WO2000002808A1 - Robots for microelectronic workpiece handling - Google Patents

Robots for microelectronic workpiece handling Download PDF

Info

Publication number
WO2000002808A1
WO2000002808A1 PCT/US1999/015567 US9915567W WO0002808A1 WO 2000002808 A1 WO2000002808 A1 WO 2000002808A1 US 9915567 W US9915567 W US 9915567W WO 0002808 A1 WO0002808 A1 WO 0002808A1
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
end effector
transport unit
housing
section
Prior art date
Application number
PCT/US1999/015567
Other languages
English (en)
French (fr)
Inventor
Wayne J. Schmidt
Thomas H. Oberlitner
Original Assignee
Semitool, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semitool, Inc. filed Critical Semitool, Inc.
Priority to EP99933843A priority Critical patent/EP1112220A1/en
Priority to KR1020017000407A priority patent/KR20010074695A/ko
Priority to JP2000559045A priority patent/JP2003527737A/ja
Priority to US09/386,590 priority patent/US6322119B1/en
Priority to US09/386,566 priority patent/US6318951B1/en
Publication of WO2000002808A1 publication Critical patent/WO2000002808A1/en
Priority to US09/759,998 priority patent/US20030198551A1/en
Priority to US09/875,428 priority patent/US6749390B2/en
Priority to US09/875,300 priority patent/US6752584B2/en
Priority to US10/080,910 priority patent/US6749391B2/en
Priority to US10/873,568 priority patent/US20040228719A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/0009Constructional details, e.g. manipulator supports, bases
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/08Programme-controlled manipulators characterised by modular constructions

