WO2003079744A1 - Palette de transfert pour plaquette fpc, et procede de montage de puce a semi-conducteur sur plaquette fpc - Google Patents

Palette de transfert pour plaquette fpc, et procede de montage de puce a semi-conducteur sur plaquette fpc Download PDF

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Publication number
WO2003079744A1
WO2003079744A1 PCT/JP2003/003088 JP0303088W WO03079744A1 WO 2003079744 A1 WO2003079744 A1 WO 2003079744A1 JP 0303088 W JP0303088 W JP 0303088W WO 03079744 A1 WO03079744 A1 WO 03079744A1
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WO
WIPO (PCT)
Prior art keywords
layer
transport pallet
silicone elastomer
fpc board
range
Prior art date
Application number
PCT/JP2003/003088
Other languages
English (en)
Japanese (ja)
Inventor
Takeyuki Tsunekawa
Hirofumi Iida
Original Assignee
Mitsubishi Plastics, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002072757A external-priority patent/JP4097185B2/ja
Priority claimed from JP2002072756A external-priority patent/JP4097184B2/ja
Priority claimed from JP2002380156A external-priority patent/JP4188076B2/ja
Application filed by Mitsubishi Plastics, Inc. filed Critical Mitsubishi Plastics, Inc.
Priority to AU2003213383A priority Critical patent/AU2003213383A1/en
Priority to KR1020047014427A priority patent/KR100694609B1/ko
Publication of WO2003079744A1 publication Critical patent/WO2003079744A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards

Definitions

  • the present invention relates to a transport pallet for an FPC board used when mounting a semiconductor chip on an FPC board and a method for mounting a semiconductor chip on an FPC board.
  • FPC boards Flexible Printed Circuit boards
  • the FPC board has recently played a central role as a base material constituting a circuit of a small electronic device.
  • the FPC board cannot handle semiconductor chips in the same manner as the paper phenol board or the glass epoxy board due to its properties such as strength, flatness, and heat shrinkage.
  • a method has been adopted in which the FPC board is positioned on a transport pallet made of stainless steel, etc., adhered with adhesive tape, and the semiconductor chip is mounted by using the stainless steel as a strong plate. I have.
  • Japanese Patent Application Laid-Open No. 9-239795 discloses that an FPC substrate is temporarily fixed on a transport pallet with an adhesive.
  • the work of positioning the FPC board on the transport pallet and attaching it with adhesive tape is a manual work, and the work is repeated each time it is mounted. Therefore, work efficiency is poor.
  • adhesive residue after peeling off the adhesive tape is not preferable in quality.
  • the adhesive tape is disposable, and is peeled off from the pallet body after use and discarded, it is economically and environmentally unfavorable. Therefore, in order to simplify the work of attaching and detaching the tape, a method of using a double-sided tape that can be used many times without peeling each time can be considered.
  • the adhesive strength of the double-sided tape sharply decreases as the number of uses increases. Down.
  • An object of the present invention is to provide a transport pallet for an FPC board and a method for mounting a semiconductor chip on an FPC board, which are efficient, economical, and environmentally friendly.
  • the present invention is according to claim 1.
  • FIG. 1A is a plan view of a transport pallet according to the first embodiment of the present invention.
  • FIG. 1 (b) is a cross-sectional view taken along line 1b-1b in FIG. 1 (a).
  • FIG. 2 is a sectional view showing the operation of the transport pallet in FIG. 1 (b).
  • FIG. 3A is a plan view of a transport pallet according to the second embodiment.
  • FIG. 3B is a cross-sectional view taken along line 3b-3b in FIG. 3A.
  • FIG. 4 is a sectional view showing the operation of the transport pallet in FIG. 3 (b).
  • FIG. 5 is a perspective view of a transport pallet according to the third embodiment.
  • FIG. 6 is a sectional view taken along line 6-6 in FIG.
  • FIG. 7 is a cross-sectional view of a transport pallet in a modification of the embodiment of FIG.
  • FIG. 8 is a partial cross-sectional view of a transport pallet according to another embodiment.
  • FIG. 9 is a partial cross-sectional view of a transport pallet according to another embodiment.
  • the transport pallet 11 includes a non-stretchable support body 12 as a strength plate and a silicone elastomer layer 13.
  • the support 12 is an aluminum plate.
  • the transport pallet 11 has two first holes 14 for positioning with respect to the mounting portion 31 of the mounting device (see FIG. 2).
  • a plurality of second holes 16 for positioning with respect to a rectangular FPC board 15 are formed.
  • the first holes 14 are respectively formed at both ends in the longitudinal direction of the transport pallet 11, and penetrate the support 12 and the silicone elastomer layer 13.
  • Each second hole 16 penetrates the support 12 and the silicone elastomer layer 13.
  • the area of the transport pallet 11 is, for example, an area that allows six FPC boards 15 to be in close contact with each other.
  • One pair of the plurality of second holes 16 corresponds to two diagonal corners of one FPC board 15.
  • the silicone elastomer constituting the silicone elastomer layer 13 can be obtained by crosslinking a polyorganosiloxane having a siloxane skeleton represented by the following formula.
