WO2003073141A1 - Dispositif de guide d'onde optique en resine athermique - Google Patents

Dispositif de guide d'onde optique en resine athermique Download PDF

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Publication number
WO2003073141A1
WO2003073141A1 PCT/JP2003/001921 JP0301921W WO03073141A1 WO 2003073141 A1 WO2003073141 A1 WO 2003073141A1 JP 0301921 W JP0301921 W JP 0301921W WO 03073141 A1 WO03073141 A1 WO 03073141A1
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WO
WIPO (PCT)
Prior art keywords
optical waveguide
temperature
substrate
waveguide
fluorinated polyimide
Prior art date
Application number
PCT/JP2003/001921
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English (en)
Japanese (ja)
Inventor
Yoshihiro Moroi
Hidehisa Nanai
Yuji Yamamoto
Shigeki Sakaguchi
Original Assignee
Central Glass Company, Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Central Glass Company, Limited filed Critical Central Glass Company, Limited
Publication of WO2003073141A1 publication Critical patent/WO2003073141A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind

Definitions

  • the present invention relates to an asamaru resin optical waveguide device which eliminates the need for external temperature control by eliminating the temperature dependence of the optical waveguide itself by using a polyimide substrate for the optical waveguide.
  • DWDM Dense Wavelength Division Multiplexing
  • a wavelength multiplexer / demultiplexer that multiplexes or demultiplexes light of different wavelengths is an extremely important device.
  • the center wavelength of the device changes due to a change in ambient temperature.
  • One way to stabilize and improve such temperature characteristics is to incorporate a high-accuracy external temperature control device into the element as a correction component.
  • this method hindered cost reduction and miniaturization of the device, and had a problem in practical use.
  • the change in the center wavelength of the device is due to the temperature dependence of the optical path length of the optical circuit that constitutes the device, and the temperature dependence of the optical path length is expressed by the following equation.
  • n equivalent refractive index of the optical waveguide
  • ⁇ linear thermal expansion coefficient of the substrate
  • the temperature dependence of the optical path length of the optical circuit becomes zero, the change in the center wavelength of the device due to the temperature change in the surrounding environment is eliminated, and the temperature-independent optical waveguide (a (Referred to as a thermal optical waveguide).
  • a substrate having a negative linear thermal expansion coefficient is used, and an optical waveguide that is assimilated by controlling the linear thermal expansion coefficient is disclosed.
  • quartz optical waveguides are limited due to the fabrication temperature being close to 100 ° C. and the high fabrication cost, and there is a major problem in the spread of optical waveguide devices.
  • thermo-optic constant (dn / dT) of the resin is negative in a resin optical waveguide whose fabrication temperature is low and cost reduction can be expected. From this, an asamaru optical waveguide can be manufactured by controlling the linear thermal expansion coefficient of the substrate.
  • An as-made optical waveguide using a fluorinated acrylic resin as the optical waveguide material and a resin material as the substrate has been reported (see 2001 Optical Fiber Communication Conference and Exhibit, Postdeadline Papers, PD7-1).
  • the heat resistance temperature of this asamaru optical waveguide is as low as about 85 ° C., and there is a temperature problem when used in combination with an active element such as VOA.
  • Another problem is that the propagation loss at 1.5 zm, which is a commonly used optical communication wavelength band, is as large as 0.8 dB / cm. Therefore, there has been a long-awaited need for a resin optical waveguide that is heat-resistant, has low propagation loss, and has long-term reliability in a resin waveguide expected to be reduced in cost.
  • An object of the present invention is to solve the above-mentioned problems in the conventional asamaru optical waveguide and to provide an asamaru optical waveguide having low cost, easy manufacturing, heat resistance, low propagation loss, and long-term reliability. It is to provide.
  • the inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and found that a fluorinated polyimide having high heat resistance and excellent light transmittance in an optical waveguide manufacturing process was used as a substrate material, and a waveguide material was used.
  • a fluorinated polyimide having high heat resistance and excellent light transmittance in an optical waveguide manufacturing process was used as a substrate material, and a waveguide material was used.
  • thermo-optic constant (dnZdT) of the substrate By controlling the thermo-optic constant (dnZdT) of the substrate and the linear thermal expansion coefficient of the substrate, it was found that an asamal resin optical waveguide having low cost, heat resistance, low propagation loss, and long-term reliability can be manufactured.
  • an optical waveguide formed on a fluorinated polyimide substrate which has substantially temperature independence in a temperature range of 0 to 150 ° C.
  • a waveguide device is provided.
  • a heat-resistant material such as fluorinated epoxy or deuterated polysiloxane may be used as the waveguide material.
