Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
  • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
  • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
  • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
  • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
  • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Definitions

• the present invention relates to a maintenance system for a substrate processing apparatus, a substrate processing apparatus, a remote control apparatus, and a communication method.
• Semiconductor devices are manufactured using coating and developing equipment, exposure equipment, and etching equipment installed in factories.
• a coating and developing apparatus is equipped with a plurality of processing units, such as a resist coating unit, a developing unit, and a heating unit, and a board transport unit.
• One photolithography process in the manufacture of semiconductor devices is performed by sequentially transferring substrates to each processing unit by a substrate transfer unit and performing predetermined processing on the substrate in each processing unit.
• factory workers are not engineers who manufacture the coating and developing equipment itself, they usually do not have much knowledge about coating and developing equipment. For this reason, even if a trouble occurs in the coating and developing equipment, the workers at the factory often cannot take appropriate measures for the trouble. In such cases, factory workers have traditionally entrusted the manufacturer of the coating and developing equipment with handling the trap. The contracted manufacturer's staff provided instructions to the workers on the coating and developing equipment by phone, oilshimiri, etc., or went to the factory where the coating and developing equipment was installed and dealt with them. .
• the person in charge of the manufacturer gives instructions via telephone, facsimile, etc. If given, detailed information could not be exchanged with each other, and the problem could not be dealt with properly and promptly.
• a person in charge of a manufacturer goes to a factory, it often takes time to arrive, and prompt response is often not possible.
• troubles occur at multiple locations at the same time, multiple persons must be dispatched at once.
• the coating / developing equipment is operated from a remote location using a communication network such as the Internet or LAN (local “area” network), and the trouble of the coating / developing equipment is solved.
• a remote maintenance system that solves the problem can be proposed. According to this remote maintenance system, one skilled person in charge of the manufacturer can respond quickly and appropriately to troubles and regular maintenance.
• operations from remote locations are operations that are not visible.
• a manufacturer in a remote location drives the coating / developing equipment without knowing that the worker is approaching the coating / developing equipment in the factory, the manufacturer moved by the drive. Workers may be injured by contact between members and workers.
• a third party approaches the substrate processing equipment without knowing that remote control is being performed when the worker of the substrate processing equipment leaves the site for some reason, Inadvertent driving may cause injury. Therefore, it is necessary to take some measures to ensure the safety of such remote operation. Disclosure of the invention
• the present invention has been made in view of the above points, and has been developed in view of the following points. Its purpose is to provide an operating device and a communication method.
• the present invention relates to a maintenance system for a substrate processing apparatus, which transmits remote operation information to a substrate processing apparatus through a communication network and provides remote operation information to the substrate processing apparatus, thereby enabling a substrate processing apparatus to be remotely operated.
• a remote control device for operating the device, and a communication control device for receiving the remote control information transmitted to the substrate processing device and providing the remote control information to the substrate processing device.
• the apparatus provides the remote operation information to the substrate processing apparatus only when the setting of the permission of the worker on the substrate processing apparatus side for the remote operation is provided.
• the remote location is not limited to the outside of the factory where the substrate processing equipment is installed, but may be in the same factory.
• the remote control information is provided to the substrate processing apparatus by the communication control device only when the permission setting of the worker is set, the remote control of the substrate processing apparatus is performed when the worker is not aware. It will not be done.
• the setting can be prohibited and remote control can be disabled, so that a third party does not approach the substrate processing equipment being remotely controlled. Become. Therefore, workers and third parties are not injured by contacting the substrate processing equipment being operated remotely, and the safety of remote maintenance work is improved.
• the communication control device may include a permission setting unit that performs the permission setting for remote operation, and the permission setting unit may be provided only on the substrate processing device side of the communication network.
• remote control permission setting cannot be performed from the remote control device side. Therefore, the remote control side does not change the permission setting without permission and the remote control is not performed, so that the substrate processing apparatus does not start moving against the intention of the operator of the substrate processing apparatus.
• the permission setting for remote operation may be divided into a plurality of stages. In this case, only dangerous remote control can be selectively permitted depending on the situation.
• permission setting for remote operation with driving of the substrate processing apparatus and permission setting for remote operation without driving of the substrate processing apparatus are included in different stages. May be. In such a case, for example, only a remote operation that does not involve driving of the substrate processing apparatus such as an operation of changing a set value can be permitted, and a remote operation that does not involve driving of the substrate processing apparatus can be prohibited. By doing so, for example, even when a worker temporarily leaves the site, some remote operations can be continued, and maintenance work can be performed efficiently.
• the remote operation involving driving of the substrate processing apparatus is a remote operation involving physical movement of various kinds of data such as a substrate transfer member in the substrate processing apparatus, and is a remote operation without driving the substrate processing apparatus. May be a remote operation that does not involve physical movement of the various specifications.
