WO2002069399A1 - Super-thin high speed flip chip package - Google Patents

Super-thin high speed flip chip package Download PDF

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Publication number
WO2002069399A1
WO2002069399A1 PCT/US2002/005593 US0205593W WO02069399A1 WO 2002069399 A1 WO2002069399 A1 WO 2002069399A1 US 0205593 W US0205593 W US 0205593W WO 02069399 A1 WO02069399 A1 WO 02069399A1
Authority
WO
WIPO (PCT)
Prior art keywords
die
package
substrate
interconnect
bumps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2002/005593
Other languages
English (en)
French (fr)
Inventor
Rajendra Pendse
Samuel Tam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ChipPac Inc
Original Assignee
ChipPac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ChipPac Inc filed Critical ChipPac Inc
Priority to JP2002568423A priority Critical patent/JP2004523121A/ja
Priority to KR10-2003-7011122A priority patent/KR20040030509A/ko
Priority to EP02721143A priority patent/EP1371094A4/en
Publication of WO2002069399A1 publication Critical patent/WO2002069399A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/216—Waveguides, e.g. strip lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • Chip packages for housing integrated circuit die are in increasing demand in applications such as hand-held or portable electronics and in miniaturized storage devices such as disk drives. In many such applications there is a need for such packages to operate at very high frequencies, typically in excess of 1 GHz, to fulfill the needs of analog or RF devices and of fast memories used in cellular phones.
  • So-called "chip scale packages” are in common use in such applications. Chip scale packages conventionally employ wire bonding as the means for interconnection between the integrated circuit die and the substrate. It is desirable to minimize the thickness of chip scale packages, to the extent practicable. Chip scale packages with wire bond interconnect having an overall package height in the range of 0.6 - 0.8 mm have been produced.
  • wire bonding interconnection employs wire loops of finite height (imposing lower limits on size in the "Z” direction) and span (imposing lower limits on size in the "X” and “Y” directions), running from bond pads at the upper surface of the die, up and then across and down to bond sites on the upper surface of the substrate onto which the die is attached. The loops are then enclosed with a protective encapsulating material. The wire loops and encapsulation typically contribute about 0.2 - 0.4 mm to the package thickness. Second, as these packages are made thinner, the "second level interconnections" between the package and the printed circuit board are less reliable.
  • second level interconnections that lie under the "shadow" of the die are most adversely affected.
  • improvement of electrical performance presents significant challenges, for at least two reasons. First, it is difficult to reduce the signal path length, because the wire bonds themselves typically have a typical length about 1.0 mm. Second, the structure of the package necessitates "wrap-around" routing of conductive traces; that is, the traces have to fan outward to vias, and then run back inward to the solder ball locations. [0006] A package structure is desired that circumvents the above obstacles and provides for further package miniaturization and improved high-speed operation.
  • a chip package achieves miniaturization and excellent highspeed operation by employing flip chip interconnection between the die and the package substrate, and mounting the chip on the same side of the package substrate as the solder balls for the second level interconnection to the printed circuit board.
  • the invention features a chip scale integrated circuit chip package including a die mounted by flip chip interconnection to a first surface of a package substrate, and having second level interconnections formed on the first surface of the package substrate.
  • the die is provided with interconnection bumps affixed to an arrangement of connection sites in a first surface of the die, and the flip chip interconnection is made by apposing the first surface of the die with the first surface of the package substrate and bringing the interconnect bumps into contact with a complementary arrangement of interconnect pads on the first surface of the substrate under conditions that promote bonding of the bumps on the pads.
  • the interconnect bumps provide a thin gap between the die and the substrate, and this gap may be at least partly filled with a die attach material (such as a die attach epoxy).
  • the combined thickness of the die and the gap is less than the gap provided by the solder ball interconnections between the substrate and the printed circuit board, so that the effective die thickness is accommodated within the second level interconnect gap, and contributes nothing to the overall package thickness ("Z" direction miniaturization).
  • connection of the interconnect bumps and the pads is a solid state connection, made by applying heat and mechanical force to deform the bumps against the pads without melting either mating surface. Such solid state bonds can provide for finer interconnect geometries than can be obtained using melt-bond connection.
  • the die is attached at about the center of the substrate, and the solder balls for the second level interconnections are located nearer the periphery of the substrate.
  • the electrical traces are formed within an interconnect layer in the first surface of the package substrate, and the traces fan outward from the interconnect pads to the solder ball attachment sites.
  • the signal path is minimized by significant reduction of total trace lengths, both by elimination of wire bonds and by elimination of wraparound routing of traces.
  • a ground plane is optionally provided on the second surface of the substrate, and connected to the second level interconnect balls and/or to the interconnect traces through one or more vias in the substrate. Such a ground plane need not be provided with any "keep out" areas, and can be an uninterrupted ground plane structure over the entire second surface. Such a ground plane configuration can provide superior electrical performance, approaching that of micro strip transmission lines.
  • at least some of the traces are constructed as coplanar waveguides, in which ground lines are formed to run alongside the signal line on a planar dielectric material.
  • a second die is attached to the substrate, on the surface opposite the first one, and is connected through vias to the second level interconnects and/ or to the first die traces.
  • the second die may be attached by conventional wire bonding.
  • the second die may be attached by a flip-chip interconnect. Because the flip chip configuration can be made with less height than the wire bond configuration, this embodiment provides a still thinner two-die package.
  • Fig. 1 is a diagrammatic sketch in a sectional view of a conventional chip scale package having wire bond interconnection.
  • FIG. 2 is a diagrammatic sketch in a sectional view of an embodiment of a thin high speed chip scale package according to the invention.
  • FIG. 3 is a diagrammatic sketch in a sectional view of another embodiment of a thin high speed chip scale package according to the invention.
