WO1999060624A1 - Systeme d'essai d'un dispositif a semi-conducteur forme sur une plaquette a semi-conducteur - Google Patents

Systeme d'essai d'un dispositif a semi-conducteur forme sur une plaquette a semi-conducteur Download PDF

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Publication number
WO1999060624A1
WO1999060624A1 PCT/JP1999/002616 JP9902616W WO9960624A1 WO 1999060624 A1 WO1999060624 A1 WO 1999060624A1 JP 9902616 W JP9902616 W JP 9902616W WO 9960624 A1 WO9960624 A1 WO 9960624A1
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WO
WIPO (PCT)
Prior art keywords
test
shell
wafer
identification code
semiconductor
Prior art date
Application number
PCT/JP1999/002616
Other languages
English (en)
Japanese (ja)
Inventor
Itaru Iida
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to US09/462,039 priority Critical patent/US6268740B1/en
Publication of WO1999060624A1 publication Critical patent/WO1999060624A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2834—Automated test systems [ATE]; using microprocessors or computers

Definitions

  • the present invention relates to a test system for a plurality of semiconductor elements (hereinafter, referred to as “1C chips”) formed on a semiconductor wafer (hereinafter, referred to as “wafer”). More specifically, the wafer and the contactor are brought together to form an integrated product (hereinafter referred to as “test shell”), and the electrical characteristics of the I c chip are tested using this test shell.
  • the present invention relates to a test system capable of smoothly disassembling a test shell into a wafer and a contactor after the test is completed. In particular, the present invention can be applied to a reliability test system.
  • the contactor is an electrical contact means having a contact terminal for electrically contacting a plurality of electrodes of a plurality of 1C chips on the wafer at once and an external terminal connected to the contact terminal. It is.
  • the technology for forming a test shell by integrating the contactor, wafer, and wafer holder (hereinafter referred to as “wafer chuck”) by vacuum suction is called aligner.
  • 1C chips are becoming smaller and more highly integrated as electronic products become smaller and more sophisticated. Recently, various mounting technologies for further miniaturizing semiconductor products have been developed. For example, a technology has been developed in which 1C chips are not packaged, but are mounted as so-called bare 1C chips. In order to bring bare 1C chips to market, quality-assured 1C chips are required. In order to bring quality assured 1C chips to market, the reliability of each bare 1C chip must be tested. Inspection of bare 1C chips using conventional reliability test equipment must solve various difficulties such as electrical connection between bare 1C chips and sockets. Handling of small bare 1C chips is extremely complicated, which may increase inspection costs.
  • main chuck A fixed and held wafer holder (hereinafter referred to as “wafer chuck”), a wafer placed on the wafer chuck by a transfer mechanism (hereinafter referred to as “pin set”), and a head of the apparatus body
  • wafer chuck A fixed and held wafer holder
  • pin set a transfer mechanism
  • pin set a transfer mechanism
  • This aligner aligns the wafer with the contactor by moving the main chuck in the X, ⁇ , ⁇ , and ⁇ directions, raises the main chuck, brings the above three members into collective contact, and connects the vacuum chuck of the main chuck and the valve of the wafer chuck.
  • This is a device that connects a mechanism and vacuum-adsorbs the wafer and the contactor to the wafer chuck by the vacuum suction force of the wafer chuck.
  • a wafer temperature control device and a wafer storage chamber hereinafter, referred to as “a wafer storage chamber” for controlling a wafer integrated as a shell at a constant test temperature during a reliability test. Test room ”).
  • the shell is disassembled into three parts: wafer chuck, wafer and contactor at the aligner.
  • the main chuck on which the shell is placed must be aligned with the same position as when the shell was formed (the same position with respect to ⁇ , ⁇ , ⁇ ). If the main jar is raised to place the shell on the main jar at a position different from this position, the hole for the positioning pin of the wafer chuck of the shell mounted on the head plate and the main chuck This is because the positioning pins do not match. As a result, the shell cannot be placed on the macinac in alignment.
  • the vacuum coupling of the main chuck and the valve mechanism of the wafer chuck cannot be connected, the valve mechanism of the wafer chuck cannot be opened, the vacuum of the shell cannot be released, and the shell cannot be disassembled into the above three members. .
  • the present invention has been made to solve the above problems. According to the present invention, when the shell is disassembled into a wafer chuck, a wafer, and a contactor after the test, the main chuck (mounting table) is automatically moved to a position where the three members are integrated, and the Shul is positioned.