• the remote operation involving the driving of the substrate processing apparatus includes a substrate transfer arm in the substrate processing apparatus, a resist solution discharge nozzle in a resist coating unit, and a developing solution discharge in a development processing unit.
• the position adjustment of the nozzle and the operation confirmation of the substrate transfer arm, the resist solution discharge nozzle and the developing solution discharge nozzle are included, and the remote control without driving the substrate processing apparatus includes a resist coating nozzle.
• a sensor for detecting that a person has approached the substrate processing apparatus may be provided on the substrate processing apparatus side. In this case, for example, it is possible to detect that a person has approached the substrate processing apparatus from a position that is invisible to the worker, so that a warning can be issued to the person or remote operation can be stopped. Therefore, the safety of remote operation is ensured.
• the operation of starting the detection of the sensor can be performed by the substrate processing apparatus and the remote control apparatus with the communication network interposed therebetween, and the operation of stopping the detection of the sensor can be performed only by the substrate processing apparatus. It may be possible. In such a case, for example, when remote control is started, the sensor can be operated from both the substrate processing device side and the remote control device side. In addition, since the sensor detection stop operation can only be performed from the substrate processing equipment side, it is possible to prevent a person on the remote control equipment side from stopping detection of the sensor and preventing the approach of a person to the substrate processing equipment from being detected. it can.
• the sensor may be capable of selectively detecting the approach of a person other than a predetermined worker.
• the approach of a person other than the worker in charge of remote control can be detected, and the safety of the person other than the worker in charge can be ensured.
• the worker in charge can, for example, approach the substrate processing equipment and continue maintenance work even during remote control, so that maintenance work can be completed more quickly.
• Information communication performed through the communication network in the above maintenance system may be possible only when communication permission is set. In this case, for example, leakage of confidential information on the substrate processing apparatus side or the remote operation apparatus side can be prevented.
• various parameters including a substrate transport member for performing substrate processing and remote control information transmitted from a remote control device at a remote location via a communication network are used for remote control.
• a control unit that is provided only when there is a setting for permitting remote operation by the operator of the substrate processing apparatus after confirming the safety of the operation, and controls the various parameters based on the provided remote operation information.
• ADVANTAGE OF THE INVENTION According to this invention, a board
• the permission setting section for performing the permission setting of the remote operation may be provided only on the substrate processing apparatus side of the communication network, and the permission setting of the remote operation is divided into a plurality of stages.
• the setting for permitting remote operation with driving the substrate processing apparatus and the setting for permitting remote operation without driving the substrate processing apparatus may be included in different stages.
• Remote operation involving driving of the substrate processing apparatus involves physical movement with respect to the various specifications.
• the various physical movement may be a remote control with no c also for specifications, remotely with the driving of the substrate processing apparatus
• the operation includes adjusting the positions of the substrate transfer arm, the resist discharge nozzle in the resist coating unit and the developer discharge nozzle in the development processing unit, the substrate transfer arm, and the resist discharge nozzle. And remote operation without driving of the substrate processing equipment, including the discharge amount of the resist solution and the discharge pressure of the resist solution in the resist coating unit.
• the substrate processing apparatus may include a sensor for detecting that a person has approached, and the operation of starting the detection of the sensor is performed between the substrate processing apparatus side and the remote operation apparatus side across a communication network.
• the operation of stopping the detection of the sensor may be performed only on the substrate processing apparatus side.
• the sensor may be capable of selectively detecting approach of a person other than a predetermined worker. Information communication performed through the communication network in the above substrate processing apparatus may be possible only when communication permission is set.
• the remote control device of the present invention can remotely control the substrate processing device by transmitting the remote control information to the substrate processing device side through the communication network and providing the remote control information to the substrate processing device.
• the remote operation information transmitted to the substrate processing apparatus side is provided to the substrate processing apparatus only when there is a permission setting of a worker on the substrate processing apparatus side for remote operation. According to the present invention, since the remote control is performed only when the permission of the worker is given, the safety of the worker and the people around the worker can be ensured.
• the permission setting section for performing the permission setting for remote operation may be provided only on the substrate processing apparatus side of the communication network.
• the permission setting for remote operation is divided into a plurality of stages.
• the permission setting for remote operation with drive to the substrate processing apparatus and the permission setting for remote operation without drive to the substrate processing apparatus may be included in different stages.
• the remote operation that involves driving the substrate processing apparatus is a remote operation that involves physical movement of various specifications including a substrate transport member in the substrate processing apparatus, and the remote operation that does not involve driving the substrate processing apparatus.
• the operation may be a remote operation that does not involve physical movement of the various parameters.
