WO2002072724A1 - Produit adhesif pour l'industrie automobile - Google Patents
Produit adhesif pour l'industrie automobile Download PDFInfo
- Publication number
- WO2002072724A1 WO2002072724A1 PCT/JP2002/001932 JP0201932W WO02072724A1 WO 2002072724 A1 WO2002072724 A1 WO 2002072724A1 JP 0201932 W JP0201932 W JP 0201932W WO 02072724 A1 WO02072724 A1 WO 02072724A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- meth
- acrylate
- group
- adhesive
- polymer
- Prior art date
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 76
- 239000000853 adhesive Substances 0.000 title claims abstract description 75
- 229920000642 polymer Polymers 0.000 claims abstract description 72
- 239000003822 epoxy resin Substances 0.000 claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 23
- 239000004593 Epoxy Substances 0.000 claims abstract description 15
- 239000011256 inorganic filler Substances 0.000 claims abstract description 12
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 12
- -1 monomethyldimethoxysilyl group Chemical group 0.000 claims description 87
- 125000005370 alkoxysilyl group Chemical group 0.000 claims description 60
- 239000003795 chemical substances by application Substances 0.000 claims description 51
- 125000005369 trialkoxysilyl group Chemical group 0.000 claims description 2
- 238000002156 mixing Methods 0.000 abstract description 15
- 239000003054 catalyst Substances 0.000 abstract description 13
- 239000004615 ingredient Substances 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 93
- 150000001875 compounds Chemical class 0.000 description 47
- 238000006243 chemical reaction Methods 0.000 description 45
- 239000011521 glass Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 24
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 22
- 239000000203 mixture Substances 0.000 description 18
- 239000000178 monomer Substances 0.000 description 17
- 239000012790 adhesive layer Substances 0.000 description 16
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- 229910000019 calcium carbonate Inorganic materials 0.000 description 10
- 239000007795 chemical reaction product Substances 0.000 description 9
- 229920005573 silicon-containing polymer Polymers 0.000 description 9
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 8
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000003505 polymerization initiator Substances 0.000 description 8
- 230000009257 reactivity Effects 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 6
- 239000000376 reactant Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 150000001412 amines Chemical class 0.000 description 5
- 125000005442 diisocyanate group Chemical group 0.000 description 5
- 239000012299 nitrogen atmosphere Substances 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 238000012643 polycondensation polymerization Methods 0.000 description 5
- 229920005862 polyol Polymers 0.000 description 5
- 229920001451 polypropylene glycol Polymers 0.000 description 5
- 238000007665 sagging Methods 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- UAJRSHJHFRVGMG-UHFFFAOYSA-N 1-ethenyl-4-methoxybenzene Chemical compound COC1=CC=C(C=C)C=C1 UAJRSHJHFRVGMG-UHFFFAOYSA-N 0.000 description 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 4
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- 238000006845 Michael addition reaction Methods 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 4
- 239000005056 polyisocyanate Substances 0.000 description 4
- 229920001228 polyisocyanate Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000012744 reinforcing agent Substances 0.000 description 4
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 4
- 125000003396 thiol group Chemical group [H]S* 0.000 description 4
- 239000003981 vehicle Substances 0.000 description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N 4-penten-2-one Chemical compound CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- WQAQPCDUOCURKW-UHFFFAOYSA-N butanethiol Chemical compound CCCCS WQAQPCDUOCURKW-UHFFFAOYSA-N 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 150000001728 carbonyl compounds Chemical class 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 150000004658 ketimines Chemical class 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- MJYFYGVCLHNRKB-UHFFFAOYSA-N 1,1,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(F)(F)CF MJYFYGVCLHNRKB-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical group NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 2
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 2
- WHFHDVDXYKOSKI-UHFFFAOYSA-N 1-ethenyl-4-ethylbenzene Chemical compound CCC1=CC=C(C=C)C=C1 WHFHDVDXYKOSKI-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- KDSNLYIMUZNERS-UHFFFAOYSA-N 2-methylpropanamine Chemical compound CC(C)CN KDSNLYIMUZNERS-UHFFFAOYSA-N 0.000 description 2
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 150000007514 bases Chemical class 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- ROPXFXOUUANXRR-YPKPFQOOSA-N bis(2-ethylhexyl) (z)-but-2-enedioate Chemical compound CCCCC(CC)COC(=O)\C=C/C(=O)OCC(CC)CCCC ROPXFXOUUANXRR-YPKPFQOOSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
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- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (z)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 description 2
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 2
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 2
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- 125000001153 fluoro group Chemical group F* 0.000 description 2
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- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
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- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
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- 238000004519 manufacturing process Methods 0.000 description 2
- NUKZAGXMHTUAFE-UHFFFAOYSA-N methyl hexanoate Chemical compound CCCCCC(=O)OC NUKZAGXMHTUAFE-UHFFFAOYSA-N 0.000 description 2
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- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 2
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 2
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 2
- 150000002903 organophosphorus compounds Chemical class 0.000 description 2
- UCUUFSAXZMGPGH-UHFFFAOYSA-N penta-1,4-dien-3-one Chemical class C=CC(=O)C=C UCUUFSAXZMGPGH-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 125000004437 phosphorous atom Chemical group 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- KJRCEJOSASVSRA-UHFFFAOYSA-N propane-2-thiol Chemical compound CC(C)S KJRCEJOSASVSRA-UHFFFAOYSA-N 0.000 description 2
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- 230000001012 protector Effects 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/10—Block or graft copolymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09J201/10—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
Definitions
- the present invention relates to an adhesive for bonding automotive members to each other. More specifically, the present invention relates to an automotive adhesive capable of rapidly primary hardening by moisture in the air and then exhibiting a strong permanent adhesive force by a curing reaction of an epoxy resin or the like.
- Adhesives for automotive glass are used to attach various components to automotive glass, such as brackets for mounting inner mirrors, moldings, protectors, reference pins for positioning, hinges, and brackets for mounting sensors.
- brackets for mounting inner mirrors such as brackets for mounting inner mirrors, moldings, protectors, reference pins for positioning, hinges, and brackets for mounting sensors.
- this bonded area is not only exposed to direct sunlight, dew, vibration, etc., but also every time the driver moves the inner mirror. Power is applied.
- adhesives for automotive glass are required to have various properties such as vibration resistance, durability, weather resistance, impact resistance, water resistance, and heat resistance, as well as strong adhesion to glass. .
- Epoxy, urethane, silicone, modified silicone and the like are usually used as such adhesives for automotive glass.
- the glass in the process of attaching the bracket to the windshield, first, the glass may be placed substantially horizontally, the bracket may be attached, and then the glass may be transported to the next process while the glass is set upright.
- the bracket is made of metal, it weighs several tens of grams. If the brackets do not adhere to the glass quickly, the brackets will be displaced below the mounting position when the glass is set up vertically, which may result in defective products.