  • the purpose of the present invention is to provide a test system in which the shell is disassembled by the above three members placed on a main chuck.
  • a wafer holder for holding a semiconductor wafer, a semiconductor wafer having a plurality of semiconductor elements formed on a surface thereof, and a plurality of contacts electrically contacting a plurality of electrodes of the semiconductor element are provided.
  • a contactor with terminals is brought into contact all together, and these are integrated to form a test shell:
  • the aligner is
  • a first storage device for storing the read shell identification code
  • a first controller for controlling the shell forming mechanism to form a test shell
  • test device for testing the semiconductor device in the test shell :
  • a second reader for reading the shell identification S IJ code attached to the test shell
  • a second storage device for storing a result of the test in association with the shell identification code; and storing information stored in the first and second storage devices between the aligner and the test device.
  • a test system for a semiconductor device formed on a semiconductor wafer comprising: -In accordance with the second aspect of the present invention, a wafer holder for holding a semiconductor wafer, a semiconductor wafer having a plurality of semiconductor elements formed on its surface, and electrically contacting a plurality of electrodes of the semiconductor element A contactor with a plurality of contact terminals is contacted collectively, and these are integrated into an array to form a test shell.
  • the aligner is a
  • a first storage device for storing a forming condition when a test shell is formed in the shell forming and disassembling mechanism, and the shell identification code read by the reading device;
  • a first control device for controlling the seal forming and dismantling mechanism for forming a test shell and for disassembling the test shell
  • test device for testing the semiconductor device in the test shell :
  • a second storage device for storing a result of the test in association with the shell identification code; and storing information stored in the first and second storage devices between the aligner and the test device.
  • a test system for a semiconductor device formed on a semiconductor wafer comprising: a transmission system for transmitting;
  • a wafer holder for holding a semiconductor wafer, a semiconductor wafer having a plurality of semiconductor elements formed on a surface thereof, and a plurality of electrodes of the semiconductor element being in electrical contact with the plurality of electrodes of the semiconductor element
  • a contactor equipped with a plurality of contact terminals that contact all at once and integrate them to form a test shell
  • the mounting table In order to align the electrodes of the semiconductor element with the plurality of contact terminals of the contactor, the mounting table is moved in the X, Y, and ⁇ directions, and further, the three members are contacted together.
  • a first storage device for storing, in association with the shell identification code, position coordinates of the mounting table moved in the X, Y, and ⁇ directions for the positioning;
  • test shell Forming the test shell by vacuum suction force, and disassembling the test shell by releasing the vacuum suction force; shell formation and disassembly mechanism; position of the mounting table when the test shell is formed seat
  • a first control device that controls the disassembly of the test shell by installing the test seal at the dismantling position based on the target;
  • test device for testing the semiconductor device in the test shell :
  • a second storage device for storing the result of the test in association with the shell identification code; and transmitting the information stored in the first and second storage devices to each other between the aligner and the test device.
  • a test system for a semiconductor device formed on a semiconductor wafer comprising:
  • a wafer holder for holding a semiconductor wafer, a semiconductor wafer having a plurality of semiconductor elements formed on a surface thereof, and a plurality of contact terminals electrically contacting a plurality of electrodes of the semiconductor element are provided.
  • the contactor provided with the contactor is brought into contact at once, and these are integrated to form a test shell;
  • a wafer holder for holding a semiconductor wafer, a semiconductor wafer having a plurality of semiconductor elements formed on a surface thereof, and a plurality of contact terminals electrically contacting a plurality of electrodes of the semiconductor element are provided. Contacting the contactor with the three members at once, and integrating them to form a test shell;
  • the test system further comprises a third reading device for reading a wafer identification code attached to the semiconductor wafer, and the second storage device further comprises: Preferably, an identification code is also stored.
  • the transmission system is an electric communication device.
  • the transmission system is a memory provided in the test shell.
  • the test device is a reliability test device.
  • the shell identification code is preferably attached to at least one of the contactor and the wafer holder constituting the test shell.
  • the forming conditions stored in the first storage device when the test shell is formed include the position coordinates of the wafer holder and the contactor when the test shell is formed. It is preferable that
  • FIGS. 1A and 1B are configuration diagrams showing one embodiment of the test system of the present invention.
  • FIG. 2 is a perspective view showing an aligner of the test system shown in FIG. 1A.
  • FIG. 3 shows the shell forming mechanism of the aligner shown in FIG.
