WO2003048072A1 - Corps de structure en nid d'abeilles et son procede de fabrication - Google Patents
Corps de structure en nid d'abeilles et son procede de fabrication Download PDFInfo
- Publication number
- WO2003048072A1 WO2003048072A1 PCT/JP2002/012696 JP0212696W WO03048072A1 WO 2003048072 A1 WO2003048072 A1 WO 2003048072A1 JP 0212696 W JP0212696 W JP 0212696W WO 03048072 A1 WO03048072 A1 WO 03048072A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- honeycomb
- adhesive
- layer
- honeycomb structure
- component
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000000149 penetrating effect Effects 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 58
- 239000010410 layer Substances 0.000 claims description 56
- 239000000853 adhesive Substances 0.000 claims description 52
- 230000001070 adhesive effect Effects 0.000 claims description 52
- 239000012790 adhesive layer Substances 0.000 claims description 34
- 239000007787 solid Substances 0.000 claims description 17
- 238000005192 partition Methods 0.000 claims description 15
- 239000011148 porous material Substances 0.000 claims description 9
- 238000005304 joining Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 abstract description 5
- 239000007767 bonding agent Substances 0.000 abstract description 2
- 238000000926 separation method Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 17
- 229910010271 silicon carbide Inorganic materials 0.000 description 15
- 239000000919 ceramic Substances 0.000 description 14
- 239000002994 raw material Substances 0.000 description 14
- 239000012784 inorganic fiber Substances 0.000 description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 10
- 238000001035 drying Methods 0.000 description 10
- 239000011230 binding agent Substances 0.000 description 9
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 8
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 7
- 238000010304 firing Methods 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000003197 catalytic effect Effects 0.000 description 6
- 238000002485 combustion reaction Methods 0.000 description 6
- 229910052878 cordierite Inorganic materials 0.000 description 6
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 6
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229920000609 methyl cellulose Polymers 0.000 description 6
- 239000001923 methylcellulose Substances 0.000 description 6
- 235000010981 methylcellulose Nutrition 0.000 description 6
- 229910052863 mullite Inorganic materials 0.000 description 6
- 239000013618 particulate matter Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 239000000446 fuel Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 4
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 4
- 229910000505 Al2TiO5 Inorganic materials 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- AABBHSMFGKYLKE-SNAWJCMRSA-N propan-2-yl (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC(C)C AABBHSMFGKYLKE-SNAWJCMRSA-N 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 229910052770 Uranium Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- -1 hydroxypropyl alcohol Chemical compound 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008929 regeneration Effects 0.000 description 2
- 238000011069 regeneration method Methods 0.000 description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910017112 Fe—C Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
- C04B28/24—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing alkyl, ammonium or metal silicates; containing silica sols
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- B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
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- B01J35/50—Catalysts, in general, characterised by their form or physical properties characterised by their shape or configuration
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- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B1/00—Producing shaped prefabricated articles from the material
- B28B1/002—Producing shaped prefabricated articles from the material assembled from preformed elements
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- C04B35/565—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide
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- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
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- C04B35/71—Ceramic products containing macroscopic reinforcing agents
- C04B35/78—Ceramic products containing macroscopic reinforcing agents containing non-metallic materials
- C04B35/80—Fibres, filaments, whiskers, platelets, or the like
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- C—CHEMISTRY; METALLURGY
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F01N3/02—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust
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- F01N3/0222—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters characterised by specially adapted filtering structure, e.g. honeycomb, mesh or fibrous the structure being monolithic, e.g. honeycombs
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- F01N3/033—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters in combination with other devices
- F01N3/035—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters in combination with other devices with catalytic reactors, e.g. catalysed diesel particulate filters
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
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- F01N3/08—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous
- F01N3/10—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust
- F01N3/24—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous by thermal or catalytic conversion of noxious components of exhaust characterised by constructional aspects of converting apparatus
- F01N3/28—Construction of catalytic reactors
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Definitions
- the present invention relates to a honeycomb structure and a method for manufacturing the same.
