WO2003005423A1 - Appareil de traitement de substrat - Google Patents

Appareil de traitement de substrat Download PDF

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Publication number
WO2003005423A1
WO2003005423A1 PCT/JP2002/006683 JP0206683W WO03005423A1 WO 2003005423 A1 WO2003005423 A1 WO 2003005423A1 JP 0206683 W JP0206683 W JP 0206683W WO 03005423 A1 WO03005423 A1 WO 03005423A1
Authority
WO
WIPO (PCT)
Prior art keywords
check
items
information
setting
unit
Prior art date
Application number
PCT/JP2002/006683
Other languages
English (en)
Japanese (ja)
Inventor
Takashi Aiuchi
Akihito Suzuki
Hirotsugu Kamamoto
Shuichi Yonemura
Takashi Imafu
Kazuhisa Sakamoto
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to JP2003511292A priority Critical patent/JPWO2003005423A1/ja
Publication of WO2003005423A1 publication Critical patent/WO2003005423A1/fr

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67276Production flow monitoring, e.g. for increasing throughput

Definitions

  • the present invention relates to a substrate processing apparatus.
  • the photolithography process in the semiconductor device manufacturing process includes a resist coating unit for forming a resist film on the wafer surface, a developing unit for developing the exposed wafer, and a resist coating unit. Thereafter, the coating is performed by a coating and developing apparatus equipped with a plurality of processing units such as a heat processing unit for performing a heat treatment before and after the development processing.
  • a coating and developing apparatus equipped with a plurality of processing units such as a heat processing unit for performing a heat treatment before and after the development processing.
  • This coating / developing apparatus is sold by a vendor to a wafer manufacturer, and when the coating / developing apparatus is installed in a factory of the wafer manufacturer, the so-called coating / developing apparatus is called by a worker on the vendor side.
  • Start-up work is performed. This start-up work involves setting and adjusting each processing unit in the coating and developing equipment so that the operation of the coating and developing equipment can be started.
  • the start-up work is performed according to predetermined check items, and various setting values, adjustment values, etc. set by the worker at that time are written on a predetermined sheet, that is, a so-called check list creation work. Is performed.
  • the so-called checklist created at this time is intended to prevent operator settings and adjustment omissions, and to store initial setting information.
  • the check list has several tens of pages, and it takes a lot of time to complete the check list.
  • the worker's checklist creation work involved omissions and transcription errors, and it took more time to correct them. If it takes a long time to create a so-called check list, the delivery of the coating and developing processing equipment to the wafer manufacturing side will be delayed, and the start of wafer processing will also be delayed. Disclosure of the invention
  • the present invention has been made in view of the above points, and provides a substrate processing apparatus for quickly and accurately creating a check list when starting up a substrate processing apparatus such as a coating and developing apparatus.
  • An object of the present invention is to provide a processing apparatus for processing a substrate, wherein the processing apparatus is used to set specifications of various devices and members for operating the processing apparatus.
  • a setting input section for inputting setting information relating to the specified setting items; and a display section for displaying a check list screen relating to predetermined check items in the processing device, wherein the checked items include the setting items.
  • the setting information input by the setting input unit is automatically displayed in a check item column corresponding to the setting information on the check list screen.
  • the substrate processing apparatus further includes an input unit for inputting check information relating to check items that cannot be set from the setting input unit, and the check information input from the input unit is used for the check list screen.
  • the check list screen may include a check item that has already been checked and a check item that has not been checked. May be displayed so that they can be identified.
  • the check list screen may display information on an operator who has performed setting work of the processing apparatus.
  • the check list screen includes the check information of the displayed check item as a standard check of the check item. If it is different from the check information, the check item may be displayed so that it can be identified.
  • the substrate processing apparatus of the present invention may include communication means for transmitting check information on the check items displayed on the check list screen to a vendor of the processing apparatus via the Internet. .
  • the substrate processing apparatus of the present invention may include a communication unit for obtaining check information on another substrate processing apparatus.
  • the check list screen relating to the check items of the processing apparatus is displayed on the display unit.
