Classifications

• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
  • H02M1/00—Details of apparatus for conversion
  • H02M1/42—Circuits or arrangements for compensating for or adjusting power factor in converters or inverters
  • H02M1/4208—Arrangements for improving power factor of AC input
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
  • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
  • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
  • F25B9/002—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
  • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
  • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
  • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
  • F25B2500/00—Problems to be solved
  • F25B2500/12—Sound
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
  • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
  • F25B2600/00—Control issues
  • F25B2600/02—Compressor control
  • F25B2600/021—Inverters therefor
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
  • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
  • F25B49/00—Arrangement or mounting of control or safety devices
  • F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
  • F25B49/025—Motor control arrangements
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
  • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
  • Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
  • Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
  • Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

Definitions

• the present invention relates to a single-phase converter circuit for performing AC-DC conversion, and more particularly to a single-phase converter circuit for performing power factor improvement, power supply harmonic suppression, DC voltage adjustment, and the like by controlling a semiconductor switching element by PWM. Further, the present invention relates to a converter device and a refrigeration cycle device for suppressing harmonics and improving a power factor by using a semiconductor switching element.
• Conventional single-phase converters include, for example, a “sine-wave input single-phase rectifier circuit” disclosed in Japanese Patent Application Laid-Open No. H10-33730, and Japanese Unexamined Utility Model Application Publication No. S64-506686. And a single-phase half-bridge type converter circuit such as a "power supply device under PWM control" disclosed in Japanese Patent Application Laid-Open No. 2-237469.
• FIG. 15 is a diagram showing the configuration of such a conventional single-phase half-bridge converter circuit.
• a diode (54c, 54d) is connected to one side of the AC input line of the capacitor input rectifier circuit with four diodes (54d) connected to each other.
• the semiconductor switching elements 55a and 55b are provided in parallel with and opposite to the above.
• the AC input from the AC power supply 51 via the noise filter 52 is converted into DC.
• the semiconductor switching elements 55a and 55b are PWM driven by the 64 and the semiconductor switching element PWM drive circuit 65 to perform power factor improvement, power supply harmonic suppression, DC voltage adjustment, and the like.
• PW for semiconductor switching elements 55 a and 55 b The detection of the input current, which is one of the control parameters during M drive, is performed by the CT 56 provided on the AC input line.
• the switching speed of the semiconductor switching elements 55a and 55b is fast, the voltage / current change is abrupt, and the carrier frequency 2 is reduced to reduce the size of the reactor 53.
• PWM switching is performed with a high-frequency carrier of 0 kHz or more. Due to the effects of such high dvZdt and wiring impedance, common noises of about several hundred kHz to about several hundred MHz are generated, which may adversely affect other devices. When applied to home electric appliances such as air conditioners, there are legal restrictions on common noise such as noise terminal voltage, and it is necessary to keep the noise within specified standards. For this reason, the conventional single-phase half-bridge converter circuit is equipped with a large noise filter 152 to suppress common system noise.
• FIG. Fig. 16 is a simplified circuit diagram of an air conditioner equipped with a converter device that suppresses harmonics and improves the power factor using a conventional semiconductor switching element.
• FIG. 17 is a cross-sectional view of the outdoor unit of the air conditioner as viewed from above, illustrating a reactor mounted state of the air conditioner in a conventional air conditioner.
• reference numeral 101 denotes a semiconductor switching element
• reference numeral 102 denotes a rear turtle for suppressing harmonics and improvement of power factor
• reference numeral 103 denotes an electrically connected reactor 102 to the main circuit board 10.
• a lead wire, 113 is an electric field capacitor
• 116 is a diode
• 123 is a shunt resistor
• 124 is a gate resistor.
• reference numeral 105 denotes a heat dissipating means attached to the main circuit board 104 for promoting heat radiation of the heat-generating components mounted on the board
• 106 denotes an outdoor fan
• 107 denotes an outdoor unit
• 1 08 is a heat exchanger disposed upstream of the outdoor fan 106 in the outdoor unit 107
• 109 is an electrical component box containing the main circuit board 104 and the reactor 102
• 1 1 0 is a direct wind from the outdoor fan 106
• 111 is a ventilation hole formed in the electric component box
• 112 is a slight wind flowing due to a pressure difference.
• the reactor 102 of the power factor improving converter circuit of the air conditioner represented by the simplified circuit diagram in Fig.