  • FIG. 4 is a side view showing a state where a wafer chuck, a wafer, and a contactor are brought into collective contact in a shell forming Z disassembly mechanism.
  • FIG. 4 is a plan view showing a wafer chuck integrated in the aligner shell forming mechanism or the shell-shell forming Z disassembly mechanism shown in FIG.
  • FIG. 5 is a perspective view showing a test chamber of the test system shown in FIG. 1A, partially cut away.
  • FIG. 6 is a perspective view showing the inside of the test chamber shown in FIG.
  • FIG. 7 is a flowchart for explaining the operation of the test system shown in FIG. 1A.
  • FIG. 8 is a diagram showing a test system according to another embodiment of the present invention.
  • FIG. 9 is a flowchart for explaining the operation of the test system shown in FIG.
  • the present invention relates to a system for testing IC chips formed on a wafer collectively, and this test is not limited to a reliability test. However, the present invention will be described here using an embodiment in which the present invention is applied to a reliability test system, from the viewpoint of more specifically describing the present invention.
  • the reliability test system shown in this embodiment includes an aligner 2 that integrates a wafer chuck, a wafer, and a contactor into a shell 1, and an aligner 2, A reliability test device 3 for testing the reliability of the wafer in the structured shell 1 and a transmission system 41 for transmitting various data between the reliability test device 3 and the aligner 2 are provided.
  • a communication means is used as the transmission means system 41.
  • This reliability test system is based on the wafer identification code (eg, character information) attached to the wafer and the shell identification code (eg, bar code) attached to the contactor, and the wafer, contactor, and wafer. Manage test results.
  • the electric communication device can be constructed using an interface such as RS232C or a LAN such as Ethernet.
  • the aligner 1 stores a wafer W in a cassette unit and loads and unloads a wafer W.
  • a loader chamber 21 for loading and unloading a wafer W, and a partition wall is provided in the loader chamber 21.
  • a reading device that reads the wafer identification code 13 attached to the wafer W eg, an optical reading device CR
  • a shell 1 A reading device (eg, a bar code reading device) (hereinafter, referred to as a “first reading device”) for reading the shell identification code.
  • the alignment chamber 22 aligns the wafer W placed on the wafer chuck 11 by moving the wafer chuck 11 with the contactor 12 held by the head plate 22A.
  • a mechanism is provided for forming the test shell 1 by bringing the wafer chuck 11, the wafer W, and the contactor 12 into one body by bringing the two into contact at once by vacuum suction force.
  • the shell identification code 14 can be attached to at least one of the wafer chuck 11 and the contactor 12 constituting the shell 1.
  • the loader chamber 21 has a transport mechanism (hereinafter, referred to as a transport mechanism).
  • the wafers W are transferred one by one from the cassette by the tweezers.
  • the third identification device 23 reads the wafer identification code 13 attached to the wafer W. After the wafer 1D and / or the slot 1D of the wafer W is recognized, the wafer W is preliminarily aligned on the sub-chuck with reference to the orientation flat (hereinafter, referred to as “the wafer W”).
  • the wafer W is transferred to the alignment chamber 22 by tweezers.
  • the shell identification code 14 attached to the contactor or the wafer chuck can be read by the first reading device 24 before these are integrated as the shell 1.
  • a head plate 22 A is attached to the alignment chamber 22 so as to be openable and closable.
  • a contactor 12 is mounted on the head plate 22A.
  • the head opening is moved by the opening / closing drive mechanism 22 B, whereby the upper opening of the alignment chamber 22 is opened / closed.
  • a main chuck 26 movable in the X, Y, ⁇ , and ⁇ directions is provided below the head plate 22 A.
  • the wafer chuck 11 is placed on the main chuck 26.
  • the main chuck 26 is arranged so that it can be moved up and down in the Z direction on the X stage 26B by a rotary elevating mechanism 26A and can be rotated forward and backward in the ⁇ direction.
  • the X stage 268 is supported on stage 26 C so as to be able to reciprocate in the X direction.
  • the Y stage 26C is supported on a base (not shown) so that it can move back and forth in the Y direction.
  • the rotary elevating mechanism 26 A, the X stage 26 B, and the Y stage 26 C constitute a moving mechanism of the mounting table.
  • the wafer W is pre-aligned by tweezers in the loader chamber 21 and then placed on the wafer chuck 11 placed on the main check 26 in the alignment chamber 22.