  • Silicone elastomers include polydimethylsiloxane in which all of R in the above formula are methyl groups, and some of the methyl groups are one or more of other alkyl groups, butyl groups, phenyl groups, and fluoroalkyl groups. It is a blend of the various polyonoleganosiloxanes substituted above, alone or in a blend of two or more.
  • the crosslinking method is not particularly limited, and a conventionally known method can be applied.
  • the methyl or bur group of polyorganosiloxane is A method of crosslinking is used.
  • a method of crosslinking by a condensation reaction between a silanol-terminated polyorganosiloxane and a silane compound having a hydrolyzable functional group a method of crosslinking by an addition reaction of a hydrosilyl group to a vinyl group, and the like can be given.
  • Adhesion between the silicone elastomer layer 13 and the support 12 is in accordance with a known method which is generally used as a method for joining the silicone elastomer layer to another material.
  • an uncrosslinked silicone elastomer layer 13 is formed.
  • the silicone elastomer layer 13 and the support 12 are vulcanized and bonded.
  • the shear modulus G 'of the silicone elastomer layer 13 is measured by a dynamic viscoelasticity measurement method. Specifically, the shear elastic modulus G 'of the silicone elastomer layer 13 is obtained by vibrating the sample of the silicone elastomer layer 13 at a frequency of 10 Hz at a temperature of 20 ° C. Range of shear bullet resistant modulus G 'of the silicone elastomer more 1 3, 5. Oxl 0 5 P a or 5. or less 0 x 10 6 P a. If the shear modulus G ′ is lower than 5.0 ⁇ 10 5 Pa, the silicone elastomer layer 13 is too soft to adhere to the FPC board 15 because the silicone elastomer is soft. It will be difficult.
  • a suitable shear modulus G 'of the silicone elastomer layer 13 can be obtained by appropriately adjusting the composition and the degree of crosslinking of the silicone elastomer, such as the type, molecular weight, and reinforcing filler of the polyorganosiloxane.
  • the temperature is about 200 ° C to 240 ° C, In the case of recent lead-free solder, the temperature may rise to about 280 ° C. Therefore, silicone elastomer further 1 3 shear modulus G, the values be in the range of up to these temperatures, it is desirable 5. Oxl 0 5 P a or 5. or less 0x1 0 6 P a .
  • a concave portion 32 is formed in the mounting portion 31 of the mounting device so as to correspond to the first hole 14 of the transport pallet 11.
  • the transport pallet 11 is placed on the mounting portion 3 1 with the support 12 of the transport pallet 11 facing the mounting portion 31.
  • the transport pallet 11 is positioned and mounted on the receiver 31 by inserting the first pin 33 through the first hole 14 and engaging with the corresponding recess 32.
  • the through-hole 34 is formed in the syrup substrate 15 at a position corresponding to the second hole 16.
  • the FPC board 15 is positioned on the transport pallet 11 by passing the second pin 35 through the through hole 34 and the second hole 16, and the FPC board 15 is fixed to the silicone elastomer layer 13.
  • a semiconductor chip (not shown) is mounted on the FPC board 15 by a heating reflow soldering process. After that, the FPC board 15 is removed from the transport pallet 11 and the mounting process is completed.
  • the next FPC board 15 is brought into close contact with the transport pallet 11, and the semiconductor chip mounting process is repeated in the same manner.
  • the transport pallet 11 used repeatedly is discarded, the silicone elastomer layer 13 is peeled off from the support 12, and the support 12 and the silicone elastomer layer 13 are separated and discarded.
  • Example 1 For each transport pallet 11 of Example 1 and Comparative Example 1, a sample piece was prepared in which the support 12 was formed of an aluminum plate having a thickness of 0.8 mm and the silicone elastomer layer 13 was formed to a thickness of 200 ⁇ . did. The specimen was vibrated at a frequency of 1 OH Z at a temperature of 20 ° C, and the measured values of the shear modulus G, of the silicone elastomer layer 13 of each of Example 1 and Comparative Example 1 were as shown below. .
  • Example 1 In each of the transport pallets 11 of Example 1 and Comparative Example 1, a first hole 14 corresponding to the mounting portion 31 and a second hole 16 corresponding to the FPC board 15 were formed. Next, an FPC board 15 was brought into close contact with a predetermined position of each transport pallet 11 to perform a heating reflow soldering step. As a result, in Example 1, the semiconductor chip could be mounted normally without displacement. In addition, the transport pallets 11 could be used repeatedly. In Comparative Example 1, the FPC board 15 floated from the silicone layer 13 in the heating reflow soldering step, causing a mounting defect.
  • the transport pallet 11 is a laminate of the support 12 and the silicone elastomer layer 13.
  • Range of shear modulus G 'of the silicone elastomer more 1 3, 5. Ox 10 5 P a or 5. OXL is 0 6 P a or less. Therefore, by utilizing the adhesiveness of the silicone elastomer, the FPC board 15 can be adhered to the silicone elastomer layer 13 without using an adhesive tape. Also, since no adhesive tape is used, there is no adhesive residue even when the FPC board 15 is removed from the transport pallet 11. Therefore, work efficiency and quality C ⁇ capable of performing semiconductor chip implementation of the F PC board 1 5 while preventing the deterioration of.