  • Fig. 4 is a diagrammatic sketch in a sectional view of still another embodiment of a thin high speed chip scale package according to the invention.
  • FIG. 1 there is shown in a diagrammatic sectional view a conventional chip scale package generally at 10, including a die 14, attached to a surface 11 of a package substrate 12.
  • the die 14 is electrically connected to the package substrate 12 by way of wire bonds 16 connected to wire bond pads 15 on the die 14 and to interconnect sites in the surface 11 of the substrate 12.
  • the die, the wire bonds, and the upper surface 11 of the substrate 12 are enclosed within and protected by a molded plastic encapsulation material 17.
  • a set of second level interconnect balls 18 are attached to sites on a surface 19 of the substrate 12 opposite the surface 11 on which the die is attached.
  • the substrate referred to as 12 in Fig.
  • FIG. 1 an embodiment of a chip scale package according to the invention is shown generally at 20.
  • the package substrate 22 is provided on a first ("lower") surface 21 with a set of second level interconnect solder balls 28.
  • these second level solder balls are arranged near the periphery of the substrate.
  • the die 24 is affixed to a die attach region 29 on the first ("lower") surface 21 of the package substrate using a die attach material 27, typically a die attach epoxy.
  • a die attach material 27 typically a die attach epoxy.
  • Interconnection between the die and the substrate is made by way of interconnect bumps 25.
  • Flip chip interconnection is known; usually the interconnect bumps 25 are attached to interconnect sites in an arrangement on conductive traces (not shown in the Figs.) in or near the surface 23 of the die, and these interconnect bumps are then bonded to connection sites in a complementary arrangement (not shown in the Figs.) on conductive traces in or on the substrate.
  • the interconnect bumps 25 are bonded to their respective pads in a solid-state fashion; that is, the bumps are thermo-mechanically connected to the pads by concurrently forcing the bonds against the pads and applying sufficient heat to deform the bonds against the pads without melting either the bond material or the pad material.
  • Such solid state interconnect can provide for interconnect geometries in ranges less than about 0.1 mm pitch.
  • the bump structures and interconnection means can be designed so that the gap between the die surface 23 and the die attach surface of the substrate 29 is less than about 0.025 mm. Because the die in this embodiment is carried on the lower surface of the substrate, and because its thickness is accommodated within the gap between the lower surface of the substrate and the underlying integrated circuit, as limited by the size of the second level interconnect balls 28, the overall package is thinner in this embodiment by an amount corresponding to about the thickness of the wire bonded die and its encapsulation, as illustrated for example in Fig. 1. Moreover, because the second level interconnect structures are located near the periphery of the substrate, the second level reliability is superior to that obtainable where there are there are solder balls situated in the shadow of the die.
  • a ground plane 26 may be provided as a more or less continual electrically conductive sheet (for example, a metal such as copper) substantially covering the upper surface of the substrate 22.
  • One or more vias passing through the substrate can be formed to connect the ground plane to appropriate second level solder balls ("ground balls") at the surface 21 of the substrate.
  • the conductive traces running from the connection sites in the surface 21 of the substrate can according to the invention run directly to assigned solder ball connection sites. In some embodiments these conductive traces are formed as coplanar waveguides, which structures are known.
  • the thickness of the package substrate is approximately 0.1 mm
  • the height of the solder balls measured from the substrate surface is approximately 0.3 mm
  • the height of the die is approximately 0.18 mm; this gives an overall package height of approximately 0.4 mm. Further reductions in these dimensions are possible, so that overall package heights les than 0.4 mm can be obtained according to the invention.
  • Figs. 3 and 4 show, at 30 and at 40, alternative embodiments of the invention in which the package includes a first die attached by flip chip interconnection to the same ("lower") surface of the substrate as the second level interconnect structures, generally as described with reference to Fig. 2; and a second die affixed to the second ("upper") surface of the package substrate.
  • the second die is interconnected to the substrate using conventional wire bonds
  • Fig. 4 the second die is interconnected to the substrate by flip-chip interconnection.
  • the first die 24 is affixed using a die attach material 27 onto a central die attach region of the first ("lower") surface 21 of the substrate 32, and interconnect is made by way of interconnect bumps 25; and second level interconnect balls 28 are attached to the first surface 21 near the periphery of the substrate as described with reference to Fig. 2.
  • a second die 34 is attached on the opposite ("upper") surface 31 of the substrate 32 and is electrically connected to the package substrate by way of wire bonds 36 connected to wire bond pads 35 on the die 34 and to interconnect sites in the surface 31 of the substrate 32.
  • the dies and associated wire bonds are enclosed in and protected by encapsulation material 37.
  • the dimensions of the second die and associated structures in the embodiment of Fig. 3 can be made similar to the dimensions of the die 14 and associated structures in the conventional package as shown in Fig. 1. Accordingly the overall package height of the package according to the invention as illustrated in Fig. 3 can be made similar to that in the conventional package, but in the embodiment of Fig. 3 the package is a two-die package, and it is a two-die package in which the first die 24 has superior electrical properties, as described above with reference to Fig. 2.
  • a still thinner overall two-die package, in which the second die can also have superior electrical performance, can be constructed as shown at 40 in Fig. 4.
  • the first die 24 is affixed using a die attach material 27 onto a central die attach region of the first ("lower") surface 21 of the substrate 32, and interconnect is made by way of interconnect bumps 25; and second level interconnect balls 28 are attached to the first surface 21 near the periphery of the substrate as described with reference to Fig. 2.
  • the second die is electrically connected to the substrate using a flip chip interconnect.
  • die 44 is affixed using a die attach material 47 to a second die attach region on the second ("upper") surface 41 of the substrate 42, and is interconnected to the substrate by way of interconnect bumps 45.
  • interconnect bumps 45 features on or in the upper surface are electrically connected to features on or in the lower surface through vias (not shown in the Figs.) running through the substrate.
  • This package can be still thinner than one constructed as in Fig. 3, because the die and flip chip interconnect can itself be thinner than a die and wire bond interconnect.