• the input current is detected by the CT 56 mounted on the main power supply, which is costly, has a large housing size, and requires a wide wiring pattern. For this reason, there is a problem that the substrate size cannot be reduced even when the substrate size of the device to which the single-phase converter circuit is applied is required to be reduced, and the cost is increased. In addition, since a large-sized noise filter with high cost is used to suppress common system noise, there is a problem that the substrate size cannot be reduced and the cost increases.
• the outdoor unit of the air conditioner is an electrical component box in which the outdoor fan 106, the reactor 102, and the main circuit board 104 are housed inside the heat exchanger 108 as shown in Fig. 17 Since the configuration is such that 1109 and 1109 are lined up, direct wind 110 from the outdoor fan 106 is difficult to obtain, and the electrical component box 109 is designed to minimize intrusion of dust and moisture. Because of the narrow ventilation holes 1 1 1 as shown in Fig. 17, the reactor 102 could not obtain the slight ventilation force flowing due to the pressure difference.
• the semiconductor switching element 101 is subjected to PWM control with a high carrier (about 20 kHz).
• the change becomes abrupt and generates high-frequency voltage oscillation, which radiates as noise into the space using the circuit loop as an antenna. Therefore, there is a problem that as the lead wire 103 becomes longer, the antenna becomes larger and the amount of radiated noise increases.
• an alternative refrigerant such as R407C.R410A, which has a higher pressure than R22, is used, since the power input to the compressor becomes large, the problem of radiated noise becomes significant. There was a problem.
• an object of the present invention is to provide a single-phase converter circuit capable of reducing the size of a substrate and reducing the cost.
• the present invention reduces the size of the reactor to the size that can be mounted on the board by dividing and connecting the reactor in parallel, and actively dissipates heat by means of heat radiating means. It is an object of the present invention to provide a converter device and a refrigeration cycle device capable of reducing power loss and radiation noise by reducing the lead wire or shortening the lead wire. Disclosure of the invention
• a bridge circuit to which four rectifiers are connected; a current detection unit provided between the bridge circuit and a negative output terminal; and the current detection unit.
• a first switching means connected in parallel to one rectifying means on the side to which the current detecting means is connected; and a first switching means connected in parallel to the other rectifying means on the side to which the current detecting means and the current detecting means are connected.
• Connected to the second switch It is characterized by comprising: switching means; and control means for controlling the switching means by performing current detection by the current detection means.
• the current detecting means is provided between the bridge circuit and the negative output terminal, and the control means does not detect the current by the current transformer (CT) but uses a small and inexpensive current detecting means.
• CT current transformer
• the current is detected by this means, and the detection result is used as one of the control parameters to control the switching means to perform power factor improvement, power supply harmonic suppression, DC voltage adjustment, etc.
• the single-layer single-phase converter circuit according to the next invention is characterized in that the two switching means, the first switching means and the second switching means, are switched simultaneously.
• the power factor becomes substantially 1 by simultaneously switching the two switching means, and the actual output voltage becomes the target output voltage.
• the single-phase converter circuit according to the next invention is characterized in that the single-phase converter circuit further includes two reactor means provided on two AC input lines, respectively.
• the two filter means provided on the two AC-side input lines suppress common-system noise, so that the noise filter can be made small and inexpensive.
• a single-phase converter circuit according to the next invention is characterized in that the two reactor means share a core with each other.
• the two reactors share the core with each other, it is sufficient to provide one shared core, and in the case where two separate reactors in which the magnetic flux does not interlink are provided.
• the total inductance can be increased and the number of turns can be reduced.
• a single-phase converter circuit according to the next invention is characterized in that the bridge circuit, the first switching means and the second switching means are molded with an insulating resin and integrated in one module. According to the present invention, the size of the substrate can be further reduced by molding the bridge circuit, the first switching means, and the second switching means with an insulating resin and integrating them in one module.
• the single-phase converter circuit according to the next invention is characterized in that, in the single-phase converter circuit for controlling the switching means by PWM, two reactors sharing a core are provided on two AC-side input lines, respectively. I do.
• two reactor means sharing a core are provided in the two AC input lines, respectively, and the noise filter is reduced in size by using a small reactor means in order to suppress common system noise. It can be inexpensive.
• a reactor used for suppressing harmonics and improving power factor is replaced by a semiconductor element. It is placed on or near the heat conductive substrate provided with the heat dissipating means to be mounted, and the space between the reactor and the heat conductive substrate is sealed with a gel material such as a material with good thermal conductivity and insulation. It is characterized in that the reactor is cooled by heat dissipating means for cooling the semiconductor element by heat conduction.
