ , 13 2 ,..., Arranged at predetermined intervals along the optical axis AX direction.
- a refractive optical system consisting of 1 3 8 (see Figure 2) is used.
- the projection magnification of this projection optical system PL is, for example, 1 Z4 (or 1 Z5) (in the following description, it is assumed to be 14). Therefore, when the slit-like illumination area IAR on the reticle R is illuminated by the illumination light IL from the illumination optical system 12, the illumination light IL passing through the reticle R passes through the projection optical system PL. A reduced image (partially inverted image) of the circuit pattern of the reticle R in the slit-shaped illumination area IAR is formed into an exposure area IA conjugate with the illumination area IAR on the wafer W having a surface coated with a photoresist. (See Figure 1).
- the element (for example, a piezo element) 20 is configured to be capable of minutely driving in the optical axis AX direction and in the tilt direction with respect to the XY plane.
- first and second sealed chambers 34 and 36 which are in a sealed state are formed between the lens elements 13 4 and 13 5 and between the lens elements 13 6 and 13 7 respectively.
- a clean gas for example, nitrogen, is supplied into the first and second sealed chambers 34 and 36 from a gas supply mechanism (not shown) via a pressure adjustment mechanism 41.
- the drive voltage (drive amount of the drive element) applied to each drive element 20 and the gas pressure in the first and second sealed chambers 34 and 36 (hereinafter, “the internal pressure” X is referred to as “internal pressure”) and is controlled by the imaging characteristic correction controller 78 in response to a command from the main controller 50.
- This corrects the imaging characteristics of the projection optical system PL, for example, curvature of field, distortion, magnification, coma, astigmatism, spherical aberration, and the like.
- the imaging characteristic adjusting mechanism for adjusting the imaging characteristic may be constituted only by a movable lens element such as the lens element 13 ⁇ , and the number of movable lens elements may be arbitrary.
- the movable lens is adjusted according to the type of the imaging characteristics that need to be corrected. What is necessary is just to determine the number of elements.
- the number of movable lens elements is increased by at least one more than the type (number) of imaging characteristics that need to be corrected, and when adjusting the imaging characteristics by driving a plurality of movable lens elements, at least one of the movable lens elements is adjusted.
- the wavefront aberration of the projection optical system PL may be reduced by a lens element.
- the configuration of the imaging characteristic adjusting mechanism of the first embodiment is not limited to these, and may be arbitrary.
- the wafer stage WST includes an XY stage 42 and a Z tilt stage 38 mounted on the XY stage 42.
- the XY stage 42 is levitated and supported above the upper surface of a wafer base 16 which is the base of the wafer stage WST by a not-shown air bearing through a clearance of about several jum, for example. Further, the XY stage 42 is moved by a linear motor (not shown) constituting a wafer stage drive system 56 W in the Y-axis direction (left-right direction in the drawing of FIG. 1) and the X-axis direction ( It can be driven two-dimensionally (in the direction perpendicular to the paper of Fig. 1).
- a Z tilt stage 38 is mounted on the XY stage 42, and a wafer holder 25 is mounted on the Z tilt stage 38. The wafer W is held by the wafer holder 25 by vacuum suction or the like.
- the Z tilt stage 38 has three Z position drive units 27 A, 27 B, and 27 C (however, the Z position drive unit 27 C on the back side of the drawing is not shown). Is supported at three points on the XY stage 42.
- These Z-position drive units 27 A to 27 C include three actuators that independently drive the respective support points on the lower surface of the Z tilt stage 38 in the optical axis direction (Z-axis direction) of the projection optical system PL. (For example, bo A coil motor, etc.) 21 A, 21 B, 21 C (However, the actuator 21 C on the back side of the drawing in FIG.
- the encoders 23A to 23C for example, a linear encoder of an optical type or a capacitance type is used.
- the Z tilt stage 38 is tilted with respect to a plane (XY plane) orthogonal to the optical axis AX direction (Z axis direction) and the optical axis by the actuators 21A, 21B, and 21C. That is, it is driven in the 0 X direction, which is the rotation direction around the X axis, and in the 0 y direction, which is the rotation direction around the Y axis.
- the drive amount (displacement amount from the reference point) of each support point in the Z-axis direction by the 38 Z position drive units 27 A, 27 B, and 27 C is supplied to the stage control device 70 and the main control device 50 via the stage control device 70 Is done.
- Main controller 50 calculates the position and leveling amount (0x rotation amount, 0y rotation amount) of Z tilt stage 38 in the Z-axis direction.
- a linear motor for driving the XY stage 42, etc., and the Z position drive units 27A to 27C (actuators 21A to 21C and encoders 23A to 23C) are collectively referred to as a wafer stage drive system 56W. It is shown.
- a movable mirror 52W that reflects a laser beam from a wafer laser interferometer (hereinafter, referred to as “wafer interferometer”) 54W is fixed on the Z tilt stage 38.
- the position of the Z tilt stage 38 (wafer stage WST) in the XY plane is always detected with a resolution of, for example, about 0.5 to 1 nm by the wafer interferometer 54W.
- a movable mirror having a reflecting surface orthogonal to the Y-axis direction, which is the scanning direction at the time of scanning exposure, and the X-axis direction, which is the non-scanning direction A moving mirror having orthogonal reflecting surfaces is provided.
- a plurality of wafer interferometers are provided in the X-axis direction and the Y-axis direction, respectively.
- Direction, Y-axis direction, 0x direction, 0y direction, 0Z direction) can be measured, but in Figure 1, these are typically the moving mirror 52 W and the wafer interferometer 54 W It is shown as
- the position information (or speed information) of the wafer stage WST is supplied to the stage controller 70 and the main controller 50 via the stage controller.
- Stage control device 70 controls the position of wafer stage WST in the XY plane via wafer stage drive system 56 W in accordance with an instruction from main control device 50.
- the end surface of the wafer stage WST for example, the Z tilt stage 38 may be mirror-finished to form the above-mentioned reflecting surface.
- the aerial image measuring device 59 includes a stage-side component provided on the tilt stage 38, that is, a slit plate 90 as a pattern forming member and lenses 84, 86.
- a relay optical system consisting of: a mirror 88 for bending the optical path, a light-sending lens 87, and a wafer stage WS ⁇ a component outside the stage provided outside, that is, a mirror 96, a light-receiving lens 89, and a photoelectric conversion element
- An optical sensor 94 and the like are provided.
- the slit plate 90 closes the opening of the protruding portion 58 provided on the upper surface of one end of the wafer stage WS and having an upper opening. And is fitted from above.
- a reflection film 83 serving also as a light-shielding film is formed on the upper surface of a light-receiving glass 82 having a rectangular shape in plan view, and a predetermined width as a predetermined measurement pattern is formed on a part of the reflection film 83.
- a 2D slit-shaped opening pattern (hereinafter referred to as “slit J”) 122 is formed.
- synthetic quartz, fluorite, or the like which has a high transmittance of ArF excimer laser light, is used.
- a relay optical system (84, 86) consisting of 84, 86 is arranged.
- the relay optical system (84, 86) relays a predetermined optical path length on the + Y side wall of the wafer stage WST behind the optical path of the relay optical system (84, 86).
- the light transmitting lens 87 that transmits the illumination light beam to the outside of the wafer stage WST is fixed.
- a mirror 96 having a predetermined length in the X-axis direction is inclined at an inclination angle of 45 ° on the optical path of the illumination light beam sent out of the wafer stage WST by the light transmission lens 87.
- the optical path of the illumination light beam sent out of the wafer stage WST is bent 90 ° vertically upward.
- a light receiving lens 89 having a larger diameter than the light transmitting lens 87 is arranged on the bent optical path.
- an optical sensor 94 is provided above the light receiving lens 89.
- the light receiving lens 89 and the optical sensor 94 are housed in a case 92 while maintaining a predetermined positional relationship.
- the case 92 is fixed to the vicinity of the upper end of a column 97 implanted on the upper surface of the wafer base 16 via an attachment member 93.
- a photoelectric conversion element capable of accurately detecting weak light, for example, a photo 'multiplier' tube (PMT, photomultiplier tube) or the like is used.
- the photoelectric conversion signal P from the optical sensor 94 is sent to the main controller 50 via the signal processor 80 in FIG.
- the signal processing device 80 can be configured to include, for example, an amplifier, a sample holder, an AZD converter (a device having a resolution of 16 bits is usually used), and the like.
- the slits 122 are formed in the reflection film 83, but in the following, for convenience, the description will be made assuming that the slits 122 are formed in the slit plate 90.
- the aerial image measurement device 59 configured as described above, the measurement of the projection image (aerial image) obtained through the projection optical system PL of the measurement mark PM formed on the reticle mark plate RFM, described later, is performed.
- the slit plate 90 constituting the aerial image measurement device 59 is illuminated by the illumination light IL transmitted through the projection optical system PL, the illumination light transmitted through the slit 122 on the slit plate 90
- the IL is led out of the wafer stage WS through a lens 84, a mirror 88, a lens 86, and a light transmitting lens 87.
- the light led out of the wafer stage WST is bent vertically upward by a mirror 96, received by an optical sensor 94 via a light receiving lens 89, and received from the optical sensor 94.
- the photoelectric conversion signal (light amount signal) P corresponding to the amount of received light is output to the main controller 50 via the signal processor 80.
- the measurement of the projected image (aerial image) of the measurement mark is performed by the slit scan method.
- the light transmitting lens 87 is connected to the light receiving lens 89 and the optical sensor 9. Will move against 4. Therefore, in the aerial image measurement device 59, the size of each lens and the mirror 96 is set so that all light passing through the light transmission lens 87 moving within a predetermined range enters the light reception lens 89. It is set.
- the light passing through the slit 122 is transmitted to the wafer stage WS by the slit plate 90, the lenses 84, 86, the mirror 88, and the light transmitting lens 87.
- a light deriving unit that leads out of the T is formed, and a light receiving lens 89 and an optical sensor 94 form a light receiving unit that receives light led out of the wafer stage WST.
- the light guiding section and the light receiving section are mechanically separated. Only at the time of aerial image measurement, the light deriving part and the light receiving part are Optically connected via 6.
- the optical sensor 94 is provided at a predetermined position outside the wafer stage WST, the measurement accuracy of the wafer interferometer 54 W caused by heat generation of the optical sensor 94 is obtained. And other adverse effects to the extent possible. Also, since the outside and the inside of the wafer stage WST are not connected by a light guide or the like, the driving of the wafer stage WST is performed as if the outside and the inside of the wafer stage WST were connected by a light guide. Accuracy is not adversely affected by the light guide.
- the optical sensor 94 may be provided inside the wafer stage WST.
- the aerial image measurement and aberration measurement methods performed using the aerial image measurement device 59 will be described later in detail. Referring back to FIG. 1, the alignment mark on the wafer W is provided on the side of the projection optical system PL.
