WO2004043876A1 - 炭化ケイ素焼結体及びその製造方法 - Google Patents
炭化ケイ素焼結体及びその製造方法 Download PDFInfo
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- WO2004043876A1 WO2004043876A1 PCT/JP2003/014371 JP0314371W WO2004043876A1 WO 2004043876 A1 WO2004043876 A1 WO 2004043876A1 JP 0314371 W JP0314371 W JP 0314371W WO 2004043876 A1 WO2004043876 A1 WO 2004043876A1
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Definitions
- Patent application title Japanese Patent Application filed by the same applicant, namely, Japanese Patent Application No. 2002-328214 (filing date: November 12, 2002), Japanese Patent Application No. 2003- No. 344849 (filing date: October 2, 2003), the contents of which are incorporated herein by reference.
- the present invention relates to a silicon carbide sintered body and a method for producing the same.
- the silicon carbide sintered body is used for various applications, the application range of the silicon carbide sintered body is limited in a certain technical field. For example, in applications that are exposed to temperatures as high as 1420 ° C, which is the melting point of silicon, there was a concern that residual silicon in the silicon carbide sintered body would be eluted. Therefore, the use of silicon carbide sintered bodies has been limited.
- Patent Documents 1 and 2 Several techniques have been proposed as means for solving the above-mentioned problems (for example, see Patent Documents 1 and 2).
- Patent Document 1 JP-A-59-184768
- Patent Document 2 JP-A-63-30386
- a set of the silicon carbide sintered body is used. Uniform dispersibility of the silicon particles in the weave has been required.
- the present invention relates to the following items.
- the porosity (%) (area of the silicon particles (area of the silicon particles + area of the silicon carbide particles)
- the porosity calculated as X 100 is 15% or more and 30% or less
- a method for producing a silicon carbide sintered body using a reaction sintering method comprising: (1) pouring a slurry-like mixed powder obtained by dissolving and dispersing silicon carbide powder in a solvent into a molding die. (2) a step of calcining the obtained green body at 1200 ° C. to 1800 ° C. in a vacuum atmosphere or an inert gas atmosphere to obtain a calcined body 1; ) A step of impregnating the obtained calcined body 1 with a carbon source; (4) a step of calcining the calcined body 2 impregnated with a carbon source; and (5) a step of melting the calcined body 2 obtained.
- FIG. 1 shows the SiC grains in the structure of the silicon carbide sintered body obtained in Production Example 1.
- FIG. 4 is a diagram showing a dispersion state of particles and Si particles.
- FIG. 2 is a diagram showing a dispersion state of SiC particles and Si particles in the structure of the silicon carbide sintered body obtained in Production Example 2.
- the present inventors have found that a calcined body containing silicon carbide and carbon is impregnated with metal silicon, and the carbon and silicon are reacted and sintered to obtain a silicon carbide sintered body. Further, it has been found that the above-mentioned problem can be solved by providing a heating step for removing unreacted silicon.
- the present invention will be described in more detail. First, the components used for producing the silicon carbide sintered body of the present invention will be described.
- Examples of the silicon carbide powder used in the present invention include rhombus, type 3; amorphous, a mixture thereof, and the like. Further, in order to obtain a high-purity silicon carbide sintered body, it is preferable to use a high-purity silicon carbide powder as the raw material silicon carbide powder.
- the grade of the i3 type silicon carbide powder is not particularly limited, and for example, generally commercially available ⁇ type silicon carbide can be used.
- the particle diameter of the silicon carbide powder is preferably small from the viewpoint of high density, specifically, about 0.01 // 111 to 10 ⁇ 111, more preferably 0.05 / zm to 5 ⁇ . It is. If the particle size is less than 0.1 ⁇ , it is difficult to handle in the processing steps such as weighing and mixing, and if it exceeds 10 / m, the specific surface area is small, that is, the contact area with the adjacent powder is small. It is not preferable because it becomes smaller and it is difficult to increase the density.
- High-purity silicon carbide powder consists of, for example, a silicon source containing at least one or more silicon compounds and an organic
- a liquid source and a solid source can be used together as a carbon source containing a compound (hereinafter referred to as “key source”), but at least one of them must be selected from liquid sources .
- key source a polymer of alkoxysilane (mono-, di-, tri-, tetra-) and tetraalkoxysilane is used.
- tetraalkoxysilanes are suitably used, and specific examples include methoxysilane, ethoxysilane, propoxysilane, and butoxysilane. From the viewpoint of handling, ethoxysilane is preferred.
- the tetraalkoxysilane polymer include a low-molecular-weight polymer (oligomer) having a degree of polymerization of about 2 to 15 and a liquid of a citric acid polymer having a higher degree of polymerization. Solid oxides that can be used in combination with these include silicon oxide.
