WO2003046904A1 - Procede et dispositif de matriçage et de pressage de supports d'information - Google Patents
Procede et dispositif de matriçage et de pressage de supports d'information Download PDFInfo
- Publication number
- WO2003046904A1 WO2003046904A1 PCT/JP2002/012569 JP0212569W WO03046904A1 WO 2003046904 A1 WO2003046904 A1 WO 2003046904A1 JP 0212569 W JP0212569 W JP 0212569W WO 03046904 A1 WO03046904 A1 WO 03046904A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- information medium
- stamper
- master
- manufacturing
- etched
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
- G11B7/261—Preparing a master, e.g. exposing photoresist, electroforming
Definitions
- Method of manufacturing master for information medium Method of manufacturing stamper for information medium, apparatus for manufacturing master for information medium, and apparatus for manufacturing stamper for information medium
- the present invention relates to a method and apparatus for manufacturing an information medium master for forming a concavo-convex pattern by dry etching, and a method and manufacturing method for manufacturing an information medium stamper using the information medium master. It is related to equipment. Background art
- an optical recording medium (CD, DVD, etc.) as an information medium
- a concave / convex pattern is formed to transfer guide grooves and pits for tracking control to the disk base material for the optical recording medium.
- Manufacturing stampers for optical recording media (hereinafter also referred to as “stampers”).
- an optical recording medium master (hereinafter, also referred to as “master”) having a concavo-convex pattern having substantially the same shape as the disk base material is prepared. Transfer to stamper forming material.
- the master is manufactured by forming a photoresist layer on a base material as a support member, irradiating an exposure beam to form a latent image, and developing the latent image.
- a method for producing a master (photoresist master) in which a concavo-convex pattern is formed on a substrate has been conventionally known.
- methods for manufacturing various masters have been developed to reduce the pitch / pit size of guide grooves.
- a concave-convex pattern is formed by forming a concave portion on a glass master (10, a member corresponding to the above-described base material) by dry etching.
- a method for manufacturing a glass master (20, the master for an optical recording medium described above), and a metal stamper (15, A manufacturing method for manufacturing a recording medium stamper is disclosed. In this manufacturing method
- a photoresist (11) is applied on a glass master, and then an exposure beam is irradiated to record an uneven pattern by exposure.
- the photoresist is developed to expose a part of the surface of the glass master (the portion where the exposure was recorded).
- a concave portion is formed in the glass master by performing dry etching using the photoresist on the glass master as a mask.
- the photoresist remaining on the glass master is removed.
- a conductive film (13) is formed on the surface of the manufactured glass master, and a metal material is deposited using the conductive film as an electrode.
- a metal stamper is formed on the glass mass. Thereafter, the metal stamper is peeled off from the glass master, and the concave / convex pattern of the metal stamper is transferred to, for example, a resin material, thereby forming a disk base material.
- Japanese Unexamined Patent Application Publication No. 2000-420267 discloses a method of manufacturing a master having an uneven pattern formed by dry-etching an underlayer film (2) formed on the surface of a glass substrate (1).
- a method and a method of manufacturing an optical disk stamper (6) using the master are disclosed.
- this manufacturing method first, an underlayer film is formed by sputtering Cr on the surface of a glass substrate.
- a thin film (3) is formed by spin-coating a photoresist on the lower film, and the thin film is irradiated with an exposure beam to expose and record an uneven pattern, and then developed.
- a recess is formed in the lower layer film by performing dry etching using the photoresist on the lower layer film as a mask. Subsequently, the photoresist remaining on the lower layer film is removed. As a result, an original master on which a concavo-convex pattern is formed (an original master composed of a laminate of a glass substrate and a lower film) is manufactured. Next, a metal material layer is formed on the surface of the manufactured master using a Ni sputter electrode. As a result, an optical disk stamper made of a metal material is formed on the master. Thereafter, the optical disk stamper is peeled off from the master, and the concave and convex pattern of the optical disk stamper is transferred to, for example, a resin material. A disk substrate is formed. Disclosure of the invention
- a concave / convex pattern is formed by forming a concave portion on a glass master (synthetic quartz master) by dry etching.
- synthetic quartz master has a generally low etching rate (a thickness that can be etched per a predetermined time when an etching beam having a predetermined power is used).
- the photoresist since the photoresist generally has a higher etching rate than the synthetic quartz master, it disappears before the synthetic quartz master is etched to a desired depth. Therefore, it is necessary to form the photoresist to a certain thickness or more. In this case, when the photoresist is formed to a sufficient thickness, a large amount of the photoresist material is consumed, which makes it difficult to reduce the manufacturing cost of the glass master.
- a concave / convex pattern is formed by dry-etching a lower layer film in which Cr is sputtered on the surface of a glass substrate to form a concave portion. Is formed.
- Cr that is softer than the synthetic quartz master is etched, it is possible to form the recess in a shorter time than the above-described manufacturing method in which the recess is formed in the synthetic quartz master.
- sputtering of Cr requires an expensive large-scale vacuum film forming apparatus, there is a problem that it is difficult to reduce the manufacturing cost of an information medium master due to this. .
- the gazette discloses that rebaking is performed to increase the strength of the photoresist after development. It is unknown whether or not it is possible to reduce the etching rate of the photoresist by the re-baking process because it is not specifically described. However, even if the above-mentioned inconvenience in which the photoresist is etched in a relatively short time can be solved by the re-baking process, unnecessary work steps increase by the re-baking process. There is a problem that it is difficult to reduce the manufacturing cost of the information medium master.
- the present invention has been made to solve the above-described problems, and is intended to manufacture an information medium master and an information medium stamper on which a sharp uneven pattern is formed without causing a rise in manufacturing cost.
- Method and apparatus for manufacturing an information medium master And a method and apparatus for manufacturing a stamper for an information medium.
