Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
  • H01L33/50—Wavelength conversion elements
  • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
  • C08G59/32—Epoxy compounds containing three or more epoxy groups
  • C08G59/3236—Heterocylic compounds
  • C08G59/3245—Heterocylic compounds containing only nitrogen as a heteroatom
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
  • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
  • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
  • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
  • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Definitions

• the present invention relates to epoxy molding compositions. More particularly, the present invention relates to epoxy molding compositions which are particularly useful as optoelectronic encapsulants for light emitting devices.
• Epoxy resin compositions are widely used for electronic packaging materials in the electronics industry, and, in particular, as encapsulants for semiconductor elements and electronic circuits. Accordingly, epoxy resin based compositions have been widely used in the formation of molding compositions for use as electronic packaging materials. Transparent epoxy molding compositions are well known for use as encapsulants in connection with optoelectronic devices, such as light-emitting diodes (LEDs), for use for lighting applications in the electronics industry.
• LEDs light-emitting diodes
• LEDs have traditionally been multilayer epitaxial structures based mainly on AlGaAs and InGaAlP as basic materials. Such LEDs are typically encapsulated in a transparent epoxy composition, which is typically provided in a dome shape for efficient transmission of light from the LED-.
• Epoxy compositions useful in encapsulating optoelectronic devices may involve liquid type compositions, which can be filled or poured about an LED and cured. Additionally, partially cured epoxy compositions may be used for encapsulating LEDs, in which an epoxy composition is partially cured or "B- staged” to form a "pellet", which can then be transfer molded with the electronic device under heat and pressure to encapsulate the LED.
• UV/blue LEDs are LEDs which are capable of emitting in the ultraviolet (UV) range, or in the blue range, or in both the UV and blue ranges of the electromagnetic spectrum. Conversion of UV blue light from an LED to visible white light can be accomplished using phosphors, which are typically applied to the surface of the LED and then encapsulated with an epoxy encapsulant.
• U.S. Patent No. 5,886,401 to Liu discloses an LED structure including a transparent epoxy compound for encapsulating the LED, and including a phosphor layer coated on the outer surface of the epoxy compound. Such an arrangement requires additional manufacturing steps for providing the separate layers of epoxy and phosphor, which results in additional time and cost for manufacturing.
• U.S. Patent No. 5,149,971 to McElhaney et al. discloses a scintillator assembly which includes a body of optically-transparent epoxy and an amount of phosphor particles embedded within the body adjacent one surface. The phosphor particles are mixed within the liquid epoxy when in an uncured state and settle to the bottom surface of a mold in which the liquid epoxy is contained.
• U.S. Patent No. 5,813,753 to Vriens et al. discloses an LED for use in lighting applications which includes a UV/blue LED located in a depression of a cup, with the cup being filled with a light transmitting cyclo aliphatic epoxy encapsulant with phosphor particles dispersed in the encapsulant or adhered to the surface of the LED.
• cycloaliphatic epoxy encapsulants are well known for use as liquid epoxy compositions in encapsulating electronics.
• Such liquid cycloaliphatic epoxy compositions cannot be B-staged due to their inherent high reactivity.
• the phosphor particles typically settle out of the liquid composition during curing, thereby providing a non-uniform distribution of phosphor throughout the cured encapsulant.
• the present invention is directed to a molding compound which includes an epoxy composition including the reaction product of an epoxy component and an anhydride component; and a visible light-emitting phosphor material, with the phosphor material substantially uniformly distributed throughout the molding compound.
• the present invention is directed to an encapsulant material for an electronic component, such as an LED, which includes a molding compound which is a reaction product of a partially cured epoxy composition having a phosphor material substantially uniformly distributed therethrough.
• the molding compound has an average molecular weight of about 5,000 to about 20,000.
• the molding compound is prepared by B-staging a partially cured homogeneous mixture of the epoxy composition and the phosphor material which has been previously subjected to partial curing to increase the viscosity of the epoxy composition and suspend the phosphor material within the epoxy composition during mixing of the homogeneous mixture.