- the present invention relates to an 82-cam structure used for a catalyst carrier utilizing a catalytic action of an internal combustion engine, a boiler, a chemical reaction device, a reformer for a fuel cell, or the like, or a filter for collecting fine particles in exhaust gas, and the like.
- the present invention relates to a manufacturing method, and more particularly to a honeycomb structure that is less likely to cause defects such as cracks in a bonded portion and a method of manufacturing the same.
- a honeycomb structure is used for a catalyst carrier utilizing a catalytic action of an internal combustion engine, a boiler, a chemical reaction device, a reformer for a fuel cell, or the like, or a filter for collecting fine particles in exhaust gas, particularly diesel fine particles, and the like.
- the honeycomb structure used for such a purpose has a problem that the temperature distribution in the honeycomb structure becomes non-uniform due to a sudden change in the temperature of the exhaust gas or local heat generation, which causes cracks in the structure. was there.
- DPF a filter
- a thermal shock resistant rotary thermal storage system that applies and sinters a ceramic bonding material whose mineral composition after firing is substantially the same as that of the matrix segment and whose difference in thermal expansion coefficient is 0.1% or less at 80 O: Has been proposed. Also, in the SAE paper 1986 of 1986, the honeycomb segment of cordierite was included. Discloses a ceramic honeycomb structure joined with cordierite cement.
- a honeycomb ceramic member is composed of inorganic fibers, inorganic binders, organic binders, and inorganic particles that intersect at least three-dimensionally.
- a ceramic honeycomb structure bonded with a sealing material is disclosed.However, the use of an intractable organic binder is difficult due to the prolonged drying time and the uniformity of the material composition. However, this has led to reduced productivity. For this reason, a honeycomb structure having few adhesive defects and high adhesive strength without an organic binder is desired. Disclosure of the invention
- the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a honeycomb structure having a high bonding strength and hardly causing defects such as cracks in a bonding portion, and a method for manufacturing the same. That is.
- the present invention provides a honeycomb structure in which a plurality of honeycomb segments having a large number of flow holes penetrating in the axial direction partitioned by a porous partition are integrated via a bonding layer, wherein the bonding layer is
- An object of the present invention is to provide a honeycomb structure, comprising: at least one adhesive layer; and at least one underlayer interposed between the honeycomb segment and the adhesive layer.
- the bonding layer includes an underlayer directly formed on the side wall of the honeycomb segment, and further has a structure in which a part of the underlayer penetrates into pores of the honeycomb segment.
- the thermal expansion coefficient of the underlayer is Ut
- the thermal expansion coefficient of the honeycomb segment is Ht
- the thermal expansion coefficient of the adhesive layer is At
- Ht ⁇ UtAt or Ht ⁇ Ut ⁇ Preferably, the relationship is At.
- the content of at least one component X constituting the adhesive layer is Ax
- the content of component X contained in the honeycomb segment is Hx
- the content of component X contained in the underlayer is U.
- the adhesive layer and the underlayer are formed from an adhesive and an undercoat, respectively. It is preferable that the viscosity of the primer be lower than the viscosity.
- the present invention further includes a step of manufacturing a honeycomb segment having a large number of through-holes penetrating in the axial direction partitioned by a porous partition wall, and a step of forming a honeycomb structure by joining the honeycomb segments.
- a method of manufacturing a honeycomb structure including: a step of applying at least one layer of a base material on the honeycomb segments; and a step of applying at least one layer of an adhesive on the honeycomb segments. And a step of bonding and integrating the honeycomb segments to provide a method for manufacturing a honeycomb structure.
- the viscosity of the base material is lower than the viscosity of the adhesive
- both the base material and the adhesive include a solid component and a liquid component, and at least one component constituting the solid component in the adhesive Hy ⁇ Uy ⁇ Ay or Hy ⁇ , where Ay is the content of Y, Hy is the content of component Y in the honeycomb segment, and Uy is the content of component Y in the solid component in the primer. It is preferable to check in the relationship of Uy ⁇ Ay.