Definitions

  • microelectronic devices As the microelectronics industry advances toward efficient and economical
  • An automated apparatus used for processing a microelectronic workpiece such as a
  • This apparatus utilizes a plurality of workpiece processing modules or
  • Workpiece transport units are used to access
  • a workpiece cassettes and transfer workpieces throughout the processing apparatus A workpiece
  • conveyor supports and guides the workpiece transport units for transferring individual workpieces
  • workpiece conveyor also includes a transport unit guide, such as an elongated rail, which defines a transport unit guide
  • the workpiece transport units which move along the rail are configured to have a workpiece transfer arm assembly having an end
  • the transfer arm assembly can be adjusted in
  • Some processing modules require the workpiece to be oriented with
  • modules such as electroplating reactors, utilize a processing head which can be "flipped", i.e., rotated, between a first position in which the processing head is positioned to receive the workpiece
  • processing requires complicated head operator mechanisms for rotating the processing heads.
  • operator mechanisms can require substantially heavy or large structures for rotating the processing
  • the present inventors have recognized that reducing or eliminating the requirement for processing modules to turn over or flip a workpiece for processing would simplify the overall
  • processing stations may have varying wafer
  • the present invention is directed to a workpiece conveyor system that is used for transporting
  • the workpiece conveyor system includes an improved workpiece
  • transport unit that carries the workpieces within the apparatus on, for example, a conveyor rail or the
  • the transport unit includes a vertical member extending from a housing.
  • An arm member is a member extending from a housing.
  • effector is disposed at a distal end of the arm member and is selectively driven in rotation about a horizontal axis to "flip" the workpiece between a face-up orientation and a face-down orientation.
  • the effector is preferably configured to grip an edge of a workpiece, such as a semiconductor wafer,
  • the workpiece transport unit In accordance with one embodiment of the present invention, the workpiece transport unit
  • the transport unit can be driven linearly on the rail
  • the vertical member can be raised or lowered vertically along a vertical axis (Y).
  • the arm member can be rotated about the vertical axis (Zl) and a distal portion of the arm
  • the end effector can rotate or "flip" about a
  • the arm member preferably includes a rotary actuator
  • a workpiece transport unit having a vacuum
  • the vacuum gripping mechanism for holding a workpiece to the end effector.
  • the vacuum gripping mechanism for holding a workpiece to the end effector.
  • two workpiece transport units are slidable on
  • At least one of the transport units includes a first end
  • the vertical space is sufficiently projected in a horizontal direction for
  • the two transport units can be overlapped in plan, and the two transport units can be moved longitudinally along the
  • FIGURE 1 is an exploded perspective view of a workpiece processing tool incorporating
  • FIGURE 2 is a perspective view of the improved workpiece conveyor system shown in FIGURE 1;
  • FIGURE 3 is a sectional view taken generally along line 3-3 of FIGURE 2;
  • FIGURE 4 is a perspective view of a workpiece transport unit constructed in accordance with one embodiment of the present invention.
  • FIGURE 5 is an exploded perspective view of the workpiece transport unit shown in FIGURE 4;
  • FIGURE 6 A is a partial exploded perspective view of the robot arm components of the
  • FIGURE 6B is a partial exploded perspective view of the robot arm components of
  • FIGURE 6A FIGURE 6B being a continuation of FIGURE 6A;
  • FIGURE 7 is a side view of the robot arm components of FIGURES 6A, 6B, as
  • FIGURE 8 is a sectional view taken generally along line 8-8 of FIGURE 7;
  • FIGURE 9 is a sectional view taken generally along line 9-9 of FIGURE 8.
  • FIGURE 10 is an enlarged fragmentary sectional view from FIGURE 8.
  • FIGURE 11 is an enlarged fragmentary right side view taken from FIGURE 7;
  • FIGURE 12 is an enlarged fragmentary sectional view taken from FIGURE 8;
  • FIGURE 13 is an enlarged perspective view of one embodiment of an end effector
  • FIGURE 14 is a rear perspective view of the workpiece transport unit of FIGURE 4 in
  • FIGURE 15 is a plan view of the end effector of FIGURE 13;
  • FIGURE 16 is a sectional view taken generally along line 16-16 of FIGURE 15;
  • FIGURE 17 is an enlarged fragmentary sectional view taken from FIGURE 16, shown
  • FIGURE 18 is an enlarged fragmentary sectional view taken generally along line 18-18
  • FIGURE 19 is an enlarged fragmentary sectional view taken from FIGURE 16;
  • FIGURE 20 is an enlarged fragmentary sectional view of an alternative embodiment
  • FIGURE 21 is an enlarged view taken from FIGURE 20;
  • FIGURE 22 is an end view of an alternative workpiece processing tool having a
  • FIGURE 23 is an enlarged view taken from FIGURE 22;
  • FIGURE 24 is a plan view of the workpiece processing tool of FIGURE 22;
  • FIGURE 25 is an exploded perspective view of an end effector of the robot arm shown in
  • FIGURE 20 and a workpiece
  • FIGURE 26 is a plan view of the end effector of FIGURE 25;
  • FIGURE 27 is a bottom view of the end effector of FIGURE 26;
  • FIGURE 28 is an enlarged view taken from FIGURE 26;
  • FIGURE 29 is an enlarged view taken from FIGURE 26;
  • FIGURE 30 is a sectional view taken along line 30-30 in FIGURE 26;