  • the light transmittance is good in the 85 m wavelength band
  • the propagation loss in the 1.5 m band which is a normal optical communication wavelength band
  • the deuterated polysiloxane is 1.5 im.
  • the propagation loss is about 0.4 dBZcm, the manufacturing cost is high, and it cannot be used practically as a general optical waveguide material.
  • Fluorinated polyimide has a high heat-resistant temperature of 300 ° C or higher and a small propagation loss of 0.3 dB / cm in the 1.5-m band, and is suitable as a resin-assembled optical waveguide material.
  • the substrate material and the waveguide material become the same material, which increases the compatibility, improves the adhesion between the substrate and the waveguide, and reduces and avoids the residual stress of the fabricated device. It is possible to improve the long-term reliability under high temperature and high humidity.
  • fluorinated polyimide for the substrate and controlling its linear thermal expansion coefficient, it has low cost, easy manufacturing, heat resistance, low propagation loss, long-term reliability, and eliminates temperature dependence.
  • fluorinated polyimide for the substrate and controlling its linear thermal expansion coefficient, it has low cost, easy manufacturing, heat resistance, low propagation loss, long-term reliability, and eliminates temperature dependence.
  • the fluorinated polyimide substrate is prepared from a polyimide solution or a polyamic acid solution, or a mixture thereof.
  • the coefficient of linear thermal expansion is from 40 pm / K to 120 ppm. It has been found that it can be set arbitrarily within the range of / K, and that it has a glass transition temperature of 300 ° C or higher and can be manufactured with high transparency, so that it is suitable as an optical waveguide substrate.
  • the temperature of the transmission refractive index of the optical waveguide can be increased.
  • An asamal resin optical waveguide device with no dependency can be formed.
  • Thermo-optical constants of the material used as an optical waveguide material will depend on the material compositions being used, approximately - in the range of 0. 6 X 10- 4 ⁇ one 1. 8 X 10- 4 ZK Since the refractive index n is about 1.5, substituting these values into Equation 1 yields a coefficient of linear thermal expansion ⁇ of the substrate satisfying the assimilation condition in the range of 40 to 120 ppm / K. It is desired that the control can be performed arbitrarily.
  • the optical waveguide may be used in combination with an active element such as VOA on the substrate, and since these elements generate heat, the heat resistance temperature is preferably about 150 ° C. or more.
  • resin materials have high reliability up to about half the glass transition temperature (° C) and can ensure heat resistance. It is suitable as a material for an optical waveguide element having heat resistance.
  • the material of the optical waveguide highly transparent, but also the substrate for the optical waveguide needs to have high light transmission in order to obtain an optical waveguide with low light propagation loss.
  • the substrate material and the waveguide material are the same, so that compatibility is high.
  • fluorinated polyimide is suitable as a material for the optical waveguide device.
  • tetrapyruonic acid and its derivatives used in the production of fluorinated polyimide constituting the substrate.
  • an example of tetracarboxylic acid will be given. 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane (hereinafter referred to as 6 FDA), 3,3 ', 4,4,1-tetracarboxydiphenyl ether, 3,3 ', 4,4'-benzophenone tetracarboxylic acid, 3,3', 4,4'-tetra-potoxydiphenylsulfone, pyromellitic acid and the like.
  • 6 FDA 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane
  • 6 FDA 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane
  • 6 FDA 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane
  • 6 FDA 2,
  • the diamine component for example, the following diamine or its diisocyanate derivative is used.
  • 2,2'-bis (trifluoromethyl) _4,4'-diaminobiphenyl hereinafter referred to as TFDB
  • 2,2'-bis (p-aminophenol) hexafluoropropane 2,2 ' -Dimethylbenzidine, 3,3,1-dimethylpentidine, 4,4'-oxydianiline (hereinafter referred to as ODA), etc., which may be used alone or in combination.
  • ODA 4,4'-oxydianiline
  • a polyimide substrate having high surface smoothness without bubble swelling or warpage due to stress generation can be manufactured.
  • a suitable one can be selected by measuring the linear thermal expansion coefficient and the glass transition temperature of the obtained fluorinated polyimide.
  • An example of the asamaru resin optical waveguide device is a device that resonates, reflects, transmits, or branches a specific wavelength by interfering or resonating light propagating in the optical waveguide. Coupler, Matsu eighteenda interferometer, A resonator, a Fabry-Believe resonator, an arrayed waveguide diffraction grating, and the like.
  • Coupler Matsu eighteenda interferometer, A resonator, a Fabry-Believe resonator, an arrayed waveguide diffraction grating, and the like.
  • 6 FDAZTFDB polyimide solution a polyimide solution having a concentration of 30% and a viscosity of 50 boise
  • a polyimide optical waveguide core was prepared from the solution of Preparation Example 3, and the lower and upper clads were prepared with the solution of Preparation Example 2.