- the method of manufacturing an information medium master includes forming a photoresist layer on an object to be etched, irradiating the photoresist layer with an exposure beam to form a latent image, and then developing the photoresist. Exposing a part of the object to be etched from the layer, dry-etching the object to be etched using the photoresist layer as a mask to form a concave portion in the object to be etched, and leaving a recess on the object to be etched; A method for manufacturing an information medium master on which an uneven pattern is formed by removing the remaining photoresist layer, wherein the etching target is an etching rate for the information medium.
- an etched body made of a resin material having a selectivity of an etching rate of a photoresist layer of 0.5 or more is used.
- the “selection ratio of the etching rate of the photoresist layer to the etching rate of the object to be etched” refers to a value obtained by dividing the etching rate of the object to be etched by the etching rate of the photoresist layer.
- an apparatus for manufacturing a master for an information medium comprises: a resist layer forming apparatus for forming a photoresist layer on an object to be etched; and an irradiation beam for irradiating the photoresist layer with an exposure beam to form a latent image.
- An exposure device a developing device that develops the photoresist layer on which the latent image is formed to expose a part of the object to be etched, and the etching device that uses the developed photoresist layer as a mask.
- a desired etching rate is obtained by forming the etching target from a resin material having a selectivity of the etching rate of the photoresist layer to the etching rate of the etching target of 0.5 or more.
- the photoresist layer as a mask can be left even after the formation of the recess having the depth. For this reason, it is possible to effectively avoid the disadvantage that the groove shape of the concave portion is rounded or the depth thereof is reduced due to the disappearance of the photoresist layer before the formation of the concave portion is completed.
- an information medium stamper using the information medium master it is possible to form an information medium stamper capable of manufacturing a disk base material that enables accurate tracking.
- the production cost of the master for the information medium is reduced. Can be sufficiently reduced.
- the object to be etched an object to be etched formed of a resin material having the selectivity of 1.0 or more and 3.0 or less is used.
- the resist layer forming apparatus may be configured such that the object to be etched is formed of a resin material having the selectivity of 1.0 or more and 3.0 or less. It is preferable to use an etched body.
- the photoresist layer as a mask can be more reliably left even after the formation of the concave portion having the desired depth, and the photoresist layer as the mask can be formed before the formation of the concave portion is completed.
- the inconvenience that the groove shape of the concave portion is rounded or the depth thereof becomes shallow due to the disappearance can be more effectively avoided.
- the object to be etched includes a beam absorbing material that absorbs the exposure beam or a beam anti-reflection material that prevents reflection of the exposure beam. It is preferable to use an object to be etched formed of a resin material.
- the resist layer forming apparatus may include, as the etching target, an etching target formed of a resin material including a beam absorbing material that absorbs the exposure beam or a beam antireflection material that prevents reflection of the exposure beam. It is preferred to use. As a result, multiple exposure of the photoresist layer can be effectively prevented. As a result, a sharp latent image (recess) can be formed at a narrow pitch. Therefore, by manufacturing the disk base material based on the stamper manufactured using the information medium master, the recording density of the recorded data can be sufficiently improved.
- the resist layer forming apparatus includes: a melamine resin as the body to be etched; and 4,4,1-bis (ethylamino) as the beam absorbing material. It is preferable to use an etched object formed of a mixture containing benzophenone.
- the object to be etched is formed in a layer on a base material, and the concave portion is formed in the object to be etched. In this case, it is preferable to form the object to be etched by spin coating the resin material on the base material.
- the etched body is formed by forming the etched body in a layer from the resin material on a base material. It is preferable to include a ring forming device. In this case, it is preferable that the etching target forming apparatus forms the etching target by spin coating the resin material on the base material.
- the base material formed of a material having the lower etching rate than the material to be etched is used, and the thickness of the concave portion to be formed is set to be the depth to be formed. It is preferable to form the concavo-convex pattern by forming the etched body and exposing a part of the base material from the etched body during the dry etching to form the concave portion.
- the object-to-be-etched forming apparatus may include, as the substrate, a substrate formed of a material having a lower etching rate than the object to be etched.
- the etching apparatus is used to form the body to be etched with a thickness that should be the depth of the recess to be formed, and the etching apparatus exposes a part of the base material from the body to be etched at the time of the dry etching. It is preferable to form the concave-convex pattern by forming a concave portion.
- the base material is formed of a material (quartz glass) having a lower etching rate than that of the light absorbing layer, and the light absorbing layer is formed to have a depth corresponding to the depth of the concave portion to be formed.
- a concave part with a desired depth can be easily formed by etching only until the surface of the base material is exposed from the light absorption layer during etching. can do.
- the concave portion is formed because the substrate having a low etching rate is not so etched.
- time management in the etching process becomes extremely easy.
- a method of manufacturing a stamper for an information medium according to the present invention is a method of manufacturing a stamper for an information recording medium using the master for an information medium manufactured according to the method for manufacturing a master for an information medium. Then, a stamper forming material is formed on the surface of the information medium master on which the uneven pattern is formed, and the etched body serving as the information medium master is removed from the stamper forming material.
- an information medium stamper manufacturing apparatus is an information recording medium stamper manufacturing apparatus that manufactures an information medium stamper using the information medium master manufactured by the information medium master manufacturing apparatus, A stamper-forming material forming apparatus for forming a stunner and a forming material on the surface of the information medium master on which the uneven pattern is formed; and forming the etched body as the information medium master from the stamper forming material. And a removing device for removing.
- a method of manufacturing a stamper for an information medium is a method of manufacturing a stamper for an information medium using the master for an information medium manufactured according to the method for manufacturing a master for an information medium.
- an apparatus for manufacturing an information medium stamper includes an information medium stamper for manufacturing an information medium stamper using the information medium master manufactured by the information medium master manufacturing apparatus.
- a stamper-shaped material forming apparatus for forming a stamper-forming material on a surface on which the uneven pattern is formed on the information medium master; and the information medium master from which the base material has been peeled off.
- a removing device for removing the etch target from the laminate with the stamper forming material.
