WO2003050601A1 - Systeme de traitement de substrat et dispositif de sechage de substrat - Google Patents

Systeme de traitement de substrat et dispositif de sechage de substrat Download PDF

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Publication number
WO2003050601A1
WO2003050601A1 PCT/JP2001/010961 JP0110961W WO03050601A1 WO 2003050601 A1 WO2003050601 A1 WO 2003050601A1 JP 0110961 W JP0110961 W JP 0110961W WO 03050601 A1 WO03050601 A1 WO 03050601A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
slit nozzle
downstream
slit
processing apparatus
Prior art date
Application number
PCT/JP2001/010961
Other languages
English (en)
Japanese (ja)
Inventor
Hitoshi Tauchi
Original Assignee
Sumitomo Precision Products Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Products Co., Ltd filed Critical Sumitomo Precision Products Co., Ltd
Priority to JP2003551598A priority Critical patent/JPWO2003050601A1/ja
Priority to KR10-2004-7008589A priority patent/KR20040064295A/ko
Priority to PCT/JP2001/010961 priority patent/WO2003050601A1/fr
Publication of WO2003050601A1 publication Critical patent/WO2003050601A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/02—Devices for feeding articles or materials to conveyors
    • B65G47/04—Devices for feeding articles or materials to conveyors for feeding articles
    • B65G47/06—Devices for feeding articles or materials to conveyors for feeding articles from a single group of articles arranged in orderly pattern, e.g. workpieces in magazines
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Definitions