  • An alignment mechanism (not shown) is provided in the alignment chamber 22.
  • the alignment mechanism includes an upper camera fixed to an alignment bridge and a lower camera fixed to a main chuck 26.
  • the inspection electrode pad of the wafer W placed on the moving main chuck 26 is imaged by the upper camera, and its position is measured.
  • the contact terminal (eg, bump terminal) 12 A of the contactor 12 fixed to the head plate 22 A is imaged by the lower camera provided in the main chuck 26, and the position is measured.
  • the wafer W and the contactor 12 are aligned based on these image data.
  • this alignment mechanism for example, the technology proposed in Japanese Patent Application No. 10-54423 can be used.
  • the main chuck 26 is raised in the Z direction by the rotary elevating mechanism 26 A.
  • Figures 3 and 4 show the An embodiment of a shell forming mechanism and a shell forming / disassembling mechanism for forming a test shell is shown.
  • the inspection electrode pad of the wafer W is brought into contact with the bump terminal 12 A of the contactor 12 at a time.
  • the contactor 12 is vacuum-sucked on the upper surface of the wafer chuck 11, and the wafer chuck 11, the wafer W and the contactor 12 are integrated by a vacuum suction force to form a test shell.
  • the first control device 25 includes a central processing unit 25a, a first storage device 25b, and an input / output device 25c.
  • the central processing unit reads the wafer identification code 13 (eg, character information) of wafer W (OCR value) and the seal identification code of contactor 12 (eg, B).
  • the CR value and to create a database that associates with each other, the data base - storing scan in the first storage device 2 5 b.
  • the first storage device 25 b stores the position coordinate data (X, ⁇ ) of the main chuck 26 when the wafer chuck 11, the wafer W, and the contactor 12 are integrated to form the test shell 1. , ⁇ and / or ⁇ ) are stored as test shell formation conditions. This position coordinate data is used when the shell 1 is disassembled into the above three parties, as described later.
  • ring-shaped grooves 11 ⁇ and 11 1 are formed concentrically on the upper surface of the wafer chuck 11. These ring-shaped grooves 11 ⁇ and 11 1 are communicated with the internal flow path at a plurality of locations.
  • a seal ring 11 C is attached near the outer periphery of the upper surface of the wafer chuck 11. This sealing ring 11C is made of a flexible elastic member such as silicon rubber. This Seal ring 1 1 C prevents vacuum leakage in the test shell.
  • the first and second valve mechanisms are located on the peripheral surface of the wafer chuck 11.
  • valve mechanisms 11 D and 11 E supply and exhaust the internal flow path.
  • a valve operating mechanism 27 is attached to the peripheral surface of the main chuck 26.
  • the valve operating mechanism 27 opens and closes the first and second valve mechanisms 11 D and 11 E.
  • the valve operating mechanism 27 includes first and second quick couplings 2 connected to the first and second valve mechanisms 11D and 11E.
  • Air cylinder 27 D having a guide and a pair of guide rods for guiding the movement of the frame 27 C
  • Each of the first and second quick couplings 27A and 27B is advanced by the air cylinder 27D, fitted into the first and second valve mechanisms 11D and 11E, and the first and second quick couplings 27A and 27B are inserted into the first and second valve mechanisms 11D and 11E.
  • the 11 D and 11 E valve bodies are automatically closed. Therefore, the wafer W and the contactor 12 are stacked in this order on the wafer hatch 11 and the first and second quick couplings 27 A and 27 B of the valve operating mechanism 27 are connected to the wafer chuck 11 11. 1, 2nd valve mechanism 1 1D,
  • reference numeral 26D denotes a ⁇ drive mechanism used at the time of alignment, and the ⁇ drive mechanism 26D allows the main chuck 26 to rotate forward and backward in the ⁇ direction.
  • the reliability test apparatus 3 is composed of a test chamber 31 and a housing 3 2 in which the test chambers 31 are installed in a plurality of upper and lower stages (for example, seven stages).
  • a tester 33 for transmitting and receiving test signals to and from the wafer W to be tested in each test chamber 31; and second and third control devices 34 for controlling the test chambers 31 and the tester 33 respectively. , 3 5.
  • the test shell 1 formed by the aligner 1 is placed under the control of the second controller 34, and the test temperature and the like are controlled.
  • the tester 33 transmits and receives test signals to and from each test room 31 under the control of the third control device 35 and analyzes the test results. As shown in FIG.
