WO2002009169A1 - Dispositif d'inspection et carte sonde - Google Patents

Dispositif d'inspection et carte sonde Download PDF

Info

Publication number
WO2002009169A1
WO2002009169A1 PCT/JP2001/002592 JP0102592W WO0209169A1 WO 2002009169 A1 WO2002009169 A1 WO 2002009169A1 JP 0102592 W JP0102592 W JP 0102592W WO 0209169 A1 WO0209169 A1 WO 0209169A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe card
substrate
inspection apparatus
disposed
inspected object
Prior art date
Application number
PCT/JP2001/002592
Other languages
English (en)
French (fr)
Inventor
Yoshiyuki Ido
Original Assignee
Ibiden Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000224384A external-priority patent/JP3696486B2/ja
Application filed by Ibiden Co., Ltd. filed Critical Ibiden Co., Ltd.
Priority to US10/088,100 priority Critical patent/US6765400B2/en
Priority to EP01917565A priority patent/EP1248292A4/en
Publication of WO2002009169A1 publication Critical patent/WO2002009169A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
PCT/JP2001/002592 2000-07-25 2001-03-28 Dispositif d'inspection et carte sonde WO2002009169A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/088,100 US6765400B2 (en) 2000-07-25 2001-03-28 Inspection apparatus and probe card
EP01917565A EP1248292A4 (en) 2000-07-25 2001-03-28 INSPECTION DEVICE AND PROBE CARD

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-224384 2000-07-25
JP2000224384A JP3696486B2 (ja) 1999-11-18 2000-07-25 検査装置

Related Child Applications (3)

Application Number Title Priority Date Filing Date
US10/088,100 A-371-Of-International US6765400B2 (en) 2000-07-25 2001-03-28 Inspection apparatus and probe card
US10/840,244 Continuation US20040207425A1 (en) 2000-07-25 2004-05-07 Inspection apparatus and probe card
US10/840,254 Continuation US20040207419A1 (en) 2000-07-25 2004-05-07 Inspecting device and probe card

Publications (1)

Publication Number Publication Date
WO2002009169A1 true WO2002009169A1 (fr) 2002-01-31

Family

ID=18718361

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/002592 WO2002009169A1 (fr) 2000-07-25 2001-03-28 Dispositif d'inspection et carte sonde

Country Status (3)

Country Link
US (3) US6765400B2 (ja)
EP (1) EP1248292A4 (ja)
WO (1) WO2002009169A1 (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7288950B2 (en) * 2002-08-07 2007-10-30 Hoya Corporation Contacting component, method of producing the same, and test tool having the contacting component
JP2008134170A (ja) * 2006-11-29 2008-06-12 Micronics Japan Co Ltd 電気的接続装置
KR20080053768A (ko) * 2006-12-11 2008-06-16 삼성전자주식회사 웨이퍼 척, 이를 구비하는 웨이퍼의 전기적 특성을테스트하는 장치 및 테스트하는 방법
JP5236379B2 (ja) * 2007-08-24 2013-07-17 日本特殊陶業株式会社 Ｉｃ検査装置用基板及びその製造方法
US8242382B2 (en) * 2008-01-30 2012-08-14 Innovent Technologies, Llc Method and apparatus for manufacture of via disk
JPWO2009099122A1 (ja) * 2008-02-05 2011-05-26 日本電気株式会社 半導体検査装置及び半導体検査方法
US8570056B2 (en) * 2008-02-28 2013-10-29 Nec Corporation Semiconductor inspection apparatus, semiconductor wafer positioning method, and semiconductor wafer inspection method
WO2009107747A1 (ja) * 2008-02-29 2009-09-03 日本発條株式会社 配線基板およびプローブカード
US8324915B2 (en) * 2008-03-13 2012-12-04 Formfactor, Inc. Increasing thermal isolation of a probe card assembly
KR20100019885A (ko) * 2008-08-11 2010-02-19 삼성전기주식회사 프로브 카드 제조 방법
TWI416642B (zh) * 2009-01-22 2013-11-21 Chroma Ate Inc With double-sided electrode semiconductor grain detection method and testing machine
US8269514B2 (en) * 2009-08-25 2012-09-18 Formfactor, Inc. Method and apparatus for multilayer support substrate
CN102162818A (zh) * 2010-02-21 2011-08-24 木本军生 探针台装置
JP2012042444A (ja) * 2010-08-13 2012-03-01 Samsung Electro-Mechanics Co Ltd プローブ基板及びその製造方法
JP6615680B2 (ja) * 2016-04-08 2019-12-04 株式会社日本マイクロニクス プローブカード
TWI752563B (zh) * 2020-07-24 2022-01-11 鴻勁精密股份有限公司 接合機構及其應用之作業設備
US11885830B2 (en) 2021-01-15 2024-01-30 Lumentum Operations Llc Probe tip assembly for testing optical components

