WO2002103086A1 - Fil de connecteur et procede de fabrication de ce dernier - Google Patents

Fil de connecteur et procede de fabrication de ce dernier Download PDF

Info

Publication number
WO2002103086A1
WO2002103086A1 PCT/JP2002/005811 JP0205811W WO02103086A1 WO 2002103086 A1 WO2002103086 A1 WO 2002103086A1 JP 0205811 W JP0205811 W JP 0205811W WO 02103086 A1 WO02103086 A1 WO 02103086A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
plating layer
plating
copper
tin
Prior art date
Application number
PCT/JP2002/005811
Other languages
English (en)
Japanese (ja)
Inventor
Minori Otani
Nobuyasu Dohi
Takeshi Ichimonji
Original Assignee
Nippon Shindo Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Shindo Co., Ltd. filed Critical Nippon Shindo Co., Ltd.
Priority to JP2003505394A priority Critical patent/JPWO2002103086A1/ja
Publication of WO2002103086A1 publication Critical patent/WO2002103086A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0607—Wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium

Definitions

  • the present invention relates to a wire for a connector, which is used as a connector material for electrical and electronic parts, and a method of manufacturing the same.
  • a plating wire used as a lead wire of an electric plug and an electronic part has been disclosed in, for example, Japanese Patent No. 2724020.
  • copper or copper alloy with good conductivity is used as a wire material, and nickel plating or copper plating is applied on this wire material as a base plating, and tin or tin alloy is applied on this base plating. It has a plated wire structure.
  • the type of lower layer plating affects the performance of the product after plating.
  • a structure using copper plating is compatible with the upper layer tin or tin alloy plating, and even if the upper layer tin or tin alloy is liquefied due to high temperature, the copper surface is easily wetted by the liquefied metal. While it has the advantage of being less effective in preventing the diffusion of harmful metals from the base metal to the upper layer tin or tin alloy plating layer, the solder metal wetting progresses as the diffusion of harmful metals from the base metal progresses with the passage of time. It has the disadvantage that sexuality declines significantly. '
  • the diffusion preventing effect of harmful metals from the base metal to the upper layer tin or tin alloy plating layer is very excellent, but the compatibility with the upper layer tin or tin alloy plating
  • the above-mentioned copper plating structure is superior, and the solder wettability at the time of high temperature liquefaction of the upper layer plating is inferior to that of the copper plating structure.
  • the present invention adopts copper or nickel as the lower layer in the prior art.
  • Solder that has all the disadvantages of the above structure and has the effect of preventing the diffusion of harmful metals from the base metal to the upper layer tin or tin alloy plating layer, while maintaining excellent characteristics in the lower layer plating It is an object of the present invention to provide a connector wire having wettability and a method for producing the same. Disclosure of the invention
  • the connector wire of the present invention is a wire for a connector used for a connector material of electric / electronic device parts, and a nickel plating layer and a copper plating layer are sequentially laminated on a wire material made of copper or copper alloy. It is characterized by the formation of a two-layer lower plating layer and the formation of an upper reflow plating layer of tin or tin alloy on the lower plating layer.
  • the method for producing this connector wire is to form an undercoat layer consisting of these two layers by sequentially laminating a nickel plating layer and a copper plating layer on a wire material made of copper or copper alloy. Then, tin plating or tin alloy plating is applied on the lower layer plating layer, and a heat reflow process is performed to form an upper layer reflow plating layer.
