WO2003023087A1 - Moulage de resine deposee et procede de production correspondant - Google Patents
Moulage de resine deposee et procede de production correspondant Download PDFInfo
- Publication number
- WO2003023087A1 WO2003023087A1 PCT/JP2002/009231 JP0209231W WO03023087A1 WO 2003023087 A1 WO2003023087 A1 WO 2003023087A1 JP 0209231 W JP0209231 W JP 0209231W WO 03023087 A1 WO03023087 A1 WO 03023087A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin molding
- thermoplastic resin
- plated
- producing
- etching
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31605—Next to free metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31609—Particulate metal or metal compound-containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
Landscapes
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP20020798050 EP1426465B1 (en) | 2001-09-11 | 2002-09-10 | Plated molded resin article and process of producing thereof |
DE60238540T DE60238540D1 (de) | 2001-09-11 | 2002-09-10 | Plattierter harzformkörper und verfahren zu seiner herstellung |
KR1020037004791A KR100917141B1 (ko) | 2001-09-11 | 2002-09-10 | 도금 수지 성형체와 그 제조방법 |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-274447 | 2001-09-11 | ||
JP2001274447A JP4593036B2 (ja) | 2001-09-11 | 2001-09-11 | メッキ樹脂成形体 |
JP2001363109A JP4030754B2 (ja) | 2001-11-28 | 2001-11-28 | メッキ樹脂成形体 |
JP2001-363109 | 2001-11-28 | ||
JP2002100768 | 2002-04-03 | ||
JP2002-100768 | 2002-04-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003023087A1 true WO2003023087A1 (fr) | 2003-03-20 |
Family
ID=27347475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/009231 WO2003023087A1 (fr) | 2001-09-11 | 2002-09-10 | Moulage de resine deposee et procede de production correspondant |
Country Status (7)
Country | Link |
---|---|
US (2) | US7645370B2 (ja) |
EP (1) | EP1426465B1 (ja) |
KR (1) | KR100917141B1 (ja) |
CN (1) | CN1249267C (ja) |
DE (1) | DE60238540D1 (ja) |
TW (1) | TWI224120B (ja) |
WO (1) | WO2003023087A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006006735A1 (ja) * | 2004-07-13 | 2006-01-19 | Daicel Polymer Ltd. | メッキ樹脂成形体 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005232338A (ja) * | 2004-02-20 | 2005-09-02 | Daicel Polymer Ltd | メッキ樹脂成形体 |
JP4276555B2 (ja) * | 2004-02-20 | 2009-06-10 | ダイセルポリマー株式会社 | メッキ樹脂成形体 |
JP2006152041A (ja) * | 2004-11-26 | 2006-06-15 | Daicel Polymer Ltd | メッキ樹脂成形体 |
CN101107388B (zh) * | 2005-01-17 | 2012-06-13 | 大赛璐高分子株式会社 | 电镀树脂模塑制品的制造方法 |
US20090120798A1 (en) * | 2005-01-17 | 2009-05-14 | Toshihiro Tai | Method For Manufacturing Plated Resin Molded Article |
US9783890B2 (en) | 2012-10-26 | 2017-10-10 | Rohm And Haas Electronic Materials Llc | Process for electroless plating and a solution used for the same |
CN104098845A (zh) * | 2014-06-27 | 2014-10-15 | 广东威林工程塑料有限公司 | 一种采用盐酸溶液粗化的电镀聚丙烯材料及其制备方法 |
JP6343631B2 (ja) * | 2016-05-30 | 2018-06-13 | 住友理工株式会社 | 電子写真機器用導電性ロール |
JP6955583B2 (ja) | 2017-06-14 | 2021-10-27 | プレミックス・オサケユフティオPremix Oy | 抗菌ポリマー組成物 |