• a further embodiment of the present invention is directed to a method of preparing a molding compound, which includes providing an epoxy 'composition including an epoxy compound, and mixing a visible light-emitting phosphor material with the epoxy composition to provide a homogeneous mixture, with the phosphor material suspended within the epoxy composition.
• the viscosity of the homogeneous mixture is increased while maintaining the phosphor material suspended within the epoxy composition to form a pre-reacted intermediate. This can be accomplished by partially curing the epoxy composition to an initial viscosity capable of maintaining the phosphor material suspended within the epoxy composition.
• the pre-reacted intermediate is then B-staged to partially cure the epoxy composition, thereby forming the molding compound.
• a further embodiment of the present invention involves a method of preparing a molding compound which includes providing an epoxy composition including an epoxy compound and an anhydride, and mixing a visible light-emitting phosphor material with the epoxy composition at a temperature of about 105°C to about 110°C to provide a homogeneous mixture, with the phosphor material suspended within the epoxy composition.
• the mixture is cooled to a temperature of about 60°C to about 65 °C, and a polyol is added to the mixture for reaction with the anhydride.
• the temperature of the mixture is then increased to about 70°C to about 80°C for a time period of about 10 minutes to 30 minutes to cause an increase in the viscosity of the mixture while maintaining the phosphor material suspended within the epoxy composition to form a pre-reacted intermediate.
• the pre-reacted intermediate is then B-staged at a temperature of about 65°C, thereby forming the molding compound with the phosphor material uniformly distributed therethrough.
• the present invention is directed to a method of encapsulating an optoelectronic device, which includes providing an optoelectronic device and a molding compound which includes a light-emitting phosphor material homogeneously mixed within a partially cured epoxy compound, and encapsulating the optoelectronic device with the molding compound, followed by fully curing the epoxy compound.
• the present invention includes an optoelectronic device including an LED and an encapsulant surrounding the LED, with the encapsulant in the form of a reaction product of a cured epoxy composition having a phosphor material substantially uniformly distributed therethrough.
• Fig. 1 is a schematic diagram of an optoelectronic device in accordance with the present invention.
• the present invention is directed to a composition of matter, and, in particular, to a molding compound such as for use in encapsulating electronic packages which include an optoelectronic component such as an LED.
• the molding compound of the present invention includes a partially cured epoxy composition having a phosphor material uniformly distributed throughout the epoxy composition. By providing the phosphor material within the partially cured epoxy composition, the phosphor material can be suspended within and substantially uniformly distributed throughout the epoxy composition, thereby preventing settling of the phosphor material during curing thereof in the encapsulation process.
• the molding compound of the present invention includes an . epoxy composition.
• the epoxy composition is a substantially transparent epoxy composition capable of transmitting light emitted from an LED, as is known in the art.
• the epoxy composition used in the molding compound of the present invention is a reaction product of an anhydride of a cyclic dibasic acid and an epoxy-containing compound.
• the cyclic anhydride component used in the present invention is desirably a cycloaliphatic anhydride, such as hexahydrophthalic anhydride (HHPA).
• Small quantities of other related anhydrides such as tetrahydrophthalic anhydride and phthalic anhydride, may be present with the hexahydrophthalic anhydride but should not be more than 25% of the total cyclic acid anhydride content, e.g., 5 to 25%, for best results.
• any thermosetting epoxy resin may be used which is capable of being B-staged, as will be discussed in more detail herein.
• Particularly desirable are solid epoxy resins, and in particular, tri- or multi-functional epoxy resins.
• useful epoxy resins include solid epoxy resins derived from bisphenol A or F, tetramethyl and/or biphenyl, and epichlorohydrin, novalacs, and the like.
• Triglycidyl isocyanurate (TGIC) is particularly desirable.
• An example of a particularly useful product is tris(2,3-epoxy- propyl) isocyanurate, sold under the tradename TEPIC ® by Nissan Chemical Industries, Ltd.
