CN101483993B - 电路板投收系统及使用该电路板投收系统进行翻板的方法 - Google Patents
电路板投收系统及使用该电路板投收系统进行翻板的方法 Download PDFInfo
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- CN101483993B CN101483993B CN2008103000686A CN200810300068A CN101483993B CN 101483993 B CN101483993 B CN 101483993B CN 2008103000686 A CN2008103000686 A CN 2008103000686A CN 200810300068 A CN200810300068 A CN 200810300068A CN 101483993 B CN101483993 B CN 101483993B
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 230000007306 turnover Effects 0.000 title claims description 36
- 238000010521 absorption reaction Methods 0.000 claims description 17
- 238000010586 diagram Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 241000252254 Catostomidae Species 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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CN2008103000686A CN101483993B (zh) | 2008-01-11 | 2008-01-11 | 电路板投收系统及使用该电路板投收系统进行翻板的方法 |
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CN2008103000686A CN101483993B (zh) | 2008-01-11 | 2008-01-11 | 电路板投收系统及使用该电路板投收系统进行翻板的方法 |
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CN101483993A CN101483993A (zh) | 2009-07-15 |
CN101483993B true CN101483993B (zh) | 2011-06-08 |
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CN2008103000686A Expired - Fee Related CN101483993B (zh) | 2008-01-11 | 2008-01-11 | 电路板投收系统及使用该电路板投收系统进行翻板的方法 |
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Families Citing this family (2)
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CN103415147A (zh) * | 2013-07-24 | 2013-11-27 | 昆山迈致治具科技有限公司 | 一种pcb板冷却吸附治具 |
CN106946030A (zh) * | 2017-05-26 | 2017-07-14 | 苏州世高自动化系统有限公司 | 智能投板机 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000307237A (ja) * | 1999-04-23 | 2000-11-02 | Fuji Photo Film Co Ltd | リフロー装置 |
CN1411420A (zh) * | 1998-07-11 | 2003-04-16 | 塞米用具公司 | 用于装卸微电子工件的机器人 |
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CN1411420A (zh) * | 1998-07-11 | 2003-04-16 | 塞米用具公司 | 用于装卸微电子工件的机器人 |
JP2000307237A (ja) * | 1999-04-23 | 2000-11-02 | Fuji Photo Film Co Ltd | リフロー装置 |
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CN101483993A (zh) | 2009-07-15 |
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Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhending Technology Co., Ltd. Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Honsentech Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
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Effective date of registration: 20170302 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
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Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
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