• At least two or more of the reactors are connected in parallel.
• the converter device according to the next invention is characterized in that a material for improving thermal conductivity is mixed into a whisker-gel material having good thermal conductivity and insulation properties.
• a converter device is characterized in that an EMC countermeasure material is mixed into a resin or gel-like substance having good thermal conductivity and insulation properties.
• the converter device according to the next invention is characterized in that a temperature detecting means is provided on the heat conductive substrate on which the semiconductor element is mounted.
• a refrigeration cycle device includes any one of the above-mentioned conversion devices.
• the reactor arranged in parallel on or near the heat conductive substrate on which the semiconductor element and the like are mounted, and the semiconductor switching element, suppress harmonics and reduce power. It is equipped with a converter device for improving the efficiency, and uses a refrigerant having a higher pressure than R22 as the refrigerant.
• FIG. 1 is a diagram showing a configuration of a single-phase half-bridge converter circuit according to a first embodiment of the present invention.
• FIG. 2 is a single-phase half-bridge converter according to the first embodiment.
• FIG. 3 is an explanatory diagram for explaining the operation of the circuit, and FIG. 3 is a diagram for explaining the current flow of the single-phase half-bridge type converter circuit according to the first embodiment when the AC power supply voltage is positive.
• FIG. 4 is an explanatory diagram for explaining a current flow of the single-phase half-bridge type converter circuit when the AC power supply voltage is negative according to the first embodiment;
• FIG. FIG. 6 is a diagram showing a configuration of a single-phase half-bridge type converter circuit according to a second embodiment of the present invention.
• FIG. 1 is a diagram showing a configuration of a single-phase half-bridge converter circuit according to a first embodiment of the present invention.
• FIG. 2 is a single-phase half-bridge converter according to the first embodiment.
• FIG. 3 is an
• FIG. 6 is a diagram showing a configuration of a reactor according to the second embodiment shown in FIG. Yes, Fig. 7 shows the second embodiment.
• FIG. 8 is a diagram showing a configuration of another reactor, FIG. 8 is a diagram showing a configuration of another single-phase half-bridge type converter circuit according to the second embodiment, and
• FIG. 9 is a diagram showing an embodiment of the present invention.
• FIG. 10 is a diagram showing a configuration of a single-phase half-bridge type converter circuit according to FIG. 3;
• FIG. 10 is a schematic cross-sectional view of a converter device according to Embodiment 4 of the present invention;
• FIG. FIG. 12 is a simplified circuit diagram of a converter device according to Embodiment 4 of the present invention.
• FIG. 12 is an assembly diagram of a converter device according to Embodiment 4 of the present invention.
• FIG. 13 is an embodiment of the present invention.
• FIG. 14 is a schematic cross-sectional view of a converter device according to Embodiment 5.
• FIG. 14 is a conceptual diagram of a system showing a refrigeration cycle device.
• FIG. 15 shows a configuration of a conventional single-phase half-bridge converter circuit.
• FIG. 16 FIG. 17 is a simplified circuit diagram showing a conventional converter device of an air conditioner, and FIG. 17 is a diagram showing a reactor mounted state of the converter device of the conventional air conditioner as viewed from above the outdoor unit.
• FIG. 1 is a diagram illustrating a configuration of a single-phase half-bridge converter circuit according to a first embodiment of the present invention.
• the single-phase half-bridge type converter circuit includes a reactor 3 provided on one of the AC power supply R line and the S line from the noise filter 12 connected to the AC power supply 1, and four rectifiers ( Diodes) 4a, 4b, 4c, and 4d are connected between the diode bridge circuit 4 for full-wave rectification of the AC from the noise filter 1 and the reactor 3 with the output N and the diode bridge circuit 4.
• Diodes Diodes
• this single-phase half-bridge converter circuit is connected in parallel with the shunt resistor 6 for current detection and the rectifier 4c on the side to which the shunt resistor 6 for current detection is connected, and has a polarity opposite to that of the rectifier 4c.
• the side where the connected semiconductor switching element 5a, the current detection shunt resistor 6 and the current detection shunt resistor 6 are connected (so that the current flows in the opposite direction to the rectifier element 4c).