  • the present invention relates to a horizontal transfer type substrate processing apparatus used for manufacturing glass substrates for liquid crystal display devices and the like, and a substrate drying apparatus used for the substrate processing apparatus.
  • a glass substrate used for a liquid crystal display device is manufactured by repeatedly performing chemical treatment such as etching and separation on the surface of a glass substrate as a material.
  • the substrate processing equipment is roughly divided into a dry type and a wet type, and a pett type is divided into a batch type and a single wafer type.
  • the single wafer type is subdivided into a stationary rotation type and a horizontal conveyance type by roller conveyance or the like.
  • the horizontal transfer type has a basic structure that supplies a processing liquid to the surface of the substrate while transporting the substrate in the horizontal direction. O used for processing
  • a substrate In a horizontal transfer type substrate processing apparatus used for an etching process, a substrate generally passes through a receiving section, a liquid avoiding section, an etching section, a washing section, and a draining section in order.
  • a large number of spray nozzles arranged in a matrix above the substrate transport line emit a shower-like etching solution, and the substrate passes through the shower, etching the entire surface of the substrate. Liquid is supplied.
  • the surface of the substrate is selectively etched except for the portion where the masking material is applied.
  • the substrate after the etching process is subjected to a double-sided cleaning process using a pure water shower in a water washing unit, and is sent to a draining unit that is a drying unit.
  • a force that removes pure water adhering to both sides of the substrate is known as one of the removal methods using an air knife.
  • air knife In draining with an air knife, air is ejected in a thin film form from a pair of upper and lower slit nozzles provided across the substrate transfer line, and the air knife is collided with both surfaces of the substrate to remove pure water from both surfaces. .
  • the air injection direction is inclined to the upstream side in the substrate transfer direction in a side view and to the side in a plan view in order to increase the efficiency of removing pure water and to prevent liquid scattering.
  • Draining with air knives is smaller and more space efficient than draining with rotation.
  • they are arranged directly in the transport line and do not need to be taken in and out by robots, they are highly efficient and space-efficient in this respect. Due to these advantages, it is attracting attention as a drying means after washing in a horizontal transfer type substrate processing apparatus.
  • a line-crossing type transport roller in which a plurality of roller bodies are mounted in the axial direction of a drive shaft crossing the transport line is used.
  • a pinch-roll type line-crossing type transport roller with a press-down port facing from above is used.
  • a pair of upper and lower slit nozzles for the air knife are arranged at a large angle to the side in plan view in order to increase the efficiency of pure water removal and prevent liquid scattering. Due to this inclined arrangement, a right-angled triangular dead space in which a line-crossing type transport roller cannot be provided due to interference with the nozzle is generated on the upstream side and the downstream side of the slit nozzle.
  • the slit nozzle is installed on both sides of the board transfer line
  • An independent pinch roll is provided to support and drive both edges of the substrate.
  • a roller drive mechanism is required on both sides of the substrate transport line, and the transport mechanism becomes expensive.
  • warping or fluttering of the substrate becomes a problem. If a large number of small-diameter support rollers are dispersed and arranged in the front and rear dead spaces, a force that would prevent the board from warping or flapping temporarily ⁇ Actually, the level adjustment of the small-diameter support rollers is difficult. As a result, stable substrate support as expected is difficult.
  • An object of the present invention is to provide a horizontal transfer type substrate processing apparatus and a substrate drying apparatus which can stably support a substrate in the vicinity of a slit nozzle for an air knife which is arranged in an inclined manner and can avoid complication of a transfer mechanism. It is in. Disclosure of the invention
  • a substrate processing apparatus of the present invention conveys a substrate in a horizontal direction, passes the substrate through a plurality of processing units, performs a jet process in at least one of the plurality of processing units, and performs a jet process.
  • a horizontal transfer type substrate processing apparatus provided with a liquid draining section using an air knife downstream of the liquid processing section, a pair of upper and lower slit nozzles for the air knife installed in the liquid draining section are inclined sideways in plan view.
  • At least a number of free rollers for supporting the substrate are dispersed and arranged in a space including a right-angled triangular dead space generated on the upstream side and the downstream side of the slit nozzle due to the inclination thereof.
  • a predetermined number of the rollers are collectively installed on a common support plate disposed upstream and downstream of the slit nozzle.
  • the substrate drying apparatus of the present invention is provided with a pair of upper and lower slit nozzles for an air knife, which are disposed vertically above and below a substrate transfer line, each of which is inclined sideways in plan view.
  • the slit nozzle With the inclination of the slit nozzle, the slit nozzle
  • the right-angled triangular dead space generated on the upstream side and downstream side of the nozzle, or a predetermined number of them are collectively arranged on a common support plate that is distributed and arranged in the space including the space and that is arranged on the upstream side and downstream side of the slit nozzle.
  • a large number of free rollers for supporting the substrate are provided.
  • a large number of substrate support rollers are provided in a right triangular dead space formed before and after a slit nozzle for an air knife, which is inclined.
