WO2001067835A1 - Appareil pour l'inspection de la pate de soudure appliquee sur une carte de circuit imprime et pour l'apport supplementaire en pate de soudure - Google Patents

Appareil pour l'inspection de la pate de soudure appliquee sur une carte de circuit imprime et pour l'apport supplementaire en pate de soudure Download PDF

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Publication number
WO2001067835A1
WO2001067835A1 PCT/KR2001/000367 KR0100367W WO0167835A1 WO 2001067835 A1 WO2001067835 A1 WO 2001067835A1 KR 0100367 W KR0100367 W KR 0100367W WO 0167835 A1 WO0167835 A1 WO 0167835A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder paste
dispensing
circuit board
pcb
inspection
Prior art date
Application number
PCT/KR2001/000367
Other languages
English (en)
Inventor
Byung Jun Oh
Original Assignee
Ari Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ari Co., Ltd. filed Critical Ari Co., Ltd.
Publication of WO2001067835A1 publication Critical patent/WO2001067835A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive

Definitions

  • the present invention relates to a method and an apparatus for surface mounting electronic components on a printed circuit board, and more particularly to an apparatus for inspecting and dispensing a solder paste on the printed circuit board, i.e., a method and an apparatus for inspecting a dispensing state of the solder paste firstly printed on the printed circuit board and refills the printed circuit board with supplementary solder paste according to inspection result.
  • a printed circuit board which is essentially embedded in electronic appliances such as computers and home appliances, is printed with a solder in a melted state (hereinafter called 'solder paste') in a predetermined pattern in order to surface mount small electronic parts such as semiconductor chips and resistant chips thereon.
  • the solder paste is printed on the PCB usually by a solder paste dispenser called a screen printer.
  • the screen printer applies the solder paste on the component mounted place of the PCB by squeezing out solder paste applied on a metal mask that has a predetermined pattern of opening therein.
  • FIG. 1 schematically shows an arrangement of main units in a general electronic components mounting line. Referring to FIG. 1, the general electronic component mounting process is as follows.
  • the screen printer 12 applies solder paste on the PCB that is successively supplied by a PCB loading device 11 Then, with a solder paste inspector 14, the dispensing state of the solder paste is inspected, and it is determined whether the solder paste is dispensed approp ⁇ ately or not
  • the solder paste inspector 14 uses a vision system, or the like For example the solder paste inspector 14 determines whether the dispensing state of the solder paste is approp ⁇ ate or not based on a difference calculated between an actual area of the solder paste p ⁇ nted on the PCB as inspected and a preset image data about an average area of the solder paste normally p ⁇ nted on a reference PCB
  • the undesignated reference numeral 13 refers to a glue dispensing machine for dispensing solidifying adhesive such as a glue on the mounting place of the PCB for the relatively heavier electronic components such as a quad flat package (QFP) and a connector
  • the reference numerals 15a and 15b are buffer conveyors disposed for balanced tact time between the respective processes, I e , for load balance, and reference numeral 17 is different shape chip mounter for mounting components of different shapes, 18 is a reflow machine for solidifying mounting of the mounted components, and 19 is a PCB unloading device for discharging the PCB completed with the electronic component mounting
  • the PCB has also been designed to be thinner
  • the amount of the printed solder paste varies depending on the thickness of the metal mask of the screen printer 12.
  • the thickness of the solder paste is determined within the range of 80 ⁇ m-150 ⁇ m.
  • the PCB when mounting the electronic components on both sides of the PCB in the conventional electronic component mounting line, the PCB is reversed after the electronic components are mounted on one side thereof Then, with its other side facing upward on the mounting line, the PCB is mounted with the electronic components thereon and the solder paste is solidified, sequentially.
  • the electronic components soldered on one side of the PCB is input to the reflow machine 18 and the solidified solder paste thereof is re-subjected to the temperature close to the melting point (approximately 20°C). Accordingly, the solder paste is melted, and defectiveness occurs like early cooling of the solder paste, deviation or separation of the relatively larger and heavier electronic components such as the quad flat package and connector from the initial position of the PCB.