• the anhydride ring In order to promote reaction of the cyclic anhydride component and the epoxy component, the anhydride ring must be opened.
• Various agents can be incorporated into the epoxy composition to assist in this ring opening reaction.
• Such ring opening can be accomplished, for example, by active hydrogens present as water, or by hydroxyls, or by a Lewis base.
• a polyol is incorporated into the epoxy composition to assist in the ring opening of the anhydride and promote curing of the epoxy composition.
• the polyol should be a lower aliphatic polyol of 3 to 6 carbon atoms and 2 to 4 hydroxyls, preferably of 3 hydroxyls, although in some cases minor proportions of other polyois may be blended in, providing that they do not adversely affect the molding compound properties.
• the highly preferred polyois employed are glycerol and trimethylol propane (TMP), alone or in mixture.
• TMP trimethylol propane
• Other polyois of the group described may be utilized in minor proportions, generally being less than 25%, e.g., 5 to 25%, of the polyol content. Among these are ethylene glycol, diethylene glycol, propylene glycol and dipropylene glycol.
• a suitable substitute material for these or for part of them is propoxylated pentaerythritol, a tetrol having a molecular weight of about 400, sold under the name PeP-450.
• This propoxylated pentaerythritol may be used in small quantities, generally being limited to 5 to 25% of the polyol content, preferably on a hydroxyl content basis.
• the "supplementing" polyois it will often be most desirable to employ those which are liquid at room temperature or with heating to comparatively low temperatures.
• comparatively high melting materials e.g., pentaerythritol, may be employed, preferably as a small proportion of polyol component.
• the various reactants will be essentially pure, over 95% pure, preferably over 99% pure, and most preferably 99.9 to 100% pure. Of course, they should be clean and colorless and water content is to be avoided.
• the reactions to make the molding compounds and subsequently to cure them may be effected without a catalyst, sometimes, in order to speed the reaction, the presence of a catalyst may be useful. It has been found that a relatively small group of catalytic materials, tin soaps of fatty acids of 8 to 18 carbon atoms, exert a catalytic effort without impairing the clarity, colorless nature, and other desirable properties of the molding compound and the finished cured product.
• the molding compounds of the present invention further include a phosphor material evenly distributed therethrough.
• the phosphor material is capable of converting light which is emitted from an LED into visible white light.
• the phosphor material can be a phosphor which is capable of converting and emitting one color (broadband, narrow band or multi-line, e.g., red, green, blue, yellow, or white), or a mixture of phosphors which are capable of converting and emitting different colors to get a good color rendering.
• the molding compound of the present invention is provided for use with an LED capable of transmitting UV and/or blue light
• the phosphor material is capable of converting such UV and/or blue light into visible white light, in particular, light having a wavelength in the known visible white light range, such as about 400 to about 800 nm.
• the phosphor material is desirably provided in the form of particles or grains, which can be intermixed within the epoxy composition, as will be described in more detail herein.
• the phosphor material may be selected from any known phosphor which, in combination with a UV or blue LED, will produce the desired light emission. For example, as is known in the art, yellow phosphor with a blue LED can be used to produce, white light.
• a particularly desirable phosphor is Yttrium Aluminum Garnet ("YAG”) yellow phosphor, which has a peak emission of about 575 nm. Such a phosphor is particularly useful for producing visible white light in combination with L GaN blue LED, which has a peak emission at 465 nm.
• YAG Yttrium Aluminum Garnet
• the proportions of the various components of the molding compounds employed are such as to produce the monoester of the acid anhydride and have the glycidyl moiety of the triglycidyl isocyanurate react with the acid group resulting from the anhydride-polyol reaction.
• a molecule of polyol may react with both carboxyls which may be considered to have come from the anhydride, or polyol hydroxyls from different polyol molecules may each react with the carboxyls.
• more than one glycidyl moiety of the triglycidyl isocyanurate may react with anhydride carboxyls and, in some cases, such reactions may be effected before the anhydride reacts with polyol.
