WO2004038065A1 - 安定化層を積層したアルミニウム安定化積層体 - Google Patents
安定化層を積層したアルミニウム安定化積層体 Download PDFInfo
- Publication number
- WO2004038065A1 WO2004038065A1 PCT/JP2003/012851 JP0312851W WO2004038065A1 WO 2004038065 A1 WO2004038065 A1 WO 2004038065A1 JP 0312851 W JP0312851 W JP 0312851W WO 2004038065 A1 WO2004038065 A1 WO 2004038065A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- aluminum
- stabilized
- thin film
- laminated
- laminate
- Prior art date
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 85
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 85
- 230000000087 stabilizing effect Effects 0.000 title claims abstract description 9
- 239000010409 thin film Substances 0.000 claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 238000004544 sputter deposition Methods 0.000 claims abstract description 13
- 238000007733 ion plating Methods 0.000 claims abstract description 9
- 238000007740 vapor deposition Methods 0.000 claims abstract description 7
- 230000006641 stabilisation Effects 0.000 claims description 35
- 238000011105 stabilization Methods 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 29
- 238000007747 plating Methods 0.000 claims description 22
- 239000011888 foil Substances 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229920006254 polymer film Polymers 0.000 claims description 5
- 235000010210 aluminium Nutrition 0.000 description 76
- 239000010949 copper Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 15
- 239000010408 film Substances 0.000 description 12
- 238000010030 laminating Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 239000005060 rubber Substances 0.000 description 6
- 238000007654 immersion Methods 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 5
- 239000000057 synthetic resin Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229920002725 thermoplastic elastomer Polymers 0.000 description 4
- 230000004913 activation Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000005034 decoration Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- VRAIHTAYLFXSJJ-UHFFFAOYSA-N alumane Chemical compound [AlH3].[AlH3] VRAIHTAYLFXSJJ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/221—Ion beam deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/08—Dimensions, e.g. volume
- B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
- B32B2309/105—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
Definitions
- the present invention relates to an aluminum-based material used in all technical fields such as electric and electronic parts, semiconductor circuits, automobile-related products, and a technique for stabilizing the surface composed of aluminum. More specifically, various aluminum aluminums used for wiring, conducting, circuit, bonding, soldering, contact (contacts, connectors, relays, switches, etc.), shielding, decoration, etc.
- the present invention relates to an aluminum-stabilized laminate in which electrical resistance, corrosion resistance or decorativeness is dramatically improved by stabilizing the surface made of aluminum in a system material. Background technology '
- Japanese Patent Laid-Open Publication No. 2001-1999 describes a superconducting conductor in which the surface of an aluminum wire is coated with a Cu 1 Ni alloy. But this is It relates to a minute wire, not to a thin film composed of aluminum. Therefore, no mention is made of any technique for stabilizing the surface of the thin film.
- Japanese Patent Application Laid-Open No. 10-9670 describes a cylinder for an internal combustion engine in which the surface of a cylinder made of aluminum is coated with a copper alloy.
- this relates to a cylinder made of aluminum, not to a thin film made of aluminum. Therefore, no mention is made of any technique for stabilizing the surface of the thin film.
- Japanese Patent Application Laid-Open No. 5-108238 describes an aluminum stabilizer for a superconducting conductor, in which the outer periphery of high purity aluminum is coated with copper.
- this relates to linear aluminum, not to thin films made up of classical materials. Therefore, no mention is made at all on the technique for stabilizing the surface of the thin film. Disclosure of the invention
- the present invention has been made in view of such a current situation, and the object of the present invention is to use a simple method for the aluminum surface of aluminum-based materials used for electric and electronic parts, semiconductor circuits, automobile-related products, etc.
- An object of the present invention is to provide a stabilized aluminum stabilized laminate.
- the inventors of the present invention conducted intensive studies to solve the above-mentioned problems, and found that if the surface composed of a phantom is protected with any metal, it is possible to stabilize aluminum, and based on this finding. Further research has finally led to the completion of the present invention.
