WO2002000505A2 - Automatic printing of labels - Google Patents
Automatic printing of labels Download PDFInfo
- Publication number
- WO2002000505A2 WO2002000505A2 PCT/US2001/018219 US0118219W WO0200505A2 WO 2002000505 A2 WO2002000505 A2 WO 2002000505A2 US 0118219 W US0118219 W US 0118219W WO 0200505 A2 WO0200505 A2 WO 0200505A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- moisture
- label
- drypack
- sensitive
- caution
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/46—Applying date marks, code marks, or the like, to the label during labelling
Definitions
- the present invention relates to integrated circuit packaging technology, and more specifically, to marking moisture-sensitive devices with labels relevant to dry pack processes.
- SMDs are more susceptible to this problem then through-hole parts because they are exposed to higher temperatures during reflow soldering.
- the soldering operation occur under the board that shilds the device from the hot solder.
- Controlling the moisture level in the package body is therefore crytical to reducing the risk of moisture-induced damage.
- moisture-sensitive devices are packed in a drypack that consists of desiccant material and a Humidity Indicator Card (HIC) sealed together with the devices inside a moisture barrier bag (MBB).
- the desiccant material is an absorbent material such as a silica gel used to maintain a low relative humidity in the MBB.
- the HIC is a card on which a moisture chemical is printed such that it will change color from blue to pink when the preset relative humidity is exceeded.
- IPC Electronic Circuits
- JEDEC Joint Electronic Device Engineering Council
- the caution label affixed to the outside surface of the MBB varies to reflect the specific product in the bag.
- the label identifies the contents of the bag and includes the date the bag was sealed, the dry pack expiration date, as well as product handling guidelines.
- the caution label contains a moisture-sensitivity (MS) level defined by the IPC/JEDEC J-STD- 020A Standard.
- Moisture-sensitivity levels indicate a time limit for storing a moisture-sensitive device after opening the MBB and prior to mounting the device onto a circuit board, and temperature and humidity to be maintained in storage.
- the out-of-bag time limit varies depending on the moisture-sensitivity of the product. If the out-of-bag time from initial exposure to board mounting is exceeded, the product should be baked at a prescribed temperature for a prescribed time period.
- the IP C/JEDEC J-STD-020A Standard defines six different moisture-sensitivity levels, referred to as level 1 through level 6. Each higher level denotes a higher level of sensitivity.
- level 1 corresponds to unlimited exposure time at a temperature not higher than 30°C and relative humidity not higher than 85%.
- Levels 2, 2a, 3, 4, 5, and 5a require exposure time to be not more than one year, 4 weeks, 168 hours, 72 hours, 48 hours, and 24 hours, respectively.
- Level 6 is product specific. It directs to follow specific instructions on dry pack label. Levels 2 to 6 prescribe out-of-bag storage at a temperature not higher than 30°C and relative humidity not higher than 60%.
- Products are tested to determine their moisture-sensitivity level. Product that fails the level 1 test requirements is then tested at a higher level until it passes.
- Specific environment stress steps subject the product to conditions designated to simulate the environment of an end-use application. Subsequent electrical testing and inspection steps determine if the device was damaged during the environment stress steps.
- the product is packed in a drypack, and is subject to the dry pack handling procedure prescribed by the JJPC/JEDEC J-STD- 033 Standard.
- a pre-printed caution label is affixed to the outside surface of the drypack to identify the moisture-sensitivity level of the product.
- labeling of the drypack products is performed manually. As a result, a wrong label can be attached to a drypack. This can cause moisture-induced failure of the device due to incorrect out-of-bag exposure time.
- the present invention offers a novel system for automatically generating caution labels for moisture- sensitive semiconductor devices packed in drypack bags.
- the system comprises a scanner that scans an ID mark representing ID information of a moisture-sensitive device sealed in a drypack bag, and a computing device with a look-up table containing moisture-sensitivity levels assigned to the moisture-sensitive devices.
- the computing device searches the look-up table for a moisture-sensitivity level assigned to the packed moisture-sensitive device.
- the determined moisture- sensitivity level is supplied by the computing device to a label-formatting device for generating a caution label indicating the moisture-sensitivity level.
- the label-formatting device may control a printer for printing the generated caution label.
- the moisture-sensitivity levels comply with the IPC/JEDEC J-STD-020A Standard.
- the look-up table may further comprise information on type of the devices, and lead counts of the devices.