  • the transport pallet 11 can be used repeatedly, which is economical.
  • the silicone elastomer layer 13 and the support 12 are firmly bonded. For this reason, there is no possibility of peeling during use. Also, even if the processing of the first hole 14 is performed, the processed end face does not peel off.
  • the transport pallet 11 has a second hole 16 corresponding to the FPC board 15. Therefore, the FPC board 15 can be easily positioned at a predetermined position on the transport pallet 11 by passing the second pins 35 through the through holes 34 and the second holes 16 formed in the FPC board 15.
  • a first hole 14 corresponding to the receiver 31 is formed in the transport pallet 11. Therefore, by inserting the first pin 33 into the first hole 14, the transport pallet 11 can be easily positioned at a predetermined position of the mounting portion 31. Since the support 12 is an aluminum plate, the support 12 can be formed of an easily available material. Lighter and easier to handle than stainless steel plate. Next, a description will be given of a modification of the embodiment shown in FIGS. In this embodiment shaped condition, silicone elastomer further 1 3 shear modulus G, the range of, 5. In addition to being a 0X1 0 5 P a ⁇ 5.
  • thermal conductivity of the silicone elastomer layer 13 is too low, temperature unevenness may occur on the transport pallet 11 in a heating step such as a heating reflow soldering step during mounting.
  • a heating step such as a heating reflow soldering step during mounting.
  • the thermal conductivity of the silicone elastomer layer 13 is set to 0.4 W / m'K or more, the thermal conductivity becomes good, and the temperature unevenness on the transport pallet 11 in the heating process during mounting is improved. Less likely to occur.
  • Example 2 Each transport pallet 11 of Example 2, Comparative Example 2 and Comparative Example 3 is the same as Example 1 and Comparative Example 1 described above except for the physical property values of the silicone tomer layer 13.
  • Example 2 Comparative Example 2 and Comparative Example 3
  • a sample of the silicone elastomer layer 13 was vibrated at a frequency of 1 OHz, and the silicone elastomer layer 1 was measured by dynamic viscoelasticity measurement at a temperature of 20 ° C.
  • a shear rate of 3 and a 14 rate G ' were measured.
  • the thermal conductivity of the silicone elastomer layer 13 was measured in accordance with JIS R2618.
  • the shear modulus G and thermal conductivity of the silicone elastomer layer 13 are as follows.
  • Each of the transport pallets 11 of Example 2 and Comparative Example 2 is provided with two first holes 14 and a plurality of second holes 16 as in Example 1. ?
  • the same substrate 15 is brought into close contact with the silicone elastomer layer 13 of the corresponding transport pallet 11 and heated A rudder process was performed.
  • the transport pallet 11 of the second embodiment was able to mount the semiconductor chip normally similarly to the first embodiment, and a mounting failure occurred in the comparative example 2.
  • temperature unevenness was less likely to occur on the transport pallet 11 than in Comparative Example 2.
  • the range of the shear modulus G ′ of the silicone elastomer layer 13 is 5.0 ⁇ 10 5 Pa to 5.0 ⁇ 10 6 Pa, and the thermal conductivity of the silicone elastomer layer 13 is 0.4 WZm.K or more. It is. With this configuration, the thermal conductivity of the silicone elastomer layer 13 is improved, and it is possible to prevent the occurrence of temperature unevenness on the transport pallet 11 in the heating step during mounting. Next, another modification of the embodiment shown in FIGS. 1A and 1B and FIG. 2 will be described. This implementation range of the silicone elastomer layer of shear modulus G 'in the form 5. 0 X 1 0 5 P a ⁇ 5 .
  • the volume resistivity of the silicone elastomer layer 13 measured by the method is 1.0 ⁇ 10 10 ⁇ ⁇ cm or less.
  • the four-probe method based on JISK 7194 is a method in which four electrodes are linearly arranged on a sample of a silicone elastomer layer 13 and a current flows between the two outer electrodes. This is a method of calculating the volume resistivity of the silicone elastomer layer 13 based on the potential difference generated between the electrodes.
  • Suitable volume resistivity of the silicone elastomer layer 13 is obtained, for example, by adding a conductive filler to the silicone elastomer. If the volume resistivity of the silicone elastomer layer 13 is too high, dust may easily adhere to the surface of the silicone elastomer layer 13, which is not preferable in the manufacturing process. However, by configuring the volume resistivity of the silicone elastomer layer 13 to be 1.0x1 ⁇ ⁇ ⁇ cm or less, the conductivity of the silicone elastomer layer 13 is improved, and adhesion of dust due to static electricity is prevented. You. (Examples and Comparative Examples)
  • Example 3 Regarding each transport pallet 11 of Example 3, Example 4 and Comparative Example 3, it is the same as Example 1 and Comparative Example 1 except for the physical property values of the silicone elastomer layer 13.