• remote control involving driving of the substrate processing apparatus includes adjusting a position of a substrate transfer arm in the substrate processing apparatus, a resist solution discharging nozzle in a resist coating unit, and a developing solution discharging nozzle in a developing unit.
• a sensor for detecting that a person has approached the substrate processing apparatus may be provided on the substrate processing apparatus side, and the operation of starting the detection of the sensor is performed by the substrate processing apparatus side and a communication network interposed therebetween. It can be performed on the remote control device side, and the operation of stopping the detection of the sensor can be performed only on the substrate processing device side.
• the sensor may be capable of selectively detecting the approach of a person other than a predetermined worker.
• the information communication performed through the communication network in the remote operation device described above may be possible only when communication permission is set.
• the communication method of the present invention is a communication method performed through a communication network between a remote operation device that operates a substrate processing apparatus from a remote location and the substrate processing apparatus, and includes a communication method between the remote operation apparatus and the substrate processing apparatus. It is possible to set permission or non-permission of communication on the substrate processing apparatus side for various types of information communicated by the device. During normal operation of the substrate processing apparatus, communication of the various types of information is set to non-permission. When a trouble occurs, the communication of the various information is selectively set to be permitted. According to the present invention, for example, a person in charge of the remote control device cannot communicate with the substrate processing device unilaterally to obtain remote control of the substrate processing device without obtaining permission of a worker in the substrate processing device. Operation safety is ensured. In addition, since information that can be communicated with the substrate processing apparatus can be selected, it is possible to prevent, for example, secret information possessed by the substrate processing apparatus from being disclosed to the remote control apparatus. BRIEF DESCRIPTION OF THE FIGURES
• FIG. 1 is a schematic configuration diagram of a maintenance system according to the present embodiment.
• Figure 2 is a block diagram showing the configuration of the computer.
• Fig. 3 is a block diagram showing the configuration of the communication control device.
• FIG. 4 is an explanatory diagram showing an example of a setting screen of the communication control device.
• Fig. 5 is a perspective view showing the outline of the coating and developing processing apparatus that constitutes the maintenance system.
• FIG. 6 is a plan view schematically showing the configuration of the coating and developing apparatus shown in FIG.
• FIG. 7 is a front view of the coating and developing apparatus of FIG.
• Figure 8 is an explanatory diagram showing the outline of the configuration of the resist coating unit.
• Fig. 9 is an explanatory diagram showing the outline of the configuration of the development processing unit.
• FIG. 10 is a rear view of the coating and developing apparatus of FIG.
• Figure 11 is a block diagram showing the configuration of the control section.
• Figure 12 shows the protocol flow of the maintenance system.
• Fig. 13 is a plan view schematically showing the configuration of the coating and developing apparatus when an infrared sensor is attached.
• FIG. 1 is a schematic configuration diagram of a maintenance system 1 according to the present embodiment.
• This maintenance system 1 is a system for remotely maintaining a coating and developing apparatus as a substrate processing apparatus.
• the maintenance system 1 has, for example, a plurality of coating / developing apparatuses M 1 to M ⁇ and a communication controller 3 on the factory 2 side where wafers are manufactured, and a vendor which is a manufacturer of the coating / developing apparatuses ⁇ 1 to ⁇ ⁇ .
• On the 4th side there is a computer 5 as a remote control device.
• the coating and developing equipment ⁇ 1 to ⁇ ⁇ are installed in the clean room R in the factory 2.
• the computer 5 on the vendor 4 side is connected to the communication control unit 3 on the factory 2 side via the Internet 6, and the computer 5 and the communication control unit 3 can communicate with each other.
• Firewalls (not shown) are provided between the Internet 6 and the computer 5 and between the Internet 6 and the communication control device 3, respectively, to prevent a third party from entering each terminal.
• the communication control device 3 is connected to each of the coating and developing processing devices M1 to Mn by, for example, a LAN 7 built in the factory 2. With such a configuration, the computer 5 can communicate with the coating and developing processing devices M1 to Mn via the Internet 6 and the communication control device 3.
• the combi- ter 5 is a device for remotely controlling the coating and developing devices M1 to Mn.
• the computer 5 includes, for example, a communication unit 20, an input unit 21, a control unit 22, and a display unit 23 as shown in FIG.
• the communication unit 20 is directly connected to the Internet 6, and this communication Various information and signals can be transmitted and received between the computer 5 and the communication control device 3 by the section 20. Therefore, the computer 5 receives the trouble information on the coating and developing processing devices M1 to Mn transmitted from the communication control device 3 side, and performs remote control for remotely controlling the coating and developing processing devices M1 to Mn. Information can be transmitted to the communication control device 3 side.