- An off-axis alignment system ALG is provided as a mark detection system for detecting (alignment mark) or a reference mark serving as a reference for position control.
- an alignment sensor of an image processing method that is, a so-called FIA (Field Image Alignment) system is used as the alignment system ALG.
- the alignment system ALG includes an alignment light source, an optical system including a half mirror and a group of objective lenses, an index plate on which index marks are formed, and an image sensor.
- a light source for the alignment a halogen lamp or the like that emits broadband illumination light is used.
- the illumination light from the alignment light source illuminates the alignment mark on the wafer W via the optical system, and the reflected light from the alignment mark is received by the imaging device via the optical system and the index plate. .
- a bright-field image of the alignment mark (including the image of the index mark) is formed on the light receiving surface of the image sensor.
- the photoelectric conversion signal corresponding to the bright-field image that is, the light intensity signal corresponding to the reflection image of the alignment mark, is subjected to main control from the imaging device via an alignment control device (not shown). It is supplied to the device 50.
- the main controller 50 calculates the position of the alignment mark on the wafer W with reference to the detection center of the alignment system ALG (corresponding to the center of the aforementioned index mark) based on the light intensity signal.
- the stage coordinate system defined by the optical axis of the wafer interferometer 54 W based on the calculation result and the position information of the wafer stage WST which is the output of the wafer interferometer 54 W at that time. The coordinate position of the alignment mark is calculated.
- an oblique incidence type multipoint focal position detection system (60%) including an illumination system 60a and a light receiving system 60b. a, 60 b) are provided.
- the irradiation system 60a has a light source whose on / off is controlled by the main controller 50, and forms images of a large number of pinholes or slits toward the imaging plane of the projection optical system PL.
- the surface of the wafer W is irradiated with an image forming light beam to be formed in a direction oblique to the optical axis AX.
- the light receiving system 6 Ob receives a reflected light beam generated by the reflection of the imaging light beam on the surface of the wafer W, and transmits a defocus signal for detecting a defocus to the main controller 50.
- This multi-point focal position detection system 60a, 60b
- a similar multi-point focal position detection system are described in, for example, Japanese Patent Application Laid-Open No. 6-284304 and this publication. No. 5,448,332, etc., corresponding to US Pat. No. 5,448,332, etc., and a detailed description of its configuration will be omitted.
- the disclosures in each of the above US patents are incorporated herein by reference.
- the main controller 50 sets the defocus of the projection optical system P to zero based on a defocus signal (defocus signal) from the light receiving system 60b, for example, an S-curve signal at the time of scanning exposure to be described later.
- a defocus signal defocus signal
- the movement and inclination (that is, rotation in the 0x and 0y directions) of the Z tilt stage 38 in the Z-axis direction are controlled via the wafer stage drive system 56W.
- the main controller 50 controls the movement of the Z tilt stage 38 by using the multi-point focal position detection system (60a, 60b) so that the illumination light I Auto focus (auto focus) that substantially matches the image plane of the projection optical system PL with the surface of the wafer W within the exposure area IA (which has an imaging relationship with the illumination area IAR), which is the irradiation area of L ) Perform auto leveling.
- the main controller 50 controls, for example, the inclination of the reflected light beam of a parallel plate (not shown) in the light receiving system 6 O b with respect to the optical axis by controlling the projection optical system PL.
- the origin is reset in the multipoint focal position detection system (60a, 6Ob) according to the focus fluctuation amount of the PL, and the calibration is performed.
- an environment sensor 81 for detecting atmospheric pressure fluctuation and temperature fluctuation is provided near the projection optical system PL in the above-mentioned environment control chamber (not shown). The measurement result by the environment sensor 81 is supplied to the main controller 50.
- the control system mainly includes a main controller 50 composed of a workstation (or a microcomputer) and a stage controller 70 under the control of the main controller 50. Further, a memory 51 is provided as a storage device readable and writable by the main control device 50. The memory 51 stores the amount of aberration of the projection optical system PL obtained by the aberration measurement method of the first embodiment.
- a reticle R on which a circuit pattern is formed is transported by a reticle transport system (not shown), and the reticle R is suction-held on a reticle stage R ST at a loading position.
- main controller 50 sets an optimal illumination condition for exposure using reticle R based on an operator's instruction.
- the position of the wafer stage WST and the position of the reticle stage RST are controlled by the stage controller 70 under the instruction of the main controller 50, and the main controller 50 controls the position of the reticle R (not shown).
- the shadow image (aerial image) is measured using the aerial image measuring device 59 as described later, and the projection position of the reticle pattern image is obtained. That is, reticle alignment is performed.
- the reticle alignment is performed by the above-mentioned pair of RA detection systems (not shown) by using an image of a pair of reticle alignment marks (not shown) on reticle R and a reference mark plate (not shown) on wafer stage WST.
- the projection position of the reticle pattern image may be determined based on the measured value of the reticle pattern image.
- the main controller 50 moves the wafer stage WST so that the slit plate 90 is positioned immediately below the alignment system ALG, and the slit that becomes a position reference of the aerial image measurement device 59 is moved by the alignment system ALG. 1 2 2 is detected.
- Main controller 50 obtains the pattern image of reticle R based on the detection signal of alignment ALG, the measured value of wafer interferometer 54 W at that time, and the projection position of the reticle pattern image obtained earlier.
- the relative position between the projection position and the alignment ALG that is, the baseline of the alignment ALG is obtained.
- a baseline measurement reference mark formed on a reference mark plate (not shown) on wafer stage WST may be used instead of slit 122.
- the main controller 50 When the baseline measurement is completed, the main controller 50 performs detailed operations in, for example, Japanese Patent Application Laid-Open No. 61-44429 and the corresponding US Pat. No. 4,780,617.
- a wafer alignment such as the disclosed EGA (Enhanced ⁇ Global alignment) is performed, and the positions of all shot areas on the wafer W are obtained.
- EGA Enhanced ⁇ Global alignment
- the disclosure in each of the above US patents is incorporated herein by reference, as far as the national laws of the designated country or selected elected country permitted in this international application permit.
- a plurality of shot areas on the wafer W are required.
- a wafer alignment mark of a predetermined sample shot within the area is measured as described above using an alignment ALG.
- main controller 50 monitors the wafer while monitoring the position information from interferometers 54 W and 54 R based on the position information and the baseline of each shot area on wafer W obtained above.
- the stage WST is moved to the scanning start position (acceleration start position) of the first shot area, and the reticle stage RST is moved to the scanning start position (acceleration start position), and the scanning exposure of the first shot area is performed. Do.
- main controller 50 starts relative scanning by moving reticle stage RST and wafer stage WST in directions opposite to each other in the Y-axis direction.
- the stages R ST and W ST reach their respective target scanning speeds
- the pattern area of the reticle R starts to be illuminated by the illumination light IL, and scanning exposure is started.
- the light source 14 has started emitting light
- the main controller 50 controls the movement of each blade of the movable reticle blind 30 B in synchronization with the movement of the reticle stage RST. Have been. Accordingly, the irradiation of the illumination light IL to the outside of the pattern area on the reticle R is shielded.
- main controller 50 controls the movement speed Vr of reticle stage RST in the Y-axis direction and movement speed Vw of wafer stage WST in the Y-axis direction by projection optical system PL described above.
- Reticle stage RST and wafer stage WST are controlled synchronously so that the speed ratio according to the magnification is maintained.
- the stepping operation between shots and the scanning exposure operation for shots are repeated, and the pattern of the reticle R is transferred to all the shot areas on the wafer W by the step-and-scan method.
- the above-mentioned autofocus and auto-leveling are performed by using the multi-point focal position detection system (60a, 60b) integrated with the projection optical system PL. Done.
- the aberration and the baseline of the projection optical system PL are accurately measured. It is important that they are adjusted and that the imaging characteristics of the projection optical system PL are adjusted to an appropriate state.
- Such aberrations of the projection optical system PL include spherical aberration and even-number aberration such as focus.
- the even-function aberration is an aberration in which the radial function of each term of the Fringe-Zell polynomial representing the wavefront aberration is represented by an even function.
- the aerial image measurement device 59 described above is used for measuring even function aberrations such as the above-mentioned spherical aberration.
- even function aberrations such as the above-mentioned spherical aberration.
- FIG. 3 shows a state where the aerial image of the measurement mark PM formed on the reticle mark plate RFM is being measured using the aerial image measurement device 59.
- the reticle mark plate RFM instead of the reticle mark plate RFM, it is also possible to use a reticle dedicated to aerial image measurement, or a reticle R used for device manufacturing, in which dedicated measurement marks are formed.
- the reticle mark plate RFM has a line-and-space (LZS) in which the ratio (duty ratio) of the width of the line portion having a periodicity in the Y-axis direction to the width of the space portion at a predetermined position (duty ratio) is 1: 1. ) It is assumed that a measurement mark PM composed of a pattern (periodic pattern) is formed.
- LZS line-and-space
- a plurality of measurement marks PM may be provided on the reticle mark plate RFM.
- a method of aerial image measurement using the aerial image measurement device 59 will be briefly described. It is assumed that the slit plate 90 is formed with a slit 122 having a predetermined width 2D extending in the X-axis direction, for example, as shown in FIG. 4A.
- the movable reticle blind 30B is driven by a main controller 50 via a blind driving device (not shown), and as shown in FIG. It is limited to only a predetermined area including the measurement mark PM.
- FIG. 4A is a top view when viewed from the projection optical system PL side of the aerial image measurement device 59 at this time.
- the cycle of the aerial image PM ′ is 14 which is the cycle of the LZS pattern of the measurement mark PM.
- the period (pitch) of the measurement mark or the like indicates the period of this aerial image.
- main controller 50 drives wafer stage WST in the + Y direction as shown by arrow F in FIG. 4A via wafer stage drive system 56 W, slits 122 are formed in space.
- the image PM ' is scanned in the Y-axis direction.
- light (illumination light IL) passing through the slits 122 is received by the optical sensor 94 via the light guide, mirror and light receiving lens 89 in the wafer stage WST, and the photoelectric conversion signal is output.
- P is supplied to the main controller 50 via the signal processor 80.
- the main controller 50 controls the light corresponding to the aerial image PM ′ based on the photoelectric conversion signal P. Get the intensity distribution.
- FIG. 4B shows an example of a photoelectric conversion signal (light intensity signal) P obtained at the time of the aerial image measurement described above.
- the aerial image PM ′ is averaged due to the width (2D) of the slits 122 in the scanning direction (Y-axis direction).
- the aerial image intensity distribution is i (y)
- the observed light intensity signal is m (y)
- the aerial image intensity distribution i (y) The relationship with the intensity signal m (y) is expressed by the following equation (2).
- the unit of the intensity distribution i (y) and the intensity signal m (y) is the intensity per unit length
- the u axis is the same coordinate axis as the y axis.