- the present invention also relates to a method for manufacturing a honeycomb structure, comprising a step of forming a honeycomb structure by joining honeycomb segments having a large number of flow holes penetrating in the axial direction partitioned by a porous partition wall, A step of applying at least one layer of a base material on the honeycomb segments, a step of applying at least one layer of an adhesive, and a step of bonding and integrating the honeycomb segments; And a method for manufacturing a honeycomb structure, comprising: BRIEF DESCRIPTION OF THE FIGURES
- FIG. 1 (a) to 1 (c) are schematic views showing one embodiment of a honeycomb structure according to the present invention.
- FIG. 1 (a) is a schematic perspective view of a honeycomb segment
- FIG. 1 (b) is a honeycomb
- FIG. 1 (c) is a schematic plan view of a honeycomb structure.
- FIG. 2 is a schematic plan view showing another embodiment of the honeycomb structure according to the present invention.
- FIG. 3 is a schematic plan view showing still another embodiment of the honeycomb segment according to the present invention.
- FIG. 4 is an electron micrograph showing a state in which the underlayer has penetrated into the pores of the honeycomb segment.
- a section means a section perpendicular to the longitudinal direction (X-axis direction) of the flow hole unless otherwise specified.
- the honeycomb structure 1 of the present invention has a large number of flow holes 3 penetrating in the X-axis direction partitioned by porous partition walls 2 as shown in, for example, FIGS. 1 (a), (b) and (c).
- a plurality of honeycomb segments 1.2 each having a honeycomb structure having a uniform structure are integrated via a bonding layer 8.
- the bonding layer 8 includes one or more bonding layers 10 and one or more layers interposed between the honeycomb segment 12 and the bonding layer 10 as shown in FIG. 2, for example. And underground formation 9. With this configuration, the underlying layer firmly adheres the honeycomb segments to the adhesive layer, enabling stronger adhesion between the honeycomb segments and the stress at the interface between the honeycomb segments 12 and the bonding layer 8. Can be suppressed.
- the underlayer 9 is preferably formed directly on the side wall 7 of the honeycomb segment, and is further preferably formed on both of the side walls 7 of the two honeycomb segments to be joined.
- the side wall 7 of the honeycomb segment is porous, if a structure in which a part of the underlying layer penetrates into the pores is employed, the adhesion between the honeycomb segment and the underlying layer is further enhanced by the so-called anchor effect. It is preferable.
- honeycomb structure of the present invention as shown in FIG. 3, it is preferable that two or more base layers 9a and 9b are interposed between the honeycomb segment 12 and the bonding layer 10. In this case, a part of the underlying layer 9a formed directly on the honeycomb segments The structure preferably penetrates into the pores of the cement.
- the viscosity of the underlayer which is a raw material of the underlayer.
- the solid component serving as the underlayer easily penetrates into the pores of the side wall 7.
- the bonding layer requires a certain thickness, and the bonding agent for forming the bonding layer is relatively high in viscosity in order to facilitate handling.
- the base layer 9 is interposed between the honeycomb segment 12 and the adhesive layer 10, and a low-viscosity base material is applied thinly, and a high-viscosity adhesive is applied on the base material, thereby providing sufficient
- the thickness of the bonding layer and the improvement of the adhesive strength due to the anchor effect of the formation can be achieved at the same time.
- the viscosity of the adhesive is preferably 150 to 800 P (poise), more preferably 200 to 600 P, and even more preferably 250 to 500 P. Most preferred.
- the viscosity of the base material is preferably from 0.01 to 150 P, more preferably from 0.02 to 50 P, and most preferably from 0.05 to 10 P. As shown in FIG.
- the viscosity of the base material forming the base layer 9a is lower than the viscosity of the adhesive forming the adhesive layer 10, but the viscosity of the base material forming the base layer 9a and the base forming the base layer 9b are preferable. It is further preferable that the viscosity is sequentially increased in the order of the viscosity of the agent and the viscosity of the adhesive forming the adhesive layer 10.
- the thermal expansion coefficient of the underlayer is Ut
- the thermal expansion coefficient of the honeycomb segment is Ht
- the thermal expansion coefficient of the adhesive layer is At, Ht ⁇ Ut ⁇ At or Ht ⁇ Ut
- the relationship is preferably t ⁇ At, and more preferably, Ht ⁇ Ut ⁇ At.