- the information medium master is transferred to the stamper forming material to manufacture the information medium stamper. Since it is formed sharply, the concavo-convex pattern transferred to the information medium stamper can also be formed in a very sharp shape. Therefore, by manufacturing a disc base material for an information medium using the stamper for an information medium, a disc base material that enables accurate tracking can be formed.
- the information medium stamper for one manufacturing method according to the present invention it is preferable to remove said object to be etched by performing 0 2 Purazumaa Dzushingu.
- the resin material stuck to the information medium stamper can be reliably and easily removed.
- a metal material as the stamper forming material is deposited on the information medium master to manufacture the information medium stamper. This makes it possible to accurately transfer the concave / convex pattern of the master compared to a manufacturing method using a resin or the like as the stamper forming material.
- the method for manufacturing an information medium stamper according to the present invention includes the step of forming the concave and convex pattern of the master stamper by using the information medium stamper manufactured according to the method for manufacturing an information medium stamper as a master stamper.
- the first stamper for transferring the concavo-convex pattern onto the information medium by transferring is manufactured. This makes it possible to sequentially replace the used information medium stamper with a new information medium stamper when mass-producing the information medium disk base material, so that the guide groove has a sharper groove shape. Materials can be mass-produced.
- the present disclosure relates to the subject matter included in Japanese Patent Application No. 200-3656-612, filed on January 30, 2001, which is a Japanese patent application. All of the disclosures are expressly incorporated herein by reference. BRIEF DESCRIPTION OF THE FIGURES
- FIG. 1 is a sectional view of a master 1 according to an embodiment of the present invention.
- FIG. 2 is a cross-sectional view showing a state in which a light absorbing layer 12 is formed on a base material 11 in a manufacturing process of the master 1.
- FIG. 3 is a cross-sectional view showing a state where the photoresist layer 13 formed on the light absorbing layer 12 in the manufacturing process of the master 1 is irradiated with a laser beam L for exposure.
- FIG. 4 is a cross-sectional view showing a state where development of the photoresist layer 13 has been completed in the manufacturing process of the master 1.
- FIG. 5 is a cross-sectional view showing a state where etching of the light absorbing layer 12 has been completed in the manufacturing process of the master 1.
- FIG. 6 is a cross-sectional view of the stamper 20 according to the embodiment of the present invention.
- FIG. 7 is a cross-sectional view showing a state where an electroless nickel layer 21 is formed on the master 1 in a manufacturing process of the stamper 20.
- FIG. 8 is a cross-sectional view showing a state in which an electrolytic nickel layer 22 is formed on the electroless nickel layer 21 in the manufacturing process of the stamper 20.
- FIG. 9 is a cross-sectional view showing a state where the base material 11 has been peeled off in the manufacturing process of the stamper 20.
- FIG. 10 is a cross-sectional view showing a state in which the concave / convex pattern of the stamper 20 has been transferred to the resin R2 in the manufacturing process of the disk substrate 30.
- FIG. 11 is a cross-sectional view of a disk substrate 30 manufactured using the stamper 20.
- FIG. 12 is a diagram illustrating a process of manufacturing a mother board 40 by transferring the concave / convex pattern of the stamper 20 to a metal material.
- FIG. 13 is a cross-sectional view showing a state where the concave / convex pattern of the mother board 40 is transferred to the resin R2 in the manufacturing process of the disk base material 50.
- FIG. 14 is a cross-sectional view of a master 1A according to another embodiment of the present invention.
- FIG. 15 is a cross-sectional view showing a state in which a photo resist layer 13 formed on the light absorption layer 12 is irradiated with a laser beam L for exposure in a manufacturing process of the master 1 A.
- FIG. 16 is a cross-sectional view showing a state where the development of the photoresist layer 13 is completed in the manufacturing process of the master 1A.
- FIG. 17 is a configuration diagram of the master manufacturing apparatus 100 and the stamper manufacturing apparatus 200. BEST MODE FOR CARRYING OUT THE INVENTION
- the master 1 shown in FIG. 1 is used as a mold for manufacturing a stamper 20 (see FIG. 6) and the like.
- the light absorbing layer 12 is laminated on the base material 11 to form a flat plate as a whole. It has been.
- concave portions 2, 2 ′ forming a concave-convex pattern according to the present invention are spirally formed.
- the recesses 2, 2,... Correspond to the pitch of the guide grooves 30a (or the recesses for forming the guide grooves) in the disk base material 30 (or the mother board 40).
- the depth D corresponds to the depth of the guide groove 30a.
- the base material 11 is a support to which a resin R 1 (a resin to be the light absorbing layer 12; see FIG. 2) is applied as described later.
- the etching rate is about 60 nm / min. Is formed in a flat plate shape from quartz glass.
- the etching rate 1 is indicated by a value under the following etching conditions preferably used in the present invention, and the same applies to the following etching rate values.
- Etching gas CF 4, C 2 F 6 , C 3 F 8, CHF 3
- the substrate 11 used for manufacturing the master 1 is not limited to a glass substrate, and various substrates such as a metal substrate, a metalloid substrate, and a ceramic substrate can be used.
- a rate at which the etching rate of the substrate 11 is smaller than the etching rate of the light absorbing layer 12 (for example, 60 nm / (An etching rate of not more than 30 nmZ).
- the light absorbing layer 12 corresponds to a layer to be etched as an object to be etched in the present invention.
- a resin material having a cured etching rate of about 300 nm / min and a thickness T is used. It is formed in a layer so as to be about 15 Onm.
- the etching rate of the light absorbing layer 12 is not limited to the above value, but the etching rate of the base material 11 described above and the etching rate of the photoresist layer 13 (see FIG. 3) formed in a manufacturing process described later. It can be changed appropriately according to the requirements.
- the selectivity of the etching rate of the photoresist layer 13 to the etching rate of the light absorbing layer 12 is preferably 0.5 or more, and more preferably, the selectivity is 1.0 or more. Is preferred.
- the remarkable effect exhibited by the present invention can be sufficiently obtained as described later.
- the light absorbing layer 12 is formed of a material having an excessively high etching rate, so that it becomes difficult to control the time of the etching process. It tends to be difficult to form the depressions 2, 2 ⁇ ⁇ of depth.