- m (y) jp (yu) i (u) du (2)
- the function p (y) of the slit 1 2 2 is expressed by the following equation (3).
- the observed intensity signal m (y) is a composition of the slit function p (y) and the intensity distribution i (y) of the aerial image.
- slit width the width of the slits 122 in the scanning direction (Y-axis direction)
- PMT photomultiplier tube
- the scanning speed is reduced and time is required for measurement. It is possible to detect the light intensity (light intensity).
- the slit width 2D is too small, the amount of light transmitted through the slit 122 becomes too small. Measurement becomes difficult.
- a slit 122a having a predetermined width 2D and a length L extending in the X-axis direction and a slit 122b having a predetermined width 2D and a length L extending in the Y-axis direction are formed.
- 2D is set to, for example, 200 nm or less
- L is set to, for example, 16 m, and is set to be shorter than the length of the measurement mark line pattern as shown in FIG. 4A.
- the slits 122b are arranged on the one X side and + Y side of the slit 122a at a distance of about 4 jUm.
- the light sensor 94 transmitted either of the slits 122a and 122b through the light guiding portion inside the wafer stage WST, the mirror 96 and the light receiving lens 89. It is assumed that light can be received.
- the slits 122a and 122b are referred to as the slits 122 without distinction unless otherwise required.
- the light intensity distribution in the aerial image (projection image) PM ′ of the measurement mark PM can be measured by the aerial image measurement operation using the aerial image measurement device 59 described above.
- an even function aberration for example, a spherical aberration of the projection optical system PL is measured based on the measured light intensity distribution.
- the complex amplitude distribution in the Y-axis direction in the aerial image PM ′ of the measurement mark PM is represented by o (y), and its spatial frequency spectrum is represented by O (s) (where s is the distribution coordinate on the spatial frequency axis). ).
- O (s) the spatial frequency spectrum
- ⁇ (y) of the aerial image PM ′ of the measurement mark PM is obtained by integrating the interference fringes generated by the above-mentioned beat by a certain weight and integrating the resultant with the entire spatial frequency. This weight is called a cross modulation coefficient.
- the cross modulation coefficient is defined by the following equation (4).
- T (f, f ") ⁇ ( ⁇ , ⁇ ) F ⁇ ) ⁇ (1 ⁇ (4)
- F is a pupil function at the exit pupil of the projection optical system PL (* indicates complex conjugate)
- ⁇ ⁇ , ⁇ ) is an effective light source.
- Reference numeral 7 denotes an orthogonal coordinate axis on the projection pupil of the projection optical system PL.
- the imaging formula of the measurement mark PM by partial coherent illumination is as follows:
- the aberration amount of the even function aberration of the projection optical system PL is calculated based on the amplitude of the spatial frequency component of the predetermined order (Nth order).
- the aberration amount of the even-function aberration may be obtained based on the amplitude of the even-order, for example, the second-order harmonic component.
- the spatial frequency component of the spatial image PM ′ of the measurement mark PM which is an LZS pattern with a duty of 50%, does not basically include the second harmonic component, the even harmonic component is not present. Based on the amplitude of the wave component, it is necessary to use the composition of the beat components of other frequency components as the second harmonic component.
- O (y) is represented by the following equation (8) using a Fourier series.
- the measurement mark PM 0. 5 jU m LZS pattern (pitch P h of the spatial image PM 'is 1.0 / become pattern m) and a 0.7 8 numerical aperture of the projection optical system PL (NA) Then, considering the case of coherent illumination, the harmonics that actually pass through the projection optical system P are up to the third order. Also the amount of aberration even function aberration of the primary fundamental frequency components e X p (i 0 ⁇ ) and third-order aberrations of even function aberration harmonic NamiNaru content and e X p (i 0 3) .
- the beat component corresponding to the second harmonic includes the first fundamental frequency component and the beat component of the third harmonic component, and the first fundamental frequency component and the first harmonic component.
- the beat component of the fundamental frequency component of 1) can be considered.
- the first-order fundamental frequency component and the beat component I h2_i_3_ even with its third-order harmonic component (y) is expressed by the following formula (1 1).
- this beat component I h 2 1 1 1 3 1 even (y) is represented by e X p (i ⁇ ⁇ ) for the amount of aberration for the primary fundamental frequency component, and Assuming that the aberration amount for is e X ⁇ ( ⁇ 0 3 ), it is expressed as the following equation (1 2).
- the even-order harmonic component is a beat component between multiple-order harmonic components, and its amplitude changes depending on the presence or absence of the fifth-order harmonic component and the seventh-order harmonic component, for example. And easily become unstable. Therefore, even Rather than using the amplitude of the next harmonic component as the evaluation amount of the even function aberration, the amplitude of the odd harmonic component that is not affected by the fifth and seventh harmonic components described above is used as the evaluation amount of the even function aberration.
- the wafer stage drive system drives the wafer stage WST in the + Y direction according to the instruction of the main controller 50, and the slits 122 form the aerial image.
- the photoelectric conversion signal P is obtained by the aerial image measurement device 59.
- This photoelectric conversion signal P is finally supplied to main controller 50.
- Main controller 50 acquires a light intensity distribution corresponding to aerial image PM ′ based on the photoelectric conversion signal P (first step).
- the measurement mark PM including the LZS pattern as the periodic pattern is always located within the effective visual field of the projection optical system PL, as shown in FIG.
- the position of the slit 1 2 2 (the predetermined measurement pattern) in the direction of the optical axis AX of the projection optical system PL may be any position as long as the aerial image PM ′ is in the vicinity of the image plane on which the image is formed. I do.
- FIG. 6 shows the light intensity distribution of the measured aerial image PM ′.
- the horizontal axis indicates the position of the slit 122 in the Y-axis direction, and the horizontal axis indicates the light intensity obtained when the slit 122 is at the position in the Y-axis direction.
- the light intensity distribution of this aerial image PM ′ has nine peaks in the Y-axis direction. The appearance period of this peak corresponds to the period of the aerial image PM '. Due to factors such as coma aberration of the projection optical system PL, the phase difference in the Y-axis direction between the first spatial frequency component corresponding to the period of the aerial image PM ′ and the third harmonic component thereof Each peak Have two asymmetric peaks.
- the main control unit 50 as a processing unit determines that the light intensity distribution is i (y), and the spatial frequency component of a predetermined order based on the period of the measurement mark P M on the wafer W.
- the main controller 50 drives the imaging characteristic correction controller 78 based on the calculated magnitude of the aberration of the even-function aberration to adjust the imaging characteristic of the projection optical system PL. adjust.
- the polarity of the aberration amount of the even function is determined in a predetermined direction (either positive or negative in the optical axis direction of the projection optical system PL), and the projection optical system PL is determined based on the direction. Adjust the imaging characteristics.
- main controller 50 drives imaging characteristic correction controller 78 so as to cancel the amount of positive aberration so that projection optical system PL The imaging characteristics are to be adjusted.
- main controller 50 drives wafer stage WST again in the + Y direction via the wafer stage drive system.
- the slits 122 are scanned in the Y-axis direction with respect to the aerial image PM ′, and the aerial image measurement device 59 obtains a photoelectric conversion signal P.
- the obtained photoelectric conversion signal P is finally supplied to the main controller 50 Is done.
- Main controller 50 acquires a light intensity distribution corresponding to aerial image PM ′ based on the photoelectric conversion signal P. That is, the first step described above is executed again by main controller 50.
- main controller 50 calculates the Fourier of the sine function expressed by the above-mentioned equation (13) indicating the amplitude of the first-order fundamental frequency component included in the light intensity distribution obtained in the first step.
- the main controller 50 calculates the aberration of the even function aberration corresponding to the magnitude a 1 of the amplitude from the relationship between the first order fundamental frequency component and the aberration amount of the even function aberration shown in the above equation (7).
- the second step of calculating the magnitude of the quantity is performed again.
- main controller 50 compares the aberration amount of the even function aberration calculated in the second step this time with the aberration amount of the even function aberration calculated in the previous second step.
- the polarity of the aberration amount of the actual even function aberration is equal to the polarity of the temporarily determined aberration amount of the even function aberration. It is the opposite of polarity (positive here).
- the main controller 50 again determines that the polarity of the aberration amount of the even function aberration is negative here, and cancels the negative aberration amount so as to cancel the imaging characteristic of the projection optical system P. To adjust.
- the main controller 50 determines that the projection optical system PL has been appropriately adjusted, determines the polarity as it is as it is, measures the even-function aberration, and adjusts the projection optical system PL. To end. Even if the calculated aberration amount is smaller than the previously calculated aberration amount, but is still larger than the predetermined aberration amount, the first and second steps can be repeated again. good.
- the main controller 50 executes the above-described scanning exposure operation after the imaging characteristics of the projection optical system PL are adjusted, the circuit pattern formed on the reticle R is accurately transferred onto the wafer W.
- the aberration amount of the even function aberration and the predetermined order of the aerial image (the first order in the first embodiment, but the third order) And the magnitudes of the spatial frequency components of the fifth and other orders) can be used to obtain a light intensity signal corresponding to the aerial image PM 'of the measurement mark PM by utilizing the predetermined relationship with the magnitude of the spatial frequency component.
- the magnitude of the spatial frequency component of a predetermined order included in the light intensity signal is measured, and the amount of even function aberration of the projection optical system is calculated based on the measured magnitude.
- the aberration of the projection optical system PL can be accurately measured.
- the first step and the second step are performed once, the magnitude of the even function aberration can be obtained. Polarity cannot be determined. Therefore, in the first embodiment, after adjusting the imaging characteristics of the projection optical system, the first step and the second step are executed again to obtain the aberration amount of the even function aberration, and the even function aberration measured last time is obtained.
- the polarity of the even-function aberration is determined by comparing with the aberration amount of. Specifically, if the amount of even function aberration measured this time is smaller than the amount of even function aberration measured last time, the polarity at the time of adjustment is the expected one. If it is larger, it is judged that the polarity at the time of adjustment is opposite to the expected polarity. This As a result, the imaging characteristics of the projection optical system can be appropriately adjusted as a result.
- the imaging characteristic of the projection optical system P is adjusted after temporarily setting the polarity of the aberration amount of the even function aberration to either positive or negative, but the present invention is not limited to this. Instead, the polarity of the aberration amount of the even function aberration may be detected as described below.
- the focus position of the projection optical system PL and the space of a predetermined order included in the light intensity distribution based on the photoelectric conversion signal P A curve indicating the relationship with the contrast of the frequency component (the spatial frequency component divided by the DC component included in the light intensity distribution), that is, a contrast curve, is obtained in advance.
- the horizontal axis indicates the focus position of the projection optical system PL
- the vertical axis indicates the contrast of the spatial frequency component of a predetermined order at that time.