  • the present invention has been made to overcome the problems of the conventional method for mounting the electronic components, and it is an object of the present invention to provide a method for mounting electronic components on a p ⁇ nted circuit board that improves the quality of the mounted component by increasing quality precision and inspection reliability about the state that the solder paste is dispensed on the p ⁇ nted circuit, while minimizing the possibility of having defectiveness.
  • Another object of the present invention is to provide an apparatus that integrates solder paste inspecting and dispensing functions into one unit, for firstly inspecting the dispensing state of the solder paste p ⁇ nted on the p ⁇ nted circuit board by a screen p ⁇ nter, and supplementary refilling the p ⁇ nted circuit board with the solder paste on a taught location according to the result of the first inspection.
  • Yet another object of the present invention is to provide an apparatus that integrates solder paste inspecting and dispensing functions into one unit, for firstly inspecting the dispensing state of the solder paste p ⁇ nted on the p ⁇ nted circuit board by a screen p ⁇ nter, and supplementary refilling the p ⁇ nted circuit board with the solder paste on a taught location according to the result of the first inspection without having to repeatedly inspecting the dispensing state of the solder paste.
  • Yet another object of the present invention is to provide an apparatus that integrates solder paste inspecting and dispensing functions into one unit, for inspecting the dispensing state of a solder paste p ⁇ nted on a p ⁇ nted circuit board by a screen p ⁇ nter, and supplementary refilling the p ⁇ nted circuit board with the solder paste according to the result of the inspection, while simultaneously applying a bond on a taught location of the p ⁇ nted circuit board for solidifying mounted components.
  • the above object is accomplished by a method for attaching and thereby mounting an electronic component on a solder paste p ⁇ nted on a p ⁇ nted circuit board according to a dispensing state of the solder paste inspected by a vision system, the method in accordance with the present invention including the steps of inputting an image information about a normal dispensing state of the solder paste normally p ⁇ nted on a reference p ⁇ nted circuit board, and calculating and sto ⁇ ng reference data, dispensing the solder paste on a p ⁇ nted circuit board as inspected, inputting image information about the dispensing state of the solder paste p ⁇ nted on the p ⁇ nted circuit board as inspected, and calculating inspection data, compa ⁇ ng the reference data with resultant data of the inspection and outputting a difference obtained from the compa ⁇ son, and supplementary dispensing the solder paste on the p ⁇ nted circuit board as inspected according to the resultant data of the inspection.
  • an apparatus for inspecting and dispensing a solder paste on a p ⁇ nted circuit board in accordance with the present invention including supporting means for positioning thereby supporting the p ⁇ nted circuit board on which the solder paste is firstly p ⁇ nted by a screen p ⁇ nter, image recognizing means for inputting image information about a dispensing state of the solder paste p ⁇ nted on the p ⁇ nted circuit board, and outputting resultant data, a controller for compa ⁇ ng data about image information output by the image recognizing means with a preset reference data, and outputting a control signal according to the compa ⁇ son result, positioning means controlled by the control signal of the controller to be moved to certain coordinates on an orthogonal coordinate, and a solder paste dispenser disposed on and thus connectively d ⁇ ven with the positioning means, to supplementary dispense the solder paste on a certain location on the p ⁇ nted circuit board according to the control signal of the controller.
  • the positioning means includes an adhesive dispenser disposed on and thus connectively d ⁇ ven with the positioning means, for dispensing an adhesive for a solidification of a mounted component on a certain location on the p ⁇ nted circuit board in accordance with the control signal of the controller
  • the solder paste dispenser is preferably d ⁇ ven by a dnvmg unit formed on the positioning means and thus raised and lowered with respect to the p ⁇ nted circuit board