  • the free rollers are arranged in a predetermined number on a common support plate arranged in the dead space, and the level adjustment is not required, so that the warping and flapping of the substrate can be stably performed. Is prevented.
  • a line crossing type transfer roller crossing the substrate transfer line preferably a pinch roll type
  • the horizontal transfer method for transferring the substrate in the horizontal direction is classified into a method of transferring the substrate in the horizontal direction in a horizontal posture, and a method of transferring the substrate in the horizontal direction by tilting the substrate to the side. Is applicable to both methods
  • FIG. 1 is a schematic side view of a substrate processing apparatus showing one embodiment of the present invention
  • FIG. 2 is a plan view of a main part (liquid drainage part) of the substrate processing apparatus
  • FIG. 3 is a line AA in FIG.
  • FIG. 4 is a view taken along a line BB in FIG. BEST MODE FOR CARRYING OUT THE INVENTION
  • the substrate processing apparatus of the present embodiment is an etching apparatus used for manufacturing a glass substrate for a liquid crystal display.
  • the substrate processing apparatus includes a receiving section 20, a liquid avoiding section 30, an etching section 40, a washing section 50, and a liquid removing section 6 arranged in order in the transport direction of the substrate 10. It has 0.
  • Each part is equipped with a number of transfer ports 21, 31, 41, 51, 61 that support the substrate 10 horizontally and transfer it in the horizontal direction.
  • the transfer roller 61 includes a horizontal drive shaft 61 a that crosses the substrate transfer line at right angles, and a plurality of roller bodies 6 lb attached at predetermined intervals in the longitudinal direction of the drive shaft 61 a.
  • the roller bodies 61 b and 61 b on both sides supporting both edges of the substrate 10 are flanged rollers for positioning the substrate 10 in the width direction.
  • one press roller 6 1c attached to the horizontal support shaft 6 1d is moved upward with respect to the flanged rollers on both sides of the predetermined number of the transfer rollers 61.
  • a convey roller of a pinch roller type is constructed by being opposed to the above.
  • the drive shaft 61 a is provided between the side plates on both sides of the liquid drain 60, and one end thereof is connected to a drive mechanism provided outside one of the side plates of the liquid drain 60. I have.
  • the liquid avoiding part 30 provided between the receiving part 20 and the etching part 40 is a buffer (buffer part) for preventing the etching liquid from entering the receiving part 20 from the etching part 40.
  • the etching unit 40 is provided on the upper surface of the substrate 10 so as to supply an etching liquid from above in the form of a shower.
  • the shower unit 42 is provided at a position above the transfer line of the substrate 10.
  • pure water is sprayed from above onto the upper surface of the substrate 10 in a shower shape.
  • a first shower unit 52 is provided on the lower surface of the substrate 10, and a second shower unit 53 for spraying pure water in a shower shape from below is provided on a lower surface of the substrate 10 with a transfer line of the substrate 10 interposed therebetween.
  • Drainer 60 is a substrate drying device that removes pure water from both surfaces of substrate 10 that has been washed.
  • the liquid draining section 60 is provided with a pair of upper and lower slit nozzles 62 and 63 arranged so as to sandwich the transport line of the substrate 10 from above and below.
  • the upper slit nozzle 62 is an air nozzle for an air knife that removes pure water from the cleaned upper surface of the substrate 10 by blowing air over the entire width of the upper surface of the substrate 10 in a thin film shape.
  • the lower slit nozzle 63 is an air nozzle for an air knife for removing pure water from the cleaned lower surface of the substrate 10 by blowing air in a thin film shape over the entire lower surface of the substrate 10.
  • the upper and lower slit nozzles 62 and 63 are used to increase the efficiency of removing pure water and to prevent the liquid from being scattered. It is inclined to the upstream side, and it is inclined to the side in plan view. With the inclination of the slit nozzles 62, 63 to the side, it is not possible to install line crossing type transport rollers 61 upstream and downstream of the lower slit nozzle 63. There is a dead space in the shape of a right triangle. A right triangle support plate 64 A is installed in the upstream dade space.
  • the support plate 64A is provided with side plates on both sides of the liquid drain portion 60 such that one of two horizontal sides that intersect at right angles is orthogonal to the substrate transfer line and the oblique side is parallel to the slit nozzle 63. Horizontally supported between.
  • On the upper surface of the support plate 64A as shown in FIGS. 2 to 4, a plurality of ribs 65A parallel to the substrate transfer line are erected at predetermined intervals in the width direction of the substrate transfer line. .
  • one or a plurality of free rollers 67A having a horizontal axis perpendicular to the substrate transfer direction as a rotation axis is rotatably mounted.
  • a right triangle support plate 64B is installed in the downstream dead space.
  • the support plate 64 B is provided on both sides of the liquid drain 60 such that one of two horizontal sides that intersect at right angles is orthogonal to the substrate transfer line and the oblique side is parallel to the slit nozzle 63. Horizontally supported between the side plates.
  • On the upper surface of the support plate 64B a plurality of ribs 65B parallel to the substrate transfer line are erected at predetermined intervals in the width direction of the substrate transfer line.
  • a conductive plate 66B is attached to one side of each rib 65B, and one or more free rollers 67B having a horizontal axis as a rotation axis perpendicular to the board transfer direction are provided with a conductive plate 66B. It is installed in contact with.
  • each of the free rollers 66A and 66B is arranged at the same level as the substrate transfer line, and a plurality of free rollers 67A and 167A attached to the ribs 65A and 65B, respectively.