  • wire material of the connector wire of the present invention materials conventionally used such as brass and phosphor bronze can be used. Also, the cross-sectional shape of the wire material is
  • It can be of any shape such as approximately square or circular.
  • the connector wire of the present invention it is possible to ensure stable solderability at all times even when time passes. This is achieved by the following actions.
  • the copper plating layer becomes an interface with the molten solder during soldering, and stable solderability can be secured.
  • the nickel plating layer was applied as the lower layer plating layer, in the connector wire with a relatively thin upper layer plating layer, defects such as pinholes that may occur in the upper layer plating layer If this occurs, the underlying plating layer is adversely affected by the environment and the solderability deteriorates. In the present invention, these problems are eliminated.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of the connector wire of the present invention.
  • the connector wire 1 is formed by applying a nickel plating layer 12 as a first layer of a lower layer glazing layer to the surface of a square wire 1 1 having a substantially square cross section shape made of brass.
  • a copper plating layer 13 is provided as a second layer of the lower plating layer.
  • reflow-tin-plated layer 14 is applied as a top-plated layer on copper-plated layer 13.
  • the method of manufacturing the connector wire 1 is a cross section made of brass A nickel plating layer 12 and a copper plating layer 13 are sequentially laminated on the surface of the square wire 11 having a substantially square shape to form a lower plating layer composed of these two layers. Then, after applying a tin plating layer 14 as an upper plating layer on the copper plating layer 13, it is manufactured by heat reflow treatment and immediately thereafter quenching.
  • a nickel plating solution such as a plating bath or a sulfuric acid bath is used as a plating solution for applying the nickel plating layer 12 of the first layer of the lower layer plating layer. Be done. Further, as a plating solution for applying the copper plating layer 13 as the second layer of the lower layer plating layer, a copper plating solution such as a cyan bath or a sulfuric acid bath is used. Further, as a plating solution for applying a tin plating layer of the upper plating layer, tin plating solutions such as a sulfuric acid bath, an alkaline bath and an organic sulfonic acid bath are used.
  • the tin plating layer 14 is formed as the upper plating layer, but instead of this, a tin alloy plating layer may be provided.
  • a tin alloy plating solution such as a borofluorination bath or an organic sulfonic acid bath is used.
  • a heating apparatus such as an atmosphere furnace using high-frequency electricity or gas, a high frequency induction furnace, or the like can be used.
  • a method of cooling immediately after this reflow treatment a method of passing in a liquid such as water or hot water can be adopted.
  • the cross-sectional shape is a substantially square, and a nickel plating layer of 0.5 m in film thickness and 0.5 ⁇ m ⁇ in thickness on a corner made of brass with one side of 0.64 mm.
  • a copper-plated layer and a tin upper reflow-plated layer with a thickness of 1.5 m are sequentially laminated.
  • Comparative Example 1 and Comparative Example 2 are prepared and evaluated.
  • Comparative Example 1 a 1.0 ⁇ m thick nickel lower layer plating layer and a 1.5 m thick tin upper layer reflow plating layer were sequentially stacked on the same square line as in Example 1.
  • Comparative example 2 a 1.0 ⁇ m thick nickel lower layer plating layer and a 1.5 m thick tin upper layer reflow plating layer were sequentially stacked on the same square line as in Example 1.
  • Comparative Example 2 on the same square line as in Example 1, a copper underlayer plating layer with a thickness of 1. ⁇ and a tin upper layer reflow plating layer with a thickness of 1. ⁇ m are sequentially laminated.