  • FIGURE 31 is a plan view of the end effector of FIGURE 25, holding a workpiece
  • FIGURE 32 is a sectional view taken along line 32-32 in FIGURE 31;
  • FIGURE 33 is a sectional view taken along line 33-33 in FIGURE 31;
  • FIGURE 34 is a sectional view taken along line 34-34 in FIGURE 31.
  • FIGURE 1 illustrates an exemplary modular workpiece processing apparatus 10 that may use
  • apparatus 10 includes an
  • the apparatus 10 also includes
  • workpiece processing stations may be secured to one another about the workpiece conveying system
  • workpiece conveyor 20 is disposed in the processing chamber so that it can access each of a plurality
  • a plurality of the processing modules 14, 16 may be secured in an end-to-end configuration
  • the workpiece conveying system 20 of one apparatus 10 is programmed to cooperate with the workpiece conveying system 20 of one or more prior or
  • FIGURE 2 illustrates further details of the workpiece conveyor 20 for transporting
  • conveyor 20 generally includes one or more workpiece transport units 30,32 that are coupled for
  • the transport unit guide 26 preferably
  • transport unit guide 26 comprises an elongate spine 26a mounted on a frame 28.
  • transport unit guide 26 may
  • workpiece conveyor 20 and transport unit guide 26 may be formed as a track or other elongate configuration for guiding workpiece transport units 30, 32 thereon.
  • the length and shape of workpiece conveyor 20 and transport unit guide 26 may be varied,
  • the workpiece transport unit guide 26 includes a spine that
  • Each workpiece transport unit 30, 32 preferably engages a respective pair of the upper and
  • Each pair of guide rails can mount one or more transport units
  • Each workpiece transport unit 30, 32 is powered along the respective path by a suitable
  • drive operators 61, 64 are mounted to respective sides of transport unit guide 26 to provide controllable axial movement of workpiece transport units 30, 32 along the
  • the drive operator 61. 64 may be linear magnetic motors for providing
  • operators 61 , 64 are preferably linear brushless direct current motors. Such preferred drive operators
  • 61, 64 utilize a series of magnetic segments which magnetically interact with a respective
  • electromagnet 69 mounted on each of the workpiece transport units 30, 32 to propel the units along
  • Cable guards 72, 73 may be connected to respective workpiece transport units 30, 32 and
  • Cable guard 72, 73 may comprise
  • the workpiece transport unit 30 is coupled with a first side of the
  • Each workpiece transport unit 30, 32 can include four linear bearings 136, 140, 138, 142 for
  • FIGURE 4 illustrates a workpiece transport unit 30 which is substantially identical to the
  • the transport unit 30 includes a robot arm or arm member 100 extending horizontally from a
  • the arm member 100 includes a first arm section 110 rotatably
  • the first arm section 1 10 is rotatable about a vertical axis
  • the second rotatable arm section 114 is rotatable about a vertical axis Z2 with respect to the first arm section 110.
  • the end effector 108 is rotatable about a horizontal axis (or "flip" axis) R, perpendicular to the vertical axes Zl and Z2.
  • the housing 106 includes a vertically arranged base plate 120, a first top cover plate 122, a
  • shroud 128 comprises side walls 129, 130 and a back wall 132.
  • lower linear bearings 140, 142 is a brushless motor 69, which acts on the drive operator 61 of the
  • a head reader linear encoder 149 provides a position signal
  • FIGURE 5 illustrates the various components that are disposed inside of the housing 106.
  • a lift assembly 154 and cooperating components of arm assembly 100 are disposed
  • the lift assembly 154 includes the various components used drive the arm assembly 100
  • the lift assembly 154 includes a lead screw motor 156 which turns a threaded lead screw 158 that, and turn, is disposed for rotation within a lift bracket 160.
  • lead screw nut 162 is threaded onto the lead screw 158 and fastened to a lift nut adaptor 164.
  • lead screw 158 about its axis will advance the nut 162 and the adaptor 164 upwardly, axially along the lead screw 158. Reverse rotation of the lead screw motor 156 will lower the nut 162 and adaptor
  • an absolute position sensor 165 100 along the vertical axis Z2 is provided by an absolute position sensor 165.
  • the arm member 100 is connected to vertical rail 176 for movement along the vertical axis Z2.
  • a vertical linear bearing assembly 170 having a track 172 and a sliding element 174 is arranged
  • the vertical member includes at a base end thereof a carrier plate
  • the arm member 100 can be vertically raised and lowered by the adaptor 164 through actuation
  • the linear bearing assembly 170 ensures a precise and stable vertical
  • a lift encoder 177 is connected to the driven shaft of the lead screw
  • FIGURES 6 A and 12 illustrate a first rotational movement motor 200 which, by rotation of
  • the motor 200 is connected by a motor mount
  • a coupling 214 connects the output shaft 201 of the motor 200 to an input shaft 218 of a tube
  • the resolver sensor 226 sends a precise rotary position signal of the tube assembly 220
  • FIGURES 6B, 8 and 9 illustrate the connection of tube 220 to a lower housing 242 of the first
  • a top cover 245 fits over the lower housing 242 to form a
  • FIGURES 6B and 8 through 10 illustrate components for imparting rotation of the second
  • a second rotational motor 240 is housed
  • the motor 240 is vertically supported by a motor
  • flange 248 is also fastened to a top of the motor 240 as shown in FIGURE 8, by fasteners (not