• a semiconductor switching element 5 b connected in parallel with the other rectifying element 4 d so as to have a polarity opposite to that of the rectifying element 4 d (so that a current flows in a direction opposite to that of the rectifying element 4 d);
• the capacitance (smoothing capacitor) 7 provided between the output P and the output N, the target output voltage 8 and the actual output voltage (the voltage of the output P) are input, and the output voltage error signal obtained by amplifying the difference is output.
• Output voltage error amplifier to output 9 Enter the AC voltage of the noise filter 2 and later, and a power supply synchronization circuit 1 0 AC voltage of this output a sinusoidal reference waveform signal full-wave rectified, the.
• this single-phase half-bridge type converter circuit A multiplier 11 that inputs the output voltage error component signal and the sine wave reference waveform signal from the power supply synchronization circuit 10 and outputs an amplified output voltage error signal multiplied by these, and a shunt resistor 6 for current detection
• a current error amplifier that inputs a real current signal generated by the flow of a real current and an output voltage error amplification signal from the multiplier 11, compares these, and outputs a current error amplification signal obtained by amplifying these error components
• the comparator 14 receives the current error amplified signals from the comparator 12 and the triangular wave 13 and the current error amplifier 12 and outputs a PWM drive signal.
• a semiconductor drive element 15 that inputs a PWM drive signal and switches (turns on / off) the semiconductor switching elements 5 a and 5 b in response to the PWM drive signal.
• the reactor 3 is, for example, a coil such as a toroidal coil, and is provided on one of the R line and the S line of the AC power supply.
• the diode bridge circuit 4 has a diode 4a provided between the AC power supply R line and the output P so that a current flows in the output P direction, and an AC power supply S line and an output which flows a current in the output P direction. And a diode 4c provided between the AC power supply R line and the current detecting shunt resistor 6 so that current flows in the AC power supply direction.
• a diode 4 d provided between the AC power supply S line and the shunt resistor 6 for current detection so that a current flows in the power supply direction.
• the current detecting shunt resistor 6 is an extremely small resistor having a resistance value of, for example, about 1 ⁇ , and is provided between the anodes of the diodes 4 c and 4 d and the output N. All the current loops of this single-phase half-bridge type converter circuit pass through the current detecting shunt resistor 6, and the input current to the single-phase half-bridge type converter circuit is generated as a voltage generated across the current detecting shunt resistor 6. Is detected.
• the semiconductor switching elements 5a and 5b are, for example, transistors such as insulated gate bipolar transistors (IGBTs).
• the semiconductor switching element 5a is connected in parallel with the current detecting shunt resistor 6 and one of the rectifying elements 4c to which the current detecting shunt resistor 6 is connected so as to flow a current in the output N direction.
• the semiconductor switching element 5b is connected so as to allow a current to flow in the output N direction in parallel with the current detecting shunt resistor 6 and the other rectifying element 4d to which the current detecting shunt resistor 6 is connected.
• the smoothing capacitor 7 is provided between the output P and the output N to smooth the current.
• the output voltage error amplifier 9 receives the preset target output voltage 8 and the actual output voltage (the voltage of the output P), and outputs an output voltage error signal obtained by amplifying the difference between them.
• the AC voltage after the noise filter 2 is input to the power supply synchronous circuit 10, and a sine wave reference waveform signal obtained by full-wave rectifying the AC voltage is output.
• the multiplier 11 receives the output voltage error signal from the output voltage error amplifier 9 and the sine wave reference waveform signal from the power supply synchronization circuit 10 and outputs an amplified output voltage error signal obtained by multiplying the input signal. In the output voltage error amplification signal, the amplitude of the sine wave corresponds to the output voltage error.
• the current error amplifier 12 inputs the actual current signal converted and detected by the current detection shunt resistor 6 and the amplified output voltage error signal from the multiplier 11, compares them, and amplifies these errors. The amplified current error signal is output.
• the comparator 14 receives the triangular wave 13 and the current error amplified signal from the current error amplifier 12 and compares them, and outputs, for example, a PWM drive signal having a carrier frequency of 20 kHz.
• the semiconductor switching element PWM drive circuit 15 receives the PWM drive signal from the comparator 14 and switches the semiconductor switching elements 5a and 5b in accordance with the PWM drive signal (turns on / off). ). Since the noise filter 2 is a technique well known to those skilled in the art, the description thereof is omitted here.