• the reactions may be considered to be those as initially described, with a polyol forming a monoester with an acid anhydride and a glycidyl moiety of triglycidyl isocyanurate reacting with a free carboxylic acid group generated by the previous reaction.
• Such reactions may be considered to be effected when the three reactants are simultaneously reacted.
• the molding compound includes from about 20 weight percent to about 75 weight percent of the epoxy-containing compound based on the total weight of the molding compound, more desirably from about 30 weight percent to about 40 weight percent of the epoxy-containing compound based on the total weight of the molding compound; from about 20 weight percent to about 75 weight percent of the acid anhydride based on the total weight of the molding compound, more desirably from about 45 weight percent to about 55 weight percent of the acid anhydride based on the total weight of the molding compound; from about 5 weight percent to about 20 weight percent of the polyol based on the total weight of the molding compound, more desirably from about 5 weight percent to about 10 weight percent of the polyol based on the total weight of the molding compound; and from about 0.5 weight percent to about 20 weight percent of the phosphor material based on the total weight of the molding compound, desirably from about 5 weight percent to about 12 weight percent of the phosphor material based on the total weight of the molding compound.
• a mold release when a mold release of the epoxy-
• the phosphor material is substantially uniformly distributed throughout the molding ' compound. Such a uniform distribution of the phosphor material is important to prevent settling of the phosphor material during curing of the encapsulant over the optoelectronic component, which can result in inconsistent levels of light emitted through the encapsulant.
• Providing the phosphor material uniformly distributed throughout a molding compound can be difficult due to settling of the phosphor material, which can occur during final cure of the molding compound, or, in the case of pre-formed molding compounds, during B-stage curing of the molding compound. Such settling is believed to be due to the high specific gravity associated with such phosphor materials, as well as the low viscosity of a typical epoxy composition for use in a molding compound.
• the phosphor material can be substantially uniformly distributed throughout the epoxy composition, and maintained with such a uniform distribution, by increasing the viscosity of the epoxy composition while maintaining the phosphor material uniformly distributed throughout the epoxy composition, such as through continued mixing, thus suspending the phosphor material within the epoxy composition to. form a pre-reacted intermediate.
• the molding compound is provided as a reaction product of such a pre-reacted intermediate.
• preparation of the molding compound of the present invention involves a pre-mixing of the epoxy composition with the phosphor material to provide a homogeneous mixture, wherein the phosphor material is substantially evenly distributed within the epoxy composition. This may be accomplished by combining and mixing the epoxy compound, the anhydride component, and the phosphor material. Desirably, such mixing occurs at a temperature of from about 80°C to about 140°C, more desirably from about 105°C to about 110°C, for a period of about 20 minutes. No significant reaction occurs during this mixing step. [0032] The thus prepared mixture is cooled to a temperature of about 45°C to about 85°C, desirably 60°C to about 65°C.
• the polyol is then added to the mixture thus prepared with continued mixing, for example, through the use of a mixing blade. Addition of the polyol is believed to initiate a reaction with the anhydride, thereby forming a half acid/half ester.
• the temperature of the mixture is increased to about 70°C to about 80°C over a period of about 10 to 30 minutes, with continued mixing of the components.
• the epoxy composition begins to cure, and the viscosity of the mixture slowly increases.
• Such an increase in viscosity due to partial curing of the epoxy composition suspends the phosphor material within the partially cured epoxy composition.
• the viscosity of the composition is increased to about 300 to 900 centipoise (cps) at 75°C.
• a pre- reacted intermediate product is formed.
• this, intermediate product has a weight average molecular weight of from about 300 to about 1,000.
• the viscosity of the pre-reacted intermediate is directly related to the amount of phosphor material incorporated therein, as well as the particle size and surface treatment of the phosphor material.
• a pre-reacted intermediate product, according to the present invention including about 12 weight percent of phosphor material based on the total weight of the composition, may achieve a viscosity of about 600 to 800 cps when heated at 75°C for a period of 20 minutes.