- silicon oxide means, in addition to SiO 2, silica gel (colloidal ultrafine silicide-containing liquid, containing OH group and alkoxyl group inside), silicon dioxide (silica gel, fine silica, (Quartz powder). These silicon sources may be used alone or in combination of two or more.
- silicon sources from the viewpoint of good homogeneity and handling, oligomers of tetraethoxysilane and mixtures of oligomers of tetraethoxysilane with finely divided silica are preferred.
- a high-purity substance is used as these silicon sources, and the initial impurity content is preferably 20 ppm or less, more preferably 5 ppm or less.
- the polymerization and cross-linking catalyst used in the production of high-purity silicon carbide powder can be appropriately selected depending on the carbon source.
- the carbon source is a phenol resin or a furan resin
- toluene sulfonic acid, toluene carboxylic acid, acetic acid, and oxalate are used.
- acids such as acid and sulfuric acid.
- toluenesulfonic acid is preferably used.
- the ratio of carbon to silicon (hereinafter abbreviated as czsi ratio) in the process of producing high-purity silicon carbide powder, which is the raw material powder used in the above-described reaction sintering method, is determined by mixing the mixture with 10 It is defined by elemental analysis of a carbide intermediate obtained by carbonization at 0 ° C. Stoichiometrically, when the C / Si ratio is 3.0, the free carbon in the generated carbon carbide must be 0%. Free carbon is generated at low C / Si ratios. It is important to determine the blending in advance so that the amount of free carbon in the resulting carbonized carbon powder does not become an unsuitable amount for the production use of a sintered body or the like.
- free carbon can be suppressed by setting the CZSi ratio to 2.0 to 2.5, and this range is preferably used. it can.
- the CZ S i ratio is set to 2.55 or more, the free carbon increases remarkably, but since this free carbon has the effect of suppressing crystal growth, the cZs i ratio is appropriately adjusted according to the crystal growth size to be obtained. You may choose.
- the pressure of the atmosphere is set to a low pressure or a high pressure, the C / Si ratio for obtaining pure silicon carbide fluctuates. In this case, the C / Si ratio must be within the above-mentioned range. There is no limitation.
- a method for producing a raw material powder described in the method for producing a single crystal in Japanese Patent Application Laid-Open No. Hei 9-148605 filed by the present applicant has been proposed. That is, at least one selected from high-purity tetraalkoxysilane and tetraalkoxysilane polymer is used as a silicon source, and a high-purity organic compound that generates carbon by heating is used as a carbon source, and these are uniformly mixed. Heating the mixture thus obtained in a non-oxidizing atmosphere to obtain a silicon carbide powder; and obtaining the silicon carbide powder at a temperature of 170 ° C. The temperature is kept at less than 100 ° C, and at the same time, heating is performed at least once at a temperature of 200 ° C to 210 ° C for 5 to 20 minutes. A post-processing step to be performed;
- the content of each impurity element is 0.5 ppm or less.
- a method for producing a high-purity silicon carbide powder which is characterized by obtaining the following silicon carbide powder, can be used. Since the silicon carbide powder obtained in this way is not uniform in size, it is treated by pulverization and classification so as to conform to the above-mentioned particle size.
- a silicon source, a carbon source, an organic substance comprising a nitrogen source, and a polymerization or crosslinking catalyst are uniformly mixed.
- a carbon source such as a phenol resin
- an organic substance comprising a nitrogen source such as hexamethylenetetramine
- a polymerization or cross-linking catalyst such as toluene sulfonic acid
- solvent such as ethanol
- tetraethoxysilane is used. It is preferable to sufficiently mix with a silicon source such as an oligomer.
- the substance used as the carbon source is preferably a high-purity organic compound containing oxygen in the molecule and remaining carbon by heating.
- specific examples include various sugars such as phenolic resins, furan resins, epoxy resins, monosaccharides such as phenoxy resin and glucose, oligosaccharides such as sucrose, and polysaccharides such as cellulose and starch. These are mainly liquid at room temperature, soluble in solvents, softened by heating such as thermoplastic or heat-meltable or liquid, for the purpose of homogeneously mixing with the silicon source. Used. Of these, resole phenolic resin and nopolak phenolic resin are preferred. In particular, a resol type phenol resin is preferably used.
- silicon oxide includes silicon dioxide and silicon monoxide.
- alkoxysilane represented by tetraethoxysilane examples thereof include a molecular weight polymer (oligomer), a silicic acid polymer having a higher polymerization degree, and a silicon oxide compound such as silica sol and fine powder silica.
- alkoxysilane examples include methoxysilane, ethoxysilane, propoxysilane, and butoxysilane. Among them, ethoxysilane is preferably used from the viewpoint of handling properties.
- the oligomer refers to a polymer having a degree of polymerization of about 2 to 15.
- silicon sources tetraethoxysilane oligomers and mixtures of tetraethoxysilane oligomers with finely divided silica are preferred from the viewpoint of good homogeneity and handling properties.