  • Example 3, Example 4 and Comparative Example 3 the sample piece of the silicone elastomer further 1 3 are vibrated by the frequency number 1 0 H Z, silicone over emissions elastomer by dynamic viscoelasticity measurement under conditions of a temperature of 2 0 ° C A further 13 shear moduli G 'were measured. Further, the volume resistivity of the silicone elastomer layer 13 was measured by a four-probe method in accordance with JISK 7194.
  • the shear elastic modulus G ′ and the volume resistivity of the silicone elastomer layer 13 are as follows.
  • Example 4 and Comparative Example 3 as in Example 1, the FPC board 15 was brought into close contact with the corresponding silicone elastomer layer 13 to perform a heating reflow soldering step. Went.
  • the semiconductor chips could be normally mounted on the transport pallets 11 of Examples 3 and 4 as in Example 1, and mounting failure occurred in Comparative Example 3.
  • dust was less likely to adhere than in Comparative Example 3.
  • the range of the shear modulus G 'of the silicone elastomer layer 13 is 5.0 x 10 PC deflation 88
  • the silicone elastomer layer 13 includes a first layer 13a laminated on the support 12, and a second layer 13b laminated thereon.
  • the FPC board 15 is adhered to the second layer 13b.
  • the silicone elastomer constituting the first and second layers 13a and 13b can be obtained by crosslinking the above-mentioned polyorganosiloxane having a siloxane skeleton.
  • the specimen of the first layer 13a is vibrated at a frequency of 1 OHz, and the shear modulus G 'of the first layer 13a is measured by dynamic viscoelasticity measurement at a temperature of 20 ° C. .
  • Shear modulus G of the first layer 1 3 a ranges, 3. 0xl 0 4 P a or 5.
  • Second layer 1 3 b placed shear modulus G, the range measured by dynamic viscoelasticity measurement under the same conditions, 5. Oxl 0 5 P a or 5. 0 x 1 0 6 P a below is there.
  • the silicone elastomer layer 13 is bonded to the support 12. No primer or adhesive is used between the silicone elastomer layer 13 and the support 12. If the shear modulus G 'of the first layer 13a is too low, that is, if the silicone elastomer is too soft, the sheet handling becomes poor.
  • the first layer 1 3a If the shear modulus G 'is too high, that is, if the silicone elastomer is too hard, the first layer 13a becomes difficult to adhere to the support 12. In addition, there is a possibility that peeling may occur between the support 12 and the first layer 13a due to stress applied during the operation or formation of the first and second holes 14, 16. If the shear modulus G ′ of the second layer 13 b is too low, the second layer 13 b is too tightly attached to the FPC board 15, making it difficult to remove the FPC board 15. On the other hand, if the shear modulus G, of the second layer 13b is too high, the second layer 13b will not easily adhere to the FPC board 15, and it will be difficult to position the FPC board.
  • the first layer 13a is in contact with the support 12 and The second layers 13b are in good contact with the FPC board 15, respectively.
  • the shear modulus G 'of the first layer 13a is lower than the shear modulus G, of the second layer 13b.
  • the shear elastic modulus G 'of the first layer 13a is higher than that of the second layer 13b, the adhesion of the first layer 13a becomes weaker than that of the second layer 13b.
  • the silicone elastomer layer 13 may be peeled off from the support body 12.
  • the shear modulus G, of the first layer 13a is lower than that of the second layer 13b, the adhesion of the first layer 13a can be made stronger than that of the second layer 13b. Therefore, it is possible to prevent the silicone elastomer layer 13 from peeling off from the support 12 when the FPC board 15 is peeled off from the transport pallet 11.
  • the preferred shear modulus G 'of the first and second layers 13a and 13b is determined by appropriately adjusting the composition and the degree of crosslinking of the silicone elastomer, such as the type of polyorganosiloxane, molecular weight, and reinforcing filler. Obtained by
  • the temperature may rise to about 200 ° C to 240 ° C, and to about 280 ° C for recent lead-free solder. Therefore, the first and second layers 13a, 13b have physical properties such as shear modulus G '. It is desirable to be effective up to a temperature of Next, a method for mounting a semiconductor chip on the FPC board 15 using the transport pallet 11 having the configuration will be described.
  • the configuration of the mounting portion 31 of the mounting apparatus shown in FIG. 4 is the same as that of FIG. Also in the present embodiment, the transport pallets 11 are arranged on the receiver 31 in the same manner as in the embodiment of FIG.
  • Example 5 the support 12 was formed of an aluminum plate having a thickness of 0.8 mm, and the first layer 13a had a thickness of 0.1 mm.
  • a sample piece in which the thickness of the two layers 13b is 0.2 mm is prepared.
  • the shear modulus of the first layer and the second layer of Example 5 and Comparative Example 4 are as follows.
  • Example 5 An FPC board 15 corresponding to a predetermined position of each transport pallet 11 of Example 5 and Comparative Example 4 was brought into close contact with each other, and a heating reflow soldering step was performed. As a result, in Example 5, the semiconductor chip could be mounted normally without displacement.
  • Ma P Picture 88
  • the transport pallet 11 of Example 5 could be used repeatedly. Further, after use, the silicone elastomer layer 13 could be peeled from the support 12 by hand. On the other hand, in Comparative Example 4, the silicone elastomer layer 13 floated from the support 12 when the first holes 14 of the transport pallet 11 were formed. Further, in the heating reflow soldering step, peeling occurred between the silicone elastomer layer 13 and the support 12, resulting in a mounting failure.