Landscapes

  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
PCT/US2002/005593 2001-02-27 2002-02-26 Super-thin high speed flip chip package Ceased WO2002069399A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002568423A JP2004523121A (ja) 2001-02-27 2002-02-26 超薄型高速フリップチップパッケージ
KR10-2003-7011122A KR20040030509A (ko) 2001-02-27 2002-02-26 초박형 고속 플립칩 패키지
EP02721143A EP1371094A4 (en) 2001-02-27 2002-02-26 SUPER THIN HOUSING FOR HIGH-SPEED FLIP CHIP

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US27223601P 2001-02-27 2001-02-27
US60/272,236 2001-02-27
US10/084,787 US20020121707A1 (en) 2001-02-27 2002-02-25 Super-thin high speed flip chip package
US10/084,787 2002-02-25

Publications (1)

Publication Number Publication Date
WO2002069399A1 true WO2002069399A1 (en) 2002-09-06

Family

ID=26771428

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/005593 Ceased WO2002069399A1 (en) 2001-02-27 2002-02-26 Super-thin high speed flip chip package

Country Status (6)

Country Link
US (2) US20020121707A1 (https=)
EP (1) EP1371094A4 (https=)
JP (2) JP2004523121A (https=)
KR (1) KR20040030509A (https=)
TW (1) TWI246170B (https=)
WO (1) WO2002069399A1 (https=)

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US8143108B2 (en) * 2004-10-07 2012-03-27 Stats Chippac, Ltd. Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate
US20020121707A1 (en) * 2001-02-27 2002-09-05 Chippac, Inc. Super-thin high speed flip chip package
US7659623B2 (en) * 2005-04-11 2010-02-09 Elpida Memory, Inc. Semiconductor device having improved wiring
US7821131B2 (en) * 2007-06-21 2010-10-26 Intel Corporation Substrate including barrier solder bumps to control underfill transgression and microelectronic package including same
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US20130020702A1 (en) * 2011-07-21 2013-01-24 Jun Zhai Double-sided flip chip package
DE102019202718B4 (de) 2019-02-28 2020-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Dünnes Dual-Folienpackage und Verfahren zum Herstellen desselben
DE102019202721B4 (de) 2019-02-28 2021-03-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. 3d-flexfolien-package
DE102019202716B4 (de) 2019-02-28 2020-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Flex-folien-package mit coplanarer topologie für hochfrequenzsignale und verfahren zum herstellen eines derartigen flex-folien-packages
DE102019202715A1 (de) 2019-02-28 2020-09-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Folienbasiertes package mit distanzausgleich
US12400942B2 (en) 2023-05-08 2025-08-26 Bae Systems Information And Electronic Systems Integration Inc. Interposer for implementing flip-chip dies in wirebonded circuit assemblies

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EP1371094A4 (en) 2009-07-15
US20050056944A1 (en) 2005-03-17
TWI246170B (en) 2005-12-21
JP2004523121A (ja) 2004-07-29
JP2009038391A (ja) 2009-02-19
EP1371094A1 (en) 2003-12-17
US20020121707A1 (en) 2002-09-05
KR20040030509A (ko) 2004-04-09

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