  • 67 B are arranged at predetermined intervals in the rib longitudinal direction which is the substrate transfer direction.
  • the free rollers 66A and 66B are made of resin, and the free rollers 66B downstream of the slit nozzle 63 are made of conductive resin. It is electrically connected to plate 66B.
  • the conductive plate 66B is grounded to the ground by a lead wire (not shown).
  • a ionizer 68 (FIG. 1) is provided on the downstream side of the upper slit nozzle 63 so as to face the substrate 10 from above.
  • the substrate 10 passes in the horizontal position in the order of the receiving part 20, the liquid avoiding part 30, the etching part 40, the washing part 50, and the liquid removing part 60.
  • the upper surface of the substrate 10 is subjected to an etching process, the upper and lower surfaces are cleaned, and then the substrate is dried.
  • pressurized air is blown in a thin film form from the slit nozzles 62, 63 onto both surfaces of the substrate 10.
  • the spray direction is inclined to the upstream side and the side in the transport direction of the substrate 10. For this reason, The cleaning liquid (pure water) adhering to both surfaces of the substrate 10 is efficiently removed to the side of the substrate transfer line. Further, since the substrate 10 enters between the slit nozzles 62 and 63 from the corners, scattering of the cleaning liquid (pure water) adhering to the lower surface of the substrate 10 is suppressed.
  • a right triangle triangular dead space is formed upstream and downstream of the slit nozzle 63.
  • a line crossing type transport roller 61 cannot be provided due to interference with the slit nozzle 63.
  • the substrate 10 receives a large air pressure from the slit nozzles 62 and 63 in this dead space, and is liable to cause wave rattling and the like.
  • a large number of free rollers 67A and 67B are provided in the right triangular dead space generated on the upstream side and the downstream side of the slit nozzle 63 in the substrate transport direction and in the vertical direction. It is arranged in a horizontal direction perpendicular to this, and is arranged up to the vicinity of the slit nozzle 63.
  • the free rollers 67A and 67B are installed on the common support plates 64A and 64B, and do not require level adjustment. Therefore, the substrate 10 is stably supported even in the immediate vicinity of the slit nozzles 62 and 63, and its wave rattling and the like are effectively prevented, and assembly / maintenance becomes very easy.
  • the substrate 10 is brought into contact with the air due to friction with the air when passing between the slit nozzles 6 2 and 6 3 and friction with the resin caused by moving on the many free rollers 67 A. It is charged to a high voltage that reaches 0 V. If this charge is left, the circuit formed on the upper surface of the substrate 10 may be broken by sparks.
  • the substrate 10 that has passed between the slit nozzles 62 and 63 is placed on a large number of conductive free rollers 67 B grounded via the conductive plate 66 B. To As it moves, the charge on the lower surface is removed immediately after passing.
  • the disposition pitch of the free rollers 67A and 67B be selected so that the warpage of the substrate 10 between the rollers in the substrate transport direction and the width direction is within 1 mm. If the arrangement pitch is extremely small, problems such as cost-up, deterioration of maintainability, and contamination of the lower surface of the substrate 10 may occur. If it is too large, the cleaning liquid (pure water) remains due to the warpage of the substrate 10, and poor drying occurs.
  • an arrangement pitch of about 75 mm is appropriate.
  • the distance between the transfer ports — rollers 61 and 61 disposed upstream and downstream of the free rollers 67 A and 67 B must be smaller than the length of the substrate 10. Therefore, the area in which the free rollers 67A and 67B are disposed must be smaller than the length of the substrate 10 in the substrate transport direction.
  • the lower limit of the length in the board transfer direction of the area where the free ports 67A and 67B are disposed is geometrically determined by the inclination angle ⁇ of the slit nozzles 62 and 63 to the side.
  • the length of the dead space is determined, but in practice, the length of the substrate 10 is preferably 2 Z 3 or more from the viewpoint of stable support of the substrate 10.
  • the inclination angle 0 of the slit nozzles 62 and 63 to the side should be 10 ⁇ 20 degrees ⁇ J '.
  • the diameter of the free rollers 67A and 67B is smaller than the diameter of the main body of the transport roller, and is preferably 10 to 30 mm. If it is too small, rotation failure may occur or the lower surface of the substrate 10 may be scratched. Place that is too big In such a case, it is difficult to secure the arrangement pitch.
  • the main body diameter of the transport roller is usually 40 to 50 mm.
  • the free rollers 67A and 67B are arranged only in the right triangular dead space generated on the upstream side and the downstream side of the slit nozzle 63.
  • the free rollers 67A and 67B may be arranged in a wider range. Is also possible.
  • the support plates 64A and 64B one each is disposed on the upstream side and the downstream side of the slit nozzle 63, but it is also possible to use two or more on one or both sides. Availability on
  • the substrate processing apparatus of the present invention has a large number of rectangular triangular dead spaces on the upstream side and the downstream side of the slit nozzle which is inclined in the air knife type liquid draining section.
  • the substrate support rollers By disposing the substrate support rollers in a distributed manner, and by setting a predetermined number of free rollers collectively on a common support plate arranged in the dead space, the substrate can be disposed even in the vicinity of the slit nozzle. Can be reliably supported, and the warpage and flutter can be stably prevented.
  • line-crossing type transport rollers upstream and downstream of the substrate support roller it is possible to avoid complication of the transport mechanism.
  • a large number of substrate support rollers are dispersed and arranged on the upstream side and the downstream side of the slit knife for the air knife, which is inclined, so as to force the right triangular dead space.