- an epoxy resin-based adhesive takes time to cure the adhesive. Therefore, even if the glass is set upright, it is necessary to wait for several tens of minutes until the bracket does not shift, resulting in poor production efficiency. Even when a quick-curing epoxy resin adhesive was used, vibration resistance, impact resistance, and the like were insufficient.
- the adhesive in order to solve the above-mentioned problems, is quickly cured after bonding to exhibit a temporary fixing action, and finally, is firmly bonded to provide durability, weather resistance, heat resistance, impact resistance, and water resistance.
- the challenge was to provide an automotive adhesive with excellent properties such as properties. That is, the present invention can be used not only for bonding glass of an automobile to other members, but also for bonding members having materials other than glass.
- An object of the present invention is an automotive adhesive for bonding members that are required to be quickly cured and finally firmly bonded after bonding.
- the adhesive at 23 ° C has a viscosity of 100 to 700 Pa ⁇ s and a structural viscosity index of 2.'0 to 4.0 Is the gist.
- the rheological properties of the adhesive before curing were designed to exhibit a particular viscosity and structural viscosity index.
- the alkoxysilyl group-containing polymer in the adhesive rapidly undergoes a hydrolysis-condensation polymerization reaction due to moisture in the air or moisture contained in the inorganic filler.
- the primary curing proceeds at a level of several minutes after the formation of the adhesive layer, and it is possible to provide an excellent temporary fixing property in which the adhesive layer does not flow even when the member is set upright.
- the curing reaction of the epoxy resin since the curing reaction of the epoxy resin also proceeds sequentially, it is possible to finally form an adhesive cured layer that is firmly bonded and excellent in various properties. it can. The method for measuring the viscosity and the structural viscosity index will be described later.
- the alkoxysilyl group-containing polymer (a) has a main chain substantially having a polyoxyalkylene structure, and includes, as an alkoxysilyl group, a dialkylmonoalkoxysilyl group, a monoalkyldialkoxysilyl group and a trialkoxysilyl group.
- it contains at least one member selected from the group consisting of:
- those containing a monomethyldimethoxysilyl group and a trimethoxysilyl group are preferred, whereby the curing reaction can be rapidly advanced by moisture in the air.
- the present inventors considered that when bonding a bonding member such as a metal bracket to a windshield of an automobile, the process of erecting the glass vertically after bonding as described above, and as a result, two We found that we needed nature.
- the two properties are that, after the adhesive member is adhered to the glass, it hardens quickly and exerts a temporary fixing action, that is, a temporary fixing property, and finally, a property of firmly bonding. , High adhesion stability.
- the one used for exhibiting the temporary fixing property is the hydrolytic condensation polymerization of alkoxysilyl groups due to moisture in the air or moisture contained in the inorganic filler. Therefore, in the automotive adhesive of the present invention, the alkoxysilyl group-containing polymer (a) is contained as an essential component. Further, if the polymer (a) is contained in the adhesive, the adhesive layer becomes a cured product having a certain degree of elasticity even after the curing of the epoxy resin (d) is completed. The durability becomes very good.
- This alkoxysilyl group-containing polymer (a) needs to have at least one alkoxysilyl group in one molecule. It is preferable that there are two or more alkoxysilyl groups in terms of reactivity, and in this case, the adhesive layer can be given a temporary fixing property more quickly.
- the number of alkoxysilyl groups may be three or four, but if it exceeds five, storage stability may decrease and the vibration resistance of the cured adhesive layer may be insufficient.
- the alkoxysilyl group-containing polymer (a) includes an alkoxysilyl group-containing polymer. Any polymer can be used without particular limitation.
- the preferred main chain structure of the alkoxysilyl group-containing polymer (a) is a polyoxyalkylene structure represented by 1 (R- ⁇ ) n_.
- R is not limited to the following examples, but is an alkylene group such as an ethylene group, a propylene group, an isobutylene group, or a tetramethylene group. In addition, two or more of these alkylene groups may be mixed in one molecule.
- the molecular weight of the polymer (a) is preferably about 500 to 30,000 as a number average molecular weight (Mn) in view of reactivity and cured physical properties after the reaction.
- Mn number average molecular weight
- the more preferable Mn is 2,000 to 20,000 in consideration of the curing speed and vibration resistance due to appropriate elasticity of the adhesive cured layer.
- the alkoxysilyl group of the polymer (a) preferably has at least one of a dialkylmonoalkoxysilyl group, a monoalkyldialkoxysilyl group, 1, and a realkoxysilyl group.
- Alkoxy is not limited to the following examples, but includes methoxy, ethoxy, propoxy and the like.
- the most preferred alkoxysilyl group-containing polymer (a) contains both a monomethyldimethoxysilyl group and a trimethoxysilyl group, and the curing reaction proceeds rapidly due to moisture in the air, and the curing reaction takes about 3 minutes. The suspension can be completed.
- the alkoxysilyl group-containing polymer (a) may be a mixture of polymers (a) having various alkoxysilyl groups.
- An example of such a mixture is a mixture of a silicone polymer having a monomethyldimethoxysilyl group and a silicone polymer having a trimethoxysilyl group. This mixture can be preferably used, similarly to the alkoxysilyl group-containing polymer (a) containing both monomethyldimethoxysilyl groups and trimethoxysilyl groups.
- the mass ratio of the monomethyldimethoxysilyl group to the trimethoxysilyl group in the alkoxysilyl group-containing polymer (a) is 1 to 90:99 to 10 The degree is preferred.
- a polymer having a polyoxyalkylene structure as a main chain structure and having an alkoxysilyl group can be obtained by the following procedure.
- diols such as ethylene glycol and propylene glycol
- triols such as glycerin and hexantriol
- tetraols such as pentaerythritol and diglycerin
- polyols such as sorby!
- a method of introducing an alkoxysilyl group from a polyoxyalkylene polymer obtained by reacting an alkylene oxide or the like such as oxide with propylene oxide under known conditions is preferred.
- Preferred polyoxyalkylene polymers are: Considering the water resistance and physical properties of the cured adhesive, it is a di- to hexavalent polyoxypropylene polyol, especially polyoxypropylene diol and polyoxypropylene triol.
- the first method is to introduce an unsaturated double bond into a terminal hydroxyl group of a polyoxyalkylene polymer, and then proceed to the general formula HSi. (oR 1) 2 (R 2 ) and / or HS i (oR 1) 3 in (R 1 may be the same or different,.
- R 2 representing a hydrogen atom or an alkyl group having a carbon number of 1-5, is And represents an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 20 carbon atoms.).
- a compound having a functional group capable of reacting with an unsaturated double bond and a hydroxyl group is reacted with a hydroxy group of the polyoxyalkylene polymer to form an ether bond, an ester, or the like. Bonding, urethane bonding or carbonate bonding may be used.
- a double bond may be introduced into the side chain of the polyoxyalkylene polymer by adding and copolymerizing an epoxy compound having an aryl group such as arylglycidyl ether.
- an alkoxysilyl group-containing polymer ( a ) into which an alkoxysilyl group has been introduced is obtained.
