WO2002009169A1 - Dispositif d'inspection et carte sonde - Google Patents
Dispositif d'inspection et carte sonde Download PDFInfo
- Publication number
- WO2002009169A1 WO2002009169A1 PCT/JP2001/002592 JP0102592W WO0209169A1 WO 2002009169 A1 WO2002009169 A1 WO 2002009169A1 JP 0102592 W JP0102592 W JP 0102592W WO 0209169 A1 WO0209169 A1 WO 0209169A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe card
- substrate
- inspection apparatus
- disposed
- inspected object
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01917565A EP1248292A4 (en) | 2000-07-25 | 2001-03-28 | INSPECTION DEVICE AND PROBE CARD |
US10/088,100 US6765400B2 (en) | 2000-07-25 | 2001-03-28 | Inspection apparatus and probe card |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000224384A JP3696486B2 (ja) | 1999-11-18 | 2000-07-25 | 検査装置 |
JP2000-224384 | 2000-07-25 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/088,100 A-371-Of-International US6765400B2 (en) | 2000-07-25 | 2001-03-28 | Inspection apparatus and probe card |
US10/840,244 Continuation US20040207425A1 (en) | 2000-07-25 | 2004-05-07 | Inspection apparatus and probe card |
US10/840,254 Continuation US20040207419A1 (en) | 2000-07-25 | 2004-05-07 | Inspecting device and probe card |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002009169A1 true WO2002009169A1 (fr) | 2002-01-31 |
Family
ID=18718361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/002592 WO2002009169A1 (fr) | 2000-07-25 | 2001-03-28 | Dispositif d'inspection et carte sonde |
Country Status (3)
Country | Link |
---|---|
US (3) | US6765400B2 (ja) |
EP (1) | EP1248292A4 (ja) |
WO (1) | WO2002009169A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101047711B1 (ko) * | 2002-08-07 | 2011-07-08 | 호야 가부시키가이샤 | 콘택 부품과 그 제조방법 및 콘택 부품을 구비한 검사 기구 |
JP2008134170A (ja) * | 2006-11-29 | 2008-06-12 | Micronics Japan Co Ltd | 電気的接続装置 |
KR20080053768A (ko) * | 2006-12-11 | 2008-06-16 | 삼성전자주식회사 | 웨이퍼 척, 이를 구비하는 웨이퍼의 전기적 특성을테스트하는 장치 및 테스트하는 방법 |
JP5236379B2 (ja) * | 2007-08-24 | 2013-07-17 | 日本特殊陶業株式会社 | Ic検査装置用基板及びその製造方法 |
JP2011517365A (ja) * | 2008-01-30 | 2011-06-02 | イノベント テクノロジーズ, エルエルシー | ビアディスクの製造のための方法および装置 |
US8536890B2 (en) * | 2008-02-05 | 2013-09-17 | Nec Corporation | Semiconductor inspecting device and semiconductor inspecting method |
WO2009107741A1 (ja) * | 2008-02-28 | 2009-09-03 | 日本電気株式会社 | 半導体検査装置、半導体ウェハの位置合わせ方法、及び半導体ウェハの検査方法 |
KR101232691B1 (ko) | 2008-02-29 | 2013-02-13 | 니혼 하츠쵸 가부시키가이샤 | 배선기판 및 프로브 카드 |
US8324915B2 (en) * | 2008-03-13 | 2012-12-04 | Formfactor, Inc. | Increasing thermal isolation of a probe card assembly |
KR20100019885A (ko) * | 2008-08-11 | 2010-02-19 | 삼성전기주식회사 | 프로브 카드 제조 방법 |
TWI416642B (zh) * | 2009-01-22 | 2013-11-21 | Chroma Ate Inc | With double-sided electrode semiconductor grain detection method and testing machine |
US8269514B2 (en) * | 2009-08-25 | 2012-09-18 | Formfactor, Inc. | Method and apparatus for multilayer support substrate |
CN102162818A (zh) * | 2010-02-21 | 2011-08-24 | 木本军生 | 探针台装置 |
JP2012042444A (ja) * | 2010-08-13 | 2012-03-01 | Samsung Electro-Mechanics Co Ltd | プローブ基板及びその製造方法 |
JP6615680B2 (ja) * | 2016-04-08 | 2019-12-04 | 株式会社日本マイクロニクス | プローブカード |
TWI752563B (zh) * | 2020-07-24 | 2022-01-11 | 鴻勁精密股份有限公司 | 接合機構及其應用之作業設備 |
US11885830B2 (en) | 2021-01-15 | 2024-01-30 | Lumentum Operations Llc | Probe tip assembly for testing optical components |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0802419A2 (en) * | 1996-04-15 | 1997-10-22 | Nec Corporation | Probe card and method of forming the same |
EP0841698A2 (en) * | 1996-11-08 | 1998-05-13 | W.L. GORE & ASSOCIATES, INC. | Wafer level contact sheet and method of assembly |
