WO2003050600A1 - Systeme de traitement de substrat et dispositif de sechage de substrat - Google Patents

Systeme de traitement de substrat et dispositif de sechage de substrat Download PDF

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Publication number
WO2003050600A1
WO2003050600A1 PCT/JP2001/010960 JP0110960W WO03050600A1 WO 2003050600 A1 WO2003050600 A1 WO 2003050600A1 JP 0110960 W JP0110960 W JP 0110960W WO 03050600 A1 WO03050600 A1 WO 03050600A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
slit nozzle
downstream
processing apparatus
air knife
Prior art date
Application number
PCT/JP2001/010960
Other languages
English (en)
Japanese (ja)
Inventor
Hitoshi Tauchi
Original Assignee
Sumitomo Precision Products Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Products Co., Ltd filed Critical Sumitomo Precision Products Co., Ltd
Priority to PCT/JP2001/010960 priority Critical patent/WO2003050600A1/fr
Priority to JP2003551597A priority patent/JPWO2003050600A1/ja
Priority to KR10-2004-7008588A priority patent/KR20040065572A/ko
Publication of WO2003050600A1 publication Critical patent/WO2003050600A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells

Definitions

  • the present invention relates to a horizontal transfer type substrate processing apparatus used for manufacturing glass substrates for liquid crystal display devices and the like, and a substrate drying apparatus used for the substrate processing apparatus.
  • a glass substrate used for a liquid crystal display device is manufactured by repeatedly performing chemical treatment such as etching and separation on the surface of a glass substrate as a material.
  • the substrate processing equipment is roughly classified into dry type and wet type, and wet type is divided into batch type and single wafer type. Furthermore, the single wafer type is subdivided into a stationary rotation type and a horizontal conveyance type by roller conveyance or the like.
  • the horizontal transfer type has a basic structure that supplies a processing liquid to the surface of the substrate while transporting the substrate in the horizontal direction. O used for processing
  • a substrate In a horizontal transfer type substrate processing apparatus used for an etching process, a substrate generally passes through a receiving section, a liquid avoiding section, an etching section, a washing section, and a draining section in order.
  • the etchant is sprayed in a shower form from a number of spray nozzles arranged in a matrix above the substrate transport line, and the substrate passes through the shower, so that the etchant is spread over the entire surface of the substrate. Supplied.
  • the surface of the substrate is selectively etched except for the portion where the masking material is applied. You.
  • the substrate after the etching process is subjected to a double-sided cleaning process using a pure water shower in a water washing unit, and is sent to a draining unit that is a drying unit. Pure water adhering to both surfaces of the substrate is removed at the draining section, and an air knife is known as one of the removing methods.
  • air knife In draining with an air knife, air is ejected in a thin film form from a pair of upper and lower slit nozzles provided across the substrate transfer line, and the air knife collides with both surfaces of the substrate to remove pure water from both surfaces. I do.
  • the air injection direction is inclined to the upstream side in the substrate transfer direction in a side view and to the side in a plan view in order to increase the efficiency of removing pure water and to prevent liquid scattering.
  • Draining with air knives is smaller and more space efficient than draining with rotation.
  • they are arranged directly in the transport line and do not need to be taken in and out by robots, they are highly efficient and space-efficient. Due to these advantages, it is attracting attention as a drying means after washing in a horizontal transfer type substrate processing apparatus.
  • the charging of the substrate is a major problem. That is, in the draining and drying using an air knife, when the substrate passes between the upper and lower slit nozzles, charging occurs due to friction with air.
  • the substrate is transported by a transport roller provided crossing the line, and the slit nozzle is inclined to the side, so the transport roller cannot be provided due to interference with the slit nozzle.
  • Triangular dead spaces are formed upstream and downstream of the slit nozzle. Therefore, in the vicinity of the slit nozzle, the substrate is not sufficiently supported in spite of receiving a large air pressure, and as a result, the warping and fluttering of the substrate becomes a problem.