- a high-purity substance is used for these silicon sources, and the initial impurity content is preferably 20 ppm or less, more preferably 5 ppm or less.
- the embodiment of the method for producing a silicon carbide sintered body according to the present invention is as follows: (1) A slurry-like mixed powder obtained by dissolving and dispersing silicon carbide powder in a solvent is poured into a molding die and dried. (2) a step of obtaining a green body by calcining the obtained green body in a vacuum atmosphere or an inert gas atmosphere at 1200 to 180 ° C. to obtain a calcined body 1; 3) a step of impregnating the obtained calcined body 1 with a carbon source; (4) a step of calcining the calcined body 2 impregnated with a carbon source; and (5) a step of melting the obtained calcined body 2.
- the silicon carbide powder and the defoamer are dissolved or dispersed in a solvent to produce a slurry-like mixed powder.
- a solvent to produce a slurry-like mixed powder.
- the stirring and mixing can be performed by a known stirring and mixing means, for example, a mixer, a planetary pole mill, or the like.
- the stirring and mixing are preferably performed for 6 hours to 48 hours, particularly for 12 hours to 24 hours.
- Examples of the silicon carbide powder used in the step of obtaining the green body include the above-described silicon carbide powder.
- the solvent include water, lower alcohols such as ethyl alcohol, ethyl ether, and acetone. It is preferable to use a solvent having a low impurity content as the solvent.
- the antifoaming agent include a silicone antifoaming agent.
- an organic binder may be added when producing a slurry-like mixed powder from the silicon carbide powder.
- Examples of the organic binder include a deflocculant and a powder pressure-sensitive adhesive.
- the deflocculant a nitrogen-based compound is preferable from the viewpoint of further increasing the effect of imparting conductivity. For example, ammonia, polyacrylic acid Ammonium salts and the like are preferably used.
- Polyvinyl alcohol urethane resin for example, water-soluble polyurethane
- the mixed powder in the form of a slurry is cast into a mold, left to stand, removed from the mold, and the solvent is removed by drying to produce a green body.
- inject molding is generally used to cast the slurry-like mixed powder into a mold.
- the slurry-like mixed powder is poured into a casting mold, left to stand, and then removed from the mold.
- the solvent is removed by heating or air drying under a temperature condition of 40 ° C to 60 ° C. As a result, a green body having a specified size can be obtained.
- the “green body” means a silicon carbide molded body before reaction sintering, in which many pores are obtained by removing a solvent from a slurry-like mixed powder, and the pores are present therein.
- the green body is calcined to produce a calcined body 1.
- the calcination is performed at 1200 ° C. to 190 ° C., preferably at 1200 ° C. to 180 ° C., and more preferably at 150 ° C. to 180 ° C. Done. If the temperature is lower than 1200 ° C., the contact between the silicon carbide powders in the green body is not sufficiently promoted, and the contact strength is insufficient, so that handling becomes inconvenient. If the temperature exceeds 190 ° C., the grain growth of the silicon carbide powder in the green body becomes remarkable, and the penetration of the molten high-purity silicon becomes insufficient thereafter. Is 1 ° C / mir up to 800 ° C!
- the maximum temperature holding time of the above-mentioned calcination is preferably from 10 minutes to 120 minutes, more preferably from 20 minutes to 60 minutes.
- the temperature rise rate of the above-mentioned calcination and the maximum temperature holding time of the calcination are appropriately determined in consideration of the shape and size of the green body.
- the above-described calcination is preferably performed in a vacuum atmosphere or an inert gas atmosphere from the viewpoint of preventing oxidation.
- the “calcined body 1” is a silicon carbide molded body before reaction sintering in which pores and impurities obtained by calcining the above-mentioned green body have been removed, and a carbon source Means that it does not contain
- the “calcined body 2” to be described later is a silicon carbide molded body before reaction sintering obtained by calcining the above-described calcined body 1 after being impregnated with a carbon source. Means containing carbon source. Therefore, it goes without saying that “calcined body 1” and “calcined body 2” should be distinguished.
- the bending strength of the calcined body 1 obtained in the above step (2) is 2 OMPa or more in a preferred embodiment.
- the calcined body 1 is impregnated with a phenol resin as a carbon source to produce a calcined body 1 impregnated with a phenol resin.
- the impregnation method is as follows: the phenol resin impregnates the calcined body 1 There is no particular limitation so long as the phenol resin is impregnated by utilizing the capillary phenomenon. It is more preferable to impregnate the calcined body 1 with a phenol resin by using a cold isostatic pressing (CIP) method.
- CIP cold isostatic pressing
- a conventionally known cold isostatic pressing (CIP) processing apparatus is used to perform the following steps.
- the calcined body 1 can be impregnated with a phenol resin.
- the calcined body 1 and a phenol resin as a carbon source are added to a flexible mold.
- phenol resin is added to the flexible mold in an amount larger than the calculated value in consideration of the residual carbon ratio and in which the Darin body is sufficiently immersed.