• the power supply synchronous circuit 10, the output voltage error amplifier 9, the multiplier 11, the current error amplifier 12, the comparator 14, and the semiconductor switching element PWM drive circuit 15 correspond to the control means of the present invention. .
• FIG. 2 is an explanatory diagram for explaining the operation of the single-phase half-bridge converter circuit according to the first embodiment.
• a voltage error signal obtained by amplifying the difference between the actual output voltage and the target output voltage 8 is obtained. 1 i
• a sine wave reference waveform signal is generated in which the AC voltage after the noise filter 12 is full-wave rectified. These signals are multiplied to generate an output voltage error amplification signal whose amplitude of the sine wave corresponds to the output voltage error.
• This output voltage error amplified signal is compared with the actual current signal detected by voltage conversion by the current detecting shunt resistor 6, and a current error amplified signal in which these errors are amplified is generated.
• the amplified current error signal is compared with the triangular wave 13 to generate a PWM drive signal having a carrier frequency of 20 kHz.
• the semiconductor switching element PWM drive circuit 15 switches the semiconductor switching elements 5a and 5b according to the PWM drive signal. Thereby, the semiconductor switching elements 5a and 5b are simultaneously switched so that the power factor becomes substantially 1 and the actual output voltage becomes the target output voltage 8.
• FIG. 3 is an explanatory diagram for explaining a flow of an input current of the single-phase half-bridge type converter circuit according to the first embodiment when the AC power supply voltage is positive.
• FIG. 4 is an explanatory diagram for describing a flow of an input current of the single-phase half-bridge converter circuit when the AC power supply voltage is negative according to the first embodiment.
• the reactor 3 When the AC power supply voltage is positive and the semiconductor switching elements 5a and 5b are off, the reactor 3, the diode 4a, the smoothing capacitor 7, and the current detection shunt from the AC power supply R line of the noise filter 2. A current flows through the loop through the resistor 6 and the diode 4 d to the AC power supply S line of the noise filter 2, and the smoothing capacitor 7 is charged. At this time, the energy stored in the reactor 3 is output to the smoothing capacitor 7 side, and the DC output voltage is boosted.
• the current detecting shunt resistor 6 is provided between the diode bridge circuit 4 and the output N, and the current is detected by the current transformer (CT). Instead, the current is detected by a small and inexpensive shunt resistor 6 for current detection, and the detection result is used as one of the control parameters to control the semiconductor switching elements 5a and 5b to improve power factor and suppress power supply harmonics. Since the DC voltage adjustment and the like are performed, the size of the substrate can be reduced, and the cost can be reduced.
• This single-phase half-bridge converter circuit is particularly effective when applied to air conditioners and other home appliances that require circuit boards (electrical components) to be installed in a narrow space.
• FIG. 5 is a diagram showing a configuration of a single-phase half-bridge type converter circuit according to a second embodiment of the present invention.
• the basic configuration is the same as that of the first embodiment, and the same parts as those in FIG. 1 are denoted by the same reference numerals, and the description thereof will be omitted. Only different parts will be described here.
• This single-phase half-bridge type comparator circuit includes an AC power supply R line and an S line instead of the reactor 3 of the first embodiment. Both have reactors 3a and 3b. Further, instead of the noise filter 2 of the first embodiment, a noise filter 2 a having a simpler configuration and a small size and being inexpensive is provided.
• FIG. 6 is a diagram showing a configuration of reactors 3a and 3b according to the second embodiment shown in FIG.
• the reactors 3a and 3b have a structure in which the same number of copper wires are wound around a core having a high relative magnetic permeability, and do not saturate magnetically until the currents flowing through the reactors 3a and 3b exceed the maximum current.
• the specifications do not significantly decrease.
• it has a noise attenuation characteristic up to about 30 MHz (it has a noise reduction characteristic up to the legally regulated frequency range of the noise terminal voltage of an air conditioner). Has the function of preventing outflow. As a result, the cost and size of the noise filter 1a can be reduced.
• FIG. 7 is a diagram showing a configuration of another reactor according to the second embodiment.
• reactors 3c and 3d having a structure in which the same number of copper wires are wound around the same core are provided instead of reactors 3a and 3b. That is, in this example, the same number of copper wires are wound around the loop-shaped core having a high relative permeability so as to form a harmonic connection in which the magnetic fluxes of the reactors 3c and 3d are added.
• the two reactors 3 c and 3 d share a core, so that only one shared core needs to be provided, and two separate reactors 3 a, Since the total inductance can be increased and the number of windings can be reduced as compared with the case where 3b is provided, the size of the reaction coils 3c and 3d can be reduced, and the board size can be further reduced. can do.