  • the substrate is charged to a high voltage of 1000 V
  • An object of the present invention is to provide a horizontal transfer type substrate processing apparatus and a substrate drying apparatus capable of stably supporting a substrate in the vicinity of a slit nozzle for an air knife and effectively preventing circuit breakdown due to charging. It is in. Disclosure of the invention
  • a substrate processing apparatus of the present invention conveys a substrate in a horizontal direction, passes the substrate through a plurality of processing units, performs an jet process in at least one of the plurality of processing units, and
  • a horizontal transfer type substrate processing apparatus provided with a liquid draining section by an air knife downstream of the nozzle processing section, each substrate is placed at least downstream of a slit nozzle for an air knife installed in the liquid draining section.
  • a large number of free rollers which are made of a conductive material and are electrically grounded, are dispersed and arranged.
  • the substrate drying apparatus of the present invention is provided with slit nozzles for air knives arranged vertically above and below a substrate transfer line, and a distributed nozzle for supporting the substrate at least downstream of the slit nozzle.
  • the substrate is stably supported by a number of free rollers near the slit nozzle. The electric charge accumulated on the lower surface of the substrate, which has passed through the slit nozzle, is efficiently removed through a large number of free rollers also serving as a substrate supporting roller.
  • the slit nozzle is inclined sideways in a plan view, and a right-angled triangular dead space formed on the upstream and downstream sides of the slit nozzle with the inclination, or It is preferable that the free rollers for supporting the substrate are dispersedly arranged in a space including the above, and at least the free roller on the downstream side is made of a conductive material and is electrically grounded, since the draining function and the substrate supporting function are excellent.
  • the ion charge is efficiently removed by disposing a ionizer facing the upper surface of the substrate from above on the downstream side of the slit nozzle.
  • the horizontal transfer method for transferring the substrate in the horizontal direction is divided into a method in which the substrate is transferred in the horizontal direction in a horizontal position, and a method in which the substrate is transferred in the horizontal direction in a position inclined to the side. Is applicable to any method
  • FIG. 1 is a schematic side view of a substrate processing apparatus showing one embodiment of the present invention
  • FIG. 2 is a plan view of a main part (liquid drainage part) of the substrate processing apparatus
  • FIG. 3 is a line AA in FIG.
  • FIG. 4 is a view taken along line BB in FIG. BEST MODE FOR CARRYING OUT THE INVENTION
  • the substrate processing apparatus of the present embodiment is an etching apparatus used for manufacturing a glass substrate for a liquid crystal display.
  • the substrate processing apparatus includes a receiving section 20, a liquid avoiding section 30, an etching section 40, a washing section 50, and a liquid removing section 6 arranged in order in the transport direction of the substrate 10. It has 0.
  • Each part is equipped with a number of transfer rollers 21, 31, 41, 51, 61, which support the substrate 10 horizontally and transfer it in the horizontal direction.
  • the transfer roller 61 includes a horizontal drive shaft 61a that crosses the substrate transfer line at right angles, and a plurality of roller bodies 61b mounted at predetermined intervals in the longitudinal direction of the drive shaft 61a.
  • the roller bodies 61 b and 61 b on both sides supporting both edges of the substrate 10 are flanged rollers for positioning the substrate 10 in the width direction.
  • one press roller 6 1c attached to the horizontal support shaft 6 1d is moved upward with respect to the flanged rollers on both sides of the predetermined number of the transfer rollers 61.
  • a convey roller of a pinch roller type is constructed by being opposed to the above.
  • the drive shaft 61 a is provided between the side plates on both sides of the liquid drain 60, and one end thereof is connected to a drive mechanism provided outside one of the side plates of the liquid drain 60. I have.
  • the liquid avoiding part 30 provided between the receiving part 20 and the etching part 40 is a buffer (buffer part) for preventing the etching liquid from entering the receiving part 20 from the etching part 40.