- platinum, rhodium, cobalt, palladium and nickel catalysts are preferred.
- platinum-based catalysts such as chloroplatinic acid, platinum metal, platinum chloride, and platinum-olefin complexes are preferred.
- the reaction of the hydrosilyl compound is carried out at a temperature of 30 to 150 ° C from the viewpoint of the reactivity between the unsaturated double bond and the hydroxyl compound, particularly at the reaction rate of unsaturated double bond, reaction rate and unsaturated double bond. From the viewpoint of the reaction rate of the hydroxy compound, the reaction is preferably performed at a temperature of 60 to 120 ° C. for several hours.
- a second method for introducing an alkoxysilyl group into a polyoxyalkylene polymer is to use a compound represented by the general formula
- R 1 and R 2 have the same meanings as above.
- R 3 is This is a divalent hydrocarbon group having 1 to 17 carbon atoms.
- a known urethanation catalyst may be used.
- 20 to 200 ° C., and particularly considering the reaction rate and the reaction rate between the hydroxyl group and the isocyanate group 50 to 15 By reacting at a temperature of 0 ° C. for several hours, an alkoxysilyl group-containing polymer (a) can be obtained.
- a third method for introducing an alkoxysilyl group into a polyoxyalkylene polymer is to react a hydroxyl group of a boroalkylene alkylene polymer with a polyisocyanate compound such as tolylene diisocyanate to convert the isocyanate group.
- a polyisocyanate compound such as tolylene diisocyanate
- the general formula R 2 -S i (OR 1 ) 2 (R 3 W) and / or (R 3 W) S i (OR 1 ) 3 has the same meaning as above W represents a hydroxyl group, a carboxyl group, a mercapto group, a primary amino group and a secondary amino group. Active hydrogen group selected. ) Is a method of reacting the compound represented by
- an alkoxysilyl group-containing polymer (a) By reacting W with an isocyanate group, an alkoxysilyl group-containing polymer (a) can be obtained.
- polyisocyanate compound examples include, but are not limited to, aliphatic, alicyclic, araliphatic, aromatic diisocyanate compounds, and the like. Hereinafter, specific examples thereof will be described.
- Aliphatic diisocyanate compounds trimethylene diisocyanate, tetramethylene, 1,2-propylene diisocyanate, 1,2 diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate , 2,4,4 mono- or 2,2,4-trimethylhexamethylene diisocyanate, 2,6-diisocyanate methyl caproate and the like.
- Alicyclic diisocyanate compounds 1,3-cyclopentene diisocyanate, phanate, 3_isocyanetomethyl-3,5,5-trimethylcyclohexymethyl-2,4-cyclohexanediisocyanate, methyl 2,6 —Cyclohexanediisocyanate, 1,3-bis (isocyanatomethyl) cyclohexane, 1,4-bis (isocyanatemethyl) cyclohexane, isophorone diisocyanate, etc.
- Aroaliphatic diisocyanate compound 1,3- or 1,4-xylylene diisocyanate or a mixture thereof, ⁇ , ⁇ 'diisocyanate 1, 1, 4-getylbenzene, 1, 3 ⁇ ⁇ ⁇ ⁇ or 1, 4 bis (1 _ Isocyanate-1-methylethyl) benzene or a mixture thereof.
- Aromatic diisocyanate compounds m-phenylene diisocyanate, p-phenylene diisocyanate, 4,4 'diphenyl diisocyanate, 1,5,2,4,1 or 2,6 — Tolylenediocyanate, 4,4'-toluidine diisocyanate, 4,4'-diphenyl terdiisocyanate and the like.
- diisocyanate compounds diisocyanates containing a sulfur atom such as phenyldithiothionate.
- polyisocyanate compounds 2,4_ or 2,6_ tolylene diisocyanate, 4,4 'diphenylmethane diisocyanate, hexamethylene diisocyanate, 1, 3, 1 or 1, 4 _xylylenediisocyanate or a mixture thereof, isophorone diisocyanate, 1,3-bis (isosinetomethyl) cyclohexane, 1,4-bis (isocyanatomethyl) cyclohexane, 4,4'-Methylenebis (cyclohexyl isocyanate) is preferred.
- an aliphatic diisocyanate compound is used, a resin with little discoloration can be obtained.
- the compounds represented by the general formulas R 2 —S i (OR 1 ) 2 (R 3 W) and (R 3 W) S i (OR 1 ) 3 are not limited to the following examples.
- aminosilane compound examples include, but are not limited to, aminopropyltrimethoxysilane, aminopropyltriethoxysilane, aminopropylmethyldimethoxysilane, aminopropylmethylmethylamine, and the like.
- Aminosilane manufactured by Shin-Etsu Chemical Co., Ltd. trade name: ⁇ 6063, X-12-896, ⁇ 576, X-12-565, X-12-580, X-12-125263, ⁇ 6123, X-12-12 575, ⁇ _12—562, X-12-5202, X-12-5204, and 9703.
- aminosilane compounds from the viewpoint of easiness of reaction, wide availability on the market and easy availability, aminopropyl trimethoxysilane, aminopropyltriethoxysilane, and aminopropyl Methyldimethoxysilane, aminopropylmethylethoxysilane, N-jS (aminoethyl) aminopropyltrimethoxysilane, N- (aminoethyl) aminopropyltriethoxysilane, ⁇ _ ⁇ (Aminoethyl) monoaminopropylmethyldimethoxysilane is preferred.
- Examples of the ⁇ , j3-unsaturated carbonyl compound include, but are not limited to, (meth) acrylic compounds, vinyl ketone compounds, vinyl aldehyde compounds, and other compounds.
- (Meth) acrylic compounds include methyl (meth) acrylate, ethyl (meth) acrylate, 'propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl To (meth) acrylate, pentyl (meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethyl Xyl acrylate, nonyl (meth) acrylate, decyl (me
- trimethylolpropane tri (meth) acrylate Penyu erythritol (meth) acrylate, pentaerythritol tetra (meth) acrylate Rate, ethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol ( (Meth) acrylate, neopentyl glycol di (meth) acrylate, trimethylolpropanetrioxyethyl (meth) acrylate, tris (2-hydroxyethyl) isocyanurate tri (meth) acrylate, tris (2-) (Hydroxyethyl) isocyanurate di (meth) acrylate, tricyclodecane dimethanol di (meth) acrylate, epoxy (meth)
- ⁇ -methacryloxypropyltrimethoxysilane having an alkoxysilyl group ⁇ -methacryloxypropyltriethoxysilane, r-methacryloxymethyldimethoxysilane, ⁇ -methacryloxymethylethoxysilane, and ⁇ -acryloxy Propyltrimethoxysilane, acryloxymethyldimethoxysilane and the like.
- Vinyl ketone compounds include vinyl acetone, bierethyl ketone, vinyl butyl ketone, and the like; vinyl aldehyde compounds include acrolein, methacrylate, crotonaldehyde, and the like; and other compounds include maleic anhydride and itaconic anhydride.
