WO2001074962A1 - Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device - Google Patents
Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device Download PDFInfo
- Publication number
- WO2001074962A1 WO2001074962A1 PCT/JP2001/002716 JP0102716W WO0174962A1 WO 2001074962 A1 WO2001074962 A1 WO 2001074962A1 JP 0102716 W JP0102716 W JP 0102716W WO 0174962 A1 WO0174962 A1 WO 0174962A1
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- WIPO (PCT)
- Prior art keywords
- semiconductor
- adhesive film
- same
- substrate
- carrying
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/240,265 US7070670B2 (en) | 2000-03-31 | 2001-03-30 | Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-101254 | 2000-03-31 | ||
JP2000-101253 | 2000-03-31 | ||
JP2000101254A JP2001279217A (ja) | 2000-03-31 | 2000-03-31 | 接着剤組成物、難燃性接着剤組成物、接着フィルム、半導体搭載用配線基板及び半導体装置とその製造方法 |
JP2000101253A JP4505769B2 (ja) | 2000-03-31 | 2000-03-31 | 接着フィルム、接着フィルムを備えた半導体搭載用配線基板、半導体装置及びその製造方法 |
JP2001-074268 | 2001-03-15 | ||
JP2001074268A JP4258984B2 (ja) | 2001-03-15 | 2001-03-15 | 半導体装置の製造方法 |
JP2001078587A JP4719992B2 (ja) | 2001-03-19 | 2001-03-19 | 接着剤組成物およびその用途 |
JP2001-078587 | 2001-03-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001074962A1 true WO2001074962A1 (en) | 2001-10-11 |
Family
ID=27481187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/002716 WO2001074962A1 (en) | 2000-03-31 | 2001-03-30 | Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device |
Country Status (4)
Country | Link |
---|---|
US (1) | US7070670B2 (ja) |
KR (3) | KR100894207B1 (ja) |
TW (3) | TWI332521B (ja) |
WO (1) | WO2001074962A1 (ja) |
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- 2001-03-30 WO PCT/JP2001/002716 patent/WO2001074962A1/ja active Application Filing
- 2001-03-30 TW TW098125792A patent/TWI332024B/zh not_active IP Right Cessation
- 2001-03-30 TW TW090107672A patent/TWI245791B/zh not_active IP Right Cessation
- 2001-03-30 KR KR1020087011924A patent/KR100894208B1/ko active IP Right Grant
- 2001-03-30 US US10/240,265 patent/US7070670B2/en not_active Expired - Lifetime
- 2001-03-30 KR KR1020027012945A patent/KR100815314B1/ko active IP Right Grant
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JPH03181580A (ja) * | 1989-12-11 | 1991-08-07 | Hitachi Chem Co Ltd | フレキシブル印刷配線板用接着剤及びこれを用いたフレキシブル印刷配線板 |
EP0819747A1 (en) * | 1995-04-04 | 1998-01-21 | Hitachi Chemical Co., Ltd. | Adhesive, adhesive film and adhesive-backed metal foil |
JPH09298369A (ja) * | 1996-05-09 | 1997-11-18 | Hitachi Chem Co Ltd | 多層配線板及びその製造方法 |
JPH11209724A (ja) * | 1998-01-30 | 1999-08-03 | Hitachi Chem Co Ltd | 難燃化接着剤、難燃化接着部材、難燃化接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 |
JPH11260838A (ja) * | 1998-03-09 | 1999-09-24 | Hitachi Chem Co Ltd | 両面接着フィルムを用いて作製した半導体装置 |
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US8119737B2 (en) | 2000-02-15 | 2012-02-21 | Hitachi Chemical Company, Ltd. | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
US20140332984A1 (en) * | 2000-02-15 | 2014-11-13 | Hitachi Chemical Co., Ltd. | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
US7947779B2 (en) * | 2000-02-15 | 2011-05-24 | Hitachi Chemical Company, Ltd. | Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer |
US20120080808A1 (en) * | 2000-02-15 | 2012-04-05 | Teiichi Inada | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
US7645514B2 (en) * | 2003-01-07 | 2010-01-12 | Sekisui Chemical Co., Ltd. | Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
KR101177251B1 (ko) | 2003-06-06 | 2012-08-24 | 히다치 가세고교 가부시끼가이샤 | 접착시트, 다이싱 테이프 일체형 접착시트 및 반도체 장치의 제조방법 |
US7968195B2 (en) * | 2003-06-06 | 2011-06-28 | Hitachi Chemical Co., Ltd. | Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler |
US7968194B2 (en) * | 2003-06-06 | 2011-06-28 | Hitachi Chemical Co., Ltd. | Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler |
KR101177250B1 (ko) | 2003-06-06 | 2012-08-24 | 히다치 가세고교 가부시끼가이샤 | 접착시트, 다이싱 테이프 일체형 접착시트 및 반도체 장치의 제조방법 |
US8617930B2 (en) | 2003-06-06 | 2013-12-31 | Hitachi Chemical Co., Ltd. | Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device |
US7875500B2 (en) * | 2003-06-06 | 2011-01-25 | Hitachi Chemical Company, Ltd. | Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support |
US8017444B2 (en) * | 2004-04-20 | 2011-09-13 | Hitachi Chemical Company, Ltd. | Adhesive sheet, semiconductor device, and process for producing semiconductor device |
WO2008133472A1 (en) * | 2007-04-30 | 2008-11-06 | Lg Chem, Ltd. | Adhesive resin composition and dicing die bonding film using the same |
Also Published As
Publication number | Publication date |
---|---|
TWI332521B (en) | 2010-11-01 |
KR20080047488A (ko) | 2008-05-28 |
TW200948921A (en) | 2009-12-01 |
TWI332024B (en) | 2010-10-21 |
KR20070104681A (ko) | 2007-10-26 |
KR20040029939A (ko) | 2004-04-08 |
TW200401020A (en) | 2004-01-16 |
KR100894207B1 (ko) | 2009-04-22 |
TWI245791B (en) | 2005-12-21 |
US20030159773A1 (en) | 2003-08-28 |
US7070670B2 (en) | 2006-07-04 |
KR100894208B1 (ko) | 2009-04-22 |
KR100815314B1 (ko) | 2008-03-19 |
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