  • the dnvmg unit includes a dnving motor, a ball screw coaxially disposed with an output shaft of the dnving motor, a moving member disposed to be moved along a shaft of the all screw, and an actuator disposed on the moving member for supporting the solder paste dispenser.
  • the adhesive dispenser is preferably d ⁇ ven by a raising unit formed on the positioning means to be raised and lowered with respect to the pnnted circuit board
  • the raising unit includes a dnving motor, a dnving pulley disposed on the output shaft of the dnving motor, a dnven pulley connected to the d ⁇ ving pulley through a belt, a ball screw coaxially disposed on the dnven pulley, a movable member disposed to be moved along the shaft of the ball screw, and an actuator disposed on the movable member to support the adhesive dispenser.
  • FIG. 1 is a view schematically showing one example of a conventional line for mounting electronic components on a pnnted circuit board
  • FIG. 2 is a perspective view schematically showing an appearance of an apparatus for inspecting and dispensing a solder paste in accordance with the present invention
  • FIG. 3 is a schematic perspective view showing the main portion of FIG. 2 m greater detail
  • FIG. 4 is a flowchart for explaining a process of inspecting and dispensing the solder paste in accordance with the present invention
  • FIG. 5 is a view schematically showing an anangement of units for mounting electronic components with the apparatus for inspecting and dispensing solder paste employed therein in accordance with the present invention.
  • the apparatus 200 for inspecting and dispensing the solder paste in accordance with the present invention includes an image recognizing means 30 for inspecting the dispensing state of the solder paste firstly pnnted on a pnnted circuit board 1 (PCB) by a screen p ⁇ nter (not shown), a solder paste dispenser 50 for supplementary refilling the PCB 1 with the solder paste on a location taught in accordance with the result of the inspection of the image recognizing means 30, and an adhesive dispenser 70 for dispensing a solidifying adhesive such as a glue on the taught location of the PCB 1.
  • an image recognizing means 30 for inspecting the dispensing state of the solder paste firstly pnnted on a pnnted circuit board 1 (PCB) by a screen p ⁇ nter (not shown)
  • a solder paste dispenser 50 for supplementary refilling the PCB 1 with the solder paste on a location taught in accordance with the result of the inspection of the image recognizing means 30, and an adhesive dispenser 70 for dispens
  • the image recognizing means 30, the solder paste dispenser 50, and the adhesive dispenser 70 are integrated into one unit so that the same are controlled with respect to the PCB 1 sequentially
  • the apparatus 200 for inspecting and dispensing the solder paste in accordance with the present invention will be descnbed in greater detail with reference to FIGS. 2 and 3
  • the image recognizing means 130, the solder paste dispenser 150, and the adhesive dispenser 170 are supported on a positioning means 120 such as an X-Y orthogonal robot to be moved to certain coordinates on a base frame 100
  • a conveyor 101 for conveying and thus supplying PCBs 1 firstly pnnted with the solder paste by a screen pnnter (not shown) in a certain direction, and a supporting means 110 mounted on the conveyor 101 to support the PCB 1 to a state that the PCB 1 is positioned on the lower portion of an image input side of the image recognizing means 130
  • the supporting means 110 includes a cell type positioning conveyor 111 that takes a certain part of the conveyor 101 and is moved in a direction perpendicular to the conveyance direction of the PCB 1, and an actuator 112 for raising and aligning the PCB 1 from the positioning conveyor 111 to the inspection position at a certain height
  • the image recognizing means 130 is aimed to input image information about the dispensing state of the solder paste p ⁇ nted on the PCB 1 and outputs signal data
  • a general vision system that include a vision camera 131, a control portion 133 for processing signals, a monitor 135 for displaying the image data, and a signal generator such as a mouse 136 and a keyboard 137 for teaching and inputting signal information about a certain location of the image information as displayed on the monitor 135
  • the image data about the dispensing state of the solder paste on the PCB recognized by the vision camera 131 is input to a controlling means such as a computer system, or the like, to be used as an information signal about the result of the inspection and also used as a control signal