- a stabilization layer having a thickness of 0.01 to 1 m made of metal is formed by sputtering, vapor deposition or ion plating all over the thin film whose surface is at least made of aluminum.
- the present invention relates to an aluminum-stabilized laminate formed by laminating according to any method.
- the thin film whose surface is at least made of aluminum can be an aluminum foil rolled to a thickness of 4 to 200 ⁇ m.
- the metal may be any of Cu, Ni or an alloy containing these.
- a plated layer can be laminated on the surface of the stabilization layer.
- FIG. 1 is a schematic cross-sectional view of an aluminum stabilized laminate.
- FIG. 2 is a schematic cross-sectional view of an aluminum-stabilized laminate in which a thin film whose surface is at least aluminum is a laminate of an aluminum foil and a polymer film.
- FIG. 3 is a schematic cross-sectional view of an aluminum-stabilized laminate in which a plating layer is laminated on the stabilization layer.
- the aluminum stabilized laminate according to the present invention The thin film 102, 202, 302 in which the surface on which the base of the aluminum stabilized laminate 101, 201, 301 is formed is at least aluminum is at least aluminum itself.
- thin films in which a layer made of aluminum is formed on the surface of a material other than aluminum are also included.
- an aluminum foil can be mentioned, and among them, it is particularly preferable to use one having a thickness of 4 to 200 ⁇ .
- the stabilization layer described later is deposited by any of the sputtering method, the vapor deposition method, and the ion plating method, and anything out of this range is inconvenient when the respective methods are applied.
- the reason is that That is, if the thickness is less than 4 ⁇ , rolling of the aluminum itself is difficult, the cost of the aluminum itself is increased, and the treatment by the above methods is difficult due to the strength. It has the disadvantage of becoming Also, its thickness is 2 OO / i If m exceeds m, the processing by the above methods can not be performed in a roll, and processing efficiency is greatly reduced, and it is cost-effective to select another processing method such as cladding processing. is there.
- a material having a layer made of aluminum formed on the surface of a material other than aluminum for example, various materials conventionally known in applications such as electric and electronic parts, semiconductor circuits and automobile related products as materials other than aluminum.
- the polymer film include a synthetic resin film, a thermoplastic elastomer-one film, a rubber film and the like.
- Examples of the synthetic resin film include films made of synthetic resins such as PET, PEN, acrylic, nylon, polyethylene, polypropylene, Bayer chloride, polyimid, liquid crystal polymer, epoxy and the like.
- Examples of thermoplastic elastomer film include films made of thermoplastic elastomer elastomer such as styrene type, polyvinyl chloride type, olefin type, uretan type, ester type and amide type.
- the rubber film for example, other than natural rubber, butadiene rubber, isoprene rubber, chloroprene rubber, styrene-butadiene rubber, ditrinore rubber, petinore rubber, ethylene-propylene rubber, acrylic rubber, urethane rubber, fluorocarbon rubber, silicone rubber, etc.
- a film made of synthetic rubber can be mentioned.
- the types of synthetic resin, thermoplastic elastomer or rubber listed here are merely examples and are not limited to these.
- Various kinds of fillers such as glass fibers can be added to such a polymer film for the purpose of improving the strength and imparting a flame retardant effect and the like.
- the shape of the thin film whose surface is at least aluminum in the object of the present invention may be planar or physical as is apparent from the above description.
- film, sheet Particularly preferable ones are those having a thin film as a whole, such as plate-like or mouth-like. This is related to the fact that the stabilization layer described later is laminated by any of the sputtering method, the vapor deposition method, and the ion plating method, and by making such a shape, the stabilization layer is extremely adhered. It is possible to stack highly
- aluminum as used above includes those composed of only aluminum (including the case of containing a slight amount of impurities) and those composed of aluminum as its main component.
- the following stabilization layer is laminated on the entire surface of the thin film composed of at least aluminum as described above, the entire surface referred to here is only the stabilization. It does not mean that it does not belong to the technical scope of the present invention as long as a part of the surface on which the stabilization layer is not laminated is present. Therefore, it is not necessary to laminate the following stabilization layer to the part which does not need to be stabilized.