  • An output shaft 250 of the motor 240 receives a pulley flange 252, a drive pulley 254 and
  • the second rotation motor 240 includes a rotary position encoder (not shown) integrated
  • the encoder sends a rotary position signal to a control unit for control of the transport
  • a wrist torque tube 260 is mounted for rotation within
  • the arm belt 290 is driven by the drive
  • a bearing 264 (shown schematically) held by a bearing retainer 266, and a torque tube retainer 272 support and guide the torque tube 260.
  • mount 268 is mounted with a rotary absolute encoder 270 to the lower housing 242.
  • the rotary rotary absolute encoder 270 is mounted with a rotary absolute encoder 270 to the lower housing 242.
  • absolute encoder generates a rotational position signal of the second arm section 114 with respect
  • the position signal is provided to a control for the transport unit.
  • An absolute encoder cover 274 mates with the bottom of the lower housing 242.
  • a robot wrist housing 280 fastened to the lower
  • a flip axis amplifier 292 is a flip axis amplifier 292, and a spring loaded belt tensioner 294.
  • the tensioner 294 includes an idler pulley 295 for maintaining
  • the idler pulley is carried by a plate 297 which is pivoted about a pin
  • the plate is spring loaded by a spring (not shown)
  • the force of the spring rotates the plate to press the idler pulley 295 against the belt 290.
  • the second rotational motor 240 is selectively actuated to circulate the belt 290 which is
  • FIGURES 6B and 10 illustrate the flip axis components which allow rotation of the effector
  • the flip axis motor 302 is selectively actuated to rotate the end effector
  • the flip axis motor is connected to an actuator mount 304.
  • bearing housing 306 is located within the cover 300 and holds a bearing 308 (shown schematically)
  • a flip axis hub 312 is mounted to the end effector 108.
  • the flip axis motor includes an output shaft 350 connected, at a back end of the motor 302,
  • the redundant rotary position encoders provide a signal to a
  • control unit of the transport unit that corresponds to the rotary position of the effector 108 about the
  • flange 356 is attached by fasteners to the flip axis hub 312 (registering fastener holes shown in FIGURE 6B).
  • the flip axis hub 312 includes an annular bearing surface 360 which is journaled for rotation
  • the bearing 308 is held in place by the bearing retainer 310 which is attached by fasteners to the bearing housing 306 (registering fastener holes shown in FIGURE 6B).
  • bearing housing 306 includes a base portion 362 which .s fastened to the wrist torque tube 260 and
  • the actuator mount 304 is attached by fasteners 305 to a rear side of the bearing housing 306.
  • the actuator mount 304 is attached by fasteners to a front
  • a pneumatic cylinder 414 includes a spring 470 which exerts
  • Pressurized air introduced into the port 422 acts on the piston 472 in opposition to the force of
  • annular space 600 is provided around the pneumatic
  • This pneumatic tubing as well as the conductors can be routed from the space 600 backwardly, partly
  • circuit cables disposed in cavities 260b. This arrangement winds up or unwinds these cables about
  • conductors can then be routed through the encoder housing 224, upwardly into the volume 244
  • FIGURES 13 through 16 illustrate one embodiment of the edge-gripping end effector 108.
  • the end effector 108 includes a paddle 400 extending from a base portion 400a (shown
  • the paddle 400 is substantially Y-shaped with two
  • a gripper body 404 is
  • the pneumatic actuator 414 is connected
  • pneumatic actuator 414 is connected to the rear flange 356 of the effector 108, by fasteners (not
  • the pneumatic actuator 414 includes the pressurized air inlet port 422 which can be a
  • the gripper body 404 includes a guide tab 428 at a front end thereof, overlying the paddle
  • the guide tab includes, on a top surface thereof, a semicylindrical groove 430.
  • tab 428 includes a ramp surface 440 on a front end thereof, declined downwardly in a forward
  • a workpiece sensor 442 On a front surface of the gripper body 404 is a workpiece sensor 442. The workpiece sensor
  • a light emitting and receiving sensor which emits a light beam and, if a workpiece is present on
  • the paddle 400 receives a light reflection from the workpiece. If no workpiece is present the
  • sensor 442 emits an infrared light beam.
  • the pins are preferrably formed from plastic material. For simplicity, only the pin 452 will be
  • the pin 452 has a cylindrical body 456 with a radially
  • top flange 458 extending top flange 458 and an intermediate base 460.
  • the base 460 fits onto a stepped region 462
  • the intermediate base 460 has an
  • the declined surface 466 ensures that only an edge
  • FIGURE 18 illustrates the workpiece W ( shown solid) initially resting on an edge 467 thereof
  • the plunger 434 includes a conical tip 434a which has an inclined
  • portion 474 that pushes and overlies an edge 475 of the workpiece W to vertically retain the
  • the ramp surface 440 ensures that the workpiece is only contacted
  • the plunger includes a cylindrical slender forward extension 434b, which includes the tip
  • the barrel portion 434c is a cylindrical tool gripping portion 434d having opposing flat surfaces 434e,
  • the plunger 434 fits into a stepped bore 476.
  • bore 476 includes a forward slender bore 476a for guiding the slender forward extension 434b and
  • the workpiece edge is pressed into the vertical contact surface 456a of the pins and between the ramp surface 440 and the inclined surface 474.
  • the workpiece can be released by
  • FIGURE 20 illustrates an alternative robot arm assembly 500.