- the base layer 9 is bonded to the honeycomb segment 12. It functions to buffer the difference in the thermal expansion coefficient of the layer 10 and can suppress the generation of thermal stress at the interface between the bonding layer and the 82 cam segment. As shown in FIG.
- the underlayer 9 and the adhesive layer 10 are preferably composed mainly of ceramics, and one or more colloidal sols such as a silica sol or an alumina sol, silicon carbide, silicon nitride, cordierite, alumina, mullite, A ceramic selected from the group consisting of zirconia, zirconium phosphate, aluminum titanate, titania and combinations thereof; 6- ⁇ ] "-VIII 1 series metal, nickel series metal or metal
- inorganic powders such as Si and SiC, silica, mullite, alumina, silica-ceramic fiber such as alumina It is preferably formed from a raw material containing one or more inorganic fibers, one or more inorganic binders, etc.
- the raw materials further include methylcellulose, ethylcellulose, polyvinyl alcohol, and hydroxypropyl alcohol. It may contain an organic binder such as boxyl methylcellulose, etc. Colloidal sol is suitable for imparting adhesive strength, and inorganic powder is suitable for improving affinity with the honeycomb segment.
- the same inorganic powder as the main component of the segment is preferable, and the inorganic fiber is suitable as a reinforcing material that suitably imparts toughness to the bonding layer. is there.
- the components constituting the base layer and the adhesive layer include, for example, raw material components having different chemical compositions, crystal structures, and forms such as inorganic powders, inorganic fibers, and colloidal sols contained in the raw material base agent and the adhesive. It is a component formed respectively.
- the adhesive layer contains a component formed from two or more types of inorganic powders, it means at least one type of the component.
- this component is X
- the relationship between the content A of X, the content HX of component X in the honeycomb segment, and the content UX of component X in the underlayer is Hx ⁇ Ux ⁇ Ax or It is preferable that the relationship is H x ⁇ U x ⁇ A x.
- each content rate is a value represented by mass% with respect to the whole of each member.
- the honeycomb segments are made of metal Si and silicon carbide, and inorganic fiber or silicon carbide is used as the inorganic powder of the underlayer and the adhesive layer, the thermal expansion coefficient of the inorganic fiber and silicon carbide is Since it is small, the honeycomb segment has a larger thermal expansion coefficient when other components such as metal Si are included.
- the bonding layer preferably contains components such as colloidal sol and inorganic fibers in order to impart good adhesive strength and toughness.
- the content of the inorganic fiber F in the underlayer is U f
- the content of the inorganic fiber F in the adhesive layer is A f
- the content of the inorganic fiber F in the honeycomb segment is H f
- the honeycomb segment is
- the content of the component X of 9 a and 9 b is defined as U ax and U b, respectively. If X, it is sufficient that either Ua X or Ub X is in the range of Hx to Ax, but it is preferable that Hx ⁇ U ax ⁇ Ub x ⁇ Ax or Hx ⁇ Ua x ⁇ Ub x ⁇ Ax .
- the thickness of the adhesive layer 10 is not particularly limited, but if it is too thick, the pressure loss when the exhaust gas passes through the honeycomb structure becomes too large, and if it is too thin, the adhesive does not have an original adhesive function. In some cases, this is not preferable.
- a preferable thickness range of the adhesive layer 10 is 0.1 to 3.0 mm.
- the thickness of the underlayer 9 is not particularly limited, but if it is too thick, cracks are likely to occur, and if it is too thin, a so-called anchor effect cannot be obtained, which is not preferable.
- the preferred range of the thickness of the underlayer 9 is 10 to 500 m.
- the honeycomb segment 12 is mainly composed of silicon carbide, silicon nitride, cordierite, alumina, mullite, zirconia, zirconium phosphate, aluminum titanate, titania, or a combination thereof. It is preferable that the ceramics be composed of at least one ceramic selected from the group consisting of Fe-Cr-A1 metal, nickel-based metal or metal Si and SiC. Where the lord The component means a component which accounts for 80% by mass or more of the component and becomes a main crystal phase.