  • the reliability testing device 3 is provided with a second reading device 36 for reading a shell identification code 14 (eg, a bar code) attached to the test shell.
  • This shell identification code can be printed on at least one outer surface of the wafer chuck 11 and the contactor 12.
  • Each test shell can be identified by the shell identification code.
  • the first control device 25 of the aligner 2 and the second and third control devices 34, 35 of the reliability test device 3 are connected to the transmission system (eg, electrical communication device (cable)) as described above. 4) These are connected by 1 and various data can be transmitted and received between them. That is, the test shell 1 is transported from the aligner 2 to the reliability test device 3.
  • the bar code reader 36 reads the shell identification code 14 of the contactor 12 and recognizes each test shell ID based on the read BCR value.
  • the shell identification code (BCR value) of the test shell 1 is transmitted from the test room to the aligner 2 via the transmission system 41 (eg, communication means).
  • aligner 2 Upon receipt of the BCR value of test shell 1, aligner 2 receives an acknowledge signal indicating that the reception was successful, and the wafer ID, slot ID, and slot ID of wafer W corresponding to BCR of shell 1 directly.
  • wafer data simply referred to as “wafer data”
  • the reliability test apparatus 3 transmits an acknowledgment signal indicating that the wafer data has been normally received to the aligner 2. After these procedures are completed, the reliability test of the wafer W is performed.
  • the test test room 31 includes a temperature control room 31A and a connector room 31B adjacent to the temperature control room 31A.
  • cylinder mechanisms 31D are provided at four corners of the substrate 31C in the temperature control chamber 31A.
  • the upper end of the cylinder rod of each cylinder mechanism 31D is connected to four corners of a pressing plate 31E provided above the substrate 31C.
  • a clamp mechanism (not shown) is provided on the back surface of the pressing plate 31E. With this clamping mechanism, each test chamber 31 receives the test shell 1.
  • a connector for connecting to the tester 33 and a wiring board are provided in the connector room 31B.
  • a bottom jacket (not shown) is provided on the substrate 31C.
  • This bottom jar A large number of pogo pins 31F (for example, 2000 to 3 OOO pieces) are provided in the shape of a plurality of rings around the ket. These pogo pins 31 F are provided corresponding to the positions of a large number of external terminals arranged in a ring around the bump terminals of the contactor 12. During the test, the bump terminals make electrical contact with the external terminals, and the test signals from the tester 33 are transmitted to and received from the electrodes of the IC chip via these terminals.
  • the bottom jacket incorporates a temperature control mechanism and cooperates with a cooling jacket (not shown) fixed to the pressing plate 31E to bring the test shell 1 to a predetermined test temperature (for example, 110). ° C). In this way, the temperature of the test shell 1 is maintained at an appropriate value in the temperature control room 31A.
  • AAM means aligner
  • BRM means reliability test equipment.
  • the head plate 22A is opened by the opening / closing drive mechanism 22B.
  • the contactor 12 is mounted on the head plate 22 A, and the wafer chuck 11 is placed on the main chuck 26.
  • the first and second valve mechanisms 11D and 11E of the wafer chuck 11 are adjusted to the positions of the first and second quick couplings 27A and 27B.
  • a vacuum exhaust device (not shown) is driven, and the wafer chuck 11 is vacuum-adsorbed on the main chuck 26.
  • the air cylinder 27 D of the valve operating mechanism 27 is driven, and the first and second quick couplings 27 A and 27 B are connected to the first and second valve mechanisms 11 D and 11 E of the wafer chuck 11. Is done. Wafers W are taken out from the cassette in the loader chamber 21 one by one, and the wafers W are prepared by tweezers and sub-chucks. The wafer W is placed on the wafer chuck 11 by tweezers (step S 1). During this time, the wafer identification code (character information) 13 of the wafer W is read by the OCR 23 (step S 2).
  • a database that associates the two is created based on the OCR value and the BCR value (step S 4).
  • This database is stored in the storage device.
  • the center of the wafer W and the center of the wafer chuck 11 1 may not coincide with each other. No (Of course, they may match, but it is more common that they do not match). Therefore, the center position coordinates (eg, X and Y coordinates) of the head plate 22A are stored in the storage device of the first control device 25 in advance.
  • the wafer is chucked by a vacuum exhaust device (not shown).
  • the alignment mechanism is driven, and the electrode pad of the wafer W is aligned with the bump terminal 12 A of the contactor 12.