  • the setting information input for setting the specifications of the processing device members and the like is automatically entered and displayed in a predetermined column of the check list screen. This eliminates the need for the operator to re-enter the setting information in the checklist for the specified paper, and the checklist is quickly created accordingly. Also, since the setting information that has been entered is entered directly into the checklist, there is no need for a transcription error as in the past, and the checklist can be created more accurately. Furthermore, since the checklist is displayed as a screen, the worker can proceed with the work while looking at the screen, thereby improving work efficiency. Also, if storage as paper is required, it may be printed out by hard copy or the like.
  • the specifications of the various devices and members of the processing apparatus include, for example, various units provided in the processing apparatus for processing a substrate and members constituting the unit.
  • the check items include adjustment items and confirmation items in addition to the above-mentioned setting items.
  • the check items include various items such as the processing temperature, processing humidity, wind speed in the processing unit, discharge amount of processing liquid, and discharge flow rate of each processing.
  • the apparatus further comprises an input unit for inputting check information on check items that cannot be set from the setting input unit, and the check information input from the input unit is displayed on the check list screen.
  • the check information is displayed in the column of check items corresponding to the check information, all check items can be entered on the screen of the display unit.
  • the check items that cannot be set from the setting input unit include, for example, check items that are inspected and measured by the work of workers, and the measured values are entered.
  • the check items include the center position of the substrate in each processing unit, the position of the processing liquid discharge nozzle, the reference position of the transport unit, and the like.
  • the worker can check the checked items. Items are easier to grasp, work efficiency is improved, and there is no omission of checks.
  • unchecked items and checked items may be displayed in different colors, or unset items may be extracted and displayed.
  • the information on the worker who performed the setting work displayed on the check list screen includes, for example, the name of the worker, the employee number, the name of the office to which the worker belongs, and the like.
  • the name of the worker may be described on the check list screen to provide a function as a confirmation sign for the checked items. That is, a worker's confirmation sign may be displayed for each check item on the check list screen.
  • the operator when the check information of the check item displayed on the check list screen is different from the standard check information, the operator can identify the check item. It is possible to confirm that the check information is different from the standard information, and to reconfirm the check information.
  • the standard check information may be, for example, processing information of a processing device having the same specifications, which may be a reference of a processing device serving as a predetermined reference, or a process that has already been checked and is operating normally. It may be check information of the device.
  • the substrate processing apparatus of the present invention further includes communication means for transmitting check information on the check items displayed on the check list screen to a vendor of the processing apparatus via the Internet.
  • the vendor can be notified of the settings made by the workers and the progress of the start-up work. This makes it possible to monitor the start-up work of the manager of the vendor, who is an expert, and to promptly give instructions to the workers if necessary. Also, after the work is completed, a checklist screen can be sent, and the vendor can save it as a checklist.
  • the substrate processing apparatus of the present invention further includes a communication means for obtaining check information on another substrate processing apparatus, the check information on other processing is obtained as necessary.
  • the check information on other processing is obtained as necessary.
  • FIG. 1 is a perspective view schematically showing a coating and developing treatment apparatus according to an embodiment.
  • FIG. 2 is a plan view schematically showing the configuration of the coating and developing treatment apparatus.
  • FIG. 3 is a front view of the coating and developing apparatus of FIG.
  • Figure 4 is an explanatory diagram of a longitudinal section showing the outline of the configuration of the resist coating unit.
  • FIG. 5 is a rear view of the coating and developing apparatus of FIG.
  • Figure 6 is a block diagram showing the configuration of the control section.
  • Figure 7 is an explanatory diagram showing an example of the checklist screen.
  • FIG. 8 is an explanatory diagram showing an example of the setting input screen.
  • FIG. 9 is an explanatory diagram showing an example of a setting input screen in which numerical values have been input.
  • Figure 10 is an explanatory diagram showing an example of a check list screen on which check information has been entered.
  • Fig. 11 is an explanatory diagram showing an example of the check list screen when identifying the checked check items.
  • Figure 12 is a schematic configuration diagram of a transmission system for transmitting check information to a vendor.
  • Figure 13 is a block diagram showing the configuration of a control section with a communication unit.