  • the control portion 133 is input with reference data about image information on the dispensing state of the solder paste normally pnnted on a reference PCB, and together with the control signal, the control portion 133 outputs signal information about companson between the image data about the dispensing state of the solder paste pnnted on the PCB as inspected and the reference data to the monitor 125 and to a mam controller 180 which are provided to the base frame 100
  • the main controller 180 controls the positioning means 120 by the control signal output from the control portion 133 of the image recognizing means 130 so that the positioning means 120 is moved to certain coordinates on the base frame 100.
  • the signal generator 137 are used as the signal generator through which an operator inputs a command to teach the location that the operator determines needs solder paste refill based on the image information displayed on the monitor 135. For example, when the operator clicks the mouse 136 on a certain position of the image information as displayed on the monitor 135 he/she wants to teach, an identifying number such as a distinctive number is input to the clicked area, and the control signal is output from the ma controller 180 according to the identifying signal Accordingly, the positioning means 120 is moved to the certain coordinates on the base frame 100, to refill the taught area of the PCB with the supplemental solder paste.
  • the dnving unit 160 includes a ball screw 163 coaxially disposed on an output shaft of a dnving motor 161, a moving member 165 movably disposed on the shaft of the ball screw 163, and an actuator 167 disposed on the moving member 165 in a manner of supporting the solder paste dispenser 160
  • the adhesive dispenser 170 is raised and lowered with respect to the PCB 1 by a raising unit 180 disposed on the positioning means 120
  • the raising unit 180 includes a dnving pulley 182 disposed on the output shaft of the dnving motor 181, a d ⁇ ven pulley 183 connected to the dnving pulley 182 through a belt B, a movable member 185 disposed to be moved along the shaft of the ball screw 184 that is coaxially disposed with the d ⁇ ven pulley 183, and an actuator 186 disposed on the movable member 185 for supporting the adhesive dispenser 170.
  • the operation of the apparatus for inspecting and dispensing the solder paste constructed as above in accordance with the present invention will be described in greater detail with reference to FIGS. 2 through 4.
  • the PCB 1 which is firstly p ⁇ nted with the solder paste by the screen pnnter (not shown), is moved in a certain direction by the conveyor 101 (step SI 10)
  • the PCB 1 is positioned by the cell type positioning conveyor 111, and raised and thus firstly aligned at a certain height by the actuator 112 (step S120).
  • the cell type positioning conveyor 111 conveys the PCB 1 m a direction perpendicular to an initial conveyance direction, to secondly position and align the PCB 1 below the image input side of a CCD camera 131 of the image recognizing means 130.
  • the vision camera 131 of the image recognizing means 131 is moved to the inspection coordinates, and to recognize the image information about the dispensing state of the solder paste on the PCB 1 as inspected (step S130)
  • control portion 133 of the vision camera 131 compares the inspection data of the recognized image information with the reference data corresponding to the image information obtained from the inspection of the dispensing state of the solder paste normally dispensed on the reference PCB, and outputs signal information about the compa ⁇ son result to the monitor 135 (step S140).
  • step SI 50 it is determined whether the solder paste is dispensed on the PCB 1 appropnately or not. For example, based on a difference calculated by compa ⁇ ng the area of the solder paste dispensed on the PCB as inspected with a preset image information about the area of the solder paste normally disposed on a reference PCB, it is determined whether the solder paste is dispensed approp ⁇ ately or not. If the solder paste is mapprop ⁇ ately dispensed, the control portion 131 of the vision camera 131 outputs a control signal, which conesponds to the information output to the monitor 135, to the main controller 180 of the base frame 100 (step S160).
  • the main controller 180 controls the positioning means 120 to move the positioning means to certain coordinates on the base frame 100 and supplementary dispense the solder paste on the certain coordinates of the PCB 1 (step S170).