  • the solution of Preparation Example 1 was prepared so that the linear thermal expansion coefficient of the polyimide substrate was 78 ppmZK, and 50 g of this solution was placed on a 20 cm square glass plate on which a release agent had been applied in advance. Cast using an applicator. After casting, heat treatment was performed in an oven at 70 ° C for 2 hours and at 150 ° C for 2 hours to partially remove the solvent. Thereafter, the solvent-containing plate was peeled from the support. Subsequently, the obtained solvent-containing plate was fixed to a frame, heated in an oven at 200 ° C. for 2 hours, and then heated at 380 ° C. for 2 hours to substantially completely remove the solvent.
  • the heating rate to the heating temperature was set at 3 ° C / min.
  • This polyimide substrate had a thickness of 550 m, a Young's modulus of 4.5 GPa, a glass transition temperature of 325 ° C, and a surface roughness of 4 nm. A coefficient of linear thermal expansion of 78 ppmZK was obtained. No foaming or warpage was observed on the polyimide substrate.
  • a linear optical waveguide and an arrayed waveguide diffraction grating were fabricated using the obtained polyimide substrate.
  • a 6 FDAZTFDB polyamic acid solution (the solution of Preparation Example 2) was spin-coated on this polyimide substrate, and heated at 70 ° C for 2 hours, at 160 ° C for 1 hour, at 250 ° C for 30 minutes, and at 350 ° C for 1 hour. Thermal imidization was performed to form an under clad with a thickness of 15 m.
  • a 6 FDAZTFDB / QDA polyamic acid solution (the solution of Preparation Example 3) was spin-coated on this substrate, and heated under the same conditions as above to form a core layer.
  • This core layer was formed into a linear core pattern having a length of 7 Omm, a width of 8 mm, and a height of 8 zm by photolithography and dry etching.
  • an overcladding having a thickness of 15 m was formed on the substrate under the same conditions as those for forming a 6 FDAZTFDB polyamic acid solution (the solution of Preparation Example 2) undercladding.
  • the propagation loss was measured by a cutback method using 1.55 Aim light through the fabricated waveguide, it was 0.3 dBZcm, and the polarization dependent loss was less than 0.3 IdB / cm, making it suitable as an optical waveguide.
  • the propagation loss was measured by a cutback method using 1.55 Aim light through the fabricated waveguide, it was 0.3 dBZcm, and the polarization dependent loss was less than 0.3 IdB / cm, making it suitable as an optical waveguide.
  • Array waveguide grating with a core size of 8 m in width, 8 m in height, 8 x 8 channels, center wavelength of 1.5525 m, and a wavelength interval of 200 GHz is the same process as the fabrication of the above linear optical waveguide It was produced using.
  • Array waveguide fabricated When the temperature characteristics of the diffraction grating were measured, the change in the center wavelength of the device was less than 0.01 nm / ° C in the range of 0 ° C to 150 ° C.
  • the fabricated resin optical waveguide device had low optical loss, no polarization dependence, and was substantially temperature independent.
  • the fabricated linear waveguide and AWG were left in an atmosphere at a temperature of 85 ° C and a humidity of 85% for 2,000 hours. However, there was no change in characteristics before and after the storage, and they had long-term reliability.
  • a directional coupler having a waveguide length of 2 cm, a waveguide interval of a coupling portion of 3 m, and a coupling length of 1.2 mm was manufactured by the same material and the same process as in Example 1.
  • the core size was 8 m wide and 8 m high.
  • the incident light was measured using a 1.55 m laser in the range of 0 ° C to 150 ° C, and the branching ratio was determined by measuring the amount of light emitted from each port. At any temperature, the crossport showed a branching ratio of 99.1% or more, and was virtually independent of temperature.
  • the insertion loss of the directional coupler was 1.0 dB, and the polarization dependent loss was 0.2 dB / cm or less. Thus, a suitable optical waveguide was obtained.
  • the fabricated directional coupler was left in an atmosphere at a temperature of 85 ° C and a humidity of 85% for 2000 hours. However, there was no change in characteristics before and after the exposure, and it had long-term reliability.
  • a linear optical waveguide and an arrayed waveguide diffraction grating were fabricated under the same conditions as in Example 1 'except that a silicon substrate was used as the substrate.
  • the light propagation loss was measured by the cutback method by passing 1.55 light through the fabricated linear optical waveguide.
  • the measured loss was 0.6 dB / cm, and the polarization dependent loss was 0.7 dBZcm. Both dependency losses have worsened.
  • the change in the central wavelength of the device from 0 ° C to 150 ° C was ⁇ 0.15 nm / ° C, which was unsuitable for AWG. there were.
  • the fabricated linear waveguide and AWG were left in an atmosphere at a temperature of 85 ° C and a humidity of 85% for 2,000 hours, separation occurred between the silicon substrate and the optical waveguide.
  • the optical propagation loss has deteriorated to 0.8 dBZcm, and the long-term reliability is insufficient. there were.
  • an asamaru resin optical waveguide device having low cost, easy production, heat resistance, low propagation loss, and long-term reliability.