- the Si content defined by SiZ (Si + SiC) is 5 to 50% by mass. It is more preferable that the content be 10 to 40% by mass. If the content is less than 5% by mass, it is difficult to obtain the effect of adding Si, and if it exceeds 50% by mass, it is difficult to obtain the effects of heat resistance and high thermal conductivity characteristic of SiC.
- the adhesive 9 also includes one composed of one or both of the metal Si and SiC.
- the cell density of the honeycomb segments 12 (the number of the flow holes 3 per unit cross-sectional area) is not particularly limited, but if the cell density is too low, the geometric surface area becomes insufficient and if it is too large, The pressure loss is undesirably too large.
- the cell density is preferably between 0.9 and 310 cells Zcm 2 (6 to 2000 cells / in 2).
- the cross-sectional shape (cell shape) of the flow hole 3 is not particularly limited, and may be any shape such as a polygonal shape such as a triangle, a rectangle and a hexagon, a circle, an ellipse, and a corrugated shape.
- the shape is one of a triangle, a quadrangle, and a hexagon.
- the thickness of the partition 2 is not particularly limited. However, if the thickness of the partition 2 is too small, the strength as a honeycomb segment is insufficient, and if the thickness is too large, the pressure loss becomes too large, which is not preferable.
- the thickness of the partition 2 is preferably in the range of 50 to 200 / zm.
- the shape of the honeycomb segment 12 is not particularly limited and can be any shape.
- the basic shape is a quadrangular prism as shown in FIG.
- each of the honeycomb segments 12 may have a fan-shaped cross-sectional shape.
- the honeycomb structure 1 of the present invention there is no particular limitation on the cross-sectional shape of the honeycomb structure 1 of the present invention, and in addition to the circles shown in FIGS. 1 (a) and (b), elliptical shapes, oval shapes, and the like, as well as the quadrangular shapes shown in FIG. It can take any shape such as a polygon such as and an amorphous shape.
- the honeycomb structure of the present invention When the honeycomb structure of the present invention is used as a catalyst carrier in an internal combustion engine, a boiler, a chemical reaction device, a reformer for a fuel cell, or the like, the honeycomb structure carries a metal having catalytic ability.
- the metal having catalytic activity include Pt, Pd, and Rh, and it is preferable that at least one of these metals is supported by the honeycomb structure.
- the honeycomb structure of the present invention when used as a filter for collecting and removing particulate matter contained in exhaust gas, such as DPF, the openings of the through holes 3 of the honeycomb structure are alternately formed. It is preferably plugged. Since the openings of the flow holes 3 are alternately plugged, the exhaust gas containing particulate matter passes through one end face of the honeycomb structure. It flows into the inside of the honeycomb structure 1 from the unrestricted flow holes 3, passes through the porous partition walls 2 having a filtering ability, and from the flow holes 3 in which the other end face side openings are not plugged. Is discharged. When passing through the partition, the particulate matter is captured by the partition.
- the honeycomb structure may carry a metal having a catalytic function as described above in order to promote the combustion.
- the honeycomb segment 12 is manufactured.
- the manufacturing process of the honeycomb segment 12 is not particularly limited, and a method of manufacturing a honeycomb segment having a honeycomb structure can be generally used.
- the honeycomb segment 12 can be manufactured by the following process.
- At least one ceramic selected from the group consisting of silicon carbide, silicon nitride, cordierite, alumina, mullite, zirconia, zirconium phosphate, aluminum titanate, titania, and a combination thereof, Fe—C r1 A1 metal, nickel-based metal or metal Si and SiC, etc., and a binder such as methylcellulose and hydroxypropoxylmethylcellulose, a surfactant, water, etc. are added to the plastic Make the soil.
- the kneaded material is extruded, for example, to form a honeycomb formed body having a large number of flow holes 3 penetrating in the axial direction partitioned by the partition walls 2. This is dried with, for example, microwaves and hot air, and then fired, whereby the honeycomb segment 12 as shown in FIG. 3 can be manufactured.
- the honeycomb segment 12 manufactured here can have the preferable shape described in the above description of the invention of the honeycomb structure.
- honeycomb segments 12 are manufactured, these honeycomb segments are joined to form a honeycomb structure.