- the spatial frequency component of a predetermined order is the primary fundamental frequency component.
- the simulation conditions are as follows: the wavelength of the illumination light IL is 1933 nm, the coherence factor ⁇ is 0.15, and the projection optical system PL is 0.78.
- the period of the aerial image ⁇ ⁇ , is set to 200 nm.
- the contrast curve shown in FIG. 7 may be calculated by aerial image measurement in an actual device. Then, main controller 50 sets the focus position where the contrast of the spatial frequency component is almost 0 in the contrast curve (for example, the position of about 0.3 im shown in FIG. 7, that is, the contrast value is the maximum). (A position having a predetermined offset from the position where the position becomes), the slits 122 are positioned via the stage control device 70 and the wafer stage drive system 56 W or the like.
- main controller 50 executes the above-described first step and second step, and calculates the magnitude of the primary fundamental frequency component corresponding to aerial image PM ′ using the above equation (1 3 ), And the magnitude of the aberration amount of the even function aberration is obtained based on the above equation (7).
- the main controller 50 generates a desired value of even function aberration in the projection optical system PL via the imaging characteristic correction controller 78 while keeping the focus position of the projection optical system PL at that position.
- the relationship between the change in the aberration amount of the functional aberration and the change in the contrast of the primary fundamental frequency component included in the light intensity distribution corresponding to the aerial image PM ' is obtained.
- FIGS. 8A and 8B show an example of the relationship between the change in the aberration amount of the even function aberration obtained by the above-described operation and the change in the contrast of the primary fundamental frequency.
- Figure A 8 A are relationships between low-order aberration changes and the change in the contrast of the primary fundamental frequency component of the spherical aberration Z 9 is shown
- FIG. 8 B high-order spherical aberration The relationship between the amount of aberration of Zi6 and the change in contrast of the first-order fundamental frequency component is shown.
- the focus position of the projection optical system PL is set to the position where the contrast of the primary fundamental frequency component is 0, even function aberration of the projection optical system PL Is not intentionally generated, that is, when the amount of aberration of low-order spherical aberration Z 9 in FIG. 8 is 0 m ⁇ , and the amount of difference of high-order spherical aberration ⁇ 16 in FIG. In contrast, the contrast of the first-order fundamental frequency component is zero.
- the main controller 50 through the image forming characteristics correction controller 7 8, while generating aberration of lower order spherical aberration Zeta 9 or higher order spherical aberration Zeta 16 in the positive direction extends Ma Inasu direction, the Each time, the aerial image measurement is performed via the aerial image measurement device 59 described above, and the size of the primary spatial frequency component included in the obtained light intensity distribution is obtained. By doing so, main controller 50 obtains the contrast characteristic with respect to the amount of even-function aberration as shown in FIGS. 8A and 8B. be able to.
- FIG 8 A referring to FIG. 8 B, the lower order spherical aberration Z 9 and contrast of the primary spatial frequency components in proportion to the amount of aberration of higher order spherical aberration Z 16 increases from negative to positive linear It can be seen that the number is gradually decreasing. From the characteristic of the change of each even function aberration with respect to the change of the contrast, the aberration amount of the even function aberration can be read, and its polarity can be clarified. Main controller 50 obtains the relationship between the aberration amount of the even function aberration at the obtained offset position and the magnitude of the first-order fundamental frequency component (here, contrast) as described above, and based on the relationship, Thus, the polarity of the aberration amount of the even function aberration is determined.
- the first-order fundamental frequency component here, contrast
- the predetermined offset position is determined so that the magnitude (contrast) of the first-order fundamental frequency component is almost 0.
- the amount of even-function aberration that can occur can be predicted.
- a range of the contrast value to be measured may be predicted from the range, and the necessary minimum focus offset amount may be estimated from the range.
- the low-order aberration of the projection optical system PL is an important measurement target.
- the low order aberrations in general, refers to up Oite Z 9 fringe Zernike polynomial.
- the aberration amount of low-order aberration is likely to change depending on time and temperature, but the aberration amount of high-order aberration changes depending on time and temperature because the error in the shape of the lens element is dominant.
- Possibility is low, measure low-order aberrations and cancel low-order aberrations to reduce aberrations in projection optical system PL It was thought that there was a function to do it.
- the present inventor found that only the low-order aberration Z 9 among the aberrations symmetrical to the optical axis of the projection optical system PL, that is, even function aberrations not was ascertained that the change to high-order aberrations Z 16, Z 25. Therefore, in the aberration measurement method of the first embodiment, the low-order aberration and the high-order aberration are separated from the measured aberration amount of the even-function aberration, and the spherical aberration is corrected according to the temperature change. Is desirable.
- the amplitude of the spatial frequency component may be used as the evaluation amount of the magnitude, or the contrast may be used as the evaluation amount. Contrast is the amplitude of the spatial frequency component divided by the DC component included in the light intensity signal.
- the effect of the change in the light amount of the illumination light source on the aberration measurement is measured. Can be alleviated.
- the measurement mark PM is formed on the reticle mark plate RFM, but another measurement mark may be formed.
- a measurement mark of an LZS pattern whose periodic direction is arranged in the X-axis direction is formed, and a slit scan operation in the X-axis direction is performed (in this case, the slit 1 on the slit plate 90 is used).
- Use 2 2 b) or measure the aerial image.
- the light guiding section and the light receiving section of the aerial image measuring device 59 are mechanically separated from each other. However, they are connected by a flexible optical fiber cable. Is also good.
- FIGS. 9A and 9B Next, a second embodiment of the present invention will be described with reference to FIGS. 9A and 9B.
- the exposure apparatus according to the second embodiment is used for measuring the aberration of the projection optical system PL. Only the operation in the control device 50 is different from that of the first embodiment described above, and the device configuration is the same as the exposure device 10 of the first embodiment shown in FIGS. 1 to 5. ing. Therefore, in the following, in order to avoid repetition, the description will focus on the difference from the first embodiment, that is, the operation of measuring the even function aberration of the projection optical system PL. Also, for the same purpose, the same reference numerals are used for the same or equivalent components, and the description thereof will be omitted.
- main controller 50 executes an aerial image measurement operation.
- the position in the optical axis direction of the projection optical system P that scans the slit plate 90 that is, the focus position of the projection optical system PL (scans the slit 122 as a predetermined measurement pattern). Position) was fixed to one location, and the aerial image measurement was performed.
- a plurality of positions in the optical axis direction of the projection optical system PL hereinafter, abbreviated as “focus positions”.
- aerial image measurement is performed (first step). Note that the aerial image measurement operation at each focus position is the same as the operation in the above-described first embodiment, and a detailed description thereof will be omitted.
- the photoelectric conversion signal P measured at each focus position by the aerial image measurement operation at a plurality of focus positions is transmitted to main controller 50.
- the main controller 50 calculates the primary fundamental frequency component included in the light intensity distribution measured at each focus position from the light intensity distribution based on the photoelectric conversion signal P at each focus position,
- the magnitude of the harmonic component and its fifth harmonic component (here, the contrast) is extracted.
- main controller 50 calculates a contrast curve of spatial frequency components of each order as shown in FIG. 9A based on the contrast of each frequency component at a plurality of focus positions.
- FIG. 9A shows only the contrast curve of the first-order fundamental frequency component (solid line) and the contrast curve of the third-order harmonic component (dotted line).
- the horizontal axis shows the focus position
- the vertical axis shows the spatial frequency component control. Indicates the last.
- the force position at which the contrast curve of the first-order fundamental frequency component is maximized. Position is the origin), and the focus position where the contrast curve of the third harmonic component is the maximum, causes a position shift, a so-called focus difference.
- FIG. 9B shows the relationship between the focus difference and the aberration amount of the even function aberration.
- the horizontal axis indicates the amount of aberration of even-function aberration
- the vertical axis indicates the best focus position of the first-order fundamental frequency component and the best focus of the third-order harmonic component generated by the amount of aberration. This shows the focus difference from the position.
- the aberration amount of the even-number aberration and the focus difference between their best focus positions are in a proportional relationship, and when this focus difference is measured, the even-function aberration at that time is measured. The amount of aberration can be determined.
- the relationship between the focus difference and the amount of aberration of the even function aberration is determined by aerial image simulation using a mathematical model of the projection optical system PL and stored in the memory 51. And Therefore, the main controller 50 as a processing device obtains a contrast curve of the first-order fundamental frequency component and a contrast curve of the third-order harmonic component as shown in FIG. After calculating the focus difference and the focus difference of the best focus position (indicated by R1 in FIG. 9A), the amount of even-function aberration corresponding to the focus difference R1 is stored in the memory 51. The calculation is performed by referring to the stored characteristics of the focus difference and the aberration amount of the even function aberration shown in FIG. 9B (second step).
- the main control device 50 as an adjusting device adjusts the aberration amount of the even function aberration of the projection optical system PL via the imaging characteristic correction controller 78 based on the calculated aberration amount of the even function aberration. I do. Then, if the main controller 50 executes the above-described scanning exposure operation after the imaging characteristics of the projection optical system PL are adjusted, the circuit pattern formed on the reticle R is transferred onto the wafer W with high accuracy.
- the focus position at which the contrast of the primary fundamental frequency component contained in the aerial image is maximized By calculating the position shift from the focus position at which the contrast of the third harmonic component is the maximum, that is, the focus difference, the aberration amount of the even function aberration can be calculated. Since the focus difference is obtained with a sign, this method can simultaneously obtain the magnitude of the aberration amount and the polarity thereof.
- this method it is possible to avoid including disturbance factors such as manufacturing errors of a plurality of periodic patterns in the aberration measurement by using only one periodic pattern for measuring the amount of aberration. Therefore, the aberration of the projection optical system PL can be measured with high accuracy.
- a measurement mark on a reticle mark plate R FM two periodic patterns having different periods, two Ls whose aerial image periods are 0.5 tm and 1.0 j «m, respectively.
- a measurement mark having a / S pattern is prepared, and the first and second steps described above are executed for each measurement mark to measure each aerial image.
- the Zernike sensitivity to the focus difference (hereinafter simply referred to as focus difference sensitivity) differs. Therefore, it is possible to separate low-order spherical aberration (Z 9 ) from high-order spherical aberration (Z 16 ).
- the focus difference sensitivity described above can be obtained by aerial image simulation using a mathematical model of the projection optical system PL.
- the sensitivities of spherical aberrations Z 9 , Z 16 s Z 25 , and Z 36 , which are even-function aberrations, with respect to changes in the focus difference are displayed for the three types of patterns / patterns.
- the combination of the period of the LZS pattern and the order of the harmonics, and the fundamental frequency component and the predetermined order for at least four types of combinations Calculate the focus difference with the (third- or fifth-order) harmonic components, and create a simultaneous equation using the focus difference and the combination of the combinations shown in Table 2 below; You need to solve it.