- phenol resin 1: 3 to 6 (volume ratio) to the above-mentioned flexible mold.
- the aforementioned flexible mold is one that can be at least tightly sealed and can simultaneously and uniformly apply pressure to the substance contained in the mold in all directions.
- the phenol resin it is preferable to use a liquid-type phenol resin.
- the sealed mold is placed in a pressurized chamber of a pressurized container, filled with a liquid for pressurization, and sealed with a stopper of the pressurized container.
- a liquid for pressurization a liquid with high compressibility should be used. it can. Specifically, it is preferable to use water and 30% boric acid water from the viewpoint of high compression ratio and good workability.
- the calcined body 1 is impregnated with a carbon source by performing a cold isostatic pressing (CIP) treatment under predetermined conditions.
- CIP cold isostatic pressing
- the pressure is less than 1000 kgm 2 , the impregnation will be insufficient, and if it is more than 5000 kgcm 2 , there is a risk of rupture during pressure reduction. More preferably, will pressurized to 2500 k gZcm 2 ⁇ 3500 k gZ cm 2 over a period of 2 hours, the cold isostatic press (CIP) process by holding followed by one hour at the above conditions. At this time, it is preferable to reduce the pressure to normal pressure over 2 hours after maintaining the pressure at a predetermined value.
- CIP cold isostatic press
- the “cold isotropic press (CIP) treatment means a treatment method in which a high pressure is uniformly applied to the entire surface of a molded body using an equilibrium pressure or a hydrostatic pressure.
- CIP cold isostatic pressing
- the cold isostatic pressing (CIP) processing in addition to the processing method using the above-described liquid medium as the pressure medium, there is also a method using a gas medium.
- the calcined body 1 impregnated with the phenol resin obtained in the above step (3) is calcined to produce a calcined body 2.
- a carbon component contributing to reaction sintering can be obtained.
- the calcination is performed at 900 ° C to 1400 ° C, preferably 900 ° C to 1200 ° C, more preferably 950 ° C to 1100 ° C. If the temperature is lower than 900 ° C., carbonization becomes insufficient, which is not preferable. Also 1400 If the temperature exceeds ° C, the carbonization is completed, which is not preferable from an economic viewpoint.
- the heating rate of the above-mentioned calcining is up to 600 ° C ⁇ ⁇ !!
- the maximum temperature holding time of the above-mentioned calcining is preferably from 10 to 60 minutes, more preferably from 20 to 30 minutes, but it is appropriately determined in consideration of the shape and size of the calcined body 1. Is good.
- the above-described calcination is preferably performed in a vacuum atmosphere or an inert gas atmosphere from the viewpoint of preventing oxidation.
- the bending strength of the calcined body 2 obtained in the above step (4) is 20 MPa or more, and more preferably 23 MPa or more in a preferred embodiment.
- the formability of the silicon carbide sintered body is finally improved. In other words, the formability is improved by improving the strength of the calcined body (2).
- the calcined body 2 produced through the above-mentioned step (4) is placed in a vacuum atmosphere or an inert gas atmosphere at a temperature equal to or higher than the melting point of high-purity metallic silicon, specifically, at 150 ° C. to 170 ° C. It is heated to 0 ° C and immersed in molten high-purity metallic silicon to produce a silicon carbide body (sintered body).
- the calcined body 2 is immersed in the molten metal silicone, the liquid silicon penetrates into the pores in the calcined body 2 due to the capillary phenomenon, and the silicon and the calcined body 2 are released. Reacts with carbon. This reaction generates silicon carbide, and the pores in the calcined body 2 are filled with the generated silicon carbide.
- the reaction between silicon and free carbon was demonstrated during the process of producing silicon carbide powder. As described above, the reaction with free carbon proceeds at the stage where molten high-purity metallic silicon heated to 1450 ° C to 170 ° has penetrated into the calcined body 2 I do.
- the time for immersing calcined body 2 in molten metal silicon is not particularly limited, and is appropriately determined depending on the size and the amount of free carbon in calcined body 2.
- the high-purity metallic silicon is melted by heating to 150 to 170 ° C., preferably to 150 to 160 ° C.
- the melting temperature is lower than 144 ° C.
- the viscosity of the high-purity metallic silicon increases, which is not preferable because it does not penetrate into the calcined body 2 due to a capillary phenomenon.
- the temperature exceeds 170 ° C., evaporation is remarkable and the furnace body and the like are damaged, which is not preferable.
- high-purity metallic silicon examples include powder, granules, and massive metallic silicon, and 2 to 5 mm massive metallic silicon is suitably used.
- high purity means those having an impurity content of less than 1 ppm.
- the silicon carbide generated by reacting the free carbon contained in the calcined body 2 with silicon fills the pores in the calcined body 2 to provide high-density and good electrical characteristics. Is obtained.