  • This embodiment has the following advantages.
  • the transport pallet 11 is a laminate of the support 12, the first layer 13a, and the second layer 13b. Range of shear modulus G 'of the second layer 13 b is, 5. 0xl 0 5 P a more 5. Ox 1 0 6 is P a or less.
  • the FPC board 15 can be adhered to the transport pallet 11 without using an adhesive tape by utilizing the adhesiveness of the second layer 13b. Also, since no adhesive tape is used, there is no adhesive residue even when the FPC board 15 is removed from the transport pallet 11. Therefore, the semiconductor chip can be mounted on the FPC board 15 with high work efficiency and while preventing quality deterioration.
  • Range of shear modulus G 'of the first layer 13 a is, 3. 0xl 0 4 P a or 5. is 0x1 0 6 P a or less. Due to the adhesive strength of the first layer 13a, the first layer 13a can be firmly adhered to the support 12 without using the silicone elastomer layer 13 with a primer or an adhesive.
  • the silicone elastomer layer 13 will peel off from the support 12 during use of the transport pallet 11, and even if the first hole 14 is processed, no peeling will occur on the processed end face.
  • the silicone elastomer layer 13 can be peeled off from the support 12 and separated and discarded.
  • the shear modulus G ′ of the first layer 13a is lower than the shear modulus G ′ of the second layer 13b. Therefore, the force by which the first layer 13a adheres to the support 12 is as follows: It becomes stronger than the adhesion to PC board 15 and? ?
  • the transport pallet 25 includes a tape 23 for temporary fixing to an FPC board (not shown), and a pallet body 24 to which the tape 23 is in close contact with its surface.
  • the tape 23 includes first and second layers 21 and 22 made of silicone elastomer, each having a different shear modulus G ′.
  • a well-known additive may be added to the silicone elastomer contained in the first and second layers 21 and 22 as long as the physical properties required for the present invention are not impaired. Additives include fumed silica, precipitated silica, silicon oxide such as quartz powder, diatomaceous earth, calcium carbonate, carbon black, alumina, magnesium oxide, zinc oxide, zinc oxide, boron nitride, iron oxide, etc. Is mentioned.
  • the loss coefficient ta ⁇ ⁇ of the silicone elastomer is a physical property value that is affected by the molecular structure and cross-linking state of the polyorganosiloxane used as the material of the silicone elastomer, and indicates flexibility.
  • the raw materials and the degree of crosslinking are adjusted to obtain a silicone elastomer having a suitable loss factor ta ⁇ ⁇ .
  • a polyorganosiloxane in which a part of the methyl group of polydimethylsiloxane is substituted with another functional group is used, the crystallinity of the silicone elastomer is reduced, and a suitable loss factor ta ⁇ ⁇ 088
  • the shear modulus G ′ of the first layer 21 is not less than 3.0 ⁇ 10 4 and not more than 5.0 ⁇ 10 5 Pa. Preferably, 5. 0 X 1 0 4 or 3. is 0 X 1 0 5 P a or less. Shear modulus G, is Below 5. 0 X 1 0 4 P a , the first layer 21 is to handle too soft made flame axis. On the other hand, if higher than the shear modulus G 'forces 3. 0 X 1 0 5 P a , the first layer 2 1 is hardly adhered to the pallet body 24, first before the step of mounting a semiconductor chip on FPC board 1 The layer 21 may come off from the pallet body 24.
  • the shear bomb 1 "production rate G ' is measured by dynamic viscoelasticity measurement under the same conditions as in the above embodiment.
  • the range of the loss coefficient tan S of the first layer 21 is 0.15
  • the loss factor tan S is smaller than 0.15, when the first layer 21 is brought into close contact with the pallet body 24, the deformation of the first layer 21 is restored in a short time.
  • the loss coefficient tan S is larger than 0.60, the deformation will increase during use, making it impossible to withstand repeated use.
  • the shear modulus G ' is less than 5. 0 X 1 0 5 P a , and the adhesive force becomes too high between the FPC substrate to be fixed to the second layer 22, the FPC board after the semiconductor chip mounting It cannot be easily removed.
  • the shear modulus G ' is higher than 5.0 X 10 6 Pa, the adhesive strength between the second layer 22 and the FPC board is insufficient, and the temporary purpose of the FPC board, which is the original purpose, is not obtained. Fixing becomes difficult.
  • the range of the shear modulus G, of the second layer 22 is not less than 5.0 X 10 5 and not more than 5.0 X 10 6 Pa.
  • the first and second layers 21 and 22 are laminated with each layer remaining in an uncrosslinked state, and are bonded by vulcanization. However, it is not necessary to use this method, and any other method can be used as long as the two layers 21 and 22 can be bonded so that the shear modulus G, of each layer 21 and 22 falls within the above range. Good.
  • the range of the thickness of the first layer 21 is preferably 30 ⁇ or more and 200 ⁇ m or less, and more preferably 5 O zm or more and 10 ⁇ or less. For example.