  • the robot arm assembly is
  • a first rotatable arm section 510 includes the electric motor 240 and the
  • a vacuum chamber cap 546 is
  • the first arm section 510 includes a housing 560
  • housing 560 for being connected to a source of vacuum, and is in flow communication with a
  • the channel 570 through the wrist tube 540.
  • the channel is in flow communication with an indented
  • the vacuum chamber cap 546 includes an inlet portion 574 which
  • the inlet portion 574 includes a plurality of ports 576
  • the inlet nozzle 578 extends upwardly into an axial channel 580
  • FIGURE 22 illustrates a processing tool 600 having a central workpiece conveyor system
  • the workpiece conveyor system 620 includes a workpiece transport unit guide 26 as previously
  • transport units 630, 632 one slidably mounted on each side of the guide as previously described.
  • the workpiece transport unit 630, 632 incorporate the robot transfer arm 500 as described
  • FIGURE 23 illustrates a compact lateral arrangement of the transport units 630, 631 having
  • a lateral outside dimension 640 for compact mutual sliding along the guide rail 26.
  • wafer W held thereby can underlie the (left) end effector 562 and wafer W held thereby in close
  • the transport unit 630 thereby can overlie the (right) end effector 522 and wafer W held thereby.
  • FIGURE 24 illustrates the (left and right) transport units 630, 632 in this compact, retracted
  • the transport units can deliver
  • FIGURES 22-24 allows for simultaneous linear transfer of wafers by both
  • the vacuum cap 546 of the robot arm assembly has an
  • the result of the described configuration is a reduced tool footprint, when viewed in plan view, of approximately nine inches in width.
  • FIGURE 8 could also be modified to extend the torque tube 260
  • FIGURE 25 illustrates an alternative embodiment end effector 700 for gripping a workpiece
  • the end effector 700 includes a paddle member 706 and a link member 708.
  • the paddle member 706 is fastened to the link member 708.
  • the paddle member 706 includes
  • paddle member includes four holes which receive locator pins or buttons 714 which locate the wafer
  • a link member vacuum closeout 716 closes the vacuum channel 760
  • FIGURE 26 illustrates a top surface 706a of the paddle 706.
  • the paddle 706 includes parallel
  • prongs 722, 724 At the distal end of the prongs are raised wafer supporting ridges or pad areas 726,
  • the locator pins 714 are located adjacent to the pad areas 726, 727. At the base end of the
  • paddle 706 is an elongated wafer supporting ridge or pad area 730.
  • Locator pins 714 are located at opposite ends of the pad area 730.
  • the pad areas 726, 727, 730 circumscribe a portion of a circle
  • FIGURE 27 illustrates the bottom of the paddle member 706 which includes the elongate
  • vacuum channel 740 which is surrounded by a recesssed ledge 742 which corresponds to the shape
  • vacuum closeout 710 shown in FIGURE 25. Additionally, within the vacuum channel 740 are located vacuum ports or holes 744 which open the vacuum channel through a thickness of the vacuum closeout 710 shown in FIGURE 25.
  • FIGURE 28 illustrates the pad area 727 including a vacuum port 744 therethrough which is
  • FIGURE 31 illustrates the wafer W located between the four locator pins 714 and covering
  • FIGURE 32 shows the link member vacuum closeout 716 which closes the elongate vacuum
  • the closeout 716 includes an inlet opening 764 and an outlet opening 766.
  • opening 764 communicates with the vacuum chamber cap 546 as shown in FIGURE 21.
  • FIGURES 33 and 34 illustrate one of the locator pins 714 in more detail.
  • FIGURES 25-34 The end effector assembly of FIGURES 25-34 provides a vacuum manifold which
  • the elevated vacuum pad areas contact the wafer surface only in a preselected
  • buttons or locator pins 714 provide guide "furniture” with angled lead-in to precisely locate the wafer relative to the raised pad
  • the vacuum gripping end effector of FIGURES 25-34 may offer some advantages over the
  • the wafer may cause the wafer to slide relative to the paddle. To prevent the wafer from interfering
  • FIGURES 25-34 simplifies robot movement by only requiring a lift up to attach the vacuum pad areas to the wafer.
  • the plunger type edge grip requires a wafer presence sensor system separate from the
  • grip mechanism This includes an electrical/optic sensor such as described with the previous
PCT/US1999/015567 1996-07-15 1999-07-09 Robots for microelectronic workpiece handling WO2000002808A1 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
EP99933843A EP1112220A1 (en) 1998-07-11 1999-07-09 Robots for microelectronic workpiece handling
KR1020017000407A KR20010074695A (ko) 1998-07-11 1999-07-09 마이크로일렉트릭 제품 취급용 로봇
JP2000559045A JP2003527737A (ja) 1998-07-11 1999-07-09 マイクロ電子ワークピース取扱い用ロボット
US09/386,590 US6322119B1 (en) 1999-07-09 1999-08-31 Robots for microelectronic workpiece handling
US09/386,566 US6318951B1 (en) 1999-07-09 1999-08-31 Robots for microelectronic workpiece handling
US09/759,998 US20030198551A1 (en) 1997-12-15 2001-01-11 Robots for microelectronic workpiece handling
US09/875,428 US6749390B2 (en) 1997-12-15 2001-06-05 Integrated tools with transfer devices for handling microelectronic workpieces
US09/875,300 US6752584B2 (en) 1996-07-15 2001-06-05 Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US10/080,910 US6749391B2 (en) 1996-07-15 2002-02-22 Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces
US10/873,568 US20040228719A1 (en) 1996-07-15 2004-06-22 Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11410598A 1998-07-11 1998-07-11
US09/114,105 1998-07-11