• the trouble information includes, for example, various setting information and image information of the coating and developing processing apparatuses M1 to Mn at the time of occurrence of a trouble, and various kinds of log information until the trouble occurs.
• the remote operation information includes, for example, static remote operation information for remote operation without driving various parameters in the coating and developing processing apparatuses M1 to Mn, and information in the coating and developing processing apparatuses M:! To Mn. It contains dynamic remote control information for remote control involving driving of various specifications.
• the static remote control information includes, for example, setting change information for changing the settings of various specifications of the coating development processing devices M1 to Mn.
• the dynamic remote control information includes, for example, drive adjustment information for physically moving and adjusting the specifications (drive specifications) of the coating and developing processing apparatuses M1 to Mn driven during wafer processing, and maintenance. Includes operation confirmation information to confirm operation after work.
• an information request signal for requesting the communication control unit 3 to transmit trouble information can be input to the input unit 21 when, for example, a trouble occurs in the coating and developing processing devices M1 to Mn.
• remote control information can be input to the input unit 21. That is, the person in charge of the vendor 4 inputs the remote control information to the input unit 21 to change the settings of various specifications in the coating and developing processing apparatuses M1 to Mn at the remote location, It can be adjusted by moving the specifications.
• a keyboard or a mouse pointing device provided with cursor keys and numeric inputs is used, and the remote control is performed by a key press signal or a mouse position signal on the keypad. Operation information and the like can be input to the convenience store 5.
• the control unit 22 controls the entire computer 5, and the control unit In 22, various programs are executed based on various information and signals from the communication control device 3 and the input unit 21, for example.
• the control unit 22 uses, for example, a CPU (Central Processing Unit).
• the display 23 can display, for example, received trouble information.
• a dot matrix-type color liquid crystal display cell or a CRT (CathodeRayTube) is used.
• the display unit 23 may be a touch screen. In this case, remote operation information can be directly input as an input unit. Further, the display section 23 may display an operation screen of an input / display apparatus 93 described later of each of the coating and developing processing apparatuses M1 to Mn. It may be displayed or remote control information may be input.
• the communication control unit 3 is installed in the clean room R in the factory 2 together with the coating and developing units M:! ⁇ Mn as shown in Fig. 1.
• the communication control device 3 includes, for example, a communication unit 30, an input unit 31 as a permission setting unit, a storage unit 32, and a control unit 33, as shown in FIG.
• a modem is used for the communication unit 30
• a touch screen is used for the input unit 31
• a RAM Random ACCs Mesmory
• a CPU is used for the control unit 33.
• the communication unit 30 is connected to the LAN 7 in the factory 2 and the Internet 6, and the communication control unit 3 allows the communication control device 3 to communicate with the coating and developing processing devices M1 to Mn and the computer 5. Various kinds of information and signals can be communicated between them. That is, the communication unit 30 transmits the information received from the computer 5 to the coating image processing devices M1 to Mn, or the coating and developing processing devices M:! The information received from can be transmitted to the computer 5 side.
• the input unit 31 transmits the remote control information received from the computer 5 to the coating image processing devices Ml to Mn, and performs remote control based on the remote control information.
• Permission or non-permission can be set.
• This permission / non-permission setting is divided into multiple stages, for example, two stages.
• the permission / non-permission setting in the first stage includes remote operation information that does not involve physical movement, that is, static remote operation information, for various specifications in the coating and developing processing devices M1 to Mn. I will.
• the permission / non-permission setting in the first stage includes the discharge amount of the resist solution, the discharge pressure, the rotation speed of the wafer W, the ambient temperature, and the humidity in the resist coating unit in the coating and developing equipment Ml.
• the permission / non-permission setting in the second stage includes remote operation information that involves physical movement of various specifications in the coating and developing processing devices M1 to Mn, that is, dynamic remote operation information. More specifically, the permission and non-permission settings in the second stage are performed by setting the wafer transfer arm of the transfer unit in the coating / development processing units Ml to Mn and the discharge of the resist liquid in the resist coating unit.
• Position adjustment information for adjusting the position by actually moving the nozzle and the developing solution discharge nozzle of the development processing unit, and adjusting or changing the wafer transfer arm, the resist solution discharging nozzle, and the developing solution discharging nozzle.
• Operation confirmation information for confirming operation is included.
• These permission / non-permission settings can be made, for example, by the operator pressing the setting buttons A and B at each stage on the touch screen of the input unit 31 as shown in FIG.
• the static remote control information having a plurality of contents as described above may be collectively set to be permitted or non-permitted, and conversely, the discharge amount of the resist liquid may be set to “permitted”.
• the discharge pressure may be set to allow or disallow for each item, such as “not allowed”.
• permission or non-permission is set for each content, a setting button is provided for each content.