  • the thickness of the first layer 21 is less than 30 m, a sufficient amount of deformation is not obtained when the first layer 21 is attached to the pallet body 24, and the first layer 21 does not adhere sufficiently to the pallet body 24. If the thickness of the first layer 21 is larger than 200 ⁇ , the amount of deformation with respect to the stress applied when mounting the semiconductor chip becomes too large, and the mounting accuracy is reduced. As shown in FIG. 6, the first layer 21 is in close contact with the pallet body 24, and the upper surface of the second layer 22 is exposed on the surface. An unillustrated FPC board is bonded onto the second layer 22, and an unillustrated semiconductor chip is mounted on the FPC board.
  • the FPC board When the semiconductor chip is heated to be mounted on the FPC board, the FPC board is temporarily fixed on the transport pallet 25 by the adhesive force of the second layer 2.
  • a pin hole may be formed in the pallet in order to position the pallet in the transfer section of the mounting apparatus.
  • the pallet body 24 is preferably made of stainless steel or aluminum. However, any other material may be used as long as it has heat resistance and strength that can serve as a reinforcing material for the FPC board when mounting a semiconductor chip.
  • the pallet body 24 is provided with a concave portion 28 having substantially the same depth as the thickness of the tape 23 and having a width to which the tape 23 can be attached.
  • a concave portion 28 having substantially the same depth as the thickness of the tape 23 and having a width to which the tape 23 can be attached.
  • the tape 23 is simply pasted on the surface of the pallet body 24 without forming the concave part 28 in the pallet body 24, the tape 23 itself forms a convex part on the transport pallet 25, A portion of the FPC board mounted on the tape 23 other than the portion bonded to the tape 23 generates a gap between the pallet body 24 and the other portion. For this reason, the pallet main body 24 does not play a role as a reinforcing material, and a shift occurs when mounting the semiconductor chip.
  • the difference X between the thickness of the tape 23 and the depth of the concave portion 28 is desirably not less than Om and not more than 0.05 mm. If the difference X is larger than 0.05 mm, the FPC board and the pallet body 2 are not formed, as in the case where the tape 23 is simply stuck on the surface of the pallet body 24 without forming the concave portion 28. The gap between them may become large, causing a gap when mounting a semiconductor chip. On the other hand, when the depth of the concave portion 28 is larger than the thickness of the tape 23, the difference X is preferably equal to or less than 0.05 mm, and most preferably 0 nini.
  • the FPC board must be bent in order for the FPC board to adhere to the tape 23. Therefore, the FPC board to be mounted may be shifted from the target position. Further, as shown in a modified example of FIG. 7, the tape 23 may be adhered without forming the concave portion 28 of FIG. 6 on the surface of the pallet body 24.
  • the projection 27 provided on the lower surface of the FPC board 26, and the pallet body 24, the projection 27 is formed. Even if the FPC board 26 has the tape 23, the tape 23 can be stabilized, and the deviation when mounting the semiconductor chip can be reduced.
  • How to mount FPC board and semiconductor chip (not shown) on transport pallet 25 Is as follows. First, the first layer 21 of the tape 23 is stuck on the pallet body 24 so that, for example, the second layer 22 is arranged on the surface of the transport pallet 25.
  • the FPC board is placed on the transport pallet 25, the FPC board is fixed by the adhesive force of the second layer 22, and a heating reflow soldering step is performed to mount the semiconductor chip on the FPC board.
  • the semiconductor chip can be mounted without shifting to a predetermined position. It can also be peeled off without leaving a glue residue on the FPC board.
  • the tape 23 can be reused more times than normal double-sided tape without peeling, and even when finally degraded and peeled, the adhesive remains on the pallet body 24 without leaving any adhesive residue. Can be peeled off.
  • the values of the shear modulus G 'and the loss coefficient ta ⁇ ⁇ were measured using a stake mouth meter VESF-III manufactured by Iwamoto Seisakusho under the conditions of a temperature of 20 ° C and a frequency of 1 OHz.
  • the first layer in Example 6 is a layer having a thickness of 0.1 mm in which a polydimethylsiloxane-based polymer into which fermethylsiloxane is introduced is crosslinked.
  • the second layer in Example 6 is a 0.2 mm thick layer formed by forming a bridge of TSE 2913-U manufactured by GE Toshiba Silicone Co., Ltd. At a temperature of 20 ° C, the shear modulus G of the second layer is 1.0 ⁇ 10 6 Pa. 3088
  • the FPC board is set at a predetermined position on the transport pallet, and a heating reflow soldering step of mounting semiconductor chips at a temperature of 240 ° C is performed.
  • the semiconductor chip could be mounted normally on the FPC board without shifting the position of the FPC board, and there was no adhesive residue on the FPC board removed after mounting.
  • the tape could be used at least 30 times. Furthermore, after 30 uses, the pallet could be easily peeled off from the pallet body by hand, leaving no residue on the pallet body.
  • the first layer of Comparative Example 5 was the same as Example 1 except that the physical properties were changed as follows by not including phenylmethylsiloxane unit when crosslinking the polydimethylsiloxane-based polymer. evaluated.
