WO2003025974A3 - Zwischenträger für elektronische bauelemente und verfahren zur lötkontaktierung eines derartigen zwischenträgers - Google Patents

Zwischenträger für elektronische bauelemente und verfahren zur lötkontaktierung eines derartigen zwischenträgers Download PDF

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Publication number
WO2003025974A3
WO2003025974A3 PCT/DE2002/003429 DE0203429W WO03025974A3 WO 2003025974 A3 WO2003025974 A3 WO 2003025974A3 DE 0203429 W DE0203429 W DE 0203429W WO 03025974 A3 WO03025974 A3 WO 03025974A3
Authority
WO
WIPO (PCT)
Prior art keywords
intermediate support
solder
electronic components
contact
sucked
Prior art date
Application number
PCT/DE2002/003429
Other languages
English (en)
French (fr)
Other versions
WO2003025974A2 (de
Inventor
Puymbroeck Jozef Van
Marcel Heerman
Original Assignee
Siemens Dematic Ag
Puymbroeck Jozef Van
Marcel Heerman
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Dematic Ag, Puymbroeck Jozef Van, Marcel Heerman filed Critical Siemens Dematic Ag
Priority to KR10-2004-7003555A priority Critical patent/KR20040036938A/ko
Priority to JP2003529499A priority patent/JP2005503036A/ja
Priority to US10/489,592 priority patent/US20040251527A1/en
Priority to EP02774350A priority patent/EP1425792A2/de
Publication of WO2003025974A2 publication Critical patent/WO2003025974A2/de
Publication of WO2003025974A3 publication Critical patent/WO2003025974A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Der Zwischenträger für elektronische Bauelemente, beispielsweise Halbleiter, besitzt einen Trägerkörper aus Kunststoff mit einstückig angeformten Kontakthöckern (2), welche mit einer Metallschicht versehen sind, die jeweils mit mindestens einer Leiterbahn des Trägerkörpers (1) leitend verbunden ist. Die Kontakthöcker (2) besitzen jeweils eine von ihrer Spitze bis zu ihrem Fuss reichende gut benetzbare Bahn, die jeweils in einen Lotaufnahmebereich mit Saugwirkung (11) am Fuss des jeweiligen Kontakthöckers (2) führt. Auf diese Weise kann beim Löten der Kontakthöcker überschüssiges Lot abgesaugt werden, so dass Kurzschlüsse auch ohne die Verwendung eines Lötstopplacks vermieden werden. So kann bei der Lötkontaktierung des Zwischenträgers das Lot grossflächig auf einen Schaltungsträger aufgebracht werden, wobei es beim Reflowlöten aus den Zwischenräumen zwischen den Kontaktstellen abgesaugt wird.
PCT/DE2002/003429 2001-09-14 2002-09-13 Zwischenträger für elektronische bauelemente und verfahren zur lötkontaktierung eines derartigen zwischenträgers WO2003025974A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR10-2004-7003555A KR20040036938A (ko) 2001-09-14 2002-09-13 전자 부품들용 중간 기판, 및 이러한 중간 기판을 납땜접합하는 방법
JP2003529499A JP2005503036A (ja) 2001-09-14 2002-09-13 電子素子のための中間支持体および中間支持体をはんだコンタクトする方法
US10/489,592 US20040251527A1 (en) 2001-09-14 2002-09-13 Intermediate support for electronic components and method for solder contacting such an intermediate support
EP02774350A EP1425792A2 (de) 2001-09-14 2002-09-13 Zwischenträger fur elektronische bauelemente und verfahren zur lotkontaktierung eines derartigen zwischenträgers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10145348A DE10145348C1 (de) 2001-09-14 2001-09-14 Zwischenträger für elektronische Bauelemente und Verfahren zur Lötkontaktierung eines derartigen Zwischenträgers
DE10145348.5 2001-09-14

Publications (2)

Publication Number Publication Date
WO2003025974A2 WO2003025974A2 (de) 2003-03-27
WO2003025974A3 true WO2003025974A3 (de) 2004-01-22

Family

ID=7699039

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/003429 WO2003025974A2 (de) 2001-09-14 2002-09-13 Zwischenträger für elektronische bauelemente und verfahren zur lötkontaktierung eines derartigen zwischenträgers