- the light absorbing layer 12 is formed of a material having a low etching rate, there is a slight error in the etching time. Even if it occurs, the amount of etching due to this time error is small, so that the time management of the etching process becomes easy. As a result, even when the selectivity is larger than 3.0, the concave portions 2, 2,... Having a desired depth can be formed.
- the thickness of the light absorbing layer 12 is not particularly limited, but is formed to a thickness that can sufficiently absorb the laser beam L for exposure during the exposure of the photoresist layer 13. . More specifically, the light absorption layer 12 uses a material having an absorption coefficient k of at least 0.01, preferably at least 0.1 with respect to the laser beam L to sufficiently transmit the laser beam L for exposure. It is preferable to form it in a thickness that can be absorbed. In this case, when the thickness of the light absorbing layer 12 is not sufficient, the laser beam L cannot be sufficiently absorbed, and the photoresist layer 13 is subjected to multiple exposure, and the latent image tends to be destroyed.
- the thickness of the light-absorbing layer 12 is preferably set to 1 nm or more and 300 nm or less, and more preferably, 100 nm or more and 200 nm or less. .
- the degree of thermal decomposition of the photoresist layer 13 due to the heat storage of the light absorption layer 12 changes according to the irradiation power of the laser beam L to be irradiated. Therefore, when exposure is performed using the laser beam L having a relatively small power, the thickness of the light absorbing layer 12 can be set to more than 300 nm and not more than 500 nm.
- the etching rate of the light absorbing layer 12 is higher than the etching rate of the base material 11, as described above. It is preferable that the thickness T be equal to the depth D of the recess 2 to be formed later. Thus, as will be described later, only the dry etching is performed until the surface of the substrate 11 is exposed, and the desired depth D (that is, The concave portions 2, 2 ′ of the thickness T) of the light absorbing layer 12 can be formed.
- the light-absorbing layer 12 is an organic compound having a light-absorbing property with respect to the wavelength of the laser beam L irradiated at the time of exposure (corresponding to a beam-absorbing material in the present invention; hereinafter, also referred to as a light-absorbing agent).
- a photoinitiator, a dye, or a mixture of a photoinitiator and a dye is used.
- the photoinitiating aid is composed of an organic compound that absorbs light such as ultraviolet light.
- 4,4′-bis (getylamino) benzophenone hereinafter, also referred to as “benzophenone compound”
- a mixture with melamine resin (thermosetting resin) synthesized with formalin or the like is used as the resin material in the present invention.
- master manufacturing apparatus 100 an apparatus for manufacturing an information medium master according to the present invention (hereinafter, also referred to as “master manufacturing apparatus”) 100 will be described with reference to FIG.
- the master manufacturing apparatus 100 includes a light absorbing layer forming apparatus 101, a resist layer forming apparatus 102, an exposing apparatus 103, a developing apparatus 104, an etching apparatus 105, and a resist removing apparatus 106.
- the master 1 is manufactured by using the base material 1 1 .
- a benzophenone-based compound is melted in a melamine resin to form the light absorbing layer 12.
- resin Rl also referred to as “resin Rl”.
- the produced resin R1 is stored in the light absorbing layer forming device 101.
- an ultraviolet curable resin can be used instead of the melamine resin.
- various additives such as an adhesion aid, a light absorbing agent, and a surfactant may be added to prepare a coating solution.
- an adhesion aid such as an adhesion aid, a light absorbing agent, and a surfactant
- a compound obtained by mixing various light absorbing materials with a thermosetting resin or a photocurable resin can also be used.
- the light absorption layer forming apparatus 101 first flattens the surface. After forming a coupling agent layer (not shown) on the polished substrate 11, as shown in FIG. 2, a resin R 1 is applied on the substrate 11 in a layer by spin coating. Next, the light-absorbing-layer forming apparatus 101 subjects the base material 11 in this state to a heat treatment at 150 ° C. to 250 ° C., for example, about 200 ° C., thereby curing the resin R 1. Let it. When an ultraviolet curable resin is used during the preparation of the coating solution, the coating film is cured by irradiating the coating solution with ultraviolet rays for curing. Thereby, the light absorption layer 12 is formed on the base material 11.
- the resist layer forming apparatus 102 spin-coats a photoresist on the light absorbing layer 12 so as to have a thickness of about 30 nm, and then dries to evaporate the residual solvent.
- a photoresist layer 13 is formed on the light absorption layer 12.
- the photoresist layer 13 functions as a mask when the light absorption layer 12 is dry-etched later, and is made of a photosensitive material having a dried etching rate of about 20 Onm / min. Therefore, the selectivity of the etching rate of the photoresist layer 13 to the etching rate of the resin R 1 (in this case, about 300 nm / min) is 1.5.
- a photoresist DVR100 manufactured by Zeon Corporation
- the photosensitive material is used as an example of the photosensitive material.
- the exposure apparatus 103 moves a part where the concave portions 2, 2 'are to be formed (a part where the guide groove 30a of the disk base 30 is to be formed) to a numerical aperture (NA), for example. through the lens of 0.90, a wavelength (e) laser 351 nm of Pas evening for-learning one beam L (exposure beam. as an example, when sliced in the form of a peak intensity (1 / theta 2) (A laser beam with a spot diameter of 0.32 ⁇ m).
- NA numerical aperture
- the light absorption layer 12 is formed between the base material 11 and the photoresist layer 13, the light was emitted from the exposure device 1 ⁇ 3 and transmitted through the photoresist layer 13 (a latent image was formed).
- Most of the laser beam L is absorbed by the light absorbing layer 12 without reaching the substrate 11.
- a small amount of the laser beam L that reaches the substrate 11 and is reflected without being completely absorbed by the light absorbing layer 12 is absorbed by the light absorbing layer 12 without reaching the photoresist layer 13. . Therefore, reflection by the substrate 11 is prevented, and multiple exposure of the photoresist layer 13 is prevented, so that a narrow (narrow) pitch and a sharp latent image are formed.