- the silicon carbide sintered body produced through the above-mentioned step (5) is heated to a temperature equal to or higher than the melting point of metallic silicon, and preferably 150. Unreacted silicon is removed by heating the mixture to a temperature of 170 ° C. to 170 ° C., more preferably 160 ° C. to 170 ° C. If the heating temperature is lower than 1450, the amount of residual silicon increases and unreacted silicon exudes to the surface of the silicon carbide sintered body. On the other hand, if the heating temperature is higher than 170 ° C., the strength (MP a) of the silicon carbide sintered body decreases. In this case, the heating time is preferably maintained at the above-mentioned heating temperature for 30 to 90 minutes, more preferably about 60 minutes, for example, 50 to 70 minutes.
- a hydrofluoric acid treatment step may be further provided in addition to the above-mentioned steps (1) to (6).
- a hydrofluoric acid treatment step to elute unreacted silicon into hydrofluoric acid, it is possible to remove unreacted silicon that could not be completely removed in the above step (5).
- the cleaning conditions in this case are appropriately determined depending on the shape and size of the work. However, considering the work efficiency and the time required for cleaning after hydrofluoric acid treatment, it is preferable to remove the unreacted silicon in the above-mentioned step (6).
- the cleaning effect can be further improved by using ultrasonic waves in combination with the cleaning.
- the above reaction sintering method it is possible to obtain a silicon carbide sintered body having high purity, high density, high toughness, and electrical conductivity, and which can be discharged.
- the above-mentioned reaction sintering method as long as the above-mentioned heating conditions of the present invention can be satisfied, there is no particular limitation on a production apparatus and the like, and a known heating furnace reaction apparatus can be used.
- the silicon carbide sintered body obtained as described above has a small amount of residual silicon.
- the aforementioned silicon carbide sintered body has a structure in which silicon carbide particles are uniformly dispersed. That is, the porosity of the silicon carbide sintered body is 30% or less.
- the porosity of the silicon carbide sintered body is preferably 10% or more and 30% or less, and 15% or more and 20% or less. If the porosity exceeds the above upper limit, the amount of residual silicon increases, and the strength of the silicon carbide sintered body tends to decrease.
- the residual silicon content of the sintered silicon carbide is 30% by volume or less based on the volume of the sintered silicon carbide. Therefore, the heat resistance and reliability of the silicon carbide sintered body are improved, and as a result, the applicable range of the product is expanded.
- the porosity in the present invention is defined as a microscope of a polished cross section of a silicon carbide sintered body. This is the value obtained by calculating the area of silicon carbide particles and silicon particles from a photograph by image processing according to the following formula.
- Porosity (%) (area of silicon particles // (area of silicon particles + area of silicon carbide particles)) x 100
- the area ratio between silicon carbide and silicon in the silicon carbide sintered body is 70% or more for silicon carbide and 30% or less for silicon.
- the amount of residual silicon in the sintered silicon carbide is not more than 4%, preferably not more than 2%, based on the total volume of the sintered silicon carbide. If it exceeds 4%, elution of residual silicon may occur at the time of high temperature use.
- the lower limit of the amount of residual silicon in the silicon carbide sintered body is not particularly limited, but is about 0.5%. This is because the reaction between Si and C involves volume shrinkage, and it is difficult to reduce the reaction to 0.5% or less.
- the silicon carbide sintered body obtained by the present invention has a density of 2.9 gZcm 3 or more and a structure in which mainly isotropic silicon particles having an average particle size of 2 xm to 8 m are uniformly dispersed. Have. Therefore, it can be used as a structural member with small variations in density and the like. In general, if the density of the sintered body is less than 2.9 g / cin 3 , mechanical properties such as bending strength and breaking strength and electrical properties are reduced, and furthermore, particles are increased and pollution is deteriorated. Therefore, it can be said that the silicon carbide sintered body of the present invention has good mechanical properties and electrical properties.
- the density of the silicon carbide sintered body of the present invention is 3.0 gZcm 3 or more.
- the obtained sintered body is a porous body, it is inferior in heat resistance, oxidation resistance, chemical resistance and mechanical strength, is difficult to clean, has minute cracks, and small pieces become pollutants. In other words, it has inferior physical properties, such as gas permeability, and has problems such as limited applications.
- the problem caused by the above-mentioned porous body hardly occurs.
- the total content of impurities in the silicon carbide sintered body obtained by the present invention is less than 10 ppm. Full, preferably less than 5 ppm, more preferably less than 3 ppm, and even more preferably less than 1 ppm. From the viewpoint of application to the semiconductor industry, the impurity contents obtained by these chemical analyzes have only a meaning as reference values. Practically, the evaluation differs depending on whether the impurities are uniformly distributed and whether they are locally unevenly distributed. Therefore, those skilled in the art generally evaluate the extent to which impurities contaminate wafers under predetermined heating conditions using various practical devices.