  • the etching unit 40 is provided with a shower unit 42 for supplying an etchant in a shutter-like manner from above on the upper surface of the substrate 10 at a position above the transport line of the substrate 10.
  • pure water is sprayed from above onto the upper surface of the substrate 10 in a shower shape.
  • the first shower unit 52 is provided on the lower surface of the substrate 10, and the second shower unit 53 for spraying pure water in a shower shape from below is provided between the lower surface of the substrate 10 and the transfer line of the substrate 10.
  • Drainer 60 is a substrate drying device that removes pure water from both surfaces of substrate 10 that has been washed.
  • the liquid draining section 60 is provided with a pair of upper and lower slit nozzles 62 and 63 arranged so as to sandwich the transport line of the substrate 10 from above and below.
  • the upper slit nozzle 62 is an air nozzle for an air knife that removes pure water from the cleaned upper surface of the substrate 10 by blowing air over the entire width of the upper surface of the substrate 10 in a thin film shape.
  • the lower slit nozzle 63 is an air nozzle for an air knife for removing pure water from the cleaned lower surface of the substrate 10 by blowing air in a thin film shape over the entire lower surface of the substrate 10.
  • the upper and lower slit nozzles 62, 63 are inclined toward the upstream side in the transport direction of the substrate 10 in a side view to improve the pure water removal efficiency as shown in FIGS. Then it is inclined to the side. With the inclination of the slit nozzles 6 2 and 6 3 to the side, the upstream and downstream sides of the lower slit nozzle 63 have a right-angled angle where it is not possible to install a line-crossing type transport roller 61. An angular dead space occurs.
  • a right triangle support plate 64 A is installed in the upstream dade space.
  • the support plate 64A is provided with side plates on both sides of the liquid drain portion 60 such that one of two horizontal sides that intersect at right angles is orthogonal to the substrate transfer line and the oblique side is parallel to the slit nozzle 63. Horizontally supported between.
  • a plurality of ribs 65 A parallel to the substrate transfer line are provided on the upper surface of the support plate 64 A at predetermined intervals in the width direction of the substrate transfer line. .
  • On one side surface of each rib 65A one or a plurality of free rollers 67A having a horizontal axis as a rotation axis perpendicular to the substrate transfer direction is rotatably mounted.
  • a right triangle support plate 64B is installed in the downstream dead space.
  • the support plate 64 B is provided on both sides of the liquid drain 60 such that one of two horizontal sides that intersect at right angles is orthogonal to the substrate transfer line and the oblique side is parallel to the slit nozzle 63. Horizontally supported between the side plates.
  • On the upper surface of the support plate 64B a plurality of ribs 65B parallel to the substrate transfer line are erected at predetermined intervals in the width direction of the substrate transfer line.
  • a conductive plate 66B is attached to one side surface of each rib 65B, and one or more free rollers 67B having a horizontal axis as a rotation axis perpendicular to the board transfer direction are provided. Is installed in contact with
  • each of the free rollers 66A and 66B is arranged at the same level as the substrate transfer line, and a plurality of free rollers 67A and 66A attached to the ribs 65A and 65B, respectively. 67 B are arranged at predetermined intervals in the rib longitudinal direction which is the substrate transfer direction.
  • the free rollers 66A and 66B are made of resin, and the free port 66B downstream of the slit nozzle 63 is made of a conductive resin. Is electrically connected to the conductive plate 66B.
  • the conductive plate 66B is grounded to the land by a lead wire (not shown).
  • a ionizer 68 (FIG. 1) is provided so as to face the substrate 10 from above.
  • the substrate 10 passes in the horizontal position in the order of the receiving part 20, the liquid avoiding part 30, the etching part 40, the washing part 50, and the liquid removing part 60.
  • the upper surface of the substrate 10 is subjected to an etching process, the upper and lower surfaces are cleaned, and then the substrate is dried.
  • pressurized air is blown in a thin film form from the slit nozzles 62, 63 onto both surfaces of the substrate 10.