- the developing device 104 develops the photoresist layer 13 in this state, so that the irradiated portion of the laser beam L is removed to form the concave portions 3, 3 'as shown in FIG.
- the surface of the light absorbing layer 12 becomes the bottom surface 3 a of the concave portion 3.
- the latent image formed when the laser beam L is irradiated is very sharp, the concave portions 3, 3 'formed by development are also formed sharply.
- the etching apparatus 105 uses the photoresist layer 13 in which the recesses 3, 3,... Are formed as a mask to form CF 4 , C 2 F 6 , C 3 F 8 , CHF 3 , mixed gas or these additive gas (0 2, Ar, ⁇ 2 ) the added gas, by the this performing rear click Dib ion etching using as an etching gas, as shown in FIG. 5, the light absorbing layer 12
- the recesses 2, 2 ⁇ ⁇ are formed in the recess.
- the thickness ⁇ of the light absorbing layer 12 is defined in accordance with the depth D of the concave portion 2, and the etching rate of the substrate 11 is much smaller than the etching rate of the light absorbing layer 12 (in this case, By using a quartz glass flat plate of about 60 nm / minute, during etching, the surface of the base material 11 becomes the surface of the base material 11 until the surface of the base material 11 is exposed from the light absorbing layer 12 during etching.
- the concave portions 2, 2 'having a desired depth D can be formed. This place In this case, even if the etching time is slightly too long, the base 11 having a low etching rate is not so etched, so that the recess 2 is prevented from being formed excessively deeper than the depth D. Therefore, time management of the etching process becomes very easy.
- the groove shape of the concave portions 2 and 2 ′ ′ is rounded or deep due to the disappearance of the photoresist layer 13 as a mask before the formation of the concave portions 2 and 2 ′.
- the inconvenience of D becoming shallow can be effectively avoided.
- the resist removing device 106 dipped the laminate of the etched substrate 11, the light absorbing layer 12, and the photoresist layer 13 into a resist stripping solution to form the light absorbing layer 12.
- the remaining photoresist layer 13 is removed.
- the master 1 is manufactured as shown in FIG.
- the stamper 20 shown in FIG. 6 is a mold for injection molding of a disk base material 30 (see FIG. 11) for an optical recording medium and for manufacturing a mother board 40 (see FIG. 12). It is manufactured using the master 1 manufactured according to the manufacturing method described above.
- the stamper 20 is configured by laminating an electrolytic nickel layer 22 on an electroless nickel layer 21 (conductive layer), and is formed in a flat plate as a whole. Also, on the underside of the stamper 20,
- the pitch between the adjacent convex portions 20a, 20a is, for example, 0.32 according to the pitch at which the guide grooves 30a are formed in the disk substrate 30. ⁇ M.
- stamp manufacturing apparatus an apparatus 200 for manufacturing a stamper for an information medium (hereinafter, also referred to as “stamper manufacturing apparatus”) 200 according to the present invention will be described with reference to FIG.
- the stamper manufacturing apparatus 200 includes a conductive layer applying apparatus 201, a stamper forming material forming apparatus 202, and a removing apparatus 203, and is configured to be able to manufacture a stamper 200 using the master 1. ing.
- the conductive layer applying device 201 firstly uses, for example, electroless plating (deposition) to form a metal material along the concavo-convex pattern of the master 1 as shown in FIG. Then, an electroless nickel layer 21 (conductive layer) made of nickel is formed. Thereby, the surface of the master 1 (the surface of the base material 11 and the surface of the light absorbing layer 12) becomes conductive.
- the material for forming the layer (conductive layer) for imparting conductivity to the surface of the master 1 is not limited to nickel, and various metal materials can be used.
- the method of forming the conductive layer is not limited to the electroless plating method, and various metal material layers (for example, a nickel layer) are formed by various film forming methods such as an evaporation method and a sputtering method. Is also good.
- the stamper forming material forming apparatus 202 performs electroplating treatment (by deposition) using the electroless nickel layer 21 as an electrode, thereby forming an electroless nickel layer as shown in FIG.
- An electrolytic nickel layer 22 is formed (laminated) on the layer 21.
- the electrolytic nickel layer 22 formed by the stamper-forming material forming device 202 is the stamper-forming material of the present invention, and is a laminate of the electroless nickel layer 21 and the electrolytic nickel layer 22 ( Hereinafter, also referred to as “stamper-side laminate”) will constitute the stamper 20 later.
- the substrate 11 is peeled from the master 1 on which the stamper-side laminate is laminated by hand or by a dedicated peeling device (not shown). Base material 1 1
- the light absorbing layer 12 is removed. Specifically, removing the removal device 2 0 3, by performing 0 2 plasma mediation Thing to the plane peeling the substrate 1 1, the light absorbing layer 1 2 is stuck on one side laminate stamper I do.
- the concave portions 2, 2 'of the master 1 are transferred to the metal material (the electroless nickel layer 21 and the electrolytic nickel layer 22), and the convex portions 20a, 20a are transferred.
- a stamper 20 is produced.
- the stamper 20 forms an uneven pattern by transferring the uneven pattern to a metal material based on the master 1 described above. Therefore, since the concave / convex pattern of the original master 1 is sharply formed as described above, the concave / convex pattern transferred to the stamper 20 is also formed in a very sharp shape. Therefore, as will be described later, by manufacturing a disk base material for an optical recording medium using the stamper 20, it becomes possible to form a disk base material that enables accurate tracking.
- the resin R 2 is injected into a mold in which the stamper 20 is set, and the The substrate 30 is injection molded.
- the stamper 20 are transferred to the resin R 2, whereby the guide grooves 30 a, 30 a-a are formed.
- a disk substrate 30 is produced.
- a transfer device 204 is added to the stamper-manufacturing device 200 as shown in FIG.
- a plurality of child stampers (an example of a first stamper in the present invention) It is preferable that A,... Can be manufactured.