- honeycomb structure may be manufactured by purchasing the honeycomb segments already manufactured and purchasing the honeycomb segments by the following steps.
- a base material is applied to at least one, and preferably both, of the side walls 7 to be joined in the two honeycomb segments 12 shown in FIG. 2, and at least one layer of adhesive is applied. And a step of bonding and integrating the honeycomb segments.
- the base material preferably contains a solid component and a liquid component, and more preferably is a slurry.
- the solid component of the adhesive refers to the component remaining in the finally formed adhesive layer, and does not include those that are removed by volatilization or the like in the process of forming the adhesive layer. Also included are those that are physically or physically changed unless removed.
- the solid component of the base material preferably one or more colloidal sols such as silica sol or alumina sol, silicon carbide, silicon nitride, cordierite, alumina, mullite, zirconia, zirconium phosphate, aluminum titanium —Ceramics selected from the group consisting of g, titania, and combinations thereof;
- F e One or two or more inorganic powders such as Cr-A1-based metals, nickel-based metals or metals Si and SiC It is preferably formed from a raw material containing one or more inorganic fibers such as ceramic fibers such as silica, mullite, alumina, and silica-alumina, and one or more inorganic binders by drying, heating, firing, or the like.
- the adhesive can be applied by, for example, a spraying method, application with a brush or a brush, or a dipping method.
- the base material two or more types of base materials are formed so as to form two or more base layers on one side wall side as shown in base layers 9a and 9b shown in FIG. It may be applied twice or more.
- the adhesive also preferably contains a solid component and a liquid component, and is more preferably in the form of a slurry.
- the solid components of the adhesive preferably include those selected from those exemplified as preferable components for the base material. There is no particular limitation on the method of applying the adhesive, and the adhesive can be applied in the same manner as the application of the base material.
- the adhesive is preferably applied after the base material has been applied.
- the application may be carried out after the application of the base material, followed by drying, heating, baking, etc., or after the application of the base material, particularly without drying, heating, baking, etc. May be.
- the base material may be applied directly to the other side wall 7. In this case, the order of applying the base material and the adhesive is not important.
- the viscosity of the base material is preferably lower than the viscosity of the adhesive.
- the viscosity of the adhesive is preferably 150 to 800 P (poise), more preferably 200 to 600 P, and further more preferably 250 to 500 P. Is most preferred.
- the viscosity of the base material is preferably from 0.01 to 150 P, more preferably from 0.02 to 50 P, and most preferably from 0.05 to 10 P. As shown in FIG.
- the viscosity of the base material for the base layer 9a formed directly on the side wall 7 is reduced.
- the viscosity of the adhesive for the adhesive layer 10 is preferably lower than that of the adhesive for the adhesive layer 10, but the viscosity of the adhesive for the foundation layer 9a is the lowest, and the viscosity is sequentially increased. It is even more preferred to have the highest viscosity.
- the content of certain component Y constituting the solid component in the base material is U y
- the content of component Y in the adhesive is A y
- the content of component Y in the honeycomb segment is H y
- the contents Uy and Ay mean the contents with respect to the entire solid component.
- the honeycomb structures 1 are formed by bonding and integrating the respective honeycomb segments. After that, depending on the type of the adhesive, a stronger adhesive force can be obtained by further drying and / or firing.
- the openings of the flow holes 3 are alternately plugged with a sealing material. It is preferable to plug the plugs alternately in a staggered pattern.
- the plugging with the sealing material can be performed by masking the flow holes that are not plugged, applying the raw material in the form of a slurry, applying the raw material to the opening end face of the honeycomb segment, and drying and firing. In this case, it is preferable that the plugging is performed during the above-described honeycomb segment manufacturing process, that is, immediately after forming the honeycomb segment and before firing, since only one firing step is required. However, plugging may be performed after firing. It may be performed anywhere after molding.
- the material of the plugging material to be used can be suitably selected from the group listed as preferable raw materials for the honeycomb segment, but it is preferable to use the same raw material as the raw material used for the honeycomb segment.
- a catalyst may be supported on the honeycomb structure.
- This method may be a method generally performed by those skilled in the art.