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0802419A2 (en) * 1996-04-15 1997-10-22 Nec Corporation Probe card and method of forming the same
EP0841698A2 (en) * 1996-11-08 1998-05-13 W.L. GORE & ASSOCIATES, INC. Wafer level contact sheet and method of assembly
JPH11145216A (ja) * 1997-11-12 1999-05-28 Matsushita Electric Ind Co Ltd ウェハバーンイン装置、検査用基板及びポゴピン
JP2000039452A (ja) * 1998-07-22 2000-02-08 Hoya Corp コンタクトボード及びその構成部品
JP2000304770A (ja) * 1999-04-16 2000-11-02 Advantest Corp プローブカード及びプローブカード製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5055778A (en) * 1989-10-02 1991-10-08 Nihon Denshizairyo Kabushiki Kaisha Probe card in which contact pressure and relative position of each probe end are correctly maintained
US5302891A (en) * 1991-06-04 1994-04-12 Micron Technology, Inc. Discrete die burn-in for non-packaged die
US5487999A (en) * 1991-06-04 1996-01-30 Micron Technology, Inc. Method for fabricating a penetration limited contact having a rough textured surface
JP2895989B2 (ja) 1991-06-10 1999-05-31 三菱電機株式会社 プローバ装置およびウエハの検査方法
US5166605A (en) * 1991-08-02 1992-11-24 General Electric Company Controlled impedance test fixture for planar electronic device
EP0543331B1 (en) * 1991-11-18 1996-09-18 Nec Corporation Polyimide multilayer interconnection board and method of making the same
JPH06347480A (ja) 1993-06-04 1994-12-22 Nitto Denko Corp プローブ構造
DE69416200T2 (de) * 1993-06-16 1999-06-02 Nitto Denko Corp Sondenkonstruktion
JPH07115113A (ja) * 1993-08-25 1995-05-02 Nec Corp 半導体ウエハの試験装置および試験方法
US5742169A (en) * 1996-02-20 1998-04-21 Micron Technology, Inc. Apparatus for testing interconnects for semiconductor dice
US5886535A (en) * 1996-11-08 1999-03-23 W. L. Gore & Associates, Inc. Wafer level burn-in base unit substrate and assembly
US5834945A (en) * 1996-12-31 1998-11-10 Micron Technology, Inc. High speed temporary package and interconnect for testing semiconductor dice and method of fabrication
JPH10322025A (ja) 1997-05-20 1998-12-04 Iwaki Electron Corp Ltd プリント回路基板
JPH1164377A (ja) 1997-08-20 1999-03-05 Jsr Corp 積層型コネクターおよび回路基板検査用アダプター装置
JPH11260871A (ja) 1998-03-14 1999-09-24 Tokyo Electron Ltd プローブ装置
US6215320B1 (en) * 1998-10-23 2001-04-10 Teradyne, Inc. High density printed circuit board
US6351133B1 (en) * 1999-03-31 2002-02-26 Adoamtest Corp. Packaging and interconnection of contact structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0802419A2 (en) * 1996-04-15 1997-10-22 Nec Corporation Probe card and method of forming the same
EP0841698A2 (en) * 1996-11-08 1998-05-13 W.L. GORE & ASSOCIATES, INC. Wafer level contact sheet and method of assembly
JPH11145216A (ja) * 1997-11-12 1999-05-28 Matsushita Electric Ind Co Ltd ウェハバーンイン装置、検査用基板及びポゴピン
JP2000039452A (ja) * 1998-07-22 2000-02-08 Hoya Corp コンタクトボード及びその構成部品
JP2000304770A (ja) * 1999-04-16 2000-11-02 Advantest Corp プローブカード及びプローブカード製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1248292A4 *

Also Published As

Publication number Publication date
EP1248292A1 (en) 2002-10-09
US20040207419A1 (en) 2004-10-21
EP1248292A4 (en) 2007-08-15
US6765400B2 (en) 2004-07-20
US20040207425A1 (en) 2004-10-21
US20030006788A1 (en) 2003-01-09

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