  • FIG. 1 is a perspective view schematically showing a configuration of a coating and developing apparatus 1 as a processing apparatus according to the present embodiment
  • FIG. 2 is a plan view of the coating and developing apparatus 1.
  • the coating and developing apparatus 1 loads 25 wafers W from the outside into the coating and developing processing apparatus 1 in cassette units, and A cassette station 2 for loading and unloading wafers W, a processing station 3 having a plurality of processing units for processing wafers W in a single-wafer manner, and a processing station 3 provided adjacent to the processing station 3 And an interface unit 4 for transferring a wafer W to and from an exposure processing apparatus (not shown).
  • a plurality of cassettes C can be placed at predetermined positions on the cassette mounting table 10 in a line in the X direction (up and down direction in Fig. 2).
  • a wafer transfer unit 11 is provided along the transfer path 12 so as to be movable in the X direction.
  • the wafer transfer unit 11 can carry in / out the wafer W to / from the cassette C.
  • To 5 3 Can access and transfer the wafer W.
  • the cassette station 2 is provided with a control section 13 of the coating and developing apparatus 1, which will be described later.
  • a main transfer unit 20 is provided at the center of the processing station 3, and various processing units are provided in multiple stages around the main transfer unit 20.
  • a plurality of processing unit groups G1, G2, G3, and G4 are provided.
  • the first and second processing unit groups Gl and G2 are disposed on the front side of the coating and developing processing apparatus 1, and the first processing unit group G1 includes a wafer W as shown in FIG.
  • a resist coating unit 21 for applying a resist solution to form a resist film and a developing unit 22 for developing the wafer W are provided in two stages from the bottom.
  • the second processing unit group G2 is provided with a resist coating unit 23 and a developing unit 24 in order from the bottom.
  • the resist coating unit 21 includes a spin chuck 30 for holding and rotating the wafer W by suction and a spin chuck 30 for holding the wafer W in a casing 2 la.
  • the resist liquid discharge nozzle 32 is connected to the resist liquid supply pipe 34, and the resist liquid supply pipe 34 has a control valve 35 for adjusting the discharge flow rate of the resist liquid. Is provided.
  • the control valve 35 is controlled by a discharge amount control unit 36, and the discharge amount of the resist liquid from the resist liquid discharge nozzle 32 is controlled to a predetermined discharge amount.
  • the gas supply pipe 33 is provided with a damper 37 for adjusting the gas supply amount.
  • the dambar 37 is controlled by the gas supply control unit 38, and the supply amount from the gas supply pipe 33 is controlled.
  • the inside of cup 3 1 Thus, the wind speed in the cup 31 during processing can be maintained at a predetermined wind speed.
  • the gas supply pipe 33 is provided with a temperature / humidity controller 39 for controlling the temperature and humidity of the gas.
  • the discharge amount control unit 36, the gas supply control unit 38, and the temperature / humidity control unit 39 perform various controls based on setting information from the control section 13 described later.
  • the third processing unit group G3 of processing station 3 is arranged adjacent to cassette station 2, as shown in Fig. 2.
  • the third processing unit group G3 includes cooling units 50 and 51 for cooling and processing the wafer W, and enhances the fixability between the resist solution and the wafer W.
  • the adhering unit 52, the extension unit 53 for transferring the wafer W, and the pre-wetting units 54 and 55 for evaporating the solvent in the resist solution are, for example, 6 from the bottom. Stacked in columns.
  • the fourth processing unit group G4 is arranged adjacent to the interface unit 4.
  • the fourth processing unit group G4 includes, for example, a cooling unit 60, an extension / cooling unit 61 for naturally cooling the placed wafer W, an extension unit 62, and a post-exposure unit.
  • Post-exposure baking units 63 and 64 for performing heat treatment and post-baking units 65 and 66 for performing heat treatment after image processing are stacked, for example, in seven stages from the bottom. .
  • the interface unit 4 is provided with, for example, a wafer transfer unit 70 and a peripheral exposure unit 71.
  • the wafer transfer unit 70 is used for the extension 'cooling unit 61, extension unit 62, peripheral exposure unit 71, and an exposure processing unit (not shown) belonging to the fourth processing unit group G4. Access and for each It is configured to transfer wafer W.
  • the control section 13 is a section for controlling the processing performed in the coating and developing processing apparatus 1.
  • the control section 13 includes, for example, a setting input section 80, a main control section 81, a storage section 82, a display section 83, and a manual input section 84 as an input section as shown in FIG. And
  • the setting input unit 80 is for inputting and setting, for example, setting information relating to the entire coating and developing apparatus 1 and various units.
  • the various units are the main transfer unit 20 described above, the wafer transfer units 11 and 70, the resist coating units 21 and 23, the development units 22 and 24, and the development processing units 22 and 24.