  • the center of the wafer W is matched with the center of the head plate 22A.
  • the center position coordinates of the head plate 22A on which the contactor 12 is mounted eg, X, Y
  • the position deviation between the reference position and the center position coordinates (eg, X, Y coordinates) of the main chuck 26 after the alignment is calculated by the central processing unit of the first control device 25.
  • the displacement is stored in the storage device.
  • the main chuck 26 is raised by the rotary elevating mechanism 26 A, and the electrode pads of the wafer W are connected to the bump terminals 12 A, as shown in FIG. Contact all at once.
  • the wafer chuck 11, the wafer W and the contactor 12 are integrated by the evacuation device, and the test shell 1 is formed (step S 5).
  • the valve operating mechanisms 27 A and 27 B are disconnected from the valve mechanisms 11 D and 11 E, the valve mechanisms 11 D and 11 E are closed, and the position between the wafer chuck 11 and the contactor 12 is reduced.
  • the vacuum is maintained and a transportable test shuttle 1 is formed.
  • the wafer W and the contactor 12 are integrated as described above, the X, Y, and / or ⁇ position coordinates of the main chuck 26 and the head plate 22 described above
  • the amount of displacement between the center and the center of the main chuck 26 is stored in the storage device of the first control device 25 as a database in which the contactor 12 and the wafer W are associated with each other.
  • the operator removes the shell 1 from the aligner 1 and carries it into the reliability test device 3 (step S6).
  • the reading device (bar code reading device) 36 reads the shell identification code (bar code 14) of the test shell 1 (step S 7).
  • the BCR value is transferred to aligner 2 by an electrical transmission system (eg, an electrical communication device) 4 1 (Step S8).
  • the aligner 2 receives the BCR value from the reliability test apparatus 3, it transmits an acknowledge signal indicating that the data has been received normally and transfers the wafer data to the reliability test apparatus 3 (step S9).
  • the reliability test apparatus 3 receives the wafer data from the aligner 2, transmits an acknowledge signal indicating that the wafer data has been normally received to the aligner 2, and notifies that the test preparation is completed. As described above, the test shell 1 is attached to each test room 31. The reliability control of each wafer W is executed in each test room 31 based on the test signal from the tester 33 by the second and third control devices 34 and 35 (step S10). When the test is completed, a test result for each chip on each wafer W is created (step S11). The test results are stored in the second and third storage devices 34b and 35b of the second and third control devices.
  • the operator takes out the test shell 1 from each test room 31 and carries it into the aligner 2 (step S 1 2).
  • the barcode 14 of the shell 1 is read by the barcode reader 24 (step S13), and the shell is specified based on the BCR value.
  • Ru is mounted, the first control unit 2 5 Araina one 2, based on the BCR value of the shell 1, the position coordinate data ⁇ beauty when the shell is formed Search the database for positional deviation data between the wafer W and the main chuck 26.
  • the main chuck 2 6 is moved to the position data of the wafer W, it is further adjusted positional deviation amount between the main chuck 2 6 X, and is moved in the Y direction the wafer W, The main chuck is moved to the position where the shell was formed. Next, the main chuck 26 rises from that position, the positioning pins of the main chuck 26 are inserted into the holes of the wafer chuck I 2, and the main chuck 26 is joined to the shell 1.
  • the first and second quick couplings 27 A and 27 B of the valve operating mechanism 27 are positioned on an extension of the valve mechanisms 11 D and 1 IE of the wafer chuck 11, and the valve operating mechanism It can be smoothly connected to 11D and 11E.
  • the valve mechanisms 11 D and 11 E are opened by the valve operating mechanism 27, and the internal flow path of the main chuck 26 is opened to the atmosphere, so that the shell 1 can be disassembled.
  • the center of the main chuck 26 only moves to the head plate 22A, that is, the center position of the wafer W. Since the center of 11 is deviated, the hole of the wafer chuck 11 does not match the positioning pin of the main chuck 26, and the two cannot be joined. However, in the present embodiment, the position of the main chuck 26 is adjusted based on the amount of deviation between the position of the wafer W and the main chuck 26 based on the barcode 14 of the contactor 12, so that the shell 1 and the main chuck 26 are adjusted. 26 are securely joined and the shell can be securely disassembled (step SI 4).
  • the first control device 25 receives the wafer data of the corresponding wafer W based on the BCR value of the shell 1.
  • Barcode reader 24 is provided on aligner 2.