  • a copper underlayer plating layer with a thickness of 1. ⁇ and a tin upper layer reflow plating layer with a thickness of 1. ⁇ m are sequentially laminated.
  • the “appearance” is an evaluation of whether or not there is no occurrence of color change and the appearance of the same level as the initial level is maintained. Also, if occurrence of discoloration is observed, the evaluation is indicated by attaching "X".
  • “Solder wettability” means that after the upper plating layer, that is, the upper tin reflow plating layer is applied, the test on three items (wettability test) of wetting, solder adhesion area and appearance is carried out. The evaluation of “sex” was expressed as a comprehensive evaluation of these. In this evaluation, those that can be used are "O" (pass), those that can be used depending on the conditions of use are “C” (conditional pass), and those that can not be used "X”. Expressed as (failed).
  • the heating test in this evaluation is intended to evaluate the influence of the diffusion of harmful metals from the base metal to the upper glazing layer, and by exposing the test material to a high temperature atmosphere of 130 ° C, It is done by promoting diffusion.
  • a high temperature atmosphere of 130 ° C
  • so 2 gas atmosphere SO 2 gas does not affect pure tin to discolor, etc., but it discolors to tin containing some harmful metals such as zinc. Since it has an action to be able to evaluate the appearance of discoloration due to the influence of the diffusion of such harmful metals, it is possible to evaluate the solder wettability at such discolored parts.
  • the second, third, and fourth embodiments of the present invention have a substantially square cross-sectional shape, and the film thickness is 0.25 / m and 0.5 ⁇ m on a square line of 0.64 mm on one side.
  • a nickel plating layer of 1.0 ⁇ m and a copper plating layer of the same thickness as the nickel plating layer are sequentially laminated as a lower layer plating layer, and a tin upper layer of 1.0 ⁇ m thickness is formed on the lower layer plating layer.
  • a reflow plating layer is laminated.
  • the film thickness of the upper layer glazing layer of the test piece in each of these tests was set to 1.0. Zm, this was considered as a condition based on practicality in consideration of the relatively thin film thickness used for the connector wire. It is set. In this way, it is possible to evaluate the influence of the lower overlay layer on defects such as pinholes that may occur in the upper overlay layer.
  • Example 1 in which a nickel plating layer was used as the first layer of the lower layer plating layer and a nickel plating layer was used as the lower layer plating layer.
  • Comparative Example 1 the effect of preventing the diffusion of harmful metals is high, and stable solderability is ensured even if time passes.
  • the connector wire according to the present invention has a two-layer structure in which a nickel plating layer and a copper plating layer are sequentially laminated as the lower layer plating layer, so the nickel plating layer is formed as the lower layer plating layer. It is possible to eliminate any defects in the structure of only the copper plating layer or copper plating layer. That is, according to the connector single wire according to the present invention, the product can be stored without deterioration, and good solderability can be secured even if time passes.
  • the wire material having a substantially square cross section square line
  • the present invention is not limited thereto.
  • a round wire having a circular cross section can be used.
  • each plating layer is not limited to the thickness of the plating layer in each example, and the thickness may be appropriately selected as long as it is the configuration of the plating layer consisting of three layers included in the scope of the present invention. It is needless to say that selection is possible. Industrial applicability
  • the product can be stored without deterioration over time, and moreover, excellent solderability can be ensured. It is useful.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