- caution labels are printed automatically when an operator performs labeling of a drypack bag containg a moisture-sensitive device. An ID mark representing ID information of the package sealed in the drypack bag is scanned to produce an ID signal representing the package. Based on the ID signal, a pre-set look-up table is searched for a moisture-sensitivity level assigned to the package. A caution label is automatically generated based on the moisture-sensitivity level found in the look-up table.
- FIG. 1 illustrates caution labels defined in the IPC/JEDEC J-STD-033 Standard.
- FIG. 2 is a block-diagram of a system for automatically printing caution labels in accordance with the present invention.
- the JPC/JEDEC J-STD-033 Standard developed by an Institute for Interconnecting and Packaging Electronic Circuits (IPC) and Joint Electronic Device Engineering Council (JEDEC) contains requirements for handling, packing, shipping and use of moisture-sensitive surface mount devices.
- this standard defines a drypack process for packing moisture-sensitive devices.
- the first step in the drypack process is to remove any moisture buildup in the package by baking the finished product for 4.5 to 15.5 hours, depending on the package type, at 125°C. Within 24 to 50 hours after baking, depending on package type, the product is sealed in a drypack bag (i.e. moisture barrier bag) under a partial vacuum.
- a drypack bag i.e. moisture barrier bag
- a caution label should be attached on the outside surface of each drypack bag.
- the caution label should contain the moisture-sensitivity level established for a particular IC package sealed in the drypack bag.
- caution labels with different moisture- sensitivity levels are pre-printed.
- An operator manually selects the label appropriate for a particular drypack bag based on a specification, and attaches the label to the bag.
- this manual labeling procedure is prone to errors, because the operator can attach a wrong caution label to a given drypack bag.
- a wrong caution label can cause the customer to store the moisture-sensitive device removed from the bag for a time period exceeding the out-of-bag exposure time defined by the moisture-sensitivity level of that device. As a result, the device can be damaged during solder reflow.
- the present invention offers a system for automatically printing caution labels during drypack process.
- the system 10 for automatically printing caution labels comprises a scanning device 12, a computing device 14 having a look-up table 16, a label formatting device 18, and a printer 20.
- the look-up table 16 may contain such device information as a package type, a lead count, a device idenification number, and a moisture-sensitivity level assigned to that device.
- the look-up table may be provided in a computer system that handles drypacking process.
- Each drypack bag contains an identification label that identifies the contents of the bag.
- the contents of the drypack bag may be identified by manufacturing lot number.
- the scanning device 12 connected to the computing device 14 is used by an operator to scan the lot number on the processing sheet.
- the lot number of the drypack bag scanned by the scanning device 12 serves as an index for searching the look-up table 16.
- the computing device 14 uses this identification information to search the look-up table 16 for data associated with the identification information of the drypack bag. In particular, the computing device 14 determines the moisture-sensitivity level assigned to the device packed in the drypack bag.
- the computing device 14 produces a signal representing the moisture- sensitivity level and other relevant information, and transfers this signal to the label formatting device 18 that contains information required to generate the caution label.
- the label formatting device 18 For example, a VAX workstation manufactured by Digital Equipment Corporation may be used for performing label formatting functions, and generating caution labels.
- the printer 20 connected to the label formatting device 18 prints the caution label having the moisture-sensitivity level assigned to the device sealed in the drypack bag.
- caution labels are printed automatically when an operator performs labeling of a drypack bag containing a moisture-sensitive IC package. A lot number or an ID mark representing ID information of the package sealed in the drypack bag is scanned to produce an ID signal representing the package. Based on the ID signal, a pre-set look-up table is searched for a moisture- sensitivity level assigned to the package. A caution label is automatically generated based on the moisture- sensitivity level found in the look-up table.
- the scanning device, computing device and label-formatting device may be incorporated into a single workstation responsible for handling drypacking process.