JPH11145216A (ja) * | 1997-11-12 | 1999-05-28 | Matsushita Electric Ind Co Ltd | ウェハバーンイン装置、検査用基板及びポゴピン |
JP2000039452A (ja) * | 1998-07-22 | 2000-02-08 | Hoya Corp | コンタクトボード及びその構成部品 |
JP2000304770A (ja) * | 1999-04-16 | 2000-11-02 | Advantest Corp | プローブカード及びプローブカード製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5055778A (en) * | 1989-10-02 | 1991-10-08 | Nihon Denshizairyo Kabushiki Kaisha | Probe card in which contact pressure and relative position of each probe end are correctly maintained |
US5302891A (en) * | 1991-06-04 | 1994-04-12 | Micron Technology, Inc. | Discrete die burn-in for non-packaged die |
US5487999A (en) * | 1991-06-04 | 1996-01-30 | Micron Technology, Inc. | Method for fabricating a penetration limited contact having a rough textured surface |
JP2895989B2 (ja) | 1991-06-10 | 1999-05-31 | 三菱電機株式会社 | プローバ装置およびウエハの検査方法 |
US5166605A (en) * | 1991-08-02 | 1992-11-24 | General Electric Company | Controlled impedance test fixture for planar electronic device |
DE69213890T2 (de) * | 1991-11-18 | 1997-01-30 | Nippon Electric Co | Mehrschichtige Leiterplatte aus Polyimid und Verfahren zur Herstellung |
JPH06347480A (ja) | 1993-06-04 | 1994-12-22 | Nitto Denko Corp | プローブ構造 |
EP0629867B1 (en) * | 1993-06-16 | 1999-01-27 | Nitto Denko Corporation | Probe structure |
JPH07115113A (ja) * | 1993-08-25 | 1995-05-02 | Nec Corp | 半導体ウエハの試験装置および試験方法 |
US5742169A (en) * | 1996-02-20 | 1998-04-21 | Micron Technology, Inc. | Apparatus for testing interconnects for semiconductor dice |
US5886535A (en) * | 1996-11-08 | 1999-03-23 | W. L. Gore & Associates, Inc. | Wafer level burn-in base unit substrate and assembly |
US5834945A (en) * | 1996-12-31 | 1998-11-10 | Micron Technology, Inc. | High speed temporary package and interconnect for testing semiconductor dice and method of fabrication |
JPH10322025A (ja) | 1997-05-20 | 1998-12-04 | Iwaki Electron Corp Ltd | プリント回路基板 |
JPH1164377A (ja) | 1997-08-20 | 1999-03-05 | Jsr Corp | 積層型コネクターおよび回路基板検査用アダプター装置 |
JPH11260871A (ja) | 1998-03-14 | 1999-09-24 | Tokyo Electron Ltd | プローブ装置 |
US6215320B1 (en) * | 1998-10-23 | 2001-04-10 | Teradyne, Inc. | High density printed circuit board |
US6351133B1 (en) * | 1999-03-31 | 2002-02-26 | Adoamtest Corp. | Packaging and interconnection of contact structure |
-
2001
- 2001-03-28 WO PCT/JP2001/002592 patent/WO2002009169A1/ja not_active Application Discontinuation
- 2001-03-28 US US10/088,100 patent/US6765400B2/en not_active Expired - Lifetime
- 2001-03-28 EP EP01917565A patent/EP1248292A4/en not_active Withdrawn
-
2004
- 2004-05-07 US US10/840,254 patent/US20040207419A1/en not_active Abandoned
- 2004-05-07 US US10/840,244 patent/US20040207425A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0802419A2 (en) * | 1996-04-15 | 1997-10-22 | Nec Corporation | Probe card and method of forming the same |
EP0841698A2 (en) * | 1996-11-08 | 1998-05-13 | W.L. GORE & ASSOCIATES, INC. | Wafer level contact sheet and method of assembly |
JPH11145216A (ja) * | 1997-11-12 | 1999-05-28 | Matsushita Electric Ind Co Ltd | ウェハバーンイン装置、検査用基板及びポゴピン |
JP2000039452A (ja) * | 1998-07-22 | 2000-02-08 | Hoya Corp | コンタクトボード及びその構成部品 |
JP2000304770A (ja) * | 1999-04-16 | 2000-11-02 | Advantest Corp | プローブカード及びプローブカード製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1248292A4 * |
Also Published As
Publication number | Publication date |
---|---|
US20040207419A1 (en) | 2004-10-21 |
US20040207425A1 (en) | 2004-10-21 |
US6765400B2 (en) | 2004-07-20 |
US20030006788A1 (en) | 2003-01-09 |
EP1248292A4 (en) | 2007-08-15 |
EP1248292A1 (en) | 2002-10-09 |
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