  • the operator may refill the desired area with the supplemental solder paste by determining the area that needs supplement solder paste and inputting a teaching command to refill the area w ith the solder paste based on the image information displayed on the monitor 135. More specifically, when the operator clicks the mouse 136 on the certain area he/she wants to teach among the image information displayed on the monitor 135, information signal such as identifying number is input to the clicked area Accordingly, the main controller 180 controls the positioning means 120 so that the positioning means 120 is moved to certain coordinates on the base frame 100, and the solder paste dispenser 150 is moved to the certain coordinates on the PCB 1 to refill the area with the supplemental solder paste (step S170)
  • the solder paste dispenser 150 supplies the solder paste in a state that the solder paste dispenser 150 is lowered with respect to the PCB 1 by the dnving unit 160 That is, when the d ⁇ ving motor 161 is dnven by the control signal of the main controller 180, the ball screw 163 disposed on the output shaft is rotated, and accordingly, the moving member 165 is moved along the shaft of the ball screw 163, lowenng the actuator 167 supported on the moving member 165 and thus lowenng the solder paste dispenser 150 by a predetermined distance
  • the adhesive dispenser 170 is moved to certain coordinates on the PCB 1 by the d ⁇ ving of the positioning means 120 according to the control signal taught and output to the mam controller 180, to thereby dispense the solidifying adhesive such as a glue to the area in a predetermined pattern
  • the apparatus for inspecting and dispensing the solder paste in accordance with the present invention is disposed between the screen pnnter 12 and the chip mounter 16 to inspect the dispensing state of the solder paste that is firstly pnnted on the PCB by the screen p ⁇ nter 12, and if a certain area of certain coordinates is determined to have inapprop ⁇ ately dispensed solder paste, to refills the certain area with the solder paste m a dot or linear pattern.
  • the apparatus for inspecting and dispensing the solder paste in accordance with the present invention can increase a mounting solidity for relatively heavy components such as a quad flat package and connector by dispensing separate solidifying adhesive such as a glue on a pre-taught area of the PCB completed with the solder paste dispensing
  • the apparatus for inspecting and dispensing a solder paste in accordance with the present invention adds a function of inspecting a dispensing state of the solder paste firstly pnnted on a PCB by a screen p ⁇ nter with a function of refilling an area taught by the inspection result with supplemental solder paste. Accordingly, quality precision and inspection reliability about the dispensing state of the solder paste p ⁇ nted on the PCB are increased, while the defectiveness is minimized and the productivity is maximized.
  • the apparatus for inspecting and dispensing a solder paste in accordance with the present invention integrates two functions of inspecting the dispensing state of the solder paste and supplementary dispensing the solder paste according to the inspection result in one unit disposed between the screen p ⁇ nter and the chip mounter, thereby shortening the line of the electronic component mounting line.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Une unité intégrale comprend : une partie de reconnaissance d'image pour l'inspection de l'état d'application d'une pâte de soudure qui est d'abord appliquée sur une carte de circuit imprimé par une machine à sérigraphier ; un distributeur de pâte de soudure supplémentaire, conçu pour distribuer la pâte de soudure sur un endroit de la carte signalé par une information fonction du résultat d'inspection de la partie de reconnaissance d'image ; et un distributeur d'adhésif, conçu pour distribuer un adhésif destiné à durcir les composants montés sur ladite carte de circuit imprimé, à l'endroit signalé par une information séparée. Les opérations respectives de la partie de reconnaissance d'image, le distributeur de pâte de soudure supplémentaire et le distributeur d'adhésif, sont commandés séquentiellement par rapport à la carte. Ainsi, à l'endroit où la pâte de soudure est mal appliquée, il est possible d'en rajouter. Etant donné que la précision de la qualité et la fiabilité d'inspection de l'état d'impression de la pâte de soudure appliquée sur la carte de circuit imprimé, sont améliorées, la qualité est accrue et la proportion de défauts est réduite. Ainsi, la productivité est maximisée.
PCT/KR2001/000367 2000-03-10 2001-03-09 Appareil pour l'inspection de la pate de soudure appliquee sur une carte de circuit imprime et pour l'apport supplementaire en pate de soudure WO2001067835A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20000011947 2000-03-10
KR2000/11947 2000-03-10