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
US08/990,107 Continuation-In-Part US6672820B1 (en) 1996-07-15 1997-12-15 Semiconductor processing apparatus having linear conveyer system
US11410598A Continuation-In-Part 1997-12-15 1998-07-11

Related Child Applications (3)

Application Number Title Priority Date Filing Date
US09/386,590 Continuation US6322119B1 (en) 1996-07-15 1999-08-31 Robots for microelectronic workpiece handling
US09/386,566 Continuation US6318951B1 (en) 1996-07-15 1999-08-31 Robots for microelectronic workpiece handling
US09/759,998 Continuation US20030198551A1 (en) 1997-12-15 2001-01-11 Robots for microelectronic workpiece handling

Publications (1)

Publication Number Publication Date
WO2000002808A1 true WO2000002808A1 (en) 2000-01-20

Family

ID=22353387

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/015567 WO2000002808A1 (en) 1996-07-15 1999-07-09 Robots for microelectronic workpiece handling

Country Status (6)

Country Link
EP (1) EP1112220A1 (ja)
JP (1) JP2003527737A (ja)
KR (1) KR20010074695A (ja)
CN (1) CN1411420A (ja)
TW (1) TW496848B (ja)
WO (1) WO2000002808A1 (ja)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6318951B1 (en) 1999-07-09 2001-11-20 Semitool, Inc. Robots for microelectronic workpiece handling
US6322119B1 (en) 1999-07-09 2001-11-27 Semitool, Inc. Robots for microelectronic workpiece handling
WO2002045137A2 (en) * 2000-11-29 2002-06-06 Tokyo Electron Limited Reduced edge contact wafer handling system and method of retrofitting and using same
US6623609B2 (en) 1999-07-12 2003-09-23 Semitool, Inc. Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same
US6749390B2 (en) 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
US6752584B2 (en) 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US6822413B2 (en) 2002-03-20 2004-11-23 Fsi International, Inc. Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector
US6976822B2 (en) 2002-07-16 2005-12-20 Semitool, Inc. End-effectors and transfer devices for handling microelectronic workpieces
WO2006031975A2 (en) * 2004-09-15 2006-03-23 Applied Materials, Inc. Improved systems and methods for wafer translation
EP1755151A1 (de) * 2005-08-18 2007-02-21 Asys Automatic Systems Gmbh & Co. Kg Bearbeitungsanlage modularen Aufbaus für flächige Substrate
US7281741B2 (en) 2001-07-13 2007-10-16 Semitool, Inc. End-effectors for handling microelectronic workpieces
US7374393B2 (en) 2005-12-22 2008-05-20 Applied Materials, Inc. Method of retaining a substrate during a substrate transferring process
WO2008136778A1 (en) * 2007-05-07 2008-11-13 Manufacturing Integration Technology Ltd Apparatus for object processing
US7779540B2 (en) 2005-08-12 2010-08-24 United Technologies Corporation Apparatus and method for quadrail ergonomic assembly
CN101670535B (zh) * 2008-09-08 2012-07-04 山崎马扎克公司 加工装置
CN102815541A (zh) * 2011-06-10 2012-12-12 泰惟机械有限公司 金属制品堆叠机
CN103803294A (zh) * 2012-11-08 2014-05-21 沈阳新松机器人自动化股份有限公司 用于搬运板状工件的侧翻装置
US8911193B2 (en) 2004-12-22 2014-12-16 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
CN104742113A (zh) * 2013-12-30 2015-07-01 常州中科智联机电科技有限公司 自动化取料送料机械手装置
US9358682B2 (en) 2006-02-03 2016-06-07 The European Atomic Energy Community (Euratom), Represented By The European Commission Medical robotic system
US9524897B2 (en) 2012-04-09 2016-12-20 Semiconductor Technologies & Instruments Pte Ltd End handler for film and film frames and a method thereof
CN105127984B (zh) * 2012-08-09 2018-11-09 日本电产三协株式会社 工业用机器人及其控制方法
CN113231656A (zh) * 2021-07-13 2021-08-10 新乡职业技术学院 一种数控车床自动化上下料装置
CN113352336A (zh) * 2021-06-04 2021-09-07 上海广川科技有限公司 一种用于晶圆翻转的后置偏心装置
WO2022241052A1 (en) * 2021-05-14 2022-11-17 Lam Research Corporation Blade-type end effector with angular compliance mechanism
CN115504366A (zh) * 2022-11-23 2022-12-23 中铁开发投资集团有限公司 一种场站装配式厂房立柱快速定位、吊装设备及方法