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

Cette invention porte sur un dispositif de guide d'onde optique en résine athermique comprenant un guide d'onde optique formé sur un substrat de polyimide fluoré, lequel dispositif se caractérise en ce qu'il présente une indépendance substantielle par rapport à la température dans une gamme de température comprise entre 0 et 150 °C.
PCT/JP2003/001921 2002-02-26 2003-02-21 Dispositif de guide d'onde optique en resine athermique WO2003073141A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002050139 2002-02-26
JP2002-050139 2002-02-26
JP2003026848A JP2003322738A (ja) 2002-02-26 2003-02-04 アサーマル樹脂光導波路デバイス
JP2003-026848 2003-02-04

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WO2003073141A1 true WO2003073141A1 (fr) 2003-09-04

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101928398A (zh) * 2009-06-23 2010-12-29 日东电工株式会社 聚酰亚胺化合物及制法以及由其获得的光学薄膜和光波导

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4743749B2 (ja) * 2005-01-31 2011-08-10 国立大学法人京都大学 低熱膨張性光導波路フィルム
JP4552862B2 (ja) * 2006-01-10 2010-09-29 日立電線株式会社 光合波器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000191784A (ja) * 1998-12-25 2000-07-11 Central Glass Co Ltd 光学基板用ポリイミド及び光学用ポリイミド基板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000191784A (ja) * 1998-12-25 2000-07-11 Central Glass Co Ltd 光学基板用ポリイミド及び光学用ポリイミド基板

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
KEIL N. ET AL., PROCEEDINGS OF OPTICAL FIBER COMMUNICATION CONFERENCE AND EXHIBIT 2001, vol. 4, 17 March 2001 (2001-03-17) - 22 March 2001 (2001-03-22), pages PD7-1 - PD7-3, XP010545692 *
MATSUURA T. ET AL., MACROMOLECULES, vol. 26, 1993, pages 419 - 423, XP000335369 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101928398A (zh) * 2009-06-23 2010-12-29 日东电工株式会社 聚酰亚胺化合物及制法以及由其获得的光学薄膜和光波导
CN101928398B (zh) * 2009-06-23 2013-06-12 日东电工株式会社 聚酰亚胺化合物及制法以及由其获得的光学薄膜和光波导
US8470959B2 (en) 2009-06-23 2013-06-25 Nitto Denko Corporation Polyimide compound, preparation method therefor, and optical film and optical waveguide produced by employing the compound

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JP2003322738A (ja) 2003-11-14

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