• permission / non-permission may be set for each content at once, and permission / non-permission may be set for each content.
• the storage unit 32 stores various programs including a program for setting the permission / non-permission.
• the control unit 33 can appropriately read and execute the program stored in the storage unit 32.
• the communication control device 3 allows the information communication with the vendor 4 via the Internet 6 to be enabled / disabled for each type of information.
• ⁇ Prohibition setting button D is provided. Therefore, bidirectional communication can be performed between the communication control device 3 and the computer 5 only for the information for which the communication permission setting is permitted.
• the coating and developing apparatus Ml is a processing apparatus that can perform one photolithography process in a semiconductor device manufacturing process by continuously processing a wafer W in a single wafer process.
• FIG. 5 is a perspective view schematically showing the configuration of the coating and developing apparatus M1
• FIG. 6 is a plan view schematically showing the configuration of the coating and developing apparatus M1.
• the coating / developing apparatus M1 carries out, for example, 25 wafers W into / from the coating / developing apparatus M1 in a cassette unit, and the wafer W into / from the cassette C.
• Station 40 for loading and unloading wafers a processing station 41 having a plurality of various processing cuts for processing wafers W in a single wafer manner, and a processing station 41 adjacent to the processing station 41. It has a configuration in which the interface unit 42 for transferring the wafer W to and from the provided exposure apparatus (not shown) is integrally connected. ⁇ In the cassette station 40, as shown in FIG.
• a plurality of cassettes C can be freely arranged at predetermined positions on the cassette mounting table 43 in a line in the X direction (the vertical direction in FIG. 6).
• a wafer transfer unit 44 is provided at the cassette station 40 so as to be movable in the X direction along a transfer path 45.
• the wafer transfer unit 44 can load and unload wafers W to and from cassette C.
• the wafer transfer unit 44 is processed as described later.
• the configuration is such that the extension station 63 belonging to the third processing unit group G3 on the management station 41 side can also be accessed.
• the cassette station 40 is provided with a control section 46 described later of the coating and developing apparatus M1.
• a CCD camera 200 as an imaging member is attached to the coating development processing device Ml at a plurality of locations. The state in 1 can be imaged.
• the processing station 41 has a main transfer unit 50 at the center.
• the main transfer unit 50 is provided with a wafer transfer arm 50a as a movable substrate transfer member for holding and moving the wafer W, and moving the transfer arm 50a to store the wafer W. It can be transported to a fixed transport position.
• a plurality of processing unit groups Gl, G2, G3, G4 in which various processing units are arranged in multiple stages are provided.
• the first and second processing unit groups Gl, G2 are arranged on the front side of the coating and developing apparatus M1.
• the resist coating unit 51 supplies gas of a predetermined temperature and humidity into the processing chamber S from an air supply port 300 formed in the casing 51a, for example.
• Temperature / humidity adjusting device 301 for maintaining the inside of the chamber at a predetermined atmosphere
• spin chuck 302 for holding and rotating wafer W in processing chamber S
• the resist liquid discharge nozzle 303 that supplies the resist liquid to the nozzle
• the nozzle arm 304 that moves the resist liquid discharge nozzle 303 to a predetermined discharge position
• the resist liquid discharge nozzle 303 from the resist liquid discharge nozzle 303 It is composed of various specifications such as a resist liquid supply device 305 for discharging the resist liquid at a predetermined flow rate and pressure.
• a predetermined amount of the resist solution is discharged from the resist solution discharge nozzle 303 to the wafer W rotated by the spin chuck 302, and the resist solution is discharged onto the surface of the wafer W. This is done by diffusing into
• the developing unit 52 supplies a gas having a predetermined temperature and a predetermined humidity into the processing chamber K from an air supply port 400 formed in the casing 52a, for example, as shown in FIG.
• a temperature / humidity adjusting device 401 for maintaining the inside of the chamber at a predetermined atmosphere, a chuck 402 for holding the wafer W in the processing chamber K, and a discharge port having a discharge port that is as long as the diameter of the wafer W.
• a predetermined flow rate is supplied to the developer discharge nozzle 403 for supplying the developer from the outlet to the wafer W, the nozzle arm 404 for moving the developer discharge nozzle 403 on the wafer W, and the developer discharge nozzle 403.
• the developing process in the developing unit 52 is performed by moving the wafer W from one end to the other end of the wafer W on the wafer W while the developing solution discharge nozzle 403 discharges the developing solution. This is performed by forming a liquid level of the developing solution and keeping the wafer W stationary for a predetermined time in the liquid level.
• the second processing unit group G2 is provided with a resist coating unit 53 and a development processing unit 54 in order from the bottom.
• the third processing unit group G3 of the processing station 41 is arranged adjacent to the cassette station 40 as shown in FIG.