- the surface composed of aluminum is subjected to pretreatment such as degreasing, washing with water and acid activation treatment before the following stabilization layer is laminated. Thereby, oil and dirt adhering to the surface are removed, and the adhesion of the stabilization layer is improved.
- pretreatment such as degreasing, washing with water and acid activation treatment
- oil and dirt adhering to the surface are removed, and the adhesion of the stabilization layer is improved.
- conventionally known agents can be used without limitation for the degreasing agent and the like.
- the stabilization layers 103, 203, and 303 of which the surface of the present invention is laminated on the entire surface of a thin film made of at least aluminum, are made of any metal and have a thickness of 0.01 to 1. It is ⁇ m, and it is laminated by any of the sputtering method, the vapor deposition method, and the ion plating method.
- the stabilization layer effectively prevents the lower layer aluminum from being oxidized or denatured, and functions to protect and stabilize the aluminum.
- a metal which comprises the said stabilization layer Au, Pd, Cu, Ni, Zn, Sn, Fe, Co, Ag etc. can be mentioned. However, among these metals, it is particularly preferable to use either Cu, Ni or an alloy containing these.
- any metal can be plated with high adhesion.
- it is not only limited to such plating, but can be easily added after pressing, for example, and is abundant in terms of resources, so it is inexpensive and stable in cost.
- the composition of the alloy containing Cu or N i is not particularly limited as long as Cu or N i is contained, but, for example, P d, Rh as a component other than C u or N i , Ru, Co, etc. can be included.
- the content of Cu or Ni is preferably 20 to 99.9% by mass, preferably 90 to 99.5% by mass.
- the thickness of the stabilization layer needs to be 0.010 to 1 / m. This is because 1 / m is sufficient to protect and stabilize aluminum, and if it is thicker than this, on the other hand, the good surface properties inherent to aluminum-aluminum will be impaired, If the thickness is less than 0.01 ⁇ m, a sufficient stabilization effect can not be obtained. More preferably, it is preferable to use 0.01 to 0.5 ⁇ .
- the above-mentioned stabilization layer is laminated on a thin film whose surface is at least made of aluminum, and the lamination method needs to be by sputtering method, evaporation method or ion plating method.
- the surface can uniformly cover at least the entire surface of the thin film made of aluminum, and in particular, when it is laminated on the surface of the thin film aluminum itself, such as aluminum foil, wrinkles may occur.
- the layers can be stacked without cracking or cracking.
- two or more layers of this stabilization layer can be laminated if desired, and even if the surface is laminated on both front and back sides of a thin film composed of at least aluminum. good.
- the metals constituting the respective stabilization layers may be identical to each other or different from each other, and the thickness thereof is in the range of each of 0.1001 to 1 ⁇ as described above. be able to.
- 1 X 10- 3 ⁇ 7 X 10 _1 P a in the sputtering apparatus preferably 5 X 10- 3 ⁇ 5 X under a vacuum of 10- 2 P a
- a r gas 50 ⁇ 300 cc Z min, preferably 180 to 250 cc min, output 0.. 3 to 25 k W preferably be sputtered under the conditions of 1 to 20 kW it can.
- the above-described stabilization layer is laminated on the entire surface of a thin film whose surface is at least made of aluminum.
- the plating layer 304 By laminating the plating layer 304 on the surface of the stabilization layer, the surface thereof is formed.
- various modifications such as conductive processing, corrosion resistance processing and decoration processing.
- a metal which comprises such a plating layer Cu, Ni, Au, Ag, Sn, Pd, Zn, Ru, Rh, solder etc. can be mentioned, for example, and it is according to the use. You can choose anything you like.