- the Zernike sensitivity of Z 9 , ZIG Z 25 and Z 36 to the focus difference between the first fundamental frequency component and the third harmonic component is 2, ⁇ 2 , T2 ⁇ 2 respectively, and 1.0 ⁇ mL ZS pattern
- even-order spatial frequency components do not exist in the LZS pattern with a duty of 50% basically, so that the odd-order spatial frequency components are used as the predetermined-order spatial frequency components. It is desirable to use components.
- the slit 122 is used as the measurement pattern.
- the present invention is not limited to this, and a pinhole pattern may be used.
- the diameter of the pinhole pattern is about twice (400 nm or less) the width of the pinhole pattern in order to secure the same level of light quantity as the slit 122.
- the slit plate is provided at a plurality of focus positions.
- the aerial image measurement was performed by scanning 90, but the actual aberration of the projection optical system PL, for example, the aberration amount of another even function aberration was measured while changing the aberration amount of a part of the even function aberration. It is also possible. Specifically, for example, changing the low-order even function aberration components such as Z 9, other aberrations value as an evaluation amount of Z 9 to provide a peak amplitude of each frequency component, for example, higher order even such Z 16 The amount of functional aberration can be measured.
- the projection optical system used in the recent semiconductor exposure apparatus such as the projection optical system PL used in the exposure apparatus 10 in the first and second embodiments, is driven for correcting aberration as described above.
- Built-in element 20 (see Fig. 2).
- the drive element 20 has different types of aberration that can be corrected depending on the number of axes that can be driven and the degree of freedom.
- the latest projection optical system that is, the projection optical system PL
- the latest projection optical system is equipped with the drive element 20 for multiple lens elements. and is, spherical aberration Z 9, Zi6, coma Z 7, Z 8, Z 14 , Z 15, Dace! ⁇ It is possible to adjust the aberration amount of various types of aberration such as Z 2 and Z 3 to desired values.
- the phase delay level of Zi6 represented by the solid line has an extreme value when the coordinate value of the pupil position is ⁇ 0.525, and the value is 0.447. It has become.
- FIG. 12 shows calculation results when the amplitude of the fundamental frequency component of the aerial image intensity is calculated by simulation when Z 9 is changed.
- NA 0.78
- ⁇ 0.1
- ⁇ 193 nm
- the measurement mark was 0.235 m LZS.
- the aerial image measurement is executed by setting Z 9 as the first aberration of the projection optical system PL to a plurality of aberration amounts, and the measured aerial image, that is, the predetermined value included in the light intensity signal is determined.
- the change amount of the position the magnitude of the frequency component is maximum calculated by Z 9 terms, it is possible to calculate the Z 16 of the amount of change in these positions as a second aberration as an evaluation amount.
- Zl6, Z 25, Z 36 can be obtained each of the aberration.
- ⁇ 2 «21 ⁇ 16 + « 22 ⁇ 25 + «23 ⁇ 36
- the measurement may be performed by driving the driving element 20 of the projection optical system PL to change the aberration.
- Z 4 is an aberration equivalent to a focus (defocus), but Z 4 is changed without changing the focal length on the image plane side of the projection optical system PL, that is, the position of the image plane in the direction of the optical axis AX. It can be given as aberration fluctuation in the projection optical system PL. That is, Z 4 may be changed instead of Z 9 .
- the distance between the projection optical system PL and the aerial image measurement device 59 is set. Even function aberrations can be measured while keeping the separation at the same distance, so that even if the telecentricity (illumination telecentricity) of the illumination optical system is oblique, the image does not shift during defocusing. Therefore, it is possible to measure the aberrations of even and odd functions by simultaneously measuring the image contrast and the image position Z 9 of the projection optical system PL in the state of occurrence of a plurality of Z 9 while step simultaneously. This is an important feature especially in an illumination optical system having a micro fly's eye lens.
- a light-shielding disk that cuts the 0th-order light is equivalent to the numerical aperture (coherence factor ⁇ value) of the illumination optical system and has a size of about 0.004 to 0.05 in the pupil plane. Since it is located at the center, if the illumination telecentric is not slanted, the illumination light IL will be reduced if the numerical aperture ( ⁇ value) of the illumination optical system is reduced, especially when it is set to a value between 0.004 and 0.05. This is because the above measurement cannot be realized.
- FIGS. 14A, 14B, 15A, 15B and the like Next, a third embodiment of the present invention will be described with reference to FIGS. 14A, 14B, 15A, 15B and the like.
- the exposure apparatus according to the third embodiment is different from the above-described first and second embodiments in the operation of measuring the aberration of the projection optical system PL. It is almost the same as the exposure apparatus 10 of the embodiment. Therefore, in order to avoid redundant description, the following description focuses on differences from the first and second embodiments. Also, for the same purpose, the same reference numerals are used for the same or equivalent components, and the description thereof will be omitted.
- the third embodiment is different from the first and second embodiments in the configuration of a reticle mark plate as a mark holding member and a slit as a measurement pattern.
- a reticle mark plate RFM ' is used instead of the reticle mark plate RFM
- a slit 122' is used instead of the slit 122. .
- FIG. 14A shows the total number on the reticle mark plate RFM 'in the third embodiment.
- An example of the measurement mark is shown.
- the measurement marks on reticle mark plate RFM 'in include one LZS pattern LS 1 as the first periodic pattern and a pair of LZS patterns LS 2 as the second periodic pattern.
- a pair of LZS patterns S 3 are arranged in parallel in a direction orthogonal to the periodic direction.
- the LZS patterns LS1 to LS3 are 50% duty patterns having different periods from each other.
- the pair of LZS patterns LS 2 are arranged so that the phase difference between them in the periodic direction is substantially zero so as to sandwich the L / S pattern LS 1, and the pair of LZS patterns LS 3 also The LS 2 is arranged so that the phase difference between the two in the periodic direction is substantially zero.
- Each of the LZ S patterns LS 1 to LS 3 is set so that the total length of the aerial image in the periodic direction is smaller than 12 jUm, and the respective X axis directions (the periodic directions of the LZS patterns LS 1 to LS 3).
- the length of the aerial image (direction perpendicular to the plane) is about 2; Um, and the gap between the aerial images of the LZS patterns LS1 to LS3 is about 1 m.
- FIG. 14B shows an example of the slit plate 90 ′ when performing aerial image measurement in the aberration measurement method according to the third embodiment.
- a slit 122 ′ having a predetermined width 2D extending in the X-axis direction is formed in the slit plate 90 ′.
- the slit 122 ' is formed such that its length in the X-axis direction is longer than the length of the entire aerial image in the X-axis direction of the LZS patterns LS1, LS2 (two), LS3 (two). ing.
- a measurement mark in which a plurality of LZS patterns LS "! To LS3 having different periods are arranged in parallel is used in the same manner as in the first and second embodiments (the same as the measurement mark PM). ), The measurement mark is illuminated by the illumination light IL with all of these patterns positioned within the effective visual field of the projection optical system PL. In this way, the space of the measurement mark is transmitted through the projection optical system P. An image is formed.
- Main controller 50 collectively collects the aerial images as shown in FIG. 14B. While scanning by the slit 122 ', the illumination light via the measurement mark obtained through the slit 122' is photoelectrically detected by the aerial image measurement device 59 (first step). In this way, the aerial image measurement device 59 can detect the light intensity signal P corresponding to the combined aerial image intensity including the components of the aerial image of each LZS pattern. The main controller 50 analyzes the frequency of the combined aerial image intensity based on the light intensity signal P obtained from the aerial image measurement device 59 to obtain the magnitude of the spatial frequency component corresponding to each ZS pattern. Thus, the amount of aberration of the projection optical system PL is measured, and the imaging characteristics of the projection optical system PL are adjusted based on the amount of aberration.
- the ratio of the maximum period to the minimum period in the plurality of LZS patterns is 3 times or less.
- the cycle of the L / S pattern LS1 is the largest, and the cycle of the LZS pattern LS3 is the smallest. Therefore, in reticle mark plate RFM ', the period of LZS pattern LS1 is set to be three times or less the period of L / S pattern LS3.
- the primary fundamental frequency component by the L / S pattern LS3 having the minimum period the primary fundamental frequency component by the L / S pattern LS3 having the minimum period
- the third harmonic component of the LZS pattern LS 1 having the maximum period can be prevented from being mixed.
- (LS1, LS2, LS3) (0.225, 0. 1 75, 0.125), (0.275, 0.225, 0.150), (0.275, 0.250, 0.20), (0.5450, 0.350, 0.300) ), (0.60, 0.450, 0.325), (0.600, 0.500, 0.400).
- the LS patterns with different periods are LS "! ⁇ LS3
- LZS patterns with different periods are shown, there are four or more LZS patterns with different periods (for example, LZS patterns LS 1 to LS 3 have different periods and include S 4, LS 5, etc.). good.
- the position for scanning the slit 122 ′ is changed to a plurality of positions in the direction of the optical axis AX of the projection optical system PL, and the first step described above is performed.
- main controller 50 creates a contrast curve corresponding to each of LZS patterns LS 1 to LS 3 based on the magnitude (here, contrast) of the fundamental frequency component obtained at each position. .
- FIG. 15A shows an example of a contrast curve in two LZS patterns LS 1 and LS 2 having different periods. As shown in Fig. 15A, there is a displacement between the position where the contrast is maximum in the LZS pattern LS1 and the position where the contrast is maximum in the LZS pattern LS2, that is, a focus difference occurs. ing. In FIG. 15A, the position where the contrast curve of the LZS pattern LS1 is maximum is set as the origin.
- FIG. 15B shows an example of the relationship between the focus difference and the amount of aberration of the even function aberration.
- the horizontal axis indicates the aberration amount of the even-function aberration
- the vertical axis indicates the focus difference between the LZS pattern LS 1 and the LZS pattern LS 2 caused by the amount of the aberration.
- the aberration amount of the even function aberration and the focus difference between their best focus positions are in a proportional relationship, and if this force difference (for example, R ′) is measured, At this time, the amount of aberration of the even function aberration can be obtained.
- Such a relationship between the focus difference and the amount of aberration of the even function aberration can be obtained by an aerial image simulation using a mathematical model of the projection optical system P, and this relationship is stored in the memory 51 in advance. It shall be stored.
- the main controller 50 creates a contrast curve as shown in FIG. 15A for each pattern, and calculates a displacement between the patterns at a position where the values of the curves are maximum, that is, a focus difference. Based on the relationship shown in FIG. 15B stored in the memory 51, the amount of even function aberration is obtained.
- main controller 50 determines the relative position of the first fundamental frequency component of L / S pattern LS 1 having the longest pitch as a reference to the other LZS patterns LS 2, LS 3, S 4, and LS 5.
- the first focus difference SF, the second focus difference SF 2 , the third focus difference SF 3 , and the fourth focus difference (5F 4 are obtained as described above.