• the third processing unit group G3 includes, for example, cooling units 60 and 61 for cooling the wafer W, as shown in Fig. 10, and a fixing solution for improving the fixability between the resist solution and the wafer W.
• the adhering unit 62, the extension unit 63 for transferring the wafer W, and the pre-baking units 64, 65 for evaporating the solvent in the resist solution are located below. For example, they are stacked in six stages, for example.
• the fourth processing unit group G4 is adjacent to the interface section 42. Are located.
• the fourth processing unit group G4 includes, for example, a cooling unit 70, an extension cooling unit 71 for naturally cooling the mounted wafer W, an extension unit 72, and a heating after exposure.
• Postpost exposure baking units 73 and 74 for processing, and postbaking units 75 and 76 for heating after image processing are stacked, for example, in seven rows from the bottom.
• the heating treatment in the pre-baking cuts 64, 65, the post-exposure baking units 73, 74, and the post-baking units 75, 76 can be performed, for example, by heating the wafer W to a predetermined temperature. It is carried out by placing on a maintained hot plate for a predetermined time.
• the interface unit 42 is provided with, for example, a wafer transfer unit 80 and a peripheral exposure unit 81 as shown in FIG.
• the wafer transport unit 80 accesses the extension / cooling unit 71, extension unit 72, peripheral exposure unit 81, and an exposure apparatus (not shown) belonging to the fourth processing unit group G4.
• the wafer W can be transferred to each of them.
• the control section 46 includes, for example, a communication device 90, a control device 91, a data storage device 92, and an input / display device 93, as shown in FIG.
• the communication device 90 is connected to, for example, the LAN 7, and can communicate information and signals with the communication control device 3 via the LAN 7. Therefore, the communication device 90 transmits the log information stored in the data storage device 92 described later to the communication control device 3 via the communication device 90 or the remote operation information received from the communication control device 3. Can be output to the control device 9 1.
• the control device 91 includes settings related to the processing process of the entire coating and developing processing device M1, settings related to the processing recipe in each processing unit, and a transfer unit. Various settings such as settings relating to the operation of the socket can be made.
• the control device 91 controls the entire coating and developing processing device M1, various processing units and the transport unit based on the setting, and executes a desired coating and developing process. Based on the remote control information output from the communication device 90, the control device 91 changes the various settings described above, or actually moves and adjusts the various specifications in each unit, and performs the coating and developing process. Maintenance work of the device M 1 can be performed. That is, the computer 5 can remotely control the coating and developing apparatus M 1 by providing the remote control information to the controller 91.
• the data storage device 92 can temporarily store log information such as various setting information and operation information of the coating and developing processing device M1.
• the input 'display device 93 is provided on the side of the coating and developing device M1, for example, as shown in FIG.
• the input display device 93 is, for example, a touch screen.
• various settings of the coating and developing treatment device M1 are made, and an operation screen showing the operation status of the coating and developing treatment device Ml is displayed.
• the input / display device 93 can also display an image in the coating and developing processing device M 1 taken by the CCD camera 200 as needed.
• one unprocessed wafer W is taken out from the cassette C of the cassette station 40. Then, it is transported to the extension unit 63 belonging to the third processing unit group G3. Next, the wafer W is carried into the adhection unit 62 by the main transport unit 50 and subjected to the adhection process. After the end of the adhering process, the wafer W is transferred to the cooling unit 60, cooled to a predetermined temperature, and then transferred to the resist coating unit 51, where a resist film is formed on the surface of the wafer W. You.
• the wafer W having a resist film formed on the surface is pre-cut by the main transfer unit 50, and the extension cooling unit 64
• the wafers are sequentially transported to a nit 71, and further transported to a peripheral exposure unit 81 and an exposure device (not shown) by a wafer transport unit 80, where predetermined processing is performed at each unit.
• the wafer W after the exposure processing is transferred to the extension unit 72 by the wafer transfer unit 80, and thereafter, the post-exposure base unit 73 and the cooling unit 6 are transferred by the main transfer unit 50.
• the development processing unit 52, the post baking unit 75, and the cooling unit 60 are sequentially transported to each unit, where predetermined processing is performed.
• the wafer W is transferred to the extension unit 63 and returned to the cassette C by the wafer transfer unit 44, thereby completing a series of photolithography steps.
• Figure 12 shows the protocol flow of the operation of maintenance system 1.
• the worker at the factory 2 has set the permission and non-permission settings of the first and second stages of the communication control device 3 to "not permitted". Therefore, the coating and developing apparatus M 1 cannot be remotely controlled from the computer 5 side.
• a trouble occurs in the coating and developing treatment device M1
• a worker at the factory 2 notifies the person in charge of the vendor 4 of the trouble.