- compounds containing a fluorine atom, a sulfur atom or a phosphorus atom therein are also included.
- Compounds containing a fluorine atom include perfluoroethyl (methyl) acrylate and trifluorethyl (meth) acrylate, and compounds containing a phosphorus atom include (meth) acryloxy Thiophenylacid phosphate and the like.
- methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, T-butyl acrylate, octyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate and the like are preferred.
- methyl acrylate and ethyl acrylate are particularly preferred for imparting rapid curability
- 2-ethylhexyl acrylate and lauryl acrylate are particularly preferred for imparting flexibility.
- the a, i3-unsaturated luponyl compound may be used alone or in combination of two or more.
- maleic acid diester examples include, but are not limited to, dimethyl maleate, getyl maleate, dibutyl maleate, di-2-ethylhexyl maleate, dioctyl maleate, and the like. Two or more types can be used. Among these, dimethyl maleate, getyl maleate, dibutyl maleate, and di-2-ethylhexyl maleate are preferred from the viewpoints of ease of reaction and widespread commercial availability. One or more maleic acid diesters can be used.
- Examples of the amine compound include a compound having only one or more primary amino groups in its molecule, and one or more primary amino groups and secondary amino groups in its molecule. And compounds having only one or more secondary amino groups in the molecule.
- Compounds having only one or more primary amino groups in the molecule are not limited to the following examples, but include, for example, propylamine, butylamine, isobutylamine, 2-butylamine, 1,2-dimethylpropylamine, Hexylamine, 2-ethylhexylamine, amylamine, 3-pentylamine, isoamylamine, 2-octylamine, 3-methoxypropylamine, 3-propoxypropylamine, 3-butoxypropylamine, 3-isobutoxypropylamine, Mono-amine compounds such as rosinamine, N-methyl-3,3'-iminobis (propylamine), ethylenediamine, diethylenetriamine, triethylenediamine, pentaethylenediamine, 1,4-diaminobutane, 1,2-diaminopropane , AT U (3,9-bis (3— Minopropyl) 1,2,4,8,10-tetraoxaspiro [5.5] pinde
- the compound having one or more primary amino groups and secondary amino groups in the molecule is not limited to the following examples, but includes, for example, methylaminopropylamine, ethylaminopropylamine, and aminoamine. Tylaminoethylamine, laurylaminopropylamine, 2-hydroxyethylaminopropylamine, 1- (2-aminoethyl) piperazine, N-aminopropylpiperazine and the like.
- Examples of compounds having only one or more secondary amino groups in the molecule include the following examples But not limited to, for example, piperazine, cis-1,6-dimethylpiperazine, cis-1,2,5-dimethylpiperazine, 2-methylpiperazine, N, ⁇ '-di-t-butylethylenediamine, 2-aminomethylpiperidine, 4-aminomethylpiperidine, 1,3-di (4-piperidyl) -propane, 4-aminopropylaniline, 3-aminopyrrolidine, homopidazine and the like.
- One or more amine compounds can be used.
- alkoxysilane compound having an unsaturated double bond examples are not limited to the following examples.
- methacryloxypropyl trimethoxysilane, ⁇ -methacryloxypropyltriethoxysilane, methacryloxymethyl In addition to dimethoxysilane, r-methacryloxymethyljetoxysilane, acryloxypropyl trimethoxysilane, and ⁇ -acryloxymethyldimethylmethoxysilane, Shin-Etsu Chemical's brand name: KBM503P etc. No.
- One or more alkoxysilane compounds having an unsaturated double bond can be used.
- a method of introducing an isocyanate group into the polyol compound by the third method and a method in which the introduced isocyanate group and the general formula R 2 —S i (OR 1 ) 2 (R 3 W) and / or (R 3 W) S i
- a known urethanation catalyst may be used.
- the reaction is carried out at a temperature of 50 to 150 ° C for several hours, considering the reaction rate and the reaction rate between the active hydrogen group and the isocyanate group, especially considering the reaction rate and the reaction rate, An alkoxyl group-containing polymer (a) can be obtained.
- a polyol compound may be reacted with a compound obtained by reacting a compound having a secondary amino group in the molecule with a diisocyanate compound.
- the alkoxysilane compound having a secondary amino group in the molecule is not limited to the following examples.For example, an aminosilane compound and an ⁇ , / 3-unsaturated carbonyl And a reaction product of an amine compound and an alkoxysilane compound having an unsaturated double bond, and the like. These Michael addition reactions may be performed at ⁇ 20 to 115 ° C. for 1 to 1000 hours.
- a known urethane-forming catalyst may be used for the reaction between the alkoxysilane compound having a secondary amino group in the molecule and the polyisocyanate compound, and the reaction between the reaction product and the polyol compound.
- the compound in which W in the third method is a mercapto group is reacted.
- a polymerization initiator such as a radical generator may be used. In some cases, the reaction may be performed by radiation or heat without using a polymerization initiator.
- polymerization initiator examples include peroxide-based, azo-based, and redox-based polymerization initiators, metal compound catalysts, and the like.
- a polymerization initiator having a group can also be used. Specific examples include benzoyl peroxide, tei't-alkyl peroxy ester, acetyl peroxide, diisopropyl peroxy carbonate, 2,2'-azobis (2-isobutyronitrile), 2,2'-azobis ( 2-methylbutyronitrile), 2,2'-azobis (2-methyl-4-trimethoxysilylpentonitrile), 2,2'-azobis (2-methyl-4-methyldimethoxysilylpentonitrile), etc. No.
- the reaction is performed at a temperature of 20 to 200 ° C., particularly, the reaction rate and the reaction rate between the unsaturated double bond and the mercapto group. Considering this, it is preferable to perform the reaction at 50 to 150 ° C for several hours to several tens of hours.
- the polymer (a) having a polyoxyalkylene structure as a main chain structure and having an alkoxysilyl group a polymer commercially available as a modified silicone polymer may be used.
- a polymer commercially available as a modified silicone polymer may be used.
- monomethyldimethoxysilyl having a terminal structure of monomethyldimethoxysilyl The base product name "Syril SAT200" (manufactured by Kanegafuchi Chemical Co., Ltd.) is available.
- the adhesive of the present invention contains a curing catalyst (b) for an alkoxysilyl group-containing polymer.
- the cured tfe medium (b) plays a role in promoting the hydrolysis-condensation polymerization of the alkoxysilyl group.
- the curing catalyst (b) is preferably used in an amount of 0.01 to 0.5 parts by mass based on 100 parts by mass of the alkoxysilyl group-containing polymer (a) of the automotive adhesive.
- organotin compound examples include, but are not limited to, the following examples: Examples include tin diversate, dibutyltin oxide, and a reaction product of dibutyltin oxide and a phthalic acid diester.
- the metal complex is not limited to the following examples.
- titanate compounds such as tetrabutyl titanate, tetraisopropyl titanate, and triethanolamine titanate
- Metal carboxylate such as cobaltate, bismuth octoate, bismuth versatate
- aluminum acetyl acetonate complex vanadium acetyla Metal acetyl acetonate complexes such as cetonate complexes are exemplified.