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8573919B2 (en) 2005-07-11 2013-11-05 Brooks Automation, Inc. Substrate transport apparatus
US9524896B2 (en) 2006-09-19 2016-12-20 Brooks Automation Inc. Apparatus and methods for transporting and processing substrates
KR100810610B1 (ko) 2006-10-25 2008-03-07 삼성전자주식회사 벨트장력 조절장치 및 이를 갖는 로봇암
JP5247094B2 (ja) * 2007-09-14 2013-07-24 インテヴァック インコーポレイテッド 基板処理システム
JP5235376B2 (ja) * 2007-10-05 2013-07-10 川崎重工業株式会社 ロボットのターゲット位置検出装置
WO2009066573A1 (ja) * 2007-11-21 2009-05-28 Kabushiki Kaisha Yaskawa Denki 搬送ロボット、それを備えた局所クリーン化された筐体、及びそれを備えた半導体製造装置
CN101483993B (zh) * 2008-01-11 2011-06-08 富葵精密组件(深圳)有限公司 电路板投收系统及使用该电路板投收系统进行翻板的方法
KR100994341B1 (ko) * 2008-10-24 2010-11-12 하이디스 테크놀로지 주식회사 플렉시블 기판의 이송 장치
JP4957753B2 (ja) * 2009-06-15 2012-06-20 セイコーエプソン株式会社 ロボット、搬送装置、及び慣性センサーを用いた制御方法
CN101698253B (zh) * 2009-06-19 2011-07-20 南京理工大学 高温锯片自动传送专用机械装置
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CN102284668A (zh) * 2011-05-02 2011-12-21 苏州工业园区高登威科技有限公司 抓铆钉机械手
US8496790B2 (en) * 2011-05-18 2013-07-30 Applied Materials, Inc. Electrochemical processor
CN103182710A (zh) * 2011-12-29 2013-07-03 沈阳新松机器人自动化股份有限公司 双臂大气机械手及应用其的机器人
JP5601331B2 (ja) * 2012-01-26 2014-10-08 株式会社安川電機 ロボットハンドおよびロボット
US20130200915A1 (en) * 2012-02-06 2013-08-08 Peter G. Panagas Test System with Test Trays and Automated Test Tray Handling
JP2013198960A (ja) * 2012-03-26 2013-10-03 Disco Corp ロボットハンド
CN102975192B (zh) * 2012-12-10 2014-12-24 山东电力集团公司电力科学研究院 一种航空标志球自动装卸机器人
CN103600590B (zh) * 2013-11-06 2016-03-16 青岛中科英泰商用系统股份有限公司 带有印泥补充装置和旋转机构的盖章机
CN104260090A (zh) * 2014-05-30 2015-01-07 东莞市三润田自动化设备有限公司 具有多个自由度的机械手
CN105398635B (zh) * 2014-08-12 2017-10-24 上银科技股份有限公司 外壳自动定位的方法
CN104354161B (zh) * 2014-10-25 2018-08-10 东莞三润田智能科技股份有限公司 五轴机械手
JP6468804B2 (ja) * 2014-10-30 2019-02-13 ライフロボティクス株式会社 ロボットアーム機構
CN104369046A (zh) * 2014-11-25 2015-02-25 武汉奋进电力技术有限公司 一种h型机器人
CN104526698B (zh) * 2014-12-04 2016-06-01 北京七星华创电子股份有限公司 一种高强度的机械手臂、控制方法以及机械手装置
JP6582492B2 (ja) * 2015-03-31 2019-10-02 セイコーエプソン株式会社 ロボットシステム
CN104881031B (zh) * 2015-05-29 2018-07-06 南京理工大学 一种电力系统轨道式自动巡检机器人
CN104891172B (zh) * 2015-06-12 2017-05-24 乐清市风杰电子科技有限公司 一种鞋料输送抓取机构
EP3778141B1 (en) * 2015-08-07 2023-09-27 Nidec Sankyo Corporation Industrial robot
CN105082101A (zh) * 2015-08-10 2015-11-25 苏州普京真空技术有限公司 一种移动吸附装置
CN106684027B (zh) * 2015-11-11 2020-06-19 北京北方华创微电子装备有限公司 一种微电子加工设备及方法
CA3169689C (en) 2016-01-08 2024-04-02 Berkshire Grey Operating Company, Inc. Systems and methods for acquiring and moving objects
CN106041239A (zh) * 2016-06-24 2016-10-26 宁夏小牛自动化设备有限公司 双手自动取料装置及自动取料方法和串焊机
CN106001817A (zh) * 2016-06-29 2016-10-12 北京金迈斯智能设备科技有限公司 一种电火花机床专用机器人
US11167434B2 (en) * 2016-08-30 2021-11-09 HighRes Biosolutions, Inc. Robotic processing system
EP3509800A4 (en) * 2016-09-06 2019-09-18 Advanced Intelligent Systems Inc. MOBILE WORKSTATION FOR TRANSPORTING A VARIETY OF ARTICLES
JP6862907B2 (ja) * 2017-02-27 2021-04-21 株式会社ジェイテクト 搬送装置
JP2019010691A (ja) * 2017-06-29 2019-01-24 日本電産サンキョー株式会社 産業用ロボットのハンドおよび産業用ロボット
JP6900862B2 (ja) * 2017-09-22 2021-07-07 株式会社デンソーウェーブ 移動ロボット
CN107813319B (zh) * 2017-11-13 2020-09-29 苏州工业园区职业技术学院 一种多轴工业悬臂
CN109822600A (zh) * 2017-11-23 2019-05-31 四川长虹智能制造技术有限公司 一种炒菜设备的送料机械手
CN110125949B (zh) * 2019-05-14 2022-02-18 徐州工业职业技术学院 一种汽车零部件加工的挑料机器人及其工作方法
CN110370310B (zh) * 2019-06-19 2020-11-06 宁波润华全芯微电子设备有限公司 一种机械手
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CN111776747B (zh) * 2020-07-31 2021-12-14 林铭兰 一种转运机构及采用该转运机构的马桶生产线
KR102528159B1 (ko) * 2021-06-15 2023-05-08 (주)대성하이텍 웨이퍼의 반전이송모듈
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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4451197A (en) * 1982-07-26 1984-05-29 Advanced Semiconductor Materials Die Bonding, Inc. Object detection apparatus and method
US4639028A (en) * 1984-11-13 1987-01-27 Economic Development Corporation High temperature and acid resistant wafer pick up device
US4670126A (en) * 1986-04-28 1987-06-02 Varian Associates, Inc. Sputter module for modular wafer processing system
US4770590A (en) * 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
US4944650A (en) * 1987-11-02 1990-07-31 Mitsubishi Kinzoku Kabushiki Kaisha Apparatus for detecting and centering wafer
US5639206A (en) * 1992-09-17 1997-06-17 Seiko Seiki Kabushiki Kaisha Transferring device
US5711646A (en) * 1994-10-07 1998-01-27 Tokyo Electron Limited Substrate transfer apparatus
US5746565A (en) * 1996-01-22 1998-05-05 Integrated Solutions, Inc. Robotic wafer handler
US5759006A (en) * 1995-07-27 1998-06-02 Nitto Denko Corporation Semiconductor wafer loading and unloading apparatus, and semiconductor wafer transport containers for use therewith
US5765889A (en) * 1995-12-23 1998-06-16 Samsung Electronics Co., Ltd. Wafer transport robot arm for transporting a semiconductor wafer

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4451197A (en) * 1982-07-26 1984-05-29 Advanced Semiconductor Materials Die Bonding, Inc. Object detection apparatus and method
US4639028A (en) * 1984-11-13 1987-01-27 Economic Development Corporation High temperature and acid resistant wafer pick up device
US4670126A (en) * 1986-04-28 1987-06-02 Varian Associates, Inc. Sputter module for modular wafer processing system
US4770590A (en) * 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
US4944650A (en) * 1987-11-02 1990-07-31 Mitsubishi Kinzoku Kabushiki Kaisha Apparatus for detecting and centering wafer
US5639206A (en) * 1992-09-17 1997-06-17 Seiko Seiki Kabushiki Kaisha Transferring device
US5711646A (en) * 1994-10-07 1998-01-27 Tokyo Electron Limited Substrate transfer apparatus
US5759006A (en) * 1995-07-27 1998-06-02 Nitto Denko Corporation Semiconductor wafer loading and unloading apparatus, and semiconductor wafer transport containers for use therewith
US5765889A (en) * 1995-12-23 1998-06-16 Samsung Electronics Co., Ltd. Wafer transport robot arm for transporting a semiconductor wafer
US5746565A (en) * 1996-01-22 1998-05-05 Integrated Solutions, Inc. Robotic wafer handler