- the catalyst can be supported by wash-coating a catalyst slurry, followed by drying and calcining. This step may be performed at any time after forming the honeycomb segments.
- Table 1 The components shown in Table 1 were mixed in the proportions shown in Table 1 to prepare adhesives and base materials 1 and 2, and the viscosities of each were measured by Piscotes Yuichi. Table 1 shows the viscosities and solid component contents of the adhesives and the base materials 1 and 2.
- honeycomb segments Two obtained honeycomb segments were prepared, and the base material 1 was applied to the side walls 7 of the two honeycomb segments, respectively. Next, an adhesive was applied on the base material 1 of one of the honeycomb segments. Next, the two honeycomb segments were bonded and integrated, and then heated and dried at about 200 to obtain a honeycomb structure.
- the base material 2 was applied in the same manner as the base material 1 of Example 1, and then the honeycomb composition was applied in the same manner as in Example 1 except that the base material 1 was applied on the base material 2 of the two honeycomb segments. A structure was obtained.
- a honeycomb structure was obtained in the same manner as in Example 1, except that the base material 1 was not applied.
- the honeycomb structure obtained in Example 1 has a thermal expansion coefficient of Ht>Ut> At, and a relation of Hx>Ux> Ax where Sic is a component X. If the ceramic fiber is the component X, the relationship is Hx ⁇ Ux ⁇ Ax.
- Table 3 the honeycomb structures obtained in Examples 1 and 2 did not peel off at the bonded portion, showed higher bonding strength and higher bonding compared to the honeycomb structure obtained in Comparative Example 1. The area ratio is shown. Industrial applicability
- the honeycomb structure of the present invention has one or more base layers and one or more adhesive layers between the honeycomb segments, and thus has a high adhesive strength, and generates defects such as cracks in the bonded part.
- the resulting honeycomb structure is difficult to perform. Therefore, it can be suitably used for a catalyst carrier utilizing a catalytic action, such as an internal combustion engine, a boiler, a chemical reaction device, and a reformer for a fuel cell, or a filter for collecting particulates in exhaust gas.
- the eighty-cam structure having the above-described effects was easily produced by the manufacturing method of the present invention. Therefore, the manufacturing method of the present invention can suitably manufacture the honeycomb filter as described above.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Structural Engineering (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Combustion & Propulsion (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Biomedical Technology (AREA)
- Analytical Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Filtering Materials (AREA)
- Catalysts (AREA)
- Filtering Of Dispersed Particles In Gases (AREA)
- Ceramic Products (AREA)
- Exhaust Gas After Treatment (AREA)
- Laminated Bodies (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02783763A EP1452511B1 (en) | 2001-12-06 | 2002-12-04 | Method for manufacturing a honeycomb structure body |
AU2002349404A AU2002349404A1 (en) | 2001-12-06 | 2002-12-04 | Honeycomb structure body and method for manufacturing the same |
US10/496,837 US7138168B2 (en) | 2001-12-06 | 2002-12-04 | Honeycomb structure body and method for manufacturing the same |
JP2003549268A JP4394448B2 (ja) | 2001-12-06 | 2002-12-04 | ハニカム構造体及びその製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-372907 | 2001-12-06 | ||
JP2001372907 | 2001-12-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003048072A1 true WO2003048072A1 (fr) | 2003-06-12 |
