WO2004023392A1 - Rfidタグ - Google Patents
Rfidタグ Download PDFInfo
- Publication number
- WO2004023392A1 WO2004023392A1 PCT/JP2003/011267 JP0311267W WO2004023392A1 WO 2004023392 A1 WO2004023392 A1 WO 2004023392A1 JP 0311267 W JP0311267 W JP 0311267W WO 2004023392 A1 WO2004023392 A1 WO 2004023392A1
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- WIPO (PCT)
- Prior art keywords
- semiconductor device
- antenna
- rfid tag
- connection
- terminal
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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Definitions
- the present invention relates to RF ID tags.
- the general semiconductor device mounting techniques can be broadly classified into wire bonding and wireless bonding.
- Wire bonding is an unsuitable technology for thinning RF ID tags because it bonds in an arc between the terminals of the semiconductor device and the pads of the wiring board.
- wireless bonding is suitable for reducing the thickness of an RFTD tag because the distance between a terminal of a semiconductor device and a wiring board is short and linear connection is possible.
- the wireless bonding includes a contact connection and a metal connection.
- ACF Anisometric Conductive Film
- the mounting technology of semiconductor devices of several mm square used in wireless IC cards is less than lmm square, especially 0.5 mm square or less (0.25 mm 2 or less in area conversion). It cannot be applied to the mounting of the conductor device as it is, and it is necessary to consider other parameters.
- an object of the present invention is to improve the connection reliability of an RFID tag on which a semiconductor device having a size of 0.5 mm square or less is mounted.
- this metal bonding is made of an alloy of gold and tin from the viewpoint of realizing lead-free and shorter tact time.
- FIG. 1 is a top view and a cross-sectional view of an RFID tag
- Fig. 2 is an enlarged transparent view of the joint between the semiconductor device and the antenna.
- FIG. 3 is a diagram showing characteristics relating to the connection resistance value of the RFID tag.
- Figure 4 shows the mounting structure that adopts the ACF method.
- Fig. 5 is a diagram showing the characteristics of the connection resistance value of the RFID tag when joined by the ACF method.
- FIG. 6 is a diagram showing the connection failure rate between the ACF method and the metal bonding method of gold and tin, and
- FIG. 7 is a diagram showing the strength when the underfill is present and when it is not.
- Fig. 1 shows a top view and a cross-sectional view of the RFID tag
- Fig. 2 shows an enlarged transparent view of the junction between the semiconductor device and the antenna.
- the R FID tag of this embodiment is a semiconductor device mounted on an antenna by a flip-chip method having an ID transmission function, and has a thickness of 0.13 mm as a whole tag.
- the semiconductor device is back-ground so as to have a thickness of 0.06 mm, and has an outer shape of 0.5 mm square.
- the two input / output terminals connected directly to the integrated circuit inside the semiconductor device by wiring and the two connection terminals not directly connected to the integrated circuit inside the semiconductor device, for a total of four terminals, are the center of gravity of the semiconductor device.
- the input / output terminals, the connection terminals, the input / output terminals, and the connection terminals are formed in the order of 90 ° with respect to the center (the input / output terminals and the connection terminals are arranged facing each other).
- This semiconductor device is a semiconductor device that receives microwaves in the 2.45 GHz band with an antenna and operates using self-rectification generated by the microwave power as a power source, and receives such microwave signals. It has a function to convert 128-bit data stored in the built-in storage device into a transmission signal and send it back to the antenna by using the trigger as a trigger.
- the antenna has a 56 mm long copper foil with a slight gap formed on the outer edge of the polyimide tape, and a tin plating film is formed on the end of the antenna on which the semiconductor device is mounted. ing.
- All the terminals of the semiconductor device and the copper foil of the antenna are joined by an alloy of gold and tin. Further, an underfill is disposed between the side and bottom surfaces of the semiconductor device and the copper foil.
- connection terminals are provided to ensure a balanced connection, so it is sufficient to provide only two input / output terminals and one connection terminal.
- This structure can be manufactured by the following steps.
- Step 1 An antenna is formed by bonding copper foil with an adhesive on one main plane of a polyimide film (polyimide tape) that is a resin film. Tin is plated on the adhered copper foil to make connection pads (connection electrodes).
- a polyimide film polyimide tape
- connection pads connection electrodes
- Step 2 gold bumps are formed on all terminals of the semiconductor device.
- Step 3 Fix the antenna so that the tin plated in step 1 is the top layer. Further Next, the antenna and the semiconductor device are aligned with the terminal surface of the semiconductor device facing downward so that the gold bump formed in step 2 and the tin of the antenna face each other.
- Step 4 The semiconductor device, which is a non-terminal surface, is pressurized from above to below with a pressure of 20 OMPa, and is temporarily fixed by heating at 150 ° C. for 1.5 seconds.