Publications (1)

Publication Number Publication Date
WO2001067835A1 true WO2001067835A1 (fr) 2001-09-13

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PCT/KR2001/000367 WO2001067835A1 (fr) 2000-03-10 2001-03-09 Appareil pour l'inspection de la pate de soudure appliquee sur une carte de circuit imprime et pour l'apport supplementaire en pate de soudure

Country Status (2)

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KR (1) KR200236121Y1 (fr)
WO (1) WO2001067835A1 (fr)

Cited By (13)

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DE102007019073A1 (de) * 2007-04-23 2008-11-06 Ekra Automatisierungssysteme Gmbh Asys Group Verfahren und Vorrichtung zum Aufbringen von Medien auf flächige Substrate
KR100929911B1 (ko) * 2007-11-28 2009-12-04 주식회사 프로텍 디스펜싱 예비 검사장치
US20100206189A1 (en) * 2007-02-20 2010-08-19 Charles Moncavage Screen printing machine and method
CN102601066A (zh) * 2012-03-16 2012-07-25 德州泓淋电子有限公司 一种测试打胶一体机
WO2012078894A3 (fr) * 2010-12-08 2012-10-26 Illinois Tool Works Inc. Procédés de dépôt de matériau visqueux sur un substrat à l'aide d'une imprimante au pochoir et distributeur combinés
US8474377B2 (en) 2010-12-08 2013-07-02 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
US8739699B2 (en) 2010-12-08 2014-06-03 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
US8746139B2 (en) 2010-12-08 2014-06-10 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
CN104010442A (zh) * 2014-05-29 2014-08-27 苏州锟恩电子科技有限公司 一种批量传送操作的pcb板焊线、点胶机
CN104010440A (zh) * 2014-05-29 2014-08-27 苏州锟恩电子科技有限公司 一种批量操作的pcb板焊线、点胶机
CN104245317A (zh) * 2012-04-27 2014-12-24 株式会社高永科技 丝网印刷装备的补正方法及利用该方法的基板检测系统
DE102014202170A1 (de) * 2014-02-06 2015-08-20 Ekra Automatisierungssysteme Gmbh Vorrichtung und Verfahren zum Bedrucken von Substraten
DE102016122308A1 (de) 2016-11-21 2018-05-24 Asm Assembly Systems Gmbh & Co. Kg Räumliche Speicherung von Bauelementen zwischen Bearbeitungsstationen

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KR100819803B1 (ko) * 2006-04-06 2008-04-07 삼성테크윈 주식회사 솔더 페이스트 검사 방법
JP4490468B2 (ja) 2007-10-10 2010-06-23 シーケーディ株式会社 半田印刷検査装置
KR101483160B1 (ko) * 2014-05-30 2015-01-16 주식회사 파미 인쇄회로 기판에 도포된 솔더페이스트에 대한 삼차원 측정수단과 보충용 디스펜싱수단이 일체화된 장치
KR101483161B1 (ko) * 2014-05-30 2015-01-16 주식회사 파미 디스펜서 내장형삼차원 측정 장치

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Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100206189A1 (en) * 2007-02-20 2010-08-19 Charles Moncavage Screen printing machine and method
US9327490B2 (en) 2007-02-20 2016-05-03 Asm Assembly Systems Switzerland Gmbh Screen printing machine and method having vision camera coupled to material-dispensing effector
DE102007019073A1 (de) * 2007-04-23 2008-11-06 Ekra Automatisierungssysteme Gmbh Asys Group Verfahren und Vorrichtung zum Aufbringen von Medien auf flächige Substrate
EP2140744A1 (fr) * 2007-04-23 2010-01-06 Ekra Automatisierungssysteme GmbH Procede et systeme pour appliquer des substances sur des substrats plats
KR100929911B1 (ko) * 2007-11-28 2009-12-04 주식회사 프로텍 디스펜싱 예비 검사장치
US8746139B2 (en) 2010-12-08 2014-06-10 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
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