- Examples of the basic compound include, but are not limited to, aminosilanes such as aminopropyltrimethoxysilane and aminopropyltriethoxysilane; tetramethylammonium chloride and benzalkonium chloride.
- Quaternary ammonium salts such as "DABC0 (registered trademark)” series manufactured by Sankyo Air Products Co., Ltd., "DABC0 BLJ series” manufactured by Sankyo Air Products Co., Ltd. 1,8-one diazabisik mouth L 5.4.0]
- DABC0 registered trademark
- DABC0 BLJ series manufactured by Sankyo Air Products Co., Ltd. 1,8-one diazabisik mouth L 5.4.0
- the organic phosphorus compound is not limited to the following examples, but includes, for example, monomethyl phosphoric acid, di-n-butyl phosphoric acid, triphenyl phosphate and the like.
- the adhesive of the present invention contains a vinyl polymer (c) as an essential component.
- the vinyl polymer (c) has an action to promote the hydrolysis-condensation polymerization of the alkoxysilyl group, although the reason is not clear.
- the monomer forming the vinyl polymer (c) is not limited to the following examples, but includes, for example, (meth) acrylic acid; methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (Meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, n-hexyl (meta) ) Acrylate, 2-ethylhexyl (meth) acrylate, dodecyl (meth) acrylate, tetradecyl (meth) acrylate, hexadecyl (meth) acrylate, octadecyl (meth) acrylate, etc.
- (Meth) acrylates which are alkyl esters; cyclohexyl (meth) acrylate, Njiru (meth) Akurireto, phenyl (meth) Akurireto, Isoponiru (meth) Akurireto, dimethylaminoethyl (meth) Akurire Bok, t er t-butyl aminoethyl (meth) ⁇ click Relate, glycidyl (meth) acrylate, tetrahydrofuran (meth) acrylate, aryl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, 2-hydroxy-3-phenoxy Propyl (meth) acrylate, trimethylolpropane tri (meth) acrylate, trifluoroethyl (meth) acrylate, trade names “M_110” and “M—111” manufactured by Toagose
- a monomer having a glass transition temperature Tg of the homopolymer of 0 to 200 ° C examples include, but are not limited to, methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, sec Monobutyl methacrylate, tert-butyl methacrylate, n-hexadecyl methacrylate, n-octadecyl methacrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth) acrylate, Isobornyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, tert-butylamino
- two or more of these are used in combination in consideration of the adjustment of T g and physical properties.
- (Meth) acrylate copolymer refers to the mitigation and absorption of the impact of the vehicle mirror mounting portion against the body vibration during the vehicle running, and the adhesive stability of the vehicle mirror mounting portion.
- an alkoxysilyl group-containing polymer Monomers can also be used.
- examples of such monomers include, but are not limited to, vinyl methyl dimethoxy silane, bier methyl ethoxy silane, vinyl trimethoxy silane, tris (2-methoxyethoxy) vinyl silane, and 3- (meth) acryloyl Xypropylmethyldimethoxysilane and 3- (methyl) acryloyloxypropyltrimethoxysilane.
- 3- (meth) acryloyloxypropylmethyldimethoxysilane and 3- (meth) acryloyloxypropyltrimethoxysilane are preferred in consideration of the reactivity with other vinyl monomers.
- These alkoxysilyl-containing monomers are preferably used in combination with the above-mentioned monomers from the viewpoint of controlling the physical properties of the cured adhesive layer. Further, it is preferable that the alkoxysilyl group-containing monomer be 0.01 to 10% by mass in 100 parts by mass of the monomer component for synthesizing the vinyl polymer (c). If the amount is less than 0.01% by mass, sufficient control of physical properties tends to be impossible. If the amount is more than 10% by mass, the cured adhesive layer tends to be hard.
- the biel polymer (c) can be obtained by polymerizing the above monomer by a known method such as radical polymerization, anion polymerization, and cationic polymerization. This polymerization may be carried out in the presence of a solvent such as xylene, toluene, acetone, methyl ethyl ketone, ethyl acetate, butyl acetate and the like. After these solvents are removed by a method such as distillation under reduced pressure as necessary after the polymerization, the polymer (c) may be mixed with, for example, an alkoxysilyl group-containing polymer (a) or an epoxy resin (d).
- a solvent such as xylene, toluene, acetone, methyl ethyl ketone, ethyl acetate, butyl acetate and the like.
- the method of polymerizing the monomer component for the biel-based polymer (c) in the presence of the alkoxysilyl group-containing polymer (a) can easily form a mixture of both. Recommended to be obtained.
- the polymerization method from the viewpoint of controlling the molecular weight of the vinyl polymer, in particular, 2,2′-azobis (2-isobutyronitrile), 2,2,1-azobis (2- 2,2'-azobis (2,4-dimethylvaleronitrile), 2,2'-azobis (2-methyl-4-trimethoxysilylpentonitrile), 2,2'-azobis (2 —Methyl_4—Methyldimethoxysilyl bentonitrile), trade names “VA—046B”, “VA—057”, “VA-061”, “VA-065”, “VA-085”, “VA_086” manufactured by Wako Pure Chemical Industries, Ltd.
- Azo-based polymerization initiators such as “VA-096”, “V-601”, “V-65J” and “VAm-110”, benzoyl peroxide, tert-alkyl peroxyester, acetyl benzooxide, diisopropyl
- a radical polymerization method carried out in the presence of a peroxide-based polymerization initiator such as peroxycarbonate is preferred.
- the polymerization may be carried out in the presence of a chain transfer agent such as monobutyl mercaptan and arterimethoxysilyl propyl disulfide.
- modified silicone polymer which is a mixture of an alkoxysilyl group-containing polymer (a) and a Biel polymer (c), is available from “ES-GX3406a” (manufactured by Asahi Glass Co., Ltd.), “Silyl MA440” and “Silyl MA447”. , “Syril MA430J (all manufactured by Kaneka Chemical Co., Ltd.) and the like, and these can also be used.
- the adhesive of the present invention contains an epoxy resin (d) and an epoxy curing agent (e). Since the epoxy resin (d) is three-dimensionally cured by the epoxy curing agent (e), the epoxy resin (d) has a role of increasing the adhesive strength of the adhesive layer to the heat-resistant member.
- the epoxy resin (e) examples include, but are not limited to, a known bisphenol-type epoxy resin; a biphenyl-type epoxy resin; an alicyclic epoxy resin; and a polyfunctional daricidylamine resin such as tetradaricidylaminodiphenylmethane. Fats; polyfunctional daricidyl ether resins such as tetraphenyldaricidyl ether ethane; phenol nopolak epoxy resins and cresol nopolak epoxy resins.
- Various grades of epoxy resins are commercially available, and these can be used. From the viewpoint of workability, a bisphenol A type liquid resin having a molecular weight of about 300 to 500 and being liquid at room temperature is preferable.