- the solid obtained by homogeneously mixing the liquid silicon compound, the nonmetallic sintering aid, and the polymerization or crosslinking catalyst was heated and carbonized in a non-oxidizing atmosphere.
- the production method including the firing step of firing in an oxidizing atmosphere the total content of impurities other than silicon, carbon, and oxygen contained in the silicon carbide sintered body can be reduced to less than 1 ppm.
- the nitrogen content of the silicon carbide sintered body obtained by the present invention is 150 ppm or more.
- the silicon carbide sintered body of the present invention obtained as described above preferably has the following physical properties.
- the silicon carbide sintered body of the present invention has a volume resistance of 1 ⁇ cm or less, more preferably 0.5 Qcm to 0.05 Qcm.
- the total content of unavoidable elements other than silicon and carbon that is, the total content of impurity elements in the silicon carbide sintered body is less than 5 ppm.
- the silicon carbide sintered body of the present invention has a density of 2.9 gZcm 3 or more, and more preferably 3,000 to 3.15 g / cm 3 .
- the silicon carbide sintered body of the present invention has a bending strength of not less than 20 OMPa, more preferably not less than 220 MPa.
- the sintered body obtained by the above-described manufacturing method is subjected to processing such as processing, polishing, and washing according to the purpose of use.
- the sintered body of the present invention can be manufactured by forming a cylindrical sample (sintered body) and slicing it in the radial direction.
- the machining method electric discharge machining is suitably used. Then, it is used for semiconductor manufacturing parts, electronic information equipment parts, optical parts and the like.
- the main semiconductor manufacturing apparatus in which the sintered body component according to the present invention is used includes an exposure apparatus, a resist processing apparatus, a dry etching apparatus, a cleaning apparatus, and a heating apparatus.
- Examples include processing equipment, ion implantation equipment, CVD equipment, PVD equipment, and dicing equipment.
- parts include plasma electrodes for dry etching equipment, protective rings (focus rings), and ion implantation equipment. Slit parts (apertures), protective plates for ion generators and mass spectrometers, dummy wafers used for wafer processing in heat treatment equipment and CVD equipment, heat-generating heaters in heat treatment equipment, CVD equipment and PVD equipment, In particular, a heater that directly heats the wafer at a lower portion thereof can be used.
- Examples of electronic information device parts include a disk base for a hard disk drive and a thin-film magnetic head base.
- examples of the optical component include a reflector for synchrotron radiation (SR) and laser light.
- the silicon carbide powder which is the raw material powder of the present invention, a silicon source for producing the raw material powder, a nonmetallic sintering aid, and an inert gas used for forming a non-oxidizing atmosphere.
- the purity of each gas and each impurity element is preferably 1 ppm or less, but is not necessarily limited to this as long as it is within the allowable range of the purity in the heating and sintering steps.
- the impurity element belongs to Group 1 to Group 16 elements in the Periodic Table of the revised IUPAC Inorganic Chemical Nomenclature, 1989, and has an atomic number of 3 or more, and an atomic number of 6 to 8 And the elements excluding the elements 14 to 16 above.
- a silicon carbide sintered body was manufactured under the following conditions.
- a silicon carbide powder a high-purity silicon carbide powder having a center particle size of 5 ⁇ (impurity content of 5 ppm or less manufactured according to the manufacturing method described in Japanese Patent Application Laid-Open No. 9-46805).
- 100 parts of water, 40 parts of water, 0.3 parts of deflocculant, and 3 parts of binder were added to 100 parts, and the mixture was further ball-milled for 24 hours.
- the mixture was dispersed and mixed to obtain a slurry-like mixed powder having a viscosity of 1 Boys.
- the slurry-like mixed powder was poured into a gypsum mold having a length of 6 O mm, a width of 10 mm, and a thickness of 5 mm.
- the mixture was naturally dried at 22 ° C for a time to obtain a green body.
- the obtained green body was heated in a graphite crucible having an inner diameter of 200 mm and a height of 80 mm to 180 ° C in an argon atmosphere over 10 hours, and the temperature was increased. Calcination was performed for 1 hour at the above-mentioned temperature to obtain a calcined body 1.
- a resol-type phenolic resin manufactured by Sumitomo Chemical Co., Ltd., trade name: “SK Lite”
- SK Lite resol-type phenolic resin
- the sintered body 1 described above was impregnated with a phenol resin by cold isostatic pressure (CIP) treatment.
- the calcined body 1 impregnated with the phenol resin was calcined at 1200 ° C. in the same manner as described above to obtain a calcined body 2.
- reaction sintered body was obtained by performing Si impregnation treatment at 150 ° C. using metallic silicon as a Si source.
- the mixture was heated to 145 ° C., and maintained at that temperature for 60 minutes to remove unreacted silicon, thereby obtaining a silicon carbide sintered body.