  • a reading device (bar code reading device) 36 for reading the shell identification code (bar code) 14 of the shell 1 is provided in the reliability test device 3, and further, between the aligner 2 and the reliability test device 3.
  • a transmission system (electrical communication device) 41 for communicating information read by the CR 23 and the par code readers 24 and 36 with each other is provided.
  • a first storage device is provided in the first control device 25 for storing the wafer W and the contactor 12 in association with each other based on information read by the OCR 23 and the barcode reading devices 24 and 36. With this configuration, the reliability test of the wafer W can be performed accurately and reliably based on the character information 13 of the wafer W and the bar code 14 of the contactor 12.
  • the position where the wafer chuck 11, the wafer W, and the contactor 12 are integrated, and the shell 1 is assembled is stored in the first storage device 25 b of the control device 25 of the aligner 2. Therefore, when the shell 1 is disassembled by the aligner 12, the barcode 14 is read by the barcode reader 24 of the aligner 12. Just by placing the shell 1 on the main chuck 26, the main chuck 26 moves in the X, Y, ⁇ , and ⁇ directions based on the BCR value of the shell 1 under the control of the first controller 25. The shell 1 is quickly moved to the assembled position, and the It can be joined securely.
  • the first and second quick couplings 27 A and 27 B of the valve operating mechanism 27 can be quickly and reliably connected to the valve mechanisms 11 D and 11 E of the wafer chuck 11.
  • the shell 1 can be quickly and reliably disassembled by the wafer chuck 11, the wafer W and the contactor 12 i.
  • FIG. 8 and 9 are diagrams showing another embodiment of the present invention.
  • the reliability test system of the present embodiment will be described with the same or corresponding parts as those of the above-described embodiment, with the same reference numerals.
  • a memory 14A made of, for example, a magnetic material is provided instead of the bar code 14 of the contactor 12.
  • the aligner 2 is provided with reading / writing means, for example, a magnetic head 24 A, instead of the barcode reading device 24.
  • a magnetic head 36A is provided as reading / writing means.
  • the sentence information 13 read by the OCR 23 and the test result by the reliability test device 3 are stored in the memory 14A. Therefore, in this embodiment, the memory 14A is used as the transmission means 4, and the communication means 41 can be omitted. Others are configured according to the above embodiment.
  • the wafers W are taken out one by one from the cassette in the mouth chamber 21. Prealignment of wafer W by tweezers and sub-chucks Is
  • the wafer W is placed on the wafer chuck 11 by tweezers (step S21).
  • the character information 13 of the wafer W is read by the 0 CR 23 (step S22).
  • the read information is written into the memory 14A by the magnetic head 24A, and the wafer data is stored (step S23).
  • the valve control mechanism 27 is driven by the first control device 25, and the first and second quick couplings 27A and 27B are connected to the valve mechanisms 11D and 11E of the wafer chuck 11. Is done.
  • the main chuck 26 is moved to align the electrode pad of the wafer W and the bump terminal 12 A of the contactor 12. After this alignment, the main chuck 26 rises, and the electrode pads of the wafer W and the bump terminals 12A come into contact as shown in FIG. In this state, the wafer chuck 11, the wafer W and the contactor 12 are integrated as a shell 1 by a vacuum exhaust device (not shown) (step S 24). The position coordinate data of the main check 26 at this time is written to the memory 14A by the magnetic head 24A.
  • the valve operating mechanisms 27A and 27B are separated from the valve mechanisms 11D and 11E, and the Ueno, chuck 11 and contactor 12 are formed in a transportable shell 1.
  • the operator removes the shell 1 from the aligner 2 and carries it into the reliability test device 3 (step S25).
  • the wafer data is read from the memory 14A of the shell 1 by the magnetic head 36A (step S26).
  • 1st, 2nd control device 3 4 According to 35, the reliability test of each wafer W is executed at a predetermined test temperature in each test room 31 based on the test signal from the tester 33 (step S27).
  • a test result of each 1C chip formed on the wafer W is created by the second control device 35 (step S28).
  • the wafer data stored in the storage device of the second control device 35 is written to the memory 14A of the shell 1 by the magnetic head 36A, and the wafer data is guaranteed (step S 2 9).
  • the operator takes out the shell 1 from each test room 31, transports it to the aligner 2, and attaches it to the head plate 22 A (step S 30). .