- Step 5 Further, the positioning is performed with high accuracy, pressurized at a pressure of 20 OMPa, and heated at 280 ° C for 3 seconds. This heating causes tin to diffuse into the gold, so that the terminals of the semiconductor device and the copper foil of the antenna are metal-joined by a gold-tin alloy.
- Step 6 An underfill is formed below the semiconductor device.
- the RFID tag manufactured by the above manufacturing method has the characteristics shown in (a) of FIG.
- connection resistance As a result of a high-temperature and high-humidity test at 85 ° C and 85% RH, a connection resistance of only about 10 m ⁇ was generated in about 350 cycles. Since it is known that about 10 ⁇ ⁇ ⁇ affects transmission characteristics, such characteristics can be said to be good connection resistance.
- connection resistance As a result of a temperature cycle test of 50 ° C to 125 ° C for 30 minutes each, a connection resistance of less than 2 ⁇ was not generated in 350 cycles, and a high temperature and high humidity test result was obtained. It can be said that the connection resistance is good as in the case of.
- the temperature of the temporary fixing in the above-mentioned manufacturing process 4 was set at 225 ° C, even when the temperature cycle test was performed, since only about 1 ⁇ was generated in 43 cycles, the temperature of the temporary fixing was set. As in the case where the temperature was set to 150 ° C., good connection resistance could be obtained.
- the RFID tag of this embodiment employs metal bonding for bonding the semiconductor device having a size of 0.5 mm square or less to the antenna, the occurrence of desired connection failure can be reduced.
- input and output terminals since both are the same function, by disposing so as to face diagonally of the semiconductor device, 1 8 0 degree also c becomes possible to bond the opposite direction, the antenna tin
- two terminals that is, a structure in which one input / output terminal and one connection terminal are joined by one connection terminal, it is possible to achieve a structure that does not cause a connection failure even with a slight rotational deviation. become. Also, with this structure, bonding can be performed even when rotated by 90 degrees or 270 degrees, so that bonding can be further facilitated.
- Fig. 7 shows the difference in strength between the case with and without underfill.
- the thickness of the semiconductor device of this embodiment is reduced by performing back grinding. Due to this back grinding, small micro cracks are generated in the semiconductor device. It can be seen that the formation of an underfill in such a structure is more than twice as strong against external point pressure breakdown as compared to the case without underfill.
- Figure 4 shows the mounting method when the ACF method is used.
- An antenna is formed by bonding 56 mm long copper foil on a transparent polyethylene terephthalate film (hereinafter, PET film).
- PET film transparent polyethylene terephthalate film
- a gold bump is formed on a semiconductor device, and a semiconductor device and an antenna are arranged so that the gold bump and the ACF face each other, and are temporarily fixed.
- Figure 5 shows the results of a high-temperature and high-humidity test (85 ° C, 85% RH) when joining by the ACF method manufactured by the method in Fig. 4.
- connection resistance of several hundred ⁇ occurs in 25 hours. Even when a 0.5 mm square semiconductor device is mounted, a connection resistance of several hundreds ⁇ or more occurs after 100 hours.
- ACF method is used for mounting a semiconductor device having a size of 0.5 mm square or less, a remarkable increase in connection resistance that has not occurred in a conventional semiconductor device occurs.
- the area of ACF per terminal can be sufficiently secured and the desired connection stability can be obtained. Since the terminal area of a semiconductor device that is less than 0.5 mm square that constitutes an RFID tag is very large with respect to the device area, the ACF adhesion capacity (thermal shrinkage force + cure shrinkage force) per terminal decreases. This is considered to be because the connection stability with the copper foil is reduced.
- Figure 6 compares the failure rate between the ACF method and the gold and tin metal bonding method.