• This notification method may be a telephone call, a fatal alarm, or the like, or may use the communication network of the maintenance system 1.
• all communication permission / prohibition settings for various types of information must be set.
• the worker on the factory 2 side can use the communication permission / disapproval setting button D to selectively change the communication permission / non-permission setting to “permitted”. You. In this way, the worker on the factory 2 side selectively sets the communication permission so that even if there is a problem, for example, information including confidential matters that the vendor 4 does not want to know, This prevents information including confidential matters in the processing performed in the processing device M1 from leaking to the vendor 4.
• a warning alarm signal generated by the coating and developing equipment M1 at the time of the trouble is automatically sent to the computer 5 on the vendor 4 side. The occurrence may be notified to the person in charge of the vendor 4 side.
• the person in charge of the vendor 4 who has been notified of the trouble first sends a trouble information request signal to the coating and developing processing apparatus M1 in order to collect the trouble information.
• This transmission requires a password to prevent unauthorized access.
• the transmitted information request signal is transmitted to the communication control device 3 via the Internet 6, and is transmitted from the communication control device 3 to the coating and developing processing device M 1 via the LAN 7.
• the coating / developing processor Ml that has received the information request signal when the communication permission / non-permission setting button D is set to “permit”, for example, the input / display is performed on the operation screen of the display device 93.
• the set information and operation information set are transmitted from the communication device 91 to the computer 5.
• the operation screen displayed on the input / display device 93 may be transmitted to the computer 5 as it is.
• the log information stored in the data storage device 92 that is, the setting information up to the occurrence of the trouble, the operation information, and the image information captured by the CCD camera 200 are also transmitted to the combi unit 5.
• the trouble information transmitted from the coating and developing apparatus M1 is received by the computer 5 on the vendor 4 side and displayed on the display section 23 of the computer 5.
• the operation screen of the input / display device 93 is transmitted as it is, the operation screen is displayed on the display unit 23.
• the person in charge at the vendor 4 side can use this display, for example, to grasp the current status of the coating and developing processing apparatus M 1, Identify the cause of the trouble and devise a solution.
• the person who devised the troubleshooting method inputs the troubleshooting method from the input unit 21 as remote control information. For example, if a trouble occurs in the main transfer unit 50 and it is determined that the cause of trouble is the wafer transfer arm 50a, for example, change the setting of the stop position of the wafer transfer arm 50a.
• Information, drive adjustment information for actually moving and adjusting the wafer transfer arm 50a, and operation confirmation information for confirming the operation of the wafer transfer arm 50a after the adjustment are input to the input unit 21.
• the workers on the factory 2 side use the first and second communication control units 3 Change the “permission” setting of the stage to “permitted”. This change is made after confirming that the person has left the coating and developing processing apparatus M1.
• the remote control information transmitted from the computer 5 on the vendor 4 side is provided to the coating and developing apparatus M1, and remote control can be performed from the vendor 4 side.
• the remote control information input to the input unit 21 is transmitted from the communication unit 20 to the communication control device 3 of the factory 2 via the Internet 6.
• the remote control permission / non-permission setting is all "permitted", so the communication control device 3 transmits the remote control information to the coating and developing processing device M1.
• trouble repair work is performed based on the remote operation information. For example, the stop position is adjusted by moving the wafer transfer arm 50a, and the setting of the stop position of the wafer transfer arm 50a is changed. Thereafter, the wafer transfer arm 50a is operated, and the operation of the wafer transfer arm 50a is confirmed. In this way, the cause of the trouble is eliminated.
• the permission / non-permission setting for remote operation is changed to “not permitted” by the operator, and remote operation is disabled. If necessary, the communication permission / non-permission setting may be changed to “non-permission”.
• the remote operation is set to “permitted” by the worker at the factory 2 and then the remote operation is performed, for example, the main transport unit 50 is operated without the worker's knowledge. It is possible to prevent the transfer arm 50a from being driven and the worker from being injured by the transfer arm 50a.
• the first-stage permission / non-permission setting that is, static remote control without actual driving of the drive specifications
• the transmission of information is set to “permitted”
• the permission / non-permission setting in the second stage that is, the transmission of dynamic remote operation information accompanying the actual driving of the drive specifications is set to “disallowed”.
• a third person approaches the coating and developing processing apparatus M1 and, for example, drives the wafer transfer arm 50a or the like. Injuries to third parties can be prevented depending on the cause.
• the permission / non-permission setting of the first stage is still “permitted”, so the setting change information can be transmitted without driving, for example, even if the worker is away from the workplace, the danger may occur.
• Remote control without the need to continue.
• the contents of the static remote control information changed while the worker is away from the site are displayed on the input / display device 93, for example. Is also good. In this way, workers can easily grasp the changes made while they are not on site.