- the relationship with multiple even-function aberrations (Z 9 , Z 16 , Z 25 , Z 36 ) such as higher-order spherical aberration Z 9 and higher-order spherical aberration Z 16 is expressed by a simultaneous equation expressed by the following equation (21).
- the main controller 50 solves this equation (21) to obtain each even function aberration (Z 9 , Z 16 , Z 25 , Z 36 ).
- the coefficient ai ⁇ a, ⁇ ⁇ ⁇ ri ⁇ r4, ⁇ 5 ⁇ 4 is the amount of the sensitivity of the components of the even function aberration (spherical aberration) for the change of focus difference.
- the coefficient 1 is a low-order spherical surface with respect to a change in the first focus difference S Fi (the phase difference between the primary fundamental frequency component of the LZS pattern LS1 and the primary fundamental frequency component of the LZS pattern LS2).
- 9 shows the sensitivity of aberration Z9.
- each even function aberration is measured based on the focus difference in each LZS pattern.
- the present invention is not limited to this.
- Each even-function aberration may be obtained based on the magnitude of the spatial frequency component of the order. Aerial image measurement by scanning the slit at the position where the slit exists).
- main controller 50 executes the above-described first step, and extracts a spatial frequency component corresponding to each LZS pattern by performing frequency analysis on the measured combined spatial image intensity.
- main controller 50 uses, for example, the phase of the fundamental frequency component corresponding to L ZS pattern LS 1 having the longest cycle as a reference, and uses other LZS patterns LS 2, LS 3, LS 4, LS 5 ⁇ ⁇ ⁇
- the relative phase differences with the fundamental frequency component are denoted as a first phase difference, a second phase difference ⁇ 2 , a third phase difference ⁇ 3 , and a fourth phase difference ⁇ 4, respectively.
- the coefficients I to Q, ⁇ ⁇ to ⁇ ri to r 4 , and Si S are each odd-function aberration (coma aberration) is the sensitivity of the phase difference change with respect to components.
- the coefficient Oil has a first-order fundamental frequency component of the low-order coma first phase difference with respect to Z 7 O (LZS pattern LS 1, 1 of LZS pattern LS 2
- LZS pattern LS 1, 1 of LZS pattern LS 2 shows the sensitivity of the change in the phase difference with the fundamental frequency component.
- n or more phase differences may be measured.
- n or more phase differences may be measured.
- the least-squares method is a method of obtaining S that minimizes the inner product (AS-p, AS- ⁇ ) between the vectors AS- ⁇ when expressed in a vector format as in the above equation (24). Note that the above equation (24) is transformed into the following equation (25).
- the matrix AT is the transposed matrix of the matrix A. Since ATA is an n-dimensional square matrix and ⁇ is an ⁇ -dimensional vector, the above equation (25) can solve its solution, and thus an ⁇ -dimensional vector S can be obtained.
- the ⁇ -dimensional vector S is represented by the following equation (26). Therefore, the main controller 50 calculates the following equation (26) to determine the amount of aberration of each odd function aberration.
- the aberration measurement method using the least-squares method is not limited to the odd-function aberration as described above. It is needless to say that the present invention can also be used for the measurement of each even function aberration of the embodiment (including the embodiment).
- the left side of the simultaneous equations in the above equation (23) is not the phase difference between the LZS patterns, but the displacement of the position where the contrast between the patterns is maximized.
- scanning is performed on a spatial image of a measurement mark including a plurality of periodic patterns LS 1, LS 2-′′ which are arranged in parallel and have different periods.
- the length of the measurement pattern 1 22 ' is longer than the length of the aerial image of the measurement mark. Therefore, by using this measurement pattern 122 ', it is possible to obtain the light intensity signal of the illumination light through all the periodic patterns in one scan. Measurement time of the projection optical system PL (even function aberration including low-order and high-order spherical aberrations and odd-function aberration including low-order and high-order coma aberrations) is reduced. Will be able to do it.
- the amplitude of the spatial frequency component may be used as the evaluation amount of the magnitude, or the contrast may be used as the evaluation amount.
- Contrast is the amplitude of the spatial frequency component divided by the DC component included in the light intensity signal.
- the spatial image of the measurement mark of the LZS pattern having the duty ratio of 1: 1 is measured at a plurality of focus positions, and Fourier transform is performed on the spatial image to obtain the spatial image.
- the Fourier coefficients of the fundamental frequency component and the third harmonic component included in the image are determined, and the contrast curve between the fundamental frequency component and the third harmonic component is determined based on the Fourier coefficient, and the contrast curve is maximized.
- the aberration amount of the projection optical system PL was determined based on the positional deviation of the position. In the method of obtaining the aberration of the projection optical system PL using such harmonic components, the accuracy of the duty ratio of the LZS pattern greatly affects the measurement accuracy of the aberration amount of the projection optical system P.
- Table 3 shows the phase difference between the primary fundamental frequency component and its harmonic component in the LZS pattern with different duty ratios, the so-called lateral shift (this amount is the coma aberration of the projection optical system PL). (Corresponding to odd function aberrations such as).
- the wavelength of the illumination light I is 1933 nm
- the coherence factor ⁇ is 0.3
- the numerical aperture of the projection optical system PL is 0.78
- the period of the aerial image of the LZS pattern is 1 ⁇ OjU.
- the line and space of the aerial image Are 0.5 Um 0.5 jUm, 0.45 m: 0.55 ⁇ m, and 0.55 jUm: 0.45 ⁇ m, respectively.
- the amplitude ratio of the fundamental frequency component, the second harmonic component, and the third harmonic component was 0.31: 0.032: 0.071.
- the magnitude of each spatial frequency component included in the aerial image decreases as the order increases, and here, the magnitude of the third harmonic component is large It is about 30% of the total.
- ⁇ a photomultiplier tube
- the measured amount of aberration is as follows.
- Output voltage distortion due to PMT nonlinearity is also affected.
- the measured value of the lateral shift amount under the above-described conditions is shown in Table 4 below.
- the amplitude ratio of the fundamental frequency component, the second harmonic component, and the third harmonic component was 0.31: 0.030: 0.07.
- Table 5 below shows the measured values of the amount of lateral shift when the wavelength of the illumination light IL is 248 nm, the numerical aperture NA of the projection optical system PL is 0.82, and the nonlinearity of the PMT is not considered. Have been.
- the amplitude ratio of the fundamental frequency component, the second harmonic component, and the third harmonic component was 0.31: 0.053: 0.045.
- the wavelength of the illumination light IL is set to 248 nm
- the numerical aperture NA of the projection optical system PL is set to 0.82
- the amount of displacement when the nonlinearity of the PMT is considered is measured. The values are shown.
- the amplitude ratio of the fundamental frequency component, the second harmonic component, and the third harmonic component was 0.31: 0.048: 0.046.
- the measurement pattern is more slit than the pinhole pattern.
- the pattern was used.
- the exposure apparatus according to the fourth embodiment is for solving the above-mentioned disadvantages.
- the exposure apparatus according to the fourth embodiment has almost the same configuration as the exposure apparatus 10 of the first embodiment except for some parts. Therefore, in order to avoid redundant description, the following description focuses on differences from the first to third embodiments. Also, for the same purpose, the same reference numerals are used for the same or equivalent components, and the description thereof will be omitted.
- the configuration of a reticle mark plate as a mark holding member and the configuration of a slit as a measurement pattern are different from those of the first to third embodiments.
- one of the reticle marks RFM "shown in FIG. 16A to FIG. 16C or FIG. 17A and FIG. 17 is used.
- FIG. 16A shows an example of the measurement mark on the reticle mark plate RFM "in the fourth embodiment.
- the reticle mark plate RFM In the measurement mark, a light-transmitting part with a width of 4 d (portion indicated by diagonal lines) is provided periodically (period 8 d), and a light-transmitting part with a width of 2 d (portion indicated by diagonal lines) has a width d. It is provided periodically (period 8d) so as to be sandwiched between the two light-shielding parts.
- a period of 8 d and a duty ratio of 1: 1 This pattern (first period pattern), an auxiliary pattern with a period of 8 d and a duty ratio of 1: 3 (second period pattern with a different line width from the basic pattern) and force are arranged so that they coexist in the period direction. Can be regarded as being.
- FIG. 16B shows another example of the measurement mark on the reticle mark plate RFM "in the fourth embodiment.
- this reticle mark plate RFM In the measurement mark of " the light transmission part of 3 d width (portion indicated by diagonal lines) is provided periodically (period 6 d), and the light transmission part of width d (portion indicated by diagonal lines) is It is provided periodically (period 6d) so as to be sandwiched between two light-shielding portions having a width d.
- the basic pattern (first period pattern) with a duty ratio of 1: 1 with a period of 6 d and the auxiliary pattern (second period pattern) with a duty ratio of 1: 5 with a period of 6 d are: It can be considered that they are arranged so as to be mixed in those periodic directions.
- FIG. 16C shows another example of the measurement mark on the reticle mark plate RFM "in the fourth embodiment.
- this reticle mark plate RFM In the measurement mark of, an 8 d wide light transmitting part (portion indicated by diagonal lines) is provided periodically (period 16 d), and two 2 d wide light transmitting parts (portion indicated by diagonal lines) Are periodically (with a period of 16 d) sandwiched by the light-shielding portions having a width of 2 d and sandwiched by the two light-shielding portions having a width of d.
- the basic pattern (1st period pattern) with a period of 16 d and a duty ratio of 1: 1 and the auxiliary pattern (2nd period pattern) with a period of 16 d and a duty ratio of 1: 7 Can be considered to be arranged so as to be mixed in their periodic directions.
- FIG. 17A shows another example of the measurement mark on the reticle mark plate RF M "in the fourth embodiment.
- this reticle mark plate In the measurement mark of “R FM” a 5 d wide light transmissive part (portion indicated by hatching) is provided periodically (period 1 O d), and two light transmissive parts (width d (A portion shown by a line) are provided periodically (period 10 d) so as to sandwich the light-shielding portion having the width d and to be sandwiched between the two light-shielding portions having the width d.
- the basic pattern (first period pattern) with a period of 10 d and a duty ratio of 1: 1 and the auxiliary pattern with a period of 1 Od and a duty ratio of 1: 9 are in the direction of their period. Can be regarded as being arranged so as to be mixed.
- FIG. 17B shows another example of the measurement mark on the reticle mark plate RFM "in the fourth embodiment.
- this reticle mark plate RFM In the measurement mark, a light-transmitting part (portion indicated by diagonal lines) with a width of 12 d is provided periodically (period 24 d), and three light-transmitting parts (width indicated by diagonal lines) with a width of 2 d are provided.
- the interval (light-shielding portion) is set to 2 d each, and the interval (light-shielding portion) to the light-shielding portion having a width of 12 d is set to d (period 24 d). I have.