- the transfer device 204 first uses the stamper 20 as a master stamper, and transfers the uneven pattern to, for example, a metal material to produce a mother board 40. I do. Next, the transfer device 204 transfers the concavo-convex pattern of the mother board 40 to a plurality of child stampers. 1. Make A, A- ⁇ . When manufacturing the disc base material 30, the child stampers A and A are used. Thus, the child stamper A can be sequentially replaced with a new child stamper A before the child stamper A becomes worn, so that the disk base 30 can be mass-produced.
- the mother board 40 described above can be used as a stamper (another example of the first stamper in the present invention) depending on the application.
- the mother board 40 is used as a stamper, and the resin R2 is injected into a mold in which the stamper is set.
- the disk base 50 having the concave / convex pattern reversed with respect to the disk base 30 is injection-molded.
- the method of manufacturing the disk base 50 using the mother board 40 as a stamper is effective in manufacturing a disk base for a high-density optical recording medium, which has been studied recently. Can be applied.
- the blue laser beam is used as one laser beam for reproduction and one laser beam for recording, it is necessary to bring the peak close to the recording layer during recording and reproduction. Therefore, the laser beam is incident in the opposite direction to the existing optical recording medium, and the laser beam is incident from the side of the light transmission layer that is thinner than the disc base. It is necessary to manufacture an inverted disk substrate. For this reason, a disc base material for a high-density optical recording medium can be easily manufactured by using, as a stamper, the mother board 40 in which the concavo-convex pattern is inverted with respect to the stamper 20.
- the photoresist layer 13 with respect to the etching rate (300 nm / sec) of the light absorbing layer 12 is used.
- the light absorbing layer 12 is formed of a resin material (resin R 1) having an etching rate (200 nm / sec) selectivity of 1.0 or more and 3.0 or less (1.5 in this example).
- the stamper 20 that can manufacture a disk base material that enables accurate tracking.
- a resin material (light absorbing layer 12) having an etching rate higher than that of the synthetic quartz master as an object to be etched it is possible to form the concave portions 2, 2, with a desired depth D in a short time.
- the production cost of the master 1 can be sufficiently reduced.
- the master 1 can be manufactured safely and easily because there is no need to use a chlorine-based etching gas.
- the light absorbing layer 12 was formed by using a mixture containing melamine resin and 4,4,1-bis (getylamino) benzophenone as a resin material.
- a mixture containing melamine resin and 4,4,1-bis (getylamino) benzophenone as a resin material.
- the light absorbing layer 12 is formed by spin-coating the resin R 1 (resin material) on the base material 11 as a support member.
- R 1 resin material
- the substrate 11 is formed of a material (quartz glass) having a lower etching rate than the light absorbing layer 12, and the depth of the recesses 2, 2 ⁇
- a material quartz glass having a lower etching rate than the light absorbing layer 12, and the depth of the recesses 2, 2 ⁇
- the concave and convex pattern of master 1 is formed by using a stamper forming material (electroless nickel layer 21 and electrolytic nickel layer 22). Since the stamper 20 is manufactured by transferring the stamper 20 to the stamper 20, the uneven pattern of the master 1 can be formed very sharply. Therefore, the uneven pattern transferred to the stamper 20 is also formed into a very sharp shape. Can be achieved. Therefore, by manufacturing a disk base material for an optical recording medium using this stamper 20, a disk base material capable of accurate tracking can be obtained. Can be formed. Furthermore, according to the stamper one 2 0 manufacturing method of, 0 2 plasma mediation sequencing the performed by removing the light-absorbing layer 1 2, a light absorbing layer 1 2 stuck to the stamper 2 0 reliably and easily Can be removed.
- a stamper forming material electroless nickel layer 21 and electrolytic nickel layer 22
- the convex portions 20a and 20a are provided.
- the stamper 20 formed sharply with a narrow pitch is used as a master tamper to transfer the concave / convex pattern to produce the mother board 40, so that each concave part (convex part) of the mother board 40 is manufactured.
- the recesses formed in the motherboard 40 can be sharply formed by the 20a and 20a- '. Therefore, by manufacturing a plurality of stampers (child stampers) using the mother board 40, it is possible to sequentially replace the stampers with new stampers, so that the disc base material 30 having a sharp guide groove is formed.
- a master manufacturing method including a manufacturing process of a light absorbing layer 12 as an object to be etched, and a master manufacturing apparatus 100 including a light absorbing layer forming apparatus 101 are exemplified.
- the master can be manufactured without the manufacturing process of the light absorbing layer 12, and the light absorbing layer 12 can be manufactured.
- the master production apparatus 100 can be configured by omitting the layer forming apparatus 101
- a master 1 in which a light absorbing layer 12 is formed on a quartz glass plate (base 11) as a base (support) in the present invention will be described as an example.
- the method of manufacturing the master for an optical recording medium according to the present invention is not limited to this.
- a master for an optical recording medium can be manufactured by forming a concave portion in the etching body. This In manufacturing the master 1 A, first, a flat light absorbing layer 12 (resin plate) is formed by, for example, the resin R 1 (resin material in the present invention) used in manufacturing the master 1.
- a photoresist layer 13 is formed on the light absorption layer 12.
- the photoresist layer 13 is irradiated with a laser beam L and then developed, so that concave portions 3, 3... Are formed in the photoresist layer 13 as shown in FIG.
- dry etching is performed for a predetermined time using the photoresist layer 13 as a mask, and then the photoresist layer 13 is removed.
- FIG. Are formed.
- master 1A is completed.
- the concavo-convex pattern in the present invention is not limited to the spiral concavo-convex pattern illustrated in the embodiment of the present invention.
- a concavo-convex pattern or a concavo-convex pattern of various other shapes may be used.
- the present invention is not limited to the manufacture of a stamper for forming a guide groove and the manufacture of a master for manufacturing the stamper.
- the present invention forms a stamper and a master for forming information pits. In some cases, it can be applied effectively.
- the layer to be etched in the present invention is not limited to the light-absorbing layer 12 containing a beam-absorbing material that absorbs the exposure beam (laser beam L), but is not limited to the beam-reflection material that prevents the reflection of the exposure beam. Can form a layer to be etched.