- the obtained silicon carbide sintered body was observed for porosity, residual silicon, seepage, strength, average particle size, and density according to the criteria described later.
- Table 1 shows the treatment temperature and treatment time conditions in the unreacted silicon removal step, and the experimental results obtained.
- Example 2 (Examples 2, 3), (Comparative Examples 1 to 4) An experiment was performed in the same manner as in Example 1 except that the processing temperature and the processing time in the unreacted silicon removal step were set to the conditions shown in Table 1.
- Table 1 shows the treatment temperature and treatment time conditions in the unreacted silicon removal step, and the experimental results obtained.
- Table 1 Table 1: Unreacted silicon heating removal conditions
- Example 2 heat treatment was performed at a treatment temperature of 160 ° C. for 60 minutes. Thus, it was found that a silicon carbide sintered body having good strength without silicon seepage was obtained.
- the cross section of the obtained silicon carbide sintered body is polished, and a surface layer of 0.5 mm from the surface of the cross section of the silicon carbide sintered body is subjected to a 340 ⁇ m ⁇ 250 m field of view in a rectangular viewing range.
- Image analysis was performed using a digital image processing device manufactured by LUZEX (trade name).
- the porosity (%) (area of silicon particles Z (area of silicon particles + area of silicon carbide particles) The area of elementary particles)) The porosity was determined as X100.
- the surface of the silicon carbide sintered body was observed in the same manner as (1) the porosity measurement described above, and the residual silicon (%) was determined on a volume basis.
- the sintered silicon carbide was kept at 1500 ° C for 30 minutes in an argon atmosphere. Then, it was observed whether or not silicon carbide had oozed out on the surface of the silicon carbide sintered body. When the carbon carbide exuded, it was evaluated as “existent”, and when there was no exudation, it was evaluated as “absent”.
- the surface of the silicon carbide sintered body was observed in the same manner as (1) the porosity measurement described above, and the average particle size m) of the SiC particles was determined by image analysis.
- the density (g / cm 3 ) was measured by the Archimedes method according to JISR l634. Industrial applicability
- the heat resistance and reliability of the silicon carbide sintered body are improved.
- a silicon carbide sintered body having a structure in which silicon particles are uniformly dispersed.
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Priority Applications (3)
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US10/534,531 US20060046920A1 (en) | 2002-11-12 | 2003-11-12 | Silicon carbide sintered product and method for production thereof |
JP2005505671A JPWO2004043876A1 (ja) | 2002-11-12 | 2003-11-12 | 炭化ケイ素焼結体及びその製造方法 |
AU2003280743A AU2003280743A1 (en) | 2002-11-12 | 2003-11-12 | Silicon carbide sintered product and method for production thereof |
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JP2002-328214 | 2002-11-12 | ||
JP2002328214 | 2002-11-12 | ||
JP2003-344849 | 2003-10-02 | ||
JP2003344849 | 2003-10-02 |
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US (1) | US20060046920A1 (ja) |
JP (1) | JPWO2004043876A1 (ja) |
AU (1) | AU2003280743A1 (ja) |
TW (1) | TW200416208A (ja) |
WO (1) | WO2004043876A1 (ja) |
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JP2006036585A (ja) * | 2004-07-27 | 2006-02-09 | Toshiba Ceramics Co Ltd | 液晶製造装置用セラミック部材 |
CN100388418C (zh) * | 2004-11-10 | 2008-05-14 | 东京毅力科创株式会社 | 基板处理装置用部件及其制造方法 |
CN101839862A (zh) * | 2010-03-29 | 2010-09-22 | 武钢集团昆明钢铁股份有限公司 | 碳化硅耐火材料中总硅含量的测定方法 |
KR20150025649A (ko) * | 2013-08-29 | 2015-03-11 | 엘지이노텍 주식회사 | 탄화규소 분말 |
KR20150075868A (ko) * | 2013-12-26 | 2015-07-06 | 한국기계연구원 | 반응소결 탄화규소체 및 이의 제조방법 |
JP2017537052A (ja) * | 2014-09-25 | 2017-12-14 | メリオール イノベイションズ インクMelior Innovations, Inc. | ポリシロカルブに基づいた炭化ケイ素材料、用途および装置 |