- the defect rate is 1 even after 1300 hours. /. The following good connections were maintained.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Credit Cards Or The Like (AREA)
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Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03794211A EP1536373A1 (en) | 2002-09-04 | 2003-09-03 | Rfid tag |
US10/513,995 US20060086805A1 (en) | 2002-09-04 | 2003-09-03 | Rfid tag |
AU2003261913A AU2003261913A1 (en) | 2002-09-04 | 2003-09-03 | Rfid tag |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002258391A JP2004094839A (ja) | 2002-09-04 | 2002-09-04 | Rfidタグ |
JP2002-258391 | 2002-09-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004023392A1 true WO2004023392A1 (ja) | 2004-03-18 |
Family
ID=31973028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/011267 WO2004023392A1 (ja) | 2002-09-04 | 2003-09-03 | Rfidタグ |
Country Status (7)
Country | Link |
---|---|
US (1) | US20060086805A1 (ja) |
EP (1) | EP1536373A1 (ja) |
JP (1) | JP2004094839A (ja) |
KR (1) | KR100705529B1 (ja) |
CN (1) | CN1653484A (ja) |
AU (1) | AU2003261913A1 (ja) |
WO (1) | WO2004023392A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11213773B2 (en) | 2017-03-06 | 2022-01-04 | Cummins Filtration Ip, Inc. | Genuine filter recognition with filter monitoring system |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4567988B2 (ja) * | 2004-02-05 | 2010-10-27 | 株式会社日立製作所 | 紙状rfidタグおよびその製造方法 |
JP2006252050A (ja) * | 2005-03-09 | 2006-09-21 | Matsushita Electric Ind Co Ltd | Icカードモジュール |
US7635014B2 (en) * | 2005-11-11 | 2009-12-22 | Semiconductor Energy Laboratory Co., Ltd. | Method for pressure bonding and method for manufacturing semiconductor device |
JP4992465B2 (ja) | 2007-02-22 | 2012-08-08 | 富士通株式会社 | Rfidタグおよびrfidタグの製造方法 |
US7651882B1 (en) * | 2007-08-09 | 2010-01-26 | Impinj, Inc. | RFID tag circuit die with shielding layer to control I/O bump flow |
US8059478B2 (en) * | 2008-12-04 | 2011-11-15 | Kovio, Inc. | Low cost testing and sorting for integrated circuits |
Citations (5)
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JP2000200328A (ja) * | 1998-10-01 | 2000-07-18 | Hitachi Maxell Ltd | 半導体装置 |
JP2001084343A (ja) * | 1999-09-16 | 2001-03-30 | Toshiba Corp | 非接触icカード及びicカード通信システム |
JP2001127425A (ja) * | 1999-10-28 | 2001-05-11 | Seiko Epson Corp | 配線基板及びその接合方法、実装部品の実装及び接合方法、電子部品、回路基板並びに電子機器 |
JP2002016195A (ja) * | 2000-06-29 | 2002-01-18 | Hitachi Cable Ltd | 半導体装置及び製造方法及び電子装置 |
JP2003258528A (ja) * | 2002-02-27 | 2003-09-12 | Toppan Forms Co Ltd | Icチップ実装体 |
Family Cites Families (6)
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JPH0677844B2 (ja) * | 1987-10-03 | 1994-10-05 | 好高 青山 | 部品供給装置 |
US5528222A (en) * | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
US6154137A (en) * | 1998-06-08 | 2000-11-28 | 3M Innovative Properties Company | Identification tag with enhanced security |
JP4159431B2 (ja) * | 2002-11-15 | 2008-10-01 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
JP4438558B2 (ja) * | 2003-11-12 | 2010-03-24 | 株式会社日立製作所 | Rfidタグの製造方法 |
JP4567988B2 (ja) * | 2004-02-05 | 2010-10-27 | 株式会社日立製作所 | 紙状rfidタグおよびその製造方法 |
-
2002
- 2002-09-04 JP JP2002258391A patent/JP2004094839A/ja active Pending
-
2003
- 2003-09-03 CN CNA038107368A patent/CN1653484A/zh active Pending
- 2003-09-03 WO PCT/JP2003/011267 patent/WO2004023392A1/ja not_active Application Discontinuation
- 2003-09-03 EP EP03794211A patent/EP1536373A1/en not_active Withdrawn
- 2003-09-03 KR KR1020047018185A patent/KR100705529B1/ko not_active IP Right Cessation
- 2003-09-03 US US10/513,995 patent/US20060086805A1/en not_active Abandoned
- 2003-09-03 AU AU2003261913A patent/AU2003261913A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000200328A (ja) * | 1998-10-01 | 2000-07-18 | Hitachi Maxell Ltd | 半導体装置 |
JP2001084343A (ja) * | 1999-09-16 | 2001-03-30 | Toshiba Corp | 非接触icカード及びicカード通信システム |
JP2001127425A (ja) * | 1999-10-28 | 2001-05-11 | Seiko Epson Corp | 配線基板及びその接合方法、実装部品の実装及び接合方法、電子部品、回路基板並びに電子機器 |
JP2002016195A (ja) * | 2000-06-29 | 2002-01-18 | Hitachi Cable Ltd | 半導体装置及び製造方法及び電子装置 |
JP2003258528A (ja) * | 2002-02-27 | 2003-09-12 | Toppan Forms Co Ltd | Icチップ実装体 |
Cited By (1)
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US11213773B2 (en) | 2017-03-06 | 2022-01-04 | Cummins Filtration Ip, Inc. | Genuine filter recognition with filter monitoring system |
Also Published As
Publication number | Publication date |
---|---|
EP1536373A1 (en) | 2005-06-01 |
KR100705529B1 (ko) | 2007-04-10 |
JP2004094839A (ja) | 2004-03-25 |
KR20050025181A (ko) | 2005-03-11 |
AU2003261913A1 (en) | 2004-03-29 |
CN1653484A (zh) | 2005-08-10 |
US20060086805A1 (en) | 2006-04-27 |
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