- an optical recording medium has been described as an example of an information medium, the present invention can of course be applied to a magnetic disk (a discrete medium or the like). Industrial applicability As described above, according to this method of manufacturing a master for an information medium, the object to be etched is formed from a resin material having a selectivity of the etching rate of the photoresist layer to the etching rate of the object to be etched of 0.5 or more.
- the photoresist layer as a mask can be left even after the formation of the concave portion having a desired depth. Therefore, it is possible to effectively avoid the disadvantage that the groove shape of the concave portion is rounded or the depth thereof is reduced due to the disappearance of the photoresist layer before the formation of the concave portion is completed. Thus, a method of manufacturing a master for information medium on which a sharp uneven pattern is formed is realized.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02783724A EP1460625A1 (en) | 2001-11-30 | 2002-11-29 | Information medium master manufacturing method, information medium stamper manufacturing method, information medium master manufacturing apparatus, and information medium stamper manufacturing apparatus |
US10/495,746 US20050006336A1 (en) | 2001-11-30 | 2002-11-29 | Information medium master manufacturing method information medium stamper manufacturing method information medium master manufacturing apparatus and information medium stamper manufacturing apparatus |
AU2002349665A AU2002349665A1 (en) | 2001-11-30 | 2002-11-29 | Information medium master manufacturing method, information medium stamper manufacturing method, information medium master manufacturing apparatus, and information medium stamper manufacturing apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-365612 | 2001-11-30 | ||
JP2001365612 | 2001-11-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003046904A1 true WO2003046904A1 (fr) | 2003-06-05 |
Family
ID=19175610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/012569 WO2003046904A1 (fr) | 2001-11-30 | 2002-11-29 | Procede et dispositif de matriçage et de pressage de supports d'information |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050006336A1 (ja) |
EP (1) | EP1460625A1 (ja) |
AU (1) | AU2002349665A1 (ja) |
TW (1) | TWI236013B (ja) |
WO (1) | WO2003046904A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1364367A2 (en) * | 2001-02-27 | 2003-11-26 | TDK Corporation | Method for producing photoresist master for optical information medium, and method for producing stamper for optical information medium |
JP2002289949A (ja) * | 2001-03-26 | 2002-10-04 | Sony Corp | 光ファイバ、光増幅発振装置、レーザ光発生装置、レーザディスプレイ装置およびカラーレーザディスプレイ装置 |
JP2003085829A (ja) * | 2001-09-06 | 2003-03-20 | Tdk Corp | 光情報媒体用スタンパの製造方法およびこれに用いるフォトレジスト原盤、ならびに、光情報媒体用スタンパおよび光情報媒体 |
TWI258142B (en) * | 2002-01-08 | 2006-07-11 | Tdk Corp | Manufacturing method of stamper for manufacturing data medium, the stamper, and the stamper spacer with template |
TW200305157A (en) * | 2002-03-11 | 2003-10-16 | Tdk Corp | Processing method for photoresist master, production method for recording medium-use master, production method for recording medium, photoresist master, recording medium-use master and recording medium |
JP2005166105A (ja) * | 2003-11-28 | 2005-06-23 | Tdk Corp | 凹凸パターン転写用原盤及び情報記録媒体製造用スタンパの製造方法 |
JP4404898B2 (ja) * | 2004-03-25 | 2010-01-27 | 三洋電機株式会社 | 微細凹凸構造を有する曲面金型の製造方法及びこの金型を用いた光学素子の製造方法 |
JP2005339669A (ja) * | 2004-05-27 | 2005-12-08 | Tdk Corp | インプリント方法、情報記録媒体製造方法およびインプリント装置 |
US20060073422A1 (en) * | 2004-09-28 | 2006-04-06 | Imation Corp. | Portable conformable deep ultraviolet master mask |
TWI263096B (en) * | 2004-12-03 | 2006-10-01 | Hon Hai Prec Ind Co Ltd | Method for manufacturing a cavity of a light guide plate |
JP2009026374A (ja) * | 2007-07-19 | 2009-02-05 | Tdk Corp | 光情報媒体 |
KR101422215B1 (ko) * | 2008-05-27 | 2014-07-24 | 시게이트 테크놀로지 엘엘씨 | 서보 패턴을 자기기록매체에 자기 전사하기 위한 마스터기록매체 및 그 제조 방법 |
JP4645721B2 (ja) * | 2008-10-02 | 2011-03-09 | ソニー株式会社 | 原盤製造方法、光ディスク製造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53123905A (en) * | 1977-04-05 | 1978-10-28 | Sony Corp | Original disc of video disc by optical recording system |
JPH04263140A (ja) * | 1991-02-07 | 1992-09-18 | Ricoh Co Ltd | 無反射コート付きガラス原盤 |
JP2000113520A (ja) * | 1998-10-08 | 2000-04-21 | Ricoh Co Ltd | 光ディスク原盤の製造方法 |
JP2000113526A (ja) * | 1998-10-09 | 2000-04-21 | Ricoh Co Ltd | 光情報記録媒体用スタンパの製造方法 |
JP2000280255A (ja) * | 1999-03-31 | 2000-10-10 | Seiko Epson Corp | 原盤の製造方法 |