• Such a configuration using reactor cores 3c and 3d sharing a core is also applicable to a case where a CT is used as in the conventional example without providing a current detection shunt resistor 6 as shown in FIG.
• the noise filter 2a can be reduced in size and cost
• the reactors 3c and 3d can be reduced in size.
• the third embodiment according to the present invention is different from the first or second embodiment in that part or all of the single-phase half-bridge type converter circuit is molded with an insulating resin and integrated into one module. is there.
• FIG. 9 is a diagram showing a configuration of a single-phase half-bridge converter circuit according to Embodiment 3 of the present invention. Note that the basic configuration is the same as in Embodiments 1 and 2, and the same components as those in FIG. 5 are denoted by the same reference numerals and description thereof will be omitted. explain.
• This single-phase half-bridge type converter circuit is the same as the single-phase half-bridge type converter circuits of the first and second embodiments, except that the diode bridge circuit 4, which is an electronic component through which a large current flows, and the semiconductor switching elements 5a, 5b
• the shunt resistor 6 for current detection has a sufficiently thicker wiring than the thin film wiring, and is connected by a lead frame 43.
• These are molded with insulating resin and integrated to form one module 42.
• This module 42 is connected via the board mounting terminals 4 ia to 4 lg Attached to the circuit board.
• the operation of the third embodiment is the same as that of the first and second embodiments, and a description thereof will be omitted.
• the diode bridge circuit 4, the semiconductor switching elements 5a and 5b, and the current detecting shunt resistor 6 are molded with an insulating resin and integrated to form one module.
• the size of the substrate can be further reduced as compared with the case where these are formed on a thin film wiring substrate.
• high-voltage large currents of about AC 100 to 240 V, 20 A, and DC 40 OV must be used for home appliances such as air conditioners, and electrical equipment must be stored in a narrow space. Can be effectively used for products that do not.
• Thin film wiring compatible with AC 100 to 240 V, 200 A, and DC 400 V requires a wide pattern width, creepage, and clearance, but these restrictions are eliminated by modularization, and compact Is possible.
• the circuit loop area and the wiring length are reduced, it is possible to suppress the radiation noise caused by the wiring inductance and the malfunction due to the radiation noise.
• the current detection shunt resistor 6 is externally connected to the module without taking it into the module, and the current detection level can be easily set by changing the resistance value of the current detection shunt resistor 6. It is also possible.
• control circuits such as a power supply synchronous circuit 10, an output voltage error amplifier 9, a multiplier 11, a current error amplifier 12, a comparator 14, a semiconductor switching element, and a PWM drive circuit 15 are also included in the module. Further downsizing can be achieved.
• the reactors are divided and connected in parallel to reduce the size of each unit to a size mountable on a board, and to radiate by connecting to the main circuit board with a redress. Enables reduction of noise and noise. Furthermore, by sealing the reactor and a heat conductive substrate provided with a heat dissipating means on which the semiconductor switching element is mounted with a resin or gel material having good heat conductivity and insulation properties, the semiconductor switching element is sealed. The reactor is also cooled using the heat radiation means. Also, do not mix EMC (Electric Magnetic Compatibility) measures materials or materials that improve thermal conductivity into the resin or gel-like material that encapsulates the reactor. Ten
• FIG. 10 is an example of a schematic cross-sectional view showing a compander device of the present invention.
• FIG. 11 shows a simplified circuit diagram of an air conditioner equipped with the converter device of the present invention.
• FIG. 12 is an assembly diagram of the converter device of the present invention.
• the semiconductor switching element 101 and the diode 116 of the converter section shown in FIG. 11 are mounted on the heat conductive substrate 114 by soldering.
• An insulating resin case 1 17 is formed so as to form a box shape with the conductive substrate 1 14 as the bottom surface, and the heat dissipating means 105 and the heat conductive substrate 1 14 are closely attached by the mounting screws 1 18 I have.
• the reactor 102 which has been divided and reduced in size to the board mounting size, is mounted on the reactor board 119, and is arranged hierarchically above the heat conductive board 114, and is a bus bar taken out in the vertical direction of the board. By means of such connection means, the substrate 119 is fixed and electrically connected.