- any method of electroless plating or electrolytic plating may be used, and a thickness of 0.20 to 20 ⁇ , preferably 0, can be obtained by adopting a conventionally known method corresponding to each metal. • It can be laminated in the range of 1 to 10 ⁇ m. In addition, two or more such plating layers can be laminated, and in this case, the metals constituting the respective plating layers may be the same as or different from each other.
- the aluminum foil As a thin film whose surface is composed of at least aluminum, using a 25 im thick aluminum foil processed into a thin film by rolling, first the aluminum foil is slit to a width of 25 Omm and a length of 10 Om, and then 50 g A degreasing treatment was performed by immersing in an immersion bath filled with 1/1 Estarine 30 (trade name, manufactured by Okuno Pharmaceutical Co., Ltd.) at a liquid temperature of 50 ° C. for 1 minute. Thereafter, washing was repeated four times. Then, the surface of the aluminum foil thus degreased is activated with acid by immersion in an immersion bath filled with 5% of sulfuric acid for 30 seconds at room temperature. Did. After repeated washing with water three times, it was drained and dried.
- 1/1 Estarine 30 trade name, manufactured by Okuno Pharmaceutical Co., Ltd.
- the entire surface of the stabilization layer of the aluminum-stabilized laminate thus obtained was subjected to an activation treatment with an acid by immersion in an immersion bath filled with 1% sulfuric acid for 30 seconds at room temperature. .
- the plating solution (copper sulfate 100 g Z 1, sulfuric acid 160 g / 1, chlorine 60 ppm and TOP LUTINA 380 H (Okuno Pharmaceutical Industries Co., Ltd.) was used using a continuous electric plating device. (Made of 10 cc Z 1) and continuously immerse the above aluminum stabilized laminate at a moving speed of 2. Om / min, under conditions of a liquid temperature of 30 ° C. and a current density of 4 AZdm 2 A galvanization layer of Cu with a thickness of 1.8 ⁇ (measured by a fluorescent X-ray film thickness measurement device) was laminated by electric plating for 2 minutes.
- the plate was washed with water three times, and then the plating solution (Sn 55 gZl, as an organic acid, Metath AM (trade name, manufactured by Shuken Kogyo Co., Ltd.) 1 20 g / K SB was used using the same continuous electric plating apparatus
- the aluminum-stabilized laminated body filled with SR (trade name, manufactured by Shuken Kogyo Co., Ltd. 50 cc / 1) and laminated with the Cu plating layer is continuously immersed at a moving speed of 2.0 mZ.
- liquid temperature 35 ° C (measured by a fluorescent X-ray thickness measuring device) by electric plated for 2 min S n in conditions of a current density 8AZdm 2, thickness 6 Myupaiarufa the plating layer made of Cu
- the plating layer consisting of S ⁇ was further deposited.
- an aluminum-stabilized laminate in which two plating layers consisting of Cu and S ⁇ ⁇ were laminated was obtained.
- a sample of a specified shape was cut from the obtained aluminum stabilized laminate, and after a baking treatment at 150 ° C. for 4 hours, a bending test was repeated four times, and the bending test was repeated four times. There is no problem with adhesion, and No outbreak of quake was observed. Also, in the solderability test at 240 ° C., the solderability was 98% or more, and there were no problems. For the sake of comparison, the same test was conducted on a sample in which two plating layers of Cu and Sn were laminated in the same manner as above except that the above-mentioned stabilization layer was not formed. As a result, in the bending test, full peeling of the fitting layer was observed, and in the solder wetting test, the solder wetting property was 0%, and sufficient solder properties were not shown.
- the thin film whose surface is composed of at least aluminum was subjected to an activation treatment with an acid, followed by washing with water and drying, all in the same manner as in Example 1.
- Cu was set as the first target and Ni was set as the second target on the surface of the aluminum aluminum foil thus activated using a sputtering apparatus, and the degree of vacuum was 1 . 3 when it reaches X 1 0 2 P a, a r gas was the 2 5 0 c cZ min Dzu' turned to set the output C u side 6 kW, the N i side 1 4 kW, the moving speed of zero.