Abstract

L'invention concerne un système de traitement de substrat du type à chariot horizontal dans lequel un substrat est transporté dans la direction horizontale et soumis à un traitement humide et une partie permettant d'enlever l'excès de liquide à l'aide d'une lame d'air est ménagée sur le côté aval de la partie de traitement humide. Dans ce système de traitement de substrat, le substrat est supporté de façon stable à proximité d'une buse à jet plat (62) d'une lame d'air inclinée, ce qui permet d'éviter les problèmes posés par un mécanisme de support du substrat. A cet effet, un grand nombre de rouleaux libres (67A, 67B) destinés à supporter le substrat sont répartis dans des espaces comportant des zones en angle mort en forme de triangle rectangle sur les côtés amont et aval de la buse à jet plat (62) lorsqu'elle est inclinée. Un nombre spécifique de rouleaux libres (67A, 67B) sont placés collectivement sur des plaques de support partagées (64A, 64B) disposées sur les côtés amont et aval de la buse à jet plat (62).
PCT/JP2001/010961 2001-12-13 2001-12-13 Systeme de traitement de substrat et dispositif de sechage de substrat WO2003050601A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003551598A JPWO2003050601A1 (ja) 2001-12-13 2001-12-13 基板処理装置及び基板乾燥装置
KR10-2004-7008589A KR20040064295A (ko) 2001-12-13 2001-12-13 기판 처리 장치 및 기판 건조 장치
PCT/JP2001/010961 WO2003050601A1 (fr) 2001-12-13 2001-12-13 Systeme de traitement de substrat et dispositif de sechage de substrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2001/010961 WO2003050601A1 (fr) 2001-12-13 2001-12-13 Systeme de traitement de substrat et dispositif de sechage de substrat

Publications (1)

Publication Number Publication Date
WO2003050601A1 true WO2003050601A1 (fr) 2003-06-19

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ID=11738036

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Application Number Title Priority Date Filing Date
PCT/JP2001/010961 WO2003050601A1 (fr) 2001-12-13 2001-12-13 Systeme de traitement de substrat et dispositif de sechage de substrat

Country Status (3)

Country Link
JP (1) JPWO2003050601A1 (fr)
KR (1) KR20040064295A (fr)
WO (1) WO2003050601A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05277456A (ja) * 1992-03-31 1993-10-26 Hitachi Ltd 液処理装置
JPH0880476A (ja) * 1994-09-12 1996-03-26 Dainippon Screen Mfg Co Ltd 角型基板洗浄装置
JPH09246228A (ja) * 1996-03-01 1997-09-19 Dainippon Screen Mfg Co Ltd 基板の液切り装置
JPH11288099A (ja) * 1998-04-03 1999-10-19 Nippon Densan Shinpo Kk 露光装置
JP2000286320A (ja) * 1999-03-31 2000-10-13 Shibaura Mechatronics Corp 基板搬送装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05277456A (ja) * 1992-03-31 1993-10-26 Hitachi Ltd 液処理装置
JPH0880476A (ja) * 1994-09-12 1996-03-26 Dainippon Screen Mfg Co Ltd 角型基板洗浄装置
JPH09246228A (ja) * 1996-03-01 1997-09-19 Dainippon Screen Mfg Co Ltd 基板の液切り装置
JPH11288099A (ja) * 1998-04-03 1999-10-19 Nippon Densan Shinpo Kk 露光装置
JP2000286320A (ja) * 1999-03-31 2000-10-13 Shibaura Mechatronics Corp 基板搬送装置

Also Published As

Publication number Publication date
KR20040064295A (ko) 2004-07-16
JPWO2003050601A1 (ja) 2005-04-21

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