• the space between the heat conductive substrate 114 and the reactor substrate 119 is filled with a resin or a gel-like substance 115 having good thermal conductivity and insulation properties, and the reactor 110 is formed by using heat radiating means 105. It is configured to be able to radiate the heat of 2. In addition, it is also possible to improve the thermal conductivity by mixing a filler such as anolemina into a resin or gel-like substance.
• a control board 121 is disposed further above the reactor board 119, and the semiconductor switching elements 101 and the like are mounted thereon and similarly connected by a connecting means such as a bus bar or a connector. The uppermost part is sealed with an insulating resin, and an AC power supply input terminal, an output terminal, and a control interface terminal are attached as external terminals 122.
• the control circuit according to the embodiment of the present invention includes a reactor as shown in FIG. 102 is divided into four parts, and the semiconductor switching element 101 is connected to the reactor 102, respectively.
• an air conditioner with an input current of about 3 OA at the peak if the reactor is divided into four parts, the current flowing per unit can be suppressed to within 8 A at the peak, so the reactor can be mounted on a board, and
• the mechanically wound reactor of the product can be selected, and even if the number of reactors used increases, the cost can be reduced compared to a single high-current reactor.
• the semiconductor switching element 101 (M0S-FET) mounted on the thermally conductive substrate 114 has a small input current of 3 OA because there are few general-purpose surface-mount type products for large currents exceeding 10 A.
• one or two or more semiconductor switching elements 101 are provided for each reactor 102 individually.
• the heat conductive substrate 114 also includes heat-generating components other than the semiconductor switching element 101, such as a shunt resistor 123 for current detection, and a gate resistance element. 24, temperature sensor 125, and other components that should be placed close to the driving and protection of the semiconductor switching element 101 are also mounted.
• MOS-FETs surface-mounted semiconductor switching elements
• IGBTs semiconductor switching elements
• each reactor will be individually designed. There is no need to provide semiconductor switching elements, the number of elements in the converter can be reduced, the semiconductor switching elements in the inverter can be mounted in the vacant space, and the main circuit of the air conditioner can be mounted on a heat conductive substrate of almost the same size. Everything enters, and the size of the board is reduced.
• the reactor substrate 119 is inserted into a box-shaped insulating resin case 117, as shown in Fig. 12, and then filled with a resin or gel-like substance with good thermal conductivity and insulating properties. ⁇ In the case of a gel-like substance, it is also possible to fill the inside of the insulating resin case 117 first, and then insert the reactor substrate 119 later.
• the converter device that improves the power factor by using the semiconductor switching element 101 uses a high-frequency voltage oscillation because the semiconductor switching element 101 sharply changes the current and voltage. This causes strong radiated noise using the circuit loop of the main circuit section shown in FIG. 11 as an antenna.
• the converter loop of this invention reduces a circuit loop by being integrated, and suppresses a radiation noise.
• EMC and other EMC materials such as graphite and alumina, which have the effect of suppressing radiation noise, into the reactor 102 and the resin or gel-like substance 115 that encapsulates the circuit in the reactor. Radiation noise can be suppressed in the width.
• a control board 122 arranged above the reactor board 119 includes a circuit for controlling the semiconductor switching element 101 for power factor improvement, suppressing harmonics, and controlling the bus voltage to an arbitrary level, and a circuit for controlling the outside.
• the control interface circuit is connected to the uppermost external connection terminal and a board with good thermal conductivity on which the semiconductor switching element is mounted by a bus bar or connector.
• a control circuit can be built on the reactor board to provide a two-stage converter device consisting of a board with good thermal conductivity and a reactor board.
• the compressor 13 1 When the converter / inverter device of the present invention is used in the converter / inverter device for controlling the drive motor of the present invention, the refrigeration cycle device has low noise and low vibration and has reduced radiation noise. In particular, the refrigerant used in the refrigeration cycle conventionally degrades the ozone layer.
• the HCFC-based R22 refrigerant which does not destroy the ozone layer, does not destroy the ozone layer.
• HFC-based R410, R407C, R32, and HC4 When a refrigerant having a higher pressure than R22 such as R600A of the system is used, the input power to the compressor tends to increase, so that the influence of radiation noise increases, but as in the present invention, By connecting a plurality of reactors in parallel, it is possible to shorten the length of the wiring through which the main current such as the lead wire 103 flows, reduce radiated noise, and make the converter device suitable for alternative refrigerants Can o.
• FIG. 13 is an example of a schematic sectional view showing a converter device of the present invention.