  • the magnetic head 24A reads the position coordinate data of the memory 14A, the controller 25 adjusts the amount of misalignment of the main chuck 26 with the wafer W, and the main chuck 26 adjusts the position of the shell 1
  • the main chuck 26 is joined to the shell 1 at the position where it was formed.
  • the first and second quick couplings 27 A 27 B are connected to the valve mechanisms 11 D and 11 E of the shell 1 by the control device 25 and the valve operating mechanism 27, and the valve mechanism 1 1 D. 11 E is opened, the internal flow path of the main chuck 26 is opened to the atmosphere, and the shell 1 is disassembled (step S31)-.
  • the wafer data in the memory 14 A is read by the magnetic head 24 A.
  • the tweezers Based on the wafer data (eg, Ueno, 1D, slot ID, slot ID), the tweezers returns the wafer W to the original position in the cassette corresponding to the slot ID (step S32) ).
  • character information 13 attached to wafer W is read.
  • CR 23 is provided in aligner 2
  • memory 14 A for storing the character information 13 is provided in contactor 12, and a memory is provided. Since the magnetic head 36 A for reading the stored content of 14 A is provided in the reliability test device 3, the same operation and effect as in the above embodiment can be obtained.
  • the present invention can be applied to various devices for inspecting (or testing) the electrical characteristics of an IC chip formed on a wafer.
  • the aligner 2 is provided with the OCR 23 and the barcode reader 24 as reading means, but the OCR may be used instead of the barcode reader.
  • the operator transports the shell.
  • the transport and mounting may be automated.
  • the first control device, the second control device, and the third control device of the present invention may be a control device configured by an electronic circuit, or may be a control device configured by software.
  • An electric communication device can be used as one of the transmission systems in the present invention.
  • an electric wire communication device or an electric wireless communication device can be used as the electrically non-communication device.
  • the position coordinates were adopted as the test shell forming conditions.
  • the conditions are not limited to these, and the wafer identification number, the wafer chuck model number, Various conditions such as the model number of the data, the model number of the mounting table, the temperature condition when the test shell is formed, the operator identification number, and the like can be adopted.
  • various information is transmitted between the aligner and the test room.
  • the information to be transmitted may be appropriately selected from these various types of information.
  • the information conveyed may be the information of the shell identification code and the test result.
  • the mounting table is automatically moved to the position where the three members of the wafer holder, the wafer, and the contactor are integrated, and the shell and the mounting table are smoothly and reliably.
  • a reliability test system can be provided in which the seal can be quickly disassembled into wafer holders, wafers and contactors.
  • the mounting table when the shell is disassembled into the wafer holder, the wafer, and the contactor, the mounting table is automatically moved to a position where the three are integrated, and the shell and the mounting table are smoothly connected.
  • a reliability test system which is securely joined, does not require communication means between the aligner and the reliability test device, and has a simplified system configuration.

Abstract

Ce système d'essai est notamment conçu pour un essai de fiabilité. Un dispositif d'alignement (2) comprend un lecteur (23) servant à lire un code d'identification donné à une plaquette (W) ainsi qu'un lecteur (24) servant à lire un code d'identification de coquille (14) donné à une coquille d'essai (1). Un appareil d'essai comporte un lecteur (36) destiné à lire le code d'identification (14) de la coquille. Un système de transfert (41) sert à transférer des informations lues par les lecteurs (24, 36), entre le dispositif d'alignement (2) et l'appareil d'essai, les informations étant stockées dans des dispositifs de stockage (25b, 34b, 35b). Grâce à ce système, on essaie de façon correcte et efficace une puce à circuit intégré formée sur une plaquette à semi-conducteur, la coquille utilisée dans cet essai pouvant être désassemblée de manière correcte et fiable.
PCT/JP1999/002616 1998-05-20 1999-05-19 Systeme d'essai d'un dispositif a semi-conducteur forme sur une plaquette a semi-conducteur WO1999060624A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US09/462,039 US6268740B1 (en) 1998-05-20 1999-05-19 System for testing semiconductor device formed on semiconductor wafer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10/156690 1998-05-20
JP15669098A JP3430015B2 (ja) 1998-05-20 1998-05-20 信頼性試験システム

Publications (1)

Publication Number Publication Date
WO1999060624A1 true WO1999060624A1 (fr) 1999-11-25

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Country Link
US (1) US6268740B1 (fr)
JP (1) JP3430015B2 (fr)
WO (1) WO1999060624A1 (fr)

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US6268740B1 (en) 2001-07-31
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