- the basic pattern (1st period pattern) with a duty ratio of 1: 1 with a period of 24 d and the auxiliary pattern (2nd period pattern) with a duty ratio of 1: 11 with a period of 24 d are arranged so as to be mixed in their periodic directions.
- FIGS. 16A to 16C, 17A and 17B a method of designing a measurement mark as shown in FIGS. 16A to 16C, 17A and 17B will be described.
- the measurement marks of the basic pattern only the basic pattern (periodic pattern consisting of a light-shielding part and light-transmitting part with a width of 4 d) with a period of 8 d and a duty ratio of 1: 1 is used.
- the aerial image of the measurement mark is scanned with a slit pattern in the same manner as in the first and second embodiments, and the aerial image of the measurement mark is measured using the aerial image measurement device 59, or Analyze by simulation.
- Fig. 18 shows the analysis results when the aerial image of the measurement mark of only the basic pattern was analyzed by simulation.
- the bold square wave is reduced by the reticle pattern (reduced by the projection magnification of the projection optical system PL).
- the solid line Q shows the aerial image actually formed by the projection optical system P.
- a dotted line P indicates a light intensity signal P detected by scanning (slit scanning) by the aerial image measuring device 59.
- the light intensity signal P obtained by scanning by the aerial image measurement device 59 can be regarded as substantially reproducing an actual aerial image.
- a Fourier coefficient of a desired spatial frequency component (for example, a fundamental frequency component, a second to sixth harmonic component) is obtained. Then, when a Fourier coefficient of a desired spatial frequency component is subjected to inverse Fourier transform, a sine wave of the frequency component is obtained.
- FIG. 18 shows the fundamental frequency component thus obtained, and the second to sixth harmonic components.
- the value of each spatial frequency component is offset by 0.5.
- the wavelength of the illumination light IL is 193 nm
- the NA of the projection optical system PL is 0.82
- the coherence factor ⁇ is 0.3
- the LZS pattern is The period of the aerial image was set to 1. OjUm.
- the location where the auxiliary pattern is to be formed is specified.
- the measurement mark part corresponding to the section where the fundamental frequency component is negative and the second harmonic component is positive this is the light-shielding part
- P 8 d, ie, PZ4
- the light transmitting portion of the auxiliary pattern is provided in a portion corresponding to the section where the fundamental frequency component is negative (that is, the light shielding portion of the basic pattern) and the harmonic component is positive.
- the fundamental frequency component is negative
- Fig. 17A the fundamental frequency component
- Fig. 17B a light-transmitting part
- a light-transmitting part is provided as an auxiliary pattern at the part corresponding to the section where it is positive.
- the measurement mark as shown in Fig. 16B can be designed.
- Fig. 16B can be designed.
- the light transmission part (indicated by PZ8) is used as an auxiliary pattern in the part corresponding to the section where the fundamental frequency component is negative and the fourth harmonic component is positive.
- the measurement mark as shown in Fig. 16C can be designed.
- a light transmitting portion (PZ 10) is used as an auxiliary pattern in a portion corresponding to a section where the fundamental frequency component is negative and the fifth harmonic component is positive.
- the measurement mark as shown in Fig. 17A can be designed.
- the light transmission part (PZ12) is used as an auxiliary pattern in the part corresponding to the section where the fundamental frequency component is negative and the sixth harmonic component is positive.
- the measurement mark as shown in Fig. 17B can be designed by providing the part shown).
- the harmonic component due to the basic pattern and the auxiliary Since the phase difference in the periodic direction from the spatial frequency component due to the pattern can be made substantially zero, the harmonic component of the aerial image corresponding to the basic pattern is emphasized as a result.
- the measurement mark designed to emphasize the second harmonic component as shown in Fig. 16A is referred to as the second harmonic emphasis mark, and the third harmonic mark as shown in Fig. 16B is used.
- the measurement mark designed to emphasize the harmonic component is the third harmonic emphasis mark
- the measurement mark designed to emphasize the fourth harmonic component as shown in Figure 16C is the fourth harmonic mark.
- the measurement mark designed to emphasize the 5th harmonic component as shown in Fig. 17A is called the 5th harmonic emphasis mark, and the 6th harmonic mark as shown in Fig. 17B is used.
- the measurement mark designed to emphasize the second harmonic component is called the 6th harmonic emphasis mark.
- Fig. 24 shows the results of a simulation of aerial image measurement when the second harmonic emphasis mark with a pitch of 1.0 m (Fig. 16A) is used as the measurement mark.
- a solid line indicates an aerial image obtained through the projection optical system PL
- a dotted line indicates an aerial image obtained by slit scanning.
- Fig. 25 shows the simulation results of aerial image measurement when the third harmonic emphasizing mark with a pitch of 1.0 m (Fig. 16B) is used as the measurement mark.
- Fig. 16B shows the simulation results of aerial image measurement when the third harmonic emphasizing mark with a pitch of 1.0 m
- the magnitude of the third harmonic component is larger than the magnitude of the third harmonic component shown in Fig. 20.
- the third harmonic component is more emphasized. Note that the simulation results shown in Figs. 24 and 25 are all calculated under the conditions that the NA of the projection optical system PL is 0.78, the wavelength of the illumination light I is 1933 nm, and the coherence factor is 0.3. It was done.
- a predetermined width 2D extending in the X-axis direction and a predetermined length 2D are provided on the slit plate 90 "constituting the aerial image measurement device 59.
- a slit 122a, a slit 122b having a predetermined width 2D and a length L extending in the Y-axis direction, and a pinhole pattern 123 are formed, where 2D is, for example, 200 nm or less. And L is set to, for example, 16 m.
- the slit 122 b is arranged on the one X side and + Y side of the slit 122 a at a distance of about 4 ⁇ m.
- the diameter of the pinhole pattern is set to be 400 ⁇ m or less (about twice as large as the slits 122a and 122b).
- the aerial image measurement operation is performed using the measurement pattern obtained by combining the slit pattern and the pinhole pattern as described above.
- a slit is used.
- the aerial image measurement operation may be performed using the 1 2 2 a (or the slit 1 2 2 b) as the measurement pattern. (In Figure 26 B, 0.2 ⁇ m LZS pattern (5 lines) 3 sets of marks Aerial image is measured).
- the slit pattern can receive a larger amount of light than the pinhole pattern, has a high SZN ratio of the measured value, and can shorten the measurement time.
- the pinhole pattern 123 is located at a position where the illumination light IL (aerial image) through the measurement mark during scanning is not incident, as shown in FIG. 26B.
- the slit patterns 1 2 a, 1 2 b and the pinhole pattern 1 2 3 are used when the slit patterns 1 2 a, 1 2 b are relatively scanned with respect to the aerial image to be measured.
- the slit patterns 122a and 122b are used as the aerial image. Are arranged so as not to interfere with each other.
- the aerial image The aerial image measurement can be executed by appropriately selecting a measurement pattern according to the measurement purpose, measurement time, measurement accuracy, and the like.
- the measurement marks as shown in FIGS. 16 to 16C, FIG. 17A, and FIG. 17B described above are used, and the slits 122a, 122b and pin holes are used.
- the pattern 123 is appropriately selected as a measurement pattern, and the aerial image measurement operation is performed in the same manner as in the above embodiments (first step), and the period of the basic pattern included in the detected light intensity signal is determined.
- an odd function aberration such as coma of the projection optical system PL or a spherical aberration, etc.
- the harmonic component contained in the light intensity signal is larger than when measuring the aerial image of a monotonic non-ZS pattern (measurement mark of only the basic pattern), so the SZN ratio is increased.
- the influence of the nonlinearity of the PMT and the line width error of the measurement mark on the measurement result can be reduced. Therefore, it becomes possible to accurately measure the aberration of the projection optical system PL.
- the amount of aberration of the odd function aberration can be calculated based on the phase difference between the fundamental frequency component and the harmonic component described above.
- the amount of aberration of the optical axis AX of the projection optical system PL between the position where the magnitude (amplitude or contrast) of the fundamental frequency component is maximum and the position where the magnitude (amplitude or contrast) of the harmonic component is maximum It can be calculated on the basis of a displacement or the like in the direction of.
- the ratio of the magnitude of the fundamental frequency component, the magnitude of the second harmonic component, and the magnitude of the third harmonic component is 0.11: 0.18: 0.17. became.
- the magnitude of the fundamental frequency component is reduced to about 1, but the magnitude of the second-order harmonic component is smaller than the measurement result of the simple square wave measurement mark shown in Table 3 above.
- the magnitude is about six times, the magnitude of the third harmonic component is more than twice, and the magnitude of the harmonic component is remarkably large. Since the magnitude of each spatial frequency component is almost the same, the influence of the nonlinearity (10%) of ⁇ is reduced.
- the change in sensitivity change in the amount of lateral displacement due to the line width error (line width 100% ⁇ 90%) has also been significantly reduced, and the change in sensitivity has only increased in proportion to the line width change. .
- the wavelength of the illumination light IL is 248 nm (corresponding to the oscillation wavelength of a krF excimer laser), and the NA of the projection optical system PL is 0.82.
- Table 8 below shows the simulation results. (Table 8)
- the ratio of the magnitude of the fundamental frequency component, the magnitude of the second harmonic component, and the magnitude of the third harmonic component is 0.13: 0.19: 0.11, and became. That is, although the magnitude of the fundamental frequency component is reduced to about 12 compared to the simple square wave measurement mark shown in Table 4 above, the magnitude of the second harmonic component is about The magnitude of the sixth and third harmonic components is more than twice, and the magnitude of the harmonic components is remarkably large. Since the magnitude of each spatial frequency component is almost the same, the influence of the nonlinearity (10%) of the PMT is reduced. In addition, the sensitivity change (change in the amount of lateral shift) due to the line width error (line width 100% ⁇ 90%) has also been significantly reduced, and the change in sensitivity has only increased in proportion to the line width change.
- the wavelength of the illumination light IL was set to 193 nm (equivalent to the oscillation wavelength of an ArF excimer laser), and the NA of the projection optical system PL was set to 0.78.
- Table 9 shows the results of the simulation when this was done. (Table 9)
- the ratio of the magnitude of the fundamental frequency component, the magnitude of the second harmonic component, and the magnitude of the third harmonic component is 0.18: 0.13: 0.16. became. That is, although the magnitude of the fundamental frequency component is reduced to about 2/3 compared to the simple square wave measurement mark shown in Table 5 above, the magnitude of the second harmonic component is The magnitude of the second and third harmonic components is three times or more, and the magnitude of the harmonic components is remarkably large. Since the magnitude of each spatial frequency component is almost the same, the influence of the nonlinearity (10%) of the PMT is reduced. In addition, the sensitivity change (change in the amount of lateral shift) due to the line width error (line width 100% ⁇ 90%) has also been significantly reduced, and the change in sensitivity has only increased in proportion to the line width change.