• the semiconductor switching element 101, the diode 116, and the reactor 102 which is divided and reduced to the board mounting size, are mounted on the heat conductive substrate 114.
• the insulating resin case 1 17 is formed in a box shape with the heat conductive substrate 1 14 as the bottom surface, and the heat dissipating means 1 05 and the heat conductive substrate 1 1 4 are closely attached by the mounting screw 1 1 8 Have been.
• a control board 121 is disposed above the reactor 102, and the board 121 is fixed and electrically connected by connection means such as a bus bar taken out in the vertical direction of the board. The top part is sealed with insulating resin, and the AC power input terminal, output terminal, and control interface terminal are attached as external connection terminals 122 to provide the same performance as in the fourth embodiment. It is possible to obtain a converter device having:
• the current detection means is provided between the bridge circuit and the negative output terminal, and the control means does not perform the current detection using the current transformer (CT).
• CT current transformer
• the current is detected by the small and inexpensive current detection means, and the detection result is used as one of the control parameters to control the switching means.To improve the power factor, suppress power supply harmonics, adjust DC voltage, etc. It is advantageous in that the size can be reduced and the cost can be reduced.
• the power factor becomes almost 1 and the actual output voltage becomes the target output voltage, so that the board size can be reduced and the cost can be reduced. It works.
• the noise filter can be made small and inexpensive. To reduce costs It has the effect of being able to
• the two reactor means share the core with each other, it is sufficient to provide one shared core, and the total is smaller than the case where two separate reactor means in which magnetic flux is not linked are provided. Since the inductance can be increased and the number of windings can be reduced, the effect that the reactor means can be downsized and the substrate size can be downsized.
• the bridge circuit, the first switching means, and the second switching means are molded with an insulating resin and integrated into one module, the size of the substrate can be further reduced.
• the two reactor means sharing the core are provided on the two AC-side input lines, respectively. Since the noise filter can be made small and inexpensive by using the reactor means, there is an effect that the substrate size can be reduced and the cost can be reduced.
• the reactor used for suppressing harmonics and improving the power factor is arranged on or near the heat conductive substrate provided with a heat dissipating means on which a semiconductor element or the like is mounted, Good thermal conductivity and insulation between the reactor and the heat conductive substrate.
• Resin can be cooled by the heat dissipation means that cools the semiconductor element by heat conduction by encapsulating it with resin or gel-like material.
• there is an effect that deterioration of a soldered portion of the reactor due to a rise in temperature can be prevented.
• the peak value of the current flowing per reactor can be suppressed, and the size can be mounted on the board and a general-purpose reactor can be used. This has the effect of suppressing radiation noise and reducing cost due to miniaturization.
• the heat dissipation property of the reactor can be improved because a material that improves the heat conductivity is mixed into a resin or gel-like substance that has good thermal conductivity and insulation properties. This has the following effect.
• the reactor used for suppressing harmonics and improving the power factor is arranged in parallel on or near the heat conductive substrate on which the semiconductor element and the like are mounted.
• the single-phase converter circuit it is useful to reduce the size of the substrate and to reduce the cost. It is suitable for power supply harmonic suppression and DC voltage adjustment.
• the reactor is divided and connected in parallel to reduce the size of the reactor to a size that can be mounted on the substrate, and is useful for actively dissipating heat by the heat dissipating means. Yes, it is suitable for reducing processing variations and radiation noise by relaxing the layout and structural constraints, suppressing the rise in temperature inside the electrical component box, and shortening or using leadless wires.

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• Mechanical Engineering (AREA)
• Thermal Sciences (AREA)
• General Engineering & Computer Science (AREA)
• Rectifiers (AREA)
• Dc-Dc Converters (AREA)
• Power Conversion In General (AREA)

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• 2001
  • 2001-03-13 CN CNB018006523A patent/CN1265539C/zh not_active Expired - Lifetime
  • 2001-03-13 WO PCT/JP2001/001952 patent/WO2001073933A1/ja active Application Filing
  • 2001-03-13 ES ES01912304T patent/ES2383553T3/es not_active Expired - Lifetime
  • 2001-03-13 ES ES08002429.2T patent/ES2612002T3/es not_active Expired - Lifetime
  • 2001-03-13 EP EP01912304A patent/EP1198058B1/de not_active Expired - Lifetime
  • 2001-03-13 EP EP08002429.2A patent/EP1921737B1/de not_active Expired - Lifetime

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