Country Status (8)

Country Link
US (1) US20040251527A1 (de)
EP (1) EP1425792A2 (de)
JP (1) JP2005503036A (de)
KR (1) KR20040036938A (de)
CN (1) CN1555572A (de)
DE (1) DE10145348C1 (de)
TW (1) TW563238B (de)
WO (1) WO2003025974A2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100555706B1 (ko) 2003-12-18 2006-03-03 삼성전자주식회사 미세 솔더볼 구현을 위한 ｕｂｍ 및 이를 이용한 플립칩패키지 방법
US7422913B2 (en) * 2004-05-24 2008-09-09 Arima Display Corp. Method for checking a condition of a heat treatment
JP5145729B2 (ja) * 2007-02-26 2013-02-20 富士電機株式会社 半田接合方法およびそれを用いた半導体装置の製造方法
JP5073351B2 (ja) * 2007-04-12 2012-11-14 日本電波工業株式会社 表面実装用の電子デバイス
CN112201629B (zh) * 2020-09-01 2023-06-06 苏州通富超威半导体有限公司 一种倒装芯片封装结构及其制造方法
CN113056098B (zh) * 2021-02-10 2022-09-23 华为数字能源技术有限公司 电子元件封装体、电子元件组装结构及电子设备
US11875988B2 (en) * 2021-04-29 2024-01-16 Nxp Usa, Inc. Substrate pad and die pillar design modifications to enable extreme fine pitch flip chip (FC) joints

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724473A (en) * 1982-12-17 1988-02-09 Thomson-Csf Micropackage for encapsulating an electronic component
JPH01140647A (ja) * 1987-11-27 1989-06-01 Hitachi Ltd 面装着型半導体パッケージ
DE4135007A1 (de) * 1990-10-25 1992-05-14 Cts Corp Bauelemente fuer oberflaechenmontage
DE19704930A1 (de) * 1996-02-12 1997-09-25 Zierick Mfg Corp An der Oberfläche zu befestigende Verbinder, die die Kapillarwirkung fördern
WO1999010926A1 (de) * 1997-08-22 1999-03-04 Siemens S.A. Verfahren zur herstellung von elektrisch leitenden querverbindungen zwischen zwei verdrahtungslagen auf einem substrat
US6111309A (en) * 1998-05-29 2000-08-29 Kabushiki Kaisha Toshiba Semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5192835A (en) * 1990-10-09 1993-03-09 Eastman Kodak Company Bonding of solid state device to terminal board
WO1996009646A1 (de) * 1994-09-23 1996-03-28 Siemens N.V. Polymer stud grid array
US5984164A (en) * 1997-10-31 1999-11-16 Micron Technology, Inc. Method of using an electrically conductive elevation shaping tool
CN1352805A (zh) * 1999-05-20 2002-06-05 西门子公司 用于与一个布线焊接的至少带有两个用金属喷涂的聚合物突起的基底

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4724473A (en) * 1982-12-17 1988-02-09 Thomson-Csf Micropackage for encapsulating an electronic component
JPH01140647A (ja) * 1987-11-27 1989-06-01 Hitachi Ltd 面装着型半導体パッケージ
DE4135007A1 (de) * 1990-10-25 1992-05-14 Cts Corp Bauelemente fuer oberflaechenmontage
DE19704930A1 (de) * 1996-02-12 1997-09-25 Zierick Mfg Corp An der Oberfläche zu befestigende Verbinder, die die Kapillarwirkung fördern
WO1999010926A1 (de) * 1997-08-22 1999-03-04 Siemens S.A. Verfahren zur herstellung von elektrisch leitenden querverbindungen zwischen zwei verdrahtungslagen auf einem substrat
US6111309A (en) * 1998-05-29 2000-08-29 Kabushiki Kaisha Toshiba Semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 393 (E - 814) 31 August 1989 (1989-08-31) *

Also Published As

Publication number Publication date
WO2003025974A2 (de) 2003-03-27
DE10145348C1 (de) 2003-03-27
JP2005503036A (ja) 2005-01-27
TW563238B (en) 2003-11-21
EP1425792A2 (de) 2004-06-09
CN1555572A (zh) 2004-12-15
US20040251527A1 (en) 2004-12-16
KR20040036938A (ko) 2004-05-03

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