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6752584B2 (en) 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US6749390B2 (en) 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
US6322119B1 (en) 1999-07-09 2001-11-27 Semitool, Inc. Robots for microelectronic workpiece handling
US6318951B1 (en) 1999-07-09 2001-11-20 Semitool, Inc. Robots for microelectronic workpiece handling
US6623609B2 (en) 1999-07-12 2003-09-23 Semitool, Inc. Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same
WO2002045137A3 (en) * 2000-11-29 2003-03-20 Tokyo Electron Ltd Reduced edge contact wafer handling system and method of retrofitting and using same
US6692219B2 (en) 2000-11-29 2004-02-17 Tokyo Electron Limited Reduced edge contact wafer handling system and method of retrofitting and using same
WO2002045137A2 (en) * 2000-11-29 2002-06-06 Tokyo Electron Limited Reduced edge contact wafer handling system and method of retrofitting and using same
US7281741B2 (en) 2001-07-13 2007-10-16 Semitool, Inc. End-effectors for handling microelectronic workpieces
US6822413B2 (en) 2002-03-20 2004-11-23 Fsi International, Inc. Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector
US6976822B2 (en) 2002-07-16 2005-12-20 Semitool, Inc. End-effectors and transfer devices for handling microelectronic workpieces
US7993093B2 (en) 2004-09-15 2011-08-09 Applied Materials, Inc. Systems and methods for wafer translation
WO2006031975A2 (en) * 2004-09-15 2006-03-23 Applied Materials, Inc. Improved systems and methods for wafer translation
WO2006031975A3 (en) * 2004-09-15 2006-07-27 Applied Materials Inc Improved systems and methods for wafer translation
US8911193B2 (en) 2004-12-22 2014-12-16 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7779540B2 (en) 2005-08-12 2010-08-24 United Technologies Corporation Apparatus and method for quadrail ergonomic assembly
EP1755151A1 (de) * 2005-08-18 2007-02-21 Asys Automatic Systems Gmbh & Co. Kg Bearbeitungsanlage modularen Aufbaus für flächige Substrate
US7845892B2 (en) 2005-08-18 2010-12-07 Jusung Engineering Co, Ltd. Movable transfer chamber and substrate-treating apparatus including the same
US7374393B2 (en) 2005-12-22 2008-05-20 Applied Materials, Inc. Method of retaining a substrate during a substrate transferring process
US7374391B2 (en) 2005-12-22 2008-05-20 Applied Materials, Inc. Substrate gripper for a substrate handling robot
US9358682B2 (en) 2006-02-03 2016-06-07 The European Atomic Energy Community (Euratom), Represented By The European Commission Medical robotic system
WO2008136778A1 (en) * 2007-05-07 2008-11-13 Manufacturing Integration Technology Ltd Apparatus for object processing
US8727693B2 (en) 2007-05-07 2014-05-20 Manufacturing Integration Technology Ltd Apparatus for object processing
CN101670535B (zh) * 2008-09-08 2012-07-04 山崎马扎克公司 加工装置
CN102815541A (zh) * 2011-06-10 2012-12-12 泰惟机械有限公司 金属制品堆叠机
US9524897B2 (en) 2012-04-09 2016-12-20 Semiconductor Technologies & Instruments Pte Ltd End handler for film and film frames and a method thereof
CN105127984B (zh) * 2012-08-09 2018-11-09 日本电产三协株式会社 工业用机器人及其控制方法
CN103803294A (zh) * 2012-11-08 2014-05-21 沈阳新松机器人自动化股份有限公司 用于搬运板状工件的侧翻装置
CN104742113A (zh) * 2013-12-30 2015-07-01 常州中科智联机电科技有限公司 自动化取料送料机械手装置
WO2022241052A1 (en) * 2021-05-14 2022-11-17 Lam Research Corporation Blade-type end effector with angular compliance mechanism
CN113352336A (zh) * 2021-06-04 2021-09-07 上海广川科技有限公司 一种用于晶圆翻转的后置偏心装置
CN113231656A (zh) * 2021-07-13 2021-08-10 新乡职业技术学院 一种数控车床自动化上下料装置
CN113231656B (zh) * 2021-07-13 2021-09-10 新乡职业技术学院 一种数控车床自动化上下料装置
CN115504366A (zh) * 2022-11-23 2022-12-23 中铁开发投资集团有限公司 一种场站装配式厂房立柱快速定位、吊装设备及方法
CN115504366B (zh) * 2022-11-23 2023-02-28 中铁开发投资集团有限公司 一种场站装配式厂房立柱快速定位、吊装设备及方法

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CN1411420A (zh) 2003-04-16

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