• a similar epoxy composition without any phosphor material incorporated therein achieves a viscosity of about 400 cps under similar conditions of 75°C heating for a period of 20 minutes. Accordingly, including the phosphor material results in achieving an increased viscosity in the composition in a shorter time period.
• this intermediate product is further partially cured. Desirably, the intermediate product is transferred to cavities or molds for B-staging of the composition.
• B-staging of the composition helps to speed molding times during subsequent molding encapsulation procedures by polymerizing the epoxy composition at a comparatively low temperature, making it possible to produce a stable molding compound (stable for several months at room temperature) which will be satisfactorily moldable in a subsequent molding encapsulation procedure, with a short curing period.
• B-staging is effected at a temperature in the range of 50°C to 100°C, more desirably 60°C to 80°C, most desirably at about 65°C, for a period of 30 minutes to 24 hours, preferably from 4 to 10 hours, when no catalyst is used. With catalyst, the times may be from 1/4 to 2/3 of those noted.
• B-staging is typically continued until a spiral flow of about 30 to about
• Such B-staging results in formation of a molding compound having approximately 40 to 60% of the epoxy moieties of the epoxy compound being reacted.
• the molding compound is sufficiently polymerized so as to be cured quickly in a subsequent molding operation.
• the resin may be size reduced to a suitable particle size range, e.g., 1/16 inch to 1/4 inch diameter.
• it can be B- staged to a pre-form shape in a suitably sized mold and, after ejection from the mold, may be employed directly. In this manner, the molding compound acquires the shape of the mold, producing a stable product, such as a pellet, for later curing during an encapsulation process.
• the molding compound has a weight average molecular weight of about 5,000 to about 20,000, due to the partial curing of the epoxy composition.
• the molding compound represents a reaction product of the intermediate product, which is itself a partially cured epoxy composition having a phosphor material uniformly distributed therethrough.
• the final molding composition includes the phosphor material substantially uniformly distributed throughout the molding composition.
• the molding -compound of the present invention is provided in a substantially solid form, such as a pellet.
• Molding compositions provided in such pellet form for use, for example, in transfer press molding applications are known in the art, and ' typically involve an epoxy-containing compound in which the epoxy composition has been partially reacted to for a partially cured reaction product.
• the phosphor material By incorporating the phosphor material into the molding compound within the partially reacted structure thereof, the phosphor . material can be maintained evenly throughout the structure of the molding compound. Accordingly, during final curing of the molding compound during encapsulation, the phosphor material can be maintained in a substantially uniform distribution throughout the molding compound, thereby resulting m an encapsulated electronic component in which the fully cured encapsulant includes a phosphor material evenly and homogeneously distributed throughout the structure thereof.
• An advantage of the present molding compounds is achieved in the ability to B-stage the molding compounds.
• cycloaliphatic epoxy resins are reputed to be useful as encapsulants, they are liquids and cannot be B- staged with HHPA. Any initial reaction between the anhydride, polyol, and cycloaliphatic resin would form a cross-linked pellet which would not flow when heated, and would therefore not be useful as a molding composition for the present invention.
• the present invention further provides a method for encapsulating an optoelectronic device using such a molding compound.
• the optoelectronic device such as an LED
• the molding compound which includes a phosphor material uniformly distributed and homogeneously mixed within a partially cured epoxy composition.
• the LED is encapsulated with the molding compound, and the epoxy composition is fully cured.
• molding processes using the prepared molding compound may be accomplished by any known method, including utilization of preforms and transfer molding or compression molding, wherein the polymer is thermoset to final structure.
• the present molding compounds are intended for transfer molding.
• the finished product is ejected from the mold and such removal may often be effected immediately, without the need for any cooling.
• the polymer is normally employed to cover, strengthen, rigidify and/or insulate an enclosed material and such is present in the mold during the curing operation. Molding can be accomplished in short time periods, as low as 45 seconds, and normally within the range of one to five minutes, at a temperature of about 130°C to 175°C, preferably from 140°C to 160°C.