- the epoxy curing agent (e) is not particularly limited as long as it is a commonly used curing agent. Examples thereof include triethylenetetramine, diethylenetriamine, metaxylylenediamine, metaphenylenediamine, diaminodiphenylmethane, isophoronediamine, and the like. Amines such as 2,4,6-tris (dimethylaminomethyl) phenol; tertiary amine salts; polyamide resins; imidazoles; and compounds such as carboxylic anhydrides such as phthalic anhydride can be used. In particular, since the automotive adhesive of the present invention is usually used at room temperature, it is preferable to use an aliphatic amine-based curing agent having a fast curing reaction.
- a latent curing agent such as ketimine, which is activated by amine in which active amine is blocked and activated by moisture in the air, may be used.
- the epoxy curing agent (e) is preferably used in an amount of 0.1 to 300 parts by mass with respect to 100 parts by mass of the epoxy resin (d).
- the adhesive of the present invention contains an inorganic filler (f).
- the inorganic filler adjusts the viscosity and the structural viscosity index of the adhesive before curing, prevents inconvenience such as sagging, and provides temporary tackiness quickly. In addition to acting as a bulking agent, it acts as a reinforcing agent to increase the strength and heat resistance of the cured adhesive layer.
- the inorganic filler (f) is not limited to the following examples, but is preferably, for example, a powdered material such as calcium carbonate, silica, titanium dioxide, talc, and myc. Examples of the calcium carbonate include colloidal calcium carbonate and heavy calcium carbonate, and any of them can be used.
- the adhesive of the present invention has a viscosity immediately after mixing the components (a) to (f) for 30 seconds, It must be 100-700 Pa ⁇ s at 23 ° C.
- the reason for setting immediately after mixing is that the curing is quickly started due to moisture in the air and moisture contained in the inorganic filler. If the viscosity is less than 100 Pa ⁇ s, inconveniences such as sagging and protrusion will occur, and it will take time to develop the temporary fixing property. If it exceeds 700 Pa ⁇ s, the viscosity is too high and the mixing workability and the coating workability are deteriorated. Viscosity is measured at 23 ° C, 40-60% RH (relative humidity) using a No. 7 rotor with a rotational viscometer at a rotational speed of l Orpm according to JISK 6833. Value.
- the adhesive of the present invention must have a structural viscosity index of 2.0 to 4.0 immediately after all of the components (a) to (f) are mixed.
- the structural viscosity index is a value (XZ Y) obtained by dividing a viscosity value X at a rotation speed of 2 rpm by a viscosity value Y at a rotation speed of 10 rpm.
- the viscosity measurement conditions are the same as above except for the number of rotations. If the structural viscosity index is less than 2.0, the temporary fixing property is not exhibited, and sagging occurs when the adhesive layer is made vertical, which is not preferable. If it exceeds 4.0, it is not preferable because of poor coating workability.
- the adhesive of the present invention essentially contains the components (a) to (f) described above.
- the adhesive containing the alkoxysilyl group-containing polymer (a ) With respect to 100 parts by mass, the amount of the Biel polymer (c) is 1 to 200 parts by mass, the amount of the epoxy resin (d) is 30 to 70 parts by mass, and the amount of the inorganic filler (f) is 10 to 300 parts by mass. Adjustment is preferred. If the amount of the vinyl-based polymer (c) is too small, the action of accelerating the hydrolysis-condensation polymerization of the alkoxysilyl group is not exhibited.
- the amount of the alkoxysilyl-containing polymer (a) is obtained. May be hindered. If the amount of the epoxy resin (d) is too small, the final adhesive strength, heat resistance and chemical resistance of the cured adhesive layer may be insufficient, but if it is too large, the vibration resistance may be reduced. Low inorganic filler ( ⁇ ) If the amount is not too high, the viscosity and the structural viscosity index of the adhesive before curing may be lower than the values intended in the present invention, which may cause inconveniences such as sagging.
- the curing reaction of the alkoxysilyl group-containing polymer (a) starts with moisture in the air of the present invention, it is preferable to mix the components immediately before use. In mixing, it is preferable to avoid contact with moisture in the air in order to obtain a stable curing speed regardless of the external environment. For example, it is recommended that mixing be performed by shutting off the air using a static mixer.
- the two-part adhesive is divided into agent A and agent B, for example, the alkoxysilyl group-containing polymer (a) is used as agent A, the alkoxysilyl group-containing polymer curing catalyst (b) is used as agent B, and By mixing the epoxy resin (d) with the B agent and the epoxy curing agent (e) with the A agent separately, the pot life is prolonged.
- the vinyl polymer (c) is commercially available in a form mixed with the alkoxysilyl group-containing polymer (a), the vinyl polymer (c) is included in the agent A.
- the vinyl polymer (c) may be separately synthesized and blended with the agent B.
- the inorganic filler (f) may be blended with either the A agent or the B agent, or may be blended with both the A agent and the B agent. It is preferable to mix both the A agent and the B agent so that the A agent and the B agent have the same viscosity.
- known mixing means such as a planetary mixer can be employed.
- a latent curing agent is used as the epoxy curing agent (e), and each component is protected from the influence of moisture. After mixing, store in a sealed container that can block out moisture.
- Ketimine and enamine are easily decomposed by water to the original amine compound and ketone or aldehyde, and provide an effect as an epoxy curing agent.
- a preferable compound is norbornane difif, in consideration of physical property adjustment and durability of the present invention.
- the adhesive of the present invention may contain, if necessary, known additives and reinforcing agents such as an ultraviolet absorber, an ultraviolet stabilizer, an adhesive, an pigment, a fibrous reinforcing agent, and hollow fine particles. .
- the method of using the adhesive of the present invention it is only necessary to apply an appropriate amount of the adhesive to the adherend and press the member against the member. Any known coating method can be adopted.
- the amount of application can be appropriately changed according to the mass and shape of the member to be attached to the glass.
- a bracket for mounting an inner mirror a metal weight of 39 g
- the adhesive curing reaction of the epoxy resin After about 10 to 20 hours, the adhesive curing reaction of the epoxy resin is completed, and it has a very strong adhesive strength, and also has vibration resistance, durability, weather resistance, impact resistance, water resistance, and heat resistance. An adhesive cured layer having excellent properties such as properties is formed. Since the adhesive of the present invention can achieve both the temporary fixing property and the strong adhesive property, the primer treatment and post-treatment are not particularly required, but post-treatment such as heating and humidification may be appropriately performed.
- the adhesive of the present invention can be used not only for attaching a metal or resin bracket for attaching an inner mirror to an automobile glass, but also for forming members such as a molding, a protector, a positioning reference pin, a hinge, and a sensor attaching bracket.
- the car glass It is suitable for use in direct glazing for attaching glass to the vehicle body, bonding outer and inner parts such as ponnets, doors and back trims, and bonding reinforcing agents for bonnets, doors and roofs. Can be.