  • the spray direction is inclined to the upstream side and the side in the transport direction of the substrate 10. For this reason, The cleaning liquid (pure water) adhering to both surfaces of the substrate 10 is efficiently removed to the side of the substrate transfer line.
  • the substrate 10 is located in this dead space, especially the slit nozzle 6 In the vicinity of 2 and 63, a large air pressure is applied from the slits 6 2 and 6 3, and it is easy to cause wavy rattling and the like.
  • a large number of free rollers 67A and 67B are provided in the right triangular dead space formed on the upstream side and the downstream side of the slit nozzle 63 in the substrate transport direction and in the substrate transport direction. It is arranged in a horizontal direction perpendicular to this, and is arranged up to the vicinity of the slit nozzle 63.
  • the free rollers 67A and 67B are installed on the common support plates 64A and 64B, and do not require level adjustment. Accordingly, the substrate 10 is stably supported even in the immediate vicinity of the slit nozzles 62, 63, and its wave rattling is effectively prevented, and assembly / maintenance becomes extremely easy.
  • the substrate 10 becomes 10 10 due to friction with air when passing between the slit nozzles 62 and 63 and friction with resin due to moving on a large number of free rollers 67A. It is charged to such a high voltage as to reach 0.000 V. If this charge is left, the circuit formed on the upper surface of the substrate 10 may be broken by sparks.
  • the substrate 10 that has passed between the slit nozzles 62 and 63 is connected to a large number of conductive free rollers 67 B grounded via the conductive plate 66 B. As it moves above, the charge on the lower surface is removed immediately after passing.
  • the disposition pitch of the free rollers 67A and 67B be selected so that the warpage of the substrate 10 between the rollers in the substrate transport direction and the width direction is within 1 mm. If the arrangement pitch is extremely small, problems such as cost-up, deterioration of maintainability, and contamination of the lower surface of the substrate 10 may occur. If it is too large, the cleaning liquid (pure water) remains due to the warpage of the substrate 10, and poor drying occurs.
  • the arrangement pitch is appropriately about 5 mm.
  • the distance between the transfer ports — rollers 61 and 61 disposed upstream and downstream of the free rollers 67 A and 67 B must be smaller than the length of the substrate 10. Therefore, the area in which the free rollers 67A and 67B are disposed must be smaller than the length of the substrate 10 in the substrate transport direction.
  • the inclination angles S to the side of the slit nozzles 62 and 63 are set to S.
  • the length of the dead space is determined by the length of the dead space, but in practice, it is preferably 2/3 or more of the length of the substrate 10 from the viewpoint of stable support of the substrate 10.
  • the inclination angle 0 of the slit nozzles 62 and 63 to the side is 10 to 20 degrees C.
  • the diameter of the free rollers 67A and 67B is smaller than the body diameter of the transport roller, and is preferably 10 to 30 mm. If it is too small, rotation failure may occur or the lower surface of the substrate 10 may be scratched. If it is too large, it will be difficult to secure the pitch.
  • the main body diameter of the transport roller is It is always 40 to 50 mm.
  • the free rollers 67A and 67B are arranged only in the right triangular dead space formed on the upstream side and the downstream side of the slit nozzle 63, but are arranged in a wider range than this. It is also possible. As for the support plates 64A and 64B, one is provided on each of the upstream side and the downstream side of the slit nozzle 63, but it is also possible to use two or more on one side or both sides. Further, the free rollers 67 A and 67 B can be made conductive both on the upstream side and the downstream side of the slit nozzle 63. Industrial applicability
  • the substrate processing apparatus is configured to support a substrate at least at a downstream side of a slit nozzle for an air knife installed in a liquid draining unit, and to be configured by a conductive material to electrically connect the substrate.
  • the substrate drying apparatus includes a plurality of free rollers, each of which supports a substrate and is made of a conductive material and is electrically grounded, at least downstream of a slit nozzle for an air knife. By dispersing them, the substrate can be stably supported in the vicinity of the slit nozzle, and furthermore, it is possible to effectively prevent circuit breakage due to charging.