Family
ID=19181715
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/012696 WO2003048072A1 (fr) | 2001-12-06 | 2002-12-04 | Corps de structure en nid d'abeilles et son procede de fabrication |
Country Status (6)
Country | Link |
---|---|
US (1) | US7138168B2 (ja) |
EP (1) | EP1452511B1 (ja) |
JP (1) | JP4394448B2 (ja) |
AU (1) | AU2002349404A1 (ja) |
PL (1) | PL205740B1 (ja) |
WO (1) | WO2003048072A1 (ja) |
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WO2005071234A1 (fr) * | 2003-12-24 | 2005-08-04 | Saint-Gobain Centre De Recherches Et D'etudes Europeen | Structure de filtration, notamment filtre a particules pour les gaz d'echappement d'un moteur a combustion interne et organe d'armature destine a une telle structure. |
FR2864577A1 (fr) * | 2003-12-24 | 2005-07-01 | Saint Gobain Ct Recherches | Structure de filtration, notamment filtre a particules pour les gaz d'echappement d'un moteur a combustion interne et organe d'armature destine a une telle structure |
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JPWO2006103786A1 (ja) * | 2005-03-28 | 2008-09-04 | イビデン株式会社 | ハニカム構造体およびシール材 |
WO2006103786A1 (ja) * | 2005-03-28 | 2006-10-05 | Ibiden Co., Ltd. | ハニカム構造体およびシール材 |
CN100453511C (zh) * | 2005-03-28 | 2009-01-21 | 揖斐电株式会社 | 蜂窝结构体及密封材料 |
JP4753782B2 (ja) * | 2005-06-24 | 2011-08-24 | イビデン株式会社 | ハニカム構造体 |
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JP4753781B2 (ja) * | 2005-06-24 | 2011-08-24 | イビデン株式会社 | ハニカム構造体 |
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US8039086B2 (en) | 2005-12-14 | 2011-10-18 | Ngk Insulators, Ltd. | Bonding material, process for producing the same, and honeycomb structure made with the same |
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WO2007069674A1 (ja) | 2005-12-14 | 2007-06-21 | Ngk Insulators, Ltd. | 接合材とその製造方法、及びそれを用いたハニカム構造体 |
US8241725B2 (en) | 2006-02-10 | 2012-08-14 | Ngk Insulators, Ltd. | Honeycomb segment, honeycomb structure and process for producing the same |
US7964263B2 (en) | 2006-03-30 | 2011-06-21 | Ngk Insulators, Ltd. | Bonded element, honeycomb segment bonded element, and honeycomb structure using the same |
WO2007116665A1 (ja) * | 2006-03-30 | 2007-10-18 | Ngk Insulators, Ltd. | 接合体、ハニカムセグメント接合体、及びそれを用いたハニカム構造体 |
KR100818570B1 (ko) * | 2006-04-27 | 2008-04-03 | 이비덴 가부시키가이샤 | 허니컴 구조체 및 시일재 |
US7901755B2 (en) | 2006-11-16 | 2011-03-08 | Ibiden Co., Ltd. | Honeycomb structure and method for manufacturing the same |
WO2008059576A1 (fr) * | 2006-11-16 | 2008-05-22 | Ibiden Co., Ltd. | Corps structural en nid d'abeilles et procédé de fabrication de celui-ci |
US8092624B2 (en) | 2006-12-07 | 2012-01-10 | Ngk Insulators, Ltd. | Bonding material composition and method for manufacturing the same, and joined body and method for manufacturing the same |
US7981228B2 (en) | 2006-12-25 | 2011-07-19 | Ngk Insulators, Ltd. | Joined body and method for manufacturing the same |
WO2009157504A1 (ja) * | 2008-06-25 | 2009-12-30 | 日本碍子株式会社 | ハニカム構造体 |
JP5649964B2 (ja) * | 2008-06-25 | 2015-01-07 | 日本碍子株式会社 | ハニカム構造体 |
WO2009157503A1 (ja) * | 2008-06-25 | 2009-12-30 | 日本碍子株式会社 | ハニカム構造体 |
JP2012215102A (ja) * | 2011-03-31 | 2012-11-08 | Kubota Corp | ディーゼルパティキュレートフィルタおよび排ガス浄化装置 |
JP2015166573A (ja) * | 2014-03-04 | 2015-09-24 | 日本碍子株式会社 | ハニカム構造体 |
Also Published As
Publication number | Publication date |
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EP1452511A4 (en) | 2006-05-24 |
US7138168B2 (en) | 2006-11-21 |
EP1452511B1 (en) | 2013-03-13 |
PL374058A1 (en) | 2005-09-19 |
JPWO2003048072A1 (ja) | 2005-04-14 |
AU2002349404A1 (en) | 2003-06-17 |
PL205740B1 (pl) | 2010-05-31 |
EP1452511A1 (en) | 2004-09-01 |
JP4394448B2 (ja) | 2010-01-06 |
US20050079975A1 (en) | 2005-04-14 |
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