- the following corrosion resistance test was done about the obtained aluminum stabilization layered product. That is, using a high-temperature and high-humidity tester (manufactured by Tabai Seisakusho), corrosion after 12 hours, 24 hours, 48 hours and 18 hours under the conditions of temperature 80 ° C. and humidity 90%. The sex was evaluated. The evaluation was made as “A” which was not corroded at all, “B” which was slightly corroded, and “C” which was considerably corroded. As a comparative example, the corrosiveness was evaluated under the same conditions with respect to one in which the stabilization layer was not laminated in the present example (that is, one whose surface is aluminum). The results are shown in Table 1.
- Comparative example ABCC As shown in Table 1, when the stabilization layer is laminated on the surface of the thin film whose surface is at least aluminum, the corrosion resistance is dramatically improved, and it is clear that the deterioration due to oxidation is prevented. Industrial applicability
- the entire surface of the thin film composed of at least aluminum is protected with a stabilization layer having a thickness of 0.01 to 1 zm. While it is possible to sufficiently protect the material from being oxidized or sulfided to be altered, the stabilization layer is made of metal, so the heat resistance is also very excellent. It is also very excellent in various characteristics such as soldering. Therefore, the aluminum stabilization laminated layer of the present invention is for wiring, conducting, circuit, bonding, soldering, or contact.
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/532,299 US20060240272A1 (en) | 2002-10-25 | 2003-10-07 | Stabilized aluminum laminate having aluminum and stabilizing layer laminated thereon |
AU2003268785A AU2003268785A1 (en) | 2002-10-25 | 2003-10-07 | Stabilized aluminum laminate having aluminum and stabilizing layer laminated thereon |
EP03748750A EP1564311A4 (en) | 2002-10-25 | 2003-10-07 | STABILIZED ALUMINUM LAMINATE OF ALUMINUM WITH STABILIZATION LAYER |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2002-311001 | 2002-10-25 | ||
JP2002311001A JP3520285B1 (ja) | 2002-10-25 | 2002-10-25 | アルミニウム安定化積層体 |
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WO2004038065A1 true WO2004038065A1 (ja) | 2004-05-06 |
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PCT/JP2003/012851 WO2004038065A1 (ja) | 2002-10-25 | 2003-10-07 | 安定化層を積層したアルミニウム安定化積層体 |
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US (1) | US20060240272A1 (ja) |
EP (1) | EP1564311A4 (ja) |
JP (1) | JP3520285B1 (ja) |
KR (1) | KR20050065583A (ja) |
CN (1) | CN1705770A (ja) |
AU (1) | AU2003268785A1 (ja) |
TW (1) | TW200424326A (ja) |
WO (1) | WO2004038065A1 (ja) |
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KR100662727B1 (ko) * | 2006-01-04 | 2006-12-28 | 동아대학교 산학협력단 | 강과 알루미늄 클래드재의 제조방법 및 그를 위한 원심주조기 |
JP5133527B2 (ja) * | 2006-04-20 | 2013-01-30 | 三菱電機株式会社 | 圧接型半導体装置の製造方法 |
KR100945201B1 (ko) | 2007-10-31 | 2010-03-03 | 한국전기연구원 | 안정화재가 형성된 초전도 박막선재 및 그의 접합방법 |
JP4918621B1 (ja) * | 2010-09-24 | 2012-04-18 | 神鋼リードミック株式会社 | 電子部品材 |
EP3179486B1 (en) * | 2014-08-05 | 2019-05-01 | Fujikura Ltd. | Oxide superconducting wire, superconducting device and method for producing oxide superconducting wire |