• Molding pressures may be varied widely but will normally be in the range of 300 to 2,000 lbs/sq. in.
• the polymers and molding compounds are not limited to such applications but can find more general uses as structural materials, printed circuit substrates, potting compounds, encapsulants, insulators, etc.
• the present invention also provides an optoelectronic device in the form of a light-emitting diode having an encapsulant surrounding the light- emitting diode.
• the encapsulant is a reaction product of a cured epoxy composition having a phosphor material substantially uniformly distributed therethrough, as described hereinabove.
• Such an optoelectronic device is depicted generally in Fig. 1.
• Fig. 1 depicts an optoelectronic device 10 which includes an LED 20 encapsulated by an encapsulant 50.
• LED 20 may be any LED as is known in the art.
• LED 20 may desirably be an LED stack having a multi-layer structure, with an upper ohmic contact and a lower ohmic contact, as is known in the art.
• LED 20 is positioned within reflector cup 30, which includes a reflective surface 32, such as a mirror. Reflector cup 30 is in electrical communication with the lower ohmic contact of LED 20.
• Optoelectronic device 10 further includes lead wires 42 and 44.
• Lead wire 42 is in electrical communication with the lower ohmic contact of LED 20 through reflector cup 30, and lead wire 44 is in electrical communication with the upper ohmic contact of LED 20, for example through bond wire 46.
• Optoelectronic device 10 further includes encapsulant 50 surrounding and encapsulating LED 20.
• Encapsulant 50 includes a reaction product of a cured epoxy composition having a phosphor material substantially uniformly distributed therethrough, as is described in detail hereinabove.
• Encapsulant 50 surrounds LED 20 and is formed in the shape of a dome, with relatively large dimensions as compared to LED 20.
• Encapsulant 50 may be formed about LED 20 through a transfer molding process, as is known in the art.
• encapsulant 50 includes the phosphor material substantially uniformly distributed throughout the epoxy composition, the light is converted and distributed substantially uniformly through encapsulant 50, thereby providing for uniform emission of visible light from the optoelectronic device.
• Example 1 A molding composition was prepared having the following components:
• B-staging was accomplished by heating the mixture to a temperature of 65°C for a time period of about 17 hours, until a spiral flow of 30 to 50 inches was achieved, using a standard test procedure as is known in the art.
• B- staging the molded compound thus formed was analyzed for phosphor content at the top, middle, and bottom portions of the compound relative to the positioning in the mold. Analysis of the molded compound determined the phosphor content to be 11.3% at the top portion, 11.4% at the middle portion, and 11.6% at the bottom portion.
• Example 2 A molding composition having the same proportion of components as set forth in Example 1 was prepared.
• the triglycidyl isocyanurate, hexahydrophthalic anhydride and stearic acid components were mixed with the phosphor in a liquid reaction vessel at a temperature of 105° to 110°C while stirring.
• the mixture was allowed to cool to about 60°C to 65°C, and then the glycerin was added.
• the temperature of the mixture was increased to about 75°C over a 20 minute period, with continuous mixing of the components using a mixing blade. After 20 minutes, the composition had a viscosity of about 750 cps at 75°C.
• the mixture was then transferred into a molding tray for B-staging.
• B- staging was accomplished in a similar manner as in Example 1, by heating the mixture to a temperature of 65°C for a time period of about 17 hours, until a spiral flow of 30 to 50 inches was achieved.
• the molded compound thus formed was analyzed for phosphor content at the top, middle, and bottom portions of the compound relative to the positioning in the mold. Analysis of the molded compound determined the phosphor content to be 11.9% at each of the top, middle, and bottom portions.
• a comparison of the results of Examples 1 and 2 demonstrates the uniform distribution of the phosphor material in the sample which was pre-reacted to suspend the phosphor within the epoxy compound prior to B-staging, as compared with a sample which did not involve such a pre-reaction.

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