WO2024115633A1 (en) * | 2022-12-02 | 2024-06-06 | Sabic Global Technologies B.V. | Chromium acid etching free metal plating of blends of acrylonitrile-butadiene-styrene and polar polymer |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4278739A (en) | 1979-01-24 | 1981-07-14 | Stauffer Chemical Company | Electroless metal plated laminates |
US5326811A (en) | 1991-06-17 | 1994-07-05 | Mitsubishi Petrochemical Co., Ltd. | Plated polyamide resin articles |
US5370934A (en) | 1991-03-25 | 1994-12-06 | E. I. Du Pont De Nemours And Company | Electroless plated aramid surfaces |
JPH08253869A (ja) * | 1995-03-14 | 1996-10-01 | Sharp Corp | 樹脂の無電解メッキ方法 |
JPH11181218A (ja) * | 1997-12-22 | 1999-07-06 | Sumika Abs Latex Kk | メッキ用樹脂組成物およびメッキ成形品 |
JPH11310880A (ja) * | 1998-04-30 | 1999-11-09 | Idemitsu Petrochem Co Ltd | 金属メッキされた樹脂成形品 |
JP2000154266A (ja) * | 1998-09-17 | 2000-06-06 | Polyplastics Co | プラスチック成形品の製造方法 |
Family Cites Families (27)
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GB1099416A (en) * | 1965-01-25 | 1968-01-17 | Agfa Gevaert Nv | Method of incorporating photographic ingredients into a photographic colloid |
DE1769259A1 (de) | 1967-05-03 | 1971-10-21 | Avisun Corp | Verwendung einer Polyolefinmasse zum elektrolytischen Aufbringen eines Metallueberzuges |
US3607350A (en) * | 1967-12-05 | 1971-09-21 | Dow Chemical Co | Electroless plating of plastics |
US3843585A (en) * | 1972-04-28 | 1974-10-22 | Dow Chemical Co | Coacervation of anion-containing aqueous disperse systems with amphoteric polyelectrolytes |
JPS5426926B2 (ja) * | 1972-06-03 | 1979-09-06 | ||
JPS5144343B2 (ja) * | 1972-09-16 | 1976-11-27 | ||
US3819394A (en) * | 1972-12-13 | 1974-06-25 | Kollmorgen Photocircuits | Protective coating for activated resinous substrates |
JPS5290192A (en) * | 1976-01-23 | 1977-07-28 | Kyowa Kagaku Kougiyou Kk | Inorganic flame resisting agent |
US4386175A (en) * | 1979-02-08 | 1983-05-31 | Kokoku Rubber Industrial Company Limited | Resin composition |
JPS5613099A (en) * | 1979-07-10 | 1981-02-07 | Nichireki Chem Ind Co Ltd | Treating method of sludge |
JPS57123231A (en) * | 1981-01-22 | 1982-07-31 | Toyobo Co Ltd | Metal-plated polyamide molded product and preparation of same |
DE3148280A1 (de) * | 1981-12-05 | 1983-06-09 | Bayer Ag, 5090 Leverkusen | Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung |
JPH0635499B2 (ja) * | 1984-02-09 | 1994-05-11 | 電気化学工業株式会社 | Abs系樹脂メッキ製品 |
US4876145A (en) * | 1984-02-09 | 1989-10-24 | Denki Kagaku Kogyo Kabushiki Kaisha | Plated resin article |
JPS61120857A (ja) | 1984-11-16 | 1986-06-07 | Toray Ind Inc | メツキ用熱可塑性樹脂組成物 |
US4751146A (en) * | 1985-07-09 | 1988-06-14 | Showa Denko Kabushiki Kaisha | Printed circuit boards |
JPS62109826A (ja) * | 1985-11-08 | 1987-05-21 | Hamazaki Sangyo Kk | 界面活性剤含有熱可塑性樹脂系マスタ−バツチの製造方法 |
GB2193966B (en) * | 1986-08-01 | 1990-01-31 | Nippon Synthetic Chem Ind | Thermoplastic resin composition |
FR2619569B1 (fr) * | 1987-08-20 | 1990-09-07 | Charbonnages Ste Chimique | Procede de fabrication d'une resine thermoplastique resistante au choc, comportant une etape de transfert des particules d'un latex de renforcement dans les monomeres de la matrice, a l'aide d'agents ioniques |