JP2001184734A (ja) * | 1999-12-24 | 2001-07-06 | Hitachi Maxell Ltd | 情報記録媒体用基板を製造するための原盤及びその製造方法 |
JP2002050087A (ja) * | 2000-05-22 | 2002-02-15 | Ricoh Co Ltd | 光ディスク原盤の製造方法、光ディスク用スタンパ及び光ディスク基板 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3181284B2 (ja) * | 1990-01-12 | 2001-07-03 | 旭電化工業株式会社 | エネルギー線反応性粘着剤組成物 |
JPH11296918A (ja) * | 1998-04-08 | 1999-10-29 | Ricoh Co Ltd | 光情報記録媒体用スタンパの製造方法 |
JP2003085829A (ja) * | 2001-09-06 | 2003-03-20 | Tdk Corp | 光情報媒体用スタンパの製造方法およびこれに用いるフォトレジスト原盤、ならびに、光情報媒体用スタンパおよび光情報媒体 |
TWI228718B (en) * | 2001-11-05 | 2005-03-01 | Tdk Corp | Manufacturing method and device of mold plate for information medium |
US20050066825A1 (en) * | 2001-12-28 | 2005-03-31 | Tdk Corporation | Method for manufacturing stamper for information medium manufacture, stamper, and photoresist original disk |
AU2003202474A1 (en) * | 2002-01-08 | 2003-07-24 | Tdk Corporation | Method for manufacturing stamper for information medium manufacture, stamper, and photoresist master disk |
TWI258142B (en) * | 2002-01-08 | 2006-07-11 | Tdk Corp | Manufacturing method of stamper for manufacturing data medium, the stamper, and the stamper spacer with template |
-
2002
- 2002-11-29 TW TW091134806A patent/TWI236013B/zh not_active IP Right Cessation
- 2002-11-29 EP EP02783724A patent/EP1460625A1/en not_active Withdrawn
- 2002-11-29 AU AU2002349665A patent/AU2002349665A1/en not_active Abandoned
- 2002-11-29 WO PCT/JP2002/012569 patent/WO2003046904A1/ja not_active Application Discontinuation
- 2002-11-29 US US10/495,746 patent/US20050006336A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53123905A (en) * | 1977-04-05 | 1978-10-28 | Sony Corp | Original disc of video disc by optical recording system |
JPH04263140A (ja) * | 1991-02-07 | 1992-09-18 | Ricoh Co Ltd | 無反射コート付きガラス原盤 |
JP2000113520A (ja) * | 1998-10-08 | 2000-04-21 | Ricoh Co Ltd | 光ディスク原盤の製造方法 |
JP2000113526A (ja) * | 1998-10-09 | 2000-04-21 | Ricoh Co Ltd | 光情報記録媒体用スタンパの製造方法 |
JP2000280255A (ja) * | 1999-03-31 | 2000-10-10 | Seiko Epson Corp | 原盤の製造方法 |
JP2001184734A (ja) * | 1999-12-24 | 2001-07-06 | Hitachi Maxell Ltd | 情報記録媒体用基板を製造するための原盤及びその製造方法 |
JP2002050087A (ja) * | 2000-05-22 | 2002-02-15 | Ricoh Co Ltd | 光ディスク原盤の製造方法、光ディスク用スタンパ及び光ディスク基板 |
Also Published As
Publication number | Publication date |
---|---|
EP1460625A1 (en) | 2004-09-22 |
TWI236013B (en) | 2005-07-11 |
AU2002349665A1 (en) | 2003-06-10 |
TW200300936A (en) | 2003-06-16 |
US20050006336A1 (en) | 2005-01-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3006199B2 (ja) | 光ディスクの製造方法 | |
JP3104699B1 (ja) | 細溝付き成形基板の製造方法 | |
US6207247B1 (en) | Method for manufacturing a molding tool used for sustrate molding | |
US6814897B2 (en) | Method for manufacturing a molding tool used for substrate molding | |
WO2003046904A1 (fr) | Procede et dispositif de matriçage et de pressage de supports d'information | |
WO2003041070A1 (fr) | Procede et dispositif de fabrication d'une matrice de pressage pour support d'information | |
WO2003105145A1 (ja) | フォトレジスト原盤の製造方法、光記録媒体製造用スタンパの製造方法、スタンパ、フォトレジスト原盤、スタンパ中間体及び光記録媒体 | |
WO2003058616A1 (fr) | Procede de production d'une matrice de pressage destinee la production d'un support de donnees, matrice de donnees et matrice de pressage intermediaire dotee d'un disque maitre | |
JP2004519803A (ja) | 光情報媒体用フォトレジスト原盤の製造方法および光情報媒体用スタンパの製造方法 | |
JP2001234383A (ja) | スタンパーの製造方法 | |
JP4366193B2 (ja) | スタンパ原盤の製造方法及びスタンパの製造方法 | |
US20080261152A1 (en) | Method of manufacturing mother stamper and method of manufacturing stamper | |
JP2004136692A (ja) | 金属製第3成形型を大量に製造する方法、樹脂基板を製造する方法及び樹脂基板 | |
JPH10241213A (ja) | 光ディスク用スタンパーの製造方法 | |
JPH09115190A (ja) | 光ディスク用スタンパの製造方法 | |
JP2009080914A (ja) | 光ディスク原盤の製造方法、光ディスク原盤、スタンパ、光ディスク基板、及び光ディスク | |
JP2004062981A (ja) | 光ディスク製造用スタンパーの製造方法、光ディスク製造用スタンパー及び光ディスクの製造方法 | |
JP2009087431A (ja) | スタンパ原版の製造方法及びスタンパ原版 | |
JP2003085829A (ja) | 光情報媒体用スタンパの製造方法およびこれに用いるフォトレジスト原盤、ならびに、光情報媒体用スタンパおよび光情報媒体 | |
JP2003228889A (ja) | 情報媒体用原盤の製造方法、情報媒体用スタンパーの製造方法、情報媒体用原盤の製造装置、および情報媒体用スタンパーの製造装置 | |
JP2008123574A (ja) | 光情報記録媒体用スタンパ原版および光情報記録媒体用スタンパの製造方法 | |
JPH10241214A (ja) | 光ディスク用スタンパーの製造方法 | |
JP2010118121A (ja) | 光ディスク用原盤の製造方法、光ディスク用原盤、スタンパ、及び光ディスク | |
JPH11333856A (ja) | 樹脂基板用の成形型の製造方法 | |
JP2002015474A (ja) | 光ディスク原盤及び光ディスク基板の作製方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SC SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LU MC NL PT SE SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 10495746 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2002783724 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 2002783724 Country of ref document: EP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 2002783724 Country of ref document: EP |