KR20170017165A (ko) * | 2015-08-05 | 2017-02-15 | 강릉원주대학교산학협력단 | 유도가열이 가능한 주방용기의 제조방법 |
JP6204953B2 (ja) * | 2015-09-18 | 2017-09-27 | 矢崎総業株式会社 | 端子付き電線及びそれを用いたワイヤーハーネス |
CN109072470A (zh) * | 2016-06-03 | 2018-12-21 | 古河电气工业株式会社 | 表面处理材料及其制造方法和使用表面处理材料而形成的元件 |
CN114481067B (zh) * | 2022-01-08 | 2022-11-29 | 沈阳富创精密设备股份有限公司 | 一种超纯、超厚、致密铝膜的制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6126770A (ja) * | 1984-07-16 | 1986-02-06 | Tanaka Kikinzoku Kogyo Kk | Mg,Mg合金,A1,A1合金上へのAu,Ag,Cuのコ−テイング方法 |
JP2000212726A (ja) * | 1999-01-25 | 2000-08-02 | Toyo Metallizing Co Ltd | 金属蒸着アルミニウム箔 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3620933A (en) * | 1969-12-31 | 1971-11-16 | Macdermid Inc | Forming plastic parts having surfaces receptive to adherent coatings |
BE788117A (fr) * | 1971-08-30 | 1973-02-28 | Perstorp Ab | Procede de production d'elements pour circuits imprimes |
GB1415653A (en) * | 1972-01-06 | 1975-11-26 | Thorpe J E | Process for treating aluminium foil |
US3920413A (en) * | 1974-04-05 | 1975-11-18 | Nasa | Panel for selectively absorbing solar thermal energy and the method of producing said panel |
DE3517631A1 (de) * | 1984-11-07 | 1986-05-07 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen elektrischer plasmapolymerer vielschichtkondensatoren |
JPH04143292A (ja) * | 1990-10-05 | 1992-05-18 | Hitachi Ltd | アルミニウム合金のメッキ方法 |
US5908542A (en) * | 1997-07-02 | 1999-06-01 | Gould Electronics Inc. | Metal foil with improved bonding to substrates and method for making the foil |
US6183880B1 (en) * | 1998-08-07 | 2001-02-06 | Mitsui Mining & Smelting Co., Ltd. | Composite foil of aluminum and copper |
US6299721B1 (en) * | 1998-12-14 | 2001-10-09 | Gould Electronics Incl | Coatings for improved resin dust resistance |
US6399152B1 (en) * | 2000-07-27 | 2002-06-04 | Goodrich Technology Corporation | Vacuum metalization process for chroming substrates |
-
2002
- 2002-10-25 JP JP2002311001A patent/JP3520285B1/ja not_active Expired - Lifetime
-
2003
- 2003-10-07 CN CNA2003801019132A patent/CN1705770A/zh active Pending
- 2003-10-07 EP EP03748750A patent/EP1564311A4/en not_active Withdrawn
- 2003-10-07 AU AU2003268785A patent/AU2003268785A1/en not_active Abandoned
- 2003-10-07 US US10/532,299 patent/US20060240272A1/en not_active Abandoned
- 2003-10-07 WO PCT/JP2003/012851 patent/WO2004038065A1/ja active Application Filing
- 2003-10-07 KR KR1020057006083A patent/KR20050065583A/ko not_active Application Discontinuation
- 2003-10-13 TW TW092128318A patent/TW200424326A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6126770A (ja) * | 1984-07-16 | 1986-02-06 | Tanaka Kikinzoku Kogyo Kk | Mg,Mg合金,A1,A1合金上へのAu,Ag,Cuのコ−テイング方法 |
JP2000212726A (ja) * | 1999-01-25 | 2000-08-02 | Toyo Metallizing Co Ltd | 金属蒸着アルミニウム箔 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1564311A4 * |
Also Published As
Publication number | Publication date |
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CN1705770A (zh) | 2005-12-07 |
KR20050065583A (ko) | 2005-06-29 |
AU2003268785A1 (en) | 2004-05-13 |
JP3520285B1 (ja) | 2004-04-19 |
TW200424326A (en) | 2004-11-16 |
EP1564311A1 (en) | 2005-08-17 |
US20060240272A1 (en) | 2006-10-26 |
EP1564311A4 (en) | 2007-08-15 |
JP2004143547A (ja) | 2004-05-20 |
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