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US9657409B2 (en) | 2013-05-02 | 2017-05-23 | Melior Innovations, Inc. | High purity SiOC and SiC, methods compositions and applications |
JP6225093B2 (ja) * | 2014-10-27 | 2017-11-01 | 日本碍子株式会社 | 複合耐火物 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS37953B1 (ja) * | 1959-08-07 | 1962-04-26 | ||
US4722762A (en) * | 1980-10-02 | 1988-02-02 | Kernforschungsanlage Julich Gmbh | Method of making shaped bodies of silicon carbide or of graphite or graphite-like material with a silicon carbide surface |
JPH02111663A (ja) * | 1988-10-20 | 1990-04-24 | Eagle Ind Co Ltd | 多孔質導電性材料 |
US20020070485A1 (en) * | 1999-07-09 | 2002-06-13 | Bridgestone Corporation | Silicon carbide sintered body and method for producing the same |
WO2003033434A1 (fr) * | 2001-10-16 | 2003-04-24 | Bridgestone Corporation | Procede d'elaboration de carbure de silicium fritte, et carbure de silicium fritte resultant |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5589116A (en) * | 1991-07-18 | 1996-12-31 | Sumitomo Metal Industries, Ltd. | Process for preparing a silicon carbide sintered body for use in semiconductor equipment |
US6695984B1 (en) * | 1998-08-07 | 2004-02-24 | Bridgestone Corporation | Silicon carbide sinter and process for producing the same |
US6162543A (en) * | 1998-12-11 | 2000-12-19 | Saint-Gobain Industrial Ceramics, Inc. | High purity siliconized silicon carbide having high thermal shock resistance |
US6387834B1 (en) * | 1999-06-02 | 2002-05-14 | Bridgestone Corporation | Sintered silicon carbide body and method for producing the same |
US7226561B2 (en) * | 2002-03-11 | 2007-06-05 | Bridgestone Corporation | Method of producing silicon carbide sintered body jig |
-
2003
- 2003-11-11 TW TW092131572A patent/TW200416208A/zh unknown
- 2003-11-12 JP JP2005505671A patent/JPWO2004043876A1/ja active Pending
- 2003-11-12 US US10/534,531 patent/US20060046920A1/en not_active Abandoned
- 2003-11-12 AU AU2003280743A patent/AU2003280743A1/en not_active Abandoned
- 2003-11-12 WO PCT/JP2003/014371 patent/WO2004043876A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS37953B1 (ja) * | 1959-08-07 | 1962-04-26 | ||
US4722762A (en) * | 1980-10-02 | 1988-02-02 | Kernforschungsanlage Julich Gmbh | Method of making shaped bodies of silicon carbide or of graphite or graphite-like material with a silicon carbide surface |
JPH02111663A (ja) * | 1988-10-20 | 1990-04-24 | Eagle Ind Co Ltd | 多孔質導電性材料 |
US20020070485A1 (en) * | 1999-07-09 | 2002-06-13 | Bridgestone Corporation | Silicon carbide sintered body and method for producing the same |
WO2003033434A1 (fr) * | 2001-10-16 | 2003-04-24 | Bridgestone Corporation | Procede d'elaboration de carbure de silicium fritte, et carbure de silicium fritte resultant |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006036585A (ja) * | 2004-07-27 | 2006-02-09 | Toshiba Ceramics Co Ltd | 液晶製造装置用セラミック部材 |
CN100388418C (zh) * | 2004-11-10 | 2008-05-14 | 东京毅力科创株式会社 | 基板处理装置用部件及其制造方法 |
CN101839862A (zh) * | 2010-03-29 | 2010-09-22 | 武钢集团昆明钢铁股份有限公司 | 碳化硅耐火材料中总硅含量的测定方法 |
KR20150025649A (ko) * | 2013-08-29 | 2015-03-11 | 엘지이노텍 주식회사 | 탄화규소 분말 |
KR102105565B1 (ko) * | 2013-08-29 | 2020-04-28 | 엘지이노텍 주식회사 | 탄화규소 분말 |
KR20150075868A (ko) * | 2013-12-26 | 2015-07-06 | 한국기계연구원 | 반응소결 탄화규소체 및 이의 제조방법 |
KR101584232B1 (ko) | 2013-12-26 | 2016-01-11 | 한국기계연구원 | 반응소결 탄화규소체 및 이의 제조방법 |
JP2017537052A (ja) * | 2014-09-25 | 2017-12-14 | メリオール イノベイションズ インクMelior Innovations, Inc. | ポリシロカルブに基づいた炭化ケイ素材料、用途および装置 |
JP2021020852A (ja) * | 2014-09-25 | 2021-02-18 | メリオール イノベイションズ インクMelior Innovations, Inc. | ポリシロカルブに基づいた炭化ケイ素材料、用途および装置 |
JP2022116321A (ja) * | 2014-09-25 | 2022-08-09 | メリオール イノベイションズ インク | ポリシロカルブに基づいた炭化ケイ素材料、用途および装置 |
JP7196375B2 (ja) | 2014-09-25 | 2022-12-27 | パリデュス インク | ポリシロカルブに基づいた炭化ケイ素材料、用途および装置 |
JP7472196B2 (ja) | 2014-09-25 | 2024-04-22 | パリデュス インク | ポリシロカルブに基づいた炭化ケイ素材料、用途および装置 |
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AU2003280743A1 (en) | 2004-06-03 |
JPWO2004043876A1 (ja) | 2006-03-09 |
US20060046920A1 (en) | 2006-03-02 |
TW200416208A (en) | 2004-09-01 |
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