La présente invention concerne un fil (1) de connecteur qu'on utilise en tant que matériau de connexion pour un constituant d'un dispositif électrique ou électronique et son procédé de fabrication. Le fil (1) de connecteur comporte une couche de placage inférieure formée de deux couches, c'est-à-dire d'une couche (12) de nickelage et d'une couche (13) de cuivrage qui sont successivement formées sur un matériau (11) de fil en cuivre ou en alliage de cuivre. Une couche supérieure (14) de placage par refusion en étain ou en alliage d'étain est formée sur la couche de placage inférieure.
PCT/JP2002/005811 2001-06-18 2002-06-10 Fil de connecteur et procede de fabrication de ce dernier WO2002103086A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003505394A JPWO2002103086A1 (ja) 2001-06-18 2002-06-10 コネクター用ワイヤーおよびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPPCT/JP01/05184 2001-06-18
JP0105184 2001-06-18

Publications (1)

Publication Number Publication Date
WO2002103086A1 true WO2002103086A1 (fr) 2002-12-27

Family

ID=11737450

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/005811 WO2002103086A1 (fr) 2001-06-18 2002-06-10 Fil de connecteur et procede de fabrication de ce dernier

Country Status (2)

Country Link
JP (1) JPWO2002103086A1 (fr)
WO (1) WO2002103086A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008269999A (ja) * 2007-04-20 2008-11-06 Kobe Steel Ltd 嵌合型コネクタ用端子及びその製造方法
JP2009208106A (ja) * 2008-03-03 2009-09-17 Furukawa Electric Co Ltd:The コネクタ用めっき角線材料
JP2009263786A (ja) * 2008-03-31 2009-11-12 Furukawa Electric Co Ltd:The 接続部品用金属材料およびその製造方法
JP2009263785A (ja) * 2008-03-31 2009-11-12 Furukawa Electric Co Ltd:The 接続部品用金属材料およびその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61177393A (ja) * 1985-01-31 1986-08-09 Furukawa Electric Co Ltd:The リン青銅のＳｎ又はＳｎ合金メツキ方法
JPH04165096A (ja) * 1990-10-26 1992-06-10 Kyowa Densen Kk 電子部品用リード線
JPH11350188A (ja) * 1998-06-03 1999-12-21 Furukawa Electric Co Ltd:The 電気・電子部品用材料とその製造方法、およびその材料を用いた電気・電子部品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61177393A (ja) * 1985-01-31 1986-08-09 Furukawa Electric Co Ltd:The リン青銅のＳｎ又はＳｎ合金メツキ方法
JPH04165096A (ja) * 1990-10-26 1992-06-10 Kyowa Densen Kk 電子部品用リード線
JPH11350188A (ja) * 1998-06-03 1999-12-21 Furukawa Electric Co Ltd:The 電気・電子部品用材料とその製造方法、およびその材料を用いた電気・電子部品

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008269999A (ja) * 2007-04-20 2008-11-06 Kobe Steel Ltd 嵌合型コネクタ用端子及びその製造方法
JP2009208106A (ja) * 2008-03-03 2009-09-17 Furukawa Electric Co Ltd:The コネクタ用めっき角線材料
JP2009263786A (ja) * 2008-03-31 2009-11-12 Furukawa Electric Co Ltd:The 接続部品用金属材料およびその製造方法
JP2009263785A (ja) * 2008-03-31 2009-11-12 Furukawa Electric Co Ltd:The 接続部品用金属材料およびその製造方法

Also Published As

Publication number Publication date
JPWO2002103086A1 (ja) 2005-08-04

Similar Documents

Publication Publication Date Title
JP3880877B2 (ja) めっきを施した銅または銅合金およびその製造方法
TW201005124A (en) Composite material for electrical/electronic component and electrical/electronic component using the same
JP2006070340A (ja) 錫めっき皮膜及びそれを備えた電子部品並びにその製造方法
US6207298B1 (en) Connector surface-treated with a Sn-Ni alloy
WO2002103086A1 (fr) Fil de connecteur et procede de fabrication de ce dernier
JP3730120B2 (ja) 無鉛基板の製法
US20130192873A1 (en) Structure body and electronic component and printed wiring board including the same
US6117566A (en) Lead frame material
JPH01283780A (ja) ＳｎまたはＳｎ合金被覆材料
TW201114952A (en) Method for inhibiting growth of tin whiskers
JPH04255259A (ja) 半導体装置用リードフレーム
JP4427044B2 (ja) フレキシブル基板用導体およびその製造方法並びにフレキシブル基板
JPS6036000B2 (ja) 耐熱銀被覆銅線およびその製造方法
JP2000164782A (ja) 鉛を含まない錫ベース半田皮膜を有する半導体装置およびその製造方法
JPH07105164B2 (ja) アルミニウム合金製電子電気機器導電部品
JPH0529517A (ja) 半導体装置用リードフレーム
JP3857219B2 (ja) 配線基板およびその製造方法
JP3792642B2 (ja) 配線基板およびその製造方法
JP2628749B2 (ja) 耐熱性に優れた電子・電機部品用ＳｎまたはＳｎ合金被覆材料
JPS5837923B2 (ja) 耐熱性配線用電気導体
JP2003147573A (ja) 電子部品の製造方法、及び電子部品
JPS6342393A (ja) 銅または銅合金線条体の錫または錫合金メツキ方法
JP4856745B2 (ja) フレキシブル基板用導体およびその製造方法並びにフレキシブル基板
JP2006161146A (ja) ウィスカー発生を抑制したＣｕ−Ｚｎ系合金のＳｎめっき条及びその製造方法
JP5925422B2 (ja) ジョイント端子およびその製造方法

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): JP

WWE Wipo information: entry into national phase

Ref document number: 2003505394

Country of ref document: JP