- An adhesive (trade name “Pond MO”) containing a modified silicone polymer having a terminal structure of monomethyldimethoxysilyl group (trade name “Silyl SAT 200”; manufactured by Kaneka Chemical Industry Co., Ltd.) and 5% of an amine-based epoxy curing agent.
- S 1 OA agent 100 parts, manufactured by Konishi Co., Ltd., about 23% of a vinyl polymer (acrylonitrile / styrene copolymer), and a modified silicone polymer having a trimethoxysilyl group terminal structure (trade name “ES — GX 3 4 6 a ”; Asahi Glass Co., Ltd.) 30 parts, Colloidal Calcium Carbonate (trade name“ White Inuhua CC—R ”; Shiraishi Industry Co., Ltd.) 6 5 parts, heavy calcium carbonate (trade name“ NS 4 [00]; Nitto Powder Chemical Co., Ltd.) 30 parts were mixed with a planetary mixer to obtain agent A of a two-part adhesive.
- a vinyl polymer acrylonitrile / styrene copolymer
- a modified silicone polymer having a trimethoxysilyl group terminal structure trade name “ES — GX 3 4 6 a ”; Asahi Glass Co., Ltd.) 30
- an adhesive (trade name "Pond MOS 100B Agent; Konishi Co., Ltd.") comprising 4% of a catalyst for an organotin compound-based alkoxysilyl group-containing polymer in a bisphenol-type epoxy resin, 50 parts of colloidal calcium carbonate (trade name "Hiroihana CC-I”; manufactured by Shiraishi Industry Co., Ltd.), heavy calcium carbonate (trade name "NS 400”; manufactured by Nitto Powder Chemical Co., Ltd.) 2 5 parts of planetary mixer And mixed to obtain the B agent.
- the adhesive of the present invention was obtained by mixing 100 parts of the A agent and 50 parts of the B agent.
- the viscosity, structural viscosity index, shear resistance, and tack-free properties were measured under the following conditions, and are shown in Table 1.
- Agent A and Agent B obtained in each case were mixed thoroughly by hand using a spatula at the mixing ratio shown in Table 1 for 30 seconds, at 23 ° C and 40-60% RH atmosphere according to JISK 6833.
- the value was measured with a rotational viscometer (BS model manufactured by T0KIMEC) using a No. 7 mouthpiece at a rotation speed of 10 rpm.
- the agent A and the agent B obtained in each case were mixed for 30 seconds in the mixing ratio shown in Table 1, and according to JISK 6833, in a 23 ° (:, 40-60% RH atmosphere, a rotational viscometer (Tokimek) Using a No. 7 rotor, the viscosity value X at a rotation speed of 2 rpm and the viscosity value Y at a rotation speed of 10 rpm were measured using a No. 7 rotor, and the viscosity value X was divided by the viscosity value Y. Value (XZY).
- the A agent and the B agent obtained in each example were thoroughly mixed by hand with a spatula for 30 seconds at the compounding ratio shown in Table 1, and 39 g of powder was mixed.
- the A and B agents obtained in each example were mixed thoroughly by hand with a spatula at the mixing ratio shown in Table 1 for 30 seconds, and the diameter was 5 Om. m and a depth of 1 Omm were filled into a polyethylene container to smooth the surface. J According to ISA 14439, the time (minutes) until the adhesive did not adhere to the finger when the surface was touched with the finger was measured.
- Silyl MA440 manufactured by Kanegafuchi Chemical Industry Co., Ltd.
- Example 2 is a trade name of a modified silicone polymer containing a vinyl polymer and having a terminal structure of a monomethyldimethoxysilyl group.
- Table 1 shows the evaluation results of Examples 1 and 2 and Comparative Examples 1 and 2.
- MOS 10A 100 100 100 100 100 100 100
- Example 1 of the present invention a modified silicone polymer having a terminal structure of a methyldimethoxysilyl group and a polymer (ES-GX3406a) containing a vinyl-based polymer and having a trimethoxysilyl group at its terminal structure were used. The mixture was mixed and used as an alkoxysilyl group-containing polymer and a Bier-based polymer.
- a modified silicone polymer having a terminal structure of methyldimethoxysilyl group was mixed with a polymer containing a vinyl polymer and having a terminal structure of methyldimethoxysilyl group (Silyl MA440). Although the alkoxysilyl group-containing polymer had a composition of only a methyldimethoxysilyl group-containing polymer, it exhibited good misalignment resistance due to adjustment of viscosity and structural viscosity index.
- Comparative Example 1 since the polymer (ES-GX3406a) containing a Bier-based polymer and having a trimethoxysilyl terminal structure was used, the tack-free property was good, but the structural viscosity index was high. However, since the temperature did not reach the range defined in the present invention, a significant shift occurred. In Comparative Example 2, it was found that the vinyl polymer was not contained, the tack-free property was poor, and the primary curing reaction was slow. As a result, the displacement resistance was also poor.
- urethane resin (I) 500 g is placed in a reactor and heated to 100 ° C under a nitrogen atmosphere, and 250 g of methyl methacrylate, 250 g of n-lauryl methacrylate, KBM503 (trade name: Shin-Etsu Chemical Co., Ltd.) 5g of KBM803 (trade name: Amercaptoprovir trimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd.), 5g of lauryl mercaptan as a chain transfer agent
- a mixed solution obtained by mixing azobisisobutyronitrile at a ratio of 5 g as a polymerization initiator was added dropwise over 5 hours, and further reacted at 100 ° C for 2 hours to obtain a vinyl-based compound containing a trimethoxysilyl group.
- the adhesive of the present invention has a quick-curing property, and does not cause inconvenience such as sagging and displacement even when the adhesive layer is in a vertical state at a level of 1 to 5 minutes.