  • the main control unit 81 directly controls the entire coating and developing processing apparatus 1 and various units based on the setting information input from the setting input unit 80, for example, or sends the setting information to the control unit of various units. And indirectly control the unit.
  • the storage unit 82 has, for example, a plurality of storage areas, and stores setting information input from the setting input unit 80, a predetermined program executed by the main control unit 81, and the like.
  • the display section 83 is composed of, for example, a dot matrix type color liquid crystal display cell or a CRT (Cathode Ray Tube), and as shown in FIG. Display a checklist screen T in a predetermined format created during startup work.
  • the display section 83 is provided, for example, on the front side of the cassette station 2 as shown in FIG. 1 and adjacent to the setting input section 80, and the operator inputs check information while checking the setting information. You can check the list screen T.
  • the same date and time as the clock function (not shown) provided in the coating and developing apparatus 1 are displayed.
  • the operator's sign for example, input information from the manual input section 84 is displayed, and the operator's name can be entered from the manual input section 84. .
  • the names of workers for example, passwords, ID codes, etc. may be input as necessary.
  • a column is provided to display the serial number of the coating and developing equipment and the names of all workers, and can be entered using, for example, the manual input section 84.
  • the worker on the vendor side inputs the identification number of coating / developing apparatus 1 and his / her own name from manual input section 84, and fills in check list screen T on display section 83. At this time, if there are multiple workers, for example, enter the names of all the workers.
  • various settings, adjustments, and confirmations are performed according to the items on the checklist screen T displayed on the display unit 83.
  • the items to be checked include the temperature and humidity settings in the cup of the resist coating unit 21, the wind speed in the cup, the discharge amount setting of the resist solution, the height adjustment of the resist solution discharge nozzle,
  • the operator first opens the setting input screen S for the resist coating unit 21 as shown in FIG.
  • the setting input screen S includes, for example, a setting information column for inputting setting information for each setting item relating to the resist dispensing unit 21 and a confirm button for confirming the setting.
  • the operator inputs predetermined values recommended by the vendor in the setting information fields of the temperature and humidity in the cup, the wind speed in the cup, and the discharge amount of the resist liquid.
  • the confirm button is pressed, for example, the main controller 81 to the temperature / humidity controller 39, the gas supply controller 38, and the discharge amount controller 36
  • the setting information such as the predetermined numerical value is output, and the temperature and humidity in the cup 31, the wind speed in the cup 31, and the discharge amount of the resist liquid are set.
  • each numerical value input on the setting input screen S is displayed in the column of each check information on the check list screen T on the display section 83 as shown in FIG.
  • the date and time when the start-up work was performed are displayed in the date / time column.
  • the name of the worker who performed the work related to the check items is input, for example, from the manual input section 84, and is entered in the worker's signature field.
  • the worker when the worker adjusts the position of the resist solution discharge nozzle of the resist dispensing unit 21 and adjusts the center position of the needle C on the spin chuck 30, for example, the worker first uses a caliper. The position of the resist solution discharge nozzle 32 and the center position of the wafer W are actually measured using measuring instruments such as a jig and a jig. Next, if the measured value is within the allowable range, enter the measured value from the manual input section 84 and enter it in the check information field of the checklist screen T.
  • the measured value is not within the allowable range, the position and the like of the resist solution discharge nozzle 32 are corrected and corrected, and the measured value is measured again, and the measured value is input from the manual input unit 84.
  • the actual measured value after the correction is entered in the check information column of the checklist screen T.
  • the date and time are automatically entered in the same way as the input from the setting input section 80 described above. Then, for example, the name of the worker who performed the work is input from the manual input section 84, and is entered in the sign field of the worker on the checklist screen T.
  • the input from the setting input section 80 and the input from the manual input section 84 are sequentially performed according to the check items on the check list screen T, so that the check list is displayed on the screen. Is created.
  • the check list screen T in which all the check items have been entered in this way is stored in the storage section 82 of the control section 13 as, for example, check list information. If necessary, a printing device (not shown) such as a printer may be used. Output according to the location.