US5230927A (en) * | 1989-02-16 | 1993-07-27 | Mitsubishi Gas Chemical Company, Inc. | Method for metal-plating resin molded articles and metal-plated resin molded articles |
US5143592A (en) * | 1990-06-01 | 1992-09-01 | Olin Corporation | Process for preparing nonconductive substrates |
DE4112789A1 (de) * | 1991-04-19 | 1992-10-22 | Bayer Ag | Verfahren zur aufarbeitung von stabilisierten abs-polymerisaten unter rueckgewinnung unumgesetzter monomerer |
JP2927142B2 (ja) * | 1993-03-26 | 1999-07-28 | 上村工業株式会社 | 無電解金めっき浴及び無電解金めっき方法 |
DE4404750A1 (de) * | 1994-02-15 | 1995-08-17 | Bayer Ag | Matte ABS-Polymer-Zusammensetzungen |
JPH1017767A (ja) * | 1996-07-02 | 1998-01-20 | Du Pont Kk | 高流動性ポリアミド樹脂組成物 |
GB9722028D0 (en) * | 1997-10-17 | 1997-12-17 | Shipley Company Ll C | Plating of polymers |
US7182136B2 (en) * | 2003-07-02 | 2007-02-27 | Halliburton Energy Services, Inc. | Methods of reducing water permeability for acidizing a subterranean formation |
-
2002
- 2002-09-03 TW TW91120013A patent/TWI224120B/zh not_active IP Right Cessation
- 2002-09-10 WO PCT/JP2002/009231 patent/WO2003023087A1/ja active Application Filing
- 2002-09-10 KR KR1020037004791A patent/KR100917141B1/ko not_active IP Right Cessation
- 2002-09-10 US US10/238,909 patent/US7645370B2/en not_active Expired - Lifetime
- 2002-09-10 CN CNB028028481A patent/CN1249267C/zh not_active Expired - Lifetime
- 2002-09-10 EP EP20020798050 patent/EP1426465B1/en not_active Expired - Lifetime
- 2002-09-10 DE DE60238540T patent/DE60238540D1/de not_active Expired - Lifetime
-
2004
- 2004-06-14 US US10/867,440 patent/US20040224169A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4278739A (en) | 1979-01-24 | 1981-07-14 | Stauffer Chemical Company | Electroless metal plated laminates |
US5370934A (en) | 1991-03-25 | 1994-12-06 | E. I. Du Pont De Nemours And Company | Electroless plated aramid surfaces |
US5326811A (en) | 1991-06-17 | 1994-07-05 | Mitsubishi Petrochemical Co., Ltd. | Plated polyamide resin articles |
JPH08253869A (ja) * | 1995-03-14 | 1996-10-01 | Sharp Corp | 樹脂の無電解メッキ方法 |
JPH11181218A (ja) * | 1997-12-22 | 1999-07-06 | Sumika Abs Latex Kk | メッキ用樹脂組成物およびメッキ成形品 |
JPH11310880A (ja) * | 1998-04-30 | 1999-11-09 | Idemitsu Petrochem Co Ltd | 金属メッキされた樹脂成形品 |
JP2000154266A (ja) * | 1998-09-17 | 2000-06-06 | Polyplastics Co | プラスチック成形品の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006006735A1 (ja) * | 2004-07-13 | 2006-01-19 | Daicel Polymer Ltd. | メッキ樹脂成形体 |
JP2006028552A (ja) * | 2004-07-13 | 2006-02-02 | Daicel Polymer Ltd | メッキ樹脂成形体 |
Also Published As
Publication number | Publication date |
---|---|
US20040224169A1 (en) | 2004-11-11 |
KR20040043091A (ko) | 2004-05-22 |
EP1426465B1 (en) | 2010-12-08 |
CN1473208A (zh) | 2004-02-04 |
EP1426465A4 (en) | 2008-01-23 |
CN1249267C (zh) | 2006-04-05 |
DE60238540D1 (de) | 2011-01-20 |
KR100917141B1 (ko) | 2009-09-15 |
EP1426465A1 (en) | 2004-06-09 |
US7645370B2 (en) | 2010-01-12 |
TWI224120B (en) | 2004-11-21 |
US20030059621A1 (en) | 2003-03-27 |
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