Landscapes
- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2001275266A AU2001275266A1 (en) | 2000-06-28 | 2001-06-05 | Automatic printing of caution labels for moisture-sensitive devices |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21443100P | 2000-06-28 | 2000-06-28 | |
US60/214,431 | 2000-06-28 | ||
US09/761,180 US6573200B2 (en) | 2001-01-18 | 2001-01-18 | Automatic printing of caution labels for moisture-sensitive devices |
US09/761,180 | 2001-01-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002000505A2 true WO2002000505A2 (en) | 2002-01-03 |
WO2002000505A3 WO2002000505A3 (en) | 2002-05-23 |
Family
ID=26908996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/018219 WO2002000505A2 (en) | 2000-06-28 | 2001-06-05 | Automatic printing of labels |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2001275266A1 (zh) |
TW (1) | TW495477B (zh) |
WO (1) | WO2002000505A2 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7224532B2 (en) | 2002-12-06 | 2007-05-29 | Chevron U.S.A. Inc. | Optical uses diamondoid-containing materials |
US7402835B2 (en) | 2002-07-18 | 2008-07-22 | Chevron U.S.A. Inc. | Heteroatom-containing diamondoid transistors |
US7649056B2 (en) | 2002-07-18 | 2010-01-19 | Chevron U.S.A. Inc. | Heterodiamondoids |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0675458A1 (fr) * | 1994-03-31 | 1995-10-04 | Association Pour L'essor De La Transfusion Sanguine Dans La Region Du Nord | Procédé automatique d'étiquetage et de contrôle de poches de sang en retour d'analyse et machine en comportant application |
-
2001
- 2001-06-05 AU AU2001275266A patent/AU2001275266A1/en not_active Abandoned
- 2001-06-05 WO PCT/US2001/018219 patent/WO2002000505A2/en active Application Filing
- 2001-06-21 TW TW90115095A patent/TW495477B/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0675458A1 (fr) * | 1994-03-31 | 1995-10-04 | Association Pour L'essor De La Transfusion Sanguine Dans La Region Du Nord | Procédé automatique d'étiquetage et de contrôle de poches de sang en retour d'analyse et machine en comportant application |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7402835B2 (en) | 2002-07-18 | 2008-07-22 | Chevron U.S.A. Inc. | Heteroatom-containing diamondoid transistors |
US7649056B2 (en) | 2002-07-18 | 2010-01-19 | Chevron U.S.A. Inc. | Heterodiamondoids |
US7981975B2 (en) | 2002-07-18 | 2011-07-19 | Chevron U.S.A. Inc. | Heterodiamondoids |
US8013078B2 (en) | 2002-07-18 | 2011-09-06 | Chevron U.S.A. Inc. | Heterodiamondoids |
US7224532B2 (en) | 2002-12-06 | 2007-05-29 | Chevron U.S.A. Inc. | Optical uses diamondoid-containing materials |
Also Published As
Publication number | Publication date |
---|---|
WO2002000505A3 (en) | 2002-05-23 |
AU2001275266A1 (en) | 2002-01-08 |
TW495477B (en) | 2002-07-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5295297A (en) | Method of producing semiconductor memory | |
US5607059A (en) | Surface package type semiconductor package and method of producing semiconductor memory | |
JP3055104B2 (ja) | 半導体パッケ―ジの製造方法 | |
EP0589156B1 (en) | A semiconductor device packaging medium having a vacuum seal indicator card | |
US6573200B2 (en) | Automatic printing of caution labels for moisture-sensitive devices | |
TW409330B (en) | Repairable multi-chip module package | |
WO2002000505A2 (en) | Automatic printing of labels | |
CN114340826B (zh) | 装配线的工艺参数的检测 | |
JPH06124981A (ja) | 半導体装置の製造方法 | |
TW419767B (en) | Improved integrated circuit chip packaging method | |
KR102285727B1 (ko) | 릴 팩킹 장치 | |
US20020185409A1 (en) | Desiccant containing product carrier | |
JP3115566B2 (ja) | 面実装型半導体パッケージ包装体の製造方法 | |
US6560839B1 (en) | Method for using a moisture-protective container | |
JP2665181B2 (ja) | 面実装型半導体パッケージ包装体 | |
JPH0648463A (ja) | 集積回路出荷媒体 | |
JP2665182B2 (ja) | 面実装型半導体パッケージ包装体の製造方法 | |
JP3187399B2 (ja) | 袋体に封入された面実装型樹脂封止半導体装置 | |
JP2609516B2 (ja) | 面実装型半導体パッケージの実装方法 | |
JPH11171125A (ja) | 半導体装置用テーピング装置及びその方法 | |
TWI305398B (en) | Method for checking a lead frame structure | |
JP2003273172A (ja) | マーキング方法 | |
JP3115565B2 (ja) | 面実装型樹脂封止半導体パッケージ包装体 | |
KR100370844B1 (ko) | 반도체패키지제조를위한마킹방법 | |
JP2003229339A (ja) | 集積回路素子の処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
AK | Designated states |
Kind code of ref document: A3 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
122 | Ep: pct application non-entry in european phase | ||
NENP | Non-entry into the national phase in: |
Ref country code: JP |