  • the check list created during the start-up work is displayed as a check list screen on the display section 83 of the coating and developing apparatus 1, and the setting input section is displayed. Since the setting information such as the set value set in 80 is automatically entered in the checklist screen T as it is, mistakes in the checklist entry and omission of entry can be prevented. Also, since it is not necessary for the operator to write down the set values and the like, the checklist is created quickly, and the time required for the startup work is reduced.
  • the check items that have already been checked and the check items that have not been checked may be identified and displayed. For example, as shown in Fig. 11, checked and unchecked items are displayed in different colors. In such a case, unchecked items can be seen at a glance, thus preventing omission of checks.
  • the check items may be identified by other methods, for example, by brightness or blinking. Also, only unchecked items may be extracted and displayed.
  • the manual input section 84 is provided independently.
  • the display section 83 may be provided with an input function and integrated.
  • the display unit 83 is configured with a touch screen or the like as a pointing device, and the check list and the operator's sign that are not input from the setting input unit 80 are displayed in the check list 83.
  • the setting input unit 80 and the display unit 83 are provided separately in the above embodiment, the setting input unit 80 and the display unit 83 are provided separately. Choi
  • the list screen may be displayed at one place. For example, a checklist screen T can be displayed on the setting input section 80 that is a touch screen. Then, the check list screen T and setting input screen S can be switched. This allows the setting input and the display of the checklist to be performed in one place. Since the setting input section 80 is a touch screen, the manual input performed by the manual input section 84 can also be performed.
  • check information displayed on the check list screen T described in the above embodiment may be transmitted to the vendor side via the Internet.
  • Figure 12 is a schematic diagram of the communication system 100 for transmitting the check information displayed on the check list screen T to the vendor.
  • a plurality of coating and developing units M 1 to M n with the same specifications and an advanced group computer (AGC) 1 that collectively manages the coating and developing units M 1 to M n 02 is provided on the factory 101 side.
  • AGC102 and the coating and developing equipment Ml to Mn are connected by LAN103.
  • the control section 104 of the coating and developing apparatus Ml has a communication section 105 as a communication means for communicating information with the AGC 102. Is provided.
  • the AGC 102 also has a communication unit (not shown).
  • a host computer 107 is provided on the vendor 106 side.
  • the host computer 107 is provided with a communication unit (not shown).
  • the host computer 107 and the AGC 102 are connected via the Internet 108 and can communicate with each other.
  • the check information of the display unit 83 of the coating and developing processing apparatus M1 is transmitted to the host computer 10 of the vendor 106 through the Internet 108 via the AGC 102. 7 can be sent.
  • paint The check information displayed on the check list screen T is transmitted to the vendor 106 at predetermined time intervals when the cloth development processor Ml is started up.
  • vendor 106 check information can be obtained as a checklist and stored as data by vendor 106.
  • the check information stored at the factory 101 can be obtained whenever necessary.
  • the check information of the coating and developing processing apparatus M 1 the check information of another coating and developing processing apparatus that has already been started up, for example, the coating and developing processing apparatus M 2 is obtained, and the check information is obtained.
  • the standard check information may be compared with the check information on the checklist screen T.
  • the communication unit 105 obtains the check information of the coating and developing processing apparatus M 2 via the LAN 103 and stores it in, for example, the storage unit 82.
  • the check information of the coating and developing treatment apparatus M2 is compared with the check information displayed on the checklist screen T by a predetermined program, and different items are identified and displayed. Workers are to re-set, confirm, etc. for the different items. By doing so, setting and adjustment mistakes are suppressed, and the start-up work is performed more accurately.
  • the standard check information includes other check information, such as check information of the coating and developing processing equipment that is already operating normally, check information of the coating and developing processing equipment in other factories, and ideal chucks created by vendors in advance. It may be information or the like.
  • the host computer 107 obtains the chip information of the other factory via the Internet 108 and executes the coating and developing processing. You may make it transmit to apparatus M1.
  • the embodiment described above relates to a coating and developing processing apparatus, the present invention can be applied to other processing apparatuses, for example, an exposure apparatus, an etching apparatus, and an inspection apparatus. Further, the present invention has been applied to a wafer processing apparatus, but can also be applied to a processing apparatus for a substrate other than a wafer, for example, an LCD substrate or a mask reticle substrate for a photomask. Industrial applicability