- the wavelength of the illumination light IL was set to 248 nm (corresponding to the oscillation wavelength of a KrF excimer laser), and the NA of the projection optical system PL was set to 0.82.
- Table 10 shows the results of the simulation in this case. (Table 10)
- the ratio of the magnitude of the fundamental frequency component, the magnitude of the second harmonic component, and the magnitude of the third harmonic component is 0.20: 0.14: 0.10.
- the magnitude of the fundamental frequency component is reduced to about 23, but the magnitude of the second harmonic component is about
- the magnitude of the second and third harmonic components is three times or more, and the magnitude of the harmonic components is remarkably large. Since the magnitude of each spatial frequency component is almost the same, the influence of the nonlinearity (10%) of the PMT is reduced.
- the sensitivity change (change in the amount of lateral shift) due to the line width error (line width 100% ⁇ 90%) has also been significantly reduced, and the change in sensitivity has only increased in proportion to the line width change.
- the size of the harmonic component is increased because the measurement mark includes the periodic pattern having the period corresponding to the harmonic component of the aerial image.
- the SZN ratio can be increased, so that the effects of the non-linearity of the PMT and the manufacturing errors of the measurement marks (reticle mark plate, etc.) can be reduced, and the aberration of the projection optical system PL can be accurately corrected It can measure well.
- the non-linearity of the PMT is measured in advance to further improve the measurement of the aberration of the projection optical system PL, and the spatial frequency component of a predetermined order of the measured aerial image is measured.
- Cancel magnitude and phase, measured nonlinearity It is also possible to make corrections as follows.
- Figure 28 shows the input / output characteristics of the PMT. As shown in FIG. 28, since the input / output characteristics of the PMT are not linear, the characteristics can be measured in advance and the output voltage of the PMT can be corrected. If the line width error of the measurement mark is measured in advance, the sensitivity to aberration can be predicted by simulation.
- the size of the measurement mark of the fourth embodiment described above is all the size of the aerial image obtained via the projection optical system PL, and the actual size of the measurement mark is the projection magnification of the projection optical system PL. Since it is the reciprocal of (1 Z 4), that is, about four times, even existing inspection equipment can measure those line widths with sufficient accuracy.
- the auxiliary pattern is provided in the light-shielding part of the basic pattern.
- the present invention is not limited to this.
- a light-shielding portion is newly formed as the auxiliary pattern.
- a transmissive mask is used.
- the present invention can be applied to a reflective mask.
- the projection optical system PL it is desirable to adjust the projection optical system PL based on the amount of aberration measured by the aberration measurement method of each of the above-described embodiments, and to originally reduce the aberration of the projection optical system PL to zero.
- some aberration remains even after the adjustment of the projection optical system PL. Therefore, regarding the operation of the exposure apparatus 10, after adjusting the projection optical system P, the aberration remaining in the projection optical system PL is measured again as the initial aberration amount by using the aberration measurement method of the first embodiment. Keep it.
- the exposure apparatus 10 periodically measures the fluctuation of aberration by the aberration measuring method of the first embodiment, and when the aberration changes due to aging, the main controller 50 , ..
- the controller 78 May be driven via the controller 78 to adjust the imaging characteristics of the projection optical system PL such that their aberration amounts return to the initial aberration amounts.
- the reticle pattern is transferred by setting at least one aberration of the projection optical system PL to a predetermined value other than zero (the above-described initial aberration amount)
- the aberration amount is returned to the predetermined value.
- the temporal change of the aberration of the projection optical system PL occurs due to expansion and contraction due to a change in the temperature of the lens barrel of the projection optical system PL, and a minute error in the position of the drive element 20 of the lens element 13 1. It is sufficient to consider the change in low-order aberrations.
- the initial aberration amount after the adjustment of the projection optical system P is obtained by aerial image measurement, and when periodic aberration measurement is performed, the temporal change of the low-order aberration is detected by referring to this, and the low-order aberration is detected. May be returned to the initial aberration amount. It is desirable from the viewpoint of measurement stability that the periodic aberration measurement be performed using the measurement mark formed on the reticle mark plate RFM or the like.
- coma or spherical aberration is measured.
- the present invention is not limited to this. If the aberration is represented by each term in the fringe Zernike polynomial, the aberration amount Can be measured.
- the above-mentioned aberration measurement was performed in the above, measurement marks were placed at each position in the illumination area corresponding to each of the plurality of measurement points in the exposure area, and the aberration was measured for each measurement point. Is also good.
- aberration measurement at a plurality of measurement points may be performed using only one measurement mark.
- a reticle mark plate provided with a plurality of measurement marks in substantially the same arrangement as a plurality of measurement points is provided.
- the above-described exposure is performed by using a reticle (or reticle) or by step-moving a reticle mark plate (or reticle) on which a plurality of measurement marks are arranged at predetermined intervals in the non-scanning direction (X-axis direction) in the Y-axis direction. Multiple regions set in two dimensions within the region The aberration measurement at the measurement point may be performed.
- the illumination condition of the measurement mark has not been described. However, for example, it is preferable to set the illumination condition to a small coherence factor ( ⁇ value) (so-called small ⁇ illumination). At this time, the ⁇ value is preferably set to about 0.1 or less.
- the tilt stage 38 is driven to obtain the above-described light intensity signals at a plurality of focus positions.
- the projection optical system is used.
- a plurality of light intensity signals may be obtained by adjusting the spherical aberration of the system. That is, the present invention is not limited to the above-described second and third embodiments.
- the spherical aberration of the projection optical system PL may be adjusted.
- the aerial image measurement device used in each of the above embodiments is not limited to the configuration shown in FIG. 3, but may be any.
- the reticle stage is used instead of driving the wafer stage WS to obtain the above-mentioned light intensity signal.
- RS ⁇ may be driven.
- the present invention is not limited to this.
- EUV light, hard X-rays, charged particle beams such as electron beams and ion beams can be used as illumination light for exposure.
- the above-mentioned measurement mark is of a reflection type, and the aerial image measuring device 59 converts the wavelength of EUV light with, for example, fluorescence to obtain the above-mentioned light intensity signal.
- the present invention is not limited to this, and an equal-size or enlargement system may be used as the projection optical system.
- a reflection system, and the projected image may be not only an inverted image but also an erect image.
- the same reduction as in the above embodiments is performed.
- the projection magnification may be 15 or 1 Z6. In such a case, the size and arrangement of the measurement mark and the reference mark are determined according to the projection magnification. It is desirable to determine.
- the illumination optical system composed of multiple lenses and the projection optical system PL are incorporated into the main body of the exposure apparatus for optical adjustment, and the reticle stage RST and wafer stage WST, which consist of many mechanical parts, are attached to the main body of the exposure apparatus.
- the exposure apparatus 100 of each of the above embodiments can be manufactured by connecting wires and pipes and further performing comprehensive adjustment (electrical adjustment, operation check, and the like). It is desirable to manufacture the exposure apparatus in a clean room where the temperature and cleanliness are controlled.
- the present invention is not limited to this, and the mask and the wafer are kept stationary while the mask and the wafer are stationary.
- the present invention can also be applied to other types of exposure apparatuses such as a step-and-repeat type exposure apparatus that transfers a pattern onto a wafer and sequentially moves the wafer.
- the present invention is not limited to an exposure apparatus for manufacturing a semiconductor, but also provides an exposure apparatus for transferring a device pattern onto a glass plate and a thin-film magnetic head used for manufacturing a display including a liquid crystal display element.
- the present invention can be applied to an exposure apparatus for transferring a device pattern used for a semiconductor wafer onto a ceramic wafer, and an exposure apparatus used for manufacturing an image pickup device (such as a CCD), an organic EL, a micromachine, a DNA chip, and the like.
- an image pickup device such as a CCD
- an organic EL organic EL
- micromachine a micromachine
- DNA chip a DNA chip
- micro devices such as semiconductor devices
- glass substrates or silicon wafers are used to manufacture reticles or masks used in light exposure equipment, EUV exposure equipment, X-ray exposure equipment, electron beam exposure equipment, etc.
- the present invention can be applied to an exposure apparatus for transferring a circuit pattern.
- a transmissive reticle is generally used in an exposure apparatus that uses DUV (far ultraviolet) light or VUV (vacuum ultraviolet) light, and quartz glass, fluorine-doped quartz glass, or fluorite is used as a reticle substrate.
- DUV far ultraviolet
- VUV vacuum ultraviolet
- quartz glass, fluorine-doped quartz glass, or fluorite is used as a reticle substrate.
- Magnesium fluoride, quartz, or the like is used.
- a transmission type mask stencil mask, membrane mask
- silicon wafer is used as a mask substrate.
- the present invention may be applied to an immersion type exposure apparatus or the like disclosed in, for example, International Publication W09949540 in which a liquid is filled between a projection optical system PL and a wafer.
- this immersion type exposure apparatus it is preferable to perform the above-described measurement in a state where the liquid is filled between the projection optical system PL and the slit plate 90.
- a wafer stage is arranged at each of an exposure position where a reticle pattern is transferred via a projection optical system and a measurement position (alignment position) where a mark is detected by a wafer alignment system.
- the present invention may be applied to a twin wafer stage type exposure apparatus capable of executing the steps substantially in parallel.
- This twin wafer stage type exposure apparatus is disclosed, for example, in Japanese Patent Application Laid-Open No. Hei 10-214 783 and the corresponding US Pat. No. 6,341,077, or International Publication WO98 / 4007. No. 791, and corresponding U.S. Patent Nos. 6,262, 796, etc., and to the extent permitted by national law in the designated country or selected elected country specified in this international application. The disclosure of the United States patent is incorporated herein by reference.
- the semiconductor device includes a step of designing the function and performance of the device, a step of manufacturing a reticle based on the design step, a step of manufacturing a wafer from a silicon material, and a step of forming a reticle pattern by the exposure apparatus of the above-described embodiment. It is manufactured through the steps of transferring to wafers, device assembling steps (including dicing, bonding, and packaging processes) and inspection steps.
- the aberration measurement method of the present invention is suitable for measuring the aberration of a projection optical system. Further, the exposure method and apparatus of the present invention are suitable for performing exposure using a projection optical system.
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Abstract
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JP2004562876A JPWO2004059710A1 (ja) | 2002-12-24 | 2003-12-18 | 収差計測方法、露光方法及び露光装置 |
AU2003289427A AU2003289427A1 (en) | 2002-12-24 | 2003-12-18 | Aberration measuring method, exposure method and exposure system |
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WO2006009188A1 (ja) * | 2004-07-23 | 2006-01-26 | Nikon Corporation | 像面計測方法、露光方法及びデバイス製造方法、並びに露光装置 |
WO2006040890A1 (ja) * | 2004-10-08 | 2006-04-20 | Nikon Corporation | 露光装置及びデバイス製造方法 |
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