- the final cured adhesive layer is excellent in vibration resistance, durability, weather resistance, impact resistance, water resistance, heat resistance, etc., and adheres firmly to the member. Therefore, it is useful as an adhesive for automobiles, and particularly extremely useful as an adhesive for attaching an inner mirror mounting bracket to front glass.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-7011715A KR20040030529A (ko) | 2001-03-08 | 2002-03-01 | 자동차용 접착제 |
US10/471,326 US20040092640A1 (en) | 2001-03-08 | 2002-03-01 | Automotive adhesive |
EP02701685A EP1380625A4 (en) | 2001-03-08 | 2002-03-01 | AUTOMOTIVE ADHESIVE |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001065524A JP2002265922A (ja) | 2001-03-08 | 2001-03-08 | 自動車ガラス用接着剤 |
JP2001-65524 | 2001-03-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002072724A1 true WO2002072724A1 (fr) | 2002-09-19 |
Family
ID=18924152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/001932 WO2002072724A1 (fr) | 2001-03-08 | 2002-03-01 | Produit adhesif pour l'industrie automobile |
Country Status (6)
Country | Link |
---|---|
US (1) | US20040092640A1 (ja) |
EP (1) | EP1380625A4 (ja) |
JP (1) | JP2002265922A (ja) |
KR (1) | KR20040030529A (ja) |
CN (1) | CN1262619C (ja) |
WO (1) | WO2002072724A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2863624A1 (fr) * | 2003-12-11 | 2005-06-17 | Bostik Findley | Compositions adhesives recticulables a l'humidite |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6649016B2 (en) * | 2002-03-04 | 2003-11-18 | Dow Global Technologies Inc. | Silane functional adhesive composition and method of bonding a window to a substrate without a primer |
US8051607B2 (en) * | 2005-11-09 | 2011-11-08 | Toyoda Gosei Co., Ltd. | Weather strip and manufacturing method thereof |
DE102006006382A1 (de) * | 2006-02-11 | 2007-08-16 | Richard Fritz Gmbh + Co. Kg | Mittel zum Verbinden zweier Teile |
JP5232446B2 (ja) * | 2007-11-14 | 2013-07-10 | 株式会社カネカ | 反応性ケイ素基を有する有機重合体を含む組成物 |
US8414987B2 (en) | 2008-12-12 | 2013-04-09 | Great Eastern Resins Industrial Co., Ltd. | Primer composition for cured silicon-containing surface and its uses |
TWI346585B (en) * | 2008-12-12 | 2011-08-11 | Great Eastern Resins Ind Co Ltd | Primer composition for cured silicon-containing surface and its uses |
FR2969638B1 (fr) * | 2010-12-22 | 2014-05-02 | Bostik Sa | Composition adhesive et procede correspondant de pose de parquet a stabilite dimensionnelle amelioree |
EP2570450A1 (de) * | 2011-09-14 | 2013-03-20 | Sika Technology AG | Formgedächtnis-Material auf Basis eines Strukturklebstoffs |
US9333534B2 (en) | 2011-10-27 | 2016-05-10 | Hewlett-Packard Indigo B.V. | Method of forming a release layer |
JP2016502565A (ja) * | 2012-10-19 | 2016-01-28 | ダウ グローバル テクノロジーズ エルエルシー | シラン変性ポリマー、エポキシ樹脂および硬化触媒の組成物ならびにこの組成物を含むポリマーコンクリート |
CN103450833A (zh) * | 2013-08-05 | 2013-12-18 | 天津静达保光汽车零部件有限公司 | 汽车车身结构胶黏剂及其制作方法 |
DE102013216787A1 (de) | 2013-08-23 | 2015-02-26 | Evonik Degussa Gmbh | Guanidingruppen aufweisende semi-organische Siliciumgruppen enthaltende Verbindungen |
CN104312513B (zh) * | 2014-11-17 | 2016-08-24 | 南京艾布纳密封技术股份有限公司 | 一种双组分环氧电子灌封硅胶 |
CN105838317B (zh) * | 2016-04-27 | 2018-07-10 | 勃乐氏密封系统(太仓)有限公司 | 一种高性能单组分脱醇型室温硫化硅橡胶密封胶及其制备方法 |
EP3275913B1 (en) * | 2016-07-28 | 2021-11-10 | 3M Innovative Properties Company | High performance epoxy adhesive compositions |
EP3529328B1 (en) * | 2016-10-24 | 2020-06-24 | Dow Global Technologies LLC | Epoxy adhesive resistant to open bead humidity exposure |
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EP0370531A2 (en) * | 1988-11-25 | 1990-05-30 | Kanegafuchi Chemical Industry Co., Ltd. | Two pack type curable composition comprising epoxy resin and silicon-containing elastomeric polymer |
EP0370463A2 (en) * | 1988-11-21 | 1990-05-30 | Kanegafuchi Chemical Industry Co., Ltd. | Two pack type curable composition comprising epoxy resin and silicon-containing elastomeric polymer |
JPH05148469A (ja) * | 1991-11-29 | 1993-06-15 | Sekisui Chem Co Ltd | 接着剤組成物 |
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JP2000053935A (ja) * | 1998-08-07 | 2000-02-22 | Toagosei Co Ltd | 二液型エポキシ系接着剤 |
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CA1235245A (en) * | 1984-12-26 | 1988-04-12 | Toshifumi Hirose | Curable resinous composition comprising epoxy resin and silicon-containing elastomeric polymer |
DE60043697D1 (de) * | 1999-03-23 | 2010-03-04 | Kaneka Corp | Härtbare harzzusammensetzungen |
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2001
- 2001-03-08 JP JP2001065524A patent/JP2002265922A/ja active Pending
-
2002
- 2002-03-01 EP EP02701685A patent/EP1380625A4/en not_active Withdrawn
- 2002-03-01 KR KR10-2003-7011715A patent/KR20040030529A/ko not_active Application Discontinuation
- 2002-03-01 WO PCT/JP2002/001932 patent/WO2002072724A1/ja active Application Filing
- 2002-03-01 CN CNB028061179A patent/CN1262619C/zh not_active Expired - Lifetime
- 2002-03-01 US US10/471,326 patent/US20040092640A1/en not_active Abandoned
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EP0370463A2 (en) * | 1988-11-21 | 1990-05-30 | Kanegafuchi Chemical Industry Co., Ltd. | Two pack type curable composition comprising epoxy resin and silicon-containing elastomeric polymer |
EP0370531A2 (en) * | 1988-11-25 | 1990-05-30 | Kanegafuchi Chemical Industry Co., Ltd. | Two pack type curable composition comprising epoxy resin and silicon-containing elastomeric polymer |
JPH05148469A (ja) * | 1991-11-29 | 1993-06-15 | Sekisui Chem Co Ltd | 接着剤組成物 |
JPH05287256A (ja) * | 1992-04-13 | 1993-11-02 | Sekisui Chem Co Ltd | 接着剤組成物 |
JPH061826A (ja) * | 1992-04-23 | 1994-01-11 | Sekisui Chem Co Ltd | 接着剤組成物 |
JPH073159A (ja) * | 1993-06-15 | 1995-01-06 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノポリシロキサン組成物 |
JPH11323297A (ja) * | 1998-05-13 | 1999-11-26 | Sekisui Chem Co Ltd | 接着剤組成物 |
JP2000053935A (ja) * | 1998-08-07 | 2000-02-22 | Toagosei Co Ltd | 二液型エポキシ系接着剤 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2863624A1 (fr) * | 2003-12-11 | 2005-06-17 | Bostik Findley | Compositions adhesives recticulables a l'humidite |
WO2005066283A1 (fr) * | 2003-12-11 | 2005-07-21 | Bostik S.A. | Compositions adhesives reticulables a l’humidite |
US8158723B2 (en) | 2003-12-11 | 2012-04-17 | Bostik, S.A. | Moisture cross-linkable adhesive compositions |
Also Published As
Publication number | Publication date |
---|---|
KR20040030529A (ko) | 2004-04-09 |
CN1496394A (zh) | 2004-05-12 |
CN1262619C (zh) | 2006-07-05 |
JP2002265922A (ja) | 2002-09-18 |
US20040092640A1 (en) | 2004-05-13 |
EP1380625A1 (en) | 2004-01-14 |
EP1380625A4 (en) | 2004-05-19 |
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