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  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Coating Apparatus (AREA)

Abstract

Une liste de contrôle utilisée dans la mise en marche d'un appareil de traitement de substrat est créé plus rapidement et de manière plus précise que selon les procédés de l'art antérieur. L'appareil de traitement de substrat comprend une unité d'introduction de mise en fonction destinée à introduire des informations de mise en fonction sur des articles de mise en fonction de l'appareil de traitement et une unité d'affichage destinée à afficher une image de liste de contrôle concernant les articles contrôlés prédéfinis de l'appareil de traitement. Les articles de contrôle incluent les articles de mise en fonction. Les informations de mise en fonction introduites par le biais de l'unité d'introduction de mise en fonction est automatiquement affichée dans les fenêtres d'article de contrôle correspondant respectif de l'image de la liste de contrôle.
PCT/JP2002/006683 2001-07-04 2002-07-02 Appareil de traitement de substrat WO2003005423A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003511292A JPWO2003005423A1 (ja) 2001-07-04 2002-07-02 基板の処理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001203322 2001-07-04
JP2001-203322 2001-07-04

Publications (1)

Publication Number Publication Date
WO2003005423A1 true WO2003005423A1 (fr) 2003-01-16

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WO (1) WO2003005423A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4906714B2 (ja) * 2005-03-29 2012-03-28 株式会社日立国際電気 基板処理装置、集中管理装置、基板処理装置の表示方法及び調整方法
JP2012147002A (ja) * 2003-06-13 2012-08-02 Lam Research Corporation 汎用プログラマブル半導体処理システムのためのアーキテクチャおよびその方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1049500A (ja) * 1997-03-14 1998-02-20 Sony Corp スケジュール管理方法
US20010039463A1 (en) * 1997-12-19 2001-11-08 Sachiko Nakagawa Device and method for supporting system development and computer-readable medium

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1049500A (ja) * 1997-03-14 1998-02-20 Sony Corp スケジュール管理方法
US20010039463A1 (en) * 1997-12-19 2001-11-08 Sachiko Nakagawa Device and method for supporting system development and computer-readable medium

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012147002A (ja) * 2003-06-13 2012-08-02 Lam Research Corporation 汎用プログラマブル半導体処理システムのためのアーキテクチャおよびその方法
JP4906714B2 (ja) * 2005-03-29 2012-03-28 株式会社日立国際電気 基板処理装置、集中管理装置、基板処理装置の表示方法及び調整方法
JP2012114448A (ja) * 2005-03-29 2012-06-14 Hitachi Kokusai Electric Inc 基板処理装置及びその表示方法並びにセットアップ方法、集中管理装置及びその表示方法

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