Abstract

L'invention concerne un système de traitement de substrat du type à chariot horizontal dans lequel un substrat est transporté dans la direction horizontale pour passer par une pluralité de parties de traitement, un traitement humide est effectué au niveau d'au moins une desdites parties de traitement et une partie permettant d'enlever l'excès de liquide à l'aide d'une lame d'air est ménagée sur le côté aval de la partie de traitement humide. Dans ce système de traitement de substrat, le substrat est supporté de façon stable à proximité d'une buse à jet plat (52) d'une lame d'air, ce qui permet de protéger efficacement le circuit contre les pannes dues au chargement. A cet effet, la buse à jet plat (52) disposée dans une partie permettant d'enlever l'excès de liquide est inclinée vers le côté, vue de dessus, et des rouleaux libres (67A, 67B) destinés à supporter le substrat sont répartis dans des zones en angle mort en forme de triangle rectangle sur les côtés amont et aval de la buse à jet plat (52) ou dans des espaces comprenant ces zones en angle mort. Au moins le rouleau libre (67B) sur le côté aval est composé d'un matériau conducteur et mis à la terre.
PCT/JP2001/010960 2001-12-13 2001-12-13 Systeme de traitement de substrat et dispositif de sechage de substrat WO2003050600A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2001/010960 WO2003050600A1 (fr) 2001-12-13 2001-12-13 Systeme de traitement de substrat et dispositif de sechage de substrat
JP2003551597A JPWO2003050600A1 (ja) 2001-12-13 2001-12-13 基板処理装置及び基板乾燥装置
KR10-2004-7008588A KR20040065572A (ko) 2001-12-13 2001-12-13 기판 처리 장치 및 기판 건조 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2001/010960 WO2003050600A1 (fr) 2001-12-13 2001-12-13 Systeme de traitement de substrat et dispositif de sechage de substrat

Publications (1)

Publication Number Publication Date
WO2003050600A1 true WO2003050600A1 (fr) 2003-06-19

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JP (1) JPWO2003050600A1 (fr)
KR (1) KR20040065572A (fr)
WO (1) WO2003050600A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110779320A (zh) * 2019-09-17 2020-02-11 苏州晶洲装备科技有限公司 一种新型风干系统及具有该系统的oled基板剥离设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03113340U (fr) * 1990-03-07 1991-11-19
JPH0573939U (ja) * 1992-03-13 1993-10-08 島田理化工業株式会社 ガラス基板処理装置
JPH05277456A (ja) * 1992-03-31 1993-10-26 Hitachi Ltd 液処理装置
JPH09246228A (ja) * 1996-03-01 1997-09-19 Dainippon Screen Mfg Co Ltd 基板の液切り装置
JP2000286320A (ja) * 1999-03-31 2000-10-13 Shibaura Mechatronics Corp 基板搬送装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03113340U (fr) * 1990-03-07 1991-11-19
JPH0573939U (ja) * 1992-03-13 1993-10-08 島田理化工業株式会社 ガラス基板処理装置
JPH05277456A (ja) * 1992-03-31 1993-10-26 Hitachi Ltd 液処理装置
JPH09246228A (ja) * 1996-03-01 1997-09-19 Dainippon Screen Mfg Co Ltd 基板の液切り装置
JP2000286320A (ja) * 1999-03-31 2000-10-13 Shibaura Mechatronics Corp 基板搬送装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110779320A (zh) * 2019-09-17 2020-02-11 苏州晶洲装备科技有限公司 一种新型风干系统及具有该系统的oled基板剥离设备

Also Published As

Publication number Publication date
JPWO2003050600A1 (ja) 2005-04-21
KR20040065572A (ko) 2004-07-22

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