• the configuration of the unit in the coating and developing equipment is displayed in advance, for example, on the screen of the input / display device 93 (status screen), and only the changed unit on this status screen is displayed in a distinguishable manner. You may make it. At this time, for example, only the unit that has been changed may be displayed in a different color, or only that unit may be displayed blinking.
• a sensor that detects the approach of a person may be attached to the coating and developing apparatus M1 described in the above embodiment so that remote control becomes impossible when a person approaches.
• Figure 13 shows such an example.
• An infrared sensor 100 capable of detecting a person is attached to the processing device M1.
• the infrared sensor 100 is mounted so that it can detect that a person has entered, for example, the area around the coating and developing treatment apparatus M1 (the shaded area in FIG. 13).
• Information detected by the infrared sensor 100 can be output to, for example, the control device 91 of the coating and developing processing device M 1, and can be output from the control device 91 to the communication control device 3.
• the communication control device 3 can automatically change the permission setting for remote operation to “not permitted” based on this detection information.
• the operation of starting detection of the infrared sensor 100 can be performed on both the factory 2 side and the vendor 4 side, and the operation of stopping detection of the infrared sensor 100 can be performed only on the factory 2 side. Is also good.
• the coating / developing apparatus M1 on the factory 2 side is provided with an ON / OFF switch for the infrared sensor 100
• the computer 5 on the vendor 4 side is provided with only an ON switch for the infrared sensor 100. .
• the infrared sensor 100 can be operated from the factory 2 and the vendor 4 as needed.
• the vendor 4 who cannot completely grasp the situation inside the factory 2 cannot turn off the infrared sensor 100 without permission.
• the infrared sensor 100 becomes OFF, contrary to the intention of the factory 2, and remote control does not continue when the infrared sensor 100 is connected to that OFF. Therefore, a person who approaches the coating and developing unit M1 by all means is always detected, and the safety of remote operation of the coating and developing unit M1 is improved.
• the approach of a person other than the specified worker A sensor that can be selectively detected may be used.
• an identification code for each of the coating and developing apparatuses M :! to Mn is assigned in advance to workers in charge of the coating and developing apparatuses M1 to Mn in the factory 2, and the identification codes are assigned to the respective workers.
• the identification code may be attached, for example, to a worker's nam plate, work clothes, or the like. For example, if the sensor detects the identification code of the worker in charge, remote operation is continued, and if the sensor detects an identification code other than the worker in charge, remote operation becomes impossible.
• the remote operation is continuously performed when the worker approaches the coating and developing processing apparatus M1, and the remote operation is stopped when a person other than the worker approaches the coating and developing apparatus M1. .
• the remote operation is stopped when a person other than the worker approaches the coating and developing apparatus M1.
• the substrate processing apparatus constituting the maintenance system is not limited to the coating and developing apparatus. It may be an apparatus, for example, an exposure apparatus, an etching apparatus, or the like.
• the present embodiment is a maintenance system including only a coating and developing apparatus, the present invention can be applied to a maintenance system for a plurality of types of substrate processing apparatuses.
• the substrate processing equipment may be installed in multiple factories.
• the communication control device 3 does not need to be an independent device, and may be provided in the substrate processing apparatus. Further, the control device in the substrate processing apparatus may fulfill the function of the communication control device 3.
• the computer 5 on the side of the vendor 4 does not need to be installed at one place, but may be installed at a plurality of places.
• the installation position of the computer 5 is not limited to the side of the vendor 4, but may be a position away from the substrate processing apparatus in the factory 2, for example, outside the clean room R.
• the maintenance system 1 of the present invention is used for dealing with troubles, but the present invention may be used for regular maintenance other than troubles.
• the substrate to be processed by the substrate processing apparatus is not limited to the substrate, but may be a substrate other than the substrate, for example, an LCD substrate or a mask reticle substrate for a photomask. Industrial applicability

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Health & Medical Sciences (AREA)
• Engineering & Computer Science (AREA)
• Environmental & Geological Engineering (AREA)
• Epidemiology (AREA)
• Public Health (AREA)
• Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
• Control Or Security For Electrophotography (AREA)
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• 2002
  • 2002-08-27 JP JP2002247525A patent/JP4316210B2/ja not_active Expired - Lifetime
• 2003
  • 2003-08-08 EP EP03791203.7A patent/EP1536459B1/en not_active Expired - Lifetime
  • 2003-08-08 WO PCT/JP2003/010156 patent/WO2004021417A1/ja not_active Ceased
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  • 2003-08-08 AU AU2003254901A patent/AU2003254901A1/en not_active Abandoned
  • 2003-08-08 US US10/525,090 patent/US7524378B2/en not_active Expired - Lifetime
• 2009
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