  • the thickness of the first layer was 0.1 mm
  • the shear modulus G, of the first layer at a temperature of 20 ° C. was 2.0 ⁇ 10 6 Pa
  • the loss coefficient tan S was 0. 1 and 2.
  • the tape 23 and the pallet body 24 are stably adhered by the first layer 21 having a low shear modulus G, and the FPC board and tape to be fixed are fixed by the second layer 22 having a high shear modulus G '. Adhesive strength between them can be reduced to the extent that they are temporarily fixed. Silicone elastomer has high heat resistance, so even if a heat reflow soldering step is performed to mount a semiconductor chip on an FPC board, the semiconductor chip can be mounted without shifting to a predetermined position. 03088
  • the silicone elastomer does not easily deteriorate, it can be reused more times than normal tape, and when it finally deteriorates and peels, it can be peeled off by hand without leaving any adhesive residue .
  • the embodiments are not limited to each embodiment, and may be modified as follows. As shown in FIG. 8, convex portions 42 may be formed on the FPC board 15 at positions corresponding to the second holes 16 by a press molding method or the like. In this case, the FPC board 15 is positioned at the door jf home position of the transport pallet 11 by engaging the convex portion 42 with the corresponding second hole 16.
  • FIG. 9 is a modification of the embodiment of FIG. 8 when the silicone elastomer layer 13 includes the first and second layers 13a and 13b.
  • the projections 42 are formed on the substrate 15, what is formed on the transport pallet 11 for engaging the projections 42 is not limited to the second holes 16, but may be recesses. ,. This recess is usually formed to a depth such that it penetrates through the silicone elastomer layer 13 and reaches the middle of the support 12, but may be a depth that does not reach the support 12.
  • the configuration for positioning the spine substrate 15 at a predetermined position on the transport pallet 11 is performed only by the second pin 35 or only by the engagement between the convex portion 42 of FIGS. 8 and 9 and the second hole 16.
  • the configuration is not limited to this, and the FPC board 15 may be used for both the second pin 35 and the projection 42.
  • one through hole 34 and one protrusion 42 are formed in the FPC board 15, respectively.
  • Suitable thermal conductivity and volume resistivity are high thermal conductivity filler and conductive filler 8
  • the thermal conductivity of the silicone layer 13 does not have to be equal to or higher than 0.
  • the thermal conductivity is preferably 0.4 W / m ⁇ K or more so as to prevent the occurrence of uneven temperature on the pallet 11.
  • the volume resistivity of the silicone elastomer layer 13 may not be 1.0 ⁇ 10 10 ⁇ ⁇ cm or less.
  • the volume resistivity is preferably less than 1.0 ⁇ 10 10 ⁇ ⁇ cm to prevent dust from adhering.
  • the physical properties of the shear elastic modulus G ′, thermal conductivity, and volume resistivity of the silicone elastomer layer 13 are approximately 200 ° C. to 240 °. C, It is not limited to keeping at around 280 ° C in the case of recent lead-free solder. For example, if the temperature is less than 200 ° C in the heating reflow soldering step, the temperature at which the physical properties of the silicone elastomer layer 13 can be maintained is 200. Even below C.
  • the process of mounting the semiconductor chip on the FPC boards 15 and 26 adhered on the transfer pallets 11 and 25 is a heating reflow soldering process. Not limited.
  • a flow soldering step (wave soldering step) may be used.
  • the FPC board 15 when the FPC board 15 is positioned at a predetermined position of the transport pallet 11 by the second pin 35, the second hole 16 is formed in the transport pallet 11.
  • the present invention is not limited to the configuration to be formed.
  • the depth of the recess reaches the middle of the support 12 through the silicone elastomer layer 13.
  • the transport pallet 11 has a plurality of second holes 16 corresponding to the FPC board 15 or even if the recess is not formed.
  • the FPC board 15 can be easily positioned at a predetermined position on the transfer pallet 11.
  • the transport pallet 11 may not have the first hole 14 corresponding to the mounting portion 31 of the mounting device.
  • the support 12 is not limited to an aluminum plate, and may be, for example, a metal plate such as a stainless steel plate or a magnesium alloy plate, a glass fiber impregnated epoxy plate, or a glass plate.
  • a plastic plate such as a fiber-impregnated polyester plate may be used.
  • the non-stretchable support 12 may be made of another material.
  • Plastic plates such as fiber impregnated epoxy plates are particularly suitable.
  • the shear elastic modulus G 'of the silicone elastomer layer 13 and the first and second layers 21 and 22 of the tape 23 is adjusted to a suitable value. The method may be performed, for example, by optionally blending a plurality of commercially available silicone compounds. In each of the embodiments shown in FIGS. 1 (a) and (b) to FIG.
  • the bonding method between the silicone elastomer layer 13 and the support 12 is not limited to vulcanization bonding.
  • a crosslinked silicone elastomer sheet may be used.
  • the support 12 may be bonded using a silicone-based adhesive.
  • the silicone elastomer layer 13 is provided with an additive which is conventionally known to be added to a silicone elastomer composition.
  • An additive may be added within a range that does not impair the physical properties such as the shear modulus G ′, thermal conductivity, and volume resistivity of the present invention.
  • these additives include, for example, silicon oxide such as fumed silica, precipitated silica, and quartz powder, as well as diatomaceous earth, calcium carbonate, carpump rack, alumina, magnesium oxide, zinc oxide, boron nitride, iron oxide, and the like.
  • silicon oxide such as fumed silica, precipitated silica, and quartz powder
  • diatomaceous earth calcium carbonate, carpump rack
  • alumina magnesium oxide
  • zinc oxide zinc oxide
  • boron nitride iron oxide
  • the number of the FPC boards 15 adhered onto the transfer pallet 11 is not limited to six, and the FPC boards 15 and the FPC boards 15 It may be appropriately changed depending on the size. For example, when the FPC board 15 is large, the number of FPC boards 15 that can be in close contact with the transport pallet 11 decreases.
  • the second hole 16 is? . It is formed by appropriately changing the position corresponding to the substrate 15. In each of the embodiments of FIGS. 1 (a) and 1 (b) to FIG. 4, the positions where the second holes 16 are formed are at two corners on one diagonal line of one FPC board 15. The position is not limited to the corresponding position, and may be changed as appropriate. Further, the position where the first hole 14 is formed is not limited to the both ends in the longitudinal direction of the transport pallet 11 and may be appropriately changed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Laminated Bodies (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne une palette de transfert pour plaquettes FPC comprenant un support non extensible et un élastomère aux silicones. Le module de cisaillement G', mesuré suivant une méthode de viscoélasticité dynamique, à 10 Hz et à 20 °C, sous vibration de l'élastomère aux silicones, est comprise entre 5,0 x 105 Pa et 5,0 x 106 Pa. L'élastomère aux silicones est appliqué sur le support.
PCT/JP2003/003088 2002-03-15 2003-03-14 Palette de transfert pour plaquette fpc, et procede de montage de puce a semi-conducteur sur plaquette fpc WO2003079744A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2003213383A AU2003213383A1 (en) 2002-03-15 2003-03-14 Transfer palette for fpc board and method for mounting semiconductor chip on fpc board
KR1020047014427A KR100694609B1 (ko) 2002-03-15 2003-03-14 Ｆｐｃ 기판용 반송 팔레트 및 ｆｐｃ 기판으로의 반도체칩 실장 방법

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2002072757A JP4097185B2 (ja) 2002-03-15 2002-03-15 Ｆｐｃ基板搬送用パレット及びｆｐｃ基板への半導体チップ実装方法
JP2002-72757 2002-03-15
JP2002072756A JP4097184B2 (ja) 2002-03-15 2002-03-15 Ｆｐｃ基板搬送用パレット及びｆｐｃ基板への半導体チップ実装方法
JP2002-72756 2002-03-15
JP2002-380156 2002-12-27
JP2002380156A JP4188076B2 (ja) 2002-12-27 2002-12-27 薄型基板の仮固定用テープ及びこれを用いた薄型基板実装用パレット

Publications (1)

Publication Number Publication Date
WO2003079744A1 true WO2003079744A1 (fr) 2003-09-25

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PCT/JP2003/003088 WO2003079744A1 (fr) 2002-03-15 2003-03-14 Palette de transfert pour plaquette fpc, et procede de montage de puce a semi-conducteur sur plaquette fpc

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Country Link
KR (1) KR100694609B1 (fr)
CN (1) CN100349502C (fr)
AU (1) AU2003213383A1 (fr)
TW (1) TW592000B (fr)
WO (1) WO2003079744A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111164396A (zh) * 2017-12-06 2020-05-15 Nok株式会社 温度测量装置和温度测量机构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050986A (ja) * 1983-08-30 1985-03-22 ソニー株式会社 フレキシブルプリント回路基板の製造方法
JPS63204696A (ja) * 1986-10-23 1988-08-24 株式会社小糸製作所 可撓性プリント基板への部品ハンダ付け実装法
JP2001210998A (ja) * 2000-01-21 2001-08-03 Denso Corp フレキシブル基板の実装方法とそれに使用する補強板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050986A (ja) * 1983-08-30 1985-03-22 ソニー株式会社 フレキシブルプリント回路基板の製造方法
JPS63204696A (ja) * 1986-10-23 1988-08-24 株式会社小糸製作所 可撓性プリント基板への部品ハンダ付け実装法
JP2001210998A (ja) * 2000-01-21 2001-08-03 Denso Corp フレキシブル基板の実装方法とそれに使用する補強板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111164396A (zh) * 2017-12-06 2020-05-15 Nok株式会社 温度测量装置和温度测量机构
CN111164396B (zh) * 2017-12-06 2021-11-30 Nok株式会社 温度测量装置和温度测量机构

Also Published As

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KR100694609B1 (ko) 2007-03-13
CN100349502C (zh) 2007-11-14
KR20040097170A (ko) 2004-11-17
TW592000B (en) 2004-06-11
CN1644005A (zh) 2005-07-20
TW200305356A (en) 2003-10-16
AU2003213383A1 (en) 2003-09-29

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